Display device

Abstract

A display device includes: a display panel for reproducing an image or video; a guide panel disposed on the back of the display panel; a printed circuit board mounted on the guide panel and electrically connected to the display panel; and a chip on film (COF) having one side electrically connected to the display panel and the other side electrically connected to the printed circuit board, wherein a portion of the chip on film is bent to surround the guide panel, wherein, in the guide panel, a buffer for alleviating an impact applied to the chip on film is formed in a portion surrounded by the chip on film. In the display device according to the present disclosure, a plurality of buffer bars are arranged to be spaced apart from each other in the vertical direction of the guide panel, so that when the guide panel moves in the vertical direction due to an external impact and collides with the chip on film, the buffer bar can be elastically deformed to suppress the impact applied to the chip on film.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly, to a display device having a structure that effectively copes with external impact. Background Art

[0002] The contents described in this background technology section merely provide background information about the present disclosure and do not constitute prior art.

[0003] As we enter the mature information age, display devices that visually express electrical information signals have been rapidly developed. In response to this, various display devices with excellent performance, thinness, lightness, and low power consumption have been developed.

[0004] Display devices include liquid crystal display devices (LCD), quantum dot (QD) display devices, field emission display devices (FED), electrowetting display devices (EWD) and organic light emitting display devices (OLED), etc.

[0005] The display device is miniaturized so that the device can be carried by the user. The display device has been developed to be mounted on a movable device such as a vehicle. Therefore, the user can use the display device on the vehicle more conveniently. Summary of the invention

[0006] When the display device is mounted on a movable device such as a vehicle, a shock received from the outside due to movement may be transmitted to the display device.

[0007] The display device may be deformed due to external impact, or in severe cases, may be damaged due to external impact. When the damage is severe, fragments of the display device may injure a user on the vehicle.

[0008] Even if such a display device is not damaged when the display device receives an external impact, malfunction, failure, etc. of the display device may occur due to the external impact.

[0009] Particularly, in the case of a display device having a slim structure or a display device having a curved flexible structure, the influence of the external impact may be greater.

[0010] The display device may have a chip on film (COF). A driving device for driving the display device may be embedded in the chip on film. The chip on film may be made of a thin flexible material. Therefore, the chip on film very effectively increases the convenience of assembly and reduces the space occupied by parts.

[0011] The chip on film may be easily subjected to external impact because it is formed to be thin. Due to such external impact, the chip on film may be damaged. Therefore, it is necessary to develop a technology that can suppress damage to the chip on film due to external impact.

[0012] Therefore, an object of the present disclosure is to provide a display device having a structure that can effectively cope with external impact.

[0013] Furthermore, an object of the present disclosure is to provide a display device having a structure that can suppress damage of a chip on film due to an external impact.

[0014] Furthermore, an object of the present disclosure is to provide a display device having a buffer capable of suppressing an impact directly applied to a chip-on-film by alleviating an external impact applied to the chip-on-film.

[0015] The purpose of the present disclosure is not limited to the above-mentioned purpose. Other unmentioned purposes and advantages of the present disclosure can be understood through the following description and can be more clearly understood through the embodiments of the present disclosure. In addition, it is easy to understand that the purposes and advantages of the present disclosure can be achieved using the means shown in the claims and their combinations.

[0016] The display device may include a display panel, a guide panel, a printed circuit board, and a chip on film (COF).

[0017] An image or video may be reproduced on the display panel. A guide panel may be disposed at the back of the display panel. A printed circuit board may be mounted on the guide panel and electrically connected to the display panel.

[0018] One side of the chip on film may be electrically connected to the display panel, and the other side thereof may be electrically connected to the printed circuit board. The chip on film may be disposed such that a portion thereof is bent to surround the guide panel.

[0019] The display device may further include a cover glass, a first adhesive layer, a touch sensor, a second adhesive layer, a back plate, and a metal plate.

[0020] The cover glass may be disposed in front of the display panel to protect the display panel. The touch sensor may be disposed at the back of the cover glass and in front of the display panel, and may recognize a user's touch input.

[0021] The first adhesive layer may be disposed between the cover glass and the touch sensor. The first adhesive layer may bond the touch sensor to the cover glass because one side of the first adhesive layer is bonded to the cover glass and the other side thereof is bonded to the touch sensor.

[0022] The second adhesive layer may be disposed between the touch sensor and the display panel. The second adhesive layer may adhere the touch sensor to the display panel because one surface thereof is adhered to the touch sensor and the other surface thereof is adhered to the display panel.

