Light-emitting device packaging material and display module

Abstract

This application belongs to the field of light-emitting device technology. This application discloses a light-emitting device encapsulation material, comprising a substrate layer, an adhesive layer, and a matrix layer; the adhesive layer is disposed on one side of the substrate layer and includes at least one groove; the matrix layer is disposed between the substrate layer and the adhesive layer and includes at least one reflective block; the reflective block is embedded in the groove; along a direction perpendicular to the substrate layer, the groove of the adhesive layer has a first projection on the substrate layer, and the reflective block of the matrix layer has a second projection on the substrate layer; the second projection is within the first projection. This application also discloses a display module, comprising a substrate, a light-emitting device, and an encapsulation material; the light-emitting device is disposed on the substrate; the encapsulation material is disposed on the light-emitting device. The light-emitting device encapsulation material in this application can solve the problem of large gaps between layers in the light-emitting device encapsulation material, the light-emitting device encapsulation material is less prone to bubble formation, has high peel strength, and ensures the reliability of the component.

Description

Technical Field

[0001] This invention belongs to the field of light-emitting device technology, and particularly relates to a light-emitting device packaging material and a display module. Background Technology

[0002] Packaging of light-emitting devices refers to the process of encapsulating light-emitting devices into display modules. It differs significantly from integrated circuit packaging; the packaging materials for light-emitting devices must not only protect the device but also possess good light transmittance.

[0003] One side of the substrate layer of the light-emitting device encapsulation material has functional layers such as a matrix layer with a specific pattern. During lamination, the adhesive layer fills the gaps between the reflective layer or other functional layers.

[0004] However, in the process of implementing the technical solution in the embodiments of this application, the applicant discovered that the above-mentioned technology has at least the following technical problems:

[0005] Currently, the adhesive layer of the packaging material for light-emitting devices is a sheet with a basically flat surface. However, due to limitations such as the fluidity of the adhesive layer and the lamination time, the adhesive layer may not be able to fully fill the gaps between the matrix layer or other functional layers, resulting in problems such as bubbles, small contact area, and easy peeling and detachment between the layers of the packaging material for light-emitting devices. Summary of the Invention

[0006] This application provides a light-emitting device encapsulation material that solves the problem of excessive gaps between the adhesive layer and the matrix layer or other functional layers, reduces the generation of air bubbles in the light-emitting device encapsulation material, lowers the requirements for lamination conditions and adhesive layers, and improves peel strength while increasing production efficiency.

[0007] One aspect of this application provides a light-emitting device encapsulation material, which includes a substrate layer, an adhesive layer, and a matrix layer; the adhesive layer is disposed on one side of the substrate layer and includes at least one groove; the matrix layer is disposed between the substrate layer and the adhesive layer and includes at least one reflective block; the reflective block is embedded in the groove; along a direction perpendicular to the substrate layer, the groove of the adhesive layer has a first projection on the substrate layer, and the reflective block of the matrix layer has a second projection on the substrate layer; the second projection is within the first projection.

[0008] Furthermore, the depth of the groove is 10-45% of the thickness of the adhesive layer, and the ratio of the thickness of the reflective block to the depth of the groove is 1:(0.8-1.2); the thickness of the substrate layer is 20-100μm, the thickness of the matrix layer is 20-50μm, and the thickness of the adhesive layer is 130-200μm.

[0009] Furthermore, the distance between the center points of adjacent grooves is 4-10mm, and the distance between the edge of the groove and the edge of the adhesive layer is greater than or equal to 2-6mm.

[0010] Furthermore, the peel strength between the adhesive layer and the substrate layer is greater than or equal to 80 N / cm.

[0011] Furthermore, the first projection of the groove includes at least one of the following: fan-shaped, circular, elliptical, rectangular, trapezoidal, pentagonal, or hexagonal; the second projection of the reflector includes at least one of the following: fan-shaped, circular, elliptical, rectangular, trapezoidal, pentagonal, or hexagonal; and the shapes of the first projection and the second projection may be the same or different.

[0012] Furthermore, the groove is cylindrical, and the reflector is cylindrical; one reflector is embedded in one groove.

[0013] Furthermore, the transmittance of the substrate layer at a wavelength of 450-500nm is greater than or equal to 90%, the transmittance of the adhesive layer at a wavelength of 450-500nm is greater than or equal to 90%, and the reflectivity of the reflective element at a wavelength of 450-500nm is greater than or equal to 80%.

