A squeegee control system and method for a solder paste printer

Abstract

A squeegee control system and method for a solder paste printer proposed by the present invention. The squeegee control system is arranged at the bottom of the squeegee holder of the solder paste printer, and the squeegee blade of the solder paste printer is arranged at the bottom of the squeegee control system; the squeegee blade of the solder paste printer is divided into multiple adjacent area squeegee blades. The squeegee control system includes multiple area control subsystems, and each area control subsystem is used to control one area squeegee blade; the area control subsystem includes an area control module and an area squeegee blade adjustment module. The area control module is used to monitor the working pressure of the area squeegee blade and calculate the working parameters of the area squeegee blade according to the pre-input component parameters and working pressure of the solder paste printer; the area squeegee blade adjustment module is used to adjust the corresponding area squeegee blade according to the working parameters of the area squeegee blade. The present invention effectively solves the process problem that when facing stencils with different thicknesses, the squeegee cannot scrape cleanly, resulting in poor solder deposition.

Description

Technical Field

[0001] The present invention relates to the field of automatic control technology, and more specifically, to a blade control system and method for a solder paste printer. Background Art

[0002] Solder paste printing technology uses a pre-made stencil. By a certain method, the stencil is brought into direct contact with the printer, and the solder paste flows evenly within the stencil and is injected into the apertures. When the stencil leaves the printed board, the solder paste falls off from the apertures in the shape of the aperture pattern onto the corresponding pad pattern on the printed board, thus completing the printing of the solder paste on the printed board.

[0003] Currently, fully automatic solder paste printers are mainly used in SMT factories, which are production equipment for printing solder paste onto corresponding pads on a PCB. The working principle is to first fix the PCB to be printed on the printing positioning table, and then the left and right (or front and back) blades of the printer squeegee the solder paste through the stencil onto the corresponding pads. Since the solder paste is a thixotropic body and has viscosity, when the blade moves forward at a certain speed and angle, a certain pressure is generated on the solder paste, pushing the solder paste to roll in front of the squeegee, generating the pressure required to inject the solder paste into the apertures or vias. The viscous friction of the solder paste causes shear at the junction of the squeegee and the stencil of the solder paste printer, and the shear force reduces the viscosity of the solder paste, which is conducive to the smooth injection of the solder paste into the stencil openings or vias. Among them, the blade speed, blade pressure, and the angle between the blade and the stencil all have a certain impact on printing. Only by correctly controlling these parameters can the printing quality of the solder paste be ensured.

[0004] An ordinary blade consists of a blade holder, a blade, and a blade retainer. The blade is an integral whole, and when adjusting the blade pressure and angle, the entire blade is adjusted together. When there are stencils with significantly different heights, during the process of the blade advancing, due to the steps generated by the high and low stencils, the area of the stencil with a lower height is not scraped clean, and there is more solder paste remaining on the stencil. It is difficult for the solder paste to fall onto the PCB pads, resulting in poor solder deposition. After passing through the reflow oven, there will be insufficient solder. If the blade pressure is forcibly increased, it is easy to damage the stencil and the blade. Excessive extrusion of the stencil on the PCB will also cause the solder paste in the apertures to be extruded and spread around, causing abnormalities such as short circuits and solder balls. Summary of the Invention

[0005] Aiming at the above problems, the purpose of the present invention is to provide a blade control system and method for a solder paste printer, which effectively solves the process problem of poor solder deposition caused by the blade not scraping clean when facing stencils of different thicknesses.

[0006] To achieve the above object, the present invention is realized through the following technical solutions: A squeegee control system for a solder paste printer, the squeegee control system is arranged at the bottom of the squeegee holder of the solder paste printer, and the squeegee blade of the solder paste printer is arranged at the bottom of the squeegee control system; the squeegee blade of the solder paste printer is divided into multiple adjacent area squeegee blades, and each area squeegee blade corresponds to a section of the stencil area of the solder paste printer.

