A photosensitive structure set, a spectral imager and a method of using the same

Abstract

The embodiment of the present application provides a kind of light perception structure group, spectral imager and its use method.The light perception structure group includes hot light detector, including at least one feature unit structure, the feature unit structure includes multiple metal nano structures;And mobile device, including at least one moving component, the moving component is set to one-to-one group corresponding with the feature unit structure;The moving component is set to drive the feature unit structure to move, to change the relative position of the feature unit structure and the light source to be detected.The light perception structure group provided in the embodiment of the present application is set by moving component, and the feature unit structure is moved by moving component, to change the relative position of the feature unit structure and the light source to be detected, reduces the structural complexity of spectral imager, and realizes the perception of spectrum in ultra-wideband range.

Description

Technical Field

[0001] This article relates to, but is not limited to, the field of micro-nano device technology, and in particular to a light-sensing structure group, a spectral imager, and its usage. Background Technology

[0002] Currently, spectral imagers are used as the most powerful and widely applied tools in scientific and technological research. Benchtop, laboratory-grade spectral imager systems, utilizing bulky optical components, moving parts, and long transmission paths, can achieve non-parallel, ultra-high resolution, and wide spectral range.

[0003] However, the rapidly expanding application space has led to the use of spectral imagers in many fields, such as spectrum analysis. These applications require spectral imagers to have small physical size, low cost, and low power consumption. For example, portable and handheld spectrum analysis devices need to reduce the size of the entire system to the centimeter scale, and more extreme miniaturization products need to reduce the size of the entire system to the sub-millimeter level. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This application provides a light-sensing structure group, a spectral imager, and a method for using the same.

[0006] This application provides a light-sensing structure assembly. The light-sensing structure assembly includes:

[0007] A thermal optical detector includes at least one feature unit structure, said feature unit structure comprising a plurality of metal nanostructures; and

[0008] A moving device includes at least one moving component, which is arranged in a one-to-one correspondence with the feature unit structure; the moving component is configured to drive the feature unit structure to move, so as to change the relative position of the feature unit structure and the light source to be detected.

[0009] In one exemplary embodiment, the moving component includes at least one first moving component, the first moving component being configured to drive the feature unit structure to move along a first moving direction; or,

[0010] The moving component includes at least one second moving component, the second moving component being configured to drive the feature unit structure to move along a second moving direction; or...

[0011] The moving component includes at least one third moving component, which is configured to drive the feature unit structure to move along the first moving direction and the second moving direction;

[0012] The first moving direction is different from the second moving direction, and the plane formed by them is parallel to the plane where the feature unit structure is located.

[0013] In one exemplary embodiment, the first moving component includes:

[0014] The first electrode plate is provided with a first voltage interface for inputting a first voltage;

[0015] A second electrode plate is disposed opposite to and spaced from the first electrode plate along the first moving direction; the second electrode plate is provided with a second voltage interface for inputting a second voltage; and...

[0016] A movable part is located between the first electrode plate and the second electrode plate, and the movable part is configured to drive the feature unit structure to move along the first moving direction under the action of the voltage difference between the first voltage and the second voltage.

[0017] In one exemplary embodiment, the moving part includes:

[0018] Part One;

[0019] The second part is positioned opposite and spaced apart from the first part along the first moving direction; and

[0020] A connecting component is located between the first part and the second part; the first part and the second part are connected via the connecting component.

[0021] In one exemplary embodiment, the connecting component includes:

[0022] First extending arm;

[0023] The second extension arm is disposed opposite to and spaced apart from the first extension arm along the first moving direction; and

[0024] A connecting arm is located between the first extending arm and the second extending arm; the connecting arm extends along the first moving direction, and one end of the connecting arm along the first moving direction is connected to the first extending arm, and the other end of the connecting arm along the first moving direction is connected to the second extending arm;

[0025] The first extension arm is connected to the first part, and the second extension arm is connected to the second part.

[0026] In one exemplary embodiment, the first extension arm and the second extension arm are located on the same side of the connecting arm along the first moving direction;

[0027] The end of the first extension arm closer to the connecting arm is connected to the connecting arm, and the end of the first extension arm farther from the connecting arm is connected to the first part.

[0028] The end of the second extension arm closer to the connecting arm is connected to the connecting arm, and the end of the second extension arm farther from the connecting arm is connected to the second part.

[0029] In one exemplary embodiment, the first moving component includes at least one first comb tooth and at least one second comb tooth;

[0030] The first comb tooth is disposed on at least one of the first electrode plate and the second electrode plate, and the first comb tooth extends along the first moving direction and toward the center of the first moving component;

[0031] The second comb tooth is disposed on the moving part and extends towards the first comb tooth along the first moving direction.

[0032] In one exemplary embodiment, the second moving component includes:

[0033] Support components;

[0034] The third electrode plate is provided with a third voltage interface for inputting a third voltage and is mounted to the support member;

[0035] A fourth electrode plate, disposed opposite and spaced apart from the third electrode plate along the second moving direction; the fourth electrode plate is provided with a fourth voltage interface for inputting a fourth voltage, and the fourth electrode plate is mounted to the support member; and

[0036] A movable frame, at least partially located between the third and fourth electrode plates, is configured to move the feature unit structure relative to the support member along the second moving direction under the action of the voltage difference between the third and fourth voltages.

[0037] In one exemplary embodiment, the mobile frame includes:

[0038] The moving body extends along the second moving direction;

[0039] A first movable arm is mounted to the movable body, and at least a portion of the first movable arm is located between the third electrode plate and the fourth electrode plate;

[0040] The second movable arm is mounted to the movable body and is located on the same side of the movable body in the extending direction of the movable body as the first movable arm. At least a portion of the second movable arm is located between the third electrode plate and the fourth electrode plate.

[0041] In one exemplary embodiment, the mobile frame further includes:

[0042] A first auxiliary support arm is installed to the mobile body; the first auxiliary support arm is located between the first mobile arm and the second mobile arm.

[0043] The second auxiliary support arm is installed on the moving body and is located on the same side of the moving body in the extending direction of the first auxiliary support arm; the second auxiliary support arm is located between the first moving arm and the second moving arm;

[0044] The feature unit structure is located on the bearing surface jointly formed by the first auxiliary bearing arm and the second auxiliary bearing arm.

[0045] In one exemplary embodiment, the second moving component further includes:

[0046] The fifth electrode plate is provided with a fifth voltage interface for inputting a fifth voltage and is installed to the support member; the fifth electrode plate is located on the side of the third electrode plate away from the fourth electrode plate;

[0047] The sixth electrode plate is disposed opposite to and spaced apart from the fifth electrode plate along the second moving direction, and the sixth electrode plate is located on the side of the fourth electrode plate away from the third electrode plate; the sixth electrode plate is provided with a sixth voltage interface for inputting a sixth voltage, and the sixth electrode plate is mounted to the support member;

[0048] At least a portion of the movable frame is located between the fifth electrode plate and the third electrode plate, and at least a portion of the movable frame is located between the sixth electrode plate and the fourth electrode plate;

[0049] The fifth voltage is the same as the third voltage, and the sixth voltage is the same as the fourth voltage.

