Devices, packages, and / or substrates including curved antennas

Abstract

A substrate includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least a portion of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect is configured to be coupled to a ground. The curved antenna is coupled to the second antenna dielectric layer.

Description

[0001] Priority requirements

[0002] This patent application claims priority to U.S. Application No. 17 / 002,594, filed August 25, 2020, entitled “DEVICE, PACKAGE AND / ORSUBSTRATE COMPRISING CURVED ANTENNA”, which has been assigned to the assignee of this application and is expressly incorporated herein by reference. Technical Field

[0003] Various features relate to devices, packages, and / or substrates with antennas, but more specifically to devices, packages, and / or substrates including bent antennas. Background Technology

[0004] Figure 1 The illustration shows a package 100 including a substrate 102, a die 103, and a die 105. Dies 103 and 105 are coupled to the substrate 102. The substrate 102 includes at least one dielectric layer 120 and a plurality of interconnects 122. The substrate 102 also includes a first antenna 150 and a second antenna 160. Both the first antenna 150 and the second antenna 160 are embedded in the substrate 102. Both the first antenna 150 and the second antenna 160 are planar antennas. The first antenna 150 and the second antenna 160 may both be defined by the interconnects in the substrate 102.

[0005] There is a continued need to provide devices, packages, and / or substrates for antennas with improved transmit and receive performance. Summary of the Invention

[0006] Various features relate to devices, packages, and / or substrates with antennas, but more specifically to devices, packages, and / or substrates including bent antennas.

[0007] One example provides a substrate including at least one dielectric layer, a plurality of interconnects, and a bent antenna coupled to a surface of the substrate. The bent antenna is bent relative to the surface of the substrate such that at least a portion of the bent antenna is offset from the surface of the substrate.

[0008] Another example provides an antenna device including at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the antenna device. The curved antenna is curved relative to the surface of the antenna device such that at least a portion of the curved antenna is offset from the surface of the antenna device.

[0009] Another example provides a package including a substrate and a first antenna device coupled to the substrate. The first antenna device includes at least one dielectric layer, a plurality of interconnects, and a bent antenna coupled to a surface of the antenna device. The bent antenna is bent relative to the surface of the antenna device such that at least a portion of the bent antenna is offset from the surface of the antenna device.

[0010] Another example provides a method for forming at least one dielectric layer. The method forms a plurality of interconnects in and over the at least one dielectric layer. The method forms a bent antenna over the surface of the at least one dielectric layer. The bent antenna is bent relative to the surface of the at least one dielectric layer. At least a portion of the bent antenna is offset from the surface of the at least one dielectric layer. Attached Figure Description

[0011] The various features, properties, and advantages will become apparent when the following detailed description is understood in conjunction with the accompanying drawings, in which the same reference numerals are always used to identify them.

[0012] Figure 1 The diagram illustrates the outline of a package including a substrate, in which an antenna is embedded within the substrate.

[0013] Figure 2 The illustration shows a outline view of an exemplary package including a substrate with a curved antenna.

[0014] Figure 3 The illustration shows a view of an exemplary antenna gain for a planar antenna.

[0015] Figure 4 The illustration shows a view of an exemplary antenna gain for a curved antenna.

[0016] Figure 5 The illustration shows a outline view of an exemplary package including a substrate with a curved antenna.

[0017] Figure 6 The illustration shows a outline view of an exemplary package including a substrate with a curved antenna.

[0018] Figure 7 The illustration shows a outline view of an exemplary package including an antenna device, which includes a flexible antenna.

[0019] Figure 8 The illustration shows a outline diagram of an exemplary antenna device including a curved antenna.

[0020] Figure 9 The illustration shows a outline diagram of an exemplary antenna device including a curved antenna.

[0021] Figure 10 The illustration shows a outline diagram of an exemplary antenna device including a curved antenna.

[0022] Figure 11 The illustration shows a plan view of several exemplary bent antennas.

[0023] Figure 12 The illustration shows the outlines of several exemplary bent antennas.

[0024] Figure 13 The illustration shows a plan view of several exemplary bent antennas.

[0025] Figure 14 The illustration shows the outlines of several exemplary bent antennas.

[0026] Figure 15 The illustration shows a plan view of several exemplary bent antennas.

[0027] Figure 16 The illustration shows the outlines of several exemplary bent antennas.

[0028] Figure 17 The illustration shows a plan view of several exemplary bent antennas.

[0029] Figure 18 The illustration shows the outlines of several exemplary bent antennas.

[0030] Figure 19 An exemplary sequence for manufacturing a bent antenna is illustrated.

[0031] Figure 20 Another exemplary sequence for manufacturing a bent antenna is illustrated.

[0032] Figures 21A-21B An exemplary sequence for manufacturing a bent antenna is illustrated.

[0033] Figures 22A-22B An exemplary sequence for manufacturing a bent antenna is illustrated.

[0034] Figure 23 An exemplary flowchart of a method for manufacturing a bent antenna is illustrated.

[0035] Figures 24A-24D The illustration shows an exemplary sequence for fabricating a discrete antenna device including a flexible antenna.

[0036] Figure 25 An exemplary flowchart illustrating a method for manufacturing a discrete antenna device including a bent antenna is shown.

[0037] Figure 26 The illustrations depict various electronic devices that can integrate the dies, integrated devices, integrated passive devices (IPDs), passive components, packages, substrates, and / or device packages described herein. Detailed Implementation

[0038] In the following description, specific details are set forth to provide a thorough understanding of various aspects of this disclosure. However, those skilled in the art will understand that these aspects can be practiced without these specific details. For example, circuits may be shown as block diagrams to avoid obscuring aspects with unnecessarily detailed information. In other instances, well-known circuits, structures, and techniques may not be shown in detail to avoid obscuring aspects of this disclosure.

[0039] This disclosure describes a substrate including at least one dielectric layer, a plurality of interconnects, and a bent antenna coupled to a surface of the substrate. The bent antenna is bent relative to a surface of the substrate such that at least a portion of the bent antenna is offset (e.g., vertically offset) from the surface of the substrate (e.g., a flat surface). The bent antenna is coupled to the surface of at least one dielectric layer. The bent antenna may be coupled to a plurality of interconnects. The bent antenna may include a concave antenna. The concave antenna may be concave relative to the surface of the substrate. The bent antenna may include a nonlinear surface. The bent antenna may be implemented in the substrate as part of an antenna device. The bent antenna may be implemented in the substrate as part of a package, such as an antenna in-package (AiP). The package may include a radio frequency front-end (RFFE) package. The substrate may include more than one antenna. For example, the substrate may include several antennas, wherein at least one antenna is a bent antenna. The bent antenna may include a dome shape. As will be further described below, the bent antenna provides better antenna gain in a particular direction than a planar antenna of similar size, thus providing an antenna with better directivity and better signal transmission and / or reception in one or more particular directions. In some implementations, the bent antenna may be located close to a bent antenna ground interconnect configured to be coupled to ground. The bent antenna ground interconnect can help improve the performance of the bent antenna by helping to prevent signal interference from other interconnects and / or antennas from passing through the bent antenna.

[0040] Exemplary package having a substrate including a flexible antenna

[0041] Figure 2The illustration shows a contour view of a package 200 including a substrate 202, an integrated device 203, and an integrated device 205. The integrated device 203 is coupled to the substrate 202 via a plurality of solder interconnects 230. The integrated device 205 is coupled to the substrate 202 via a plurality of solder interconnects 250. The substrate 202 includes at least one dielectric layer 220, a plurality of interconnects 222, and a bent antenna 206. The bent antenna 206 can be configured to be electrically coupled to the integrated device 203 and / or the integrated device 205. For example, the bent antenna 206 can be configured to be electrically coupled to the integrated device 203 via a plurality of interconnects 222 and a plurality of solder interconnects 230, and the bent antenna 206 can be configured to be electrically coupled to the integrated device 205 via a plurality of interconnects 222 and a plurality of solder interconnects 250.

