Wafer defect detection device and wafer loading system

Abstract

The present invention provides a wafer loading system for a wafer defect detection device, wherein: a vacuum adsorption gas circuit is connected to a carrier platform and an adjustment platform via corresponding gas pipes; the carrier platform includes a coaxially assembled Z-axis lifting platform, a turntable, and a fixed adsorption platform; the fixed adsorption platform relies on the vacuum adsorption gas circuit to provide adsorption force to adsorb and fix the wafer to be inspected, can rotate synchronously with the turntable around the central axis, and can be driven by the Z-axis lifting platform to rise and fall synchronously with the turntable; the adjustment platform includes an adjustment adsorption platform and an XYZ three-axis platform; the adjustment adsorption platform can rely on the vacuum adsorption gas circuit to provide adsorption force to adaptively adsorb on the outer edge bottom of the fixed wafer; the XYZ three-axis platform drives the adjustment adsorption platform to move and drive the wafer displacement. The present invention integrates multiple key functions such as vacuum adsorption, high-speed rotation, Z-axis auxiliary focusing, and automatic wafer alignment, and can meet the vast majority of wafer loading requirements during wafer defect detection.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer defect detection, and more particularly to a wafer loading system of a wafer defect detection device. Background Art

[0002] Wafers are a key product in the semiconductor industry and serve as the fundamental raw material for the processing and production of integrated circuits. During wafer manufacturing, transportation, and storage, defects such as pits, scratches, and particles may appear on the wafer surface due to factors such as human error, machine errors, and environmental contamination. The "10x Rule" states that a fault at the circuit board level, when transmitted to the chip level, can result in a tenfold increase in costs. Therefore, to improve product quality and yield and reduce production costs, wafer defect detection is necessary beforehand, and production technology and equipment are refined based on the test results.

[0003] The wafer defect detection device is based on automatic optical inspection technology, with an optical system as the core, equipped with a support system, a wafer holding system, a distance measurement system, a control system, etc., which can realize the rapid and accurate positioning and identification of wafer defects. This type of device must first fix the wafer before detection, and the wafer holding system usually adopts a chuck clamping type or a vacuum adsorption type. The chuck clamping method causes less damage to the wafer surface, but it needs to clamp the edge of the wafer, making the edge position difficult to detect, and due to the lack of support at the center of the wafer, the deformation at the center increases, and the detection accuracy is reduced. The vacuum adsorption type can effectively reduce the deformation at the center of the wafer, but an unreasonable adsorption system will cause certain damage or even destruction to the wafer during the adsorption process. In addition, the eccentricity of the wafer after fixation is also an important factor affecting defect detection and positioning. Summary of the Invention

[0004] The present invention aims to solve the above-mentioned technical problems. To obtain stable and good detection results, the present invention proposes a wafer loading system for a wafer defect detection device, which is expected to facilitate the implementation of various key functions in the wafer defect detection process, such as wafer fixation, wafer rotation, auxiliary focusing, and auxiliary automatic alignment, thereby improving the efficiency and automation level of wafer defect detection.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A wafer loading system for a wafer defect detection device has the following structural features:

[0007] Used for wafer defect detection, including vacuum adsorption gas path, carrier and adjustment table;

[0008] The vacuum adsorption gas circuit includes a compressed air source, a vacuum air circuit triplex, a vacuum generating unit, and a two-position three-way solenoid valve connected in sequence. The inlet of the two-position three-way solenoid valve is connected to the vacuum generating unit, and the two outlets are connected to the supporting platform and the adjustment platform respectively through corresponding air pipes;

[0009] The carrier platform includes a Z-axis lifting platform, a turntable, and a fixed adsorption platform coaxially assembled from bottom to top; the fixed adsorption platform relies on the vacuum adsorption gas circuit to provide adsorption force, fixes the wafer to be inspected by vacuum adsorption, can rotate synchronously with the turntable around the central axis, and can be driven by the Z-axis lifting platform to rise and fall synchronously with the turntable;

[0010] The adjustment platform includes an adjustment adsorption platform and an XYZ three-axis platform; the annular adjustment ring of the adjustment adsorption platform is coaxially arranged with the fixed adsorption platform, and can rely on the vacuum adsorption gas path to provide adsorption force, and adaptively adsorb on the bottom of the outer edge of the fixed wafer; the XYZ three-axis platform is used to drive the adjustment adsorption platform to move, thereby driving the wafer displacement.

