A fixed phase difference network device with high integration and convenient assembly

Abstract

A fixed phase difference network device with high integration and convenient assembly, characterized in that: the device is composed of a radio frequency connector and a multi-layer PCB laminate, and the radio frequency connector is arranged above the multi-layer PCB laminate; the multi-layer PCB laminate includes a top metal layer, a first dielectric layer, an intermediate metal layer, a second dielectric layer, and a bottom metal layer arranged in sequence from top to bottom. The fixed phase difference network device designed by the present invention has high phase accuracy, low amplitude fluctuation, and high isolation. It integrates the power distribution and synthesis network and the fixed phase difference network, and has the advantages of high integration and convenient assembly. In addition, the use of multi-layer laminate strip lines and the opening of multiple phase adjustment stubs makes the device have the characteristics of high phase accuracy, low amplitude fluctuation, and high isolation, meeting the specific function verification requirements of base station equipment.

Description

Technical Field

[0001] The present invention belongs to the field of mobile communication and wireless communication, and particularly relates to a fixed phase difference network device with high integration and convenient assembly. Background Art

[0002] In the current 5G communication network, one of the core technologies is Massive MIMO technology. Correspondingly, base station equipment needs to have multi-port radio frequency signal input and output functions. Before the base station equipment is towered, various parameter indicators of the base station equipment need to be verified. For example, in the transceiver system of the base station equipment, it is necessary to ensure that the transceiver (RX / TRX) signals have a certain phase difference (such as a phase difference of 90°, 180°); the transceiver signals are synchronized, and there is a high isolation degree between the transceiver ports. Moreover, the transceiver ports correspond to multiple output ports, and the amplitude change of the multiple output ports is flat, so as to verify various indicators of the equipment.

[0003] Currently, in response to the above problems, the existing double-sided microstrip line solution: multi-module docking of a fixed phase difference network and a power distribution and synthesis network to realize a fixed phase difference network device with a multi-port output network. However, the disadvantage of this device is that multi-modules make the assembly of the whole device cumbersome, and the microstrip line solution has the disadvantage of poor isolation.

[0004] Therefore, we designed a fixed phase difference network device with high integration and convenient assembly to solve the above problems.

[0005] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the present invention and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the present invention. Summary of the Invention

[0006] To overcome the deficiencies in the above-mentioned prior art, the purpose of the present invention is to provide a fixed phase difference network device with high integration and convenient assembly.

[0007] To achieve the above purpose and other related purposes, the technical solution provided by the present invention is: a fixed phase difference network device with high integration and convenient assembly, which is composed of a radio frequency connector and a PCB multi-layer laminate. The radio frequency connector is arranged above the PCB multi-layer laminate; the PCB multi-layer laminate includes a top metal layer, a first dielectric layer, an intermediate metal layer, a second dielectric layer, and a bottom metal layer arranged in sequence from top to bottom;

[0008] The top metal layer includes a first metal ground layer for component soldering, RF connector soldering, and signal transmission. On the first metal ground layer, there are connector pads, resistor pads, top suspended microstrip lines, and first phase adjustment stubs.

[0009] The middle metal layer includes a second metal ground layer. On the second metal ground layer, there are multi-stage power distribution and synthesis networks and fixed phase difference networks for signal transmission.

[0010] The bottom metal layer includes a third metal ground layer. On the third metal ground layer, there are bottom suspended microstrip lines, and the bottom suspended microstrip lines are connected to the multi-stage power division network of the middle metal layer.

[0011] The preferred technical solution is that conductive grounding vias are provided on the first metal ground layer, the second metal ground layer, and the third metal ground layer. The top metal layer, the middle metal layer, the bottom metal layer, the first dielectric layer, the second dielectric layer, and the conductive grounding vias together form a closed dielectric strip line structure.

[0012] The preferred technical solution is that the resistor pad passes through the first dielectric layer and the middle metal layer through a metallized conductive via and is vertically transferred to the second dielectric layer.

[0013] The preferred technical solution is that the first phase adjustment stub is vertically transferred to the circuit of the middle metal layer through a metallized conductive via.

[0014] The preferred technical solution is that there are thirty-seven first phase adjustment stubs on the top metal layer.

