Temperature measuring circuit board and its manufacturing method

Abstract

A temperature measuring circuit board includes a substrate layer, connecting lines, temperature measuring lines, conductive pads, and embedded conductors. The substrate layer includes a first slot, a second slot, a third slot, a fourth slot, and a fifth slot. The first, second, and third slots are located on one side of the substrate layer, connecting every two adjacent second slots. The first slot also connects adjacent second and third slots. The fourth slot is located on the other side of the substrate layer, with its bottom recessed to form the fifth slot, which connects to the second slots. The connecting lines are located within the first slots. The embedded conductors are located within the second and fifth slots. The conductive pads are located within the third slot. The connecting lines electrically connect every two adjacent first embedded conductors and also electrically connect adjacent embedded conductors and conductive pads. The temperature measuring lines are located within the fourth slot. Additionally, this application also provides a method for manufacturing the temperature measuring circuit board.

Description

Technical Field

[0001] This application relates to a temperature measuring circuit board and a method for manufacturing the same. Background Technology

[0002] Typically, a temperature sensing circuit board includes temperature sensing lines and conductive pads. The temperature sensing lines are located on the surface of the substrate layer, and the conductive pads are located on the surface of the temperature sensing lines, with the number of conductive pads corresponding to the number of temperature sensing lines. However, to increase the overall sensitivity of the temperature sensing circuit board, multiple temperature sensing lines are required, leading to an increase in the number of conductive pads. This is detrimental to reducing the thickness of the temperature sensing circuit board and improving its flatness. Summary of the Invention

[0003] To address the problems in the background art, this application provides a method for manufacturing a temperature measuring circuit board.

[0004] In addition, this application also provides a temperature measuring circuit board.

[0005] A method for manufacturing a temperature sensing circuit board includes the following steps: providing a substrate, the substrate including a substrate layer, one side of the substrate layer having a plurality of first slots, a plurality of second slots, and a plurality of third slots, the first slots connecting every two adjacent second slots, and the first slots also connecting adjacent second slots and third slots. A connecting line is provided in the first slot, a first embedded conductor is provided in the second slot, and a conductive pad is provided in the third slot, the connecting line electrically connecting every two adjacent first embedded conductors, and the connecting line also electrically connecting adjacent first embedded conductors and conductive pads. A fourth slot is provided on the other side of the substrate layer, the first embedded conductors corresponding to at least a portion of the fourth slot.

[0006] A temperature measuring circuit is provided on the inner periphery of the fourth slot; and a portion of the substrate layer and a portion of the temperature measuring circuit corresponding to the first embedded conductor are removed to form a fifth slot, and a second embedded conductor is provided in the fifth slot, the second embedded conductor being electrically connected to the temperature measuring circuit and the first embedded conductor, to obtain the temperature measuring circuit board.

[0007] Furthermore, the method includes the step of: providing solder resist layers on opposite sides of the substrate layer, wherein the solder resist layers are provided with openings, the solder resist layers cover the temperature measuring circuit, the first embedded conductor and the connecting circuit, and the conductive pad is exposed in the openings.

[0008] Furthermore, the method also includes the step of: providing a protective layer on the conductive pad.

[0009] Further, the substrate further includes a first copper foil layer disposed on a surface of the substrate layer. The method of manufacturing the substrate includes: forming a first photosensitive pattern on the first copper foil layer, the first photosensitive pattern having a plurality of first openings, a plurality of second openings, and a plurality of third openings, the first openings connecting every two adjacent second openings, and the first openings also connecting adjacent second and third openings, with a portion of the first copper foil layer exposed at the bottom of the first, second, and third openings; removing portions of the first copper foil layer corresponding to the first, second, and third openings, such that portions of the substrate layer are exposed at the bottom of the first, second, and third openings respectively; etching the portion of the substrate layer exposed at the first opening to form a first groove; etching the portion of the substrate layer exposed at the second opening to form a second groove; etching the portion of the substrate layer exposed at the third opening to form a third groove; and removing the first photosensitive pattern.

[0010] Furthermore, before the step of "providing solder resist layers on opposite sides of the substrate layer", the method further includes: removing the first copper foil layer.