[0011] The structural features of the wafer loading system of the wafer defect detection device are also as follows:

[0012] The vacuum air path triplex comprises a dryer, a filter, an oil separator and a pressure reducing valve which are sequentially connected along the air flow direction.

[0013] The inlet end of the vacuum generating unit is connected to the vacuum air circuit triplex, and the outlet end is connected to the two-position three-way solenoid valve, forming two parallel paths; one path includes a vacuum breaking valve and a throttle valve in sequence, and the other path includes a vacuum supply valve, a vacuum generator, and a one-way valve in sequence, and the vacuum generator is connected to a muffler; the outlet end of the vacuum generating unit is also provided with a vacuum pressure switch and a filter in sequence.

[0014] The fixed adsorption platform includes an adsorption plate, an adsorption platform base, a high-speed rotary joint, and a sealing plug coaxially assembled from top to bottom;

[0015] The size of the adsorption plate is adapted to the size of the wafer, and the upper surface is provided with multiple evenly distributed grooves, and multiple vertically penetrating air holes are provided in the grooves;

[0016] An air passage consisting of a horizontal branch and multiple vertical branches is provided in the base of the adsorption platform. Both ends of the horizontal branch are detachably sealed by sealing plugs. The multiple vertical branches are respectively connected to the horizontal branches and are distributed according to the positions of the multiple air holes. The inner diameter is adapted to the aperture of the air holes and is vertically aligned with and connected to the air holes at the location.

[0017] The high-speed rotary joint serves as a connecting piece between the vacuum adsorption air path and the fixed adsorption platform, is fixedly supported at the bottom end of the adsorption platform base, and has a vertically penetrating center hole. The vacuum adsorption air path and the horizontal branch of the airway are connected through the center hole.

[0018] The adsorption disk is made of POM plastic.

[0019] The groove is an annular structure, and multiple grooves are evenly distributed along the radial direction.

[0020] The grooves are distributed in a network shape.

[0021] The turntable is an air-floating turntable.

[0022] Compared with the existing technology, the beneficial effects of the present invention are embodied in:

[0023] The present invention provides a vacuum adsorption gas circuit, a carrier platform and an adjustment platform, and utilizes the vacuum adsorption gas circuit to cooperate with the carrier platform and the adjustment platform respectively, so as to achieve driving the wafer to rotate at high speed while always keeping the wafer firmly fixed, thereby ensuring the stability of the wafer during the detection process and greatly reducing the risk of deformation and damage to the wafer during fixation. The wafer holding system of the present invention is convenient for edge detection, and can also be used to adjust the eccentricity of the wafer, assist the optical machine system of the wafer defect detection device in focusing to obtain high-quality signals, and assist in automatic alignment of the wafer position to ensure that the wafer surface points correspond one-to-one with the image points, which can better meet most of the wafer holding requirements during the wafer defect detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the sheet holding system of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the vacuum adsorption gas path in the wafer holding system;

[0026] Figure 3 It is a structural diagram of the carrier platform in the film loading system;

[0027] Figure 4 It is a structural diagram of the fixed adsorption platform in the carrier platform;

[0028] Figure 5 It is a structural schematic diagram of the upper surface of the adsorption disk in the fixed adsorption platform;

[0029] Figure 6 It is a structural diagram of the adjustment table in the film holding system;

[0030] Figure 7 It is a structural schematic diagram of the wafer defect detection device of the present invention;

[0031] Figure 8 It is a schematic diagram of the working process of the wafer defect detection device;

[0032] Figure 9 This is a schematic diagram of the positional relationship between the point displacement sensor and the wafer;

[0033] Figure 10 This is a workflow diagram when the present invention is applied to the Z-direction auxiliary focusing function of a wafer defect detection device;

[0034] Figure 11It is a schematic diagram of the positional relationship between the linear displacement sensor and the wafer;

[0035] Figure 12 This is a workflow diagram when the present invention is applied to the automatic alignment function of a wafer defect detection device;

[0036] Figure 13 The figure is a schematic diagram of the control flow of various functions of a wafer defect detection device equipped with the wafer loading system of the present invention.

