Light emitting element substrate

Abstract

A light emitting element substrate includes a temporary substrate, a plurality of light emitting elements, an adhesive layer, and a light blocking pattern layer. The light emitting elements are disposed on the temporary substrate. The adhesive layer connects the temporary substrate and the light emitting elements. The light blocking pattern layer is disposed on the temporary substrate and has a plurality of openings. The light emitting elements are disposed corresponding to the openings, respectively.

Description

Technical Field

[0001] This invention relates to a component substrate, and more particularly to a light-emitting component substrate. Background Technology

[0002] In recent years, in addition to the advantages of high color saturation, fast response speed and high contrast, micro light-emitting diode displays have also had advantages over organic light-emitting diode displays, such as lower energy consumption and longer material lifespan, thus attracting a lot of market investment.

[0003] To achieve lower production costs and greater product design margins, the manufacturing technology for miniature LED displays employs a die transfer process. Specifically, the die manufacturer first fabricates (or places) the miniature LED chips required by the customer on a temporary substrate. The customer then transfers the miniature LED chips stored on the temporary substrate to the driver circuit boards of different products according to different application requirements.

[0004] However, the heat generated during the thermal bonding process of the grains can easily cause the adhesive layer on the temporary substrate to warp, resulting in an unpredictable shift in the bonding position of the grains and a decrease in bonding yield. Summary of the Invention

[0005] The present invention provides a light-emitting element substrate with a high bonding yield.

[0006] The light-emitting element substrate of the present invention includes a temporary substrate, a plurality of light-emitting elements, an adhesive layer, and a light-shielding pattern layer. The light-emitting elements are disposed on the temporary substrate. The adhesive layer connects the temporary substrate and the light-emitting elements. The light-shielding pattern layer is disposed on the temporary substrate and has a plurality of openings. The light-emitting elements are respectively disposed corresponding to these openings.

[0007] Based on the above, in a light-emitting element substrate according to an embodiment of the present invention, a plurality of light-emitting elements are temporarily adsorbed onto a temporary substrate via an adhesive layer, and these light-emitting elements are suitable for bonding to a target substrate (e.g., a circuit board). During the bonding process, a light-shielding pattern layer disposed on the temporary substrate blocks the portion of the area without light-emitting elements, significantly reducing the chance of laser beams irradiating the non-bonded area. Therefore, excessive heat energy received by the adhesive layer during the bonding process of the light-emitting elements can be avoided, thus preventing warping and improving the bonding accuracy of the light-emitting elements on the target substrate. Furthermore, it effectively mitigates the phenomenon of irregular offset of the bonding position of the light-emitting elements due to adhesive layer warping. Attached Figure Description

[0008] Figure 1 This is a top view of the light-emitting element substrate according to the first embodiment of the present invention.

[0009] Figure 2yes Figure 1 A cross-sectional schematic diagram of the light-emitting element substrate.

[0010] Figures 3A to 3C yes Figure 1 A cross-sectional schematic diagram of the bonding process between multiple light-emitting elements and the circuit board.

[0011] Figure 4 yes Figure 1 Transmittance distribution of the middle adhesive layer with respect to wavelength.

[0012] Figure 5 yes Figure 2 A cross-sectional schematic diagram of the light-emitting element substrate of another modified embodiment.

[0013] Figure 6 This is a top view of the light-emitting element substrate according to the second embodiment of the present invention.

[0014] Figure 7 yes Figure 6 A top view schematic diagram of a light-emitting element substrate in another modified embodiment.

[0015] Figure 8 This is a top view schematic diagram of the light-emitting element substrate according to the third embodiment of the present invention.

[0016] Figure 9 This is a top view of the light-emitting element substrate according to the fourth embodiment of the present invention.

[0017] Figure 10 yes Figure 9 A top view schematic diagram of a light-emitting element substrate in another modified embodiment.

[0018] Figure 11 yes Figure 1 A top view schematic diagram of a light-emitting element substrate in another modified embodiment.

