A metal recycling device for waste circuit boards

Abstract

The present invention discloses a metal recovery device for waste circuit boards, which solves the problem that a temperature difference exists between the contact position between the rapping component and the waste circuit boards of the existing device, so that the waste circuit boards are adsorbed on the rapping component, which affects the working efficiency of the rapping component in the long run. The device comprises: a recovery body, wherein the recovery body comprises a main body shell, the main body shell is fixed on a supporting base, and a feeding port is provided on the main body shell, a discharging port is provided on one side of the main body shell, and a driving seat is provided on the other side of the main body shell; the device is characterized in that a circuit board pretreatment mechanism is provided in the main body shell and is connected with the feeding port, and is used for crushing pretreatment of the circuit board, and a metal discrete separation mechanism; a metal discrete component is provided in the present application, which can scatter the crushed circuit board on the one hand, and heat itself and the circuit board on the other hand to prevent the circuit board melt from being adsorbed on the metal discrete component.

Description

Technical Field

[0001] The invention particularly relates to a metal recovery device for waste circuit boards. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. It has the characteristics of high wiring density, light weight, thin thickness, and good flexibility. After the circuit board is damaged, special recycling equipment is needed to recycle the metal on the circuit board.

[0003] Chinese patent CN207899851U discloses a waste printed circuit board thermal disassembly device, which includes a frame, a frame shell is arranged in the length direction of the frame to constitute a working chamber for thermal disassembly of the printed circuit board, and a heating box connected to the working chamber and used for heating the working chamber is arranged on the upper side and / or the lower side of the frame shell; an input port and an output port for inputting and outputting waste circuit boards are respectively arranged at both ends of the frame shell; a transmission shaft is movably installed on the frame at both ends of the working chamber, and a conveying chain plate is sleeved on the transmission shaft; however, there is a temperature difference between the contact position between the rapping component of the existing device and the waste circuit board, so that the waste circuit board is adsorbed on the rapping component, which affects the working efficiency of the rapping component in the long run. Based on this, we propose a metal recovery device for waste circuit boards. Summary of the invention

[0004] The purpose of the present invention is to address the shortcomings of the prior art and provide a metal recovery device for waste circuit boards, which solves the problem that there is a temperature difference between the contact position between the rapping component and the waste circuit boards in the existing device, causing the waste circuit boards to be adsorbed on the rapping component, which in the long run affects the working efficiency of the rapping component.

[0005] There is a temperature difference between the contact position between the rapping component of the existing device and the waste circuit board, which causes the waste circuit board to be adsorbed on the rapping component. In the long run, this affects the working efficiency of the rapping component. Based on this, we propose a metal recovery device for waste circuit boards. A metal discrete component is provided in this application. On the one hand, the metal discrete component breaks up the crushed circuit boards, and on the other hand, it can heat itself and the circuit boards to prevent the molten circuit boards from being adsorbed on the metal discrete component. At the same time, the auxiliary discrete component cooperates with the metal discrete component to strengthen the discrete effect on the waste circuit boards and improve the metal recovery efficiency.

[0006] The present invention is implemented as follows: a metal recovery device for waste circuit boards, the metal recovery device for waste circuit boards comprising:

[0007] The recycling body comprises a main body shell, which is fixed on the supporting base, and is provided with a feeding port, a discharging port on one side of the main body shell, and a driving seat on the other side of the main body shell;

[0008] A circuit board pre-processing mechanism is arranged in the main housing and communicated with the feeding port, and is used for crushing and pre-processing the circuit board, and

[0009] A metal discrete separation mechanism is installed in the main housing and connected to the circuit board pretreatment mechanism, and the metal discrete separation mechanism is used for discrete separation of waste circuit boards;

[0010] Among them, the metal discrete separation mechanism includes a discrete separation chamber, a separation mechanism driving part, an auxiliary discrete component and a metal discrete component. The auxiliary discrete component and the metal discrete component are both fixedly connected to the separation mechanism driving part. The separation mechanism driving part is fixedly installed in the discrete separation chamber. The metal discrete component is used to heat the heating plate and break up and separate the heating plate.