[0042] A curved antenna 206 may be located on a surface of substrate 202 (e.g., a first surface, a top surface). For example, curved antenna 206 may be located on the surface of at least one dielectric layer 220. Curved antenna 206 may be coupled to a plurality of interconnects 222. Substrate 202 may include an antenna dielectric layer 260. Antenna dielectric layer 260 may be formed and positioned on the surface of at least one dielectric layer 220. Antenna dielectric layer 260 may be located between curved antenna 206 and the surface of substrate 202. For example, antenna dielectric layer 260 may be located between curved antenna 206 and at least one dielectric layer 220 of substrate 202. Antenna dielectric layer 260 may include the same material as at least one dielectric layer 220. Antenna dielectric layer 260 includes a non-linear profile shape. For example, antenna dielectric layer 260 includes a curved profile shape. Curved antenna 206 may be coupled to and / or formed on the curved profile shape of antenna dielectric layer 260. The shape of the bent antenna 206 can be defined by the shape of the bent profile of the antenna dielectric layer 260. The bent antenna 206 is bent relative to the surface of the substrate 202 such that at least a portion of the bent antenna 206 is offset (e.g., vertically offset) from the surface of the substrate 202 (e.g., the surface of the dielectric layer 220 of the substrate 202, a flat surface of the substrate 202). The bent antenna 206 includes a nonlinear shape and / or a nonlinear surface. Figure 2 As shown, the curved antenna 206 includes a concave shape. The concave shape may include a dome shape. However, the shape and / or curvature of the curved antenna 206 may vary with different embodiments. Although a curved antenna is shown, the substrate 202 may include several antennas, wherein at least one of the antennas is a curved antenna. For example, the substrate 202 may include several combinations of curved antennas and / or planar antennas. In some embodiments, all antennas may be curved antennas (e.g., curved antennas with the same curve or different curves).

[0043] The curved antenna 206 can be a component for signal transmission and / or reception. That is, the curved antenna 206 can be configured to transmit at least one signal for at least one frequency and / or receive at least one signal for at least one frequency. As will be further described below, the curved antenna provides better directivity and better antenna gain compared to a planar antenna of similar size and / or shape.

[0044] Package 200 may be an antenna-in-package (AiP). Package 200 may be a radio frequency (RF) package. Package 200 (or any package described in this disclosure) may be part of a radio frequency front-end (RFFE) package. Package 200 may be configured to provide wireless fidelity (WiFi) communication and / or cellular communication (e.g., 2G, 3G, 4G, 5G). Package 200 may be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE). Package 200 may be configured to transmit and receive signals with different frequencies and / or communication protocols.

[0045] Integrated devices (e.g., 203, 205) may include bare dies (e.g., exposed dies). Integrated devices may include radio frequency (RF) devices, analog devices, passive devices, filters, capacitors, inductors, antennas, transmitters, receivers, surface acoustic wave (SAW) filters, bulk acoustic wave (BAW) filters, light-emitting diode (LED) integrated devices, silicon (Si)-based integrated devices, silicon carbide (SiC)-based integrated devices, GaAs-based integrated devices, GaN-based integrated devices, memories, power management processors, and / or combinations thereof.

[0046] Figure 3 and Figure 4 The diagram illustrates the antenna gain for two antennas of similar size, one of which is a planar antenna and the other is a curved antenna. Figure 3 A planar antenna 306 with a width of approximately 5 millimeters (mm) is illustrated. The planar antenna 306 is not offset from a surface (e.g., the surface of a substrate) (e.g., not perpendicularly offset). Figure 3 The figure shows that the maximum antenna gain of the planar antenna 306 in a specific direction is approximately 4.5 dBi. Antenna gain indicates the power emitted by an antenna in a specific direction compared to an isotropic antenna. An isotropic antenna is a theoretical antenna that radiates equally in all directions. Higher antenna gain (dBi) means better directivity of the antenna in a specific direction.

[0047] Figure 4A curved antenna 406 with a width of approximately 4 millimeters (mm) is illustrated. However, the total surface width of the curved antenna 406 can be approximately 5 mm. At least a portion of the curved antenna 406 is offset (e.g., vertically offset) from a surface (e.g., the surface of a substrate). In this example, some portions of the curved antenna 406 can be offset (e.g., vertically offset) from the surface by up to 0.1 mm. Figure 4 As shown in the figure, the maximum antenna gain of the curved antenna 406 in a specific direction is approximately 5.2 dBi. Therefore, the curved antenna 406 receives and / or transmits signals better than the planar antenna 306 in certain directions and provides better directivity, even though the curved antenna 406 and the planar antenna 306 have similar footprint shapes and surface areas. Although the curved antenna 406 may actually be thicker due to offset from the surface, the increase in size in the vertical direction is offset by the decrease in size in the lateral direction. In this example, better antenna gain (and therefore better directivity) is achieved, and the effective footprint of the antenna is reduced by 1 mm while the thickness increases by only 0.1 mm. The curved antenna 406 can represent any of the curved antennas described in this disclosure. For example, the curved antenna 406 can represent the curved antenna 206.

[0048] Different implementations may have different antenna configurations, designs, shapes, and / or sizes. Figure 5 Another example of a package including substrates with different antenna configurations is illustrated. Figure 5 The illustration shows a outline view of a package 500 including a substrate 502, an integrated device 203, and an integrated device 205. Package 500 is similar to... Figure 2 Package 200. Substrate 502 is similar to substrate 202 and therefore includes components similar to or the same as substrate 202.

[0049] Substrate 502 includes at least one dielectric layer 220, a plurality of interconnects 222, a first antenna dielectric layer 570, an antenna ground interconnect 508, a second antenna dielectric layer 560, and a curved antenna 506. The first antenna dielectric layer 570 is coupled to and / or formed on the surface of substrate 502. For example, the first antenna dielectric layer 570 is coupled to and / or formed on the surface of at least one dielectric layer 220 of substrate 502. The first antenna dielectric layer 570 includes a curved profile shape (e.g., a non-linear profile shape). The antenna ground interconnect 508 is coupled to and / or formed on the curved profile shape of the first antenna dielectric layer 570. The antenna ground interconnect 508 has a curved shape that can be defined by the curved profile shape of the first antenna dielectric layer 570. The antenna ground interconnect 508 can be configured to be coupled to ground. Antenna ground interconnect 508 can be coupled to one or more interconnects from a plurality of interconnects 222. A second antenna dielectric layer 560 is coupled to and / or formed on the antenna ground interconnect 508. The second antenna dielectric layer 560 may include a curved profile shape. A curved antenna 506 is coupled to and / or formed on the curved profile of the second antenna dielectric layer 560. The shape of the curved antenna 506 can be defined by the shape of the curved profile of the second antenna dielectric layer 560. Antenna ground interconnect 508 and curved antenna 506 can be located on the surface of substrate 502 (e.g., on the surface of at least one dielectric layer 220). Antenna ground interconnect 508 and / or curved antenna 506 can be coupled to corresponding interconnects from a plurality of interconnects 222. The use of antenna ground interconnect 508 helps to isolate and / or shield the curved antenna 506 from other signals, which in turn helps the curved antenna 506 to better transmit and / or receive signals.

[0050] Although a bent antenna is shown, substrate 502 may include several antennas, wherein at least one of the antennas is a bent antenna. Substrate 502 may include Figure 2 and Figure 5 A combination of antenna designs. Therefore, the substrate may include those from... Figure 2 and Figure 5 Several combinations of various antenna designs.

[0051] Figure 6 Another example of a package including substrates with different antenna configurations is illustrated. Figure 6 The illustration shows a outline view of a package 600 including a substrate 602, an integrated device 203, and an integrated device 205. Package 600 is similar to... Figure 5Package 500. Substrate 602 is similar to substrate 502 and therefore includes components similar to or the same as substrate 502.

[0052] The substrate 602 includes at least one dielectric layer 220, a plurality of interconnects 222, a gap 670, an antenna ground interconnect 608, an antenna dielectric layer 660, and a bent antenna 506.

[0053] Antenna ground interconnect 608 is coupled to and / or formed on the surface of substrate 602. A gap 670 is located between antenna ground interconnect 608 and the surface of substrate 602 (e.g., the surface of at least one dielectric layer 220). The gap can be at least one area without solid material. The gap can include a cavity. The gap can be occupied by a gas (e.g., air). The size and / or shape of the gap 670 can vary. For example, the gap 670 can occupy part or all of the space between dielectric layer 220 and antenna ground interconnect 608. Antenna ground interconnect 608 has a curved shape and / or a curved profile surface. Antenna ground interconnect 608 includes at least one opening 609. Antenna ground interconnect 608 can be configured to be coupled to ground. Antenna ground interconnect 608 can be coupled to interconnects from a plurality of interconnects 222. Antenna dielectric layer 660 is coupled to and / or formed on antenna ground interconnect 608. The second antenna dielectric layer 660 may include a curved profile shape. A curved antenna 506 is coupled to and / or formed on the curved profile of the antenna dielectric layer 660. The shape of the curved antenna 506 may be defined by the shape of the curved profile of the antenna dielectric layer 660. The antenna ground interconnect 608 and the curved antenna 506 may be located above the surface of the substrate 602 (e.g., above the surface of at least one dielectric layer 220). The antenna ground interconnect 608 and / or the curved antenna 506 may be coupled to corresponding interconnects from a plurality of interconnects 222. The use of the antenna ground interconnect 608 helps to isolate and / or shield the curved antenna 506 from other signals, which in turn helps the curved antenna 506 to better transmit and / or receive signals. The gap 670 may be occupied by a gas (e.g., air) that provides very good dielectric properties (e.g., low dielectric constant), which helps to minimize signal coupling and dielectric losses (e.g., minimize power losses). The gap 670 can also help seal any microelectromechanical system (MEMS) device below the gap 670, such as SAW filters and / or BAW filters using bent antennas, accelerometers, and gyroscopes (for wireless sensing).