[0023] The back plate may be disposed at the back of the display panel. The back plate may be attached to the back of the display panel to suppress the display panel from being bent and damaged.

[0024] The metal plate may be disposed at the back of the back plate and in front of the guide panel. The metal plate may be placed in contact with the back of the back plate and may be used as a heat sink for cooling the display panel by radiating heat generated by the display panel to the outside.

[0025] The chip on film may be disposed so that a portion thereof is bent to surround the lower end of the guide panel. In this regard, in the guide panel, a buffer for alleviating an impact applied to the chip on film is formed in a portion of the lower end of the guide panel surrounded by the chip on film.

[0026] The chip on film may include a plurality of chips on film, and the plurality of chips on film may be disposed at positions spaced apart from each other at the bottom of the guide panel. The buffer may include a plurality of buffers disposed at an end of the guide panel, the number of which corresponds to the number of the chips on film.

[0027] The buffers may be disposed at positions of the bottom of the guide panel spaced apart from each other, and each buffer may be disposed at a position corresponding to each chip-on-film.

[0028] The buffer may include a buffer space and a buffer bar. The buffer space may be defined at one end of the guide panel. The buffer bar may include a plurality of buffer bars spaced apart from each other in the buffer space, and the buffer bar may be elastically deformed when impacted.

[0029] In addition, in the display device according to the present disclosure, a plurality of buffer bars are arranged to be spaced apart from each other in the vertical direction of the guide panel, so that when the guide panel moves in the vertical direction due to an external impact and collides with the chip on the film, the buffer bars can be elastically deformed to suppress the impact applied to the chip on the film. Therefore, even when the guide panel moves due to an external impact and collides with the chip on the film, since the impact applied to the chip on the film is mitigated by the buffer bars, damage to the chip on the film can be effectively suppressed.

[0030] In addition, in the display device according to the present disclosure, the node may be formed such that its cross-sectional area decreases toward the central portion. Due to such a structure, by preventing a sudden step from being formed at the boundary between the node and the body, damage to the buffer bar due to the sudden step may be effectively suppressed.

[0031] In addition, in the display device according to the present disclosure, the impact force occurring on the chip on film when the guide panel collides with the chip on film is mitigated by the deformation and movement of the buffer bar, so that damage to the chip on film due to external impact can be significantly suppressed.

[0032] In addition, in the display device according to the present disclosure, the driving chip is arranged on a linear portion away from the lower end of the guide panel, rather than on a curved portion, so that even when the guide panel and the chip on the film contact each other due to external impact, contact between the guide panel and the driving chip is avoided, thereby effectively suppressing damage to the driving chip.

[0033] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art through the following description.

[0034] The objects, solutions and effects of the present disclosure described above do not specify the essential features of the claims. Therefore, the scope of the claims is not limited by the objects, solutions and effects disclosed above. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is an exploded perspective view showing a display device according to an embodiment.

[0036] Figure 2 is a rear perspective view showing a display device according to an embodiment.

[0037] Figure 3 It is a diagram showing a comparative example for comparison with the display device of the present disclosure.

[0038] Figure 4 is a partial cross-sectional view showing a comparative example for comparison with the display device of the present disclosure.

[0039] Figure 5 is a partial view showing a display device according to an embodiment.

[0040] Figure 6 is a partial cross-sectional view showing a cross section of a buffer bar body in a display device according to an embodiment.

[0041] Figure 7 is a partial cross-sectional view showing a cross section of a node of a buffer bar in a display device according to an embodiment.

[0042] Figure 8 is a diagram illustrating a deformed state of a buffer bar in a display device according to an embodiment.

[0043] Fig. 9 is a side sectional view showing a buffer bar in a display device according to an embodiment. DETAILED DESCRIPTION

[0044] The advantages and features of the present disclosure and how to achieve these advantages and features will become clear through the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but will be implemented in various different forms. Only these embodiments can make the present disclosure complete and are intended to enable ordinary technicians in the technical field to which the present disclosure belongs to fully understand the scope of the present disclosure. The scope of the present disclosure is limited only by the scope of the claims.

[0045] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for illustrating the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. The same reference numerals refer to the same elements herein. In addition, when describing the present disclosure, when it is determined that the detailed description of the relevant known elements may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be omitted. As used herein, the singular forms "one" and "an" are intended to also include plural forms, unless the context clearly states otherwise. It will be further understood that when used in this specification, the terms "include", "comprising" specify the presence of the features, integers, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, operations, elements, components and / or parts thereof.

