Dual refrigeration system control architecture and dual refrigeration system control method

Abstract

The application discloses a dual refrigeration system control architecture and a dual refrigeration system control method. The dual refrigeration system control architecture comprises at least a first subsystem, a second subsystem and an interconnection module. The first subsystem and the second subsystem are used for refrigerating the same device to be cooled. The first subsystem and the second subsystem communicate with each other through the interconnection module, so that the first subsystem and the second subsystem detect the running state of each other. When the first subsystem refrigerates the device to be cooled, the first subsystem selects the first subsystem or the second subsystem to refrigerate the device to be cooled based on the running state of the first subsystem and the detected running state. The application can realize uninterrupted refrigeration of the device to be cooled and ensure the continuous and stable refrigeration of the device to be cooled.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of refrigeration systems, in particular to a dual refrigeration system control architecture and a dual refrigeration system control method. BACKGROUND

[0002] With the continuous development of Internet computing and cloud technology, big data storage and operation have become popular. When the hardware devices of a data center are running, a large amount of heat energy will be generated. In order to ensure the sustainable operation of the computer room, a stable and reliable refrigeration system is needed for cooling.

[0003] However, in the existing refrigeration system, if the electrical components fail, the entire refrigeration system in the data center will stop and cannot continue to dissipate heat, thereby directly affecting the normal operation of the hardware devices of the data center. SUMMARY

[0004] The purpose of the present application is to provide a dual refrigeration system control architecture and a dual refrigeration system control method to ensure the continuous and stable refrigeration of the refrigeration system to the equipment to be cooled.

[0005] To achieve the above purpose, the present application provides a dual refrigeration system control architecture, which at least includes a first subsystem, a second subsystem and an interconnection module; the first subsystem and the second subsystem are used for refrigerating the same equipment to be cooled; the first subsystem and the second subsystem communicate with each other through the interconnection module to detect the running state of each other; when the first subsystem refrigerates the equipment to be cooled, the first subsystem selects the first subsystem or the second subsystem to refrigerate the equipment to be cooled based on the running state of itself and the detected running state. Alternatively, when the second subsystem refrigerates the equipment to be cooled, the second subsystem selects the first subsystem or the second subsystem to refrigerate the equipment to be cooled based on the running state of itself and the detected running state.

[0006] To achieve the above purpose, the present application further provides a dual refrigeration system control method, which is applied to a dual refrigeration system control architecture, the dual refrigeration system control architecture includes a first control mode, when the dual refrigeration system control architecture is in the first control mode, a first subsystem is a main system and a second subsystem is a standby system; the method includes: detecting the running state of itself and determining whether there is a fault; if there is no fault, outputting a closed signal to the interconnection module and not switching the refrigeration system for refrigerating the equipment to be cooled; if there is a fault, outputting an open signal to the interconnection module and detecting the state of the standby system; selecting the main system or the standby system to refrigerate the equipment to be cooled based on the fault of itself, the state of the standby system and a first control strategy.

[0007] Therefore, the technical scheme provided by the application, the double refrigeration system control architecture includes a first subsystem, a second subsystem and an interconnection module, the first subsystem and the second subsystem are used for refrigerating the same to-be-cooled device, and the first subsystem and the second subsystem communicate with each other through the interconnection module. That is, the application adopts a redundant refrigeration scheme of two refrigeration systems, the two refrigeration systems operate independently, and failure of any subsystem will not affect the other subsystem, so that the mutual spread of failure can be avoided, and the mutual operation state can be detected in real time through the interconnection module, so that the two refrigeration systems can be switched in real time and accurately, uninterrupted refrigeration of the to-be-cooled device is realized, and the continuous and stable refrigeration of the to-be-cooled device is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 is an application scenario schematic diagram of the double refrigeration system control architecture in an embodiment provided by the application;

[0010] Figure 2 is a frame structure schematic diagram of the double refrigeration system control architecture in an embodiment provided by the application;

[0011] Figure 3 is a circuit diagram of the interconnection module in an embodiment provided by the application;

[0012] Figure 4 is a circuit diagram of the first interconnection subunit in an embodiment provided by the application;

[0013] Figure 5 is a signal transmission state schematic diagram of the first interconnection subunit in an embodiment provided by the application;

[0014] Figure 6 is a circuit schematic diagram of the voltage type sensor and the first filter conversion circuit in an embodiment provided by the application;