[0054] Although a bent antenna is shown, substrate 602 may include several antennas, wherein at least one of the antennas is a bent antenna. Substrate 602 may include Figure 2 and Figures 5-6 A combination of antenna designs. Therefore, the substrate may include those from... Figure 2 and Figures 5-6 Several combinations of various antenna designs. In some embodiments, when the substrate (e.g., 202, 502, 602) includes several antennas, all of the antennas in the antenna can be flexible antennas (e.g., having different, similar, or identical designs, sizes, and / or shapes).

[0055] Bendable antenna designs can be implemented in various ways. In some implementations, the bendable antenna can be integrated as part of an antenna device. Figure 7 The diagram illustrates a contour view of package 700 comprising multiple discrete antenna devices, wherein at least some of the discrete antenna devices include bent antennas. Package 700 may be an antenna-in-package (AiP). Package 700 may be a radio frequency (RF) package. Package 700 may be part of an RF front-end (RFFE) package. Package 700 may be configured to provide Wi-Fi and / or cellular communication (e.g., 2G, 3G, 4G, 5G). Package 700 may be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE). Package 700 may be configured to transmit and receive signals with different frequencies and / or communication protocols.

[0056] Package 700 includes a substrate 702, integrated device 203, integrated device 205, passive device 704, a first antenna device 750, a second antenna device 760, a third antenna device 770, and a fourth antenna device 780. Substrate 702 includes at least one dielectric layer 720 and a plurality of interconnects 722. Substrate 702 includes a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). Integrated device 203 is coupled to the second surface of substrate 702 via a plurality of solder interconnects 230. Integrated device 205 is coupled to the second surface of substrate 702 via a plurality of solder interconnects 250. Integrated device 203 and the second integrated device 205 may include dies (e.g., processor dies, memory dies). Passive device 704 is coupled to the second surface of substrate 702 via a plurality of solder interconnects 740. The passive device may include a capacitor or an inductor. For example, passive device 704 is a capacitor. Connector 714 is coupled to the second surface of substrate 702.

[0057] Package 700 may include a sealing layer 710. Sealing layer 710 may be formed on a second surface of substrate 702. Sealing layer 710 may seal integrated device 203, second integrated device 205, and passive device 704. Sealing layer 710 may include a mold, resin, and / or epoxy resin. Sealing layer 710 may be a component for sealing.

[0058] Package 700 may include connector 714. Connector 714 may be configured to allow package 700 to be electrically coupled to one or more other devices. Different implementations may use different types of connections to electrically couple package 700 to other devices. For example, package 700 may be coupled to other devices via wiring and / or flexible interconnects. Power may be supplied to package 700 via connector 714.

[0059] Figure 7 The figure illustrates a first antenna device 750, a second antenna device 760, a third antenna device 770, and a fourth antenna device 780 coupled to a first surface of a substrate 702. The first antenna device 750 is coupled to the first surface of the substrate 702 via a plurality of first solder interconnects 752. The second antenna device 760 is coupled to the first surface of the substrate 702 via a plurality of second solder interconnects 762. The third antenna device 770 is coupled to the first surface of the substrate 702 via a plurality of third solder interconnects 772. The fourth antenna device 780 is coupled to the first surface of the substrate 702 via a plurality of fourth solder interconnects 782. The first antenna device 750, the second antenna device 760, the third antenna device 770, and the fourth antenna device 780 may all be discrete antenna devices. Each antenna device (e.g., 750, 760, 770, 780) may include at least one antenna, such as a curved antenna and / or a planar antenna. For example, the first antenna device 750 includes a curved antenna 705, the second antenna device 760 includes a curved antenna 706, the third antenna device 770 includes a curved antenna 707, and the fourth antenna device 780 includes a planar antenna 708.

[0060] The first antenna device 750, the second antenna device 760, the third antenna device 770, the fourth antenna device 780, and / or combinations thereof can be configured to provide Wi-Fi communication and / or cellular communication (e.g., 2G, 3G, 4G, 5G). The first antenna device 750, the second antenna device 760, the third antenna device 770, the fourth antenna device 780, and / or combinations thereof can be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE). In some embodiments, one or more of the antenna devices (e.g., 750, 760, 770, 780) can be configured as proximity sensors. When a particular antenna device is configured to operate as a proximity sensor, that particular antenna device can be able to detect the placement and / or movement of one or more objects (e.g., a hand, a finger) in the vicinity of the particular antenna device.

[0061] The first antenna device 750, the second antenna device 760, the third antenna device 770, the fourth antenna device 780, and / or combinations thereof can be configured to transmit and receive signals with different frequencies and / or communication protocols. The first antenna device 750 can be a component for transmitting and / or receiving a first signal. The second antenna device 760 can be a component for transmitting and / or receiving a second signal. The third antenna device 770 can be a component for transmitting and / or receiving a third signal. The fourth antenna device 780 can be a component for transmitting and / or receiving a fourth signal. The first signal, the second signal, the third signal, and / or the fourth signal can have the same or different properties. For example, the signals can have the same or different frequencies and / or communication protocols. The signals can be analog signals or digital signals.

[0062] One advantage of using discrete antenna devices is the ability to design and configure packages to meet the specific operational requirements of cellular network operators without having to redesign the entire substrate. Therefore, various discrete antenna devices can be mixed and matched together to work with different cellular network operators. Antenna devices (e.g., 750, 760, 770, 780) can be discrete from substrate 702 because the antenna devices are manufactured during a process separate from the fabrication of substrate 702. Another advantage of discrete antenna devices is that they are not limited by the size, dimensions, and manufacturing constraints of substrate 702. For example, as will be further described below, antenna devices can be partially suspended above substrate 702.

[0063] Different implementations may use the same or different types of antenna devices. Antenna devices may have the same size, shape and / or configuration, or they may have different sizes, shapes and / or configurations.

[0064] Exemplary discrete antenna device including a bendable antenna

[0065] Figure 8 Antenna device 800 is illustrated. Antenna device 800 may represent any of the antenna devices described in this disclosure (e.g., 750, 760, 770, 780). Antenna device 800 may be coupled to a packaged substrate. Antenna device 800 may be a discrete antenna device manufactured during a manufacturing process separate from the process for manufacturing the substrate (e.g., the packaged substrate).

[0066] Antenna device 800 includes a first dielectric layer 802, a second dielectric layer 810, a third dielectric layer 812, a solder mask layer 822, a plurality of interconnects 830, an antenna dielectric layer 260, and a flexible antenna 206. The first dielectric layer 802 may be a core layer. The second dielectric layer 810 is formed over a first surface of the first dielectric layer 802. The third dielectric layer 812 is formed over a second surface of the first dielectric layer 802. The plurality of interconnects 830 may be located in and formed over the first dielectric layer 802, the second dielectric layer 810, and / or the third dielectric layer 812. The plurality of interconnects 830 may include vias, pads, and / or traces. The antenna dielectric layer 260 is located over a surface of the antenna device 800 (e.g., the surface of the second dielectric layer 810). The bent antenna 206 is coupled to and formed on the antenna dielectric layer 260. The bent antenna 206 and the antenna dielectric layer 260 can be coupled to, for example... Figure 2 A similar manner to that described in the formation of a bent antenna 206 on a substrate is used to form a dielectric layer on the antenna device 800. The antenna device 800 may include one or more antennas (e.g., bent antennas). A solder resist layer 822 is formed on a third dielectric layer 812. The antenna device 800 may include a plurality of solder interconnects 840. The plurality of solder interconnects 840 are coupled to a plurality of interconnects 830. The dielectric layers of the antenna device 800 (e.g., 802, 810, 812) may be made of the same, similar, or different material as the dielectric layer 220 of the substrate 202. Examples of dielectric layers include organic dielectric materials and / or ceramics. In some embodiments, some dielectric layers may be considered as part of the same dielectric layer.