[0014] Furthermore, the adhesive layer includes at least one of a polyolefin film, a polysiloxane film, an epoxy resin film, or an EVA film.

[0015] Another aspect of this application provides a display module, which includes a substrate, a light-emitting device, and a light-emitting device encapsulation layer; the light-emitting device is disposed on the substrate, and the light-emitting device encapsulation layer is disposed on the light-emitting device;

[0016] The light-emitting device encapsulation layer is the aforementioned light-emitting device encapsulation material, and the adhesive layer of the light-emitting device encapsulation material is attached to the light-emitting device.

[0017] Furthermore, along the direction perpendicular to the substrate, the reflective block of the matrix layer has a second projection on the substrate layer, and the light-emitting device has a third projection on the substrate layer; the third projection is within the second projection, and the area ratio of the third projection to the second projection is 1:(1.5-2.5).

[0018] The multiple technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0019] 1. The adhesive layer of the light-emitting device encapsulation material in this application has a groove structure that can basically match the matrix layer, which can make full contact between the layers, reduce the gap, reduce the probability of air bubbles in the light-emitting device encapsulation material, improve the peel strength between the layers, and ensure the reliability of the light-emitting device encapsulation material.

[0020] 2. Because the gaps between the layers of the light-emitting device encapsulation material in this application are small, the flowability requirement of the adhesive layer is low, and an adhesive layer with a higher degree of cross-linking can be used, so that the light-emitting device encapsulation material has better barrier effect and weather resistance.

[0021] 3. The light-emitting device encapsulation material in this application has a smaller gap, which allows for faster filling, shortens the lamination time, reduces temperature requirements, and improves production efficiency. Attached Figure Description

[0022] Figure 1 This is a cross-sectional structural schematic diagram of one embodiment of the light-emitting device packaging material in this application;

[0023] Figure 2 This is an exploded cross-sectional view of each layer of the packaging material for the light-emitting device in this application;

[0024] Figure 3 This is a top view of one embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0025] Figure 4 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0026] Figure 5 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0027] Figure 6 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0028] Figure 7 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0029] Figure 8 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0030] Figure 9 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0031] Figure 10 This is a top view of another embodiment of the adhesive layer and matrix layer of the light-emitting device encapsulation material in this application;

[0032] Figure 11 This is a cross-sectional structural schematic diagram of one embodiment of the display module in this application;

[0033] Figure 12 This is an exploded cross-sectional view of each layer of the packaging material for the light-emitting device in Comparative Example 1.

[0034] In the figure: light-emitting device encapsulation material 100, substrate layer 11, adhesive layer 12, groove 121, matrix layer 13, reflector 131; display module 200, substrate 21, light-emitting device 22, light-emitting device encapsulation layer 23. Detailed Implementation

[0035] To enable those skilled in the art to better understand the present invention, the technical solutions in specific embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0036] Currently, the adhesive layer of light-emitting device (LED) encapsulation materials is a sheet with a basically flat surface. There are large gaps between the reflective blocks in the matrix layer. During lamination, the adhesive layer may not be able to fully fill the gaps between the reflective blocks in the matrix layer, leading to problems such as air bubbles, small contact area, and easy peeling off between the layers of the LED encapsulation material. To solve the problem of large gaps between the adhesive layer and the matrix layer or other functionally different layers in the prior art, this application proposes an LED encapsulation material with an adhesive layer having a concave-convex structure. The raised portion can fill the gaps in the matrix layer, and the recessed portion fits into the raised portion of the matrix layer, allowing for sufficient contact between the layers, reducing gaps, and improving the peel strength between the layers. This reduces the generation of air bubbles in the LED encapsulation material, lowers the requirements for lamination conditions and the adhesive layer, and improves both peel strength and production efficiency.

