Ingot silicon core cutting device and cutting method thereof

Abstract

The present invention discloses an ingot silicon core cutting device and a cutting method thereof, which belong to the technical field of ingot silicon core processing. It aims at solving the problems of poor positioning effect and difficulty in taking and placing the ingot silicon core during the cutting process of the ingot silicon core. The device comprises a supporting plate, and the supporting plate further comprises a support frame, which is fixed to the side wall of the bottom end of the supporting plate. Two symmetrically distributed brackets are fixed to the side wall of the top end of the supporting plate. A cylinder is fixed to the side wall of the top end of the bracket. A controller is fixed to the side wall of the top end of the supporting plate. The controller is electrically connected to the two cylinders, and a cross-cutting knife is fixed to the output end of the cylinder. The present invention can not only play a preliminary positioning role for the ingot silicon core through the setting of the grabbing component, but also can effectively cooperate with the positioning component to complete the two-stage positioning effect of the ingot silicon core, greatly improve the stability of the ingot silicon core before cutting, and effectively prevent the poor cutting effect caused by the shaking of the ingot silicon core.

Description

Technical Field

[0001] The invention belongs to the technical field of ingot silicon core processing, and particularly relates to an ingot silicon core cutting device and a cutting method thereof. Background Art

[0002] The process of pouring molten steel into an ingot mold through a steel ladle and condensing it into an ingot, also known as mold casting, is the last step in steelmaking. Qualified molten steel produced by the steelmaking furnace must be cast into ingots or billets of a certain cross-sectional shape and size before it can be plastically processed to obtain steel for various purposes. Ingot casting includes a series of processes from tapping the steelmaking furnace (or the end of refining outside the furnace) to demolding the ingot and sending it to the soaking furnace in the primary rolling mill, namely, pre-pouring preparation, pouring, demolding, ingot finishing or hot delivery, etc. Silicon is a very important semiconductor material in daily life. It is widely used in the electronics industry, for example: various semiconductors and photovoltaic devices; therefore, its cutting process is very important. In the process of cutting the silicon rod, a clamping device is needed to clamp the silicon rod, and then the silicon rod is cut by wire cutting technology to form the target product.

[0003] At present, the ingot silicon core cutting device needs to position the ingot silicon core before cutting, but the existing ingot silicon core cutting device has poor positioning effect on the ingot silicon core, which easily causes position displacement during the cutting of the ingot silicon core, resulting in a low qualified rate of the ingot silicon core after cutting, requiring rework, low in inventiveness, and difficulty in taking and placing the ingot silicon core, making it difficult for staff to operate.

[0004] Therefore, a device and method for cutting an ingot silicon core are needed to solve the problems in the prior art of poor positioning during the cutting process of the ingot silicon core and difficulty in taking and placing the ingot silicon core.

[0005] Summary of the invention

[0006] The object of the present invention is to provide an ingot silicon core cutting device and a cutting method thereof to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for cutting silicon cores of ingots and a cutting method thereof, comprising a supporting plate, the supporting plate also comprising

[0008] The support frame is fixed to the side wall of the bottom end of the supporting plate, and two symmetrically distributed brackets are fixed to the top side wall of the supporting plate, a cylinder is fixed to the top side wall of the bracket, a controller is fixed to the top side wall of the supporting plate, and the controller is electrically connected to the two cylinders. A cross-cutting knife is fixed to the output end of the cylinder, and a mounting frame is fixed to the top side wall of the supporting plate, and a grabbing assembly is arranged inside the mounting frame. The top side wall of the supporting plate is slidably connected to an additional frame, and a positioning assembly compatible with the grabbing assembly is arranged inside the additional frame, and two symmetrically distributed bearing seats are fixed to the bottom side wall of the supporting plate, and a moving assembly compatible with the positioning assembly is arranged on one side of the bearing seat.

[0009] It should be noted that the grabbing component includes

[0010] The mounting plate is provided with two mounting plates, and the two mounting plates are symmetrically distributed and fixed to the outer side walls of the mounting frame. Two symmetrically distributed telescopic rods are fixed to the adjacent side walls of the two mounting plates. A clamping ring is fixed to the side wall of the telescopic rod away from the mounting plate, and an extrusion block is fixed to the side wall of the clamping ring close to the mounting frame. The side wall of the extrusion block away from the mounting frame is set in a smooth arc surface. The clamping ring is slidably connected to the inner side of the mounting frame, and a spring is sleeved on the outer surface of the telescopic rod, one end of the spring is fixed to the mounting plate, and the other end of the spring is fixed to the clamping ring.