[0050] In one exemplary embodiment, the mobile frame further includes:

[0051] A third movable arm is mounted to the movable body, and at least a portion of the third movable arm is located between the fifth electrode plate and the third electrode plate;

[0052] A fourth movable arm is mounted to the movable body and is located on the same side of the moving body in the extending direction of the moving body as the third movable arm, with at least a portion of the fourth movable arm located between the sixth electrode plate and the fourth electrode plate.

[0053] In one exemplary embodiment, the second moving component further includes at least one third comb tooth and at least one fourth comb tooth;

[0054] The third comb tooth is disposed on at least one of the third electrode plate and the fourth electrode plate, and the third comb tooth extends along the second moving direction and toward the center of the second moving component;

[0055] The fourth comb tooth is disposed on the movable frame and extends towards the third comb tooth along the second moving direction.

[0056] In one exemplary embodiment, the third moving component includes a first moving component and a second moving component; the second moving component is disposed within the first moving component, and the feature unit structure is disposed in the second moving component;

[0057] The feature unit structure, together with the second moving component, moves along the first moving direction under the drive of the first moving component.

[0058] A spectral imager includes the light-sensing structure group described in any of the above embodiments.

[0059] A method of using a spectral imager, applied to the spectral imager described in any of the above embodiments; the method of use includes:

[0060] The side of the thermo-optical detector with the metal nanostructure is oriented toward the light source to be detected.

[0061] Adjust the moving component so that it drives the feature unit structure to move, thereby changing the relative position of the feature unit structure and the light source to be detected.

[0062] The light sensing structure group provided in this application embodiment reduces the structural complexity of the spectral imager by setting a moving component, which drives the feature unit structure to move, thereby changing the relative position between the feature unit structure and the light source to be detected, and realizing the sensing of the spectrum in the ultra-wideband range.

[0063] Implementing any product or method of the present invention does not necessarily require achieving all of the advantages described above simultaneously. Other features and advantages of the invention will be set forth in the following description and will be apparent in part from the description and embodiments, or may be learned by practicing the invention. The objects and other advantages of the embodiments of this application may be realized and obtained through the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0064] The accompanying drawings are provided to further illustrate the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of the present invention and do not constitute a limitation on the technical solutions of the present invention. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of the present invention.

[0065] Figure 1 This is a schematic diagram of the structure of the spectral imager according to an embodiment of this application;

[0066] Figure 2 This is a schematic diagram of the structure of the thermal photodetector in an embodiment of this application;

[0067] Figure 3 This is a cross-sectional schematic diagram of the thermo-optical detector according to an embodiment of this application;

[0068] Figure 4 This is a top view schematic diagram of a spectral imager according to an embodiment of this application;

[0069] Figure 5 This is a top view of the first moving component according to an embodiment of this application;

[0070] Figure 6 This is a schematic diagram showing the position of the absorption resonance peak when the spectral imager is moved to different displacements according to an embodiment of this application;

[0071] Figure 7 This is a top view schematic diagram of a spectral imager according to another embodiment of this application;

[0072] Figure 8 This is a top view of the second moving component according to an embodiment of this application;

[0073] Figure 9 This is a top view schematic diagram of a spectral imager according to another embodiment of this application;

[0074] Figure 10 This is a top view of the third moving component in an embodiment of this application;

[0075] Figures 11A to 11L This is a flowchart illustrating the fabrication process of the photosensitive structure group in an embodiment of this application.

[0076] Explanation of reference numerals in the attached figures:

[0077] 10-Thermophotodetector; 101-Featured unit structure; 102-Substrate; 103-Metal nanostructure; 104-Conversion layer; 105-Metal layer; 106-Dielectric layer; 100-Detection structure;

[0078] 20-Moving device, 201-First moving component, 2011-First electrode plate, 2012-Second electrode plate, 2013-Moving part, 2014-First part, 2015-Second part, 2016-Connecting component, 2017-First extension arm, 2018-Second extension arm, 2019-Connecting arm, 2020-Intermediate extension arm, 2021-First comb tooth, 2022-Second comb tooth, 20a-First central axis, 20b-Second central axis;

[0079] 202-Second moving component, 2023-Third pole plate, 2024-Fourth pole plate, 2025-Support component, 2026-Moving frame, 2027-First moving arm, 2028-Second moving arm, 2029-Moving main body, 2030-First auxiliary support arm, 2031-Second auxiliary support arm, 2032-Third comb tooth, 2033-Fourth comb tooth, 2034-Fifth pole plate, 2035-Sixth pole plate, 2036-Third moving arm, 2037-Fourth moving arm, 30a-Third central axis, 30b-Fourth central axis;

[0080] 203 - Third moving part, 204 - Bridging part, 40a - Fifth central axis, 40b - Sixth central axis;

[0081] 30 - Analysis and processing device; 300 - Central processing unit; 301 - First subprocessor; 302 - Second subprocessor; 303 - Third subprocessor; 304 - Fourth subprocessor; 305 - Fifth subprocessor; 306 - Sixth subprocessor; 307 - Seventh subprocessor; 308 - Eighth subprocessor; 309 - Ninth subprocessor.

[0082] 1-Base layer, 2-First insulating layer, 3-Active layer, 4-Second insulating layer, 5-Barrier layer, 6-First sacrificial layer, 7-Functional layer, 8-Second sacrificial layer. Detailed Implementation

[0083] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into one or more forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0084] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, this disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0085] The ordinal numbers such as "first," "second," and "third" in this disclosure are used to avoid confusion among the constituent elements, not to limit the quantity. "Multiple" in this disclosure includes two or more quantities.

[0086] In this disclosure, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification of the specification, and does not imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately changed depending on the direction in which the constituent elements are described. Therefore, the description is not limited to the terms used in the specification and may be appropriately replaced as appropriate.

[0087] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate.

[0088] In this disclosure, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain) and the source electrode (source electrode terminal, source region, or source), and current can flow through the drain electrode, the channel region, and the source electrode. In this disclosure, the channel region refers to the region through which current primarily flows.

[0089] In this disclosure, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in this disclosure, the "source electrode" and the "drain electrode" can be interchanged.

[0090] In this disclosure, "electrical connection" includes the situation where constituent elements are connected together by a component having a certain electrical function. There are no particular limitations on the "component having a certain electrical function," as long as it enables the transmission and reception of electrical signals between the connected constituent elements. Examples of "component having a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components having one or more functions.

[0091] In this disclosure, "parallel" refers to a state in which the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore can include a state in which the angle is greater than or equal to -5° and less than 5°. Furthermore, "perpendicular" refers to a state in which the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore can include a state in which the angle is greater than or equal to 85° and less than 95°.

[0092] In this disclosure, the terms "film" and "layer" can be interchanged. For example, sometimes "conductive layer" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer".

[0093] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0094] Currently, there are two types of ultra-compact spectral imagers: waveguide-coupled spectral imagers and free-space coupled spectral imagers. The application of waveguide-coupled spectral imagers is limited due to the need for carefully selected couplers and the inability to provide spatial information. Free-space coupled spectral imagers are primarily used for imaging and therefore rely on the design of three-primary-color spectral filters; however, these filters suffer from problems such as simple Lorentz spectral line shapes and a lack of spectral diversity.