[0037] This application provides a method such as Figure 1 The light-emitting device encapsulation material 100 shown includes a substrate layer 11, an adhesive layer 12, and a matrix layer 13. The adhesive layer 12 is disposed on one side of the substrate layer 11, such as... Figure 2As shown, the adhesive layer 12 includes at least one groove 121. A matrix layer 13 is disposed between the substrate layer 11 and the adhesive layer 12. The matrix layer 13 includes at least one reflective block 131, which is embedded in the groove 121 of the adhesive layer 12. The substrate layer 11 serves as the outer layer of the light-emitting device encapsulation material 100, primarily providing protection and support. The matrix layer 13 contains reflective blocks 131, allowing for better light uniformity through reflection of the light from the light-emitting device. The adhesive layer 12 is used to bond the light-emitting device encapsulation material 100 to the substrate. The adhesive layer 12 has grooves 121, and the reflective blocks 131 are embedded in these grooves. The adhesive layer 12 can fill the gaps between the reflective blocks 131 in the matrix layer 13. During lamination, the adhesive layer can completely fill the gaps between the reflective blocks 131, thereby reducing the requirements for the flowability and lamination conditions of the adhesive layer 12 and allowing the use of materials with higher cross-linking degrees in the adhesive layer 12. The highly cross-linked adhesive layer 12 has poor flowability but better barrier effect and weather resistance, which can improve the reliability of the light-emitting device encapsulation material 100. Along the direction perpendicular to the substrate layer 11, the groove 121 of the adhesive layer 12 has a first projection on the substrate layer 11, and the reflector 131 of the matrix layer 13 has a second projection on the substrate layer 11. The second projection is within the first projection, which can ensure that the groove 121 and the reflector 131 are in the same position, and the groove 121 is large enough to accommodate at least one reflector 131.

[0038] In one embodiment, the depth of the groove 121 is 10-45% of the thickness of the adhesive layer 12, and the ratio of the thickness of the reflector 131 to the depth of the groove 121 is 1:(0.8-1.2); the thickness of the substrate layer 11 is 20-100 μm, the thickness of the matrix layer 13 is 20-50 μm, and the thickness of the adhesive layer 12 is 130-200 μm. The depth of the groove 121 is 10-45% of the thickness of the adhesive layer 12. If the groove 121 is too deep, the adhesive layer 12 between the light-emitting device and the reflector 131 will be too thin, reducing the bonding ability between the reflector 131 and the light-emitting device and decreasing the overall mechanical properties. Simultaneously, if the groove 121 is too deep, a large gap will exist between the reflector 131 and the adhesive layer 12 when the adhesive layer 12 adheres to the substrate layer 11. If the ratio of the thickness of the reflector 131 to the depth of the groove 121 is too small, the gap between the reflector 131 and the adhesive layer 12 will be too large. If the substrate layer 11 is too thin, it cannot effectively protect the light-emitting device. If the substrate layer 11 is too thick, it will affect the quality and intensity of the light. A thickness of 20-100 μm for the substrate layer 11 ensures that it provides good protection while minimizing its impact on light. A thickness of 20-50 μm for the matrix layer 13 ensures that it has sufficient strength while minimizing its impact on light quality. If the adhesive layer 12 is too thin, it cannot guarantee the bonding strength between the light-emitting device encapsulation material 100 and the light-emitting device. If the adhesive layer 12 is too thick, it will reduce the intensity and quality of the light. Therefore, a thickness of 130-200 μm for the adhesive layer 12 ensures a stable bond between the light-emitting device encapsulation material 100 and the light-emitting device while minimizing its impact on light.

[0039] In one implementation, the distance between the center points of adjacent grooves 121 is 4-10 mm, and the distance between the edge of groove 121 and the edge of adhesive layer 12 is greater than or equal to 2-6 mm. If the distance between adjacent grooves 121 is too small, a large gap will exist between reflective block 131 and groove 12 when adhesive layer 12 is bonded to substrate layer 11. The distance between adjacent grooves 121 needs to be less than or equal to the distance between reflective blocks 131 to ensure that adhesive layer 12 can bond to substrate layer 11. A distance of 4-10 mm between the center points of adjacent grooves 121 ensures that substrate layer 11 can bond to adhesive layer 12, and the gap between reflective block 131 and adhesive layer 12 is small during bonding. The distance between the edge of groove 121 and the edge of adhesive layer 12 is greater than or equal to 2-6 mm. If the edge of groove 121 is too close to the edge of adhesive layer 12, there is less adhesive layer 12 at the edge, the light-transmitting area is small, the light at the edge of the display module is weak, resulting in uneven light between the edge and the center. At the same time, if the reflective area is too close to the edge, it will affect the strength and reliability of the adhesive layer.

