Control System and Method for Processing Device, Electronic Device, and Storage Medium

Abstract

The present invention provides a control system and method for a processing device, an electronic device, and a storage medium. The system includes: a data receiving module, configured to receive in real time the position information of a workpiece to be processed and the distance information corresponding to the position information; a data storage module, configured to store the distance information; a first data processing module, configured to calculate the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculate the response time according to the change rate; a reading control module, configured to correct the first position information X1 at least according to the response time and the moving speed when the workpiece to be processed and the processing head move relatively, so as to determine the second position information X2. When the position information received by the data receiving module is the second position information X2, read the distance information corresponding to the first position information X1 from the data storage module, so as to control the focusing mechanism to drive the processing head to move to a matching focal position in the second direction. The following performance of the focusing mechanism is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and more particularly to a control system for a processing device, a control method for a processing device, an electronic device, and a storage medium. Background Art

[0002] In many fields, processing devices are equipped with an automatic following system. Taking laser processing as an example for illustration. A laser processing device includes a stage assembly, a laser rangefinder, a processing head, a piezoelectric ceramic motor, and an automatic following system. In the laser processing device, the automatic following system is a non-contact measurement and real-time focusing system. During laser cutting, automatic focusing can be achieved through the automatic following system, and the focus automatically adjusts in real time following the change in the product thickness, ensuring that the depth of the laser focusing modification layer for invisible cutting is consistent and guaranteeing the cutting quality.

[0003] In the laser processing device, the piezoelectric ceramic motor drives the processing head to move to adjust the distance between the processing head and the workpiece to be processed in real time following the change in the product thickness to achieve focusing. However, due to the relatively long response time of the piezoelectric ceramic motor, after the piezoelectric ceramic motor receives a signal, it cannot respond in a timely manner and drive the processing head to move, thus affecting its following performance and ultimately the cutting accuracy. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed. The present invention provides a control system and method for a processing device, an electronic device, and a storage medium.

[0005] According to a first aspect of the present invention, there is provided a control system for a processing device, including: a data receiving module, configured to receive in real time the position information of a workpiece to be processed and the distance information corresponding to the position information, where the position information is used to represent the position of the workpiece to be processed in the first direction when the workpiece to be processed moves relative to the processing head of the processing device in the first direction, the distance information is used to represent the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction, the position information includes position information corresponding one by one to each different position point where the workpiece to be processed is located, and the distance information includes distance information corresponding one by one to each different position point where the workpiece to be processed is located; a data storage module, configured to store the distance information; a first data processing module, configured to calculate the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculate the response time according to the change rate, the response time being the response time of a focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction; a reading control module, connected to the first data processing module, the data storage module, and the data receiving module, configured to at least based on the response time output by the first data processing module and the moving speed when the workpiece to be processed and the processing head move relative to each other, for the first position information X1 Modify to determine the second position information X 2 and is used when the position information received by the data receiving module is the second position information X 2 to read from the data storage module the distance information corresponding to the first position information X 1 to control, based on the read distance information, the focusing mechanism to drive the processing head to move in the second direction to a focal position matching the read distance information, where the first position information X 1 is the position information corresponding to multiple position points.

[0006] Exemplarily, the system further includes: a first downsampling module, connected to the data receiving module and the data storage module, for performing a first downsampling on the distance information; a second downsampling module, connected to the first downsampling module and the first data processing module, for performing a second downsampling on the distance information that has undergone the first downsampling; wherein, the data storage module is used to store the distance information that has undergone the first downsampling, and the first data processing module is used to calculate the change rate based on the distance information corresponding to multiple position points in the distance information that has undergone the second downsampling.

[0007] Exemplarily, the multiple position points are the position points when the workpiece to be processed is within the effective processing area, and the first data processing module calculates the change rate of the distance information corresponding to the multiple position points of the workpiece to be processed in the following manner: determines a preset number of consecutive position points in the effective processing area as the multiple position points; calculates the change rate corresponding to the multiple position points according to the distance information and the respective information acquisition times corresponding to the starting position point and the ending position point among the multiple position points, where the information acquisition time corresponding to any position point is the time when the distance information corresponding to that position point is acquired.

[0008] Exemplarily, the first data processing module calculates the response time according to the change rate in the following manner: calculates the response time according to the change rate and a preset relationship function, where the preset relationship function is the relationship function between the change rate and the response time.

[0009] Exemplarily, the reading control module is further used to determine, according to the position information and the distance information, whether the workpiece to be processed is at the target position point, where the target position point is the starting point or the ending point of processing in the effective processing area of the workpiece to be processed, and where the reading control module reads the distance information from the data storage module during the process from the position information received by the data receiving module being the third position information to the position information received by the data receiving module being the fourth position information, the third position information being the position information corresponding to the workpiece to be processed when it is at the starting point of processing, and the fourth position information being the position information corresponding to the workpiece to be processed when it is at the ending point of processing.

[0010] Exemplarily, the reading control module determines whether the workpiece to be processed is at the target position point according to the position information and the distance information in the following manner: judging whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece according to the change range of the distance information; in the case where the judgment result is yes, determining the target position information corresponding to when the workpiece is at the target position point based on the position information corresponding to the currently received distance information, and the target position information is the third position information or the fourth position information; when the position information received by the data receiving module is the target position information, determining that the workpiece to be processed is at the target position point.

[0011] Exemplarily, the distance information is measured by a distance measuring mechanism of the processing device, and the second position information X 2 satisfies the following formula: X 2 = X 1 + δx 1 - δx 2 , where δx 1 represents the distance between the distance measuring mechanism and the processing head in the first direction, and δx 2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time.

[0012] Exemplarily, the system further includes: a second data processing module, connected to the reading control module, for performing digital-analog fitting according to the read distance information received from the reading control module to obtain a fitting signal; an output module, connected to the second data processing module, for generating a corresponding real-time control signal according to the fitting signal and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move to a focal position matching the read distance information in the second direction.

[0013] Exemplarily, the system further includes: a first interaction module, connected to the output module, for obtaining first indication information from the host computer, and the output module is further configured to generate a fixed control signal based on the first indication information before the workpiece to be processed reaches the processing start point in the effective processing area and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to remain at a fixed position in the second direction.

[0014] Exemplarily, the reading control module is further configured to control the data storage module to store the distance information during the process of the workpiece to be processed reaching the collection start point and the collection end point in the effective collection area. The system further includes: a judgment module, connected to the data receiving module and the reading control module, for judging whether the workpiece to be processed is at the collection start point or the collection end point according to the position information; a second interaction module, connected to the judgment module, for obtaining second indication information from the host computer, and the judgment module determines the position information corresponding to the collection start point and the collection end point respectively based on the second indication information.

[0015] According to a second aspect of the present invention, there is provided a control method for a processing device, including: receiving in real time the position information of a workpiece to be processed and the distance information corresponding to the position information, where the position information is used to represent the position of the workpiece to be processed in a first direction when the workpiece to be processed moves relative to the processing head of the processing device in the first direction, and the distance information is used to represent the distance between the processing head and the workpiece to be processed in a second direction when the workpiece to be processed moves relative to the processing head in the first direction. The position information includes the position information corresponding one by one to each different position point where the workpiece to be processed is located, and the distance information includes the distance information corresponding one by one to each different position point where the workpiece to be processed is located; storing the distance information; calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculating the response time according to the change rate, where the response time is the response time of a focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction; at least according to the response time and the moving speed when the workpiece to be processed and the processing head move relative to each other, correct the first position information X 1 to determine the second position information X 2 ; when the position information is the second position information X 2 , read the distance information corresponding to the first position information X 1 , and based on the read distance information, control the focusing mechanism to drive the processing head to move to a focal position matching the read distance information in the second direction, where the first position information X 1 is the position information corresponding to multiple position points.

[0016] Exemplarily, the method further includes: performing a first downsampling on the distance information; performing a second downsampling on the distance information after the first downsampling; where storing the distance information includes: storing the distance information after the first downsampling, and calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed includes: calculating the change rate based on the distance information corresponding to multiple position points in the distance information after the second downsampling.

[0017] Exemplarily, the multiple position points are the position points in the effective processing area of the workpiece to be processed. Calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed includes: determining a preset number of consecutive position points in the effective processing area as the multiple position points; calculating the change rate corresponding to the multiple position points according to the distance information and the respective information acquisition times corresponding to the starting position point and the ending position point among the multiple position points, where the information acquisition time corresponding to any position point is the time when the distance information corresponding to this position point is acquired.

[0018] Exemplarily, calculating the response time according to the change rate includes: calculating the response time according to the change rate and a preset relationship function, where the preset relationship function is the relationship function between the change rate and the response time.

[0019] Exemplarily, the method further includes: judging whether the workpiece to be processed is at a target position point according to the position information and the distance information, where the target position point is a processing start point or a processing end point in an effective processing area on the workpiece to be processed. Among them, the operation of reading the distance information corresponding to the first position information X 1 is performed during the process from the received position information being the third position information to the received position information being the fourth position information. The third position information is the position information corresponding to when the workpiece to be processed is at the processing start point, and the fourth position information is the position information corresponding to when the workpiece to be processed is at the processing end point.