[0015] Figure 7 is a circuit schematic diagram of the current type sensor and the first filter conversion circuit in an embodiment provided by the application;

[0016] Figure 8 is a circuit schematic diagram of the first power supply module in an embodiment provided by the application;

[0017] Figure 9 A circuit schematic diagram of a first power supply module in another embodiment provided in the present application;

[0018] Figure 10 A flow chart of a dual refrigeration system control method in an embodiment provided in the present application;

[0019] Figure 11 A flow chart of a dual refrigeration system control method in an embodiment provided in the present application. DETAILED DESCRIPTION

[0020] For the purpose of making the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings. The terms such as "upper", "upper side", "lower", "lower side", "first end", "second end", "one end", "the other end" and the like used in the present application to describe the spatial relative position of one unit or feature with respect to another unit or feature are for the purpose of facilitating the description and describing the relationship of one unit or feature with respect to another unit or feature as shown in the drawings. The spatial relative position terms can be intended to include different orientations of the device in use or operation other than the orientation shown in the drawings. For example, if the device in the drawings is turned over, the unit described as being "below" or "under" the other unit or feature will be "above" the other unit or feature. Therefore, the exemplary term "below" can encompass both the upward and downward orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptions used herein are interpreted accordingly.

[0021] In addition, the terms "mount", "set", "provided with", "connect", "slidingly connect", "fix", "sleeve" should be broadly understood. For example, "connect" can be fixed connection, detachable connection, or integral structure; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium, or internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood according to the specific circumstances by those of ordinary skill in the art.

[0022] With the continuous development of Internet computing and cloud technology, big data storage and operation have become popular. When the hardware devices of the data center are running, a large amount of heat energy will be generated. In order to ensure the sustainable operation of the computer room, a stable and reliable refrigeration system is needed for cooling.

[0023] However, in the existing refrigeration system, the failure of the electrical components will cause the entire refrigeration system in the data center to stop, and the heat dissipation cannot continue, thereby directly affecting the normal operation of the hardware devices of the data center.

[0024] Of course, there are also some data centers using double refrigeration systems, but both refrigeration systems are controlled by a logic controller, when the logic controller detects that one of the refrigeration systems fails, it switches to the other refrigeration system to continue refrigerating the data center. However, when the logic controller fails, both refrigeration systems cannot refrigerate. And taking the example of double liquid cooling systems, the existing control scheme of double liquid cooling systems, the sensor is connected to the logic controller through a wire. In actual application, the sensor is inevitably disturbed by external interference, such as electromagnetic interference of fans and water pumps, strong electric interference, lightning interference, etc. After the sensor is disturbed, the logic controller will collect incorrect sensor signals, and when the interference is serious, the logic controller will be damaged.

[0025] Therefore, how to improve the existing refrigeration system to ensure that the refrigeration system can continuously and stably refrigerate the data center has become a problem that those skilled in the art need to solve.

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the embodiments described in the present application are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0027] In an implementable embodiment, referring to FIGS. 1, 2 and 3, Figure 1 and Figure 2 a double refrigeration system control architecture can at least include a first subsystem 10, a second subsystem 20 and an interconnection module 30. The first subsystem 10 and the second subsystem 20 are used to refrigerate the same to-be-cooled device 40. It should be pointed out that the specific form of the to-be-cooled device 40 can be a server unit or other devices or components that need to be cooled, etc. The first subsystem 10 and the second subsystem 20 can be one of air cooling systems and liquid cooling systems, of course, they can also be other refrigeration systems, which are not limited in the present application.

[0028] For the sake of understanding, the following will be described taking the example that the first subsystem 10 and the second subsystem 20 are both liquid cooling systems.

[0029] The first subsystem 10 and the second subsystem 20 can communicate with each other through the interconnection module 30, so that on the one hand, the first subsystem 10 and the second subsystem 20 can operate independently of each other, thereby avoiding the spread of faults to each other, and on the other hand, the first subsystem 10 and the second subsystem 20 can detect the operating state of each other, so that the two refrigeration systems can be switched to operate with each other, thereby realizing uninterrupted refrigeration of the to-be-cooled equipment 40 and ensuring the continuous and stable refrigeration of the to-be-cooled equipment 40. When the first subsystem 10 cools the to-be-cooled equipment 40, the first subsystem 10 can select the first subsystem 10 or the second subsystem 20 to cool the to-be-cooled equipment 40 based on the operating state of the first subsystem 10 and the detected operating state. Alternatively, when the second subsystem 20 cools the to-be-cooled equipment 40, the second subsystem 20 can select the first subsystem 10 or the second subsystem 20 to cool the to-be-cooled equipment 40 based on the operating state of the second subsystem 20 and the detected operating state. It should be pointed out that the first subsystem 10 and the second subsystem 20 can be two systems with the same configuration and the same control logic, and there is no difference in hardware configuration.