[0011] Furthermore, the substrate further includes a second copper foil layer disposed on another surface of the substrate layer. The manufacturing method further includes: forming a second photosensitive pattern on the second copper foil layer, the second photosensitive pattern having a fourth opening; removing a portion of the second copper foil layer corresponding to the fourth opening, such that a portion of the substrate layer is exposed at the bottom of the fourth opening; etching the portion of the substrate layer exposed in the fourth opening to form the fourth groove; and removing the second photosensitive pattern.

[0012] Furthermore, after the step of "setting a temperature measuring line on the inner periphery of the fourth slot", the method further includes: setting a third photosensitive pattern on the second copper foil layer, the third photosensitive pattern having a fifth opening, and the fifth slot being exposed at the bottom of the fifth opening.

[0013] An electroplated body is disposed in the fifth opening, a portion of the electroplated body is filled into the fifth groove to form the second embedded conductor, and the third photosensitive pattern and the second copper foil layer are removed.

[0014] A temperature measuring circuit board includes a substrate layer, connecting lines, temperature measuring lines, a conductive pad, a first embedded conductor, and a second embedded conductor. The substrate layer includes a plurality of first slots, a plurality of second slots, a plurality of third slots, a fourth slot, and a fifth slot. The first slots, second slots, and third slots are located on one side of the substrate layer, connecting every two adjacent second slots. The first slot also connects adjacent second slots and third slots. The fourth slot is located on the other side of the substrate layer, and the bottom of the fourth slot is recessed to form the fifth slot, which connects to the second slots. The connecting line is located in the first slot, the first embedded conductor is located in the second slot, the conductive pad is located in the third slot, the connecting line is electrically connected to every two adjacent first embedded conductors, the connecting line is also electrically connected to adjacent first embedded conductors and the conductive pad, the temperature measuring line is located in the fourth slot, the second embedded conductor is located in the fifth slot, and the first embedded conductor is electrically connected to the second embedded conductor.

[0015] Furthermore, it also includes a solder resist layer, which has a window and covers the temperature measuring line, the first embedded conductor and the connecting line, with the conductive pad exposed in the window.

[0016] Furthermore, the temperature measuring circuit is made of at least one of constantan, nickel-chromium alloy, and copper-nickel alloy.

[0017] Compared to existing technologies, the temperature measuring circuit provided in this application features a first, second, and third slot on one side of the substrate layer. Connecting lines, a first embedded conductor, and a conductive pad are respectively placed within these slots. A fourth slot is then formed on the other side of the substrate layer, containing the temperature measuring line. Finally, a fifth slot is formed on the substrate layer, connecting the fourth and second slots. A second embedded conductor is placed within the fifth slot, electrically connected to the first embedded conductor, thereby connecting the temperature measuring line to the connecting line. The connecting line, temperature measuring line, first embedded conductor, second embedded conductor, and conductive pad are all embedded in the substrate layer, reducing the overall thickness of the temperature measuring circuit board and improving its flatness. Attached Figure Description

[0018] Figure 1 This is a cross-sectional schematic diagram of a double-sided copper-clad substrate provided in an embodiment of this application.

[0019] Figure 2 for Figure 1 The diagram shows a cross-sectional view of a double-sided copper-clad substrate after the first dry film layer has been applied.

[0020] Figure 3 For exposure and development Figure 1 The diagram shows a cross-section after the first dry film layer. Figure 4 (Schematic diagram of the cross-section along III-III).

[0021] Figure 4 for Figure 3 The diagram shows the bottom surface of the double-sided copper-clad substrate.

[0022] Figure 5 To remove Figure 3 A cross-sectional schematic diagram of the portion after the first copper foil layer.

[0023] Figure 6 for Figure 5 The diagram shows a cross-section of the substrate layer after the first groove is made.

[0024] Figure 7 for Figure 6 The diagram shows a cross-section after the connecting lines are installed in the first slot.

[0025] Figure 8 for Figure 7 The diagram shows a cross-section of the second copper foil layer after the second dry film layer has been applied.

[0026] Figure 9 for Figure 8 The diagram shows a cross-section of the substrate layer after the fourth groove is created.