[0067] Figure 9 The illustration shows an antenna device 900 including a bent antenna. Device 900 includes components identical or similar to those of antenna device 800. Antenna device 900 includes a first dielectric layer 802, a second dielectric layer 810, a third dielectric layer 812, a solder mask layer 822, multiple interconnects 830, a first antenna dielectric layer 570, an antenna ground interconnect 508, a second antenna dielectric layer 560, and a bent antenna 506. The first antenna dielectric layer 570, the antenna ground interconnect 508, the second antenna dielectric layer 560, and the bent antenna 506 can be coupled with, for example, a bent antenna 506. Figure 5 The bent antenna 506, as described in the previous section, is formed on the dielectric layer of the antenna device 900. The antenna device 900 may include one or more antennas (e.g., bent antennas).

[0068] Figure 10The illustration shows an antenna device 1000 including a bent antenna. Device 1000 includes components identical or similar to those of antenna device 900. Antenna device 1000 includes a first dielectric layer 802, a second dielectric layer 810, a third dielectric layer 812, a solder mask layer 822, a plurality of interconnects 830, a gap 670, an antenna ground interconnect 608, at least one opening 609, an antenna dielectric layer 660, and a bent antenna 506. The gap 670, the antenna ground interconnect 608, the at least one opening 609, the antenna dielectric layer 660, and the bent antenna 506 can be coupled with, for example... Figure 6 The bent antenna 506, as described in the previous section, is formed on the dielectric layer of the antenna device 1000. The antenna device 1000 may include one or more antennas (e.g., bent antennas).

[0069] Antenna devices (e.g., 800, 900, 1000) can be configured to provide Wi-Fi and / or cellular communication (e.g., 2G, 3G, 4G, 5G). First antenna device 350, second antenna device 360, third antenna device 370, fourth antenna device 380, and / or combinations thereof can be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE).

[0070] Figure 2 , Figure 5 , Figure 6 , Figure 8 , Figure 9 and Figure 10 The illustration shows examples of what the surface of a substrate can be. However, different implementations may define the surface of the substrate differently (e.g., a flat surface). In some implementations, the surface of the substrate may include the surface of a dielectric layer, the surface of interconnects above the dielectric layer, and / or the surface of interconnects and solder mask above the dielectric layer.

[0071] Exemplary arrangement of a bent antenna

[0072] Bent antennas can be arranged differently on the substrate and / or antenna device. Figures 11-18 Examples of possible arrangements and / or configurations of curved antennas for substrates and / or antenna devices are illustrated.

[0073] Figure 11 The illustration shows a plan view (e.g., top view) of a bent antenna 1106 and a bent antenna 1116 coupled to and formed on a dielectric layer 1102 (e.g., a dielectric layer of a substrate, a dielectric layer of an antenna device). Figure 12The diagram illustrates the outlines of bent antennas 1106 and 1116. Bent antenna 1106 comprises a rectangular footprint above dielectric layer 1102. Bent antenna 1116 comprises an elliptical footprint above dielectric layer 1102. Bent antenna 1106 and / or bent antenna 1116 may include a dome shape (e.g., a rectangular dome shape, an elliptical dome shape).

[0074] Figure 13 The illustration shows a plan view (e.g., top view) of a bent antenna 1306 and a bent antenna 1316 coupled to and formed on a dielectric layer 1102 (e.g., a dielectric layer of a substrate, a dielectric layer of an antenna device). Figure 14 The diagram illustrates outlines of bent antenna 1306 and bent antenna 1316. Bent antenna 1306 comprises a circular footprint above dielectric layer 1102. Bent antenna 1316 comprises a square footprint above dielectric layer 1102. Bent antenna 1306 and / or bent antenna 1316 may comprise a dome shape (e.g., a semi-circular dome shape). Figure 13 and Figure 14 Bent antenna 1326 and bent antenna 1336 are also illustrated. Bent antenna 1326 and bent antenna 1336 may be part of the same antenna or may be separate antennas. Bent antenna 1316 and bent antenna 1336 may together have a hybrid dome shape.

[0075] Figure 15 The illustration shows a plan view (e.g., top view) of bent antennas 1506 and 1516 that are coupled to and formed on dielectric layer 1102 (e.g., dielectric layer of a substrate, dielectric layer of an antenna device). Figure 16 The diagram illustrates the outlines of bent antennas 1506 and 1516. Bent antennas 1506 and 1516 can be part of the same antenna or separate antennas. Bent antennas 1506 and 1516 can collectively have a hybrid dome shape.

[0076] Figure 17 The illustration shows a plan view (e.g., top view) of a curved antenna 1706 and an antenna 1716 coupled to and formed on a dielectric layer 1102 (e.g., a dielectric layer of a substrate, a dielectric layer of an antenna device). Figure 18 The diagram illustrates the outlines of curved antenna 1706 and antenna 1716. Curved antenna 1706 comprises an elliptical footprint above dielectric layer 1102. Antenna 1716 comprises a rectangular footprint above dielectric layer 1102. Curved antenna 1706 may include a dome shape. Antenna 1716 may include a planar antenna without any vertical offset from dielectric layer 1102.

[0077] Figures 11-18 The antenna arrangement shown is exemplary. Different implementations may include different arrangements with different combinations and / or different numbers of antennas (e.g., different numbers of bent antennas). Examples of arrangements include a 1x4 array of antennas (e.g., bent antennas, planar antennas). The 1x4 array can be configured to implement 5G millimeter (mm) wave applications. The 1x4 array can be implemented in a 5G millimeter wave radio frequency front-end (RFFE) package.

[0078] Exemplary sequence for manufacturing a bent antenna

[0079] Figure 19 The illustration depicts exemplary sequences for providing or manufacturing a flexible antenna. In some embodiments, Figure 19 The sequence can be used to provide or manufacture Figure 2 and / or Figure 8 The bent antenna 206, or any bent antenna described in this disclosure.

[0080] It should be noted that Figure 19 The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture a flexible antenna. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the spirit of this disclosure.

[0081] like Figure 19 As shown, stage 1 illustrates the state after the dielectric layer 220 has been provided. The dielectric layer 220 may be a dielectric layer of a substrate or an antenna device. The dielectric layer 220 may include a prepreg or polyimide. However, the dielectric layer 220 may include other materials.

[0082] Stage 2 illustrates the state after the antenna dielectric layer 260 has been formed on the surface of the dielectric layer 220. The antenna dielectric layer 260 can be formed using a deposition process. The antenna dielectric layer 260 may include a polymer (e.g., a solvent-rich polymer layer).

[0083] Phase 3 illustrates the state after the antenna dielectric layer 260 is heated to form an antenna dielectric layer 260 including curved profile shapes (e.g., dome shapes, nonlinear profile shapes).

[0084] Stage 4 illustrates the state after the bent antenna 206 is formed on and coupled to the bent profile of the antenna dielectric layer 260. The bent antenna 206 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive process (SAP) can be used to form the bent antenna 206, which can deposit copper, nickel, and / or gold to form the bent antenna 206. In another example, a subtractive process can be used to deposit and pattern the metal forming the bent antenna 206. The bent antenna 206 adopts the shape of the bent profile of the antenna dielectric layer 260. The bent antenna 206 can be formed such that it is coupled to one or more interconnects in and / or on the dielectric layer 220. The bent antenna 206 can be located on the surface of the dielectric layer 220.

[0085] Exemplary sequence for manufacturing a bent antenna

[0086] Different implementation methods can produce curved antennas in different ways. Figure 20 Another exemplary sequence for providing or manufacturing a flexible antenna is illustrated. In some embodiments, Figure 20 The sequence can be used to provide or manufacture Figure 2 and / or Figure 8 The bent antenna 206, or any bent antenna described in this disclosure.

[0087] It should be noted that Figure 20 The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture a flexible antenna. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the spirit of this disclosure.

[0088] like Figure 20 As shown, stage 1 illustrates the state after the dielectric layer 220 has been provided. The dielectric layer 220 may be a dielectric layer of a substrate or an antenna device. The dielectric layer 220 may include a prepreg or polyimide. However, the dielectric layer 220 may be other materials.

[0089] Stage 2 illustrates the state after the antenna dielectric layer 260 is formed on the surface of the dielectric layer 220. The antenna dielectric layer 260 can be formed using a direct patterning process (e.g., nozzle drop, spray nozzle). The antenna dielectric layer 260 can be cured after direct patterning. The direct patterning and curing of the antenna dielectric layer 260 can form a curved profile shape (e.g., dome shape, non-linear profile shape) of the antenna dielectric layer 260.