[0020] Exemplarily, judging whether the workpiece to be processed is at a target position point according to the position information and the distance information includes: judging whether the position on the workpiece to be processed corresponding to the currently received distance information is an edge of the workpiece to be processed according to the change range of the distance information; in the case where the judgment result is yes, based on the position information corresponding to the currently received distance information, determining the target position information corresponding to when the workpiece to be processed is at the target position point, where the target position information is the third position information or the fourth position information; when the received position information is the target position information, determining that the workpiece to be processed is at the target position point.

[0021] Exemplarily, the distance information is measured by a distance measuring mechanism of the processing device, and the second position information X 2 satisfies the following formula: X 2 =X 1 +δx 1 -δx 2 where δx 1 represents the distance between the distance measuring mechanism and the processing head in the first direction, and δx 2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time.

[0022] According to the third aspect of the present invention, there is also provided an electronic device, including a processor and a memory, where a computer program is stored in the memory, and the processor executes the computer program to implement the above control method for the processing device.

[0023] According to the fourth aspect of the present invention, there is also provided a storage medium storing computer programs / instructions, and when the computer programs / instructions are executed by a processor, the above control method for the processing device is implemented.

[0024] A control system and method for a processing device, an electronic device, and a storage medium according to an embodiment of the present invention determine the response time of a focusing mechanism based on the change rate of distance information corresponding to multiple position points, and correct the first position information corresponding to the multiple position points at least according to the response time of the focusing mechanism to obtain second position information. Subsequently, when the workpiece to be processed moves to the corrected position, the following control of the focusing mechanism can be performed based on the distance information corresponding to the position information before correction. In this way, the moving distance of the focusing mechanism within the response time can be compensated in real time and accurately, improving the followability of the focusing mechanism, and thus contributing to improving the cutting accuracy of the processing device.

[0025] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other objects, features and advantages of the present invention more obvious and understandable, the following specific embodiments of the present invention are specifically exemplified. Brief Description of the Drawings

[0026] By describing the embodiments of the present invention in more detail in conjunction with the drawings, the above and other objects, features and advantages of the present invention will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings, the same reference numerals generally represent the same components or steps.

[0027] Figure 1 Shows a schematic diagram of a processing device according to an embodiment of the present invention;

[0028] Figure 2 Shows a schematic block diagram of a control system for a processing device according to an embodiment of the present invention;

[0029] Figure 3 Shows a schematic diagram of a wafer sheet including a wafer according to an embodiment of the present invention;

[0030] Figure 4 Shows an exemplary structural schematic diagram of a control system according to an embodiment of the present invention;

[0031] Figure 5 Shows a schematic flowchart of a control method for a processing device according to an embodiment of the present invention; and

[0032] Figure 6 Shows a schematic block diagram of an electronic device according to an embodiment of the present invention. Detailed Embodiments

[0033] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments of the present invention. It should be understood that the present invention is not limited by the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] For ease of understanding, an exemplary structure of the processing device will be introduced first below. Figure 1 A schematic diagram of a processing device 100 according to an embodiment of the present invention is shown. As Figure 1 shown, the processing device 100 may include a stage assembly 110, a ranging mechanism 120, a processing head 130, and a focusing mechanism 140. In addition, Figure 1 a workpiece 150 to be processed is also shown. The workpiece to be processed may be any article such as ceramics, wafers, etc. For ease of description and understanding, the workpiece to be processed will be mainly described as a wafer below. Exemplarily and non-restrictively, the ranging mechanism 120 may be a laser rangefinder, and the focusing mechanism 140 may be a piezoelectric ceramic motor. The workpiece 150 and the processing head 130 may move relative to each other in a first direction, and the first direction may be the Figure 1 X-axis direction as shown, and the X-axis direction is shown as a horizontal direction in Figure 1 . It should be noted that Figure 1 the position of the X-axis shown is only an example, and its actual position may move up and down relative to the Figure 1 position shown. The focusing mechanism 140 is connected to the processing head 130, and the focusing mechanism 140 can drive the processing head 130 to move together in a second direction. The second direction may be the Figure 1 vertical direction perpendicular to the X-axis direction in. The ranging mechanism 120 and the processing head 130 / focusing mechanism 140 are spaced apart by a certain distance in the X-axis direction.

[0035] When the workpiece 150 to be processed and the processing head 130 move relative to each other in the first direction, the position in the first direction can be measured by a position measuring mechanism. In one embodiment, the relative movement between the workpiece 150 to be processed and the processing head 130 can be that the position of the processing head 130 remains fixed while the workpiece 150 moves in the first direction. In this case, exemplarily, a position measuring mechanism (such as a grating scale) can be used to measure the moving distance of the workpiece 150 in the first direction, which is used to represent the position of the workpiece 150 in the first direction. In another embodiment, the relative movement between the workpiece 150 to be processed and the processing head 130 can be that the position of the workpiece 150 remains fixed while the processing head 130 moves in the first direction. In this case, exemplarily, a position measuring mechanism (such as a grating scale) can be used to measure the moving distance of the processing head 130 in the first direction, which is used to represent the position of the workpiece 150 in the first direction. In yet another embodiment, the relative movement between the workpiece 150 to be processed and the processing head 130 can be that the workpiece 150 and the processing head 130 move together in the first direction. In this case, exemplarily, a position measuring mechanism (such as a grating scale) can be used to measure the distance between the processing head 130 and the workpiece 150 in the first direction, which is used to represent the position of the workpiece 150 in the first direction. In this article, the solution where the position of the processing head 130 remains fixed while the workpiece 150 moves in the first direction is mainly taken as an example for illustration.

[0036] Figure 1 The shown stage assembly 110 may include a processing platform for carrying the workpiece 150 to be processed, a driving assembly for driving the processing platform (i.e., driving the workpiece 150) to move in the X-axis direction, and a position measuring mechanism for measuring the moving distance when the processing platform (i.e., measuring the workpiece 150) moves in the X-axis direction. The above driving assembly may be a linear motor, such as Figure 1The X-axis linear motor shown. The position measurement mechanism can be a grating scale. Exemplarily, the zero point of the grating scale measurement can be preset. The grating scale is used to measure the distance of the processing platform from the origin, that is, to measure the distance of the workpiece 150 to be processed from the origin. During processing, the driving component can drive the processing platform to move along the X-axis direction. During this process, the processing head 130 processes each processing point in the X-axis direction. The positions of the respective processing points on the X-axis can be determined by the grating scale. When the workpiece to be processed is a wafer, the processing points can be the processing points on any cutting track parallel to the X-axis direction of the wafer. The height of each processing point can be determined by the distance information collected by the distance measurement mechanism 120. The distance information collected by the distance measurement mechanism 120 can be transmitted to the control system for the processing device described herein (which can be referred to as an automatic following system). The control system for the processing device can determine the corresponding control signal based on the distance information and output the control signal to the focusing mechanism 140, thereby controlling the focusing mechanism 140 to move up and down to drive the processing head 130 to move up and down to a focal position matching the distance information, that is, a processing position matching the height of each processing point.

[0037] It can be understood that although in the example of using a laser rangefinder as the distance measurement mechanism, the laser rangefinder measures the distance between the workpiece to be processed and the laser rangefinder in the second direction, this distance can be used to represent the distance between the workpiece to be processed and the processing head in the second direction. For example, the laser emitting end and the receiving end of the laser rangefinder can be set at the same height as the end of the processing head facing the workpiece to be processed, so that the distance between the laser emitting end and the receiving end of the laser rangefinder and the workpiece to be processed in the second direction (the first distance) and the distance between the processing head and the workpiece to be processed in the second direction (the second distance) are kept consistent. Of course, even if the first distance and the second distance are not the same, there is still a fixed gap between the two. In this case, the distance information collected by the laser rangefinder can still be used to represent the distance between the processing head and the workpiece to be processed in the second direction. It's just that when subsequently controlling the processing head to move to a focal position matching the distance information in the second direction based on the read distance information, the focal position can be appropriately adjusted up or down according to the preset gap between the first distance and the second distance. Of course, the distance measurement mechanism can also be designed to directly measure the distance between the workpiece to be processed and the processing head in the second direction, for example, implemented based on the principle similar to that of a grating scale.

[0038] From the above description, it can be understood that the position information measured by the position measurement mechanism can include position information corresponding one by one to the respective different position points where the workpiece to be processed is located, and the distance information can include distance information corresponding one by one to the respective different position points where the workpiece to be processed is located. Among them, the position points can be understood as the physical positions of the workpiece to be processed. For example, when the workpiece to be processed is within the effective processing area, the respective position points can be the above-mentioned processing points.

[0039] In one embodiment, the processing device 100 may further include a control system for the processing device described herein ( Figure 1 not shown in the figure). In another embodiment, the control system for the processing device may be independent of the processing device 100. For example, it may be communicatively connected to the ranging mechanism 120 and the position measurement mechanism in the processing device 100, receive the distance information collected by the ranging mechanism 120, and receive the position information collected by the position measurement mechanism, and then perform following control based on the distance information and the position information.

