Photoelectric tweezers chip and preparation method thereof

Abstract

The present invention discloses an optical tweezer chip and a preparation method thereof. The chip comprises a glass bottom plate, a photoconductive coating, a photodispersible adhesive tape and a glass top plate; the photoconductive coating is coated on the upper surface of the glass bottom plate; the middle position of the photodispersible adhesive tape is cut into a set pattern; the photodispersible adhesive tape is used to bond the glass top plate and the glass bottom plate coated with the photoconductive coating. The present invention can realize the reuse of the optical tweezer chip and reduce the cost of the optical tweezer chip.

Description

Technical Field

[0001] The present invention relates to the field of light-induced micro-nano manipulation and biochip manufacturing, and in particular to a photoelectric tweezers chip and a preparation method thereof. Background Art

[0002] Photoelectric tweezers technology (also known as photoinduced dielectrophoresis technology) is a micro-nano manipulation technology based on the principle of photoinduced dielectrophoresis. This technology can perform high-throughput and high-stability precise control of micro-robot targets in a complex environment where fluid fields, photoelectric fields, and biological force fields are coupled. It has important applications in cell manipulation, biological tissue assembly and other fields.

[0003] Photoelectric tweezer chips are an important hardware component of this technology. They are generally composed of a micro-chamber composed of two upper and lower plates and double-sided tape in the middle. In general, ordinary double-sided tape is used in the assembly process of photoelectric tweezer chips, which has problems such as poor reusability, more adhesive residue, long operation time, and high friction on the surface of the plates. Generally, photoelectric tweezer chips are disposable and disposable, which has the problem of high cost. Summary of the invention

[0004] The purpose of the present invention is to provide a photoelectric tweezers chip and a preparation method thereof, which can realize the reuse of the photoelectric tweezers chip and reduce the cost of the photoelectric tweezers chip.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] A photoelectric tweezers chip, comprising: a glass bottom plate, a photoconductive coating, a photodegradable adhesive tape and a glass top plate;

[0007] The photoconductive coating is coated on the upper surface of the lower glass substrate;

[0008] The middle position of the photo-degradable adhesive tape is cut into a set pattern;

[0009] The photo-disintegrating adhesive tape is used to bond the glass upper plate and the glass lower plate coated with the photoconductive coating.

[0010] Optionally, the photo-degradable adhesive tape includes: UV photo-degradable adhesive tape or UV photo-degradable glue.

[0011] Optionally, the photoconductive coating is hydrogenated amorphous silicon, a phototransistor or titanium phthalocyanine.

[0012] A method for preparing a photoelectric tweezers chip, used for preparing the photoelectric tweezers chip, the preparation method comprising:

[0013] Cut the middle of the photo-degradable adhesive tape;

[0014] Applying a photoconductive coating to the upper surface of the glass bottom substrate;

[0015] The cut photo-disintegrable adhesive tape is used to bond the glass top plate and the glass bottom plate coated with the photoconductive coating.

[0016] Optionally, the cutting methods include: laser cutting, mechanical cutting or manual cutting.

[0017] Optionally, the method further comprises bonding the glass top plate and the glass bottom plate coated with the photoconductive coating by using the cut photoremovable adhesive tape, and then:

[0018] After the prepared photoelectric tweezers chip is used, it is irradiated with ultraviolet light to dissolve the glue.

[0019] Optionally, the ultraviolet lamp is an ultraviolet lamp box or a handheld ultraviolet lamp.

[0020] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0021] The present invention provides an optoelectronic tweezers chip and a preparation method, wherein the photo-removable adhesive tape is used to adhere the glass upper plate and the glass lower plate coated with the photoconductive coating, that is, the photo-removable adhesive tape is used to fix the upper and lower plates of the optoelectronic tweezers chip and to form a micro-chamber and micro-channel of a certain shape between the upper and lower plates. The present invention is simple and convenient to operate, requires a low level of user skills, and further improves the ease of use of the optoelectronic tweezers chip. The technology disclosed in the present invention can optimize the operating procedures for the reuse of optoelectronic tweezers chips, reduce chip costs, increase the number of cycles, reduce glue residue, significantly reduce the cost of optoelectronic tweezers chips, and improve the surface cleanliness of reusable plates. The technical method disclosed in the present invention optimizes the chip structure of the optoelectronic tweezers technology, making the optoelectronic tweezers chip easy to mass-produce and customize, thereby assisting and promoting the commercial development of the technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the structure of a photoelectric tweezers chip provided by the present invention;

[0024] Figure 2 A schematic diagram of the preparation process of a photoelectric tweezers chip provided by the present invention;

[0025] Figure 3A schematic diagram of the debonding process of a photoelectric tweezers chip provided by the present invention;