[0090] Stage 3 illustrates the state after the bent antenna 206 is formed on and coupled to the bent profile of the antenna dielectric layer 260. The bent antenna 206 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive process (SAP) can be used to form the bent antenna 206, which can deposit copper, nickel, and / or gold to form the bent antenna 206. In another example, a subtractive process can be used to deposit and pattern the metal forming the bent antenna 206. The bent antenna 206 adopts the shape of the bent profile of the antenna dielectric layer 260. The bent antenna 206 can be formed such that it is coupled to one or more interconnects in and / or on the dielectric layer 220. The bent antenna 206 can be located on the surface of the dielectric layer 220.

[0091] Exemplary sequence for manufacturing a bent antenna

[0092] Figures 21A-21B Another exemplary sequence for providing or manufacturing a flexible antenna is illustrated. In some embodiments, Figures 21A-21B The sequence can be used to provide or manufacture Figure 5 and / or Figure 9 The bent antenna 506, or any bent antenna described in this disclosure.

[0093] It should be noted that Figures 21A-21B The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture a flexible antenna. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the spirit of this disclosure.

[0094] like Figure 21A As shown, stage 1 illustrates the state after the dielectric layer 220 has been provided. The dielectric layer 220 may be a dielectric layer of a substrate or an antenna device. The dielectric layer 220 may include a prepreg or polyimide. However, the dielectric layer 220 may be other materials.

[0095] Phase 2 illustrates the state after the first antenna dielectric layer 570 is formed on the surface of the dielectric layer 220. The first antenna dielectric layer 570 can be formed in different ways. Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0096] Phase 3 illustrates the state after the antenna ground interconnect 508 is formed over and coupled to the curved profile of the first antenna dielectric layer 570. The curved antenna ground interconnect 508 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive manufacturing process (SAP) can be used to form the antenna ground interconnect 508, which can deposit copper, nickel, and / or gold to form the antenna ground interconnect 508. In another example, a subtractive manufacturing process can be used to deposit and pattern the metal forming the antenna ground interconnect 508. The antenna ground interconnect 508 adopts the shape of the curved profile of the antenna dielectric layer 570. The antenna ground interconnect 508 can be formed such that it is coupled to one or more interconnects in and / or over the dielectric layer 220. The antenna ground interconnect 508 can be located above the surface of the dielectric layer 220. The antenna ground interconnect 508 can be configured to be coupled to ground.

[0097] like Figure 21B As shown, stage 4 illustrates the state after the second antenna dielectric layer 560 is formed on the surface of the antenna ground interconnect 508. The second antenna dielectric layer 560 may be formed in different ways. Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0098] Stage 5 illustrates the state after the bent antenna 506 is formed on and coupled to the bent profile of the second antenna dielectric layer 560. The bent antenna 506 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive process (SAP) can be used to form the bent antenna 506, which can deposit copper, nickel, and / or gold to form the bent antenna 506. In another example, a subtractive process can be used to deposit and pattern the metal forming the bent antenna 506. The bent antenna 506 adopts the shape of the bent profile of the antenna dielectric layer 560. The bent antenna 506 can be formed such that it is coupled to one or more interconnects in and / or on the dielectric layer 220. The bent antenna 506 can be located on the dielectric layer 220.

[0099] Exemplary sequence for manufacturing a bent antenna

[0100] Figures 22A-22BAnother exemplary sequence for providing or manufacturing a flexible antenna is illustrated. In some embodiments, Figures 22A-22B The sequence can be used to provide or manufacture Figure 6 and / or Figure 10 The bent antenna 606, or any bent antenna described in this disclosure.

[0101] It should be noted that Figures 22A-22B The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture a flexible antenna. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the spirit of this disclosure.

[0102] like Figure 22A As shown, stage 1 illustrates the state after the dielectric layer 220 has been provided. The dielectric layer 220 may be a dielectric layer of a substrate or an antenna device. The dielectric layer 220 may include a prepreg or polyimide. However, the dielectric layer 220 may be other materials.

[0103] Phase 2 illustrates the state after the first antenna dielectric layer 570 is formed on the surface of the dielectric layer 220. The first antenna dielectric layer 570 can be formed in different ways. Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0104] Stage 3 illustrates the state after the antenna ground interconnect 608 is formed over and coupled to the curved profile of the first antenna dielectric layer 570. The curved antenna ground interconnect 608 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive manufacturing process (SAP) can be used to form the antenna ground interconnect 608, which can deposit copper, nickel, and / or gold. In another example, a subtractive manufacturing process can be used to deposit and pattern the metal forming the antenna ground interconnect 608. The antenna ground interconnect 608 adopts the shape of the curved profile of the antenna dielectric layer 570. The antenna ground interconnect 608 can be formed such that it is coupled to one or more interconnects in and / or over the dielectric layer 220. The antenna ground interconnect 608 can be located over the dielectric layer 220.

[0105] Stage 4 illustrates the state after at least one opening 609 has been formed in the antenna ground interconnect 608. At least one opening 609 can be formed using a laser process (e.g., laser ablation). At least one opening 609 can extend through the antenna ground interconnect 608.

[0106] like Figure 22B As shown, stage 5 illustrates the state after removing at least some portions of the first antenna dielectric layer 570, leaving a gap 670 between the dielectric layer 220 and the antenna ground interconnect 608. Note that not all of the first antenna dielectric layer 570 can be removed. Therefore, a combination of gap 670 and the first antenna dielectric layer 570 may exist between the dielectric layer 220 and the antenna ground interconnect 608. Different embodiments may remove at least a portion of the antenna dielectric layer 570 in different ways. For example, at least a portion of the antenna dielectric layer 570 may be dissolved.

[0107] Phase 6 illustrates the state after the antenna dielectric layer 660 has been formed on the surface of the antenna ground interconnect 608. The antenna dielectric layer 660 can be formed in various ways. The size of the opening 609 can be small enough that the antenna dielectric layer 660 does not pass through at least one opening 609. However, in some embodiments, portions of the antenna dielectric layer 660 may pass through at least one opening 609 and be formed in the void 670. Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0108] Stage 7 illustrates the state after the bent antenna 506 is formed on and coupled to the bent profile of the antenna dielectric layer 660. The bent antenna 506 can be formed using deposition, patterning, and / or plating processes. For example, a semi-additive process (SAP) can be used to form the bent antenna 506, which can deposit copper, nickel, and / or gold to form the bent antenna 506. In another example, a subtractive process can be used to deposit and pattern the metal forming the bent antenna 506. The bent antenna 506 adopts the shape of the bent profile of the antenna dielectric layer 660. The bent antenna 506 can be formed such that it is coupled to one or more interconnects in and / or on the dielectric layer 220. The bent antenna 506 can be located on the surface of the dielectric layer (e.g., the surface of a substrate, the surface of an antenna device).

[0109] Exemplary flowchart of a method for manufacturing a bent antenna

[0110] In some implementations, manufacturing a bent antenna involves several processes. Figure 23 An exemplary flowchart of a method 2300 for providing or manufacturing a flexible antenna is illustrated. In some embodiments, Figure 23 Method 2300 can be used to provide or manufacture the bent antennas 206, 506, or 606 described in this disclosure. The method can be used to provide or manufacture bent antennas for substrates and / or antenna devices. However, method 2300 can be used to provide or manufacture any bent antenna described in this disclosure.

[0111] It should be noted that Figure 23 The method may combine one or more processes to simplify and / or clarify the method for providing or manufacturing a flexible antenna. In some implementations, the order of the processes may be changed or modified.

[0112] The method (at 2305) forms an antenna dielectric layer (e.g., 260, 570) including a curved profile shape. Different embodiments may form the antenna dielectric layer differently. The antenna dielectric layer may be formed on the surface of a dielectric layer (e.g., a dielectric layer of a substrate, a dielectric layer of an antenna device) and coupled to the surface of that dielectric layer. Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0113] The method (at 2310) forms an interconnect configured as an antenna ground interconnect (e.g., 508, 608) or a bent antenna (e.g., 206). The antenna ground interconnect (e.g., 508, 608) or the bent antenna (e.g., 206) may be formed over an antenna dielectric layer (e.g., 260, 570). The antenna ground interconnect may have a bent shape. The bent antenna ground interconnect (e.g., 508, 608) may be formed using deposition processes, patterning processes, and / or plating processes. For example, a semi-additive manufacturing process (SAP) may be used to form the antenna ground interconnect, which may deposit copper, nickel, and / or gold to form the antenna ground interconnect. In another example, a subtractive manufacturing process may be used to deposit and pattern the metal forming the antenna ground interconnect. The same or similar processes may be used to form the bent antenna. Figure 19 Phase 4 and Figure 20 , Figure 21A and Figure 22B Stage 3 illustrates an example of forming an antenna ground interconnect or a bent antenna. When the method forms a bent antenna (e.g., 206), the method may stop forming any additional antenna dielectric layer or antenna interconnect.