[0040] To at least partially solve the above problems, an embodiment of the present invention provides a control system for a processing device. Figure 2 FIG. shows a schematic block diagram of a control system 200 for a processing device according to an embodiment of the present invention. Exemplarily and non - restrictively, the control system 200 may be implemented using a field - programmable gate array (FPGA). As Figure 2 shown, the control system 200 may include a data receiving module 210, a data storage module 220, a first data processing module 230, and a reading control module 240.

[0041] The data receiving module 210 may be configured to receive in real time the position information of the workpiece to be processed and the distance information corresponding to the position information. The position information is used to represent the position of the workpiece to be processed in the first direction when it moves relative to the processing head of the processing device in the first direction, and the distance information is used to represent the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction. The position information includes position information corresponding one - to - one to each different position point where the workpiece to be processed is located, and the distance information includes distance information corresponding one - to - one to each different position point where the workpiece to be processed is located.

[0042] The data storage module 220 may be configured to store the distance information.

[0043] The first data processing module 230 may be configured to calculate the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculate the response time according to the change rate. The response time is the response time of the focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction.

[0044] The reading control module 240, connected to the first data processing module 230, the data storage module 220, and the data receiving module 210, is configured to at least correct the first position information X 1 based on the response time output by the first data processing module and the moving speed when the workpiece to be processed moves relative to the processing head, to determine the second position information X 2 , and is configured to when the position information received by the data receiving module is the second position information X 2When, read from the data storage module the distance information corresponding to the first position information X 1 to control, based on the read distance information, the focusing mechanism to drive the processing head to move in the second direction to a focal position matching the read distance information, wherein the first position information X 1 is position information corresponding to multiple position points.

[0045] The exemplary structure and working principle of the control system 200 are further described below.

[0046] Exemplarily and non - restrictively, the data receiving module 210 may include a first data receiving module and a second data receiving module. The first data receiving module may be communicatively connected to the distance measuring mechanism 120 for receiving distance information from the distance measuring mechanism 120. The second data receiving module may be communicatively connected to the position measuring mechanism for receiving position information from the position measuring mechanism. Exemplarily, the first data receiving module may be an analog - to - digital conversion (ADC) module. When the distance measuring mechanism 120 is a laser rangefinder, the distance information collected by it is an analog signal. Through the ADC module, the distance information can be converted from an analog signal to a digital signal. The sampling frequency of the ADC module can be set as needed, for example, 20 megabits per second (Mbps). When the position measuring mechanism is a grating scale, the position information output by the grating scale is a digital pulse signal. The output frequency of the grating scale can be, for example, 500 kilohertz (KHz). Exemplarily and non - restrictively, the control system 200 may further include at least one down - sampling module to perform at least one down - sampling on the distance information (e.g., digitized distance information) output by the data receiving module 210. Down - sampling may be, for example, to extract data at intervals of a preset number of data points (each data point can be understood as the distance information corresponding to a position point) from the received data. The first data receiving module collects a large amount of data and does not need to process all the data. Through down - sampling, the workload of subsequent modules can be reduced. In one example, the control system 200 may further include a first down - sampling module, connected to the data receiving module 210 (specifically, the above - mentioned first data receiving module), for performing down - sampling on the distance information output by the data receiving module, for example, down - sampling the 20 - Mbps distance information to 500 Kbps. Exemplarily and non - restrictively, the first down - sampling module may also filter the distance information, such as moving average filtering. Through filtering, interference can be removed, making the output distance signal (i.e., distance information) smoother. Filtering can be performed before or after down - sampling.

[0047] For example, if the workpiece to be processed is a wafer, the data receiving module 210 can receive the position information of the wafer and the distance information corresponding to the position information in real time. The position information of the wafer can be obtained according to the measured value of the grating scale at the current moment. The distance information corresponding to the position information can be obtained according to the measured value of the distance measuring mechanism at the same moment. As Figure 1 shown, the distance measuring mechanism measures the distance between it and the wafer surface, which is represented by h for example.

[0048] The data storage module 220 can be used to store the obtained distance information. The data storage module 220 can be implemented by using any memory, such as Random Access Memory (RAM), Read Only Memory (ROM), FLASH memory, etc. Optionally, the data storage module 220 can further store the obtained position information. When storing the position information and the distance information, the data storage module 220 can store them in a one-to-one correspondence manner. For example, the position information and the distance information corresponding to each position point are associated and stored. In one example, the data storage module 220 can store all the distance information output by the data receiving module 210 or output by at least one downsampling module connected to the data receiving module 210 during the entire working period of the distance measuring mechanism. In another example, the data storage module 220 can only store the distance information output by the data receiving module 210 or output by at least one downsampling module connected to the data receiving module 210 during a partial working period of the distance measuring mechanism. For example, the data storage module 220 can only store the distance information output by the data receiving module 210 or output by at least one downsampling module connected to the data receiving module 210 when the workpiece to be processed is within the effective acquisition area. The effective acquisition area can be preset. For example, the user can input the position information corresponding to the acquisition start point and the acquisition end point of the effective acquisition area in the control system 200. When the position information collected by the grating scale, that is, the position information received by the data receiving module 210, is the position information corresponding to the acquisition start point, the data storage module 220 can be controlled to start storing the current distance information, or start storing the current distance information and the position information. In addition, when the position information collected by the grating scale, that is, the position information received by the data receiving module 210, is the position information corresponding to the acquisition end point, the data storage module 220 can be controlled to stop storing the distance information, or stop storing the distance information and the position information. Exemplarily rather than restrictively, the operation of controlling the data storage module 220 to store the distance information can be executed by the read control module 240.

[0049] Optionally, similar to the data storage module 220, the data receiving module 210 can also choose to receive the distance information measured by the ranging mechanism (e.g., perform ADC sampling on the distance information) during all or part of the working period of the ranging mechanism. The working mode of the data receiving module 210 can be understood with reference to the above description of the data storage module 220, and will not be elaborated here.

[0050] The first data processing module can calculate the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculate the response time according to the change rate. The multiple position points are consecutive position points, and the number thereof can be two or more than two. In one example, any two consecutive position points can be selected from the position points corresponding to the position information output by the data receiving module 210 as the multiple position points for calculating the change rate. Of course, the corresponding change rate can be calculated for each two consecutive position points. In another example, more than two consecutive position points can be selected from the position points corresponding to the position information output by the data receiving module 210 as the multiple position points for calculating the change rate. In this case, when calculating the change rate of the multiple position points, optionally, the first and last position points can be selected from the multiple position points, and the change rate of these two position points can be calculated as the change rate of the multiple position points. For example, for two consecutive position points m and n, the change rate k of the distance information corresponding to these two position points can be calculated. 1 Based on the calculated change rate k 1 the response time t can be calculated.

[0051] When performing follow-up control, there is a certain response time from sending a control signal to the focusing mechanism 240 until the focusing mechanism 240 responds. The response time of the focusing mechanism 240 is related to the step of the input signal and is basically independent of the amplitude of the input signal. Here, a piezoelectric ceramic motor is taken as an example for illustration. When the input signal is a sine wave (sin) waveform, the response time of the piezoelectric ceramic motor is about 2.7 ms; when the input signal is a pulse wave (pulse) waveform, the response time of the piezoelectric ceramic motor is about 5 ms. Table 1 shows the test results of testing the response time of the piezoelectric ceramic motor under different input signals. As shown in Table 1, when the input signal of the piezoelectric ceramic motor is a 500 mv, 30 Hz pulse signal, the rising edge delay of the feedback output signal of the piezoelectric ceramic motor is about 5 ms, and the response time between the input signal and the output signal is about 5 ms. Modifying the amplitude value of the pulse signal, the rising edge time and the response time basically do not change, about 5 ms. This shows that the response time of the piezoelectric ceramic motor is basically independent of the amplitude of the input signal. Changing the input signal from pulse to sin, the response time is about 2.7 ms. Combining the tests, it can be seen that the response time of the piezoelectric ceramic motor is related to the smoothness of the input signal and is independent of the signal amplitude. Exemplarily, an external signal (for example, a signal generated by a signal generator) can be used as the input signal to be input into the focusing mechanism 140 for testing. By adjusting the slope of the input signal, the relationship function between the slope k of the input signal and the response time y is fitted, such as y = f(k). In this way, after determining the change rates at multiple position points, the corresponding response time can be determined based on the above relationship function. 1 The relationship function between and the response time y, such as y = f(k 1 ). In this way, after determining the change rates at multiple position points, the corresponding response time can be determined based on the above relationship function.