[0040] In one implementation, the peel strength between the substrate layer 11 and the adhesive layer 12 is greater than or equal to 80 N / cm, ensuring a more stable bond between them. The reflective element 131 of the matrix layer 13 is embedded in the groove 121 of the adhesive layer 12. The substrate layer 11 and the adhesive layer 12 fix the matrix layer 13 between the two layers, making the light-emitting device encapsulation material 100 structurally compact and stable.

[0041] In one implementation, the first projection of the groove 121 includes a sector shape (e.g., Figure 3 As shown), circular (as shown) Figure 4 As shown), elliptical (as shown) Figure 5 As shown), rectangle (as shown) Figure 6 (as shown), trapezoidal (as shown) Figure 7 As shown), pentagon (as shown) Figure 8 (as shown) or hexagonal (such as) Figure 9 At least one of the following (as shown), the second projection of reflector 131 includes a fan shape (such as...). Figure 3 As shown), circular (as shown) Figure 4 As shown), elliptical (as shown) Figure 5 As shown), rectangle (as shown) Figure 6 (as shown), trapezoidal (as shown) Figure 7 As shown), pentagon (as shown) Figure 8 (as shown) or hexagonal (such as) Figure 9 At least one of (as shown). For example Figure 10 As shown, the shapes of the first projection and the second projection can be the same or different. Multiple reflective blocks 131 can also be embedded in a single groove 121. During production, the shape and size of the groove 121 and the reflective blocks 131 can be set according to actual needs. Preferably, the shape of the groove 121 should match the shape of the reflective block 131. This reduces the gap between the groove 121 and the reflective block 131, ensuring full contact between the adhesive layer 12 and the matrix layer 13. It also shortens the lamination time, lowers the lamination temperature, and reduces the requirements for the fluidity of the adhesive layer 12, thereby improving production efficiency. The second projection shape of the reflective block 131 can be at least one of a fan shape, a circle, an ellipse, a rectangle, a trapezoid, a pentagon, or a hexagon. The reflective block 131 allows for multiple reflections of light, achieving better light uniformity without increasing the density of the light-emitting devices. The shapes of the groove 121 and the reflector 131 are not limited; they can be cylindrical, prismatic, frustum, etc. In actual production, the shapes of the reflector 131 and the groove 121 can be set according to the shape of the light-emitting device and actual needs. Furthermore, it is optimal when the shapes of the first projection and the second projection are rotationally symmetrical. During assembly, the rotationally symmetrical shape of the reflector 131 and the groove 121 has the advantage of being easier to orient, which can speed up assembly efficiency and improve production efficiency.

[0042] In one implementation, the groove 121 is cylindrical, and the reflector 131 is cylindrical; one reflector 131 is embedded in one groove 121. Cylindrical light-emitting devices are more widely used, and the cylindrical shape of the reflector 131 is more compatible with the light-emitting device. During the assembly of the light-emitting device encapsulation material 100, the cylinder does not have an orientation problem; no matter how it is rotated, its cross-section remains circular. During lamination, the gap between the cylindrical reflector 131 and the cylindrical groove 121 is easier to fill, which can shorten the lamination time, reduce the lamination temperature, and lower the requirements for the flowability of the adhesive layer 12. Embedding one reflector 131 in one groove 121 ensures that the gap is more easily filled by the adhesive layer 12, and the reflector 131 is less likely to shift during lamination.