[0046] When interpreting numerical values, unless otherwise expressly stated, the values ​​are interpreted as including the error range.

[0047] It should be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or there can be one or more intervening elements or layers. In addition, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present. In addition, it should be understood that when a first element or layer is referred to as being "on" or "under" a second element or layer, the first element can be directly disposed on or under the second element, or can be indirectly disposed on or under the second element, with a third element or layer disposed between the first and second elements or layers.

[0048] In addition, as used herein, when a layer, film, region, plate, etc. is disposed "on" or "on top" of another layer, film, region, plate, etc., the former may directly contact the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly "on" or "on top" of another layer, film, region, plate, etc., the former directly contacts the latter and another layer, film, region, plate, etc. is not disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, etc. is disposed "under" or "below" another layer, film, region, plate, etc., the former may directly contact the latter or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly "under" or "below" another layer, film, region, plate, etc., the former directly contacts the latter and another layer, film, region, plate, etc. is not disposed between the former and the latter.

[0049] In descriptions of temporal relationships, for example, a temporal precedent relationship between two events such as "after," "subsequently," "before," etc., another event may occur in between unless "directly after," "directly subsequent," or "directly before" is not indicated.

[0050] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer or part described below may be referred to as a second element, component, region, layer or part.

[0051] Features of various embodiments The various parts of the present disclosure may be combined with each other in part or in whole, and may be technically related to or interoperable with each other. These embodiments may be implemented independently of each other, or may be implemented together in an associated relationship.

[0052] In the description of a temporal relationship, for example, a precedent relationship in time between two events such as "after", "subsequently", "before", another event may occur between them unless "directly after", "directly after" or "directly before" is not indicated. The features of the various embodiments of the present disclosure may be combined in part or in whole with each other, and may be technically related to or interoperable with each other. These embodiments may be implemented independently of each other, or may be implemented together in an associated relationship. For ease of explanation, an element or feature is described with another element or feature as shown in the figure. It should be understood that, in addition to the directions depicted in the figures, spatially relative terms are intended to cover different directions of the device in use or operation. For example, when the device in the accompanying drawings can be flipped, the elements described as "under" or "below" or "below" other elements or features will be oriented as "above" other elements or features. Therefore, the exemplary terms "under" and "below" can cover the directions above and below. The device can be oriented in other ways, for example, rotated 90 degrees or in other orientations, and the spatially relative descriptors used herein should be interpreted accordingly.

[0053] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0054] Figure 1 is an exploded perspective view showing a display device according to an embodiment. Figure 2 is a rear perspective view showing a display device according to an embodiment.

[0055] The display device according to the embodiment may be installed on the cockpit of the vehicle, for example, to provide the driver and passengers of the vehicle with images or videos required for driving. However, the present disclosure may not be limited thereto, and the display device may be used while being carried by the user without being installed in the vehicle. Hereinafter, for example, a display device installed in a vehicle will be described.

[0056] The display device according to the embodiment may include a display panel 100 , a guide panel 200 , a printed circuit board 300 , and a chip on film (COF) 400 .

[0057] An image or video may be reproduced on the display panel 100. The reproduced image or video may be navigation information required for driving, an image captured by a camera mounted on the vehicle, or other various contents required by the driver or passengers.

[0058] The guide panel 200 may be disposed at the back of the display panel 100. The guide panel 200 may be disposed at the rear portion of the display device. Various parts of the display device including the display panel 100 may be mounted on the guide panel 200. In addition, the guide panel 200 itself may be mounted on the cockpit of the vehicle. To this end, the guide panel 200 may have necessary coupling structures, such as screw holes, etc.

[0059] The printed circuit board 300 may be mounted on the guide panel 200 and may be electrically connected to the display panel 100. The printed circuit board 300 may include a device for communicating with an external device such as a camera and a main controller module of a vehicle, a device for driving the display panel 100 so that the display panel 100 reproduces an image or video, etc., may include a circuit, and may include various other active and passive elements.

[0060] One side of the chip on film 400 may be electrically connected to the display panel 100 and the other side may be electrically connected to the printed circuit board 300. The chip on film 400 may be partially bent to surround the guide panel 200. Figure 1 In the figure, for the sake of clear description, an expanded view of the chip on film 400 in an expanded state is shown.