[0052] Table 1. Test results of testing the response time of the piezoelectric ceramic motor under different input signals

[0053]

[0054] The reading control module 240 can be connected to the data receiving module 210, the data storage module 220, and the first data processing module 230. The reading control module 240 can determine whether the workpiece to be processed is within the effective processing area at least based on the current position information. When the workpiece to be processed is within the effective processing area, starting from the processing start point of the effective processing area, it reads the distance information corresponding to each position point within the effective processing area from the data storage module 220, so as to control the processing head to move to the focal position matching the distance information in the second direction. In other words, the distance information read by the reading control module 240 is the distance information corresponding to each position point within the effective processing area, including the processing start point and the processing end point of the effective processing area. In one example, for any one or more position points, when the position information currently received by the data receiving module 210 is the original position information X 1 corresponding to them, the reading control module 240 can directly read the distance information h 1 corresponding to the original position information X 1 from the data storage module 220, and control the processing head to move to the matching focal position according to the distance information h 1 . In another example, for any one or more position points, the original position information X 1 can be corrected (or error compensated) to determine the new position information X 2 . When the position information currently received by the data receiving module 210 is the position information X 2 , the reading control module 240 can read the distance information h 1 corresponding to the original position information X 1 from the data storage module 220, and control the processing head to move to the matching focal position according to the distance information h 1 . The correction can be carried out based on multiple aspects, such as the response time of the focusing mechanism. In addition, the correction can further be based on the distance between the processing head and the ranging mechanism, and these embodiments will be described below. The operation of controlling the processing head to move to the focal position matching the distance information in the second direction based on the read distance information can be entirely executed by the reading control module 240, or can be executed by the reading control module 240 in cooperation with other subsequent modules connected to the reading control module 240.

[0055] Exemplarily, the reading control module 240 can calculate the relative movement distance δx of the workpiece in the first direction relative to the processing head within the response time of the focusing mechanism according to the response time t output by the first data processing module 230 and the relative movement speed (referring to the relative movement speed between the two) v when the workpiece to be processed and the processing head move relatively 2 . Subsequently, it can be at least based on δx2 Modify the first position information X 1 to determine the second position information X 2 . For example, X can be determined according to the following formula 2 : X 2 = X 1 -δx 2 .

[0056] Exemplarily, the moving speed v when the workpiece to be processed and the processing head move relative to each other can be configured by the user. For example, it can be in the range of [600 mm / s, 1000 mm / s]. The first position information is the position information corresponding to the multiple position points described above. It should be noted that the above first position information X 1 is the position information corresponding one by one to the multiple position points, that is, for each position point among the multiple position points, it corresponds to its own first position information X 1 (i.e., the original unmodified position information). And, for each position point among at least one position point, the first position information X corresponding to it 1 can be modified to obtain the corresponding second position information X 2 (i.e., the modified new position information).

[0057] The reading control module 240 can also be used to, when the position information received by the data receiving module 210 is the second position information X 2 , read the distance information corresponding to the first position information X from the data storage module 220 1 . Based on the read distance information, the focusing mechanism can be controlled to drive the processing head to move in the second direction (vertical direction) to the focal position matching the read distance information. Through actual measurement, adopting the above solution, the X-axis following accuracy can be improved from the millimeter level to the micron level, which can effectively improve the system performance.

[0058] According to the above technical solution, determine the response time of the focusing mechanism according to the change rate of the distance information corresponding to the multiple position points, and at least correct the first position information corresponding to the multiple position points according to the response time of the focusing mechanism to obtain the second position information. Subsequently, when the workpiece to be processed moves to the corrected position, the following control of the focusing mechanism can be performed based on the distance information corresponding to the position information before correction. This method can compensate in real time and accurately for the moving distance of the focusing mechanism during the response time, improve the following performance of the focusing mechanism, and thus contribute to improving the cutting accuracy of the processing device.

[0059] Exemplarily, the system further includes: a first downsampling module, connected to the data receiving module and the data storage module, for performing a first downsampling on the distance information; a second downsampling module, connected to the first downsampling module and the first data processing module, for performing a second downsampling on the distance information that has undergone the first downsampling; wherein, the data storage module is used to store the distance information that has undergone the first downsampling, and the first data processing module is used to calculate the change rate based on the distance information corresponding to multiple position points in the distance information that has undergone the second downsampling.

[0060] As described above, the control system 200 may include at least one downsampling module to perform at least one downsampling on the distance information (such as digitized distance information) output by the data receiving module 210. In one embodiment, the system 200 may include a first downsampling module and a second downsampling module. The first downsampling module may be connected to the data receiving module 210 and the data storage module 220. The first downsampling module may perform a first downsampling on the distance information output by the data receiving module 210, and the data storage module 220 stores the distance information obtained after the first downsampling. The second downsampling module may be connected to the first downsampling module and the first data processing module 230. The second downsampling module may perform a second downsampling on the distance information obtained after the first downsampling. The first data processing module 230 may calculate the change rate based on the distance information corresponding to multiple position points in the distance information obtained after the second downsampling.

[0061] Downsampling can reduce the sampling rate. For example, assume that the data rate sampled by the data receiving module 210 is 20 Mbps. After the first downsampling, the data rate drops to 500 Kbps, which is consistent with the output rate of the grating scale. A data rate of 20 Mbps is relatively high for implementing follow-up control, and follow-up control generally does not require such a large amount of data. Therefore, performing the first downsampling helps to reduce the storage space. When calculating the change rate of the distance information, a rate of 500 Kbps is still very high, and it is not necessary to calculate at each position point. Therefore, a second downsampling can be performed, for example, downsampling to 200 bps.

[0062] According to the above technical solution, after the first downsampling and the second downsampling, the amount of data stored in the data storage module and the amount of data processed by the first data processing module can be effectively reduced. Furthermore, the storage space can be effectively saved, the system calculation amount can be reduced, and the operation efficiency of the system can be improved.

[0063] Exemplarily, the multiple position points are the position points when the workpiece to be processed is within the effective processing area. The first data processing module calculates the change rate of the distance information corresponding to the multiple position points of the workpiece to be processed in the following manner: determining a preset number of consecutive position points in the effective processing area as the multiple position points; calculating the change rate corresponding to the multiple position points according to the distance information and the respective information acquisition times corresponding to the starting position point and the ending position point among the multiple position points, wherein the information acquisition time corresponding to any position point is the time when the distance information corresponding to that position point is acquired.

[0064] For the convenience of subsequent understanding, the "effective acquisition area" and "effective processing area" described in this article will be uniformly introduced below by taking a wafer as an example.

[0065] Figure 3 The schematic diagram of a wafer (Wafer) including a wafer according to an embodiment of the present invention is shown. Generally, on the Wafer, the wafer is fixed on a thin film, and a metal iron frame is fixed on the outer periphery of the thin film. As Figure 3 shown, the edges where points B and E are located are the iron frame edges on the Wafer. The edges where points C and D are located are the wafer edges, and the circular area surrounded by the wafer edges is the wafer area. During the movement of the Wafer along the X-axis, the ranging mechanism will align with each point on the Wafer one by one. For example, when the wafer edge passes through the ranging mechanism (or vice versa, the ranging mechanism passes through the wafer edge), the distance information measured by the ranging mechanism will have a jump. Therefore, based on this jump, it can be determined whether the edge position of the wafer is detected. However, generally speaking, when point B or E (the iron frame edge) passes through the ranging mechanism, the signal output of the ranging mechanism will also have a jump, but this is not the real wafer edge. If this point is misidentified as the wafer edge, problems are likely to occur during processing. Therefore, in the embodiment of the present invention, the area between B and E is defined as the "effective acquisition area on the wafer", and this area does not include the edges where points B and E are located. The effective acquisition area on the wafer can be a slightly larger area than the wafer area. The starting point of the effective acquisition area on the wafer can be a point between B and C, and the ending point can be a point between D and E.

[0066] It should be noted that although Figure 3Various regions or position points are described by taking points on the wafer as examples. However, it can be understood that these regions and position points can all be mapped to the regions or position points within the movement range when the wafer and the processing head move relative to each other. That is, within this movement range, there is an actual movement region corresponding to the above-mentioned "effective acquisition region on the wafer", which is referred to as the "effective acquisition region" in this article. For example, when the wafer reaches the acquisition start point of the effective acquisition region, the distance measuring mechanism can be aligned with the start point of the effective acquisition region on the wafer. That is, the distance information collected by the distance measuring mechanism is the distance information at the start point of the effective acquisition region on the wafer. When the wafer reaches the acquisition end point of the effective acquisition region, the distance measuring mechanism can be aligned with the end point of the effective acquisition region on the wafer. That is, the distance information collected by the distance measuring mechanism is the distance information at the end point of the effective acquisition region on the wafer.

[0067] Both the acquisition start point and the acquisition end point of the effective acquisition region have corresponding position information, that is, corresponding grating scale readings. It is possible to determine whether the wafer enters this effective acquisition region based on the position information measured by the grating scale. Optionally, the data receiving module 210 can only receive (i.e., sample) the distance information corresponding to when the wafer enters the effective acquisition region, and / or the data storage module 220 can only store the distance information corresponding to when the wafer enters the effective acquisition region. In this way, a signal jump will only occur in the distance information stored in the data storage module 220 when the distance measuring mechanism reaches point C or point D (the wafer edge). Exemplarily and not restrictively, the position information corresponding to the effective acquisition region on the X-axis can be preset by the user through the interaction module and can optionally be stored in the second data storage module. The second data storage module can be the data storage module 220 (which can be referred to as the first data storage module), or it can be a storage module independent of the data storage module 220.