[0011] It is further worth mentioning that a slider a is fixed to the top and bottom side walls of the clamping ring, a plurality of symmetrically distributed slide grooves a are provided on the inner side wall of the installation frame, the slider a is slidably connected to the inside of the slide groove a, and a bearing groove is provided on the inner side wall of the installation frame, and the central axis of the bearing groove is collinear with the central axis of the clamping ring.

[0012] It should be further explained that the positioning component includes

[0013] A bidirectional threaded rod is rotatably connected to the inner side wall of the installation frame, a handle is coaxially fixed to one end of the bidirectional threaded rod, and two symmetrically distributed positioning rings are slidably connected to the inner side wall of the installation frame. A threaded sleeve is fixed to the top side wall of the positioning ring, and the threaded sleeve is threadedly connected to the external thread of the bidirectional threaded rod.

[0014] As a preferred embodiment, a slider b is fixed to the side wall of the bottom end of the positioning ring, and two symmetrically distributed sliding grooves b are opened on the inner side wall of the bottom end of the installation frame. The slider b is slidably connected to the inside of the sliding groove b, and the adjacent side walls of the two positioning rings are fixed with anti-slip rings.

[0015] As a preferred embodiment, the moving component includes

[0016] A screw rod is connected to the two bearing seats for common rotation, a rotating wheel is coaxially fixed to one end of the screw rod, a through groove is provided on the top side wall of the supporting plate, a wire sleeve is slidably connected inside the through groove, and a side wall of the wire sleeve is fixed to the bottom side wall of the installation frame.

[0017] As a preferred embodiment, two symmetrically distributed guide blocks are fixed to the bottom side wall of the installation frame, and two symmetrically distributed guide grooves are opened on the top side wall of the supporting plate. The guide blocks are slidingly connected to the inside of the guide grooves, and the opening length value of the guide grooves is consistent with the opening length value of the through grooves.

[0018] As a preferred embodiment, a sliding block is fixed to the side wall of the bottom end of the cross-cutting knife, and two symmetrically distributed transverse grooves are provided on the side wall of the top end of the supporting plate, and the transverse grooves are connected to the guide groove and the through groove.

[0019] A method for cutting an ingot silicon core is provided. The method is based on the above-mentioned ingot silicon core cutting device and comprises the following steps:

[0020] S1. Placing the ingot silicon core: Before the ingot silicon core is cut and processed, the ingot silicon core is moved into the mounting frame toward the carrier frame until the end of the ingot silicon core is aligned with the placement slot. The ingot silicon core extrusion block generates an extrusion transmission to drive the clamping ring to perform preliminary positioning of the ingot silicon core.

[0021] S2. Positioning the ingot silicon core: Positioning the ingot silicon core that has been preliminarily positioned in step S. First, by rotating the handle, the positioning ring moves toward the ingot silicon core until the positioning ring is in close contact with the outer surface of the ingot silicon core, thereby completing the positioning of the ingot silicon core by the positioning ring before cutting.

[0022] S3, cutting the ingot silicon core: After the positioning in step S is completed, the ingot silicon core is cut. The controller sends a work instruction to the two cylinders, causing the two cylinders to drive synchronously after receiving the instruction, driving the crosscutting knife to move toward the ingot silicon core until the two crosscutting knives meet and contact, thus completing the cutting process of the ingot silicon core.

[0023] S4. Moving the truncated ingot silicon core: The truncated ingot silicon core is moved by rotating the rotating wheel to operate the screw rod, which is then driven by the screw rod and the screw sleeve to drive the mounting frame to move horizontally, so that the ingot silicon core positioned in step S is moved until the ingot silicon core is moved to a position that is convenient for removal.

[0024] S5. Take the ingot silicon core: After the ingot silicon core is moved in step S, the positioning ring is moved away from the ingot silicon core workpiece through the reverse transfer handle, thereby releasing the positioning effect on the ingot silicon core, and the ingot silicon core after the limit is released can be manually taken.