[0030] In actual application, please refer again to Figure 1 As shown in FIG. 1, the to-be-cooled equipment 40 can be installed in a container, and the first subsystem 10 and the second subsystem 20 are used to perform circulating liquid cooling of the same container. Specifically, the first subsystem 10 and the second subsystem 20 can respectively include an inner liquid cooling circulation loop and an outer liquid cooling circulation loop, and the container is connected in series in the inner liquid cooling circulation loop, and the outer liquid cooling circulation loop exchanges heat with the inner liquid cooling circulation loop through a liquid-liquid heat exchanger, so as to realize heat exchange with the to-be-cooled equipment 40 in the container.

[0031] In an implementable embodiment, please refer to Figure 2 and Figure 3As shown, the first subsystem 10 has a first logic controller 110 for controlling the overall operation of the first subsystem 10. The second subsystem 20 has a second logic controller 210 for controlling the overall operation of the second subsystem 20. The interconnection module 30 includes a plurality of first interconnection subunits 310 and a plurality of second interconnection subunits 320. The input end of the first interconnection subunit 310 is connected with the first logic controller 110, and the output end of the first interconnection subunit 310 is connected with the second logic controller 210. The first interconnection subunit 310 is used to send the output signal of the first logic controller 110 to the second logic controller 210 after eliminating the interference, so that the first interconnection subunit 310 can effectively suppress or eliminate signal interference, and ensure that the signal of the first subsystem 10 can be stably and reliably transmitted to the second subsystem 20. The input end of the second interconnection subunit 320 is connected with the second logic controller 210, and the output end of the second interconnection subunit 320 is connected with the first logic controller 110. The second interconnection subunit 320 is used to send the output signal of the second logic controller 210 to the first logic controller 110 after eliminating the interference, so that the second interconnection subunit 320 can effectively suppress or eliminate signal interference, and ensure that the signal of the second subsystem 20 can be stably and reliably transmitted to the first subsystem 10. That is, the first interconnection subunit 310 and the second interconnection subunit 320 can ensure the correct and stable transmission of signals between the two subsystems.

[0032] In actual application, the first subsystem 10 can transmit the information such as the boot state, fault state, fault position and fault reason of the system to the second subsystem 20 through A0……An+1 first interconnection subunits, in other words, each interconnection subunit transmits one way of signal transmission, avoiding the mutual interference of multiple signal information and affecting the signal transmission result. Correspondingly, the second subsystem 20 can transmit the states of the system to the first subsystem 10 through B0……Bn+1 second interconnection subunits.

[0033] It is worth mentioning that in the above structure, the logic controllers are respectively arranged in the two subsystems for respectively performing logic judgment. For example, when the first subsystem 10 is cooling the heat dissipation equipment, the first logic controller 110 is used to control the operation of the first subsystem 10 and actively detect the state information of the second subsystem 20, instead of being reported by the second subsystem 20. In this way, the problem that the first subsystem 10 cannot obtain the state information of the second subsystem 20 and cannot effectively perform system switching judgment due to unexpected power failure of the second subsystem 20 can be avoided.

[0034] The first interconnection subunit 310 and the second interconnection subunit 320 have the same structure, and the first interconnection subunit 310 is taken as an example for detailed description.

[0035] In an implementable embodiment, as shown in Figure 3 and Figure 4 The first interconnection subunit 310 includes a signal input terminal 311, a reference potential input terminal 312, a signal output terminal 313, a reference potential output terminal 314, a first voltage stabilizing tube 315, a first high-frequency filter capacitor 316, a first low-frequency filter capacitor 317, and a first filter inductor 318. The signal input terminal 311 is connected with the digital quantity output terminal of the first subsystem 10, and the reference potential input terminal 312 is connected with the digital quantity common terminal of the first subsystem 10, which is generally a ground terminal. The signal output terminal 313 is connected with the digital quantity input terminal of the second subsystem 20, and the reference potential output terminal 314 is connected with the digital quantity common terminal of the second subsystem 20, so that the reference potential of the connection line between the digital quantity common terminal of the first subsystem 10 and the digital quantity common terminal of the second subsystem 20 is 0V.