[0019] In the attached figures, the following labels are used:

[0020] 10, 10A, 10B, 11, 11A, 11B, 12, 13: Light-emitting element substrate

[0021] 100: Temporary substrate

[0022] 100s1, 100s2: Surface

[0023] 110, 111, 112, 113, 112A, 112B: Light-emitting elements

[0024] 120: Adhesive layer

[0025] 150, 150A, 150B, 150C, 150D, 150E: Light-blocking pattern layer

[0026] 200: Circuit board

[0027] 300: Laser source

[0028] BP1, BP2: Joint pads

[0029] d1, d1': First shortest distance

[0030] d2, d2', d2”, d2a: Second shortest distance

[0031] d3: Third shortest distance

[0032] E1: First electrode

[0033] E2: Second electrode

[0034] ES: Epitaxial layer

[0035] LB: Laser beam

[0036] OP, OP-A, OP-B, OP-C, OP-D: opening

[0037] OPe, OPe-A, OPe-B: Opening edge

[0038] P1: First pitch

[0039] P2: Second pitch

[0040] TU: Transfer Unit

[0041] X, Y: Direction Detailed Implementation

[0042] As used herein, “about,” “approximately,” “essentially,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or, for example, within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” “essentially,” or “substantially” herein may be chosen based on the nature of the measurement, the cutting nature, or other properties, and a single standard deviation may not be applicable to all properties.

[0043] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, an "electrical connection" may mean the presence of other elements between two elements.

[0044] Furthermore, relative terms such as "below" or "bottom" and "above" or "top" may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being "below" to another element will be oriented "above" to that element. Thus, the exemplary term "below" can include both "below" and "above" orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being "below" or "under" another element will be oriented "above" to that element. Thus, the exemplary terms "above" or "below" can include both "above" and "below" orientations.

[0045] This document describes exemplary embodiments with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Therefore, variations in the shape of the illustrations can be expected as a result of, for example, manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0046] The invention will now be described in detail with reference to exemplary embodiments thereof, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0047] Figure 1 This is a top view of the light-emitting element substrate according to the first embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional schematic diagram of the light-emitting element substrate. Figures 3A to 3C yes Figure 1 A cross-sectional schematic diagram of the bonding process between multiple light-emitting elements and the circuit board. Figure 4 yes Figure 1Transmittance distribution of the middle adhesive layer with respect to wavelength. Figure 5 yes Figure 2 A cross-sectional schematic diagram of the light-emitting element substrate of another modified embodiment. For clarity, Figure 1 Omitted Figure 2 The drawing of the adhesive layer 120.

[0048] Please refer to Figure 1 and Figure 2 The light-emitting element substrate 10 includes a temporary substrate 100, a plurality of light-emitting elements 110, and an adhesive layer 120. These light-emitting elements 110 are disposed on the temporary substrate 100. In this embodiment, these light-emitting elements 110 can be arranged into a plurality of transfer units TU. The light-emitting element 110 is, for example, a micro light-emitting diode (micro-LED) and may include an epitaxial structure layer ES, a first electrode E1, and a second electrode E2. The epitaxial structure layer ES is, for example, at least a stacked structure of a first type semiconductor layer (not shown), a light-emitting layer (not shown), and a second type semiconductor layer (not shown), and the first electrode E1 and the second electrode E2 are electrically connected to the first type semiconductor layer and the second type semiconductor layer, respectively.

[0049] For example, these light-emitting elements 110 include multiple light-emitting elements 111, multiple light-emitting elements 112, and multiple light-emitting elements 113, and each transfer unit TU has one light-emitting element 111, one light-emitting element 112, and one light-emitting element 113, but this is not a limitation. Light-emitting elements 111, 112, and 113 can emit different colors of light, such as red, green, and blue light. That is, after being transferred onto the driving circuit board, the transfer unit TU of this embodiment can constitute a display pixel of the display panel. However, the present invention is not limited thereto. In other embodiments not shown, the number of light-emitting elements 110 and the types of emitted colors in the transfer unit TU can be adjusted according to the actual application.