[0037] In the picture:

[0038] 1 Vacuum adsorption air circuit; 10 Compressed air source; 11 Vacuum air circuit triplex; 110 Dryer; 111 Filter; 112 Oil separator; 113 Pressure reducing valve; 12 Vacuum generating unit; 120 Vacuum breaking valve; 121 Vacuum supply valve; 122 Throttle valve; 123 Vacuum generator; 124 Muffler; 125 Check valve; 126 Vacuum pressure switch; 127 Filter; 13 Two-position three-way solenoid valve; 14 Air pipe;

[0039] 2. Carrying platform; 20. Fixed adsorption platform; 200. Adsorption plate; 2000. Air hole; 2001. Mounting hole; 2002. Groove; 201. Adsorption platform base; 2010. Horizontal branch; 2011. Vertical branch; 202. Sealing plug; 203. High-speed rotary joint; 21. Turntable; 22. Z-axis lifting platform;

[0040] 3 adjustment table; 30 adjustment adsorption table; 300 annular adjustment ring; 31XYZ three-axis platform;

[0041] 4. Optical and mechanical system;

[0042] 5. Support system;

[0043] 6 wafers;

[0044] 7 distance measurement systems; 70 line displacement sensors; 71 point displacement sensors. DETAILED DESCRIPTION

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0046] Please refer to Figures 1 to 6 The wafer loading system of this embodiment is used for wafer defect detection, and includes a vacuum adsorption gas path 1, a loading platform 2 and an adjustment platform 3;

[0047] The vacuum adsorption gas circuit 1 includes a compressed air source 10, a vacuum air circuit triplex 11, a vacuum generating unit 12, and a two-position three-way solenoid valve 13, which are connected in sequence. The inlet of the two-position three-way solenoid valve 13 (port A in the figure) is connected to the vacuum generating unit 12, and the two outlets (port R and port P in the figure) are connected to the supporting platform 2 and the adjustment platform 3 respectively through corresponding air pipes 14, which are used to switch the working states of the fixed adsorption platform 20 and the adjustable adsorption platform 30 during the eccentricity adjustment process.

[0048] The carrier 2 includes a Z-axis lifting platform 22, a turntable 21, and a fixed adsorption platform 20 coaxially assembled from bottom to top. The fixed adsorption platform 20 relies on the vacuum adsorption gas circuit 1 to provide adsorption force, fixes the wafer 6 to be inspected by vacuum adsorption, and can rotate synchronously with the turntable 21 around the central axis. It can also be driven by the Z-axis lifting platform 22 to rise and fall synchronously with the turntable 21.

[0049] The adjustment platform 3 includes an adjustment adsorption platform 30 and an XYZ three-axis platform 31. The adjustment adsorption platform 30 is used to adsorb and move the wafer 6 during the process of adjusting the eccentricity, and the XYZ three-axis platform 31 is used to adjust the position of the wafer 6; the annular adjustment ring 300 of the adjustment adsorption platform 30 is coaxially arranged with the fixed adsorption platform 20, and can rely on the vacuum adsorption gas path 1 to provide adsorption force, and adaptively adsorb on the outer edge bottom of the fixed wafer 6; the XYZ three-axis platform 31 is used to drive the adjustment adsorption platform 30 to move, thereby driving the wafer 6 to move.

[0050] The wafer holding system has the function of vacuum adsorption of wafers, with a smooth adsorption and release process, causing less impact damage to the wafers, and should also have the function of driving the wafers to rotate at high speed. Its structural settings also include:

[0051] The vacuum air circuit triplex 11 is used to filter the compressed air to ensure that the compressed air is clean and dry, and includes a dryer 110, a filter 127111, an oil separator 112, and a pressure reducing valve 113 which are connected in sequence along the airflow direction.

[0052] The inlet end of the vacuum generating unit 12 is connected to the vacuum air circuit triplet 11, and the outlet end is connected to the two-position three-way solenoid valve 13, forming two parallel paths; one path includes a vacuum breaking valve 120 and a throttle valve 122 in sequence, and the other path includes a vacuum supply valve 121, a vacuum generator 123, and a one-way valve 125 in sequence, and the vacuum generator 123 is connected to a muffler 124; the outlet end of the vacuum generating unit 12 is also provided with a vacuum pressure switch 126 and a filter 127111 in sequence.

[0053] The calculation method for the vacuum pressure provided by the compressed air source 10 is:

[0054] For a wafer 6 with a radius of R and a mass of m, its moment of inertia is

[0055]

[0056] The maximum angular acceleration of the turntable 21 is α mαx , then the maximum torque required to drive the wafer 6 to rotate is

[0057]

[0058] Where D is the adsorption contact surface, f s is the static friction force per unit adsorption surface and can be solved according to the above formula.

