A thermal power combined simulation method and device

Abstract

The present application proposes a thermal-electric combined simulation method and device, which relates to the field of converter valve simulation, including: building an electrical model and a thermal model in PLECS according to the structure of the converter valve; building a control module and an oscilloscope in Simulink in MATLAB; exchanging data information between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model; running the simulation model, determining the simulation results and displaying them in the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include the power loss, voltage, current and resistance of the power semiconductor devices in the converter valve, and the thermal parameters include the temperature of the power semiconductor devices in the converter valve. The present application solves the influence of thermal parameters on the electrical parameters of the converter valve electrical model by introducing a thermal model, and can provide more accurate simulation results when simulating the internal temperature of the converter valve, and combines Simulink and PLECS in MATLAB to realize real-time interaction and visualization of electrical and thermal parameters and control functions of the electrical model.

Description

Technical Field

[0001] The present application relates to the field of converter valve simulation, and in particular to a thermal power combined simulation method and device. Background Art

[0002] Currently, in the process of converter valve simulation, the temperature of the power semiconductor devices in the converter valve always affects the electrical parameter output results of the converter valve electrical model. Currently, there is a lack of a method to simulate the impact of temperature on the operation of the converter valve. Summary of the invention

[0003] In view of the above problems, a thermal-electric combined simulation method and device are proposed. The thermal model is introduced to solve the influence of thermal parameters on the electrical parameters of the converter valve electrical model. When the internal temperature of the converter valve is simulated, more accurate simulation results can be provided. Simulink and PLECS in MATLAB are combined to realize real-time interaction of electric and thermal parameters. The control of the electrical model and the visualization of thermal and electrical parameters are realized through programming and visualization module methods.

[0004] The first aspect of the present application proposes a thermal power combined simulation method, comprising:

[0005] According to the structure of the converter valve, build the electrical model and thermal model in PLECS;

[0006] Build control modules and oscilloscopes in Simulink in MATLAB;

[0007] Performing data information interaction among the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model;

[0008] The simulation model is run to determine the simulation results and display them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include power loss, voltage, current and resistance of the power semiconductor devices in the converter valve, and the thermal parameters include the temperature of the power semiconductor devices in the converter valve.

[0009] Optionally, the step of performing data information interaction between the electrical model, the thermal model, the control module and an oscilloscope to generate a simulation model includes:

[0010] Inputting the power loss into the thermal model to determine a real-time temperature parameter output by the thermal model;

[0011] The real-time temperature parameters are input into the electrical model to perform electrical parameter correction.

[0012] Optionally, the method further includes:

[0013] The control module sends a control signal according to the electrical parameter to control the operation of the converter valve;

[0014] The control module adjusts the control signal according to the real-time temperature parameter and the electrical parameter.

[0015] Optionally, the method further includes:

[0016] The real-time temperature parameters are input into the simulation model as simulation conditions to determine simulation results.

[0017] Optionally, the thermal model includes a heat collector, a thermal resistor, a thermal capacitor and a thermal chain.

[0018] Optionally, the electrical model includes the topology of the converter valve and the circuit system structure of the converter valve.

[0019] The second aspect of the present application provides a thermal-electric combined simulation device, comprising:

[0020] The first building module is used to build an electrical model and a thermal model in PLECS according to the structure of the converter valve;

[0021] The second building module is used to build the control module and oscilloscope in Simulink in MATLAB;

[0022] A data interaction module, used for performing data information interaction between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model;

[0023] An output module is used to run the simulation model, determine the simulation results and display them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include power loss, voltage, current and resistance of the power semiconductor devices in the converter valve, and the thermal parameters include the temperature of the power semiconductor devices in the converter valve.

[0024] Optionally, the data interaction module includes:

[0025] A real-time temperature generating module, used for inputting the power loss into the thermal model and determining the real-time temperature parameter output by the thermal model;

[0026] The electrical parameter correction module is used to input the real-time temperature parameters into the electrical model to perform the electrical parameter correction.

[0027] In a third aspect of the present application, a computer device is proposed, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method described in any one of the first aspects above is implemented.

[0028] In a fourth aspect of the present application, a non-temporary computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method described in any one of the first aspects above is implemented.

[0029] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects:

[0030] By introducing a thermal model to solve the influence of thermal parameters on the electrical parameters of the converter valve electrical model, more accurate simulation results can be provided when simulating the internal temperature of the converter valve. Simulink and PLECS in MATLAB are combined. On the one hand, the characteristics of PLECS software are used to realize real-time interaction of electric and thermal parameters. On the other hand, the Simulink module in MATLAB can be used to control the model through programming and visualization module methods to realize the control function of the electrical model.