[0015] The preferred technical solution is that the multi-stage power distribution and synthesis network of the middle metal layer is formed by cascading thirty one-to-two equal-amplitude Wilkinson power dividers, with a total of thirty-two RF output ports, a first input port, and a second input port. Among them, the thirty Wilkinson power dividers include fourteen first Wilkinson power dividers without phase adjustment stubs and sixteen second Wilkinson power dividers with phase adjustment stubs.

[0016] The preferred technical solution is that second phase adjustment stubs are provided at the RF output ports. The second phase adjustment stubs are located on the top metal layer and are connected to the thirty-two RF output ports of the middle metal layer through metal conductive vias for adjusting the phase of each RF output port.

[0017] The preferred technical solution is that the fixed phase difference network of the intermediate metal layer includes four one-to-two equal-amplitude third Wilkinson power dividers, a top-layer suspended microstrip line, two total RF input ports, a first output port, and a second output port; among the four branches of the four one-to-two equal-amplitude third Wilkinson power dividers, three branches are of equal length and one branch is of unequal length, and the branch of unequal length forms a fixed phase difference between the two total RF input ports; the two total RF input ports are the total RF output port RX and the total RF output port TRX respectively.

[0018] The preferred technical solution is that metalized holes are provided at both ends of the top-layer suspended microstrip line on the top-layer metal layer, and the metalized holes are connected to the lines of the fixed phase difference network of the intermediate metal layer and the lines of the two total RF input ports; the two first output ports of the fixed phase difference network are directly connected and docked with the two input ports of the multi-stage power distribution and synthesis network of the intermediate metal layer.

[0019] The preferred technical solution is that four bottom-layer suspended microstrip lines are provided and metalized holes are provided at both ends, and the bottom-layer suspended microstrip lines are connected to the lines of the intermediate metal layer through the metalized holes; the bottom-layer suspended microstrip lines share the second metal ground layer of the intermediate metal layer with the top-layer suspended microstrip lines.

[0020] Due to the application of the above technical solution, the advantages of the present invention compared with the prior art are:

[0021] The device integrates the power distribution and synthesis network and the fixed phase difference network, has the advantages of high integration and convenient assembly. In addition, the use of multi-layer laminated board strip lines and the opening of multiple phase adjustment stubs makes the device have the characteristics of high phase accuracy, low amplitude fluctuation, and high isolation, meeting the specific function verification requirements of base station equipment. Description of the Drawings

[0022] Figure 1 It is an exploded view of an embodiment of the present invention.

[0023] Figure 2 It is a schematic diagram of the structure of the top-layer metal layer of an embodiment of the present invention.

[0024] Figure 3 It is a schematic diagram of the lamination principle of the top-layer metal layer, the intermediate metal layer, and the bottom-layer metal layer of an embodiment of the present invention.

[0025] Figure 4 is Figure 3 The enlarged schematic diagram of the fixed phase difference network A1 in

[0026] Figure 5 It is a measured standing wave ratio curve graph of an embodiment of the present invention.

[0027] Figure 6Measured amplitude curve of the embodiment of the present invention Figure 1 。

[0028] Figure 7 Measured amplitude curve of the embodiment of the present invention Figure 2 。

[0029] Figure 8 Measured isolation curve of the embodiment of the present invention Figure 1 。

[0030] Figure 9 Measured isolation curve of the embodiment of the present invention Figure 2 。

[0031] In the above figures, 1, RF connector; 2, top metal layer; 20, connector pad; 21, resistor pad; 22, top suspended microstrip line; 24, first phase adjustment stub; 26, first metal ground layer; 3, first dielectric layer; 4, intermediate metal layer; 40, first Wilkinson power divider; 400, first input port; 401, second input port; 402, second metal ground layer; 403, first output port; 404, second output port; 41, second Wilkinson power divider; 410, second phase adjustment stub; 42, total RF output port RX; 43, total RF output port TRX; T1 to T16, R1 to R16: RF output ports; 44, third Wilkinson power divider; 48, equal-length branches; 49, unequal-length branches; 5, second dielectric layer; 6, bottom metal layer; 60, bottom suspended microstrip line. Detailed implementation manners