[0095] This application provides a light-sensing structure assembly. The light-sensing structure assembly includes:

[0096] A thermal optical detector includes at least one feature unit structure, said feature unit structure comprising a plurality of metal nanostructures; and

[0097] A moving device includes at least one moving component, which is arranged in a one-to-one correspondence with the feature unit structure; the moving component is configured to drive the feature unit structure to move, so as to change the relative position of the feature unit structure and the light source to be detected.

[0098] The light sensing structure group provided in this application embodiment reduces the structural complexity of the spectral imager by setting a moving component, which drives the feature unit structure to move, thereby changing the relative position between the feature unit structure and the light source to be detected, and realizing the sensing of the spectrum in the ultra-wideband range.

[0099] The technical solutions of the embodiments of this application are described in detail below through specific examples.

[0100] Figure 1 This is a schematic diagram of the structure of a spectral imager according to an embodiment of this application. Figure 1As shown, the spectral imager may include a light-sensing structure assembly and an analysis and processing unit 30. The light-sensing structure assembly may include a thermal photodetector 10 and a moving device 20, etc. Both the thermal photodetector 10 and the moving device 20 may be electrically connected to the analysis and processing unit 30. The thermal photodetector 10 is configured to convert the received light from the light source to be detected into heat energy, then convert the heat energy into a corresponding electrical signal, and transmit the electrical signal to the analysis and processing unit 30. The analysis and processing unit 30 is configured to convert the electrical signal into spectral lines, etc. The moving device 20 is configured to move the thermal photodetector 10. For example, the moving device 20 may move under the control of the analysis and processing unit 30, etc.

[0101] In one exemplary embodiment, the spectral imager may include at least one group of light-sensing structures. Multiple groups of light-sensing structures may be arranged in a rectangular array or a circular array, etc.

[0102] Figure 2 This is a schematic diagram of the structure of the thermal photodetector according to an embodiment of this application. Figure 2 As shown, three directions are defined for the explanation of the technical solution, and the first direction is labeled X, the second direction is labeled Y, and the third direction is labeled Z. The first, second, and third directions are all different. In this embodiment, the first, second, and third directions are mutually perpendicular. The third direction is the thickness direction of the thermal photodetector 10. The plane formed by the first and second directions is parallel to the plane containing the thermal photodetector 10.

[0103] like Figure 2 As shown, the thermal photodetector 10 may include at least one feature unit structure 101. For example, the feature unit structure 101 may be a pixel unit structure. The feature unit structure 101 may include a substrate 102 and a plurality of metal nanostructures 103 disposed on the same side of the substrate 102.

[0104] In an exemplary embodiment, the substrate 102 may be a rigid substrate, a flexible substrate, or a silicon wafer, etc. For example, the rigid substrate may be made of materials such as glass or quartz, and the flexible substrate may be made of materials such as polyimide (PI) or polyethylene terephthalate (PET). For example, the flexible substrate may be a single-layer structure or a laminated structure composed of an inorganic material layer and a flexible material layer; this disclosure does not limit the scope of the application.

[0105] In one exemplary embodiment, such as Figure 2 As shown, the metal nanostructure 103 can extend along a third direction, and the metal nanostructure 103 can be a cube, cylinder, sphere, or frustum of a cone, etc.

[0106] In one exemplary embodiment, such as Figure 2As shown, multiple metal nanostructures 103 can be arranged at equal intervals along a first direction or at equal intervals along a second direction.

[0107] In an exemplary embodiment, the metallic material of the metal nanostructure 103 may include any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb).

[0108] In an exemplary embodiment, the metal nanostructure 103 may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti.

[0109] In one exemplary embodiment, the height (Z-direction) of the metal nanostructure 103 can be set from 5 nanometers (nm) to 1000 nanometers (nm). The spacing between two adjacent metal nanostructures 103 can be set from 3 nanometers (nm) to 1000 nanometers (nm).

[0110] When light shines on the feature unit structure 101, multiple metal nanostructures 103 can generate localized surface plasmon resonance. The shape, size, and spacing of the multiple metal nanostructures 103 are only required to satisfy the generation of localized surface plasmon resonance. This disclosure does not limit the shape, size, or spacing of the metal nanostructures 103 or adjacent metal nanostructures 103.

[0111] Figure 3 This is a cross-sectional schematic diagram of the thermo-optical detector according to an embodiment of this application. Figure 3 for Figure 2 The sectional view shown at point A is a sectional view along the Z-axis. Figure 3 As shown, the feature unit structure 101 may further include a conversion layer 104, a metal layer 105, and a dielectric layer 106 disposed between the substrate 102 and the metal nanostructure 103. Figure 3 As shown, the conversion layer 104 may be located on the side of the substrate 102 closer to the metal nanostructure 103, the metal layer 105 may be located on the side of the conversion layer 104 away from the substrate 102, and the dielectric layer 106 may be located on the side of the metal layer 105 away from the substrate 102. Figure 3 As shown, substrate 102 can provide support for other components of feature unit structure 101. When light shines on feature unit structure 101, dielectric layer 106 and metal layer 105 can be used as Fabry-Perot resonators.

[0112] In one exemplary embodiment, the material of the dielectric layer 106 may include at least one of titanium oxide, strontium titanate, gallium nitride, zirconium oxide, nickel oxide, polycyclic aromatic hydrocarbons, or sodium polystyrene sulfonate.

[0113] In one exemplary embodiment, the thickness (Z-direction) of the dielectric layer 106 may be set from 20 nanometers (nm) to 1000 nanometers (nm). For example, the thickness of the dielectric layer 106 is 20 nanometers (nm), or the thickness of the dielectric layer 106 is 50 nanometers (nm), or the thickness of the dielectric layer 106 is 100 nanometers (nm). This disclosure does not limit the thickness of the dielectric layer 106.

[0114] In an exemplary embodiment, the metal layer 105, the dielectric layer 106, and the metal nanostructure 103 can be used together as an absorption structure to improve the light absorption rate of the thermophotodetector 10. The metal layer 105 can also be used as an electrode, working with the conversion layer 104 to convert the absorbed light into an electrical signal. For example, the conversion layer 104 may include an electrode layer and an aluminum nitride crystal layer, etc. The electrode layer is closer to the substrate 102 than the aluminum nitride crystal layer, and one of the metal layer 105 and the electrode layer is an anode, while the other is a cathode.

[0115] In an exemplary embodiment, the metal layer 105 is made of any one or more of the following metal materials: silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb).

[0116] In an exemplary embodiment, the metal layer 105 may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti.

[0117] Figure 4 This is a top view schematic diagram of a spectral imager according to an embodiment of this application. Figure 4 As shown, the moving device 20 may include at least one moving component. The moving components are arranged in pairs with the feature unit structures 101. The feature unit structures 101 can move along a first direction, a second direction, or both directions under the influence of the moving components.

[0118] like Figure 4 As shown, the optical sensing structure group may further include at least one detection structure 100. The detection structure 100 and the feature unit structure 101 are arranged in a one-to-one correspondence. Along the Z-direction, the detection structure 100 and the feature unit structure 101 may be disposed on the upper and lower sides of the moving component. The detection structure 100 is configured to detect the actual displacement of the feature unit structure 101.