[0043] In one implementation, the substrate layer 11 has a transmittance of ≥90% at a wavelength of 450-500nm, the adhesive layer 12 has a transmittance of ≥90% at a wavelength of 450-500nm, and the reflective block 131 has a reflectance of ≥80% at a wavelength of 450-500nm. The principle of white light generation in the display module is as follows: a blue LED chip + YAG (pale yellow phosphor). The light-emitting device (usually an LED chip) first emits blue light, which then passes through the pale yellow phosphor to produce yellow-green light. The blue light and yellow-green light (mixed with the red light emitted by the red LED) form white light. To make the white light whiter, the screen colors brighter, and the color contrast higher, the intensity of the blue light must be increased. Therefore, there is a very high peak in the blue light region (450-500nm) of the light source spectrum, and the light emitted by the display module contains a high intensity of blue light. Therefore, only the light-emitting block 131 is limited to having a reflectivity of 80% or higher for light with a wavelength of 450-500nm (mainly blue light), and the substrate layer 11 and adhesive layer 12 are limited to having a transmittance of 90% or higher for light with a wavelength of 450-500nm (mainly blue light). The substrate layer 11, as the outer layer of the light-emitting device encapsulation material 100, not only plays a primary protective role but also needs to have good transmittance. Since the light emitted by the light-emitting device will ultimately pass through the substrate layer 11, a transmittance of the substrate layer 11 of 90% or higher at a wavelength of 450-500nm ensures that the intensity of the light passing through the substrate layer 11 will not decrease significantly. The light emitted by the light-emitting device will pass through the adhesive layer 12 multiple times during the homogenization process; therefore, the transmittance of the adhesive layer 12 has a significant impact on the intensity of the light. Thus, a transmittance of the adhesive layer 12 of 90% or higher at a wavelength of 450-500nm ensures that the light intensity will not decrease significantly before and after homogenization. The reflectivity of reflective block 131, with a reflectivity of greater than or equal to 80% at wavelengths of 450-500nm, ensures that the light intensity emitted by the light-emitting device changes little before and after reflection, thus not affecting the overall light intensity of the display module. Furthermore, it is preferable that reflective block 131 and / or substrate layer 11 and / or adhesive layer 12 both meet the aforementioned reflectivity and transmittance requirements for light with wavelengths of 400-760nm, resulting in a better overall display effect.

[0044] In one embodiment, the adhesive layer 12 includes at least one of a polyolefin film, a polysiloxane film, an epoxy resin film, or an EVA film. Polyolefin resins, polysiloxane resins, epoxy resins, and EVA resins (ethylene-vinyl acetate copolymer) have relatively low densities, and films made from them exhibit excellent adhesion and high transparency, ensuring high light transmittance of the adhesive layer 12. The adhesive layer 12 is preferably an EVA film or a POE film. EVA film is a polyethylene-polyvinyl acetate copolymer; EVA has high transparency, good durability, and can resist high temperatures, moisture, and ultraviolet radiation, and its high adhesion makes it suitable for various interfaces. POE is a polyolefin elastomer, which has a longer product lifespan and better durability, enabling the adhesive layer 12 to have higher reliability. The substrate layer 11 includes at least one of a PET film, a PVDF film, a polyethylene naphthalate film, or a polyolefin film.

[0045] This application also provides a method such as Figure 11 The display module 200 shown includes, in sequence, a substrate 21, a light-emitting device 22, and a light-emitting device encapsulation layer 23. The light-emitting device 22 is disposed on the substrate 21. The light-emitting device encapsulation layer 23 is disposed on the light-emitting device 22, wherein the light-emitting device encapsulation layer 23 is any of the aforementioned light-emitting device encapsulation materials 100, and the adhesive layer 12 of the light-emitting device encapsulation material 100 is attached to the light-emitting device 22.

[0046] In one implementation, along a direction perpendicular to the substrate 21, the reflective block 131 of the light-emitting device encapsulation material 100 has a second projection on the substrate layer 11, and the light-emitting device 22 has a third projection on the substrate layer 11. The third projection is within the second projection, which ensures that the strong light emitted by the light-emitting device 22 is not directly emitted from the adhesive layer 12, but is reflected multiple times by the reflective block 131 before being emitted from the adhesive layer 12, thus improving the uniformity of the light. The area ratio of the third projection to the second projection is 1:(1.5-2.5). If the reflective block 131 is small, the light is refracted fewer times by the reflective block 131, resulting in reduced light uniformity. If the reflective block 131 is too large, it will affect the light intensity. Therefore, an area ratio of 1:(1.5-2.5) for the third projection ensures that the display module has good light uniformity while minimizing the impact on light intensity.

[0047] The present application will be further described below with reference to the embodiments, but the scope of protection of the present application is not limited to the embodiments.

[0048] Example 1

[0049] like Figure 1As shown, a light-emitting device encapsulation material 100 includes a substrate layer 11, an adhesive layer 12, and a matrix layer 13. The adhesive layer 12 is disposed on one side of the substrate layer 11 and includes a groove 121. The matrix layer 13 is disposed between the substrate layer 11 and the adhesive layer 12, and includes a reflector 131 embedded in the groove 121 of the adhesive layer 12. Along a direction perpendicular to the substrate layer 11, the groove 121 of the adhesive layer 12 has a first projection on the substrate layer 11, and the reflector 131 of the matrix layer 13 has a second projection on the substrate layer 11. The first projection is circular, the second projection is circular, and the second projection is within the first projection.