[0059]

[0060] Where N is the support force of the adsorption plate 200, G is the weight of the wafer 6, F is the vacuum suction force, P is the vacuum pressure, S' is the area of ​​the vacuum groove of the adsorption plate 200, and S is the total contact area between the wafer 6 and the adsorption plate 200. Assuming the safety factor is t, the vacuum pressure P required to adsorb the wafer 6 is N for

[0061]

[0062] The upper and lower mounting surfaces of the fixed adsorption platform 20 must meet high parallelism requirements, and each mounting surface must meet high surface roughness requirements. The same applies to the turntable 21 and the Z-axis lift 22. The Z-axis lift 22 must also meet high parallelism and movement accuracy. The fixed adsorption platform 20 and the turntable 21 are fixed by screws. The turntable 21 drives the fixed adsorption platform 20 to rotate at high speed, and indirectly drives the wafer to rotate at high speed.

[0063] The fixed adsorption platform 20 includes an adsorption plate 200, an adsorption platform base 201, a high-speed rotary joint 203, and a sealing plug 202, which are coaxially assembled from top to bottom.

[0064] The shape of the suction plate 200 is adapted to the wafer 6 and is slightly smaller than the wafer 6. The bottom of the outer edge of the wafer 6 exposed outside the suction plate is fixed by suction by the annular adjustment ring 300. This structural design can reduce the deformation of the edge of the wafer 6 due to its own weight. The upper surface has multiple evenly distributed grooves 2002, and multiple vertical air holes 2000 are set in the grooves 2002. There are also mounting holes 2001 for assembly. The mounting holes 2001 should be completely located outside the grooves 2002.

[0065] An air passage consisting of a horizontal branch 2010 and multiple vertical branches 2011 is provided within the adsorption platform base 201. Both ends of the horizontal branch 2010 are detachably sealed by sealing plugs 202. The multiple vertical branches 2011 communicate with the horizontal branches 2010 and are distributed corresponding to the positions of the multiple air holes 2000. Their inner diameters are adapted to the diameters of the air holes 2000, and they are vertically aligned with and communicate with the air holes 2000 at their respective locations.

[0066] The high-speed rotary joint 203, serving as the connector between the vacuum adsorption air circuit and the fixed adsorption platform 20, should be installed at the exact center of the bottom of the fixed adsorption platform 20. One end is fixedly supported on the bottom of the adsorption platform base 201, rotating synchronously with the turntable 21 and the fixed adsorption platform 20. The other end is connected to the vacuum adsorption air circuit and remains stationary during the turntable's rotation to prevent the air pipe from being swung during rotation. It has a vertically running center hole, through which the air pipe 14 of the vacuum adsorption air circuit 1 communicates with the lateral branch 2010 of the air channel. Accordingly, a central through hole for the air supply pipe 14 should be reserved in the center of the Z-axis lifting platform 22 and the turntable 21, and a lateral through hole should be provided on the side of the Z-axis lifting platform 22 to communicate with the central through hole, ensuring sufficient space for the air pipe 14 to pass through and connect to the high-speed rotary joint 203 and the vacuum adsorption air circuit.

[0067] The high-speed rotary joint 203 should have a long service life and a high rotation speed. The maximum allowable rotation speed should not be lower than the maximum rotation speed of the turntable 21. The working resistance should be small and the rotation should be flexible.

[0068] The fixed adsorption table should be a symmetrical structure, and a dynamic balancing test should be performed during installation to prevent damage to the turntable motor due to excessive eccentricity.

[0069] The adsorption disk 200 is made of POM plastic, and other high-rigidity, high-wear-resistant, and low-weight materials may also be used.

[0070] The depth of the groove 2002 should not be too large, and it can be an annular structure. Multiple annular grooves 2002 can be evenly distributed along the radial direction or in a mesh shape.

[0071] The turntable 21 should have smaller end runout and radial runout. In this embodiment, an air-floating turntable 21 is selected.

[0072] The XYZ three-axis platform 31 uses a precision translation stage, which can achieve high-precision micro-movement over a small distance.

[0073] Please refer to Figures 7 and 8 The embodiment of the present invention also proposes a corresponding wafer defect detection device, including the above-mentioned wafer holding system.

[0074] The wafer defect detection device further includes:

[0075] Host computer;

[0076] The optical-mechanical system 4 is the core of the detection device and is used to detect defects on the wafer 6. It is carried by the support system 5 and can realize complex defect detection in multiple modes.

[0077] The support system 5 is used to drive the optical-mechanical system 4 to scan the inspection surface of the wafer 6. Specifically, the turntable 21 of the wafer loading system provides Z-axis rotational freedom and cooperates with the support system 5 to carry the optical-mechanical system 4 to complete high-speed scanning from the outer circle to the inner circle, so that the scanning points traverse the entire upper surface of the wafer 6.