[0025] Compared with the prior art, the ingot silicon core cutting device and cutting method provided by the present invention have at least the following beneficial effects:

[0026] (1) Through the setting of the grabbing component, it can not only play the role of preliminary positioning of the ingot silicon core, but also effectively cooperate with the positioning component to complete the two-stage positioning effect of the ingot silicon core, greatly improving the stability of the ingot silicon core before cutting, and effectively preventing the poor cutting effect caused by the shaking of the ingot silicon core.

[0027] (2) The positioning ring is driven by the positioning component to clamp and position the outer surface of the ingot silicon core, which can complete the positioning of the ingot silicon core in a short time, more efficiently and stably, thereby effectively improving the cutting effect during the cutting process of the ingot silicon core, and avoiding the situation where the ingot silicon core is damaged due to position displacement or cutting position deviation when the ingot silicon core is cut.

[0028] (3) Through the setting of the moving component, the cut ingot silicon core can be effectively moved, which makes it more convenient for the staff to take and place the ingot silicon core. It is more inventive and more convenient to operate. It improves the efficiency of the cutting process of the ingot silicon core to a certain extent, and reduces the interval time between the cutting processes of the ingot silicon core. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a side structural schematic diagram of the present invention;

[0031] Figure 3 This is a schematic diagram of the bottom-up structure of the present invention;

[0032] Figure 4 for Figure 3 A schematic diagram of the enlarged structure of the middle A area;

[0033] Figure 5 This is a schematic diagram of the explosion structure of the present invention;

[0034] Figure 6 Schematic diagram of the local structure of the present invention

[0035] In the figure: 1. Loading plate; 2. Support frame; 3. Bracket; 4. Cylinder; 5. Controller; 6. Cross-cutting knife; 7. Mounting frame; 8. Grabbing assembly; 81. Mounting plate; 82. Telescopic rod; 83. Clamping ring; 84. Extrusion block; 85. Spring; 9. Mounting frame; 10. Positioning assembly; 101. Bidirectional threaded rod; 102. Handle; 103. Positioning ring; 104. Threaded sleeve; 11. Bearing seat; 12. Moving assembly; 121. Screw; 122. Rotating wheel; 123. Through groove; 124. Threaded sleeve; 13. Slider a; 14. Slide a; 15. Loading groove; 16. Slider b; 17. Slide b; 18. Anti-slip ring; 19. Guide block; 20. Guide groove; 21. Sliding block; 22. Cross groove. DETAILED DESCRIPTION

[0036] The present invention will be further described below with reference to the embodiments.

[0037] See also Figure 1-6 The present invention provides an ingot silicon core cutting device and a cutting method thereof, comprising a carrier plate 1, the carrier plate 1 further comprising a support frame 2, the support frame 2 being fixed to the bottom side wall of the carrier plate 1, the top side wall of the carrier plate 1 being fixed with two symmetrically distributed brackets 3, the top side wall of the bracket 3 being fixed with a cylinder 4, the top side wall of the carrier plate 1 being fixed with a controller 5, the controller 5 being electrically connected to the two cylinders 4, the output end of the cylinder 4 being fixed with a cross-cutting knife 6, the top side wall of the carrier plate 1 being fixed with a mounting frame 7, the mounting frame 7 being provided with a grabbing assembly therein 8. The top side wall of the supporting plate 1 is slidably connected with an additional frame 9, and a positioning component 10 adapted to the grabbing component 8 is arranged inside the additional frame 9. Two symmetrically distributed bearing seats 11 are fixed to the bottom side wall of the supporting plate 1, and a moving component 12 adapted to the positioning component 10 is arranged on one side of the bearing seat 11. The two cylinders 4 are controlled by the controller 5 to be driven synchronously, so that the two cylinders 4 can be driven without time difference, which has a better effect on the cutting processing of the ingot silicon core and avoids the situation of incomplete cutting and rework.