[0031] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0033] Figure 1 is a flow chart of a thermal-electric combined simulation method according to an exemplary embodiment of the present application;

[0034] Figure 2 is an architecture diagram of a thermal-electrical co-simulation method according to an exemplary embodiment of the present application;

[0035] Figure 3 is a block diagram of a thermal-electric combined simulation device according to an exemplary embodiment of the present application;

[0036] Figure 4 It is a block diagram of an electronic device. DETAILED DESCRIPTION

[0037] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0038] Figure 1 is a flow chart of a thermal power combined simulation method according to an exemplary embodiment of the present application. Figure 1 As shown, including:

[0039] Step 101: Building an electrical model and a thermal model in PLECS according to the structure of the converter valve.

[0040] First, a preliminary introduction to PLECS is given. PLECS is a multifunctional simulation software for the combination of circuits and controls, especially for power electronics and transmission systems. Users can define temperature-related heat conduction and switching loss energy distribution for each semiconductor component; they can also collect energy lost by semiconductors and resistors, and use thermal resistors and capacitor elements to simulate thermal behavior.

[0041] In the embodiments of the present application, different electrical models, thermal models and converter valve control strategies are established according to actual applications, and parameters such as real-time temperature are established in the simulation as simulation conditions. The electrothermal parameters of the power semiconductor devices in the converter valve are calculated through joint simulation. The electrothermal parameters include parameters such as temperature and power loss, so that the output electrothermal parameters are close to actual applications and accurate.

[0042] Step 102, build a control module and an oscilloscope in Simulink in MATLAB.

[0043] First, we will give a preliminary introduction to Simulink in MATLAB. Simulink is a visual simulation tool in MATLAB. Simulink is a block diagram environment for multi-domain simulation and model-based design. It supports system design, simulation, automatic code generation, and continuous testing and verification of embedded systems. Simulink provides a graphical editor, a customizable module library, and a solver, which can model and simulate dynamic systems.

[0044] Step 103 , data information is exchanged between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model.

[0045] Among them, the thermal model includes heat collector, thermal resistance, heat capacity and thermal chain, and the electrical model includes the topology of the converter valve and the circuit system structure of the converter valve.

[0046] In the present application embodiment, Figure 2 As shown in the figure, the process of data interaction between the thermal model and the electrical model is as follows:

[0047] Input the power loss into the thermal model and determine the real-time temperature parameters output by the thermal model;

[0048] The real-time temperature parameters are input into the electrical model to perform electrical parameter correction.

[0049] In the embodiments of the present application, various scenarios encountered during the operation of the converter valves can be simulated to provide a reference for the design, manufacture and actual operation of the converter valves.

[0050] In the present application embodiment, Figure 2 As shown in the figure, the interaction process between the electrical model, thermal model, and control module is as follows:

[0051] The control module sends a control signal according to the electrical parameters to control the operation of the converter valve;

[0052] The control module adjusts the control signal according to the real-time temperature parameters and electrical parameters.

[0053] In the embodiments of the present application, the effects of controlling the converter valve by different control strategies when different faults occur in the system operation can be simulated, and the purpose of guiding the actual operation can be achieved through the simulation results.

[0054] Step 104, running the simulation model, determining the simulation results and displaying them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include power loss, voltage, current and resistance of the power semiconductor devices in the converter valve, and the thermal parameters include the temperature of the power semiconductor devices in the converter valve.

[0055] In the embodiment of the present application, the real-time temperature parameters can also be directly input into the simulation model as simulation conditions to determine the simulation results. In addition, the embodiment of the present application visualizes the thermal parameters and electrical parameters in the simulation results.

[0056] The embodiment of the present application solves the influence of thermal parameters on the electrical parameters of the converter valve electrical model by introducing a thermal model. When simulating the internal temperature of the converter valve, it can provide more accurate simulation results and combine Simulink and PLECS in MATLAB. On the one hand, the characteristics of PLECS software are used to realize real-time interaction of electric and thermal parameters. On the other hand, the advantage of the Simulink module in MATLAB that can control the model through programming and visualization module methods is used to realize the control function of the electrical model.

[0057] Figure 3 It is a block diagram of a thermal power combined simulation device 200 according to an exemplary embodiment of the present application, including: a first building module 210, a second building module 220, a data interaction module 230 and an output module 240.