[0032] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0033] Please refer to Figures 1 to 9 . It should be noted that in the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. The terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0034] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and defined, the terms "arrangement", "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Embodiment: As Figure 1 , 2 shown, the present invention provides a fixed phase difference network device with high integration and convenient assembly. The device is composed of a radio frequency connector 1 and a PCB multi-layer laminate. The radio frequency connector 1 is arranged above the PCB multi-layer laminate; the PCB multi-layer laminate includes a top metal layer 2, a first dielectric layer 3, an intermediate metal layer 4, a second dielectric layer 5, and a bottom metal layer 6 arranged in sequence from top to bottom. Figure 1 The radio frequency connector 1 shown in

[0036] is an SMA-KYWHD elbow connector, and the radio frequency connector 1 includes but is not limited to the SMA-KYWHD elbow connector. Figure 2 As Figure 1 shown, the top metal layer 2 includes a first metal ground layer 26 for component soldering, radio frequency connector 1 soldering, and signal transmission. On the first metal ground layer 26, there are connector pads 20, a plurality of resistor pads 21, a top suspended microstrip line 22, and a plurality of first phase adjustment branches 24.

[0037] The connector pads 20, resistor pads 21, and thirty-seven first phase adjustment branches 24 on the top metal layer 2 can also be provided on the bottom metal layer 6, and the number of first phase adjustment branches 24 is not limited to thirty-seven.

[0038] As Figure 2 , 3 shown, the intermediate metal layer 4 includes a second metal ground layer 402, on which a multi-stage power distribution and synthesis network and a fixed phase difference network are provided for signal transmission. The multi-stage power distribution and synthesis network of the intermediate metal layer 4 is formed by cascading thirty one-to-two equal-amplitude Wilkinson power dividers, and has a total of thirty-two RF output ports, a first input port 400 and a second input port 401; among them, the thirty Wilkinson power dividers include fourteen first Wilkinson power dividers 40 without phase adjustment stubs and sixteen second Wilkinson power dividers 41 with phase adjustment stubs. Second phase adjustment stubs 410 are provided at the RF output ports, and the second phase adjustment stubs 410 are located on the top metal layer 2 and are connected to the thirty-two RF output ports of the intermediate metal layer 4 through metal vias for adjusting the phases of the respective RF output ports. The fixed phase difference network of the intermediate metal layer 4 includes four one-to-two equal-amplitude third Wilkinson power dividers 44, a top-layer suspended microstrip line 22, two total RF input ports, a first output port 403 and a second output port 404; among the four branches of the four one-to-two equal-amplitude third Wilkinson power dividers 44, three branches 48 are of equal length and one branch 49 is of unequal length, and the branch 49 of unequal length forms a fixed phase difference between the two total RF input ports; the two total RF input ports are the total RF output port RX42 and the total RF output port TRX43 respectively. The number of RF output ports of the intermediate metal layer 4 is not limited to thirty-two.

[0039] The intermediate metal layer 4 is composed of a multi-stage power distribution and synthesis network and a fixed phase difference network A1. The multi-stage power distribution and synthesis network has two input ports, thirty-two RF output ports T1 to T16, and R1 to R16. The first input port 400 of the multi-stage power distribution and synthesis network corresponds to sixteen RF output ports R1 to R16; the second input port 401 of the multi-stage power distribution and synthesis network corresponds to sixteen RF output ports T1 to T16; there are fourteen first Wilkinson power dividers 40 located in the multi-stage power distribution and synthesis network; the second Wilkinson power divider 41 is a Wilkinson power divider with a phase adjustment stub, and there are sixteen in total; the second phase adjustment stub 410 has an impedance matching function and can precisely adjust the phase of each RF output port. The first phase adjustment stub 24 also has the function of adjusting the phase of the cascaded Wilkinson power divider; the bottom floating microstrip line 60 is located on the bottom metal layer 6. Metalized conductive holes are opened at both ends of the bottom floating microstrip line 60 and are connected to the lines of the intermediate metal layer 4 through the conductive holes, while the top floating microstrip line 22 is connected to the fixed phase difference network of the intermediate metal layer 4 through the metalized conductive holes opened at both ends; the bottom floating microstrip line 60 and the top floating microstrip line 22 share the second metal ground layer 402 of the intermediate metal layer 4 to ensure that the RF signal transmissions on the bottom floating microstrip line 60 and the top floating microstrip line 22 do not interfere with each other.