[0038] Further as Figure 1 and Figure 6As shown, it is worth noting that the grabbing assembly 8 includes a mounting plate 81, two mounting plates 81 are provided, and the two mounting plates 81 are symmetrically distributed and fixed to the outer side wall of the mounting frame 7. Two symmetrically distributed telescopic rods 82 are fixed to the adjacent side walls of the two mounting plates 81. A clamping ring 83 is fixed to the side wall of the telescopic rod 82 away from the mounting plate 81. The clamping ring 83 is fixed to the side wall of the mounting frame 9. An extrusion block 84 is fixed to the side wall of the mounting frame 9. The extrusion block 84 is set to a smooth arc surface on the side wall away from the mounting frame 7. The clamping ring 83 is slidably connected to the inner side of the mounting frame 7, and a spring 85 is sleeved on the outer surface of the telescopic rod 82. One end of the spring 85 is fixed to the mounting plate 81, and the other end of the spring 85 is fixed to the clamping ring 83. Through the setting of the grabbing component 8, it can not only play a preliminary positioning role for the ingot silicon core, but also effectively cooperate with the positioning component 10 to complete the two-stage positioning effect of the ingot silicon core, greatly improving the stability of the ingot silicon core before truncation, and effectively preventing the poor truncation effect caused by the shaking of the ingot silicon core.

[0039] Further as Figure 6 As shown, it is worth mentioning that sliders a13 are fixed to the top and bottom side walls of the clamping ring 83, and a plurality of symmetrically distributed slide grooves a14 are provided on the inner side wall of the mounting frame 7. The sliders a13 are slidably connected to the inside of the slide groove a14, and a bearing groove 15 is provided on the inner side wall of the mounting frame 7. The central axis of the bearing groove 15 is collinear with the central axis of the clamping ring 83. The slider a13 slides in the slide groove a14 to guide and limit the clamping ring 83, and the setting of the bearing ring can achieve a bearing effect on the end of the ingot silicon core.

[0040] This solution has the following working process: when the ingot silicon core needs to be cut and processed, the ingot silicon core is first inserted from the installation frame 9 into the supporting frame, and the end of the ingot silicon core is squeezed and transmitted with the squeezing block 84, so that the clamping ring 83 is forced to move in the direction away from the ingot silicon core. At this time, the spring 85 is in a compressed state, and the elastic effect of the spring 85 is used to ensure that the clamping ring 83 is always in a fit state with the outer surface of the ingot silicon core until the end of the ingot silicon core contacts the supporting groove 15, thereby completing the preliminary positioning of the ingot silicon core, and by turning the handle 102, the bidirectional threaded rod 101 rotates synchronously, and the threaded transmission effect between the bidirectional threaded rod 101 and the threaded sleeve 104 is used to cause the positioning ring 103 to move closer to the ingot silicon core after being forced, driving the anti-slip ring 18 to move synchronously until the anti-slip ring 18 is in contact with the ingot silicon core. The outer sides of the cores are in contact, thereby completing the positioning of the ingot silicon core. The controller 5 is sensed and controlled, and the controller 5 sends a control instruction to the cylinder 4, which is driven by the cylinder 4 to make the cross-cutting knife 6 move synchronously until the two cross-cutting knives 6 come into contact, thereby completing the truncation processing of the ingot silicon core. By rotating the rotating wheel 122, the screw rod 121 is rotated synchronously, and the transmission effect between the screw rod 121 and the wire sleeve 124 is utilized to cause the wire sleeve 124 to move along the through groove 123, driving the installation frame 9 to move synchronously, so that the truncated ingot silicon core is moved synchronously until the ingot silicon core is moved to a position convenient for the staff to pick up. By rotating the handle 102 again, the bidirectional threaded rod 101 is rotated synchronously until the positioning ring 103 releases the limiting effect on the ingot silicon core, and the truncated ingot silicon core can be manually picked up.

[0041] According to the above working process, it can be known that: through the setting of the grabbing component 8, it can not only play the role of preliminary positioning of the ingot silicon core, but also can effectively cooperate with the positioning component 10 to complete the two-stage positioning effect of the ingot silicon core, greatly improving the stability of the ingot silicon core before the truncation process, and effectively preventing the poor truncation effect caused by the shaking of the ingot silicon core, and driving the positioning ring 103 to clamp and position the outer surface of the ingot silicon core through the positioning component 10, which can complete the positioning of the ingot silicon core in a short time, more efficiently and stably, thereby effectively improving the truncation effect during the truncation process of the ingot silicon core, avoiding the situation where the ingot silicon core is offset and damaged or the truncation position deviation occurs when the ingot silicon core is truncation, and through the setting of the moving component 12, the truncation of the ingot silicon core can be effectively moved, which is more convenient for the staff to take and place the ingot silicon core, more inventive, and more convenient to operate, to a certain extent. The efficiency of the truncation process of the ingot silicon core is improved, and the interval time between the truncation of the ingot silicon core is shortened.