[0007] The squeegee control system includes multiple area control subsystems, and each area control subsystem is used to control one area squeegee blade; the area control subsystem includes an area control module and an area squeegee blade adjustment module, and the area control module is data-connected to the area squeegee blade adjustment module; the area control module is used to monitor the working pressure of the area squeegee blade, and calculate the working parameters of the area squeegee blade according to the pre-input component parameters and working pressure of the solder paste printer; the area squeegee blade adjustment module is used to adjust the corresponding area squeegee blade according to the working parameters of the area squeegee blade.

[0008] Further, the area control module includes: a CPU unit, a data unit, and a sensing unit. The data unit is respectively data-connected to the CPU unit and the sensing unit, and the CPU unit is data-connected to the area squeegee blade adjustment module; the sensing unit is used to sense the pressure generated when the area squeegee blade works, and transmit the pressure data to the data unit; the data unit is used to receive the pressure data, perform relevant logical operations on the pressure data through a preset algorithm, calculate the working parameters of the area squeegee blade and transmit them to the CPU unit, and save the data; the CPU unit is used to control the data interaction between the data unit and the sensing unit, and generate corresponding control commands according to the working parameters of the area squeegee blade and send them to the area squeegee blade adjustment module.

[0009] Further, the working parameters of the area squeegee blade include: the active stroke of the area squeegee blade, the pressure of the area squeegee blade, and the angle of the area squeegee blade.

[0010] Further, the preset algorithm includes:

[0011] The active stroke t of the area squeegee blade is calculated by the formula t = a - b - c - d; where a is the height of the squeegee holder, b is the height of the squeegee control system, c is the height of the stencil grid plate, and d is the height of the printing platform.

[0012] Further, the preset algorithm also includes:

[0013] Through the formula The pressure F of the area squeegee blade is calculated; where N is the pressure generated when the area squeegee blade works, is the squeegee stroke function.

[0014] Further, the preset algorithm also includes:

[0015] Through the formula Calculate the angle of the regional squeegee blade; where α is the initial angle of the regional squeegee blade.

[0016] Furthermore, through the formula Calculate the squeegee stroke function where t is the active stroke of the regional squeegee blade, {Xi} is the index coefficient of height, h(t) is the height original function, n(t) is the adaptive ratio of height, and C(t) is the differential error coefficient.

[0017] Correspondingly, the present invention also discloses a method for controlling the squeegee of a solder paste printer, including the following steps: S1: Establish a set of working parameter sets of the regional squeegee blade under a set of stencil height parameters through a preset process;

[0018] S2: Input multiple sets of different stencil height parameters, respectively generate corresponding working parameter sets of the regional squeegee blade through a preset process, and store all the working parameter sets of the regional squeegee blade in the database of the data unit;

[0019] S3: Start the squeegee control system, input a set of stencil height parameters, the CPU unit reads the database in the data unit, retrieves the corresponding working parameter set of the regional squeegee blade, and generates a corresponding control command to send to the regional squeegee blade adjustment module;

[0020] S4: The regional squeegee blade adjustment module adjusts the active stroke, pressure and angle of the regional squeegee blade by executing the control command.

[0021] Furthermore, the preset process includes the following steps:

[0022] S11: Pre-input a set of stencil height parameters, manually input a set of pressure and angle parameters of the regional squeegee blade, and after the squeegee blade runs normally, confirm the printing effect;

[0023] S12: Receive the pressure generated during the operation of the regional squeegee blade through the sensing unit, transfer the pressure data to the data unit, and save the pressure data;

[0024] S13: Input multiple sets of pressure and angle parameters of the regional squeegee blade, respectively confirm the printing effect, and save the pressure data. Find the best pressure and angle parameters of the regional squeegee blade under the current stencil height parameters in the printing effect, and save them.