[0027] Figure 10 for Figure 9 The diagram shows a cross-section after the temperature measuring line is installed inside the fourth slot.

[0028] Figure 11 for Figure 10 The diagram shows a cross-section of the substrate layer after the fifth groove is created.

[0029] Figure 12 for Figure 11 The diagram shows a cross-section after the second embedded conductor is installed in the fifth slot.

[0030] Figure 13 To remove Figure 12 The diagram shows a cross-section of the third dry film layer and the second bonding layer.

[0031] Figure 14 This is a cross-sectional schematic diagram of the temperature measuring circuit board provided in an embodiment of this application.

[0032] Explanation of main component symbols

[0033] Temperature sensing circuit board 100

[0034] Double-sided copper-clad substrate 10

[0035] Substrate layer 11

[0036] First copper foil layer 12

[0037] Second copper foil layer 13

[0038] First dry film layer 14

[0039] First bonding layer 15

[0040] Second dry film layer 16

[0041] Second bonding layer 17

[0042] First photosensitive pattern 21

[0043] First opening 211

[0044] Second opening 212

[0045] Third opening 213

[0046] First slot 31

[0047] Second slot 32

[0048] Third slot 33

[0049] Fourth slot 34

[0050] Fifth slot 35

[0051] Connection line 41

[0052] First embedded conductor 42

[0053] Conductive pad 43

[0054] Temperature measurement circuit 44

[0055] Second embedded conductor 45

[0056] Second photosensitive pattern 51

[0057] Fourth opening 511

[0058] Third photosensitive pattern 61

[0059] Fifth opening 611

[0060] Electroplated body 71

[0061] First weld shielding layer 81

[0062] Second weld shielding layer 82

[0063] Open window 821

[0064] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0065] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0066] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also exist in an intervening component. When a component is considered to be "set on" another component, it can be directly set on the other component or may also exist in an intervening component.

[0067] Please see Figures 1 to 14 This application provides a method for manufacturing a temperature measuring circuit board 100, including the following steps:

[0068] S1: Please see Figure 1 A double-sided copper-clad substrate 10 is provided, the double-sided copper-clad substrate 10 including a substrate layer 11, a first copper foil layer 12, and a second copper foil layer 13. The first copper foil layer 12 and the second copper foil layer 13 are respectively disposed on opposite surfaces of the substrate layer 11. In other embodiments of this application, the first copper foil layer 12 and the second copper foil layer 13 may also be omitted.

[0069] In this embodiment, the material of the substrate layer 11 includes, but is not limited to, polyimide (PI), polyester resin (PET), polyethylene naphthalate (PEN), liquid crystal polymer (LCP), and modified polyimide (MPI).

[0070] S2: Please see Figure 2 A first dry film layer 14 is laminated onto the first copper foil layer 12, and a first adhesive layer 15 is laminated onto the second copper foil layer 13. The first adhesive layer 15 helps to protect the second copper foil layer 13 and prevent damage to the second copper foil layer 13 when the first dry film layer 14 is laminated.

[0071] S3: Please see Figure 3The first dry film layer 14 is exposed and developed to form a first photosensitive pattern 21, which includes a plurality of first openings 211, a plurality of second openings 212, and a plurality of third openings 213. (See also...) Figure 4 The first opening 211 connects to every two adjacent second openings 212, and the first opening 211 also connects to adjacent second openings 212 and the third opening 213. Part of the first copper foil layer 12 is exposed at the bottom of the first opening 211, the second opening 212 and the third opening 213 respectively.

[0072] S4: Please see Figure 5 The chemical etching removes portions of the first copper foil layer 12 corresponding to the first opening 211, the second opening 212, and the third opening 213, so that portions of the substrate layer 11 are exposed at the bottom of the first opening 211, the second opening 212, and the third opening 213, respectively.

[0073] S5: Please see Figure 6 Plasma etching exposes a portion of the substrate layer 11 in the first opening 211 to form a first groove 31, a portion of the substrate layer 11 in the second opening 212 to form a second groove 32, and a portion of the substrate layer 11 in the third opening 213 to form a third groove 33. The first groove 31 connects every two adjacent second grooves 32, and also connects adjacent second grooves 32 and third grooves 33. None of the first groove 31, the second groove 32, or the third groove 33 penetrates the substrate layer 11.