[0042] Further as Figure 2As shown, it is worth mentioning that the positioning component 10 includes a bidirectional threaded rod 101, which is rotatably connected to the inner side wall of the installation frame 9, and a handle 102 is coaxially fixed to one end of the bidirectional threaded rod 101. The inner side wall of the installation frame 9 is slidably connected to two symmetrically distributed positioning rings 103, and a threaded sleeve 104 is fixed to the top side wall of the positioning ring 103. The threaded sleeve 104 is threadedly connected to the external thread of the bidirectional threaded rod 101. The positioning ring 103 is driven by the positioning component 10 to clamp and position the outer surface of the ingot silicon core. The positioning of the ingot silicon core can be completed in a short time, which is more efficient and stable, thereby effectively improving the cutting effect during the cutting process of the ingot silicon core, and avoiding the situation where the ingot silicon core is offset when the ingot silicon core is cut, causing damage or cutting position deviation.

[0043] Further as Figure 2 As shown, it is worth mentioning that a slider b16 is fixed to the side wall of the bottom end of the positioning ring 103, and two symmetrically distributed sliding grooves b17 are provided on the inner side wall of the bottom end of the mounting frame 9. The slider b16 is slidably connected to the inside of the sliding groove b17, and the adjacent side walls of the two positioning rings 103 are fixed with an anti-slip ring 18. By sliding the slider b16 in the sliding groove b17, it can guide the positioning ring 103, improve the stability of the positioning ring 103 during movement, and make the positioning ring 103 more smooth when moving.

[0044] Further as Figure 3 As shown, it is worth mentioning that the moving component 12 includes a screw rod 121, which is connected to the two bearing seats 11 for common rotation. A rotating wheel 122 is coaxially fixed to one end of the screw rod 121. A through groove 123 is provided on the top side wall of the supporting plate 1. A wire sleeve 124 is slidably connected to the inside of the through groove 123. The side wall of the wire sleeve 124 is fixed to the bottom side wall of the mounting frame 9. Through the setting of the moving component 12, the truncated ingot silicon core can be effectively moved, which is more convenient for the staff to take and place the ingot silicon core. It is more inventive and more convenient to operate. It improves the efficiency of the ingot silicon core truncation processing to a certain extent, and reduces the interval time in the ingot silicon core truncation processing.

[0045] Further as Figure 2 and Figure 5 As shown, it is worth mentioning that two symmetrically distributed guide blocks 19 are fixed to the bottom side wall of the installation frame 9, and two symmetrically distributed guide grooves 20 are opened on the top side wall of the carrier plate 1. The guide blocks 19 are slidably connected to the inside of the guide grooves 20. The opening length value of the guide grooves 20 is consistent with the opening length value of the through grooves 123. By sliding the guide blocks 19 in the guide grooves 20, it can play a guiding and limiting role for the installation frame 9, and greatly improve the stability of the installation frame 9 during movement, thereby avoiding the situation where the installation frame 9 is stuck due to movement.

[0046] Further as Figure 5 As shown, it is worth mentioning that a sliding block 21 is fixed to the bottom side wall of the cross-cutting knife 6, and two symmetrically distributed transverse grooves 22 are provided on the top side wall of the supporting plate 1. The transverse grooves 22 are connected to the guide grooves 20 and the through grooves 123. By sliding the sliding block 21 in the transverse grooves 22, it can not only guide and limit the cross-cutting knife 6, but also effectively improve the stability of the cross-cutting knife 6 during movement.

[0047] A method for cutting an ingot silicon core and a method for cutting an ingot silicon core are based on the above-mentioned ingot silicon core cutting device, and include the following steps:

[0048] S1. Placing the ingot silicon core: Before the ingot silicon core is cut and processed, the ingot silicon core is moved from the mounting frame 9 to the supporting frame until the end of the ingot silicon core is aligned with the placement slot. The ingot silicon core squeezing block 84 is then used to squeeze and drive the clamping ring 83 to perform preliminary positioning of the ingot silicon core.