[0025] Furthermore, finding the best pressure and angle parameters of the regional squeegee blade under the current stencil height parameters in the printing effect and saving them includes: Through DOE verification, use SPI to confirm the printing effect to find the most suitable pressure and angle parameters of the regional squeegee blade under the current stencil height parameters, and record them in the data unit of the regional control module.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention discloses a blade control system and method for a solder paste printer. Through the regional intelligent control of the blade, it can adjust parameters such as the pressure and angle of the blades in each area according to the regional height of the stencil pre-input, the height of the stencil mounted on the printer platform, the initial height of the printer blade holder, and the total height of the intelligent control blade module, realizing the precise control of the blade parameters in different areas of the stencil, as well as the application of the blade intelligent control system in the SMT field. The present invention can be applied to stencils of different heights, achieving good printing effects, effectively improving the SMT printing yield, reducing waste, and saving costs.

[0027] Therefore, compared with the prior art, the present invention has prominent substantive features and significant progress, and the beneficial effects of its implementation are also obvious. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0029] Figure 1 It is the system structure diagram of the specific implementation manner of the present invention.

[0030] Figure 2 It is the method flow chart of the specific implementation manner of the present invention. Specific Embodiments

[0031] The core of the present invention is to provide a blade control system for a solder paste printer. In the prior art, the blade of the solder paste printer is an integral whole. When adjusting the blade pressure and angle, the entire blade is adjusted together. When there are significantly different heights on the stencil, during the blade's movement, due to the steps caused by the high and low stencils, the area of the stencil with a lower height is not scraped clean, and there is a lot of solder paste remaining on the stencil. It is difficult for the solder paste to fall off onto the PCB pads, resulting in poor solder deposition. After passing through the reflow oven, solder shortage defects occur. If the blade pressure is forcibly increased, it is easy to damage the stencil and the blade. Excessive extrusion of the stencil on the PCB will also cause the solder paste in the stencil holes to be squeezed and spread around, causing abnormalities such as short circuits and solder balls.

[0032] The squeegee control system of the solder paste printer provided by the present invention is arranged at the bottom of the squeegee holder of the solder paste printer, and the squeegee blade of the solder paste printer is arranged at the bottom of the squeegee control system; the squeegee blade of the solder paste printer is divided into multiple adjacent area squeegee blades, and each area squeegee blade corresponds to a section of the stencil area of the solder paste printer. The squeegee control system includes multiple area control subsystems, and each area control subsystem is used to control one area squeegee blade; the area control subsystem includes an area control module and an area squeegee blade adjustment module, and the area control module is data-connected to the area squeegee blade adjustment module; the area control module is used to monitor the working pressure of the area squeegee blade and calculate the working parameters of the area squeegee blade according to the pre-input component parameters and working pressure of the solder paste printer; the area squeegee blade adjustment module is used to adjust the corresponding area squeegee blade according to the working parameters of the area squeegee blade. Thus, the present invention effectively solves the process problem that when facing stencils of different thicknesses, the squeegee cannot scrape cleanly, resulting in poor solder deposition.

[0033] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] Embodiment 1:

[0035] As Figure 1 shown, this embodiment provides a squeegee control system of a solder paste printer. The squeegee control system is arranged at the bottom of the squeegee holder of the solder paste printer, and the squeegee blade of the solder paste printer is arranged at the bottom of the squeegee control system; the squeegee blade of the solder paste printer is divided into multiple adjacent area squeegee blades, and each area squeegee blade corresponds to a section of the stencil area of the solder paste printer.

[0036] The squeegee control system includes multiple area control subsystems, and each area control subsystem is used to control one area squeegee blade; the area control subsystem includes an area control module and an area squeegee blade adjustment module, and the area control module is data-connected to the area squeegee blade adjustment module; the area control module is used to monitor the working pressure of the area squeegee blade and calculate the working parameters of the area squeegee blade according to the pre-input component parameters and working pressure of the solder paste printer; the area squeegee blade adjustment module is used to adjust the corresponding area squeegee blade according to the working parameters of the area squeegee blade.