[0011] Preferably, the auxiliary discrete components include:

[0012] At least one set of auxiliary discrete rods, one end of each of which is fixedly connected to a separation mechanism transmission shaft, and the separation mechanism transmission shaft is fixedly connected to a separation mechanism driving member;

[0013] an auxiliary discrete seat mounted at one end of the auxiliary discrete rod, the auxiliary discrete seat being used to knock the circuit board to be separated, and

[0014] At least one group of auxiliary crushing saw teeth, wherein the auxiliary crushing saw teeth are used for auxiliary crushing processing of the circuit board.

[0015] Preferably, the metal discrete components include:

[0016] At least one set of discrete guide rods fixedly mounted on the transmission shaft of the separation mechanism;

[0017] A discrete guide seat is sleeved on the discrete guide rod, the discrete guide seat is slidably connected to the discrete guide rod, and a discrete protection spring for protecting the discrete guide seat is embedded in the discrete guide seat, and the discrete protection spring is respectively connected to the discrete guide seat and the discrete guide rod.

[0018] Preferably, the metal discrete component further comprises:

[0019] A metal discrete seat, fixedly mounted on the discrete guide seat;

[0020] At least one group of auxiliary heating elements, which are fixedly mounted on the discrete guide rods and are used for auxiliary heating treatment of the exhaust circuit board.

[0021] Preferably, the circuit board preprocessing mechanism comprises:

[0022] The pre-treatment seat is fixedly installed in the main housing;

[0023] The pre-processing driving member is fixedly installed in the driving seat, and the output end of the pre-processing driving member is fixedly connected with the pre-processing transmission shaft;

[0024] The gear transmission part is fixedly installed on the end of the pre-treatment transmission shaft.

[0025] Preferably, the gear transmission unit comprises:

[0026] The main bevel gear is fixedly connected to the pre-processing transmission shaft;

[0027] A secondary bevel gear is arranged on one side of the main bevel gear, and the main bevel gear and the secondary bevel gear are meshed and driven.

[0028] Preferably, the circuit board preprocessing mechanism further includes:

[0029] The swing grinding part is installed in the pre-treatment seat and is used for grinding pre-treatment of the circuit board;

[0030] The pre-processing transmission part is connected to the swing grinding part, and the pre-processing transmission part is fixedly connected to the auxiliary bevel gear for transmitting the power of the pre-processing driving member.

[0031] Preferably, the pre-processing transmission unit comprises:

[0032] Pre-process the transmission seat and fix it to the auxiliary bevel gear;

[0033] A pretreatment sleeve seat is sleeved on the pretreatment transmission seat, and a plurality of sets of sleeve seat protection members are arranged on one side of the pretreatment sleeve seat close to the pretreatment transmission seat, and the sleeve seat protection members are used to protect the pretreatment sleeve seat.

[0034] Preferably, the oscillating grinding section comprises:

[0035] The grinding drive is fixedly mounted on the pretreatment sleeve;

[0036] A swiveling milling seat fixedly connected to a milling drive.

[0037] Preferably, the oscillating grinding section comprises:

[0038] The grinding drive is fixedly mounted on the pretreatment sleeve;

[0039] A swiveling milling seat fixedly connected to a milling drive.

[0040] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0041] A metal discrete component is provided in the present application. On the one hand, the metal discrete component can scatter the crushed circuit board, and on the other hand, it can heat itself and the circuit board to prevent the molten material of the circuit board from being adsorbed on the metal discrete component. At the same time, the auxiliary discrete component cooperates with the metal discrete component to strengthen the discrete effect of the waste circuit board and improve the metal recovery efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 The present invention is a schematic structural diagram of a metal recovery device for waste circuit boards.

[0043] Figure 2 It is the front view of the present invention.

[0044] Figure 3 It is a schematic diagram of the structure of the auxiliary discrete component provided by the present invention.

[0045] Figure 4 It is a schematic diagram of the structure of the metal discrete component provided by the present invention.

[0046] Figure 5 It is a schematic diagram of the structure of the metal discrete seat provided by the present invention.

[0047] Figure 6 yes Figure 1 Schematic diagram of the locally enlarged structure of A in the middle.

[0048] Figure 7 It is a structural schematic diagram of a circuit board pretreatment mechanism provided by the present invention.