[0068] In one example, when the wafer reaches the acquisition start point of the effective acquisition region, the data receiving module 210 can start sampling the distance information and sequentially store the sampled distance information into the data storage module 220 after at least one downsampling. However, the control system 200 does not start implementing the follow-up control from the acquisition start point of the effective acquisition region. The follow-up control is an operation of outputting a real-time control signal to the focusing mechanism to control the focusing mechanism (i.e., control the processing head) to move up and down following the distance information. The control system 200 can implement the follow-up control starting from when the wafer enters the effective processing region, and the effective processing region can also be referred to as the follow-up region. Continue to refer to Figure 3, in one embodiment, the area enclosed by the edges where points C and D are located (i.e., the wafer area) can be regarded as the effective processing area on the wafer. In another embodiment, an area located inside the wafer area, i.e., a smaller area than the wafer area, can be used as the effective processing area on the wafer. In theory, the follow-up control (i.e., starting processing) can be implemented when the ranging mechanism aligns with one side of the wafer edge, and the follow-up ends (i.e., ending processing) when it aligns with the other side of the wafer edge. However, since there will be signal jumps at the wafer edge, the real-time control signal generated based on the distance information will also have jumps, resulting in inaccurate following. Therefore, after the ranging mechanism aligns with one side of the wafer edge, it can continue to move a certain distance, such as the first correction distance i 1 , then start following. Only at this time, the position on the workpiece to be processed is the starting point of the effective processing area, and it can also be considered that the starting point of processing is the starting position of following. Conversely, there is still a certain distance, such as the second correction distance i 2 , before the ranging mechanism aligns with the other side of the wafer edge, and then the follow-up ends. Only at this time, the position on the workpiece to be processed is the ending point of the effective processing area, and the ending point of processing is the ending position of following. That is to say, the follow-up can start late and end early to avoid the signal jump problem caused by the wafer edge.

[0069] Similar to the effective acquisition area on the wafer, within the moving range when the wafer and the processing head move relative to each other, there is an actual moving area corresponding to the above-mentioned "effective processing area on the wafer", which is referred to as the "effective processing area" in this article. For example, when the wafer reaches the starting point of the effective processing area, the ranging mechanism can align with the starting point of the effective processing area on the wafer, that is, the distance information collected by the ranging mechanism is the distance information at the starting point of the effective processing area on the wafer. When the wafer reaches the ending point of the effective processing area, the ranging mechanism can align with the ending point of the effective processing area on the wafer, that is, the distance information collected by the ranging mechanism is the distance information at the ending point of the effective processing area on the wafer.

[0070] Exemplarily, the first data processing module 230 can calculate the change rate of the distance information corresponding to multiple position points in the following way. Optionally, a preset number can be set by the user in advance. The preset number can be any integer greater than or equal to 2. For example, the preset number can be 4. For example, 4 consecutive position points a, b, c, d are obtained. The first and last two position points among these 4 position points can be selected, that is, the starting position point a and the ending position point b. Based on the distance information h 1 , h 4 corresponding to the starting position point a and the ending position point b respectively, and the information acquisition time t 1 , t 4 respectively, through the formula k 1 = (h4 -h 1 ) / (t 4 -t 1 ) Calculate the change rate k 1 . Among them, the information acquisition time corresponding to any position point of a, b, c, and d can represent the time for acquiring the distance information corresponding to this position point. The change rate k obtained based on the starting position point a and the ending position point b 1 can be used to calculate the response time. When correcting the first position information X corresponding to each of the four position points a, b, c, and d 1 , the same response time obtained by the above calculation is used for correction.

[0071] In the above embodiment of performing two downsamplings, the data points in the distance information stored in the data storage module 220 are denser than the data points used by the first data processing module 230 to calculate the change rate. Assume that the distance information stored in the data storage module 220 includes the distance information of the following position points: D0 / D1 / D2 / D3 / D4 / D5 / D6 / D7 / D8…, after secondary downsampling, the sampling interval is 4, then the position points after secondary downsampling are: D0 / D4 / D8 / D12 / D16…. The distance information of the position points D0 and D4 after secondary sampling can be obtained first to calculate the slope k 1 . Using the slope k 1 to obtain the response times of the original position points D0 / D1 / D2 / D3 / D4. After determining the response time, the reading control module 240 corrects the position information of D0 / D1 / D2 / D3 / D4 accordingly. Similarly, the slope k between D4 and D8 after secondary sampling can be calculated subsequently 1 , and the position information of D4 / D5 / D6 / D7 / D8 is corrected accordingly.

[0072] It can be understood that when the preset number is 2, the starting position point and the ending position point are all the multiple position points.

[0073] According to the above technical solution, for multiple position points, the head and tail position points are selected to calculate the change rate. This solution has a simple algorithm and allows the calculation amount to be reduced by setting an appropriate preset number.

[0074] Exemplarily, the first data processing module calculates the response time according to the change rate in the following manner: According to the change rate and a preset relationship function, calculate the response time, where the preset relationship function is the relationship function between the change rate and the response time.

[0075] The acquisition method of the above-mentioned preset relationship function y = f(k 1 ) has been described above and will not be elaborated here.

[0076] According to the above technical solution, the response time is calculated based on a preset relationship function, so that it can be ensured that the obtained response time can better meet the requirements of the current application scenario, and the accuracy of the determined response time can be guaranteed.

[0077] Exemplarily, the reading control module is further configured to determine whether the workpiece to be processed is at a target position point according to the position information and the distance information, where the target position point is a starting point or an ending point of processing in the effective processing area of the workpiece to be processed. Among them, the reading control module reads the distance information from the data storage module during the process that the position information received by the data receiving module changes from the third position information to the fourth position information received by the data receiving module. The third position information is the position information corresponding to the workpiece to be processed when it is at the starting point of processing, and the fourth position information is the position information corresponding to the workpiece to be processed when it is at the ending point of processing.

[0078] Referring to the above description, the meaning of the effective processing area can be understood and will not be elaborated here. In this embodiment, the reading control module 240 determines whether the workpiece to be processed reaches the starting point or the ending point of processing on the effective processing area according to the position information and the distance information. This solution can realize the automatic and real-time determination of the effective processing area. Of course, this solution is only an example and not a limitation to the present invention. For example, the user can also input the position information corresponding to the starting point and the ending point of processing in the effective processing area through an interaction module such as this. In this way, when the position information received by the data receiving module 210 is equal to the position information corresponding to the starting point or the ending point of processing, it can be directly determined that the workpiece to be processed reaches the starting point or the ending point of processing.

[0079] Exemplarily, the reading control module determines whether the workpiece to be processed is at the target position point according to the position information and the distance information in the following manner: judging whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece to be processed according to the change range of the distance information; in the case where the judgment result is yes, determining the target position information corresponding to the workpiece to be processed when it is at the target position point based on the position information corresponding to the currently received distance information, where the target position information is the third position information or the fourth position information; and when the position information received by the data receiving module is the target position information, determining that the workpiece to be processed is at the target position point.

[0080] In one embodiment, it is possible to determine whether there is a signal jump, i.e., a mutation, based on the distance information measured by the ranging mechanism, and then it is possible to determine whether the position on the wafer corresponding to the currently received distance information is the edge of the wafer. In the embodiments of the present invention, a situation where the change amplitude of the distance information is relatively obvious is regarded as the existence of a signal jump. For example, when the change amplitude of the distance information exceeds the change amplitude threshold, it can be determined that there is a signal jump, which means that the ranging mechanism has aligned with the wafer edge, or that the ranging mechanism has reached above the wafer edge. The change amplitude threshold can be set to any appropriate size according to needs. For example, the change amplitude threshold can be any value greater than or equal to the product thickness set according to the product thickness of the workpiece to be processed. In one embodiment, the user can preset the change amplitude threshold through the interaction module and can optionally store it in the third data storage module. The third data storage module can be the above-mentioned second data storage module, data storage module 220, or the storage module included in the reading control module 240, or can be a storage module independent of the second data storage module, data storage module 220, and reading control module 240.

[0081] The change amplitude of the distance information can be calculated in units of data point groups in the distance information, that is, the change amplitude within each data point group is calculated. Each data point group can include two or more data points, that is, the distance information corresponding to two or more position points. Two adjacent data point groups before and after can share the data points at the boundary, or can not share any data points. Exemplarily, for each data point group, the difference between the first and last data points within the data point group can be calculated as the change amplitude of the data point group. For example, when the change amplitude between the current data point and the previous data point in the distance information is greater than the change amplitude threshold, it can be determined that the position on the wafer corresponding to the ranging mechanism when collecting the current data point is the edge of the wafer. Subsequently, based on the position information corresponding to the current data point, the target position information corresponding to the wafer when it is at the target position point can be determined.