[0037] The area control module includes: a CPU unit, a data unit, and a sensing unit. The data unit is respectively data-connected to the CPU unit and the sensing unit, and the CPU unit is data-connected to the area squeegee blade adjustment module;

[0038] An induction unit for sensing the pressure generated during the operation of the area blade and transmitting the pressure data to the data unit; a data unit for receiving the pressure data, performing relevant logical operations on the pressure data through a preset algorithm, calculating the working parameters of the area blade and transmitting them to the CPU unit, and saving the data; a CPU unit for controlling the data interaction between the data unit and the induction unit, and generating corresponding control commands according to the working parameters of the area blade and sending them to the area blade adjustment module.

[0039] It should be noted that the main function of the data unit is to receive the data from the induction unit, perform relevant logical operations on the data, transmit the processed data to the CPU unit, and save the data; the main function of the induction unit is to sense the pressure generated during the operation of the squeegee and transmit the data to the data unit. The blade is divided into areas instead of being an entire conventional one-piece. The divided area blades can move independently, and adjacent area blades do not affect each other. The squeegee parameters corresponding to this area stencil, such as squeegee pressure and squeegee angle, can be automatically adjusted by inputting the relevant parameters of this section of the stencil. By pre-inputting the heights of each area of the stencil, the height of the stencil on the printing machine platform, the initial height of the printing machine squeegee holder, the total height of the intelligent control squeegee module and other parameters, the data unit calculates and transmits the squeegee parameters to the CPU unit, controls the area blade adjustment module, and adjusts the pressure, angle and other parameters of each area blade.

[0040] The area heights of each stencil are different, and the corresponding squeegee parameters are also different. By inputting a set of stencil parameters, through DOE verification, using SPI to confirm the printing effect, finding the most suitable squeegee parameter range under the current stencil parameters, and recording it in the data unit of the area control module. By inputting different stencil parameters, finding different squeegee parameter ranges applicable to different stencil parameters, and storing them in the database of the data unit. When using different stencils, inputting the height parameters of the stencil, the area control module can read the database information, retrieve the corresponding squeegee parameters, control the area blade adjustment module, and adjust to the corresponding squeegee parameters, so as to achieve precise control of different heights of the stencil, make the blades of the entire area of the stencil match different heights of the stencil, and achieve a good printing effect.

[0041] In this system, the working parameters of the area blade that need to be calculated include: the moving stroke of the area blade, the pressure of the area blade, and the angle of the area blade.

[0042] Correspondingly, the preset algorithm includes:

[0043] The moving stroke t of the area blade is calculated by the formula t = a - b - c - d; where a is the height of the squeegee holder, b is the height of the squeegee control system, c is the height of the grid stencil, and d is the height of the printing platform.

[0044] Calculate the pressure F of the regional squeegee blade through the formula ; where N is the pressure generated during the operation of the regional squeegee blade, is the squeegee stroke function.

[0045] Calculate the angle of the regional squeegee blade through the formula ; where α is the initial angle of the regional squeegee blade.

[0046] Among them, calculate the squeegee stroke function through the formula Among them, t is the active stroke of the regional squeegee blade, {Xi} is the index coefficient of height, h(t) is the original height function, n(t) is the adaptive ratio of height, and C(t) is the differential error coefficient.

[0047] This embodiment provides a squeegee control system for a solder paste printer. Through the regional intelligent control of the squeegee blade, it can adjust parameters such as the pressure and angle of the squeegee in each area according to the regional height of the pre-input stencil, the height of the stencil racked on the printer platform, the initial height of the printer squeegee rack, and the total height of the intelligent control squeegee module, realizing precise control of the squeegee parameters in different areas of the stencil, as well as the application of the squeegee intelligent control system in the SMT field.

[0048] Embodiment 2:

[0049] Figure 2 Based on Embodiment 1, as shown, the present invention also discloses a squeegee control method for a solder paste printer, including the following steps:

[0050] S1: Establish a set of working parameter sets of the regional squeegee blade under a set of stencil height parameters through a preset process.