[0026] Figure 4 Three examples of cutting shapes based on photo-degradable adhesive tape are provided for the present invention. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The purpose of the present invention is to provide a photoelectric tweezers chip and a preparation method thereof, which can realize the reuse of the photoelectric tweezers chip and reduce the cost of the photoelectric tweezers chip.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] like Figure 1 As shown, a photoelectric tweezers chip provided by the present invention comprises: a glass bottom plate 2, a photoconductive coating 3, a photodegradable adhesive tape 4 and a glass top plate 1;

[0031] The photoconductive coating 3 is coated on the upper surface of the glass bottom plate 2;

[0032] The middle position of the photo-degradable adhesive tape 4 is cut into a set pattern;

[0033] The photodegradable adhesive tape 4 is used to bond the glass top plate 1 and the glass bottom plate 2 coated with the photoconductive coating 3. The photodegradable adhesive tape 4 fixes the upper and lower plates and constructs a micro-chamber of corresponding height. After the photodegradable adhesive tape 4 is irradiated with ultraviolet light, the active monomers in the adhesive substance of the tape form a 3D network together with the base polymer. The storage modulus of the adhesive increases sharply, resulting in a significant decrease in adhesion. The volume shrinkage and voids at the adhesive / adhesion interface also help to reduce adhesion. Therefore, the tape can be easily removed after irradiation and basically no adhesive is left on the surface of the plate.

[0034] The photo-degradable adhesive tape 4 includes but is not limited to: UV photo-degradable adhesive tape or UV photo-degradable glue.

[0035] The photoconductive coating 3 is hydrogenated amorphous silicon, a phototransistor or titanium phthalocyanine.

[0036] like Figure 2 and Figure 3As shown, the present invention provides a method for preparing a photoelectric tweezers chip, which is used to prepare the photoelectric tweezers chip, and the preparation method comprises:

[0037] The middle position of the photo-degradable adhesive tape 4 is cut; the cutting methods include but are not limited to: laser cutting, mechanical cutting or manual cutting.

[0038] Coating the photoconductive coating 3 on the upper surface of the glass bottom plate 2;

[0039] The cut photo-disintegrable adhesive tape 4 is used to bond the glass top plate 1 and the glass bottom plate 2 coated with the photoconductive coating 3 .

[0040] After the prepared photoelectric tweezers chip is used, it is irradiated with an ultraviolet lamp to dissolve the glue. The ultraviolet lamp is an ultraviolet lamp box or a handheld ultraviolet lamp. The irradiation time is 6 minutes to 10 minutes, and then the upper and lower plates are separated, rinsed with deionized water, and the surface of the plate is wiped with acetone (AR) before re-pasting and use.

[0041] After drawing a suitable pattern on the computer, use a laser cutter to directly cut it to obtain a tape of any shape; use the tape to bond the upper and lower plates at a suitable position. Any desired micro-chamber and micro-channel are formed between the cut surface of the tape and the upper and lower plates, and the height thereof is the thickness of the photo-degradable adhesive tape 4 used. Using the technology described in the present invention, micro-channels and micro-chambers of any desired shape can be quickly obtained. Figure 4 Four examples of the cut shapes of the photo-debondable tape 4 described in the present invention are shown. Based on the technology described in the present invention, a desired microchannel or microchamber of any shape can be made by cutting.

[0042] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0043] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A photoelectric tweezers chip, characterized in that: include: Glass bottom plate, photoconductive coating, photoremovable adhesive tape and glass top plate; The photoconductive coating is coated on the upper surface of the lower glass substrate; The middle position of the photo-degradable adhesive tape is cut into a set pattern; any desired micro-chamber and micro-channel are formed between the cut surface of the photo-degradable adhesive tape and the lower glass bottom plate and the upper glass top plate; The photo-disintegrating adhesive tape is used to bond the glass top plate and the glass bottom plate coated with the photoconductive coating; The photo-degradable adhesive tape includes: UV photo-degradable adhesive tape or UV photo-degradable glue; The photoconductive coating is hydrogenated amorphous silicon, a phototransistor or titanium phthalocyanine.

2. A method for preparing an optoelectronic tweezers chip, used for preparing an optoelectronic tweezers chip according to claim 1, characterized in that: The preparation method comprises: Cut the middle of the photo-degradable adhesive tape; Applying a photoconductive coating to the upper surface of the glass bottom substrate; The cut photo-disintegrable adhesive tape is used to bond the glass top plate and the glass bottom plate coated with the photoconductive coating.

3. The method for preparing a photoelectric tweezers chip according to claim 2, characterized in that: Cutting methods include: laser cutting, mechanical cutting or manual cutting.

4. The method for preparing a photoelectric tweezers chip according to claim 2, characterized in that: The method further comprises: bonding the glass top plate and the glass bottom plate coated with a photoconductive coating by using the cut photoremovable adhesive tape; and then: After the prepared photoelectric tweezers chip is used, it is irradiated with ultraviolet light to dissolve the glue.

5. The method for preparing a photoelectric tweezers chip according to claim 4, characterized in that: The ultraviolet lamp is an ultraviolet lamp box or a handheld ultraviolet lamp.

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