[0078] The distance measurement system 7 cooperates with the adjustment stage 3 during the wafer 6 loading process to adjust the eccentricity of the wafer 6. During operation, the adjustment stage 3 calculates the eccentricity based on the data measured by the distance measurement system 7 and adjusts the X, Y, and Z three-axis platform 31 accordingly to adjust the position of the wafer 6. During the inspection process, the distance measurement system 7 cooperates with the Z-axis lift stage 22. The Z-axis lift stage 22 assists the optical and mechanical system 4 in achieving focus tracking, which helps to ensure the stability of the detector signal.

[0079] The wafer defect detection device can fix the wafer 6 and has the functions of rotating the wafer 6, auxiliary focusing, eccentricity adjustment, etc., which improves the detection efficiency and automation level, and improves the detection accuracy and sensitivity.

[0080] In the specific implementation, you can refer to the following process:

[0081] 1. Place the wafer 6 so that the center of the wafer 6 is as close as possible to the center of the fixed adsorption platform 20;

[0082] 2. Using the fixed adsorption platform 20 to adsorb and fix the wafer 6;

[0083] 3. The wafer 6 rotates one circle, and the distance measuring system 7 measures and calculates the eccentricity;

[0084] 4. Determine whether the eccentricity is within the permissible range;

[0085] If yes, defect detection is performed, and after the detection, the wafer 6 is released by the fixed adsorption platform 20 to end the detection;

[0086] If not, the wafer 6 is released through the fixed adsorption platform 20, and then the Z axis of the XYZ three-axis platform 31 is raised, and the adsorption platform 30 is adjusted to adsorb the wafer 6. The movement of the XYZ three-axis platform 31 is controlled according to the eccentricity until the eccentricity is within the allowable range. The adsorption platform 30 is adjusted to release the wafer 6, and the Z axis of the XYZ three-axis platform 31 is lowered. The fixed adsorption platform 20 adsorbs the wafer 6, and defect detection is performed. After the detection, the wafer 6 is released through the fixed adsorption platform 20 to end the detection.

[0087] The wafer loading system further includes a point displacement sensor 71 and a line displacement sensor 70 .

[0088] See also Figure 9 and Figure 10 , by setting a point displacement sensor 71, it is used to realize the Z-direction auxiliary focusing function of the film loading system:

[0089] The point displacement sensor 71 can be installed on the outer shell of the optical-mechanical system 4 of the wafer defect detection device, and displace synchronously with the optical-mechanical system 4, with the measuring end facing downward, always facing the real-time detection point of the wafer surface to be detected, and retaining a gap between the wafer and the wafer, to detect the change in the distance between the point displacement sensor 71 and the wafer surface to be detected. The wafer-carrying system drives the wafer to rotate at high speed, and the support system 5 drives the point displacement sensor 71 to move along the radial direction of the wafer, scanning the entire surface to be detected of the wafer, and calculating the distance between the point displacement sensor and each point on the wafer surface to be detected. The measurement data of the point displacement sensor 71 can be uploaded to the host computer, compared with the focal length data of the optical-mechanical system 4, and the defocus distance of each point can be analyzed. According to the defocus distance of each point, the Z-axis lifting platform 22 is used to drive the wafer to rise and fall to adjust the defocus distance of each point so that it is controlled within a very small range. This process can be completed by the control of the host computer.

[0090] See also Figure 11 and Figure 12 By setting a linear displacement sensor 70, the wafer automatic alignment function of the wafer loading system is realized to adjust the eccentricity between the wafer 6 and the turntable 21:

[0091] The fixed adsorption stage 20 is used to fix the wafer during the wafer inspection process, and the adjustable adsorption stage 30 is used to move the wafer during the wafer position adjustment process. The fixed adsorption stage 20 and the adjustable adsorption stage 30 do not start the adsorption function at the same time, and are controlled by the two-position three-way solenoid valve 13 of the vacuum adsorption gas circuit 1. The above-mentioned distance measurement system 7 includes the above-mentioned linear displacement sensor 70 and point displacement sensor 71. The linear displacement sensor 70 is set on the periphery of the wafer and is used to measure the radial distance to the outer edge of the wafer. The measurement results can be uploaded to the host computer, and the host computer calculates the wafer eccentricity. The calculation method is as follows:

[0092] Assuming that the theoretical rotation center of the wafer is O, the actual rotation center is O', the eccentricity is OO', the distance d1 between the linear displacement sensor 70 and O' is known, and the distance d2 to the edge point D can be measured, the O'D length r can be calculated.