[0051] S2: Input multiple sets of different stencil height parameters, respectively generate corresponding working parameter sets of the regional squeegee blade through a preset process, and store all the working parameter sets of the regional squeegee blade in the database of the data unit.

[0052] In the above steps, the adopted preset process includes the following steps:

[0053] S11: Pre-input a set of stencil height parameters, manually input a set of pressure and angle parameters of the regional squeegee blade, and after the squeegee blade runs normally, confirm the printing effect;

[0054] S12: Receive the pressure generated during the operation of the regional squeegee blade through the sensing unit, transmit the pressure data to the data unit, and save the pressure data;

[0055] ​S13: Input multiple groups of pressure and angle parameters of the regional squeegee blades, respectively confirm the printing effects, save the pressure data, and find the optimal pressure and angle parameters of the regional squeegee blades under the current stencil height parameter in the printing effects, and then save them. Specifically, through DOE verification and using SPI to confirm the printing effects, search for the most suitable pressure and angle parameters of the regional squeegee blades under the current stencil height parameter, and record them in the data unit of the regional control module.

[0056] S3: Start the squeegee control system, input a set of stencil height parameters, the CPU unit reads the database in the data unit, retrieves the corresponding set of working parameters of the regional squeegee blades, and generates corresponding control commands to send to the regional squeegee blade adjustment module.

[0057] S4: The regional squeegee blade adjustment module adjusts the active stroke, pressure, and angle of the regional squeegee blades by executing the control commands.

[0058] This embodiment provides a squeegee control method for a solder paste printer. Through the intelligent regional control of the squeegee blades, it can adjust parameters such as the pressure and angle of each regional squeegee according to the regional height of the pre-input stencil, the height of the stencil mounted on the printer platform, the initial height of the printer squeegee holder, and the total height of the intelligent control squeegee module, so as to achieve precise control of the squeegee parameters in different regions of the stencil. This method can be applied to stencils of different heights, can achieve good printing effects, effectively improve the SMT printing yield, reduce waste, and save costs.

[0059] In summary, the present invention effectively solves the process problem that when facing stencils of different thicknesses, the squeegee cannot scrape cleanly, resulting in poor solder deposition.

[0060] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other. For the methods disclosed in the embodiments, since they correspond to the systems disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the description of the method part.

[0061] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0062] In several embodiments provided by the present invention, it should be understood that the disclosed systems, systems, and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of systems or units can be in electrical, mechanical, or other forms.

[0063] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0064] In addition, in each embodiment of the present invention, the various functional modules can be integrated in a processing unit, or each module can exist physically alone, or two or more modules can be integrated in a unit.

[0065] Similarly, in each embodiment of the present invention, the various processing units can be integrated in a functional module, or each processing unit can exist physically, or two or more processing units can be integrated in a functional module.

[0066] The steps of the methods or algorithms described in combination with the embodiments disclosed in this article can be directly implemented by hardware, software modules executed by a processor, or a combination of both. The software modules can be placed in a random access memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium well-known in the technical field.

[0067] Finally, it should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0068] The above has introduced in detail the squeegee control system and method of the solder paste printer provided by the present invention. Specific examples are used in this text to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can still be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A squeegee control system for a solder paste printer, characterized in that, the squeegee control system is arranged at the bottom of the squeegee holder of the solder paste printer, and the squeegee blade of the solder paste printer is arranged at the bottom of the squeegee control system; the squeegee blade of the solder paste printer is divided into multiple adjacent area squeegee blades, and each area squeegee blade corresponds to a section of the stencil area of the solder paste printer; the squeegee control system includes multiple area control subsystems, and each area control subsystem is used to control one area squeegee blade; the area control subsystem includes an area control module and an area squeegee blade adjustment module, and the area control module is data-connected to the area squeegee blade adjustment module; the area control module is used to monitor the working pressure of the area squeegee blade, and calculate the working parameters of the area squeegee blade according to the pre-input component parameters and working pressure of the solder paste printer; the area squeegee blade adjustment module is used to adjust the corresponding area squeegee blade according to the working parameters of the area squeegee blade.