[0119] like Figure 4 As shown, the moving component may include at least one first moving component 201. The first moving component 201 may be arranged in a one-to-one correspondence with the feature unit structure 101. The feature unit structure 101 may move along a first direction or a second direction under the drive of the first moving component 201. Figure 4The schematic diagram shows that the feature unit structure 101 can move along a first direction under the action of the first moving component 201. The detection structure 100 can be electrically connected to the analysis and processing device 30.

[0120] In one exemplary embodiment, such as Figure 4 As shown, the analysis and processing device 30 may include a central processing unit 300 and multiple subprocessors to... Figure 4 As shown in the example, the analysis and processing device 30 may include a first subprocessor 301, a second subprocessor 302, and a third subprocessor 303. The first subprocessor 301, the second subprocessor 302, and the third subprocessor 303 are all electrically connected to the central processing unit 300.

[0121] like Figure 4 As shown, the feature unit structure 101 and the first moving component 201 are grouped into a rectangular array. In the rectangular array, the direction parallel to the first direction (X) is called a row, and the direction parallel to the second direction (Y) is called a column. Multiple first moving components 201 located in the same row are electrically connected to the same subprocessor. Multiple first moving components 201 can move the same displacement under the control of the subprocessor. This arrangement can improve the moving speed of the moving device 20 and improve the working efficiency of the spectral imager. The moving displacement and moving speed of the multiple first moving components 201 controlled by multiple subprocessors can be the same or different. First moving components 201 in different rows can move synchronously or asynchronously, etc.

[0122] In an exemplary embodiment, the mobile device 20 may be configured as a microelectromechanical system (MEMS). A microelectromechanical system is a high-tech device with a size of several millimeters or even smaller, whose internal structure is generally on the micrometer or even nanometer scale, and is an independent intelligent system.

[0123] Figure 5 This is a top view of the first moving component according to an embodiment of this application. Figure 5 As shown, the first moving component 201 may include a first electrode plate 2011 and a second electrode plate 2012 that are arranged opposite to and spaced apart from each other. Figure 5 As shown, there is a gap between the first electrode plate 2011 and the second electrode plate 2012 along the moving direction of the first moving member 201. Figure 5 As shown, the direction of movement is the first direction (X). When the direction of movement is the second direction (Y), the structure of the first moving component 201 is the same, except that the arrangement direction is rotated, which will not be described in detail here.

[0124] like Figure 5As shown, the projection of the first electrode 2011 onto the plane formed by X and Y can be elongated. The projection of the second electrode 2012 onto the plane formed by X and Y can also be elongated. The first electrode 2011 is provided with a first voltage interface for inputting a first voltage to the first electrode 2011. The second electrode 2012 is provided with a second voltage interface for inputting a second voltage to the second electrode 2012. The first voltage and the second voltage may be different or the same. That is, there is a voltage difference between the first electrode 2011 and the second electrode 2012, or the voltages may be the same. This disclosure does not limit the shape or arrangement of the first voltage interface and the second voltage interface. For example, the first voltage interface may be located at one end of the first electrode 2011 along the second direction, and the second voltage interface may be located at one end of the second electrode 2012 along the second direction. The first voltage interface and the second voltage interface may be located at the same end of the first moving member 201 along the second direction. For example, a portion of the first electrode 2011 may be used as the first voltage interface. Part of the second electrode plate 2012 can be used as a second voltage interface.

[0125] In one exemplary embodiment, such as Figure 5 As shown, the first moving component 201 may further include a moving part 2013 disposed between the first electrode plate 2011 and the second electrode plate 2012. The feature unit structure 101 is located on the moving part 2013. Because there is a voltage difference between the first electrode plate 2011 and the second electrode plate 2012, under the force generated by the voltage difference, the moving part 2013 can drive the feature unit structure 101 to reciprocate along the first direction (X), such as... Figure 5 The direction indicated by the double-headed dashed line. Due to the movement of the feature unit structure 101, the relative position of the feature unit structure 101 and the light source changes. Consequently, the relative position of the metal nanostructure 103 and the light source also changes, and the position of the absorption resonance peak shifts accordingly, as shown below. Figure 6 As shown. In Figure 6 The line marked ① indicates that, within the plane formed by X and Y, the centerline of the metal nanostructure 103 coincides with the centerline of the light source. The line marked ② indicates that, within the plane formed by X and Y, the centerline of the metal nanostructure 103 is offset by 5 nanometers from the centerline of the light source along the first direction (X). The line marked ③ indicates that, within the plane formed by X and Y, the centerline of the metal nanostructure 103 is offset by 10 nanometers from the centerline of the light source along the first direction (X).

[0126] like Figure 6As shown, varying the movement distance of the metal nanostructure 103 relative to the light source from 0 nanometers to 10 nanometers allows the spectral imager to achieve continuous tuning within a wavelength range of 500 nanometers to 630 nanometers. Different wavelengths can be tuned by changing the offset center of the metal nanostructure 103 relative to the light source. By controlling the movement precision of the metal nanostructure 103 using the moving device 20, the position of the absorption resonant wavelength can be tuned more accurately. Utilizing the absorption spectra of as many resonant wavelengths as possible enables spectral sensing over an ultra-wideband range. Furthermore, multiple feature unit structures 101 can employ the same design structure. Using the moving device 20 to change the position of the feature unit structure 101 relative to the light source simplifies the structural complexity of the spectral imager.

[0127] In one exemplary embodiment, such as Figure 5 As shown, the moving part 2013 may include a first part 2014 and a second part 2015 disposed opposite to each other, the first part 2014 and the second part 2015 having a gap along the moving direction of the first moving member 201, such as Figure 5 As shown, the first part 2014 and the second part 2015 are spaced apart along the first direction (X). For example, in the plane formed by X and Y, the projections of the first part 2014 and the second part 2015 in the plane formed by X and Y can be combined to form a rectangular ring or a circular ring, which can reduce the weight of the first moving part 201, reduce movement consumption, and reduce the testing cost of the spectral imager, etc. Figure 5 As shown, the first part 2014 can be located on the side closer to the first electrode plate 2011 compared to the second part 2015.

[0128] In one exemplary embodiment, such as Figure 5 As shown, the movable part 2013 may further include a connecting member 2016. The connecting member 2016 may be located between the first part 2014 and the second part 2015. The first part 2014 and the second part 2015 may be connected via the connecting member 2016. For example, one end of the connecting member 2016 may be connected to the first part 2014, and the other end of the connecting member 2016 may be connected to the second part 2015.

[0129] In one exemplary embodiment, such as Figure 5 As shown, the connecting component 2016 may include a first extension arm 2017 and a second extension arm 2018 that are opposite to and spaced apart along the moving direction of the first moving component 201. Figure 5 As shown, the first extension arm 2017 can be located on the side closer to the first electrode plate 2011 compared to the second extension arm 2018.

[0130] The connecting component 2016 may further include a connecting arm 2019, which is located between the first extending arm 2017 and the second extending arm 2018. One end of the connecting arm 2019 along the moving direction of the first moving component 201 is connected to the first extending arm 2017, and the other end of the connecting arm 2019 along the moving direction of the first moving component 201 is connected to the second extending arm 2018. For example, the first extending arm 2017, the second extending arm 2018, and the connecting arm 2019 may be configured as an integrally formed structure.