[0082] In one embodiment, when the position on the workpiece to be processed corresponding to the currently received distance information is the edge of the workpiece to be processed, the position information corresponding to the currently received distance information can be directly determined as the target position information. For example, if the change amplitude exceeds the change amplitude threshold for the first time, it can be determined that the position information corresponding to the currently received distance information is the position information corresponding to the workpiece when it is at the processing start point (for convenience of description, referred to as the third position information). If the change amplitude exceeds the change amplitude threshold for the second time, it can be determined that the position information corresponding to the currently received distance information is the position information corresponding to the workpiece when it is at the processing end point (for convenience of description, referred to as the fourth position information).

[0083] In another embodiment, when the position on the workpiece to be processed corresponding to the currently received distance information is the edge of the workpiece to be processed, the third position information X corresponding to the machining start point when the workpiece to be processed reaches the effective machining area can be determined according to the position information corresponding to the currently received distance information in combination with the correction distance. 3 and / or determine the position information X corresponding to the machining end point when the workpiece to be processed reaches the effective machining area. 4 , where X 3 = X 5 + i 1 , X 5 represents the position information corresponding to the currently received distance information when the currently received distance information corresponds to the starting edge of the workpiece to be processed, and i 1 represents the first correction distance; and / or where X 4 = X 6 - i 2 , X 6 represents the position information corresponding to the currently received distance information when the currently received distance information corresponds to the ending edge of the workpiece to be processed, and i 2 represents the second correction distance. As described above, since there will be signal jumps at the wafer edge, the real-time control signal generated based on the distance information will also have jumps, resulting in inaccurate following. Therefore, after the ranging mechanism aligns with one side of the wafer edge, it can continue to move a certain distance, such as the first correction distance i 1 , before starting to follow. Conversely, there is still a certain distance, such as the second correction distance i 2 , before the ranging mechanism aligns with the other side of the wafer edge, and then the following ends. That is to say, the following can start late and end early to avoid the signal jump problem caused by the wafer edge.

[0084] When the position information received by the data receiving module 210 is the target position information (i.e., the third position information or the fourth position information), it can be determined that the wafer is at the target position point.

[0085] According to the above technical solution, according to the change amplitude of the distance information, it is judged whether the position on the workpiece to be processed corresponding to the currently received distance information is the edge of the workpiece to be processed, and then the position information corresponding to the machining start point or the machining end point is determined. This edge judgment-based scheme can simply and accurately determine the position information corresponding to the machining start point or the machining end point.

[0086] Exemplarily, the distance information is measured by the ranging mechanism of the processing device, and the second position information X 2 satisfies the following formula: X 2 = X 1 + δx 1 - δx 2 , where δx1 represents the distance between the ranging mechanism and the processing head in the first direction, δx 2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time.

[0087] Return to see Figure 1 , there is a certain spacing between the ranging mechanism and the processing head in the first direction. In this article, δx 1 is used to represent. Through the above description, it can be understood that the ranging mechanism can first reach above any position point. Subsequently, after the workpiece to be processed and / or the processing head move a certain distance, the processing head will come above this position point. Therefore, for any position point, if once the position information received by the data receiving module 210 is equal to the position information corresponding to the distance information measured by the ranging mechanism at this position point, and processing is performed on this position point, then since the processing head has not actually reached above this position point, there will be a certain error in such processing. For any position point, adding its original position information to δx 1 can compensate for this error and make the processing position of the processing head more accurate.

[0088] The position points within the effective processing area can include the processing start point and the processing end point. That is, for these two position points, the above-mentioned error compensation operation based on δx 1 and / or δx 2 can also be performed.

[0089] According to the above technical solution, this solution can compensate for the error caused by the installation spacing between the ranging mechanism and the processing head, thereby effectively improving the processing accuracy.

[0090] Exemplarily, the system further includes: a second data processing module, connected to the reading control module, for performing digital simulation on the read distance information received from the reading control module to obtain a fitting signal; an output module, connected to the second data processing module, for generating a corresponding real-time control signal according to the fitting signal and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move to the focal position matching the read distance information in the second direction.

[0091] In one embodiment, the control system 200 may further include a second data processing module and an output module. Figure 4 Shows an exemplary structural schematic diagram of the control system 200 according to an embodiment of the present invention. It should be noted that Figure 4 The various modules in the shown control system 200 are only examples and not limitations to the present invention. Many of the modules can be omitted or replaced with other modules, and the control system 200 may further include Figure 4 other modules other than the shown modules. In addition,Figure 4 The connection relationships of the various modules shown can also be adjusted. Figure 4 The first data processing module described above is not shown.

[0092] Refer to Figure 4 , which shows the second data processing module. The second data processing module can be a digital-to-analog (DA) fitting output module, which is connected to the reading control module 240. The second data processing module can perform digital simulation fitting according to the distance information received from the reading control module 240 through the formula y = k 2 h + b. Where h represents the distance information measured by the distance measuring mechanism, and k 2 and b can be preset, and y can represent the fitting signal obtained after fitting. Refer to Figure 4 , which also shows the output module. The output module is connected to the second data processing module, and the fitting signal obtained by the second data processing module can be transmitted to the output module. The output module can generate a corresponding real-time control signal according to the fitting signal and output the real-time control signal to the focusing mechanism. The real-time control signal can control the focusing mechanism to drive the processing head to move in the second direction to a focal position matching the distance information read by the distance measuring mechanism.

[0093] Exemplarily, refer to Figure 4 , the output module can include an output control sub-module and a data output sub-module. The output control sub-module can be a DA output control sub-module for controlling the data output sub-module to output the real-time control signal. The data output sub-module can be a digital-to-analog conversion (DAC) sub-module, which can perform operations such as digital-to-analog conversion on the real-time control signal, obtain an analog real-time control signal, and output the signal to the focusing mechanism.

[0094] In addition, refer to Figure 4 , which also shows the first data receiving module and the second data receiving module described above. Referring to the above description, the functions of the first data receiving module and the second data receiving module can be understood and will not be elaborated here. In addition, refer to Figure 4 , which also shows the third data processing module. The third data processing module can be understood as the above-mentioned first downsampling module. That is, the third data processing module can downsample the distance information received by the first data receiving module and can optionally perform sliding filtering. In addition, Figure 4 it is also shown that the output signal frequency of the first data receiving module is 200 Mbps, the output signal frequency of the third data processing module is 500 Kbps, and the output signal frequency of the second data receiving module (which can be the pulse output frequency of a position measuring mechanism such as a grating scale) is 500 KHz. However, these are only examples, and these frequencies can be adjusted as needed.

[0095] According to the above technical solution, based on the second data processing module and the output module, a fitting signal can be obtained and a corresponding real-time control signal can be generated according to the fitting signal, whereby the focusing mechanism can be automatically controlled to drive the processing head to move in the second direction. This solution has a relatively high degree of automation.

[0096] Exemplarily, the system further includes: a first interaction module, connected to the output module, for obtaining first indication information from the host computer. The output module is further configured to generate a fixed control signal based on the first indication information before the workpiece to be processed reaches the processing start point in the effective processing area, and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to remain at a fixed position in the second direction.

[0097] In one embodiment, the control system 200 may further include a first interaction module. Refer to Figure 4 , which shows the interaction module, and the interaction module may include a first interaction module. The first interaction module may include any wired and / or wireless communication interfaces to communicate with the host computer through these communication interfaces and receive the first indication information from the host computer. For example, the first interaction module may include one or more of an RS232 interface, a Bluetooth interface, a WiFi interface, a universal serial bus (USB) interface, etc. In addition, the first interaction module may further include an instruction configuration sub-module for transmitting the indication information to the corresponding module based on the type of the indication information received from the host computer. For example, when receiving the first indication information, the instruction configuration sub-module may transmit the first indication information to the output module for corresponding output control. Another example is that when receiving the following second indication information, the instruction configuration sub-module may transmit the second indication information to the judgment module for corresponding judgment.

[0098] The user can input the first position information into the host computer through an input device such as a mouse, a keyboard, a touch screen, etc., and the host computer can transmit the first indication information to the first interaction module. Refer to Figure 4 , the first interaction module may be connected to the output module. The first indication information may indicate any voltage value, and based on this voltage value, the focusing mechanism can be started, but the focusing mechanism does not move in the second direction, but remains at a fixed position. When the workpiece to be processed enters the effective processing area, the output module may generate a fixed control signal based on the first indication information. Then, the fixed control signal is output to the focusing mechanism to control the focusing mechanism to drive the processing head to remain stationary in the vertical direction.

[0099] Exemplarily, the first interaction module can be connected to the above output control sub-module and transmit the first indication information to the output control sub-module. When receiving the first indication information, the output control sub-module controls the data output sub-module to output a fixed control signal. When receiving the above fitting signal, the output control sub-module can control the data output sub-module to output a real-time control signal.

[0100] The first indication information can include a "register" value for indicating the magnitude of the fixed control signal. There is a preset corresponding relationship between the register value and the voltage value. For example, if the register value transmitted by the host computer to the first interaction module is 0 (before and after implementing the follow-up control), the output module can correspondingly output a fixed voltage (for example, according to the corresponding relationship between the register value and the voltage value pre-configured in the FPGA). Another example is that the host computer can also output third indication information to the first interaction module. Assuming that the register value included in the third indication information is 1, the magnitude of the voltage output by the output module can be calculated in real time based on the distance information (i.e., the case of real-time follow-up control).