[0114] The method (at 2315) may optionally form at least one opening (e.g., 609) in the antenna ground interconnect (e.g., 608). At least one opening 609 may be formed using a laser process (e.g., laser ablation). Figure 22A Phase 4 illustrates an example of forming at least one opening in the antenna ground interconnect.

[0115] The method (at 2320) may optionally remove at least some of the antenna dielectric layers (e.g., 570) to create a void (e.g., 670) between the antenna ground interconnect and the dielectric layer of the substrate or antenna device. Different embodiments may remove the antenna dielectric layers differently. For example, at least a portion of the antenna dielectric layer 570 may be dissolved or have slag removed. Figure 22B Stage 5 illustrates an example of removing at least some portions of the antenna dielectric layer.

[0116] The method (at 2325) forms an antenna dielectric layer (e.g., 560) including a curved profile. Different embodiments may form the antenna dielectric layer differently. The antenna dielectric layer may be formed on and coupled to the antenna ground interconnect (e.g., 508, 608). Figure 19 and Figure 20 The diagrams and illustrations depict different methods for forming antenna dielectric layers. Antenna dielectric layers can be formed using deposition and heating processes, such as... Figure 19 The antenna dielectric layer can be formed using the methods described herein, or through direct patterning processes (e.g., nozzle droplets, nozzles), such as... Figure 20 As described in [the text].

[0117] The method (at 2330) forms a bent antenna (e.g., 506). The bent antenna (e.g., 506) may be formed on an antenna dielectric layer (e.g., 560). A deposition process, a patterning process, and / or a plating process may be used to form the bent antenna (e.g., 506). For example, a semi-additive process (SAP) may be used to form the bent antenna, which may deposit copper, nickel, and / or gold. In another example, a subtractive process may be used to deposit and pattern the metal forming the bent antenna. Figure 21B Phase 5 and Figure 22B Stage 7 illustrates an example of forming a bent antenna.

[0118] Exemplary sequence for manufacturing antenna devices including flexible antennas

[0119] Figures 24A-24D The illustration depicts exemplary sequences for providing or manufacturing discrete antenna devices. In some embodiments, Figures 24A-24D The sequence can be used to provide or manufacture Figure 8 The antenna device 800, or any antenna device described in this disclosure.

[0120] It should be noted that Figures 24A-24D The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture the antenna device. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be substituted or replaced without departing from the spirit of this disclosure.

[0121] like Figure 24A As shown, stage 1 illustrates the state after the first dielectric layer 802 has been provided. The first dielectric layer 802 may be a core layer. The first dielectric layer 802 may be silicon, glass, quartz, or a combination thereof.

[0122] Phase 2 illustrates the state after one or more cavities 2401 have been formed in the first dielectric layer 802. Cavities 2401 can be formed in the first dielectric layer 802 using a laser process or a photolithography process.

[0123] Stage 3 illustrates the state after a plurality of interconnects 2402 have been formed in and over the first dielectric layer 802. A plating process can be used to form the plurality of interconnects 2402. The plurality of interconnects 2402 may include traces, vias, and / or pads. The plurality of interconnects 2402 may include one or more metal layers (e.g., a seed layer + a metal layer).

[0124] like Figure 24B As shown, stage 4 illustrates the state after the formation of the second dielectric layer 810 on the first surface of the first dielectric layer 802, and after the formation of the third dielectric layer 812 on the second surface of the first dielectric layer 802. The second dielectric layer 810 and the third dielectric layer 812 can be formed using a lamination process. The second dielectric layer 810 and / or the third dielectric layer 812 can be photoetchable dielectric layers.

[0125] Stage 5 illustrates the state after one or more cavities 2403 have been formed in the third dielectric layer 812. The cavities 2403 can be formed in the third dielectric layer 812 using a laser process or a photolithography process.

[0126] like Figure 24CAs shown, stage 6 illustrates the state after a plurality of interconnects 2412 have been formed in and over the third dielectric layer 812. A plating process can be used to form the plurality of interconnects 2412. The plurality of interconnects 2412 may include traces, vias, and / or pads. The plurality of interconnects 2412 may include one or more metal layers (e.g., a seed layer + metal layer). Note that the interconnects may be formed in and / or over the second dielectric layer 810.

[0127] Phase 7 illustrates the state after the curved antenna 506 is formed on the dielectric layer 810. In addition to the curved antenna 506, a gap 670, an antenna ground interconnect, an antenna dielectric layer 660, and at least one opening 609 may be formed on the dielectric layer 810. Figures 22A-22B The illustration shows an example of forming a curved antenna 506, a gap 670, an antenna ground interconnect 608, an antenna dielectric layer 660, and at least one opening 609. Different embodiments can form different configurations of the curved antenna. For example, Figure 19 , Figure 20 and / or Figures 21A-21B The curved antenna described herein can be formed on the dielectric layer 810.

[0128] like Figure 24D As shown, stage 8 illustrates the state after the solder mask layer 822 is formed on the third dielectric layer 812. The solder mask layer can be formed using a deposition process.

[0129] like Figure 24D As shown, stage 9 illustrates the state after multiple solder interconnects 840 are provided in the cavity of the second solder mask layer 822. The multiple solder interconnects 840 can be coupled to multiple interconnects 830 via a reflow process. The multiple interconnects 830 may represent multiple interconnects 2402 and 2412. Stage 8 and / or stage 9 may illustrate... Figure 8 Antenna equipment 800.

[0130] Figures 24A-24D The illustration shows an example of a sequence for manufacturing an antenna device. However, different embodiments may use different processes and / or sequences to form interconnects. In some embodiments, chemical vapor deposition (CVD) and / or physical vapor deposition (PVD) processes may be used to form interconnects. Sputtering, spraying, and / or plating processes may be used to form interconnects.

[0131] Exemplary flowchart of a method for manufacturing discrete antenna devices

[0132] In some implementations, manufacturing a discrete antenna device involves several processes. Figure 25 An exemplary flowchart of a method 2500 for providing or manufacturing a discrete antenna device is illustrated. In some embodiments, Figure 25 Method 2500 can be used to provide or manufacture the invention described in this disclosure. Figure 8 Antenna device 800. However, method 2500 can be used to provide or manufacture any antenna device described in this disclosure.

[0133] It should be noted that Figure 25 The sequence can combine one or more processes to simplify and / or clarify the method for providing or manufacturing an antenna device. In some implementations, the order of the processes can be changed or modified.

[0134] The method (at 2505) forms one or more dielectric layers (e.g., 402, 410, 412). Depending on the type of antenna device being manufactured, the dielectric layer may include a core layer and / or a ceramic layer. Forming the dielectric layer may include a deposition process, a lamination process, and / or include providing one or more dielectric films.

[0135] The method (at 2510) forms a plurality of interconnects (e.g., 1202, 1212) in and on dielectric layers (e.g., 802, 810, 812). A plating process can be used to form the interconnects. However, other processes can be used to form the interconnects. In some embodiments, chemical vapor deposition (CVD) and / or physical vapor deposition (PVD) processes can be used to form the interconnects. Additionally, sputtering, bonding, and / or spraying processes can be used to form the interconnects. In some embodiments, a plurality of interconnects can be formed after each dielectric layer has been formed. Figures 24A-24C Stages 1-6 are illustrated and described as examples of forming a dielectric layer and multiple interconnects.

[0136] The method (at 2515) forms at least one bent antenna. Different implementations can result in different bent antenna designs and configurations. The bent antenna can be bent relative to the surface of at least one dielectric layer. At least a portion of the bent antenna is offset from the surface of at least one dielectric layer (e.g., vertically offset). Figure 19 , Figure 20 , Figures 21A-21B and Figures 22A-22B The illustrations and descriptions depict different examples of forming at least one curved antenna.

[0137] The method (at 2520) forms a solder resist layer (e.g., 822) over a dielectric layer (e.g., 802, 810). The solder resist layer can be formed using a deposition process. Figure 24D Stage 8 illustrates an example of forming a solder resist layer.

[0138] The method (at 2525) couples multiple solder interconnects (e.g., 840) to multiple interconnects (e.g., 830). A reflow process can be used to couple multiple solder interconnects to multiple interconnects. Figure 24D Phase 9 illustrates an example of solder interconnects coupled to the interconnects of an antenna device.