[0131] like Figure 5 As shown, the connecting arm 2019 can be connected to the end of the first extension arm 2017, and the connecting arm 2019 can be connected to the end of the second extension arm 2018, with the first extension arm 2017 and the second extension arm 2018 located on the same side of the moving direction of the first moving component 201. The end of the first extension arm 2017 not connected to the connecting arm 2019 can be connected to the first part 2014. The end of the second extension arm 2018 not connected to the connecting arm 2019 can be connected to the second part 2015.

[0132] In one exemplary embodiment, such as Figure 5 As shown, the first moving component 201 may include two connecting components 2016. The two connecting components 2016 may be arranged at intervals along the second direction (Y). The two connecting arms 2019 are arranged opposite to each other. The arrangement of two connecting components 2016 can improve the uniformity of force, ensure the stability of force between the first part 2014 and the second part 2015, and improve the stability and accuracy of the movement of the feature unit structure 101.

[0133] In one exemplary embodiment, such as Figure 5 As shown, the connecting component 2016 may further include one or more intermediate extension arms 2020. The intermediate extension arms 2020 can be used as grounding terminals. Multiple intermediate extension arms 2020 may be spaced apart along the moving direction of the first moving component 201. One end of each intermediate extension arm 2020 is connected to the connecting arm 2019, and the other end is a free end, which can be used as a grounding terminal. The intermediate extension arms 2020, the first extension arm 2017, and the second extension arm 2018 are all located on the same side of the connecting arm 2019. In this embodiment, "one or more" refers to one or more.

[0134] In one exemplary embodiment, the dimensions (Y) of the plurality of intermediate extension arms 2020 along the second direction may be the same or different. The dimensions of the plurality of intermediate extension arms 2020 along the first direction (X) may be the same or different.

[0135] In an exemplary embodiment, the intermediate extension arm 2020, the first extension arm 2017, the second extension arm 2018, and the connecting arm 2019 may be configured as an integrally formed structure.

[0136] In one exemplary embodiment, such as Figure 5 As shown, the first moving component 201 may include at least one first comb tooth 2021. The first comb tooth 2021 may be disposed on the first electrode plate 2011, or on the second electrode plate 2012, or on both the first electrode plate 2011 and the second electrode plate 2012. The first moving component 201 may also include at least one second comb tooth 2022. The second comb tooth 2022 is disposed on the moving part 2013. Along the moving direction of the first moving component 201, the second comb tooth 2022 may engage with the first comb tooth 2021. The mutual engagement of the first comb tooth 2021 and the second comb tooth 2022 can enhance the electrostatic effect of the first moving component 201 and improve its moving performance.

[0137] In one exemplary embodiment, such as Figure 5 As shown, a plurality of first comb teeth 2021 may be disposed on the first electrode plate 2011 and the second electrode plate 2012. The first comb teeth 2021 extend toward the center of the first moving member 201. The plurality of first comb teeth 2021 may extend toward each other along the moving direction (first direction) of the first moving member 201. A plurality of second comb teeth 2022 may be disposed on the moving part 2013, and are arranged in groups with the plurality of first comb teeth 2021 facing each other. There is a spacing along the second direction (Y) between the first comb teeth 2021 and the second comb teeth 2022 facing each other.

[0138] In one exemplary embodiment, such as Figure 5 As shown, the first moving part 201 can be configured as a structure that is symmetrical about itself along the first central axis 20a, and the first central axis 20a is parallel to the first direction (X).

[0139] In one exemplary embodiment, such as Figure 5 As shown, the first moving part 201 can be configured as a structure that is symmetrical about itself along the second central axis 20b, and the second central axis 20b is parallel to the second direction (Y).

[0140] In one exemplary embodiment, such as Figure 5 As shown, the first moving part 201 can be configured to be symmetrical about itself along the first central axis 20a and about itself along the second central axis 20b.

[0141] Figure 7 This is a top view schematic diagram of a spectral imager according to another embodiment of this application. Figure 7 As shown, the moving component may include at least one second moving component 202. The second moving component 202 may be arranged in a one-to-one correspondence with the feature unit structure 101. The feature unit structure 101 may move along a first direction or a second direction under the drive of the second moving component 201. Figure 7The schematic diagram shows that the feature unit structure 101 can move along the second direction under the drive of the second moving part 202.

[0142] In one exemplary embodiment, such as Figure 7 As shown, the analysis and processing device 30 may include a fourth subprocessor 304, a fifth subprocessor 305, and a sixth subprocessor 306. The fourth subprocessor 304, the fifth subprocessor 305, and the sixth subprocessor 306 are all electrically connected to the central processing unit 300.

[0143] like Figure 7 As shown, the feature unit structure 101 and the second moving component 202 are grouped and arranged in a rectangular array. In the rectangular array, the direction parallel to the first direction (X) is called a row, and the direction parallel to the second direction (Y) is called a column. Multiple second moving components 202 located in the same row are electrically connected to the same subprocessor. Multiple second moving components 202 can move the same displacement under the control of the subprocessor. This arrangement can improve the moving speed of the moving device 20 and improve the working efficiency of the spectral imager. The moving displacement and moving speed of the multiple second moving components 202 controlled by multiple subprocessors can be the same or different. Second moving components 202 in different rows can move synchronously or asynchronously, etc.

[0144] Figure 8 This is a top view of the second moving component according to an embodiment of this application. Figure 8 As shown, the second moving component 202 may include a third electrode plate 2023 and a fourth electrode plate 2024 disposed at a relative interval. For example... Figure 8 As shown, there is a gap between the third electrode plate 2023 and the fourth electrode plate 2024 along the direction of movement. Figure 8 As shown, the direction of movement is the second direction (Y). When the direction of movement is the first direction (X), the structure of the second moving part 202 is the same, except that the arrangement direction is rotated, which will not be described in detail here.

[0145] like Figure 8As shown, the projection of the third electrode 2023 onto the plane formed by X and Y can be elongated. The projection of the fourth electrode 2024 onto the plane formed by X and Y can also be elongated. The third electrode 2023 is provided with a third voltage interface for inputting a third voltage to the third electrode 2023. The fourth electrode 2024 is provided with a fourth voltage interface for inputting a fourth voltage to the fourth electrode 2024. The third voltage and the fourth voltage can be different or the same. That is, there is a voltage difference between the third electrode 2023 and the fourth electrode 2024, or the voltages are the same. This disclosure does not limit the shape and arrangement of the third voltage interface and the fourth voltage interface. For example, the third voltage interface can be located at one end of the third electrode 2023 along the first direction, and the fourth voltage interface can be located at one end of the fourth electrode 2024 along the first direction. The third voltage interface and the fourth voltage interface can be located at the same end of the second moving member 202 along the first direction. For example, a portion of the third electrode 2023 can be used as the third voltage interface. The fourth plate 2024 can be used as a fourth voltage interface.

[0146] In one exemplary embodiment, such as Figure 8 As shown, the second moving component 202 may further include a support member 2025. The third electrode plate 2023 and the fourth electrode plate 2024 are arranged at intervals relative to each other along the moving direction of the second moving component 202, and are both mounted to the support member 2025. The support member 2025 can provide stable support for the third electrode plate 2023 and the fourth electrode plate 2024.