[0040] As Figure 4 shown, the fixed phase difference network A1 is composed of a third Wilkinson power divider 44 that divides one into two equal amplitudes of the fixed phase difference network and the top floating microstrip line 22. It has two total RF input ports (i.e., the RF output total port RX42 and the RF output total port TRX43) and two output ports (the first output port 403 and the second output port 404); the two output ports of the fixed phase difference network A1 are directly connected and docked with the two input ports of the multi-stage power distribution and synthesis network respectively. The third Wilkinson power divider 44 has a total of three equal-length branches 48 and an unequal-length branch 49 to form a fixed phase difference. The first phase adjustment stub 24 located in the fixed phase difference network can adjust the phase of the unequal-length branch 49 according to needs to meet actual requirements.

[0041] The bottom metal layer 6 includes a third metal ground layer. The bottom floating microstrip line 60 is provided on the third metal ground layer, and the bottom floating microstrip line 60 is connected to the multi-stage power distribution network of the intermediate metal layer 4.

[0042] Metalized holes are provided at both ends of the top floating microstrip line 22 on the top metal layer 2. The metalized holes are connected to the lines of the fixed phase difference network of the intermediate metal layer 4 and the lines of the two total RF input ports; the two output ports of the fixed phase difference network are directly connected and docked with the two input ports of the multi-stage power distribution and synthesis network of the intermediate metal layer 4.

[0043] There are four bottom-layer suspended microstrip lines 60 in total, and metallized holes are provided at both ends. The bottom-layer suspended microstrip lines 60 are connected to the circuits of the intermediate metal layer 4 through these metallized holes; the bottom-layer suspended microstrip lines 60 and the top-layer suspended microstrip lines 22 share the second metal ground layer 402 of the intermediate metal layer 4.

[0044] As Figure 5 shown in the measured standing wave ratio curve diagram, among which the standing wave ratios of the RF input total port RX and the RF input total port TRX are below 1.35 in the range of 1710 MHz to 2170 MHz, and the standing wave ratios of the RF output ports are all below 1.25, having relatively excellent standing wave performance.

[0045] As Figure 6 、 7 shown in the measured amplitude curve diagram, the measured amplitude is between -19.3 and -19.9 dB, and the amplitude difference of each channel (such as TRX-T1, TRX-T2...TRX-R1,...TRX-R16) at the same frequency point is within 0.3 dB, having the characteristic of low amplitude fluctuation.

[0046] As shown in Table 1 below: Measured phase difference data table. The fixed phase difference selected in this embodiment is 180°. It can be seen from the data table that the phase difference is 180° ± 1° at the frequency point of 1987.5 MHz, having relatively high phase accuracy.

[0047]

[0048] Table 1

[0049] As Figure 8 shown in the measured isolation degree curve Figure 1 , the worst isolation degree between the RF input total port RX and TRX is -38.812 dB, and the isolation degree at the concerned frequency point of 1987.5 MHz is -54.738 dB;

[0050] As Figure 9 shown in the measured isolation degree curve Figure 2 , it is the isolation degree between the RF output ports (such as R9~T9), and the isolation degree is below -60 dB. It can be seen from the test results that the fixed phase difference network device of this embodiment has the characteristic of high isolation degree.

[0051] The fixed phase difference network device designed by the present invention with high phase accuracy, low amplitude fluctuation, and high isolation degree integrates the power distribution and synthesis network and the fixed phase difference network, having the advantages of high integration degree and convenient assembly. In addition, the use of multi-layer laminated board strip lines and the opening of multiple phase adjustment branches enables the device to have the characteristics of high phase accuracy, low amplitude fluctuation, and high isolation degree, meeting the specific function verification requirements of base station equipment.