[0061] The chip on film 400 may be formed in a thin form and may be made of a flexible material so as to be bendable. The chip on film 400 may electrically connect the display panel 100 and the printed circuit board 300 to each other. The chip on film 400 may be provided with various active elements and passive elements, and may be provided with a driving circuit for driving the display panel 100.

[0062] The driving circuit for driving the display panel 100 may be distributed on the printed circuit board 300 and the film chip 400. The film chip 400 may include a driving chip 401, which forms at least a part of the driving circuit of the display panel 100. The film chip 400 may include a plurality of film chips. The film chips 400 may be arranged to be spaced apart from each other.

[0063] The display device according to the embodiment may further include a cover glass 10, a first adhesive layer 20, a touch sensor 30, a second adhesive layer 40, a back plate 50, and a metal plate 60. These components may be formed into a thin profile to manufacture a thin display panel.

[0064] The cover glass 10 may be disposed in front of the display panel 100 to protect the display panel 100. The cover glass 10 may be made of a transparent material so that light irradiated from the cover glass 10 may pass through the cover glass 10.

[0065] The touch sensor 30 may be disposed at the back of the cover glass 10 and at the front of the display panel 100, and may recognize a touch input of a user. The touch sensor 30 may recognize the input of the user in a capacitive manner, for example.

[0066] When a user inputs information on the cover glass 10 using a hand, a pen, etc., the touch sensor 30 may recognize the user's input and the user may manipulate the display device through the input.

[0067] The first adhesive layer 20 may be disposed between the cover glass 10 and the touch sensor 30. The first adhesive layer 20 may bond the touch sensor 30 to the cover glass 10 because one surface thereof is bonded to the cover glass 10 and the other surface thereof is bonded to the touch sensor 30.

[0068] The second adhesive layer 40 may be disposed between the touch sensor 30 and the display panel 100. The second adhesive layer 40 may adhere the touch sensor 30 to the display panel because one surface thereof is adhered to the touch sensor 30 and the other surface thereof is adhered to the display panel 100.

[0069] The first adhesive layer 20 and the second adhesive layer 40 may be made of a transparent material having good adhesive force, such as an optically clear adhesive (OCA). However, the present disclosure is not limited thereto.

[0070] The back plate 50 may be disposed at the back of the display panel 100. The back plate 50 may be attached to the back of the display panel 100 to suppress the display panel 100 from being bent and damaged. That is, the back plate 50 may serve to enhance the rigidity of the display panel 100.

[0071] The back plate 50 may be formed in a shape of, for example, a film, and may be attached to the display panel 100. However, the present disclosure is not limited thereto.

[0072] The metal plate 60 may be disposed at the back of the back plate 50 and in front of the guide panel 200. The metal plate 60 may be disposed in contact with the back of the back plate 50 and may function as a heat sink for cooling the display panel 100 by radiating heat generated from the display panel 100 to the outside.

[0073] The metal plate 60 may be easily manufactured by sheet metal processing or the like, and may be made of a material having a high heat transfer rate and excellent resistance, such as an aluminum material. However, the present disclosure is not limited thereto.

[0074] Figure 3 It is a diagram showing a comparative example for comparison with the display device of the present disclosure. Figure 3 shows a display device of the present disclosure along with Figure 2 A cross section of a portion of the comparative example taken along the line AA′ in FIG.

[0075] To describe clearly, Figure 3 Illustration of the chip on film 400 is omitted. Figure 4 is a partial cross-sectional view showing a comparative example for comparison with the display device of the present disclosure.

[0076] The printed circuit board 300 may be mounted on the back side of the guide panel 200. The display panel 100 may be disposed in front of the guide panel 200. Therefore, in order for the chip on film 400 to be electrically connected to the printed circuit board 300 and the guide panel 200, both ends of the chip on film 400 must be coupled to the printed circuit board 300 and the guide panel 200, respectively.

[0077] Therefore, the chip on film 400 should extend beyond the back plate 50 and the metal plate 60 between the guide panel 200 and the display panel 100 , and further, should extend beyond the guide panel 200 .

[0078] Due to such a structure, when assembling the display device, Figure 4 As shown, the chip on film 400 may be disposed along the lower end of the guide panel 200 to extend beyond the back plate 50 , the metal plate 60 , and the guide panel 200 .

[0079] From the lower ends of the back plate 50, the metal plate 60 and the guide panel 200, the lower end of the guide panel 200 can be placed at the lowest position. This is because the downward length of the back plate 50 is greater than the length of the metal plate 60 and the guide panel 200.