[0074] S6: Please see Figure 7 A connecting line 41 is provided in the first slot 31 by chemical plating or electroplating, a first embedded conductor 42 is provided in the second slot 32, and a conductive pad 43 is provided in the third slot 33. The connecting line 41 is electrically connected to every two adjacent first embedded conductors 42, and the connecting line 41 is also electrically connected to adjacent first embedded conductors 42 and conductive pads 43.

[0075] S7: Please see Figure 7 Remove the first photosensitive pattern 21 and the first adhesive layer 15.

[0076] S8: Please see Figure 8 A second dry film layer 16 is laminated onto the second copper foil layer 13, and a second adhesive layer 17 is laminated onto the first copper foil layer 12.

[0077] S9: Please see Figure 9The second dry film layer 16 is exposed and developed to form a second photosensitive pattern 51. The second photosensitive pattern 51 has a fourth opening 511. A portion of the second copper foil layer 13 and a portion of the substrate layer 11 corresponding to the fourth opening 511 are removed to form a fourth groove 34. The fourth groove 34 does not penetrate the substrate layer 11, and the first embedded conductor 42 corresponds to at least a portion of the fourth groove 34.

[0078] S10: Please refer to Figure 10 A temperature sensing line 44 is formed on the inner circumference of the fourth groove 34 using a sputtering method. The material of the temperature sensing line 44 includes one of nickel-chromium alloy, copper-nickel alloy, or copper-nickel-manganese alloy. When one end of the temperature sensing line 44 contacts a low-temperature region and the other end contacts a high-temperature region, the temperature sensing line 44 will generate a resistance change. By connecting multiple temperature sensing lines 44 using connecting lines 41, a considerable resistance change can be generated. Then, by connecting a conductive pad 43 into a current loop, the resistance change can be measured, thereby establishing a relationship between temperature and resistance. When measuring the temperature subsequently, the corresponding temperature value can be obtained based on the actual measured resistance value and the established relationship between temperature and resistance. The thickness of the temperature sensing line 44 is 0.1–12 micrometers.

[0079] S11: Please refer to Figure 11 The chemical etching removes the second photosensitive pattern 51 and removes a portion of the temperature measuring line 44 and a portion of the substrate layer 11 corresponding to the first embedded conductor 42 to form a fifth slot 35, with the first embedded conductor 42 exposed at the bottom of the fifth slot 35.

[0080] S12: Please refer to Figure 12 A third photosensitive pattern 61 is formed on the second copper foil layer 13. The third photosensitive pattern 61 has a fifth opening 611, which communicates with the fifth slot 35. Please refer to [link to relevant documentation]. Figure 13 An electroplated body 71 is formed within the fifth opening 611. A portion of the electroplated body 71 is filled into the fifth groove 35 to form a second embedded conductor 45. The third photosensitive pattern 61 and the second bonding layer 17 are removed, as are the first copper foil layer 12 and the second copper foil layer 13. The second embedded conductor 45 is electrically connected to the first embedded conductor 42. The electroplated body 71 covers a portion of the temperature sensing circuit 44, thus eliminating the need for solder to connect the second embedded conductor 45 and the temperature sensing circuit 44, simplifying the manufacturing process and improving efficiency.

[0081] S13: Please see Figure 14A first solder resist layer 81 is provided on one side of the substrate layer 11. The first solder resist layer 81 is filled into the fourth slot 34 to cover the temperature measuring circuit 44. A second solder resist layer 82 is provided on the other side of the substrate layer 11. The second solder resist layer 82 covers the connection circuit 41 and the first embedded conductor 42. The second solder resist layer 82 is provided with a window 821, through which the conductive pad 43 is exposed, thus obtaining the temperature measuring circuit board 100.

[0082] In this embodiment, the manufacturing method further includes: providing a protective layer 431 on the conductive pad 43, wherein the protective layer 431 is made of nickel, gold, or the like, and the protective layer 431 is used to prevent the conductive pad 43 from corroding.