[0147] In one exemplary embodiment, such as Figure 8 As shown, the second moving component 202 may further include a moving frame 2026 at least partially disposed between the third electrode plate 2023 and the fourth electrode plate 2024. The feature unit structure 101 is located on the moving frame 2026. Due to the voltage difference between the third electrode plate 2023 and the fourth electrode plate 2024, under the action of the force generated by the voltage difference, the moving frame 2026 can drive the feature unit structure 101 to reciprocate along the second direction (Y), such as... Figure 8 The direction indicated by the dashed double-headed arrow.

[0148] The support member 2025 may have a receiving chamber. The third electrode plate 2023 and the fourth electrode plate 2024 are both installed on the support member 2025 and are all located within the receiving chamber. The movable frame 2026 is installed on the support member 2025 and is located within the receiving chamber, and can move relative to the support member 2025 along the moving direction of the second movable component 202. Within the three-dimensional space formed by the first direction, the second direction, and the third direction, for example, the support member 2025 may be a hollow cylinder or a box, etc.

[0149] In one exemplary embodiment, such as Figure 8As shown, the movable frame 2026 may include a first movable arm 2027 and a second movable arm 2028 disposed opposite to each other. The first movable arm 2027 and the second movable arm 2028 are spaced apart along the moving direction of the second movable component 202, such as... Figure 8 As shown, the first movable arm 2027 and the second movable arm 2028 are spaced apart along the second direction (Y). Both the first movable arm 2027 and the second movable arm 2028 extend along the first direction (X) and together provide support for the feature unit structure 101.

[0150] like Figure 8 As shown, at least a portion of the first movable arm 2027 may be located between the third electrode plate 2023 and the fourth electrode plate 2024. At least a portion of the second movable arm 2028 may be located between the third electrode plate 2023 and the fourth electrode plate 2024. The feature unit structure 101 can move along the moving direction of the second movable component 202 under the combined drive of the first movable arm 2027 and the second movable arm 2028.

[0151] like Figure 8 As shown, the movable frame 2026 may further include a movable body 2029. The movable body 2029 can extend along the moving direction of the second movable component 202. The first movable arm 2027 and the second movable arm 2028 are both mounted to the movable body 2029. The end of the first movable arm 2027 away from the third electrode plate 2023 is mounted to the movable body 2029. The end of the second movable arm 2028 away from the fourth electrode plate 2024 is mounted to the movable body 2029.

[0152] In one exemplary embodiment, such as Figure 8 As shown, the movable frame 2026 may further include a first auxiliary support arm 2030 and a second auxiliary support arm 2031. The first auxiliary support arm 2030 and the second auxiliary support arm 2031 are located between the first movable arm 2027 and the second movable arm 2028. Both the first auxiliary support arm 2030 and the second auxiliary support arm 2031 extend along a first direction. The end of the first auxiliary support arm 2030 is mounted to the movable body 2029. The end of the second auxiliary support arm 2031 is mounted to the movable body 2029, and both the first auxiliary support arm 2030 and the second auxiliary support arm 2031 are located on the same side of the extending direction of the movable body 2029. Figure 8 As shown, the feature unit structure 101 can be located on the bearing surface jointly formed by the first auxiliary bearing arm 2030 and the second auxiliary bearing arm 2031.

[0153] In one exemplary embodiment, such as Figure 8As shown, the second moving component 202 may include at least one third comb tooth 2032. The third comb tooth 2032 may be disposed on the third electrode plate 2023, or on the fourth electrode plate 2024, or on both the third electrode plate 2023 and the fourth electrode plate 2024. The second moving component 202 may also include at least one fourth comb tooth 2033. The fourth comb tooth 2033 is disposed on the moving frame 2026. Along the moving direction of the second moving component 202, the fourth comb tooth 2033 may engage with the third comb tooth 2032. The mutual engagement of the fourth comb tooth 2033 and the third comb tooth 2032 can enhance the electrostatic effect of the second moving component 202 and improve its moving performance.

[0154] In one exemplary embodiment, such as Figure 8 As shown, multiple third comb teeth 2032 can be disposed on the third electrode plate 2023 and the fourth electrode plate 2024, and the multiple third comb teeth 2032 can extend towards each other along the moving direction (second direction) of the second moving member 202. Multiple fourth comb teeth 2033 can be disposed on the moving frame 2026, and are arranged in groups with the multiple third comb teeth 2032 facing each other. There is a spacing along the first direction (X) between the third comb teeth 2032 and the fourth comb teeth 2033 facing each other.

[0155] In one exemplary embodiment, such as Figure 8 As shown, multiple fourth comb teeth 2033 can be disposed on the first movable arm 2027 and the second movable arm 2028. Multiple third comb teeth 2032 and multiple fourth comb teeth 2033 are arranged in groups facing each other. There is a spacing along the first direction (X) between the third comb teeth 2032 and the fourth comb teeth 2033 arranged opposite to them.

[0156] In one exemplary embodiment, such as Figure 8 As shown, the second moving part 202 can be configured as a structure that is symmetrical about itself along the third central axis 30a, which is parallel to the first direction (X).

[0157] In one exemplary embodiment, such as Figure 8 As shown, the second moving part 202 can be configured as a structure that is symmetrical about itself along the fourth central axis 30b, which is parallel to the second direction (Y).

[0158] In one exemplary embodiment, such as Figure 8 As shown, the second moving part 202 can be configured to be symmetrical about itself along the third central axis 30a and about itself along the fourth central axis 30b.

[0159] In one exemplary embodiment, such as Figure 8As shown, the second moving component 202 may further include a fifth electrode plate 2034 and a sixth electrode plate 2035. The fifth electrode plate 2034 may be located on the side of the third electrode plate 2023 away from the fourth electrode plate 2024. The sixth electrode plate 2035 may be located on the side of the fourth electrode plate 2024 away from the third electrode plate 2023. At least a portion of the moving frame 2026 is located between the fifth electrode plate 2034 and the third electrode plate 2023, and at least a portion of the moving frame 2026 is located between the sixth electrode plate 2035 and the fourth electrode plate 2024.

[0160] The fifth electrode plate 2034 and the sixth electrode plate 2035 can both be installed on the support member 2025, and are located on the same side of the support member 2025 as the third electrode plate 2023 and the fourth electrode plate 2024. Adding the fifth electrode plate 2034 and the sixth electrode plate 2035, compared to only using one set of third electrode plates 2023 and fourth electrode plates 2024, can increase the moving speed of the second moving component 202 and improve detection efficiency.

[0161] In one exemplary embodiment, the fifth electrode plate 2034 is provided with a fifth voltage interface for inputting a fifth voltage to the fifth electrode plate 2034. The sixth electrode plate 2035 is provided with a sixth voltage interface for inputting a sixth voltage to the sixth electrode plate 2035. The fifth voltage and the sixth voltage may be different or the same. That is, there may be a voltage difference between the fifth electrode plate 2034 and the sixth electrode plate 2035, or the voltages may be the same. This disclosure does not limit the shape or arrangement of the fifth and sixth voltage interfaces.

[0162] In one exemplary embodiment, the input voltage of the fifth voltage interface may be the same as the input voltage of the third voltage interface. The input voltage of the sixth voltage interface may be the same as the input voltage of the fourth voltage interface.