[0080] Therefore, in the chip on film 400, a portion extending beyond the back plate 50, the metal plate 60 and the guide panel 200 may be bent at a portion corresponding to the lower end of the guide panel 200. In addition, due to this structure, the chip on film 400 may be disposed to protrude from the lower end of the display panel 100.

[0081] The length of the chip on film 400 protruding from the lower end of the display panel 100 , that is, the protruding length is the length from the lower end of the display panel 100 to the lower end of the bent portion of the chip on film 400 .

[0082] The protruding length of the chip on film 400 is the length of the portion exposed from the lower end of the display panel 100. Therefore, when the user views the front of the display panel 100, the portion corresponding to the protruding length enters the user's field of vision, which may reduce the aesthetics of the display device.

[0083] Therefore, in order to enhance the aesthetics of the display device, a portion corresponding to the protruding length of the chip on film 400 is made invisible using black ink or the like on the cover glass 10 that becomes a frame.

[0084] In addition, as the area of ​​the frame increases, the aesthetics of the display device is reduced accordingly, and an unnecessary area of ​​the display device is increased. Therefore, in order to reduce the area of ​​the frame, the protruding length of the chip on film 400 needs to be reduced as much as possible.

[0085] In order to reduce the protruding length of the chip on film 400, the chip on film 400 may be disposed very close to the lower end of the guide panel 200 and bent to extend beyond the guide panel 200. For this reason, the bent portion 410 of the chip on film 400 may be disposed very close to the lower end of the guide panel 200 in the vertical direction.

[0086] Since the bent portion 410 of the chip on film 400 is disposed at a position extremely close to the lower end of the guide panel 200 , the chip on film 400 may be easily affected by the outside.

[0087] Will refer again Figure 3 and Figure 4 In the comparative example, the buffer 210 described below is not formed at the lower end of the guide panel 200. Therefore, in the comparative example, the portion corresponding to the chip-on-film 400 at the lower end of the guide panel 200 can be formed in the shape of a filling plate without the need for Figure 3 The special structure shown.

[0088] In this regard, refer to Figure 4 , the bent portion 410 of the chip on film 400 may be disposed extremely adjacent to the lower end of the guide panel 200 .

[0089] In this structure, when an external impact is applied to the display device during vehicle operation, the guide panel 200 may be moved by the external impact. When the guide panel 200 moves downward, the chip on film 400 disposed extremely close to the lower end of the guide panel 200 may collide with the lower end of the guide panel 200.

[0090] When the lower end of the guide panel 200 collides with the chip on film 400 continuously and repeatedly, the chip on film 400 may be damaged or deformed, and thus, circuits and various elements provided on the chip on film 400 may be damaged.

[0091] Such damage and deformation of the film chip 400 may cause malfunction or operation stop of the display device. Therefore, a structure is needed to prevent the guide panel 200 from being damaged by collision with the film chip 400. Hereinafter, the structure of a display device according to an embodiment having such a structure will be described in detail with reference to the accompanying drawings.

[0092] Figure 5 is a partial view showing a display device according to an embodiment. Figure 5 It is along Figure 2 A view taken along line A-A'. Figure 6 is a partial cross-sectional view showing a cross section of a body 2121 of a buffer bar 212 in a display device according to an embodiment. Figure 7 is a partial cross-sectional view showing a cross section of a node 2122 of a buffer bar 212 in a display device according to an embodiment.

[0093] The chip on film 400 may be disposed such that a portion thereof is bent to surround the lower end of the guide panel 200. In this regard, in the guide panel 200, a buffer 210 for relieving an impact applied to the chip on film 400 may be formed in a portion surrounded by the chip on film 400.

[0094] In this regard, the buffer 210 may be disposed in a portion where the chip on film 400 is bent. Therefore, the bent portion 410 of the chip on film 400 may be disposed adjacent to a lower end of the buffer 210 disposed in the guide panel 200.

[0095] The chip on film 400 may include a plurality of chips on film, and the plurality of chips on film 400 may be disposed at positions spaced apart from each other at the bottom of the guide panel 200. The buffer 210 may be disposed at an end of the guide panel 200, and the number of the buffers 210 may correspond to the number of the chips on film 400.

[0096] The buffers 210 may be disposed at positions spaced apart from each other at the bottom of the guide panel 200. In addition, each buffer 210 may be disposed at a position corresponding to each of the chip-on-film 400.