[0050] On the other hand, the adhesive layer 120 is disposed between the plurality of light-emitting elements 110 and the temporary substrate 100, and connects the light-emitting elements 110 and the temporary substrate 100. More specifically, the light-emitting elements 110 are attached to the temporary substrate 100 by means of the adhesive layer 120. The material of the adhesive layer 120 includes acrylic gel, polyurethane (PU), epoxy resin, silicone, or other adhesive organic materials.

[0051] Of particular note is that the light-emitting element substrate 10 also includes a light-shielding pattern layer 150 disposed on the temporary substrate 100. The material of the light-shielding pattern layer 150 may include chromium, molybdenum, or molybdenum nitride (MoN). x ), titanium, titanium nitride (TiN)x (e.g., metal or multilayer film with infrared light penetration resistance). In this embodiment, the temporary substrate 100 has surfaces 100s1 and 100s2 that are opposite to each other, wherein a plurality of light-emitting elements 110 and an adhesive layer 120 are disposed on surface 100s1 of the temporary substrate 100, and a light-shielding pattern layer 150 is disposed on surface 100s2 of the temporary substrate 100. However, the present invention is not limited thereto. In another modified embodiment, the light-shielding pattern layer 150A of the light-emitting element substrate 10A may be disposed on surface 100s1 of the temporary substrate 100 and covered by the adhesive layer 120 (e.g., metal or multilayer film with infrared light penetration resistance). Figure 5 (As shown). In another embodiment not shown, the light-shielding pattern layer may also be formed on another substrate, which overlaps with the temporary substrate 100.

[0052] The light-shielding pattern layer 150 has multiple openings OP that overlap multiple light-emitting elements 110. Each of the multiple openings OP of the light-shielding pattern layer 150 corresponds to a multiple transfer unit TU. More specifically, each opening OP overlaps with light-emitting elements 111, 112, and 113. It is particularly noteworthy that, in the bonding process between the light-emitting elements 110 and the target substrate using the light-emitting element substrate 10 of this embodiment, the configuration of the light-shielding pattern layer 150 is used to define the irradiable area of ​​the laser beam on the temporary substrate 100 and the target substrate during bonding.

[0053] The following will provide an exemplary description of the bonding process between the light-emitting element substrate 10 and the circuit board 200 (i.e., the target substrate).

[0054] Please refer to Figure 3A First, the light-emitting element substrate 10 is aligned with the circuit board 200, wherein a plurality of light-emitting elements 110 on the light-emitting element substrate 10 are arranged facing a plurality of bonding pads on the circuit board 200. In this embodiment, the plurality of bonding pads include, for example, a plurality of first bonding pads BP1 and a plurality of second bonding pads BP2, wherein an adjacent first bonding pad BP1 and a second bonding pad BP2 can form a bonding pad group for bonding a light-emitting element 110, but is not limited thereto.

[0055] For example, in the bonding process, it can be Figure 2 The light-emitting element substrate 10 is inverted to form Figure 3A The arrangement of the components is as follows. However, the present invention is not limited to this. In other embodiments, the circuit board 200 may be flipped so that the bonding pads on it are facing the light-emitting elements 110 on the light-emitting element substrate 10. After alignment, the light-emitting element substrate 10 is brought close to the circuit board 200 so that the plurality of light-emitting elements 110 on the light-emitting element substrate 10 respectively contact the plurality of pad groups (i.e., the first bonding pad BP1 and the second bonding pad BP2) on the circuit board 200.

[0056] Next, a laser heating step is performed, such as... Figure 3B As shown. For example, in this embodiment, the laser beam LB emitted by the laser source 300 used to perform this step can be an infrared laser, but is not limited thereto. The infrared laser beam LB heats the area between the electrodes and the bonding pads of the light-emitting element 110 after passing through the light-emitting element substrate 10. In order to reduce the light energy loss of the laser beam LB after passing through the light-emitting element substrate 10, the adhesive layer 120 needs to have good transmittance in the infrared band. Figure 4 As shown, the transmittance of the adhesive layer 120 in this embodiment for light with a wavelength greater than 950 nm (i.e., infrared light) is greater than 98%. It should be noted that the transmittance here is, for example, the average transmittance of the adhesive layer 120 for light with a wavelength greater than 950 nm and different wavelengths.