[0139] In some implementations, multiple antenna devices are formed on a wafer and / or carrier. In this case, the wafer or carrier is diced (e.g., monolithized, sliced) into multiple discrete antenna devices. The wafer or carrier can be diced using mechanical processes (e.g., sawing) and / or laser processes (e.g., laser ablation).

[0140] Exemplary electronic devices

[0141] Figure 26 The illustrations depict various electronic devices that can be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, PoP stacks, system-in-packages (SiP), or system-on-a-chip (SoC). For example, mobile phone device 2602, laptop computer device 2604, fixed-location terminal device 2606, wearable device 2608, or motor vehicle 2610 may include device 2600 as described herein. For example, device 2600 may be any device and / or integrated circuit (IC) package described herein. Figure 26 The devices 2602, 2604, 2606, and 2608 and the vehicle 2610 shown in the illustrations are merely exemplary. Other electronic devices may also feature device 2600, including but not limited to a group of devices (e.g., electronic devices) comprising: mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, devices supporting Global Positioning System (GPS), navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units such as watch readers, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device or any combination thereof that stores or retrieves data or computer instructions.

[0142] exist Figures 2-20 , Figures 21A-21B , Figures 22A-22B C Figure 23 , Figures 24A-24D and / or Figures 25-26One or more of the components, processes, features, and / or functions illustrated in the diagram may be rearranged and / or combined into a single component, process, feature, or function, or embodied in several components, processes, or functions. Additional elements, components, processes, and / or functions may be added without departing from this disclosure. It should also be noted that... Figures 2-20 , Figures 21A-21B , Figures 22A-22B C Figure 23 , Figures 24A-24D and / or Figures 25-26 The corresponding descriptions herein are not limited to bare dies and / or ICs. In some embodiments, Figures 2-20 , Figures 21A-21B , Figures 22A-22B C Figure 23 , Figures 24A-24D and / or Figures 25-26 The descriptions therein can be used to manufacture, create, provide, and / or produce equipment and / or integrated equipment. In some embodiments, the equipment may include a die, integrated device, integrated passive device (IPD), die package, integrated circuit (IC) device, device package, integrated circuit (IC) package, wafer, semiconductor device, stacked package (PoP) device, thermal device, and / or interposer.

[0143] Note that the accompanying drawings in this disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some cases, these drawings may not be drawn to scale. In some cases, not all components and / or parts may be shown for clarity. In some cases, the position, orientation, size, and / or shape of the various parts and / or components in the drawings may be exemplary. In some embodiments, the various components and / or parts in the drawings may be optional.

[0144] The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as superior to or better than other aspects of this disclosure. Similarly, the term “aspect” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupling” is used herein to refer to direct or indirect coupling between two objects (e.g., mechanical coupling). For example, if object A is in physical contact with object B, and object B is in contact with object C, then objects A and C can still be considered coupled to each other—even if they are not in direct physical contact. The term “electrical coupling” can mean that two objects are directly or indirectly coupled together so that current (e.g., signal, power, ground) can propagate between the two objects. Electrically coupled objects may or may not have current propagating between them. Electromagnetic coupling can mean that a signal from one circuit and / or component affects a signal from another circuit and / or component. Electromagnetic coupling can cause crosstalk. Electromagnetic coupling can be a form of signal coupling. The use of the terms “first,” “second,” “third,” and “fourth” (and / or anything greater than fourth) is arbitrary. Any component described may be a first component, a second component, a third component, or a fourth component. For example, a component referred to as the second component may be a first component, a second component, a third component, or a fourth component. The terms “top” and “bottom” are arbitrary. A component located at the top may be located on top of a component located at the bottom. A top component may be considered as a bottom component, and vice versa. The term “sealed” means that an object may partially or completely seal another object. Further note that the term “on top of” as used in this application in the context of one component being on top of another component may be used to mean a component on and / or in another component (e.g., on the surface of the component or embedded in the component). Thus, for example, a first component on top of a second component may mean (1) the first component is on top of the second component but does not directly contact the second component, (2) the first component is on the second component (e.g., on the surface of the second component), and / or (3) the first component is in (e.g., embedded in) the second component. The terms “approximately 'X value'” or “approximately X value” as used in this disclosure mean within 10% of the 'X value'. For example, a value of approximately 1 or close to 1 would mean a value in the range of 0.9-1.1.

[0145] In some embodiments, an interconnect is a device or packaged element or assembly that allows or facilitates an electrical connection between two points, elements, and / or components. In some embodiments, an interconnect may include traces, vias, pads, pillars, redistributed metal layers, and / or under-bump metallization (UBM) layers / interconnects. In some embodiments, an interconnect is a conductive material that can be configured to provide an electrical path for signals (e.g., data signals), ground, and / or power. An interconnect may be part of a circuit. An interconnect may include more than one element or assembly. An interconnect may be defined by one or more interconnects. Different embodiments may use different processes and / or sequences to form interconnects. In some embodiments, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, spraying, and / or plating processes may be used to form interconnects.

[0146] Furthermore, it should be noted that the various disclosures contained herein can be described as processes, depicted as flowcharts, diagrams, structural diagrams, or block diagrams. Although flowcharts can describe operations as sequential processes, many operations can be performed in parallel or simultaneously. Moreover, the order of operations can be rearranged. A process terminates when its operations are completed.

[0147] The various features of this disclosure described herein can be implemented in different systems without departing from this disclosure. It should be noted that the foregoing aspects of this disclosure are merely illustrative and should not be construed as limiting the scope of this disclosure. The descriptions of various aspects of this disclosure are intended to be illustrative and not to limit the scope of the claims. Therefore, this teaching can be readily applied to other types of devices, and many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

1. A substrate, comprising: At least one dielectric layer; Multiple interconnects; A curved antenna, coupled to the surface of the substrate, the curved antenna comprising: A blank area with no solid material adjacent to the surface of the substrate; An antenna grounding interconnect adjacent to and above the blank area, the antenna grounding interconnect including a plurality of openings and coupled to ground; and An antenna dielectric layer is directly coupled to and above the antenna ground interconnect, the antenna dielectric layer is directly coupled to the bent antenna, and is adjacent to at least a portion of the blank area through the plurality of openings; A curved antenna portion that is directly adjacent to and above the antenna dielectric layer; The bent antenna is bent relative to the surface of the substrate, and At least a portion of the bent antenna is offset from the surface of the substrate.

2. The substrate according to claim 1, The bent antenna is coupled to the surface of the at least one dielectric layer, and The curved antenna is coupled to the plurality of interconnects.

3. The substrate according to claim 1, The curved antenna described therein includes a concave antenna, and The concave antenna is concave relative to the surface of the substrate.

4. The substrate according to claim 1, The curved antenna portion is coupled to the contour of the antenna dielectric layer, and The shape of the curved antenna portion is defined by the shape of the contour of the antenna dielectric layer.

5. The substrate of claim 1, wherein the antenna ground interconnect comprises a bent antenna ground interconnect.

6. The substrate according to claim 1, The blank area is adjacent to the surface of the substrate and is located between the antenna ground interconnect and the surface of the substrate.

7. The substrate of claim 1, wherein the antenna ground interconnect comprises a bent antenna ground interconnect that is at least partially offset relative to the surface of the substrate.

8. The substrate of claim 1, wherein the curved antenna comprises a dome shape.

9. The substrate of claim 1, further comprising a second antenna coupled to the surface of the substrate.

10. The substrate of claim 9, wherein the second antenna comprises a shape different from that of a curved antenna.

11. The substrate of claim 9, wherein the second antenna comprises a second curved antenna.

12. The substrate of claim 9, wherein the curved antenna and the second antenna comprise a hybrid dome shape.

13. The substrate according to claim 1, further comprising: The second antenna is coupled to the surface of the substrate; A third antenna is coupled to the surface of the substrate; as well as A fourth antenna is coupled to the surface of the substrate. The curved antenna, the second antenna, the third antenna, and the fourth antenna are arranged in a 1×4 array.

14. The substrate of claim 13, wherein at least one of the second antenna, the third antenna, and the fourth antenna comprises a bent antenna.

15. The substrate of claim 13, wherein at least one of the bent antenna, the second antenna, the third antenna, and the fourth antenna is configured to receive and / or transmit 5G millimeter-wave signals.

16. The substrate of claim 13, wherein the substrate is implemented in an RF front-end (RFFE) package.

17. The substrate of claim 13, wherein the bent antenna, the second antenna, the third antenna, and the fourth antenna are located on a first surface of the substrate.