[0036] In the signal transmission direction of the first interconnection subunit 310, the first high-frequency filter capacitor 316 is located between the first voltage stabilizing tube 315 and the first low-frequency filter capacitor 317, and the first filter inductor 318 is located between the first voltage stabilizing tube 315 and the first high-frequency filter capacitor 316. The positive electrode of the first voltage stabilizing tube 315 is connected with the reference potential input terminal 312 and the reference potential output terminal 314, and the negative electrode of the first voltage stabilizing tube 315 is connected with the signal input terminal 311 and the signal output terminal 313. One end of the first high-frequency filter capacitor 316 is connected with the reference potential input terminal 312 and the reference potential output terminal 314, and the other end of the first high-frequency filter capacitor 316 is connected with the signal input terminal 311 and the signal output terminal 313. One end of the first low-frequency filter capacitor 317 is connected with the reference potential input terminal 312 and the reference potential output terminal 314, and the other end of the first low-frequency filter capacitor 317 is connected with the signal input terminal 311 and the signal output terminal 313. One end of the first filter inductor 318 is connected with the negative electrode of the first voltage stabilizing tube 315, and the other end of the first filter inductor 318 is connected with the other end of the first high-frequency filter capacitor 316.

[0037] In actual application, as shown in Figure 5As shown, when the first subsystem 10 sends digital signals to the second subsystem 20, the digital signals flow through the first voltage stabilizer 315 to the first filter inductor 318, then to the first high-frequency filter capacitor 316 and the first low-frequency filter capacitor 317, and finally are received by the second subsystem 20. Among them, after the first subsystem 10 is disturbed, the first voltage stabilizer 315 is used to introduce the spike voltage (surge voltage) in the signal into the connection between the digital quantity common end of the first subsystem 10 and the digital quantity common end of the second subsystem 20 through directional breakdown, so as to eliminate the spike voltage. The first filter inductor 318 is used to effectively eliminate the high-frequency noise in the signal, the first high-frequency filter capacitor 316 can further filter and eliminate the high-frequency noise in the signal, and the first low-frequency filter capacitor 317 can eliminate the low-frequency noise in the signal. As can be seen, Figure 5 As shown in the voltage waveform diagram of each point on the left side of the figure, the signal sent by the first subsystem 10 has a spike voltage due to external electromagnetic interference, and then the spike voltage signal is removed by the first voltage stabilizer 315, and then the high-frequency noise is eliminated by the first high-frequency filter capacitor 316, and the signal waveform tends to be stable, and then the low-frequency noise is eliminated by the first low-frequency filter capacitor 317, and finally the signal waveform is completely stable. As can be seen, the first interconnection subunit 310 can effectively suppress or eliminate the interference signal, so as to ensure that the signal of the first subsystem 10 is stably and reliably transmitted to the second subsystem 20, and ensure that the signal between the two subsystems is correctly and stably transmitted.

[0038] Further, in order to prevent the current of the second subsystem 20 from flowing back to the first subsystem 10 and play a signal isolation role. In an implementable embodiment, the first interconnection subunit 310 can further include a first light-emitting diode 319. Along the signal output direction of the first interconnection subunit 310, the first light-emitting diode 319 is located between the first filter inductor 318 and the first high-frequency filter capacitor 316. The anode of the first light-emitting diode 319 is connected to the other end of the first filter inductor 318, and the cathode of the first light-emitting diode 319 is connected to the other end of the first high-frequency filter capacitor 316. In this way, the first light-emitting diode 319 can limit the transmission of the signal from the signal input terminal 311 to the signal output terminal 313, and prevent the current of the second subsystem 20 from flowing back to the first subsystem 10. At the same time, the first light-emitting diode 319 can indicate whether the signal is being sent, and the first light-emitting diode 319 is lit when the signal is being sent.