[0050] Specifically, the depth of the groove 121 is 25% of the thickness of the adhesive layer 12, and the ratio of the thickness of the reflective block 131 to the depth of the groove 121 is 1:1. The thickness of the substrate layer 11 is 60 μm, the thickness of the adhesive layer 12 is 168 μm, and the thickness of the matrix layer 13 is 42 μm. The distance between the center points of adjacent grooves 121 is 8 mm, and the distance between the edge of the groove 121 and the edge of the adhesive layer 12 is 4 mm. The substrate layer 11 is a PET film (Toray Lumirror XG7PS8), and the adhesive layer 12 is a polyolefin film (Foster TF8).

[0051] Example 2

[0052] like Figure 1 As shown, a light-emitting device encapsulation material 100 includes a substrate layer 11, an adhesive layer 12, and a matrix layer 13. The adhesive layer 12 is disposed on one side of the substrate layer 11 and includes a groove 121. The matrix layer 13 is disposed between the substrate layer 11 and the adhesive layer 12, and includes a reflector 131 embedded in the groove 121 of the adhesive layer 12. Along a direction perpendicular to the substrate layer 11, the groove 121 of the adhesive layer 12 has a first projection on the substrate layer 11, and the reflector 131 of the matrix layer 13 has a second projection on the substrate layer 11. The first projection is circular, the second projection is circular, and the second projection is within the first projection.

[0053] Specifically, the depth of the groove 121 is 10% of the thickness of the adhesive layer 12, and the ratio of the thickness of the reflective block 131 to the depth of the groove 121 is 1:1. The thickness of the substrate layer 11 is 60 μm, the thickness of the adhesive layer 12 is 200 μm, and the thickness of the matrix layer 13 is 20 μm. The distance between the center points of adjacent grooves 121 is 8 mm, and the distance between the edge of the groove 121 and the edge of the adhesive layer 12 is 4 mm. The substrate layer 11 is a PET film (Toray Lumirror XG7PS8), and the adhesive layer 12 is an EVA film (Foster F806PS).

[0054] Example 3

[0055] like Figure 1As shown, a light-emitting device encapsulation material 100 includes a substrate layer 11, an adhesive layer 12, and a matrix layer 13. The adhesive layer 12 is disposed on one side of the substrate layer 11 and includes a groove 121. The matrix layer 13 is disposed between the substrate layer 11 and the adhesive layer 12, and includes a reflector 131 embedded in the groove 121 of the adhesive layer 12. Along a direction perpendicular to the substrate layer 11, the groove 121 of the adhesive layer 12 has a first projection on the substrate layer 11, and the reflector 131 of the matrix layer 13 has a second projection on the substrate layer 11. The first projection is circular, the second projection is circular, and the second projection is within the first projection.

[0056] Specifically, the depth of the groove 121 is 45% of the thickness of the adhesive layer 12, and the ratio of the thickness of the reflective block 131 to the depth of the groove 121 is 1:1.2. The thickness of the substrate layer 11 is 60 μm, the thickness of the adhesive layer 12 is 133.3 μm, and the thickness of the matrix layer 13 is 50 μm. The distance between the center points of adjacent grooves 121 is 8 mm, and the distance between the edge of the groove 121 and the edge of the adhesive layer 12 is 4 mm. The substrate layer 11 is a PET film (Toray Lumirror XG7PS8), and the adhesive layer 12 is an EVA film (Foster F806PS).

[0057] Example 4

[0058] Except for the following technical features, they are the same as in Example 1.

[0059] The distance between the center points of the grooves was adjusted to 4mm, and the substrate layer 11 was adjusted to PEN film (Teonex).

[0060] Example 5

[0061] Except for the following technical features, they are the same as in Example 1.

[0062] The distance between the center points of the grooves was adjusted to 10mm, and the substrate layer 11 was adjusted to a PVDF film (Solef 41308).

[0063] Example 6

[0064] Except for the following technical features, they are the same as in Example 1.

[0065] The thickness of the substrate layer 11 was adjusted to 20 μm, and the adhesive layer 12 was adjusted to a polysiloxane film (Dow Corning SYLGARD184).

[0066] Example 7

[0067] Except for the following technical features, they are the same as in Example 1.