18. The substrate of claim 1, wherein the substrate is incorporated into a device selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile devices, mobile phones, smartphones, personal digital assistants, fixed-location terminals, tablet computers, computers, wearable devices, laptop computers, servers, and devices in motor vehicles.

19. An antenna device, comprising: At least one dielectric layer; Multiple interconnects; A curved antenna, coupled to the surface of the antenna device, the curved antenna comprising: A blank area without solid material adjacent to the surface of the antenna device; An antenna grounding interconnect adjacent to and above the blank area, the antenna grounding interconnect including a plurality of openings and coupled to ground; and An antenna dielectric layer is directly coupled to and above the antenna ground interconnect, the antenna dielectric layer is directly coupled to the bent antenna, and is adjacent to at least a portion of the blank area through the plurality of openings; A curved antenna portion that is directly adjacent to and above the antenna dielectric layer; The bent antenna is bent relative to the surface of the antenna device, and At least a portion of the bent antenna is offset from the surface of the antenna device.

20. The antenna device according to claim 19, The bent antenna is coupled to the surface of the at least one dielectric layer, and The curved antenna is coupled to the plurality of interconnects.

21. The antenna device according to claim 19, The curved antenna described therein includes a concave antenna, and The concave antenna is concave relative to the surface of the antenna device.

22. The antenna device according to claim 19, The curved antenna portion is coupled to the contour of the antenna dielectric layer, and The shape of the curved antenna portion is defined by the shape of the contour of the antenna dielectric layer.

23. The antenna device of claim 19, wherein the antenna ground interconnect comprises a bent antenna ground interconnect.

24. The antenna device according to claim 19, The blank area is adjacent to the surface of the antenna device and is located between the antenna ground interconnect and the surface of the antenna device.

25. The antenna device of claim 19, wherein the antenna ground interconnect comprises a bent antenna ground interconnect that is at least partially offset relative to the surface of the antenna device.

26. The antenna device of claim 19, wherein the curved antenna comprises a dome shape.

27. The antenna device of claim 19, further comprising a second antenna coupled to the surface of the antenna device.

28. The antenna device of claim 27, wherein the second antenna comprises a shape different from that of a curved antenna.

29. The antenna device of claim 27, wherein the second antenna comprises a second curved antenna.

30. The antenna device of claim 27, wherein the curved antenna and the second antenna comprise a hybrid dome shape.

31. The antenna device according to claim 19, further comprising: A second antenna is coupled to the surface of the antenna device; A third antenna is coupled to the surface of the antenna device; as well as A fourth antenna is coupled to the surface of the antenna device. The curved antenna, the second antenna, the third antenna, and the fourth antenna are arranged in a 1×4 array.

32. The antenna device of claim 31, wherein at least one of the second antenna, the third antenna, and the fourth antenna comprises a curved antenna.

33. The antenna device of claim 31, wherein at least one of the curved antenna, the second antenna, the third antenna, and the fourth antenna is configured to receive and / or transmit 5G millimeter wave signals.

34. The antenna device of claim 31, wherein the antenna device is implemented in a radio frequency front-end (RFFE) package.

35. The antenna device of claim 31, wherein the curved antenna, the second antenna, the third antenna, and the fourth antenna are located on a first surface of the antenna device.

36. The antenna device of claim 19, wherein the antenna device is incorporated into devices selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile devices, mobile phones, smartphones, personal digital assistants, fixed-location terminals, tablet computers, computers, wearable devices, laptop computers, servers, and devices in motor vehicles.

37. A package structure including an antenna, comprising: Substrate; as well as A first antenna device is coupled to the substrate, wherein the first antenna device includes: At least one dielectric layer; Multiple interconnects; and A curved antenna, coupled to the surface of the first antenna device, the curved antenna comprising: A blank area without solid material adjacent to the surface of the first antenna device; An antenna grounding interconnect adjacent to and above the blank area, the antenna grounding interconnect including a plurality of openings and coupled to ground; and An antenna dielectric layer is directly coupled to and above the antenna ground interconnect, the antenna dielectric layer is directly coupled to the bent antenna, and is adjacent to at least a portion of the blank area through the plurality of openings; A curved antenna portion that is directly adjacent to and above the antenna dielectric layer; The bent antenna is bent relative to the surface of the first antenna device, and At least a portion of the bent antenna is offset from the surface of the first antenna device.

38. The packaging structure according to claim 37, further comprising: The second antenna device includes a second antenna coupled to a surface of the second antenna device; A third antenna device, including a third antenna coupled to the surface of the third antenna device; as well as A fourth antenna device, including a fourth antenna coupled to the surface of the fourth antenna device. The first antenna device, the second antenna device, the third antenna device, and the fourth antenna device are arranged in a 1×4 array.

39. The packaging structure according to claim 37, wherein the packaging includes an RF front-end (RFFE) package.

40. The packaging structure of claim 38, wherein at least one of the second antenna, the third antenna, and the fourth antenna comprises a bent antenna.

41. The packaging structure of claim 40, wherein at least one of the bent antenna, the second antenna, the third antenna, and the fourth antenna is configured to receive and / or transmit 5G millimeter wave signals.

42. The packaging structure according to claim 37, The bent antenna is coupled to the surface of the at least one dielectric layer, and The curved antenna is coupled to the plurality of interconnects.

43. The packaging structure according to claim 37, The curved antenna described therein includes a concave antenna, and The concave antenna is concave relative to the surface of the first antenna device.

44. The packaging structure according to claim 37, The curved antenna portion is coupled to the contour of the antenna dielectric layer, and The shape of the curved antenna portion is defined by the shape of the contour of the antenna dielectric layer.

45. The packaging structure of claim 37, wherein the antenna ground interconnect comprises a bent antenna ground interconnect.

46. ​​The packaging structure according to claim 37, The blank area is adjacent to the surface of the first antenna device and is located between the antenna ground interconnect and the surface of the first antenna device.

47. The packaging structure of claim 37, wherein the antenna ground interconnect includes a bent antenna ground interconnect that is at least partially offset relative to the surface of the first antenna device.

48. The packaging structure of claim 37, wherein the curved antenna comprises a dome shape.

49. The packaging structure of claim 37 further includes a second antenna coupled to the surface of the first antenna device.

50. The packaging structure of claim 49, wherein the second antenna comprises a shape different from that of a curved antenna.

51. The packaging structure of claim 49, wherein the second antenna includes a second curved antenna.

52. The packaging structure of claim 49, wherein the curved antenna and the second antenna comprise a hybrid dome shape.

53. The packaging structure of claim 38, wherein the bent antenna, the second antenna, the third antenna, and the fourth antenna are located on a first surface of the first antenna device.

54. The packaging structure of claim 37, wherein the first antenna device is incorporated into a device selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile devices, mobile phones, smartphones, personal digital assistants, fixed-location terminals, tablet computers, computers, wearable devices, laptop computers, servers, and devices in motor vehicles.

55. A method for manufacturing an antenna, comprising: Form at least one dielectric layer; A plurality of interconnects are formed in and on the at least one dielectric layer; A curved antenna is formed on the surface of the at least one dielectric layer, wherein forming the curved antenna includes: Forming a blank area without solid material adjacent to the at least one dielectric layer; Forming an antenna grounding interconnect adjacent to and above the blank area, the antenna grounding interconnect including a plurality of openings and coupled to ground; and An antenna dielectric layer is formed that is directly coupled to and on the antenna ground interconnect, the antenna dielectric layer being directly coupled to the bent antenna and adjacent to at least a portion of the blank area through the plurality of openings; A curved antenna portion is formed that is directly adjacent to and on top of the antenna dielectric layer; The bent antenna is bent relative to the surface of the at least one dielectric layer, and At least a portion of the bent antenna is offset from the surface of the at least one dielectric layer.

56. The method according to claim 55, The curved antenna portion is formed on the antenna dielectric layer. The curved antenna portion is coupled to the contour of the antenna dielectric layer, and The shape of the curved antenna is defined by the shape of the contour of the antenna dielectric layer.

57. The method of claim 55, wherein the antenna ground interconnect comprises a bent antenna ground interconnect.

58. The method of claim 55, further comprising: A first antenna dielectric layer is formed on the surface of the at least one dielectric layer; The blank area is created between the antenna ground interconnect and the surface of the at least one dielectric layer by removing at least a portion of the antenna dielectric layer.

59. The method of claim 55, wherein the at least one dielectric layer, the plurality of interconnects, and the bent antenna are part of a substrate.

60. The method of claim 55, wherein the at least one dielectric layer, the plurality of interconnects, and the bent antenna are part of an antenna device.

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