[0058] A first building module 210 is used to build an electrical model and a thermal model in PLECS according to the structure of the converter valve;

[0059] A second building module 220 is used to build a control module and an oscilloscope in Simulink in MATLAB;

[0060] The data interaction module 230 is used to interact data information between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model;

[0061] The output module 240 is used to run the simulation model, determine the simulation results and display them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include the power loss, voltage, current and resistance of the power semiconductor devices in the converter valve, and the thermal parameters include the temperature of the power semiconductor devices in the converter valve.

[0062] Optionally, the data interaction module 230 further includes:

[0063] A real-time temperature generation module is used to input the power loss into the thermal model and determine the real-time temperature parameters output by the thermal model;

[0064] The electrical parameter correction module is used to input the real-time temperature parameters into the electrical model to perform electrical parameter correction.

[0065] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0066] Figure 4 A schematic block diagram of an example electronic device 300 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0067] like Figure 4 As shown, the device 300 includes a computing unit 301, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 302 or a computer program loaded from a storage unit 303 into a random access memory (RAM) 303. In the RAM 303, various programs and data required for the operation of the device 300 can also be stored. The computing unit 301, the ROM 302, and the RAM 303 are connected to each other via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0068] A number of components in the device 300 are connected to the I / O interface 305, including: an input unit 306, such as a keyboard, a mouse, etc.; an output unit 307, such as various types of displays, speakers, etc.; a storage unit 308, such as a disk, an optical disk, etc.; and a communication unit 309, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 309 allows the device 300 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0069] The computing unit 301 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 301 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 301 performs the various methods and processes described above, such as the voice instruction response method. For example, in some embodiments, the voice instruction response method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 308. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 300 via ROM 302 and / or communication unit 309. When the computer program is loaded into RAM 303 and executed by the computing unit 301, one or more steps of the voice instruction response method described above may be performed. Alternatively, in other embodiments, the computing unit 301 may be configured to perform the voice instruction response method in any other appropriate manner (e.g., by means of firmware).

[0070] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0071] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0072] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0073] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0074] The systems and techniques described herein can be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain network.

[0075] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services ("Virtual Private Server", or "VPS" for short). The server may also be a server of a distributed system, or a server combined with a blockchain.

[0076] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0077] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A combined thermal and electrical simulation method, characterized in that: include: According to the structure of the converter valve, build the electrical model and thermal model in PLECS; Build control modules and oscilloscopes in Simulink in MATLAB; Performing data information interaction among the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model; Running the simulation model, determining simulation results and displaying them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include power loss, voltage, current and resistance of the power semiconductor device in the converter valve, and the thermal parameters include the temperature of the power semiconductor device in the converter valve; The step of performing data information interaction between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model includes: Inputting the power loss into the thermal model to determine a real-time temperature parameter output by the thermal model; Inputting the real-time temperature parameters into the electrical model to perform electrical parameter correction; The method further comprises: The control module sends a control signal according to the electrical parameter to control the operation of the converter valve; The control module adjusts the control signal according to the real-time temperature parameter and the electrical parameter.

2. The method according to claim 1, characterized in that The method further comprises: The real-time temperature parameters are input into the simulation model as simulation conditions to determine simulation results.

3. The method according to claim 1, characterized in that The thermal model includes heat collector, thermal resistance, thermal capacitance and thermal chain.

4. The method according to claim 1, characterized in that: The electrical model includes the topology of the converter valve and the circuit system structure of the converter valve.

5. A thermal power combined simulation device, characterized in that: include: The first building module is used to build an electrical model and a thermal model in PLECS according to the structure of the converter valve; The second building module is used to build the control module and oscilloscope in Simulink in MATLAB; A data interaction module, used for performing data information interaction between the electrical model, the thermal model, the control module and the oscilloscope to generate a simulation model; an output module, used to run the simulation model, determine the simulation results and display them on the oscilloscope, wherein the simulation results include thermal parameters and electrical parameters of the converter valve, the electrical parameters include power loss, voltage, current and resistance of the power semiconductor device in the converter valve, and the thermal parameters include the temperature of the power semiconductor device in the converter valve; The data interaction module includes: A real-time temperature generating module, used for inputting the power loss into the thermal model and determining the real-time temperature parameter output by the thermal model; An electrical parameter correction module, used for inputting the real-time temperature parameter into the electrical model to perform the electrical parameter correction; Also includes: The control module sends a control signal according to the electrical parameter to control the operation of the converter valve; The control module adjusts the control signal according to the real-time temperature parameter and the electrical parameter.

6. A computer device, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method according to any one of claims 1 to 4 is implemented.

7. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 4 is implemented.

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