[0101] Optionally, for the situation after real-time follow-up control, in order to avoid the jitter of the piezoelectric ceramic motor caused by the edge signal jump, after implementing the follow-up control, the voltage corresponding to the register value 0 can also not be adopted, but instead be maintained as the follow-up voltage corresponding to the last position point during the implementation of the follow-up control (i.e., the magnitude of the real-time control signal corresponding to the last position point). For this situation, after implementing the follow-up control, the host computer does not need to send the register value 0 to the interaction module.

[0102] According to the above technical solution, based on the first interaction module, the first indication information can be received and a fixed control signal can be generated based on the first indication information, which facilitates keeping the focusing mechanism driving the processing head at an appropriate position according to user requirements before implementing the follow-up control.

[0103] Exemplarily, the reading control module is further configured to control the data storage module to store distance information during the process that the workpiece to be processed is at the acquisition start point and the acquisition end point of the effective acquisition area. The system further includes: a judgment module, connected to the data receiving module and the reading control module, for judging whether the workpiece to be processed is at the acquisition start point or the acquisition end point according to the position information; a second interaction module, connected to the judgment module, for obtaining second indication information from the host computer, and the judgment module determines the position information corresponding to the acquisition start point and the acquisition end point respectively based on the second indication information.

[0104] The second interaction module and the first interaction module can be the same interaction module (such as Figure 4The interactive module shown) may also be two separate interactive modules. Similar to the first interactive module, the second interactive module may include any wired and / or wireless communication interfaces to communicate with the host computer through these communication interfaces and receive second indication information from the host computer. For example, the second interactive module may include one or more of an RS232 interface, a Bluetooth interface, a WiFi interface, a Universal Serial Bus (USB) interface, etc. In the case where the first interactive module and the second interactive module are implemented by the same interactive module, this interactive module may include the above-mentioned instruction configuration sub-module. In the case where the first interactive module and the second interactive module are two separate interactive modules, the first interactive module and the second interactive module may optionally omit the instruction configuration sub-module.

[0105] In one embodiment, the reading control module 240 may also be used to control the data storage module 220 to store the distance information collected by the ranging mechanism during the process of the wafer moving from the acquisition starting point to the acquisition ending point in the effective acquisition area. As Figure 4 shown, the control system 200 may further include a judgment module. The judgment module may be connected to the second data receiving module and the second interactive module. The user may input second position information into the host computer through input devices such as a mouse, a keyboard, a touch screen, etc., and the host computer may transmit the second indication information to the second interactive module. The second indication information may include the position information corresponding to the acquisition starting point and the acquisition ending point respectively. For example, the user may use the keyboard to input the measured values on the grating scale corresponding to the acquisition starting point and the acquisition ending point respectively in the information input box in the user interface displayed on the host computer. The judgment module may, according to the position information received by the data receiving module 210, judge in real time whether the current workpiece to be processed has reached the acquisition starting point or the acquisition ending point. The reading control module 240 may, according to the judgment result of the judgment module, control the data storage module 220 to store the distance information during the process of the workpiece to be processed being at the acquisition starting point and the acquisition ending point in the effective acquisition area.

[0106] According to the above technical solution, it is possible to automatically judge whether the workpiece to be processed is at the acquisition starting point and the acquisition ending point within the acquisition area, and during the process of the workpiece to be processed being at the acquisition starting point and the acquisition ending point in the effective acquisition area, control the data storage module to store the distance information. This solution can effectively save storage space and is also beneficial to reducing the workload of the control system 200.

[0107] According to the second aspect of the present invention, there is also provided a control method for a processing device. Figure 5 shows a schematic flowchart of a control method 500 for a processing device according to an embodiment of the present invention. As Figure 5 shown, the method 500 may include the following steps S510, step S520, step S530, step S540, and step S550.

[0108] Step S510: Receive the position information of the workpiece to be processed and the distance information corresponding to the position information in real time. The position information is used to represent the position of the workpiece to be processed in the first direction when it moves relative to the processing head of the processing device in the first direction. The distance information is used to represent the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction. The position information includes the position information corresponding one by one to each different position point where the workpiece to be processed is located. The distance information includes the distance information corresponding one by one to each different position point where the workpiece to be processed is located.

[0109] Step S520: Store the distance information.

[0110] Step S530: Calculate the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculate the response time according to the change rate. The response time is the response time of the focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction.

[0111] Step S540: Correct at least the first position information X 1 to determine the second position information X 2 .

[0112] Step S550: When the position information is the second position information X 2 , read the distance information corresponding to the first position information X 1 , and control the focusing mechanism to drive the processing head to move to the focal position matching the read distance information in the second direction based on the read distance information. Among them, the first position information X 1 is the position information corresponding to multiple position points.

[0113] Exemplarily, the method further includes: performing a first downsampling on the distance information; performing a second downsampling on the distance information after the first downsampling; wherein, storing the distance information includes: storing the distance information after the first downsampling, and calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed includes: calculating the change rate based on the distance information corresponding to multiple position points in the distance information after the second downsampling.

[0114] Exemplarily, the multiple position points are the position points in the effective machining area on the workpiece to be machined. Calculating the change rate of the distance information corresponding to the multiple position points on the workpiece to be machined includes: determining a preset number of consecutive position points in the effective machining area as the multiple position points; calculating the change rate corresponding to the multiple position points according to the distance information and the respective information acquisition times corresponding to the starting position point and the ending position point among the multiple position points, wherein the information acquisition time corresponding to any position point is the time when the distance information corresponding to this position point is acquired.

[0115] Exemplarily, calculating the response time according to the change rate includes: calculating the response time according to the change rate and a preset relationship function, wherein the preset relationship function is the relationship function between the change rate and the response time.

[0116] Exemplarily, the method further includes: judging whether the workpiece to be machined is at the target position point according to the position information and the distance information, where the target position point is the machining starting point or the machining ending point in the effective machining area on the workpiece to be machined. Among them, the operation of reading the distance information corresponding to the first position information X 1 is performed during the process from the received position information being the third position information to the received position information being the fourth position information. The third position information is the position information corresponding when the workpiece to be machined is at the machining starting point, and the fourth position information is the position information corresponding when the workpiece to be machined is at the machining ending point.

[0117] Exemplarily, judging whether the workpiece to be machined is at the target position point according to the position information and the distance information includes: judging whether the position on the workpiece to be machined corresponding to the currently received distance information is the edge of the workpiece to be machined according to the change amplitude of the distance information; in the case that the judgment result is yes, based on the position information corresponding to the currently received distance information, determining the target position information corresponding when the workpiece to be machined is at the target position point, and the target position information is the third position information or the fourth position information; when the received position information is the target position information, determining that the workpiece to be machined is at the target position point.

[0118] Exemplarily, the distance information is measured by the ranging mechanism of the machining device. The second position information X 2 satisfies the following formula: X 2 =X 1 +δx 1 -δx 2 , where δx 1 represents the distance between the ranging mechanism and the machining head in the first direction, and δx 2 represents the moving distance of the workpiece to be machined relative to the machining head in the first direction during the response time.

[0119] According to another aspect of the present invention, an electronic device is further provided.Figure 6 shows a schematic block diagram of an electronic device 600 according to an embodiment of the present invention. As Figure 6 shown, the electronic device 600 may include a processor 610 and a memory 620. Among them, a computer program is stored in the memory 620, and the processor 610 executes the computer program to implement the above control method for the processing device.

[0120] According to another aspect of the present invention, a storage medium is also provided. Program instructions are stored on the storage medium, and the program instructions are used to execute the above control method for the processing device when running. The storage medium may include, for example, a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0121] Those of ordinary skill in the art can understand the specific implementation solutions and their beneficial effects of the above control method for the processing device, the electronic device, and the storage medium by reading the above relevant descriptions of the control system for the processing device. For the sake of brevity, they will not be elaborated here.

[0122] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present invention thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as claimed in the appended claims.

[0123] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or in a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. A professional technician can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0124] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0125] In the description provided herein, numerous specific details are set forth. It will be understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

[0126] Similarly, it should be understood that in order to streamline the present invention and aid in understanding one or more of the various inventive aspects, in the description of exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, the methods of the present invention should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, the inventive point lies in that the corresponding technical problems can be solved with features less than all the features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim stands on its own as a separate embodiment of the present invention.

[0127] Those skilled in the art will appreciate that, except where features are mutually exclusive, any combination can be used of all the features disclosed in this specification (including the accompanying claims, abstract and drawings), as well as of all the processes or units of any method or apparatus so disclosed. Each feature disclosed in this specification (including the accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

[0128] In addition, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features of different embodiments are meant to be within the scope of the present invention and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0129] Each component embodiment of the present invention can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art should understand that a microprocessor or a digital signal processor (DSP) can be used in practice to implement some or all of the functions of some modules in the control system for a processing device according to the embodiments of the present invention. The present invention can also be implemented as a device program (for example, a computer program and a computer program product) for executing part or all of the methods described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, or provided on a carrier signal, or in any other form.