[0049] S2. Positioning the ingot silicon core: The ingot silicon core that has been preliminarily positioned in step S1 is positioned. First, the handle 102 is rotated to move the positioning ring 103 toward the ingot silicon core until the positioning ring 103 is in close contact with the outer surface of the ingot silicon core, thereby completing the positioning of the ingot silicon core by the positioning ring 103 before cutting.

[0050] S3, cutting the ingot silicon core: After the positioning in step S2 is completed, the ingot silicon core is cut. The controller 5 sends a work instruction to the two cylinders 4, so that the two cylinders 4 are driven synchronously after receiving the instruction, driving the crosscutting knife 6 to move toward the ingot silicon core until the two crosscutting knives 6 are in contact with each other, thus completing the cutting process of the ingot silicon core.

[0051] S4. Moving the truncated ingot silicon core: The truncated ingot silicon core in step S3 is moved by rotating the rotating wheel 122 to operate the screw rod 121. The screw rod 121 and the wire sleeve 124 transmit the power, driving the mounting frame 9 to move horizontally, so that the ingot silicon core positioned in step S2 is moved until the ingot silicon core is moved to a position convenient for removal.

[0052] S5. Take the ingot silicon core: After the ingot silicon core is moved in step S4, the positioning ring 103 is moved away from the ingot silicon core workpiece through the reverse transfer handle 102, thereby releasing the positioning effect on the ingot silicon core, and the ingot silicon core after the limit is released can be manually taken.

[0053] In summary: by sliding the slider b16 in the slide groove b17, it can guide the positioning ring 103, improve the stability of the positioning ring 103 when moving, and make the positioning ring 103 smoother when moving. By sliding the guide block 19 in the guide groove 20, it can guide and limit the installation frame 9, and greatly improve the stability of the installation frame 9 when moving, avoiding the situation where the installation frame 9 is stuck due to movement. By sliding the sliding block 21 in the transverse groove 22, it can not only guide and limit the cross-cutting knife 6, but also effectively improve the stability of the cross-cutting knife 6 when moving.

[0054] Both the cylinder and the controller can be purchased on the market. Both the cylinder and the controller are equipped with a power supply. They are mature technologies in this field and have been fully disclosed, so they will not be repeated in the specification.