[0163] In one exemplary embodiment, such as Figure 8 As shown, the movable frame 2026 may include a third movable arm 2036 and a fourth movable arm 2037 disposed opposite to each other. The third movable arm 2036 and the fourth movable arm 2037 are spaced apart along the moving direction of the second movable member 202, as shown... Figure 8 As shown, the third moving arm 2036 and the fourth moving arm 2037 are spaced apart along the second direction (Y). Both the third moving arm 2036 and the fourth moving arm 2037 extend along the first direction (X).

[0164] like Figure 8As shown, the third moving arm 2036 and the fourth moving arm 2037 are located between the fifth electrode plate 2034 and the sixth electrode plate 2035. Both the third moving arm 2036 and the fourth moving arm 2037 are mounted to the moving body 2029. The end of the third moving arm 2036 away from the fifth electrode plate 2034 is mounted to the moving body 2029. The end of the fourth moving arm 2037 away from the sixth electrode plate 2035 is mounted to the moving body 2029.

[0165] In one exemplary embodiment, such as Figure 8 As shown, multiple third comb teeth 2032 can be disposed on the fifth electrode plate 2034 and the sixth electrode plate 2035. The multiple third comb teeth 2032 can extend towards each other along the moving direction (second direction) of the second moving member 202. Multiple fourth comb teeth 2033 can be disposed on the third moving arm 2036 and the fourth moving arm 2037. The multiple third comb teeth 2032 and the multiple fourth comb teeth 2033 are arranged in groups facing each other. There is a spacing along the first direction (X) between the third comb teeth 2032 and the fourth comb teeth 2033 facing each other.

[0166] Figure 9 This is a top view schematic diagram of a spectral imager according to another embodiment of this application. Figure 9 As shown, the moving component may include at least one third moving component 203. The third moving component 203 may be arranged in a one-to-one correspondence with the feature unit structure 101. The feature unit structure 101 may move along a first direction and a second direction under the drive of the third moving component 203.

[0167] In one exemplary embodiment, such as Figure 9 As shown, the analysis and processing device 30 may include a seventh subprocessor 307, an eighth subprocessor 308, and a ninth subprocessor 309. The seventh subprocessor 307, the eighth subprocessor 308, and the ninth subprocessor 309 may all be electrically connected to the central processing unit 300.

[0168] Figure 10 This is a top view of the third moving component according to an embodiment of this application. Figure 10 As shown, the third moving component 203 may include a first moving component 201 and a second moving component 202. The structures of the first moving component 201 and the second moving component 202 are as described above.

[0169] The second moving component 202 can be located between the first electrode plate 2011 and the second electrode plate 2012. The second moving component 202 can move as a whole along the moving direction of the first moving component 201 under the drive of the moving part 2013. In this embodiment, the moving direction of the first moving component 201 is referred to as the first moving direction, and the moving direction of the second moving component 202 is referred to as the second moving direction, which is different from the first moving direction. The plane formed by the second moving direction and the first moving direction is parallel to the plane where the feature unit structure 101 is located.

[0170] like Figure 10 As shown, the second moving part 202 may be located between the first part 2014 and the second part 2015. One end of the second moving part 202 along the first moving direction may be connected to the first part 2014 via the connecting part 2016, and the other end of the second moving part 202 along the first moving direction may be connected to the second part 2015 via the connecting part 2016.

[0171] In one exemplary embodiment, such as Figure 10 As shown, the third moving part 203 may also include a bridging portion 204. The support member 2025 of the second moving part 202 is connected to the first part 2014 and the second part 2015 via the bridging portion 204.

[0172] In one exemplary embodiment, such as Figure 10 As shown, the third moving part 203 can be configured as a structure that is symmetrical about itself along the fifth central axis 40a, which is parallel to the first direction (X).

[0173] In one exemplary embodiment, such as Figure 10 As shown, the third moving part 203 can be configured as a structure that is symmetrical about itself along the sixth central axis 40b, which is parallel to the second direction (Y).

[0174] In one exemplary embodiment, such as Figure 10 As shown, the third moving part 203 can be configured to be symmetrical about itself along the fifth central axis 40a and about itself along the sixth central axis 40b.

[0175] The technical solution of this embodiment is further illustrated below through a fabrication process of the photosensitive structure group in this embodiment. The "patterning process" mentioned in this embodiment includes processes such as film deposition, photoresist coating, mask exposure, development, etching, and photoresist stripping, which are mature fabrication processes in related technologies. Deposition can employ known processes such as sputtering and chemical vapor deposition, coating can employ known coating processes, and etching can employ known methods; no specific limitations are made here.

[0176] Figures 11A to 11LThis is a flowchart illustrating the fabrication process of the photosensitive structure assembly in an embodiment of this application. Figures 11A to 11L As shown, the fabrication method of the photosensitive structure group may include the following steps:

[0177] (1) Preparation of the first insulating layer: A first insulating film can be prepared on the substrate layer 1 using a low-pressure growth method. A patterning process is then used to prepare the first insulating layer 2, such as... Figure 11A , Figure 11B As shown.

[0178] (2) Fabrication of the active layer: The active layer 3 can be fabricated on the first insulating layer 2 using processes such as doping, for example... Figure 11C As shown.

[0179] (3) Prepare the second insulating layer. A second insulating film can be prepared on the active layer 3 using a low-pressure growth method. A patterning process is then used to prepare the second insulating layer 4, such as... Figure 11D As shown.

[0180] (4) Prepare a barrier layer: Deposit a barrier film on the second insulating layer 4, and use a patterning process to prepare the barrier layer 5, such as... Figure 11E As shown.

[0181] (5) Prepare the first sacrificial layer: deposit the first sacrificial film on the barrier layer 5, and use a patterning process to prepare the first sacrificial layer 6, such as... Figure 11F As shown.

[0182] (6) Fabrication of a functional layer: A functional layer film is fabricated on the first sacrificial layer 6. A patterning process is used on the functional layer film to fabricate the functional layer 7, such as... Figure 11G As shown. Functional layer 7 may include connecting components, a first comb tooth, and a second comb tooth, etc.

[0183] (7) Prepare a second sacrificial layer. Deposit a second sacrificial film on the functional layer 7, and use a patterning process to prepare the second sacrificial layer 8, such as... Figure 11H As shown.

[0184] (8) Prepare a metal layer: Prepare a metal layer 105 on the second sacrificial layer 8 using processes such as deposition, for example... Figure 11I As shown.

[0185] (9) Fabrication of a dielectric layer: A dielectric layer 106 is fabricated on the metal layer 105 using processes such as electron beam evaporation, for example... Figure 11J As shown.

[0186] (10) To prepare a metal nanostructure, a metal thin film is deposited on the dielectric layer 106, and a patterning process is used on the metal thin film to prepare a metal nanostructure 103, such as... Figure 11K As shown.

[0187] (11) Fabrication of a photosensitive structure assembly: The first sacrificial layer 6 and the second sacrificial layer 8 are removed from the above structure using processes such as vapor phase etching to obtain the photosensitive structure assembly, as follows: Figure 11L As shown.

[0188] This application also provides a method for using a spectral imager. The method includes:

[0189] The side of the thermo-optical detector with the metal nanostructure is oriented toward the light source to be detected.

[0190] Adjust the moving component so that it drives the feature unit structure to move, thereby changing the relative position of the feature unit structure and the light source to be detected.