[0057] From another perspective, the adhesive layer 120 has a high transmittance for the laser beam LB and also prevents the laser beam LB from being absorbed by the adhesive layer 120, thus avoiding the generation of heat energy sufficient to warp the adhesive layer 120. Therefore, it can be ensured that the bonding position of the light-emitting element 110 on the circuit board 200 will not shift due to the warping of the adhesive layer 120, which helps to ensure the bonding accuracy of the light-emitting element 110 on the circuit board 200.

[0058] Please refer to Figure 3B In this embodiment, the laser source 300 can scan and heat the junction between the light-emitting element substrate 10 and the circuit board 200 along at least one direction (e.g., direction X), allowing the first electrode E1 and the second electrode E2 of the sequentially irradiated light-emitting element 110 to be firmly bonded to the first bonding pad BP1 and the second bonding pad BP2, respectively. It is particularly noteworthy that during the laser beam LB scanning heating process, the provision of the light-shielding pattern layer 150 prevents at least a portion of the area (i.e., the non-bonding area) without light-emitting elements 110 and bonding pads from being irradiated by the laser beam LB. Therefore, the heat generated in the non-bonding area during the bonding process can be significantly reduced, thereby preventing the adhesive layer 120 from warping and affecting the bonding accuracy of adjacent light-emitting elements 110.

[0059] After the laser heating step is completed, move the temporary substrate 100 away from the circuit board 200, such as... Figure 3CAs shown. Because the light-emitting element 110 and the overlapping bonding pads form a stable bond after the laser heating process, when the temporary substrate 100 moves away from the circuit board 200, the light-emitting element 110 will detach from the adhesive layer 120 on the temporary substrate 100 and remain on the circuit board 200. For example, in this embodiment, multiple light-emitting elements 110 can form a display panel after being transferred and bonded to the circuit board 200, but this is not a limitation.

[0060] Please refer to Figure 1 In this embodiment, light-emitting elements 111, 112, and 113 overlapping the same opening OP can be arranged sequentially along direction X (i.e., the first direction), and multiple light-emitting elements 110 overlapping different openings OP can be arranged at intervals along direction X and direction Y (i.e., the second direction), respectively. For example, multiple light-emitting elements 111 overlapping different openings OP can be arranged at intervals along direction X with a first pitch P1 and at intervals along direction Y with a second pitch P2, wherein direction X is perpendicular to direction Y. Multiple light-emitting elements 112 or multiple light-emitting elements 113 overlapping different openings OP are also arranged in a similar manner, and will not be described in detail here.

[0061] On the other hand, the light-shielding pattern layer 150 also has an opening edge OPe that defines the opening OP. Each of the plurality of light-emitting elements 111 (i.e., first light-emitting elements) has a first shortest distance d1 and a second shortest distance d2 with the opening edge OPe of the overlapping opening OP along the X and Y directions, respectively. Each of the plurality of light-emitting elements 112 (i.e., third light-emitting elements) has a third shortest distance d3 and a second shortest distance d2 with the opening edge OPe of the overlapping opening OP along the X and Y directions, respectively. Each of the plurality of light-emitting elements 113 (i.e., second light-emitting elements) has a first shortest distance d1 and a second shortest distance d2 with the opening edge OPe of the overlapping opening OP along the X and Y directions, respectively.

[0062] In this embodiment, the first shortest distance d1 can be equal to the second shortest distance d2, and the second shortest distance d2 is not equal to the third shortest distance d3. It should be noted that, in order to avoid laser beam LB (e.g., Figure 3B As shown, after passing through multiple openings OP of the light-shielding pattern layer 150, diffraction occurs, and part of the light beam illuminates the area to be blocked by the light-shielding pattern layer 150. Preferably, the percentage value of the opening area of ​​the opening OP of the light-shielding pattern layer 150 relative to the product of the first pitch P1 and the second pitch P2 is greater than 3% and less than 46%. From another perspective, by further defining the size of the openings OP of the light-shielding pattern layer 150 as described above, it is also possible to prevent circuit components on the circuit board 200 located outside the opening OP area of ​​the light-shielding pattern layer 150 from being irradiated by the diffraction component of the laser beam LB, thus avoiding damage to their electrical properties.