Claims

1. A device for cutting silicon cores of ingots, comprising a supporting plate (1), characterized in that: The carrier plate (1) further includes A support frame (2), wherein the support frame (2) is fixed to the bottom side wall of the carrier plate (1), two symmetrically distributed brackets (3) are fixed to the top side wall of the carrier plate (1), a cylinder (4) is fixed to the top side wall of the bracket (3), a controller (5) is fixed to the top side wall of the carrier plate (1), the controller (5) is electrically connected to the two cylinders (4), a cross-cutting knife (6) is fixed to the output end of the cylinder (4), a mounting frame (7) is fixed to the top side wall of the carrier plate (1), a grabbing assembly (8) is arranged inside the mounting frame (7), an additional frame (9) is slidably connected to the top side wall of the carrier plate (1), a positioning assembly (10) adapted to the grabbing assembly (8) is arranged inside the additional frame (9), two symmetrically distributed bearing seats (11) are fixed to the bottom side wall of the carrier plate (1), and a moving assembly (12) adapted to the positioning assembly (10) is arranged on one side of the bearing seat (11); The grabbing assembly (8) comprises A mounting plate (81), wherein two mounting plates (81) are provided, and the two mounting plates (81) are symmetrically distributed and fixed to the outer side wall of the mounting frame (7), and two symmetrically distributed telescopic rods (82) are fixed to the adjacent side walls of the two mounting plates (81), and a clamping ring (83) is fixed to the side wall of the telescopic rod (82) away from the mounting plate (81), and an extrusion block (84) is fixed to the side wall of the clamping ring (83) close to the mounting frame (9), and the side wall of the extrusion block (84) away from the mounting frame (7) is set in a smooth arc surface, and the clamping ring (83) is slidably connected to the inner side of the mounting frame (7), and a spring (85) is sleeved on the outer surface of the telescopic rod (82), one end of the spring (85) is fixed to the mounting plate (81), and the other end of the spring (85) is fixed to the clamping ring (83); The top and bottom side walls of the clamping ring (83) are both fixed with a slider a (13), the inner side wall of the installation frame (7) is provided with a plurality of symmetrically distributed sliding grooves a (14), the slider a (13) is slidably connected to the inside of the sliding grooves a (14), the inner side wall of the installation frame (7) is provided with a bearing groove (15), and the central axis of the bearing groove (15) is collinear with the central axis of the clamping ring (83); The positioning assembly (10) includes A bidirectional threaded rod (101), the bidirectional threaded rod (101) is rotatably connected to the inner side wall of the mounting frame (9), a handle (102) is coaxially fixed to one end of the bidirectional threaded rod (101), the inner side wall of the mounting frame (9) is slidably connected to two symmetrically distributed positioning rings (103), a threaded sleeve (104) is fixed to the top side wall of the positioning ring (103), and the threaded sleeve (104) is threadedly connected to the external thread of the bidirectional threaded rod (101); A slider b (16) is fixed to the side wall of the bottom end of the positioning ring (103), and two symmetrically distributed sliding grooves b (17) are provided on the inner side wall of the bottom end of the mounting frame (9). The slider b (16) is slidably connected to the inside of the sliding grooves b (17), and an anti-slip ring (18) is fixed to the adjacent side walls of the two positioning rings (103); The mobile assembly (12) includes A screw rod (121), the screw rod (121) is connected to the inside of the two bearing seats (11) for common rotation, a rotating wheel (122) is coaxially fixed to one end of the screw rod (121), a through groove (123) is provided on the top side wall of the bearing plate (1), a wire sleeve (124) is slidably connected inside the through groove (123), and a side wall of the wire sleeve (124) is fixed to the bottom side wall of the mounting frame (9); Two symmetrically distributed guide blocks (19) are fixed to the bottom side wall of the mounting frame (9), and two symmetrically distributed guide grooves (20) are opened on the top side wall of the carrier plate (1). The guide blocks (19) are slidably connected to the inside of the guide grooves (20), and the opening length of the guide grooves (20) is consistent with the opening length of the through groove (123); A sliding block (21) is fixed to the bottom side wall of the cross-cutting knife (6), and two symmetrically distributed transverse grooves (22) are provided on the top side wall of the supporting plate (1). The transverse grooves (22) are connected to the guide groove (20) and the through groove (123).

2. A cutting method for the ingot silicon core cutting device according to claim 1, characterized in that: The ingot silicon core cutting method is based on the above-mentioned ingot silicon core cutting device and includes the following steps: S1. Placing the ingot silicon core: before the ingot silicon core is cut and processed, the ingot silicon core mounting frame (9) is moved toward the bearing frame until the end of the ingot silicon core is aligned with the placement groove, and the ingot silicon core extrusion block (84) is driven by the extrusion transmission to drive the clamping ring (83) to perform preliminary positioning of the ingot silicon core; S2. Positioning the ingot silicon core: Positioning the ingot silicon core that has been preliminarily positioned in step S1. First, by rotating the handle (102), the positioning ring (103) moves toward the ingot silicon core until the positioning ring (103) is in close contact with the outer surface of the ingot silicon core, thereby completing the positioning of the ingot silicon core by the positioning ring (103) before cutting. S3, cutting the ingot silicon core: the ingot silicon core after positioning in step S2 is cut off, and the controller (5) sends a work instruction to the two cylinders (4), so that the two cylinders (4) are driven synchronously after receiving the instruction, and drive the cross-cutting knife (6) to move toward the ingot silicon core until the two cross-cutting knives (6) are in contact with each other, thus completing the cutting process of the ingot silicon core; S4. Moving the truncated ingot silicon core: The truncated ingot silicon core is moved by rotating the rotating wheel (122) to operate the screw rod (121), which is then driven by the screw rod (121) and the wire sleeve (124) to drive the mounting frame (9) to move horizontally, so that the ingot silicon core positioned in step S2 is moved until the ingot silicon core is moved to a position that is convenient for taking; S5. Take the ingot silicon core: After the ingot silicon core is moved in step S4, the positioning ring (103) is moved away from the ingot silicon core workpiece through the reverse transfer handle (102), thereby releasing the positioning effect on the ingot silicon core, and the ingot silicon core after the limit is released can be manually taken.

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