[0097] The chip on film 400 may include a curved portion 410 and a linear portion 420. The curved portion 410 may be provided at an end of the guide panel 200 and may be formed in a curved shape to surround a portion of the buffer bar 212.

[0098] The bent portion 410 may be disposed below the buffer bar 212. In particular, the lower end of the bent portion 410 may be disposed extremely close to the lower end of the buffer bar 212 to reduce the area of ​​the frame.

[0099] The linear portion 420 may be connected to the curved portion 410. The linear portion 420 may be provided at the bottom of the guide panel 200 in a non-curved form. The linear portion 420 may be provided to overlap the front and rear surfaces of the guide panel 200 at the bottom of the guide panel 200.

[0100] The buffer 210 may include a buffer space 211 and a buffer strip 212. The buffer space 211 may be defined at the end of the guide panel 200. Compared with the above comparative example, the buffer space portion 211 may be defined by removing the lower portion of the guide panel 200. The buffer space 211 may provide a space in which the buffer strip 212 can move when subjected to an external impact.

[0101] The buffer bar 212 may include a plurality of buffer bars, and the plurality of buffer bars 212 may be disposed to be spaced apart from each other in the buffer space 211 and may be elastically deformable when impacted.

[0102] The buffer bar 212 may be formed in a bar shape and may be disposed such that a length direction thereof intersects a vertical direction of the guide panel 200. In this regard, for example, the buffer bar 212 may be integrally formed with the guide panel 200 by injection molding or the like.

[0103] The buffer bar 212 may include a plurality of buffer bars, and the plurality of buffer bars 212 may be disposed to be spaced apart from each other in a vertical direction of the guide panel 200. In this regard, a space where the plurality of buffer bars 212 are spaced apart from each other may define a buffer space 211.

[0104] The plurality of buffer bars 212 are arranged to be spaced apart from each other in the vertical direction of the guide panel 200, so that when the guide panel 200 moves in the vertical direction due to an external impact and collides with the film chip 400, the buffer bars 212 can be elastically deformed to suppress the impact applied to the film chip 400. Therefore, even when the guide panel 200 moves due to an external impact and collides with the film chip 400, since the impact applied to the film chip 400 by the buffer bars 212 is mitigated, damage to the film chip 400 can be effectively suppressed.

[0105] The buffer strip 212 may include a body 2121 and a node 2122. The body 2121 may have a larger cross-sectional area than the node 2122. The cross-sectional area of ​​the node 2122 may be smaller than the cross-sectional area of ​​the body 2121, and the node 2122 may include a plurality of nodes spaced apart in the longitudinal direction of the buffer strip 212.

[0106] Due to this structure, when the guide panel 200 moves as an external impact is applied to the guide panel 200, the buffer bar 212 contacts the chip on film 400. The buffer bar 212 in contact with the chip on film 400 moves within the buffer space 211 due to elastic deformation of the node 2122, so that the impact applied to the chip on film 400 can be effectively suppressed.

[0107] When the guide panel 200 moves as an external impact is applied to the display device, elastic deformation may occur mainly at the node 2122. Therefore, when there is an abrupt step at the boundary between the node 2122 and the body 2121, such a step may become a notch. When the buffer bar 212 is continuously and repeatedly elastically deformed, the buffer bar 212 may be damaged at the notch.

[0108] The node 2122 may be formed such that its cross-sectional area decreases toward the center portion 2122a. Due to this structure, by preventing a sudden step from being formed at the boundary between the node 2122 and the body 2121, damage to the buffer strip 212 at the sudden step may be effectively suppressed.

[0109] Figure 8 2 is a view showing a deformed state of the buffer bar 212 in the display device according to the embodiment. Figure 8 It is along Figure 2 A view taken along line A-A'.

[0110] Figure 8 1 shows that when an external impact is applied to the display device, the guide panel 200 moves, and therefore, the buffer bar 212 and the bent portion 410 of the chip on film 400 contact each other to deform the buffer bar 212. Figure 8 The illustration of the chip on film 400 is omitted.

[0111] Node 2122 may be at least partially elastically deformed by external impact. Figure 8 For example, among the nodes 2122 , the nodes 2122 provided at both edges of the buffer 210 are both deformed due to an external impact.

[0112] However, depending on the magnitude of the external impact applied to the display device, the location where the external impact is applied, and the direction in which the external impact is applied, the deformed shape of the buffer bar 212 , the number of buffer bars 212 to be deformed, etc. may vary.