[0063] The following are some other embodiments to illustrate the present invention in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and they will not be repeated below.

[0064] Figure 6 This is a top view of the light-emitting element substrate according to the second embodiment of the present invention. Figure 7 yes Figure 6 A top view schematic diagram of the light-emitting element substrate of another modified embodiment. Please refer to... Figure 7 In this embodiment, the light-emitting element substrate 11 and Figure 1 The difference in the light-emitting element substrate 10 lies in the arrangement of the multiple light-emitting elements within the same opening. Specifically, in this embodiment, light-emitting element 112A (i.e., the third light-emitting element) and light-emitting element 113 (i.e., the second light-emitting element) are arranged along direction Y (i.e., the second direction). That is, the light-emitting elements 111, 112A, and 113 overlapping the same opening OP-A of the light-shielding pattern layer 150B are not arranged in a row or column along a single direction. However, the present invention is not limited to this. In another embodiment, the light-emitting element 112B of the light-emitting element substrate 11A is offset from light-emitting elements 111 and 113 along both directions X and Y (e.g., ...). Figure 7 (As shown), for example, they are arranged in a triangular pattern.

[0065] In this embodiment, each of the plurality of light-emitting elements 111 (i.e., first light-emitting elements) has a first shortest distance d1' and a second shortest distance d2' with the opening edge OPe-A of the overlapping opening OP-A along the X and Y directions, respectively. Each of the plurality of light-emitting elements 112A (i.e., third light-emitting elements) has a first shortest distance d1' and a second shortest distance d2' with the opening edge OPe-A of the overlapping opening OP-A along the X and Y directions, respectively. Each of the plurality of light-emitting elements 113 (i.e., second light-emitting elements) has a first shortest distance d1' and a second shortest distance d2' with the opening edge OPe-A of the overlapping opening OP-A along the X and Y directions, respectively. The first shortest distance d1' may be equal to the second shortest distance d2'.

[0066] To prevent the laser beam from diffracting after passing through the multiple openings OP-A of the light-shielding pattern layer 150B, thus avoiding some beam from illuminating the area to be blocked by the light-shielding pattern layer 150B, the percentage value of the opening area of ​​the openings OP-A of the light-shielding pattern layer 150B relative to the product of the first pitch P1 and the second pitch P2 is preferably greater than 4% and less than 66%. From another perspective, by further defining the size of the openings OP-A of the light-shielding pattern layer 150B as described above, it is also possible to avoid issues with the circuit board (such as...) Figure 3BCircuit components located outside the opening OP-A area of ​​the light-shielding pattern layer 150B on the circuit board 200 may be affected or damaged by the diffraction component of the laser beam.

[0067] Figure 8 This is a top view schematic diagram of the light-emitting element substrate according to the third embodiment of the present invention. Please refer to... Figure 8 In this embodiment, the light-emitting element substrate 10B and Figure 1 The difference between the light-emitting element substrate 10 and the light-shielding pattern layer is that the opening configuration of the light-shielding pattern layer is different. Specifically, in this embodiment, the first shortest distance d1 between the light-emitting elements 111 and 113 overlapping the same opening OP-B of the light-shielding pattern layer 150C and the opening edge OPe-B along the direction X (i.e., the first direction) is not equal to the second shortest distance d2 between the light-emitting elements 111, 112 and 113 and the opening edge OPe-B along the direction Y (i.e., the second direction), and the third shortest distance d3 between the light-emitting element 113 and the opening edge OPe-B along the direction X is not equal to the second shortest distance d2.

[0068] To prevent the laser beam from diffracting after passing through the multiple openings OP-B of the light-shielding pattern layer 150C and thus partially illuminating the area to be blocked by the light-shielding pattern layer 150C, the percentage value of the opening area of ​​the openings OP-B of the light-shielding pattern layer 150C relative to the product of the first pitch P1 and the second pitch P2 is preferably greater than 3% and less than 73%. From another perspective, by further defining the size of the openings OP-B of the light-shielding pattern layer 150C as described above, it is also possible to avoid issues with the circuit board (such as...) Figure 3B Circuit components located outside the opening OP-B area of ​​the light-shielding pattern layer 150C on the circuit board 200 are affected by the diffraction component of the laser beam, which may affect their electrical properties or cause damage.