[0191] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A light-sensing structure assembly, characterized in that, For use in spectral imagers, including: A thermal optical detector includes at least one feature unit structure, said feature unit structure comprising a plurality of metal nanostructures; and The moving device includes at least one moving component, which is arranged in a one-to-one correspondence with the feature unit structure; the moving component is configured to drive the feature unit structure to move, thereby changing the relative position of the feature unit structure and the light source to be detected; the moving distance of the metal nanostructure relative to the light source varies from 0 to 10 nanometers, so that the spectral imager can achieve continuous tuning variation in the wavelength range of 500 nanometers to 630 nanometers.

2. The light-sensing structure assembly as described in claim 1, characterized in that, The moving component includes at least one first moving component, which is configured to drive the feature unit structure to move along a first moving direction; or... The moving component includes at least one second moving component, the second moving component being configured to drive the feature unit structure to move along a second moving direction; or... The moving component includes at least one third moving component, which is configured to drive the feature unit structure to move along the first moving direction and the second moving direction; The first moving direction is different from the second moving direction, and the plane formed by them is parallel to the plane where the feature unit structure is located.

3. The light-sensing structure assembly as described in claim 2, characterized in that, The first moving component includes: The first electrode plate is provided with a first voltage interface for inputting a first voltage; A second electrode plate is disposed opposite to and spaced from the first electrode plate along the first moving direction; the second electrode plate is provided with a second voltage interface for inputting a second voltage; and... A movable part is located between the first electrode plate and the second electrode plate, and the movable part is configured to drive the feature unit structure to move along the first moving direction under the action of the voltage difference between the first voltage and the second voltage.

4. The light-sensing structure assembly as described in claim 3, characterized in that, The moving part includes: Part One; The second part is positioned opposite and spaced apart from the first part along the first moving direction; and A connecting component is located between the first part and the second part; the first part and the second part are connected via the connecting component.

5. The light-sensing structure assembly as described in claim 4, characterized in that, The connecting component includes: First extending arm; The second extension arm is disposed opposite to and spaced apart from the first extension arm along the first moving direction; and A connecting arm is located between the first extending arm and the second extending arm; the connecting arm extends along the first moving direction, and one end of the connecting arm along the first moving direction is connected to the first extending arm, and the other end of the connecting arm along the first moving direction is connected to the second extending arm; The first extension arm is connected to the first part, and the second extension arm is connected to the second part.

6. The light-sensing structure assembly as described in claim 5, characterized in that, The first extension arm and the second extension arm are located on the same side of the connecting arm along the first direction of movement; The end of the first extension arm closer to the connecting arm is connected to the connecting arm, and the end of the first extension arm farther from the connecting arm is connected to the first part. The end of the second extension arm closer to the connecting arm is connected to the connecting arm, and the end of the second extension arm farther from the connecting arm is connected to the second part.

7. The light-sensing structure group as described in any one of claims 3 to 6, characterized in that, The first moving component includes at least one first comb tooth and at least one second comb tooth; The first comb tooth is disposed on at least one of the first electrode plate and the second electrode plate, and the first comb tooth extends along the first moving direction and toward the center of the first moving component; The second comb tooth is disposed on the moving part and extends towards the first comb tooth along the first moving direction.

8. The light-sensing structure assembly as described in claim 2, characterized in that, The second moving component includes: Support components; The third electrode plate is provided with a third voltage interface for inputting a third voltage and is mounted to the support member; A fourth electrode plate, disposed opposite and spaced apart from the third electrode plate along the second moving direction; the fourth electrode plate is provided with a fourth voltage interface for inputting a fourth voltage, and the fourth electrode plate is mounted to the support member; and A movable frame, at least partially located between the third and fourth electrode plates, is configured to move the feature unit structure relative to the support member along the second moving direction under the action of the voltage difference between the third and fourth voltages.

9. The light-sensing structure assembly as described in claim 8, characterized in that, The mobile frame includes: The moving body extends along the second moving direction; A first movable arm is mounted to the movable body, and at least a portion of the first movable arm is located between the third electrode plate and the fourth electrode plate; The second movable arm is mounted to the movable body and is located on the same side of the movable body in the extending direction of the movable body as the first movable arm. At least a portion of the second movable arm is located between the third electrode plate and the fourth electrode plate.

10. The light-sensing structure assembly as described in claim 9, characterized in that, The mobile frame also includes: A first auxiliary support arm is installed to the mobile body; the first auxiliary support arm is located between the first mobile arm and the second mobile arm. The second auxiliary support arm is installed on the moving body and is located on the same side of the moving body in the extending direction of the first auxiliary support arm; the second auxiliary support arm is located between the first moving arm and the second moving arm; The feature unit structure is located on the bearing surface jointly formed by the first auxiliary bearing arm and the second auxiliary bearing arm.

11. The light-sensing structure assembly as described in claim 9, characterized in that, The second moving component also includes: The fifth electrode plate is provided with a fifth voltage interface for inputting a fifth voltage and is installed to the support member; the fifth electrode plate is located on the side of the third electrode plate away from the fourth electrode plate; The sixth electrode plate is disposed opposite to and spaced apart from the fifth electrode plate along the second moving direction, and the sixth electrode plate is located on the side of the fourth electrode plate away from the third electrode plate; the sixth electrode plate is provided with a sixth voltage interface for inputting a sixth voltage, and the sixth electrode plate is mounted to the support member; At least a portion of the movable frame is located between the fifth electrode plate and the third electrode plate, and at least a portion of the movable frame is located between the sixth electrode plate and the fourth electrode plate; The fifth voltage is the same as the third voltage, and the sixth voltage is the same as the fourth voltage.

12. The light-sensing structure assembly as described in claim 11, characterized in that, The mobile frame also includes: A third movable arm is mounted to the movable body, and at least a portion of the third movable arm is located between the fifth electrode plate and the third electrode plate; A fourth movable arm is mounted to the movable body and is located on the same side of the moving body in the extending direction of the moving body as the third movable arm. At least a portion of the fourth movable arm is located between the sixth electrode plate and the fourth electrode plate.

13. The light-sensing structure group as described in any one of claims 8 to 12, characterized in that, The second moving component also includes at least one third comb tooth and at least one fourth comb tooth; The third comb tooth is disposed on at least one of the third electrode plate and the fourth electrode plate, and the third comb tooth extends along the second moving direction and toward the center of the second moving component; The fourth comb tooth is disposed on the movable frame and extends towards the third comb tooth along the second moving direction.

14. The light-sensing structure assembly as described in claim 2, characterized in that, The third moving component includes a first moving component and a second moving component; the second moving component is disposed within the first moving component, and the feature unit structure is disposed in the second moving component; The feature unit structure, together with the second moving component, moves along the first moving direction under the drive of the first moving component.

15. A spectral imager, characterized in that, Includes the light-sensing structure group as described in any one of claims 1 to 14.

16. A method of using a spectral imager, characterized in that, Applied to the spectral imager as described in claim 15, the method of use includes: The side of the thermo-optical detector with the metal nanostructure is oriented toward the light source to be detected. Adjust the moving component so that it drives the feature unit structure to move, thereby changing the relative position of the feature unit structure and the light source to be detected.

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