[0130] It should be noted that the above embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims listing several devices, several of these devices can be embodied by the same item of hardware. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names.

[0131] As described above, it is only the specific implementation manner of the present invention or the description of the specific implementation manner. The protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A control system for a processing device, comprising: A data receiving module, configured to receive in real time the position information of a workpiece to be processed and the distance information corresponding to the position information. The position information is used to represent the position of the workpiece in the first direction when the workpiece moves relative to the processing head of the processing device in the first direction, and the distance information is used to represent the distance between the processing head and the workpiece in the second direction when the workpiece moves relative to the processing head in the first direction. The position information includes position information corresponding one by one to each different position point where the workpiece is located, and the distance information includes distance information corresponding one by one to each different position point where the workpiece is located; A data storage module, configured to store the distance information; A first data processing module, configured to calculate the change rate of the distance information corresponding to multiple position points of the workpiece, and calculate the response time according to the change rate. The response time is the response time of a focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction; a reading control module connected to the first data processing module, the data storage module and the data receiving module, and configured to read the first position information X according to at least the response time output by the first data processing module and the moving speed when the workpiece to be processed and the processing head move relative to each other; 1 Correction is performed to determine the second position information X 2 , and is used when the location information received by the data receiving module is the second location information X 2 When the first position information X is read from the data storage module 1 The first position information X corresponds to the distance information read, so as to control the focusing mechanism to drive the processing head to move in the second direction to a focal position matching the distance information read, wherein the first position information X 1 is location information corresponding to the multiple location points; Wherein, the first data processing module calculates the response time according to the change rate in the following manner: Calculate the response time according to the change rate and a preset relationship function, where the preset relationship function is a relationship function between the change rate and the response time.

2. The system according to claim 1, wherein, The system further comprises: A first downsampling module, connected to the data receiving module and the data storage module, and configured to perform a first downsampling on the distance information; A second downsampling module, connected to the first downsampling module and the first data processing module, and configured to perform a second downsampling on the distance information that has undergone the first downsampling; Wherein, the data storage module is configured to store the distance information that has undergone the first downsampling, and the first data processing module is configured to calculate the change rate based on the distance information corresponding to the multiple position points in the distance information that has undergone the second downsampling.

3. The system according to claim 1, wherein, The multiple position points are the position points when the workpiece is within an effective processing area, The first data processing module calculates the change rate of the distance information corresponding to multiple position points of the workpiece in the following manner: Determine a preset number of consecutive position points in the effective processing area as the multiple position points; Calculate the change rate corresponding to the multiple position points according to the distance information and the respective information acquisition times corresponding to the starting position point and the ending position point among the multiple position points, where the information acquisition time corresponding to any position point is the time when the distance information corresponding to that position point is acquired.

4. The system according to any one of claims 1-3, wherein, The reading control module is further configured to determine whether the workpiece is at a target position point according to the position information and the distance information. The target position point is the starting point or the ending point of processing in the effective processing area of the workpiece. Wherein, during the process that the position information received by the data receiving module changes from the third position information to the fourth position information, the reading control module reads the distance information from the data storage module. The third position information is the position information corresponding to the workpiece to be processed when it is at the processing starting point, and the fourth position information is the position information corresponding to the workpiece to be processed when it is at the processing ending point.

5. The system according to claim 4, wherein the reading control module determines whether the workpiece to be processed is at the target position point according to the position information and the distance information in the following manner: Judging whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece to be processed according to the change range of the distance information; In the case where the judgment result is yes, based on the position information corresponding to the currently received distance information, determining the target position information corresponding to the workpiece to be processed when it is at the target position point, and the target position information is the third position information or the fourth position information; When the position information received by the data receiving module is the target position information, it is determined that the workpiece to be processed is at the target position point.

6. The system according to any one of claims 1-3, wherein, The distance information is obtained by measuring with a distance measuring mechanism of the processing device, and the second position information X 2 satisfies the following formula: X 2 = X 1 + δx 1 - δx 2 , wherein, δx 1 represents the distance between the ranging mechanism and the processing head in the first direction, and δx 2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time.

7. The system according to any one of claims 1-3, wherein, The system further comprises: A second data processing module, connected to the reading control module, for performing digital simulation fitting according to the read distance information received from the reading control module to obtain a fitting signal; An output module, connected to the second data processing module, for generating a corresponding real-time control signal according to the fitting signal and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move to a focal position matching the read distance information in the second direction.

8. The system according to claim 7, wherein, The system further comprises: A first interaction module, connected to the output module, for obtaining first indication information from the host computer. The output module is further configured to generate a fixed control signal based on the first indication information before the workpiece to be processed reaches the processing starting point in the effective processing area and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to maintain a fixed position in the second direction.

9. The system according to any one of claims 1-3, characterized in that, The reading control module is further configured to control the data storage module to store the distance information during the process that the workpiece to be processed is at the acquisition starting point and the acquisition ending point of the effective acquisition area. The system further comprises: A judgment module, connected to the data receiving module and the reading control module, for judging whether the workpiece to be processed is at the acquisition starting point or the acquisition ending point according to the position information. The second interaction module, connected to the judgment module, is configured to obtain second indication information from a host computer, and the judgment module determines the position information corresponding to the acquisition start point and the acquisition end point respectively based on the second indication information.

10. A control method for a processing device, comprising: Receiving in real time the position information of a workpiece to be processed and the distance information corresponding to the position information, where the position information is used to represent the position of the workpiece to be processed in the first direction when the workpiece to be processed moves relative to the processing head of the processing device in the first direction, and the distance information is used to represent the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction. The position information includes position information corresponding one by one to each different position point where the workpiece to be processed is located, and the distance information includes distance information corresponding one by one to each different position point where the workpiece to be processed is located; Storing the distance information; Calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed, and calculating the response time according to the change rate. The response time is the response time of a focusing mechanism in the processing device, and the focusing mechanism is used to drive the processing head to move in the second direction; At least correct the first position information X according to the response time and the moving speed when the workpiece to be processed moves relative to the processing head 1 to determine the second position information X 2 ; When the position information is the second position information X 2 , read the distance information corresponding to the first position information X 1 , and based on the read distance information, control the focusing mechanism to drive the processing head to move in the second direction to a focal position matching the read distance information, where the first position information X 1 is the position information corresponding to the multiple position points; Wherein, the calculating the response time according to the change rate includes: Calculating the response time according to the change rate and a preset relationship function, where the preset relationship function is a relationship function between the change rate and the response time.

11. The method according to claim 10, wherein, The method further includes: Performing a first downsampling on the distance information; Performing a second downsampling on the distance information after the first downsampling; Wherein, the storing the distance information includes: storing the distance information after the first downsampling, The calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed includes: calculating the change rate based on the distance information corresponding to the multiple position points in the distance information after the second downsampling.

12. The method according to claim 10, wherein, The multiple position points are position points in an effective processing area on the workpiece to be processed, The calculating the change rate of the distance information corresponding to multiple position points of the workpiece to be processed includes: Determining a preset number of consecutive position points in the effective processing area as the multiple position points; Calculating the change rate corresponding to the multiple position points according to the distance information and the corresponding information acquisition time corresponding to the start position point and the end position point among the multiple position points respectively, where the information acquisition time corresponding to any position point is the time when the distance information corresponding to the position point is acquired.

13. The method according to any one of claims 10-12, wherein, The method further includes: Judging whether the workpiece to be processed is at a target position point according to the position information and the distance information, where the target position point is a processing start point or a processing end point in an effective processing area on the workpiece to be processed, Among them, the operation of reading the distance information corresponding to the first position information X 1 is performed during the process from the received position information being the third position information to the received position information being the fourth position information. The third position information is the position information corresponding to when the workpiece to be processed is at the machining starting point, and the fourth position information is the position information corresponding to when the workpiece to be processed is at the machining ending point.

14. The method according to claim 13, wherein, Determining whether the workpiece to be processed is at the target position point according to the position information and the distance information includes: Judging whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece according to the change range of the distance information; In the case where the judgment result is yes, based on the position information corresponding to the currently received distance information, determining the target position information corresponding to the workpiece being at the target position point, where the target position information is the third position information or the fourth position information; When the received position information is the target position information, it is determined that the workpiece is at the target position point.

15. The method according to any one of claims 10-12, wherein, The distance information is measured by a distance measuring mechanism of the processing device, and the second position information X 2 satisfies the following formula: X 2 = X 1 + δx 1 - δx 2 , where δx 1 represents the distance between the ranging mechanism and the processing head in the first direction, and δx 2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time.

16. An electronic device, comprising a processor and a memory, wherein a computer program is stored in the memory, and the processor executes the computer program to implement the control method for a processing device according to any one of claims 10-15.

17. A storage medium storing computer programs / instructions, which when executed by a processor implement the control method for a processing device according to any one of claims 10-15.

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