[0069] Figure 9 This is a top view schematic diagram of the light-emitting element substrate according to the fourth embodiment of the present invention. Please refer to... Figure 9 In this embodiment, the light-emitting element substrate 11B and Figure 6 The difference between the light-emitting element substrate 11 and the light-shielding pattern layer is that the opening configuration of the light-shielding pattern layer is different. Specifically, in this embodiment, the first shortest distance d1' between the light-emitting elements 111, 112 and 113 overlapping the same opening OP-B of the light-shielding pattern layer 150C and the opening edge OPe-B along the direction X (i.e., the first direction) is not equal to its second shortest distance d2a along the direction Y (i.e., the second direction).

[0070] To prevent the laser beam from diffracting after passing through the multiple openings OP-B of the light-shielding pattern layer 150C and thus partially illuminating the area to be blocked by the light-shielding pattern layer 150C, the percentage value of the opening area of ​​the openings OP-B of the light-shielding pattern layer 150C as a percentage of the product of the first pitch P1 and the second pitch P2 is preferably greater than 4% and less than 73%. From another perspective, by further defining the size of the openings OP-B of the light-shielding pattern layer 150C as described above, it is also possible to avoid issues with the circuit board (such as...) Figure 3B Circuit components located outside the opening OP-B area of ​​the light-shielding pattern layer 150C on the circuit board 200 are affected by the diffraction component of the laser beam, which may affect their electrical properties or cause damage.

[0071] Figure 10 yes Figure 9 A top view schematic diagram of a light-emitting element substrate in another modified embodiment. Figure 11 yes Figure 1 A top view schematic diagram of the light-emitting element substrate of another modified embodiment. Please refer to... Figure 10 Unlike Figure 9 The orthographic projection outline of the opening OP-B of the light-shielding pattern layer 150C on the temporary substrate 100 is rectangular. In this embodiment, the orthographic projection outline of the opening OP-C of the light-shielding pattern layer 150D of the light-emitting element substrate 12 on the temporary substrate 100 is circular, but this is not a limitation. In another embodiment, the orthographic projection outline of the opening OP-D of the light-shielding pattern layer 150E of the light-emitting element substrate 13 on the temporary substrate 100 is elliptical.

[0072] It should be noted that, for the same opening area, if the opening outline of the light-shielding pattern layer is circular (e.g., ... Figure 10 (OP-C) or oval (e.g.) Figure 11 The opening OP-D), compared to the light-shielding pattern layer with a rectangular opening outline (such as... Figure 9 For the light-shielding pattern layer 150C, it can have a better suppression effect on the diffraction effect of laser beams.

[0073] In summary, in a light-emitting element substrate according to an embodiment of the present invention, multiple light-emitting elements are temporarily adsorbed onto a temporary substrate via an adhesive layer, and these light-emitting elements are suitable for bonding to a target substrate (e.g., a circuit board). During the bonding process, a light-shielding pattern layer disposed on the temporary substrate blocks areas without light-emitting elements, significantly reducing the chance of laser beams irradiating non-bonded areas. Therefore, excessive heat energy received by the adhesive layer during the bonding process of the light-emitting elements can be avoided, thus preventing warping and improving the bonding accuracy of the light-emitting elements on the target substrate. Furthermore, it effectively mitigates the phenomenon of irregular offset of the bonding position of the light-emitting elements due to adhesive layer warping.

[0074] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A light-emitting element substrate, characterized in that, include: A temporary substrate; Multiple light-emitting elements are disposed on the temporary substrate; An adhesive layer connects the temporary substrate to the light-emitting elements; as well as A light-shielding pattern layer is disposed on the temporary substrate to prevent the adhesive layer from receiving too much heat energy and warping during the bonding process of the light-emitting elements, and has multiple openings, wherein the light-emitting elements are respectively disposed in relation to the openings; In this light-shielding pattern layer, each of the openings overlaps with a first light-emitting element, a second light-emitting element, and a third light-emitting element of the light-emitting elements. The plurality of first light-emitting elements that overlap the openings are arranged at intervals along a first direction with a first pitch and at intervals along a second direction with a second pitch. The first direction is perpendicular to the second direction.