[0052] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A fixed phase difference network device with high integration and convenient assembly, characterized in that: The device is composed of a radio frequency connector (1) and a multi-layer PCB laminate. The radio frequency connector (1) is arranged above the multi-layer PCB laminate; the multi-layer PCB laminate includes a top metal layer (2), a first dielectric layer (3), an intermediate metal layer (4), a second dielectric layer (5), and a bottom metal layer (6) arranged in sequence from top to bottom; The top metal layer (2) includes a first metal ground layer (26) for component soldering, radio frequency connector (1) soldering, and signal transmission. A connector pad (20), a resistor pad (21), a top suspended microstrip line (22), and a first phase adjustment stub (24) are arranged on the first metal ground layer (26); The intermediate metal layer (4) includes a second metal ground layer (402). A multi-stage power distribution and synthesis network and a fixed phase difference network are arranged on the second metal ground layer (402) for signal transmission; The bottom metal layer (6) includes a third metal ground layer. A bottom suspended microstrip line (60) is arranged on the third metal ground layer. The bottom suspended microstrip line (60) is connected to the multi-stage power division network of the intermediate metal layer (4); The fixed phase difference network of the intermediate metal layer (4) includes four equal-amplitude third Wilkinson power dividers (44) with a 1:2 ratio, a top suspended microstrip line (22), two total radio frequency input ports, a first output port (403), and a second output port (404); Among the four branches of the four equal-amplitude third Wilkinson power dividers (44), three branches (48) are of equal length and one branch (49) is of unequal length. The unequal-length branch (49) forms a fixed phase difference between the two total radio frequency input ports; The two total radio frequency input ports are respectively a radio frequency output total port RX (42) and a radio frequency output total port TRX (43).

2. A fixed phase difference network device with high integration and convenient assembly according to claim 1, characterized in that: Conductive grounding holes are arranged on the first metal ground layer (26), the second metal ground layer (402), and the third metal ground layer. The top metal layer (2), the intermediate metal layer (4), the bottom metal layer (6), the first dielectric layer (3), the second dielectric layer (5), and the conductive grounding holes together form a closed dielectric strip line structure.

3. A fixed phase difference network device with high integration and convenient assembly according to claim 2, characterized in that: The resistor pad (21) passes through the first dielectric layer (3) and the intermediate metal layer (4) through a metallized conductive hole and is vertically transferred to the second dielectric layer (5).

4. A fixed phase difference network device with high integration and convenient assembly according to claim 3, characterized in that: The first phase adjustment stub (24) is vertically transferred to the circuit of the intermediate metal layer (4) through a metallized conductive hole.

5. A fixed phase difference network device with high integration and convenient assembly according to claim 4, characterized in that: Thirty-seven first phase adjustment stubs (24) are provided on the top metal layer (2).

6. A fixed phase difference network device with high integration and convenient assembly according to claim 1, characterized in that: The multi-stage power distribution and synthesis network of the intermediate metal layer (4) is formed by cascading thirty one-to-two equal-amplitude Wilkinson power dividers, and there are a total of thirty-two RF output ports, a first input port (400) and a second input port (401); among them, the thirty Wilkinson power dividers include fourteen first Wilkinson power dividers (40) without phase adjustment stubs and sixteen second Wilkinson power dividers (41) with phase adjustment stubs.

7. A fixed phase difference network device with high integration and convenient assembly according to claim 6, characterized in that: Second phase adjustment stubs (410) are provided at all the RF output ports, and the second phase adjustment stubs (410) are located on the top metal layer (2) and are connected to the thirty-two RF output ports of the intermediate metal layer (4) through metal vias, for adjusting the phases of the respective RF output ports.

8. A fixed phase difference network device with high integration and convenient assembly according to claim 1, characterized in that: Both ends of the top suspended microstrip line (22) on the top metal layer (2) are provided with metallization holes, and the metallization holes are connected to the lines of the fixed phase difference network of the intermediate metal layer (4) and the lines of the two total RF input ports; the two first output ports (403) of the fixed phase difference network are directly connected and docked with the two input ports of the multi-stage power distribution and synthesis network of the intermediate metal layer (4).

9. A fixed phase difference network device with high integration and convenient assembly according to claim 1, characterized in that: A total of four bottom suspended microstrip lines (60) are provided and both ends are provided with metallization holes, and the bottom suspended microstrip lines (60) are connected to the lines of the intermediate metal layer (4) through the metallization holes; the bottom suspended microstrip lines (60) share the second metal ground layer (402) of the intermediate metal layer (4) with the top suspended microstrip lines (22).

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