[0049] In the figure: 1-recovery body, 11-body shell, 12-feeding port, 13-support base, 14-heat dissipation net, 15-discharge port, 16-driving seat, 2-circuit board pretreatment mechanism, 21-pretreatment driving member, 22-pretreatment transmission shaft, 23-main bevel gear, 24-pretreatment transmission part, 241-secondary bevel gear, 242-pretreatment transmission seat, 243-pretreatment set seat, 244-set seat protection member, 25-swing grinding part, 251-grinding drive Parts, 252-swing grinding seat, 253-auxiliary grinding parts, 26-pretreatment seat, 3-metal discrete separation mechanism, 31-discrete separation chamber, 32-separation mechanism driving part, 33-auxiliary discrete component, 331-auxiliary discrete rod, 332-auxiliary discrete seat, 333-auxiliary crushing sawtooth, 34-metal discrete component, 341-metal discrete seat, 342-discrete guide seat, 343-discrete protection spring, 344-discrete guide rod, 345-auxiliary heating part. DETAILED DESCRIPTION

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0051] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] The embodiment of the present invention provides a metal recovery device for waste circuit boards, such as Figure 1-2 As shown, the metal recovery device for waste circuit boards comprises:

[0053] The recycling body 1 comprises a main body shell 11, which is fixed on a supporting base 13, and a feeding port 12 is provided on the main body shell 11, a discharge port 15 is provided on one side of the main body shell 11, and a driving seat is provided on the other side of the main body shell 11.

[0054] Exemplarily, the inner wall of the main shell 11 is provided with a soundproof cover, which can reduce the noise generated when the device is working and protect the operating environment. At the same time, a heat dissipation net 14 is detachably installed on the side wall of the main shell 11. The heat dissipation net 14 is made of heat-absorbing material. The setting of the heat dissipation net 14 improves the heat dissipation performance of the device.

[0055] A circuit board pre-processing mechanism is disposed in the main housing 11 and communicated with the feeding port 12, and is used for pre-processing the circuit board by crushing, and

[0056] The metal discrete separation mechanism 3 is installed in the main housing 11 and connected to the circuit board pre-processing mechanism. The metal discrete separation mechanism 3 is used for discrete separation of waste circuit boards.

[0057] Among them, the metal discrete separation mechanism 3 includes a discrete separation chamber 31, a separation mechanism driving member 32, an auxiliary discrete component 33 and a metal discrete component 34. The auxiliary discrete component 33 and the metal discrete component 34 are both fixedly connected to the separation mechanism driving member 32. The separation mechanism driving member 32 is fixedly installed in the discrete separation chamber 31. The metal discrete component 34 is used to heat the heating plate and break up and separate the heating plate.

[0058] In this embodiment, during operation, waste circuit boards containing recyclable metals are put into the feeding port 12, and then the circuit board pretreatment mechanism is turned on. The circuit board pretreatment mechanism grinds and crushes the circuit boards, and breaks down circuit boards of various shapes into shapes that are convenient for discreteness. Then, the separation mechanism driving member 32 is turned on. The separation mechanism driving member 32 is turned on to drive the auxiliary discrete component 33 and the metal discrete component 34 to move. On the one hand, the metal discrete component 34 breaks up the crushed circuit board, and on the other hand, it can heat itself and the circuit board to prevent the circuit board melt from being adsorbed on the metal discrete component 34, thereby solving the drawbacks of the prior art.

[0059] In the present application, a metal discrete component 34 is provided. On the one hand, the metal discrete component 34 can scatter the crushed circuit board, and on the other hand, it can heat itself and the circuit board to prevent the molten material of the circuit board from being adsorbed on the metal discrete component 34. At the same time, the auxiliary discrete component 33 cooperates with the metal discrete component 34 to strengthen the discrete effect on the discarded circuit board and improve the metal recovery efficiency.