2. The light-emitting element substrate as described in claim 1, characterized in that, The adhesive layer is made of organic materials.

3. The light-emitting element substrate as described in claim 1, characterized in that, The light-shielding pattern layer is disposed on the side surface of the temporary substrate on which the adhesive layer is located.

4. The light-emitting element substrate as described in claim 1, characterized in that, The light-shielding pattern layer is disposed on the surface of the temporary substrate opposite to the adhesive layer.

5. The light-emitting element substrate as described in claim 1, characterized in that, The first, second, and third light-emitting elements, overlapping the openings, are arranged sequentially along the first direction. The light-shielding pattern layer also has an opening edge defining each of the openings. Each of the first light-emitting elements and the opening edge of the overlapping opening have a first shortest distance and a second shortest distance along the first direction and the second direction, respectively. Each of the multiple second light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. Each of the multiple third light-emitting elements and the opening edge of the overlapping opening have the third shortest distance and the second shortest distance along the first direction and the second direction, respectively. The first shortest distance is equal to the second shortest distance, and the third shortest distance is not equal to the second shortest distance. The percentage of the opening area of ​​each of the openings in the light-shielding pattern layer to the product of the first pitch and the second pitch is greater than 3% and less than 46%.

6. The light-emitting element substrate as described in claim 1, characterized in that, The first and third light-emitting elements overlapping the openings are arranged along the first direction, and the second and third light-emitting elements overlapping the openings are arranged along the second direction. The light-shielding pattern layer also has an opening edge defining each of the openings. Each of the first light-emitting elements and the opening edge of the overlapping opening have a first shortest distance and a second shortest distance along the first direction and the second direction, respectively. Each of the plurality of second light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. Each of the plurality of third light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. The first shortest distance is equal to the second shortest distance. The percentage of the opening area of ​​each of the openings in the light-shielding pattern layer to the product of the first pitch and the second pitch is greater than 4% and less than 66%.

7. The light-emitting element substrate as described in claim 1, characterized in that, The first, second, and third light-emitting elements, overlapping the openings, are arranged sequentially along the first direction. The light-shielding pattern layer also has an opening edge defining each of the openings. Each of the first light-emitting elements and the opening edge of the overlapping opening have a first shortest distance and a second shortest distance along the first direction and the second direction, respectively. Each of the multiple second light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. Each of the multiple third light-emitting elements and the opening edge of the overlapping opening have the third shortest distance and the second shortest distance along the first direction and the second direction, respectively. The first shortest distance is not equal to the second shortest distance, and the third shortest distance is not equal to the second shortest distance. The percentage of the opening area of ​​each of the openings in the light-shielding pattern layer to the product of the first pitch and the second pitch is greater than 3% and less than 73%.

8. The light-emitting element substrate as described in claim 1, characterized in that, The first and third light-emitting elements overlapping the openings are arranged along the first direction, and the second and third light-emitting elements overlapping the openings are arranged along the second direction. The light-shielding pattern layer also has an opening edge defining each of the openings. Each of the first light-emitting elements and the opening edge of the overlapping opening have a first shortest distance and a second shortest distance along the first direction and the second direction, respectively. Each of the plurality of second light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. Each of the plurality of third light-emitting elements and the opening edge of the overlapping opening have the first shortest distance and the second shortest distance along the first direction and the second direction, respectively. The first shortest distance is not equal to the second shortest distance. The percentage of the opening area of ​​each of the openings in the light-shielding pattern layer to the product of the first pitch and the second pitch is greater than 4% and less than 73%.

9. The light-emitting element substrate as described in claim 1, characterized in that, The adhesive layer has a transmittance of more than 98% for light with wavelengths greater than 950 nm.

10. The light-emitting element substrate as claimed in claim 1, characterized in that, The orthographic projection outline of each of the openings in the light-shielding pattern layer on the temporary substrate is circular or elliptical.

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