[0113] In the display device according to the embodiment, when impacted, the buffer bar 212 may be elastically deformed in a direction intersecting its length direction. In addition, the chip on film 400 may be arranged so that at least a portion of the chip on film 400 moves in a direction in which the buffer bar 212 is deformed. Therefore, when the guide panel 200 moves due to an external impact, at least a portion of the buffer bar 212 may be elastically deformed to move in the buffer space 211.

[0114] When an external impact is applied to the display device, the guide panel 200 moves due to the impact. Therefore, the bent portion 410 of the chip on film 400 disposed at a position extremely close to the lower end of the guide panel 200 may contact the lower end of the guide panel 200. At this point, the chip on film 400 and the buffer bar 212 disposed at the lower end of the guide panel 200 may contact each other.

[0115] When impacted, at least some of the plurality of buffer bars 212 may be deformed and move in the buffer space 211 .

[0116] When the chip on film 400 contacts the buffer bar 212 , the buffer bar 212 is pressed by the chip on film 400 , and the node 2122 is elastically deformed by the pressing force. Therefore, the buffer bar 212 can move in the buffer space 211 .

[0117] An impact force occurring on the chip on film 400 when the guide panel 200 collides with the chip on film 400 is mitigated by the deformation and movement of the buffer bar 212. Therefore, damage to the chip on film 400 by an external impact can be significantly suppressed.

[0118] Fig. 9 2 is a side cross-sectional view showing a buffer bar 212 in a display device according to an embodiment. As described above, one side of the chip on film 400 may be coupled to the display panel 100, and the other side thereof may be coupled to the printed circuit board 300 mounted on the back surface of the guide panel 200. The chip on film 400 may be disposed so that the lower end of the bent portion 410 is extremely adjacent to the lower end of the guide panel 200.

[0119] In this regard, in the guide panel 200 , the buffer 210 may be disposed at a position corresponding to a position where the chip on film 400 is disposed.

[0120] In one example, the chip on film 400 may include a driving chip 401 driving the display panel 100. The driving chip 401 may include, for example, an integrated circuit for controlling at least some operations of the display panel 100.

[0121] The driver chip 401 may protrude more from the chip-on-film 400 than other parts of the chip-on-film 400. Due to this protruding structure, the driver chip 401 is not as durable as other components in the chip-on-film 400, and thus may be relatively easily damaged by external impact. Therefore, in order to suppress damage to the driver chip 401 due to external impact, the driver chip 401 needs to be disposed in a safer position to resist external impact.

[0122] Therefore, the driving chip 401 may be mounted on the linear portion 420 and disposed to be spaced apart from the end of the guide panel 200. Damage to the chip on film 400 may mainly occur at a portion where the guide panel 200 applies pressure to the chip on film 400 when the lower end of the guide panel 200 and the chip on film 400 contact each other. Therefore, damage to the chip on film 400 may mainly occur in the curved portion 410.

[0123] In the display device according to the embodiment, the driving chip 401 is arranged on the linear portion 420 away from the lower end of the guide panel 200, and is not arranged on the curved portion 410. Therefore, even when the guide panel 200 and the chip on the film 400 contact each other due to external impact, the contact between the guide panel 200 and the driving chip 401 can be avoided, thereby effectively suppressing damage to the driving chip 401.

[0124] A display device according to an embodiment of the present disclosure can be described as follows.

[0125] One aspect of the present disclosure provides a display device including: a display panel for reproducing an image or video; a guide panel disposed on the back of the display panel; a printed circuit board mounted on the guide panel and electrically connected to the display panel; and a chip on film (COF) having one side electrically connected to the display panel and the other side electrically connected to the printed circuit board, wherein a portion of the chip on film is bent to surround the guide panel, wherein a buffer for reducing impact applied to the chip on film is formed in the portion of the guide panel surrounded by the chip on film.

[0126] In one embodiment, the chip on film includes a plurality of chips on film, and the buffer includes a plurality of buffers disposed at one end of the guide panel, the number of the plurality of buffers corresponding to the number of the chips on film.

[0127] In one embodiment, the buffer includes: a buffer space defined at an end of the guide panel; and a buffer bar including a plurality of buffer bars spaced apart from each other in the buffer space, wherein the buffer bar is elastically deformable when impacted.

[0128] In one embodiment, a buffer strip includes: a main body; and a node, wherein a cross-sectional area of ​​the node is smaller than a cross-sectional area of ​​the main body, wherein the node includes a plurality of nodes spaced apart in a longitudinal direction of the buffer strip.