[0060] In a further preferred embodiment of the present invention, Figure 3 As shown, the auxiliary discrete component 33 includes:

[0061] At least one set of auxiliary discrete rods 331, one end of each of which is fixedly connected to a separation mechanism transmission shaft, and the separation mechanism transmission shaft is fixedly connected to a separation mechanism driving member 32;

[0062] An auxiliary discrete seat 332 mounted at one end of the auxiliary discrete rod 331, the auxiliary discrete seat 332 being used to knock the circuit board to be separated, and

[0063] At least one set of auxiliary crushing saw teeth 333, wherein the auxiliary crushing saw teeth 333 are used for auxiliary crushing processing of the circuit board.

[0064] In this embodiment, the separation mechanism driving component 32 can be a servo motor, and the separation mechanism driving component 32 is fixed on one side of the discrete separation chamber 31 by fastening bolts or clamps. At the same time, the discrete separation chamber 31 can be a circular groove with a hollow interior. One side of the discrete separation chamber 31 is connected to the circuit board pretreatment mechanism through a horizontal through groove, and the other side is connected to the discharge port 15, which facilitates the discharge of waste.

[0065] In a further preferred embodiment of the present invention, Figure 4-5 As shown, the metal discrete component 34 includes:

[0066] At least one set of discrete guide rods 344, fixedly mounted on the transmission shaft of the separation mechanism;

[0067] A discrete guide seat 342 is sleeved on the discrete guide rod 344, the discrete guide seat 342 is slidably connected to the discrete guide rod 344, and the discrete guide seat 342 is embedded with a discrete protection spring 343 for protecting the discrete guide seat 342, and the discrete protection spring 343 is respectively connected to the discrete guide seat 342 and the discrete guide rod 344.

[0068] A metal discrete seat 341 is fixedly mounted on the discrete guide seat 342;

[0069] At least one set of auxiliary heating elements 345 , wherein the auxiliary heating elements 345 are fixedly mounted on the discrete guide rods 344 , and the auxiliary heating elements 345 are used for auxiliary heating treatment of the exhaust circuit board.

[0070] In this embodiment, the discrete guide rod 344 can be a round rod or a square rod, and the discrete guide rod 344 can be made of titanium alloy. The discrete guide rod 344 is circumferentially arranged about the separation mechanism transmission shaft, and the auxiliary discrete rod 331 is also circumferentially arranged. At the same time, the discrete guide rod 344 and the auxiliary discrete rod 331 are staggered, and the auxiliary heating element 345 is arranged in a matrix or circumferentially on the discrete guide rod 344. The auxiliary heating element 345 is a resistance wire or an electric heating plate with a built-in battery.

[0071] Illustratively, in the present application, by providing a discrete guide seat 342 and a discrete guide rod 344, and the two are relatively slidably connected, the dispersion range can be adaptively adjusted, thereby facilitating adaptation to discrete separation chambers 31 of different specifications.

[0072] In a further preferred embodiment of the present invention, Figure 6 As shown, the circuit board preprocessing mechanism includes:

[0073] The pre-treatment seat 26 is fixedly installed in the main housing 11;

[0074] The pre-processing driving member 21 is fixedly installed in the driving seat, and the output end of the pre-processing driving member 21 is fixedly connected to the pre-processing transmission shaft 22;

[0075] The gear transmission part is fixedly mounted on the end of the pre-processing transmission shaft 22 .

[0076] The swing grinding part 25 is installed in the pre-treatment seat 26 and is used for grinding pre-treatment of the circuit board;

[0077] The pre-processing transmission part 24 connected to the swing grinding part 25 is fixedly connected to the auxiliary bevel gear 241 for transmitting the power of the pre-processing driving member 21 .

[0078] In this embodiment, the gear transmission part includes:

[0079] The main bevel gear 23 is fixedly connected to the pre-processing transmission shaft 22;

[0080] A secondary bevel gear 241 is arranged on one side of the main bevel gear 23 , and the main bevel gear 23 and the secondary bevel gear 241 are meshed and driven.

[0081] Exemplarily, the pre-processing seat 26 may be a cylinder or round seat structure with a hollow interior, and the pre-processing driving member 21 may be a servo motor, and the pre-processing driving member 21 may be fixedly installed in the driving seat by fastening bolts.