[0039] In an implementable embodiment, please refer again to Figure 2As shown, the first subsystem 10 also includes a plurality of first sensors 120. The first sensors 120 include, but are not limited to, temperature sensors, pressure sensors, liquid level sensors, flow sensors, and the like. The first sensors 120 are connected to the first logic controller 110 through a first filter conversion circuit 130, which is used to eliminate interference in the output signals of the first sensors 120, convert the signals into digital signals, and send them to the first logic controller 110, thereby eliminating external interference on the first sensors 120, protecting the first logic controller 110, and ensuring signal stability and accuracy. Similarly, the second subsystem 20 also includes a plurality of second sensors 220. The second sensors 220 are connected to the second logic controller 210 through a second filter conversion circuit, which is used to eliminate interference in the output signals of the second sensors 220, convert the signals into digital signals, and send them to the second logic controller 210.

[0040] The sensors have two types, namely voltage-type sensors 121 and current-type sensors 122. The following filter conversion circuits are designed for these two different types of sensors.

[0041] Please refer to Figure 6 As shown, when the first sensor 120 is a voltage-type sensor 121, the first filter conversion circuit 130 includes a first AD module 131, a second filter inductor 132, a second high-frequency filter capacitor 133, a second low-frequency filter capacitor 134, and a second resistor 135. The first AD module 131 is connected to the voltage-type sensor 121 through a first reference potential line 136 and a first signal line 137, respectively. The second filter inductor 132 is connected in series on the first signal line 137, and the second filter inductor 132 is located between the voltage-type sensor 121 and the second high-frequency filter capacitor 133. One end of the second high-frequency filter capacitor 133, one end of the second low-frequency filter capacitor 134, and one end of the second resistor 135 are connected to the first reference potential line 136, respectively. The other end of the second high-frequency filter capacitor 133, the other end of the second low-frequency filter capacitor 134, and the other end of the second resistor 135 are connected to the first signal line 137, respectively. The second low-frequency filter capacitor 134 and the second resistor 135 are located between the second high-frequency filter capacitor 133 and the first AD module 131, and the second resistor 135 is located between the second low-frequency filter capacitor 134 and the first AD module 131. The first AD module 131 is connected to the first logic controller 110 to convert the received analog signal of the voltage sensor 121 into a digital signal and transmit it to the first logic controller 110 for processing.

[0042] In the embodiment, the second filter inductor 132 has the characteristic of suppressing sudden current change, so that the high-frequency interference signal of the voltage sensor 121 can be eliminated. The capacitor has the characteristic of passing AC and blocking DC, the second high-frequency filter capacitor 133 can further eliminate the high-frequency interference signal, and the second low-frequency filter capacitor 134 can eliminate the low-frequency interference in the signal. The second resistor 135 is used to absorb the remaining electric quantity in the second low-frequency filter capacitor 134. The principle is that when the voltage of the sensor decreases, due to the energy storage characteristic of the capacitor, the voltage across the capacitor will not immediately decrease with the decrease of the voltage of the sensor, resulting in that the voltage collected by the first AD module 131 is not the real voltage of the current sensor, so the second resistor 135 is needed to consume the electric quantity stored in the capacitor, so that the first AD module 131 can collect the real voltage output by the sensor in time, and the accuracy of signal collection is ensured. In actual application, the output voltage of the voltage sensor 121 can be equivalent to a voltage source, and the voltage type is generally 0-5V, 0-10V or 2-10V.

[0043] Please refer to Figure 7 As shown in FIG. 1, when the first sensor 120 is a current sensor 122, the first filter conversion circuit 130 includes a first AD module 131, a second filter inductor 132, a second high-frequency filter capacitor 133, a second low-frequency filter capacitor 134, a second resistor 135 and a third resistor 138, wherein the first AD module 131 is connected with the current sensor 122 through a first reference potential line 136 and a first signal line 137 respectively; the second filter inductor 132 is connected in series on the first signal line 137, and the second filter inductor 132 is located between the third resistor 138 and the second high-frequency filter capacitor 133, and the third resistor 138 is located between the current sensor 122 and the third resistor 138; one end of the second high-frequency filter capacitor 133, one end of the second low-frequency filter capacitor 134, one end of the second resistor 135 and one end of the third resistor 138 are connected with the first reference potential line 136 respectively, and the other end of the second high-frequency filter capacitor 133, the other end of the second low-frequency filter capacitor 134, the other end of the second resistor 135 and the other end of the third resistor 138 are connected with the first signal line 137 respectively; the second low-frequency filter capacitor 134 and the second resistor 135 are located between the second high-frequency filter capacitor 133 and the first AD module 131, and the second resistor 135 is located between the second low-frequency filter capacitor 134 and the first AD module 131.