[0068] The thickness of the substrate layer 11 was adjusted to 100 μm, and the adhesive layer 12 was adjusted to a polysiloxane film (Dow Corning SYLGARD184).

[0069] Example 8

[0070] Except for the following technical features, they are the same as in Example 1.

[0071] The distance between the edge of the groove 121 and the edge of the adhesive layer 12 is adjusted to 6mm.

[0072] Example 9

[0073] Except for the following technical features, they are the same as in Example 1.

[0074] Adjust the distance between the edge of the groove 121 and the edge of the adhesive layer 12 to 2mm.

[0075] Example 10

[0076] Except for the following technical features, they are the same as in Example 1.

[0077] The distance between the center points of adjacent grooves 121 is adjusted to 14mm.

[0078] Example 11

[0079] Except for the following technical features, they are the same as in Example 1.

[0080] Adjust the distance between the edge of the groove 121 and the edge of the adhesive layer 12 to 10mm.

[0081] Example 12

[0082] Except for the following technical features, they are the same as in Example 1.

[0083] Adjust the first projection to a rectangle, and adjust the second projection to a rectangle.

[0084] Example 13

[0085] Except for the following technical features, they are the same as in Example 1.

[0086] The ratio of the thickness of the reflective block 131 to the depth of the groove 121 is adjusted to 1:1.5, and the thickness of the matrix layer 13 is adjusted to 28μm.

[0087] Example 14

[0088] Except for the following technical features, they are the same as in Example 1.

[0089] The thickness of the adhesive layer 12 is adjusted to 100 μm, the depth of the groove 121 is adjusted to 25 μm, and the thickness of the matrix layer 13 is adjusted to 25 μm.

[0090] Example 15

[0091] Except for the following technical features, they are the same as in Example 3.

[0092] The thickness of the adhesive layer is adjusted to 133.3 μm, the depth of the groove is adjusted to 66.6 μm, the depth of the groove 121 is adjusted to 50% of the thickness of the adhesive layer 12, the thickness of the matrix layer 13 is adjusted to 55.5 μm, and the ratio of the thickness of the reflector 131 to the depth of the groove 121 is adjusted to 1:1.2.

[0093] Example 16

[0094] Except for the following technical features, they are the same as in Example 2.

[0095] The thickness of the adhesive layer is adjusted to 160μm, the depth of the groove is adjusted to 16μm, the depth of the groove 121 is adjusted to 10% of the thickness of the adhesive layer 12, the thickness of the matrix layer 13 is adjusted to 20μm, and the ratio of the thickness of the reflective block 131 to the depth of the groove 121 is adjusted to 1:0.8.

[0096] Comparative Example 1

[0097] like Figure 12 As shown, a light-emitting device encapsulation material 100 comprises a substrate layer 11, an adhesive layer 12, and a matrix layer 13. The matrix layer 13 includes reflective blocks 131, and the adhesive layer 12 has a smooth surface without any special structure. All other conditions are the same as in Example 1.

[0098] I. Performance Testing:

[0099] The performance of the light-emitting device encapsulation material 100 in the above embodiments and comparative examples was tested. Simultaneously, the light-emitting device encapsulation material 100 in the above embodiments and comparative examples was assembled as follows: Figure 3 The display module shown comprises a substrate 21, a light-emitting device 22, and a light-emitting device encapsulation layer 23. The substrate 21 is a PCB board, the light-emitting device 22 is an LED lamp bead, and the encapsulation material is the light-emitting device encapsulation material 100 used in the embodiments and comparative examples.

[0100] 1. Reflectivity:

[0101] Using a spectrophotometer (Konika-Minota CM-26d), at a color temperature of 6500K and a 10° viewing window, five random locations were selected on the surface of the test sample to measure the SCI reflectance at a wavelength of 460nm. The average value of the results was taken.

[0102] 2. Light transmittance:

[0103] Using a spectrophotometer (Color Spectrum CS-700), at a color temperature of 6500K and a 10° viewing window, five random locations were selected on the surface of the test sample to measure the total transmittance, and the average value of the results was taken.

[0104] 3. Interlayer peel strength:

[0105] Use a utility knife to cut the packaging material into strips 2.5cm wide and 15cm long. Then peel the 2.5cm wide substrate layer 180°. Use a Shenzhen Sansi Zongheng universal tensile testing machine to test the peel strength. Each sample is tested three times in parallel, and the average value is taken.