[0082] During operation, the pretreatment drive 21 is turned on, and the pretreatment drive 21 can drive the pretreatment transmission shaft 22 to rotate, and the pretreatment transmission shaft 22 drives the main bevel gear 23 to rotate, and the main bevel gear 23 drives the secondary bevel gear 241 to rotate, so that the secondary bevel gear 241 drives the pretreatment transmission part 24 to rotate, and the pretreatment transmission part 24 drives the swing grinding part 25 to swing, and the swing grinding part 25 can rotate automatically, thereby realizing the grinding and refining processing of the circuit board and avoiding the accumulation of circuit board waste.

[0083] In a further preferred embodiment of the present invention, Figure 7 As shown, the pre-processing transmission unit 24 includes:

[0084] The pre-processing transmission seat 242 is fixedly connected to the auxiliary bevel gear 241;

[0085] A pretreatment sleeve seat 243 is sleeved on the pretreatment transmission seat 242 , and a plurality of sets of sleeve seat protection members 244 are arranged on one side of the pretreatment sleeve seat 243 close to the pretreatment transmission seat 242 , and the sleeve seat protection members 244 are used to protect the pretreatment sleeve seat 243 .

[0086] In this embodiment, the sleeve seat protection part 244 is evenly distributed around the pretreatment sleeve seat 243. The sleeve seat protection part 244 can be an arc-shaped elastic block or a rectangular elastic block. The sleeve seat protection part 244 is made of wear-resistant elastomer material, so as to provide sufficient buffering protection for the pretreatment sleeve seat 243.

[0087] In a further preferred embodiment of the present invention, Figure 7 As shown, the oscillating grinding section 25 includes:

[0088] The grinding drive member 251 is fixedly mounted on the pre-treatment sleeve 243;

[0089] The swing grinding seat 252 is fixedly connected to the grinding driving member 251 , and the swing grinding seat 252 is provided with a plurality of groups of auxiliary grinding members 253 for assisting the swing grinding seat 252 in its operation.

[0090] In this embodiment, the grinding drive 251 can be a servo motor, and the auxiliary grinding parts 253 are circumferentially arranged about the swing grinding seat 252. The auxiliary grinding parts 253 can be a rectangular or conical tooth structure. When working, the grinding drive 251 drives the swing grinding seat 252 and the auxiliary grinding parts 253 to rotate, so as to fully grind and refine the circuit board in the pre-treatment seat 26.

[0091] In summary, the present invention provides a metal recovery device for waste circuit boards. When in operation, the waste circuit boards containing recyclable metals are put into the feeding port 12, and then the circuit board pretreatment mechanism is started. The circuit board pretreatment mechanism grinds and crushes the circuit boards, and refines the circuit boards of various shapes into convenient discrete shapes. Then, the separation mechanism driving member 32 is started. The separation mechanism driving member 32 is turned on to drive the auxiliary discrete component 33 and the metal discrete component 34 to move. On the one hand, the metal discrete component 34 breaks up the crushed circuit board, and on the other hand, it can also heat itself and the circuit board to prevent the circuit board melt from being adsorbed on the metal discrete component 34, thereby solving the disadvantages of the prior art.

[0092] During operation, the pretreatment drive 21 is turned on, and the pretreatment drive 21 can drive the pretreatment transmission shaft 22 to rotate, and the pretreatment transmission shaft 22 drives the main bevel gear 23 to rotate, and the main bevel gear 23 drives the secondary bevel gear 241 to rotate, so that the secondary bevel gear 241 drives the pretreatment transmission part 24 to rotate, and the pretreatment transmission part 24 drives the swing grinding part 25 to swing, and the swing grinding part 25 can rotate automatically, thereby realizing the grinding and refining processing of the circuit board and avoiding the accumulation of circuit board waste.

[0093] In the present application, a metal discrete component 34 is provided. On the one hand, the metal discrete component 34 can scatter the crushed circuit board, and on the other hand, it can heat itself and the circuit board to prevent the molten material of the circuit board from being adsorbed on the metal discrete component 34. At the same time, the auxiliary discrete component 33 cooperates with the metal discrete component 34 to strengthen the discrete effect on the discarded circuit board and improve the metal recovery efficiency.

[0094] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the present invention is not limited by the described order of actions, because according to the present invention, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0095] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0096] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0097] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also belong to the scope of protection of the present invention.