[0129] In one embodiment, the node is formed such that its cross-sectional area decreases toward the central portion.

[0130] In one embodiment, at least a portion of the node is elastically deformed by an external impact.

[0131] In one embodiment, the chip on film includes: a bent portion provided at an end of the guide panel and formed in a bent shape to surround a portion of the buffer bar; and a linear portion connected to the bent portion.

[0132] In one embodiment, the chip on film includes a driving chip for driving the display panel, and the driving chip is mounted on the linear portion and disposed to be spaced apart from an end portion of the guide panel.

[0133] In one embodiment, when impacted, the buffer strip elastically deforms in a direction intersecting the longitudinal direction, wherein at least a portion of the chip on the film moves along the deformation direction of the buffer strip.

[0134] In one embodiment, when impact occurs, at least some of the plurality of buffer bars are deformed and moved in the buffer space.

[0135] In one embodiment, the display device further includes: a cover glass; a touch sensor disposed on the back of the cover glass and on the front of the display panel, wherein the touch sensor recognizes a user's touch input; a back plate disposed on the back of the display panel; and a metal plate disposed on the back of the back plate and on the front of the guide panel.

[0136] In one embodiment, the display device further includes: a first adhesive layer disposed between the cover glass and the touch sensor; and a second adhesive layer disposed between the touch sensor and the display panel.

[0137] The present disclosure as described above is not limited to the above-mentioned embodiments and drawings. For those skilled in the art of the present disclosure, it is obvious that various substitutions, modifications and changes can be made without departing from the technical concept of the present disclosure. Therefore, the scope of the present disclosure is represented by the attached claims, and any changes or modifications made due to the meaning and scope of the claims and their equivalent concepts should be understood to be included in the scope of the present disclosure.

Claims

1. A display device, comprising: A display panel for reproducing images or videos; A guide panel, disposed at the back of the display panel; a printed circuit board mounted on the guide panel and electrically connected to the display panel; as well as a chip on film having one side electrically connected to the display panel and the other side electrically connected to the printed circuit board, wherein a portion of the chip on film is bent to surround the guide panel, wherein a buffer for alleviating an impact applied to the chip-on-film is formed in a portion of the guide panel surrounded by the chip-on-film, and Wherein, the buffer comprises: a buffer space defined at a distal end of the guide panel; and The buffer strips include a plurality of buffer strips spaced apart from each other in the buffer space, wherein the buffer strips are elastically deformable when impacted.

2. The display device according to claim 1, wherein: The chip-on-film comprises a plurality of chips-on-film, The buffer includes a plurality of buffers disposed at one end of the guide panel, and the number of the plurality of buffers corresponds to the number of the chips on film.

3. The display device according to claim 1, wherein: The buffer strip comprises: the subject; and A node has a cross-sectional area smaller than a cross-sectional area of ​​the body, wherein the node comprises a plurality of nodes spaced apart in a longitudinal direction of the buffer strip.

4. The display device according to claim 3, wherein: The node is formed such that its cross-sectional area decreases toward the central portion.

5. The display device according to claim 3, wherein: At least a portion of the node is elastically deformed by the impact.

6. The display device according to claim 3, wherein: The chip on film comprises: a bent portion provided at an end of the guide panel and formed in a bent shape to surround a portion of the buffer bar; and A linear portion connected to the curved portion.

7. The display device according to claim 6, wherein: The chip on film includes a driving chip for driving the display panel, The driving chip is mounted on the linear portion and is arranged to be spaced apart from an end portion of the guide panel.

8. The display device according to claim 3, wherein: When impacted, the buffer strip elastically deforms in a direction intersecting the longitudinal direction. Wherein, at least a portion of the chip on film moves along the deformation direction of the buffer strip.

9. The display device according to claim 8, wherein: When impact occurs, at least some of the plurality of buffer bars are deformed and moved in the buffer space.

10. The display device according to claim 1, further comprising: Cover glass; A touch sensor is disposed on the back of the cover glass and in front of the display panel, wherein the touch sensor recognizes a touch input of a user; A back plate, disposed on the back of the display panel; and The metal plate is arranged at the back of the back plate and at the front of the guide panel.

11. The display device according to claim 10, further comprising: A first adhesive layer is disposed between the cover glass and the touch sensor; as well as The second adhesive layer is disposed between the touch sensor and the display panel.

Images