2. The squeegee control system for a solder paste printer according to claim 1, characterized in that, the area control module includes: a CPU unit, a data unit and a sensing unit, the data unit is respectively data-connected to the CPU unit and the sensing unit, and the CPU unit is data-connected to the area squeegee blade adjustment module; the sensing unit is used to sense the pressure generated when the area squeegee blade works, and transmit the pressure data to the data unit; the data unit is used to receive the pressure data, perform relevant logical operations on the pressure data through a preset algorithm, calculate the working parameters of the area squeegee blade and transmit them to the CPU unit, and save the data; the CPU unit is used to control the data interaction between the data unit and the sensing unit, and generate corresponding control commands according to the working parameters of the area squeegee blade and send them to the area squeegee blade adjustment module.

3. The squeegee control system for a solder paste printer according to claim 2, characterized in that, the working parameters of the area squeegee blade include: the active stroke of the area squeegee blade, the pressure of the area squeegee blade, and the angle of the area squeegee blade.

4. The squeegee control system for a solder paste printer according to claim 3, characterized in that, the preset algorithm includes: calculating the active stroke t of the area squeegee blade through the formula t = a - b - c - d; where a is the height of the squeegee holder, b is the height of the squeegee control system, c is the height of the stencil grid, and d is the height of the printing platform.

5. The squeegee control system for a solder paste printer according to claim 4, characterized in that, the preset algorithm further includes: The pressure F of the area scraping blade is calculated through the formula where N is the pressure generated during the operation of the area scraping blade, is the scraping blade stroke function.

6. The squeegee control system for a solder paste printer according to claim 5, characterized in that, the preset algorithm further includes: Calculate the angle of the regional scraping blade through the formula ; where α is the initial angle of the regional scraping blade.

7. The squeegee control system for a solder paste printer according to claim 6, characterized in that: Through the formula the scraper stroke function is calculated where t is the active stroke of the regional scraper blade, {Xi} is the index coefficient of height, h(t) is the original height function, n(t) is the adaptive ratio of height, and C(t) is the differential error coefficient.

8. A squeegee control method for a solder paste printer, characterized in that, includes the following steps: S1: Establish a set of working parameter sets of the area squeegee blade under a set of stencil height parameters through a preset process; S2: Input multiple groups of different stencil height parameters, respectively generate corresponding working parameter sets of the area squeegee blade through a preset process, and store all the working parameter sets of the area squeegee blade in the database of the data unit; S3: Start the squeegee control system, input a set of stencil height parameters, the CPU unit reads the database in the data unit, retrieves the working parameter set of the corresponding area squeegee blades, and generates corresponding control commands to send to the area squeegee blade adjustment module; S4: The area squeegee blade adjustment module adjusts the active stroke, pressure and angle of the area squeegee blades by executing the control commands.

9. The squeegee control method of the solder paste printer according to claim 8, wherein, the preset process includes the following steps: S11: Pre-input a set of stencil height parameters, manually input a set of pressure and angle parameters of the area squeegee blades, and after the squeegee blades operate normally, confirm the printing effect; S12: Receive the pressure generated during the operation of the area squeegee blades through the sensing unit, transfer the pressure data to the data unit, and save the pressure data; S13: Input multiple sets of pressure and angle parameters of the area squeegee blades, respectively confirm the printing effect, and save the pressure data. Find the best pressure and angle parameters of the area squeegee blades under the current stencil height parameters in the printing effect, and save them.

10. The squeegee control method of the solder paste printer according to claim 9, wherein, finding the best pressure and angle parameters of the area squeegee blades under the current stencil height parameters in the printing effect and saving them includes: through DOE verification, using SPI to confirm the printing effect to find the most suitable pressure and angle parameters of the area squeegee blades under the current stencil height parameters, and record them in the data unit of the area control module.

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