[0093] r=d1-d2

[0094] Rotate the wafer once and evenly measure N edge points (N must be an integer multiple of 4), and collect the radial distance r1 and rotation angle θ of each point. i . After converting to rectangular coordinates, we get the coordinates of the circle center:

[0095]

[0096] The wafer is fine-tuned based on the measured eccentricity until the center offset is within the permitted range. The linear displacement sensor can measure up to 70 times, allowing the eccentricity to be adjusted within a very small range.

[0097] The host computer can be used to control the movement of the XYZ three-axis platform 31 according to the eccentricity calculation result, thereby moving the wafer.

[0098] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A wafer loading system for a wafer defect detection device, characterized by: Used for wafer defect detection, including vacuum adsorption gas path, carrier and adjustment table; The vacuum adsorption gas circuit includes a compressed air source, a vacuum air circuit triplex, a vacuum generating unit, and a two-position three-way solenoid valve connected in sequence. The inlet of the two-position three-way solenoid valve is connected to the vacuum generating unit, and the two outlets are connected to the supporting platform and the adjustment platform respectively through corresponding air pipes; The carrier platform includes a Z-axis lifting platform, a turntable, and a fixed adsorption platform coaxially assembled from bottom to top; the fixed adsorption platform relies on the vacuum adsorption gas circuit to provide adsorption force, fixes the wafer to be inspected by vacuum adsorption, can rotate synchronously with the turntable around the central axis, and can be driven by the Z-axis lifting platform to rise and fall synchronously with the turntable; The adjustment platform includes an adjustment adsorption platform and an XYZ three-axis platform; the annular adjustment ring of the adjustment adsorption platform is coaxially arranged with the fixed adsorption platform, and can rely on the vacuum adsorption gas path to provide adsorption force, and adaptively adsorb on the bottom of the outer edge of the fixed wafer; the XYZ three-axis platform is used to drive the adjustment adsorption platform to move, thereby driving the wafer displacement.

2. The wafer loading system of the wafer defect detection device according to claim 1, wherein: The vacuum air path triplex comprises a dryer, a filter, an oil separator and a pressure reducing valve which are sequentially connected along the air flow direction.

3. The wafer loading system of the wafer defect detection device according to claim 1, wherein: The inlet end of the vacuum generating unit is connected to the vacuum air circuit triplex, and the outlet end is connected to the two-position three-way solenoid valve, forming two parallel paths; one path includes a vacuum breaking valve and a throttle valve in sequence, and the other path includes a vacuum supply valve, a vacuum generator, and a one-way valve in sequence, and the vacuum generator is connected to a muffler; the outlet end of the vacuum generating unit is also provided with a vacuum pressure switch and a filter in sequence.

4. The wafer loading system of the wafer defect detection device according to claim 1, wherein: The fixed adsorption platform includes an adsorption plate, an adsorption platform base, a high-speed rotary joint, and a sealing plug coaxially assembled from top to bottom; The size of the adsorption plate is adapted to the size of the wafer, and the upper surface is provided with multiple evenly distributed grooves, and multiple vertically penetrating air holes are provided in the grooves; An air passage consisting of a horizontal branch and multiple vertical branches is provided in the base of the adsorption platform. Both ends of the horizontal branch are detachably sealed by sealing plugs. The multiple vertical branches are respectively connected to the horizontal branches and are distributed according to the positions of the multiple air holes. The inner diameter is adapted to the aperture of the air holes and is vertically aligned with and connected to the air holes at the location. The high-speed rotary joint serves as a connecting piece between the vacuum adsorption air path and the fixed adsorption platform, is fixedly supported at the bottom end of the adsorption platform base, and has a vertically penetrating center hole. The vacuum adsorption air path and the horizontal branch of the airway are connected through the center hole.

5. The wafer loading system of the wafer defect detection device according to claim 4, characterized in that: The adsorption disk is made of POM plastic.

6. The wafer loading system of the wafer defect detection device according to claim 4, wherein: The groove is an annular structure, and multiple grooves are evenly distributed along the radial direction.

7. The wafer loading system of the wafer defect detection device according to claim 4, wherein: The grooves are distributed in a network shape.

8. The wafer loading system of the wafer defect detection device according to claim 1, wherein: The turntable is an air-floating turntable.

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