Claims

1. A metal recovery device for waste circuit boards, comprising: The recycling body comprises a main body shell, which is fixed on the supporting base, and is provided with a feeding port, a discharging port on one side of the main body shell, and a driving seat on the other side of the main body shell; The invention is characterized in that the circuit board pre-processing mechanism is arranged in the main body shell and is connected with the feeding port, and is used for crushing pre-processing of the circuit board, and A metal discrete separation mechanism is installed in the main housing and connected to the circuit board pretreatment mechanism, and the metal discrete separation mechanism is used for discrete separation of waste circuit boards; The metal discrete separation mechanism comprises a discrete separation chamber, a separation mechanism driving member, an auxiliary discrete component and a metal discrete component. The auxiliary discrete component and the metal discrete component are both fixedly connected to the separation mechanism driving member. The separation mechanism driving member is fixedly installed in the discrete separation chamber. The metal discrete component is used to heat the circuit board and scatter and separate the circuit board. The auxiliary discrete components include: At least one set of auxiliary discrete rods, one end of each of which is fixedly connected to a separation mechanism transmission shaft, and the separation mechanism transmission shaft is fixedly connected to a separation mechanism driving member; an auxiliary discrete seat mounted at the other end of the auxiliary discrete rod, the auxiliary discrete seat being used to knock the circuit board to be separated, and At least one group of auxiliary crushing saw teeth, the auxiliary crushing saw teeth are used for auxiliary crushing processing of the circuit board, and the auxiliary crushing saw teeth are arranged on the auxiliary discrete seat; The metal discrete components include: At least one set of discrete guide rods fixedly mounted on the transmission shaft of the separation mechanism; A discrete guide seat is sleeved on the discrete guide rod, the discrete guide seat is slidably connected to the discrete guide rod, and a discrete protection spring for protecting the discrete guide seat is embedded in the discrete guide seat, and the discrete protection spring is respectively connected to the discrete guide seat and the discrete guide rod; A metal discrete seat, fixedly mounted on the discrete guide seat; At least one group of auxiliary heating elements, which are fixedly mounted on the discrete guide rods and are used for auxiliary heating treatment of discarded circuit boards.

2. The metal recovery device for waste circuit boards according to claim 1, characterized in that: The circuit board preprocessing mechanism comprises: The pre-treatment seat is fixedly installed in the main housing; The pre-processing driving member is fixedly installed in the driving seat, and the output end of the pre-processing driving member is fixedly connected with the pre-processing transmission shaft; The gear transmission part is fixedly installed on the end of the pre-treatment transmission shaft.

3. The metal recovery device for waste circuit boards according to claim 2, characterized in that: The gear transmission part comprises: The main bevel gear is fixedly connected to the pre-processing transmission shaft; A secondary bevel gear is arranged on one side of the main bevel gear, and the main bevel gear and the secondary bevel gear are meshed and driven.

4. The metal recovery device for waste circuit boards according to claim 3, characterized in that: The circuit board preprocessing mechanism also includes: The swing grinding part is installed in the pre-treatment seat and is used for grinding pre-treatment of the circuit board; A pre-processing transmission part connected to the swing grinding part, wherein the pre-processing transmission part is fixedly connected to the auxiliary bevel gear.

5. The metal recovery device for waste circuit boards according to claim 4, characterized in that: The pre-processing transmission unit comprises: Pre-process the transmission seat and fix it to the auxiliary bevel gear; A pretreatment sleeve seat is sleeved on the pretreatment transmission seat, and a plurality of sets of sleeve seat protection members are arranged on one side of the pretreatment sleeve seat close to the pretreatment transmission seat, and the sleeve seat protection members are used to protect the pretreatment sleeve seat.

6. The metal recovery device for waste circuit boards according to claim 5, characterized in that: The oscillating grinding section comprises: The grinding drive is fixedly mounted on the pretreatment sleeve; A swiveling milling seat fixedly connected to a milling drive.

7. The metal recovery device for waste circuit boards according to claim 6, characterized in that: The swing grinding seat is provided with a plurality of groups of auxiliary grinding parts for assisting the swing grinding seat in working.

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