[0106] 4. Defect quantity assessment of packaging materials:

[0107] After the samples are packaged, they are visually inspected to determine the number of defects such as bubbles and breaks within a 30cm×17cm area and to assign a grade: Grade A: 3 or less defects; Grade B: 3 or more defects but less than or equal to 10 defects; Grade C: 10 or more defects.

[0108] II. Performance Test Results:

[0109] The performance test results of the encapsulating films in the above embodiments and comparative examples are shown in Table 1 below.

[0110] Table 1: Test Results

[0111]

[0112]

[0113] A comparison of Example 1 and Comparative Example 1 shows that the adhesive layer with the grooved structure produces fewer defects after encapsulation compared to the adhesive layer with a smooth surface, indicating higher reliability of the encapsulation material. The table shows that the reflective blocks in Examples 1-16 have a reflectivity greater than 80% for wavelengths of 450-500nm, and the substrate layer and adhesive layer in Examples 1-16 have a transmittance greater than or equal to 90% for wavelengths of 450-500nm, ensuring good light emission performance of the display module. The peel strength between the adhesive layer and the substrate layer in Examples 1-16 is greater than 80N / cm, indicating good adhesion between the layers in the light-emitting device encapsulation material and high reliability of the encapsulation material. The number of defects produced after encapsulation in the light-emitting device encapsulation materials of Examples 1-16 is less than or equal to 3, indicating high reliability of the light-emitting device encapsulation material.

[0114] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A light-emitting device encapsulation material, characterized in that, include: A substrate layer having a transmittance of 90% or more at a wavelength of 450-500 nm; An adhesive layer is disposed on one side of the substrate layer. The adhesive layer includes at least one groove. The adhesive layer includes at least one of a polyolefin film, a polysiloxane film, an epoxy resin film, or an EVA film. The transmittance of the adhesive layer at a wavelength of 450-500 nm is greater than or equal to 90%. A matrix layer is disposed between the substrate layer and the adhesive layer, and the matrix layer includes at least one reflective block; The reflective block is embedded in the groove; The peel strength between the adhesive layer and the substrate layer is greater than or equal to 80 N / cm; Along a direction perpendicular to the substrate layer, the groove of the adhesive layer has a first projection on the substrate layer, and the reflective block of the matrix layer has a second projection on the substrate layer; the second projection is within the first projection.

2. The light-emitting device encapsulation material according to claim 1, characterized in that: The depth of the groove is 10-45% of the thickness of the adhesive layer, and the ratio of the thickness of the reflective block to the depth of the groove is 1:(0.8-1.2). The thickness of the substrate layer is 20-100 μm, the thickness of the matrix layer is 20-50 μm, and the thickness of the adhesive layer is 130-200 μm.

3. The light-emitting device encapsulation material according to claim 1, characterized in that: The distance between the center points of adjacent grooves is 4-10mm, and the distance between the edge of the groove and the edge of the adhesive layer is greater than or equal to 2-6mm.

4. The light-emitting device encapsulation material according to claim 1, characterized in that: The first projection of the groove includes at least one of the following: fan-shaped, circular, elliptical, rectangular, trapezoidal, pentagonal, or hexagonal. The second projection of the reflector includes at least one of the following: fan-shaped, circular, elliptical, rectangular, trapezoidal, pentagonal, or hexagonal. The shape of the first projection and the shape of the second projection may be the same or different.

5. The light-emitting device encapsulation material according to claim 1, characterized in that: The groove is cylindrical, and the reflector is cylindrical; one reflector is embedded in each groove.

6. The light-emitting device encapsulation material according to claim 1, characterized in that: The reflective element has a reflectivity of 80% or greater at a wavelength of 450-500nm.

7. A display module, characterized in that, include: substrate; A light-emitting device is disposed on the substrate; A light-emitting device encapsulation layer is disposed on the light-emitting device; The light-emitting device encapsulation layer is a light-emitting device encapsulation material as described in any one of claims 1-6, and the adhesive layer of the light-emitting device encapsulation material is attached to the light-emitting device.

8. The display module according to claim 7, characterized in that: Along a direction perpendicular to the substrate, the reflective block of the matrix layer has a second projection on the substrate layer, and the light-emitting device has a third projection on the substrate layer; the third projection is within the second projection, and the area ratio of the third projection to the second projection is 1:(1.5-2.5).

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