[0083] Please see Figure 14 This application also provides a temperature measuring circuit board 100, which includes a substrate layer 11, a connecting line 41, a temperature measuring line 44, a conductive pad 43, a first embedded conductor 42 and a second embedded conductor 45.

[0084] The substrate layer 11 includes a plurality of first slots 31, a plurality of second slots 32, a plurality of third slots 33, a fourth slot 34, and a fifth slot 35. The first slots 31, the second slots 32, and the third slots 33 are located on one side of the substrate layer 11, connecting each two adjacent second slots 32. The first slot 31 also connects adjacent second slots 32 and third slots 33. The fourth slot 34 is located on the other side of the substrate layer 11, and the bottom of the fourth slot 34 is recessed to form the fifth slot 35. The fifth slot 35 connects to the second slots 32.

[0085] The connecting line 41 is disposed in the first slot 31, the first embedded conductor 42 is disposed in the second slot 32, the conductive pad 43 is disposed in the third slot 33, the connecting line 41 is electrically connected to every two adjacent first embedded conductors 42, the connecting line 41 is also electrically connected to adjacent first embedded conductors 42 and the conductive pad 43, the temperature measuring line 44 is disposed in the fourth slot 34, the second embedded conductor 45 is disposed in the fifth slot 35, and the first embedded conductor 42 is electrically connected to the second embedded conductor 45.

[0086] Compared with the prior art, the temperature measuring circuit board 100 provided in this application has the following advantages:

[0087] (i) By providing a first slot 31, a second slot 32, and a third slot 33 on one side of the substrate layer 11, and providing a connecting line 41, a first embedded conductor 42, and a conductive pad 43 in the first slot 31, the second slot 32, and the third slot 33 respectively, and then providing a fourth slot 34 on the other side of the substrate layer 11, providing a temperature measuring line 44 in the fourth slot 34, and finally providing a fifth slot on the substrate layer 11, the fifth slot connecting the fourth slot 34 and the second slot 32, and providing a second embedded conductor 45 in the fifth slot, which is electrically connected to the first embedded conductor 42, thereby enabling the temperature measuring line 44 to be connected to the connecting line 41. Wherein, the connecting line 41, the temperature measuring line 44, the first embedded conductor 42, the second embedded conductor 45, and the conductive pad 43 are all embedded in the substrate layer 11, thereby reducing the overall thickness of the temperature measuring circuit board 100 and providing flatness to the temperature measuring circuit board 100.

[0088] (ii) By embedding a connecting line 41, a first embedded conductor 42, a conductive pad 43, a second embedded conductor 45, and a temperature measuring line 44 within the substrate layer 11, the bonding and adhesion between the connecting line 41, the first embedded conductor 42, the conductive pad 43, the second embedded conductor 45, and the temperature measuring line 44 and the substrate layer 11 can be improved, reducing the risk of the connecting line 41, the first embedded conductor 42, the conductive pad 43, the second embedded conductor 45, and the temperature measuring line 44 detaching from the substrate layer 11 due to excessive bending.

[0089] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the spirit and scope of this application. All such changes and substitutions fall within the scope defined by this application.

Claims

1. A manufacturing method of a temperature measuring circuit board, characterized by, The method comprises the steps of: providing a substrate, the substrate comprising a substrate layer, one side of the substrate layer being provided with a plurality of first grooves, a plurality of second grooves and a plurality of third grooves, the first grooves being in communication with every two adjacent second grooves, the first grooves also being in communication with adjacent second grooves and third grooves; providing a connecting line in the first grooves, a first embedded conductive body in the second grooves, and a conductive pad in the third grooves, the connecting line being in electrical communication with every two adjacent first embedded conductive bodies, the connecting line also being in electrical communication with adjacent first embedded conductive bodies and conductive pads; providing a fourth groove on the other side of the substrate layer, the first embedded conductive body corresponding to at least part of the fourth groove; providing a temperature measuring line on the inner periphery of the fourth groove; removing part of the substrate layer corresponding to the first embedded conductive body and part of the temperature measuring line to form a fifth groove; and providing a second embedded conductive body in the fifth groove, the second embedded conductive body being in electrical communication with the temperature measuring line and the first embedded conductive body, thereby obtaining a temperature measuring circuit board; The substrate further comprises a first copper foil layer, the first copper foil layer being provided on one surface of the substrate layer, and the manufacturing method of the substrate comprises the steps of: providing a first photosensitive pattern on the first copper foil layer, the first photosensitive pattern having a plurality of first openings, a plurality of second openings and a plurality of third openings, the first openings being in communication with every two adjacent second openings, the first openings also being in communication with adjacent second openings and third openings, part of the first copper foil layer being exposed at the bottom of the first openings, second openings and third openings; removing part of the first copper foil layer corresponding to the first openings, the second openings and the third openings, so that part of the substrate layer is exposed at the bottom of the first openings, the second openings and the third openings, respectively; and etching part of the substrate layer exposed in the first openings to form the first grooves, etching part of the substrate layer exposed in the second openings to form the second grooves, and etching part of the substrate layer exposed in the third openings to form the third grooves; and removing the first photosensitive pattern. The method further comprises the steps of: respectively providing a solder mask layer on opposite sides of the substrate layer, the solder mask layer being provided with an opening, the solder mask layer covering the temperature measuring line, the first embedded conductive body and the connecting line, the conductive pad being exposed in the opening.

2. The production method according to claim 1, wherein The method further comprises the step of: providing a protective layer on the conductive pad.

3. The production method according to claim 2, wherein Before the step of "respectively providing a solder mask layer on opposite sides of the substrate layer", the method further comprises removing the first copper foil layer. The substrate further comprises a second copper foil layer, the second copper foil layer being provided on the other surface of the substrate layer, and the manufacturing method further comprises the steps of:

4. The production method according to claim 1, wherein providing a second photosensitive pattern on the second copper foil layer, the second photosensitive pattern having a fourth opening; 5. The production method according to claim 1, wherein removing part of the second copper foil layer corresponding to the fourth opening, so that part of the substrate layer is exposed at the bottom of the fourth opening; and etching part of the substrate layer exposed in the fourth opening to form the fourth groove; and ​ ​ removing the second photosensitive pattern.

6. The production method according to claim 5, wherein The step of "arranging a temperature measuring circuit on the inner periphery of the fourth slot" is further followed by: arranging a third photosensitive pattern on the second copper foil layer, the third photosensitive pattern having a fifth opening, the fifth slot being exposed at the bottom of the fifth opening; arranging an electroplated body in the fifth opening, part of the electroplated body filling into the fifth slot to form the second embedded conductive body; and removing the third photosensitive pattern and the second copper foil layer.

7. A temperature measuring circuit board, characterized by comprising a substrate layer, a connecting circuit, a temperature measuring circuit, a conductive pad, a first embedded conductive body and an electroplated body, the substrate layer comprising a plurality of first slots, a plurality of second slots, a plurality of third slots, a fourth slot and a fifth slot, the first slots, the second slots and the third slots being arranged on one side of the substrate layer, each two adjacent second slots being connected, the first slot further connecting an adjacent second slot and an adjacent third slot, the fourth slot being arranged on the other side of the substrate layer, the bottom of the fourth slot being concave to form the fifth slot, the fifth slot being connected to the second slot, the connecting circuit being arranged in the first slot, the first embedded conductive body being arranged in the second slot, the conductive pad being arranged in the third slot, the connecting circuit electrically connecting each two adjacent first embedded conductive bodies, the connecting circuit further electrically connecting an adjacent first embedded conductive body and the conductive pad, the temperature measuring circuit being arranged in the fourth slot, part of the electroplated body covering part of the temperature measuring circuit, another part of the electroplated body being arranged in the fifth slot to form a second embedded conductive body, the first embedded conductive body being electrically connected to the second embedded conductive body.

8. The temperature measurement circuit board of claim 7, wherein, The temperature measuring circuit board further comprises a solder mask layer, the solder mask layer being provided with a window, the solder mask layer covering the temperature measuring circuit, the first embedded conductive body and the connecting circuit, the conductive pad being exposed through the window.

9. The temperature measurement circuit board of claim 7, wherein, The material of the temperature measuring circuit comprises one of nickel-chromium alloy, copper-nickel alloy and copper-nickel-manganese alloy.

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