[0044] Compared with the first filtering conversion circuit 130 corresponding to the voltage sensor 121, the first filtering conversion circuit 130 corresponding to the current sensor 122 is added with a third resistor 138, which converts the current signal into a voltage signal, and then filters the voltage signal through the corresponding filtering device. In actual application, the current output by the current sensor 122 is equivalent to a current source, and the current type is 0-20 mA or 4-20 mA. The third resistor 138 can be a precision resistor of 500 Ω. When the current sensor 122 adopts a sensor with an output signal of 0-20 mA, the current flowing through the third resistor 138 is 0-20 mA, and the voltage across the resistor when the current is 20 mA is U=I*R=500 Ω*20 mA=10 V. Therefore, when the sensor with an output of 0-20 mA is used, the voltage across the voltage dividing resistor is 0-10 V. As can be seen, the third resistor 138 can convert the signal of the current sensor into a voltage signal. Then, the voltage signal is filtered and anti-interference processed according to the voltage signal filtering anti-interference processing of the voltage sensor 121 as described above, that is, sequentially transmitted to the first AD module 131 after interference is eliminated through the second filtering inductor 132, the second high-frequency filtering capacitor 133, and the second low-frequency filtering capacitor 134. The functions and principles of the first AD module 131, the second filtering inductor 132, the second high-frequency filtering capacitor 133, and the second low-frequency filtering capacitor 134 can be referred to the first filtering conversion circuit 130 corresponding to the voltage sensor 121, and will not be described here.

[0045] In an implementable embodiment, referring again to Figure 2 As shown in FIG. 1, the first subsystem 10 further includes a first power supply module 140 and a plurality of first actuators 150. The first logic controller 110 is connected with the first power supply module 140 and the plurality of first actuators 150, respectively. The first power supply module 140 is configured to provide reliable and uninterrupted power supply to the first logic controller 110, and to distribute the power supply to the plurality of first sensors 120 and the plurality of first actuators 140 by the first logic controller 110. The first logic controller 110 is further configured to collect signals of the first sensors 120, and to drive and monitor the states of the first actuators 140. It should be noted that the specific forms of the first actuators 140 can include but are not limited to pumps, fans, and electric valves, etc. Correspondingly, the second subsystem 20 further includes a second power supply module 240 and a plurality of second actuators 250. The second logic controller 210 is connected with the second power supply module 240 and the plurality of second actuators 250, respectively. The specific principles thereof are the same as those of the first subsystem 10, and will not be described here.

[0046] The first power supply module 140 and the second power supply module 240 have the same structure. Taking the first power supply module 140 as an example. Referring to Figure 8As shown, the first power supply module 140 includes a power supply circuit and a power management device 141, and the power supply circuit has, in sequence from the power supply input side to the power supply output side, a protection device 142, a switching power supply 143, a power resistor 144, a power detection sampling point 145, and an anti-backflow device 146.

[0047] In actual application, the power supply input side can be connected to AC or high-voltage DC, which is transmitted to the switching power supply 143 for power supply after passing through the protection device 142. The switching power supply 143 converts the AC or high-voltage DC at the input side into low-voltage DC of 24V or 12V, and the low-voltage DC is transmitted to the power supply output side through the power resistor 144 and the anti-backflow device 146. The power supply output side can directly supply power to the first logic controller 110, and at the same time supply power to the power management device 141 through a wire. The power management device 141 is connected to the power detection sampling point 145 through a signal line, and can monitor whether the output voltage of the switching power supply 143 is normal. The power management device 141 is connected to the first logic controller 110, and realizes signal transmission between the power management device 141 and the first logic controller 110. If the device connected to the power supply output side, such as the first logic controller 110, has overcurrent, the current of the power resistor 144 will increase, thereby increasing the voltage across the power resistor 144, and further reducing the voltage of the power detection sampling point 145. After the power management device 141 detects the voltage reduction of the sampling point through the signal line, it sends an alarm message. If a short circuit occurs at the power supply output side, the power consumption of the switching power supply 143 will increase sharply, and the current of the protection device 142 will increase, thereby automatically fusing and disconnecting the power supply line to ensure the safety of the power supply. The protection device 142 is not limited to a fuse, a self-resetting fuse, a circuit breaker, etc. The anti-backflow device 146 can effectively prevent the reverse current from flowing back to the switching power supply due to the inductive load such as a motor connected to the output end after power failure, and isolate the input and the output. The anti-backflow device 146 is not limited to a semiconductor device such as a diode.

[0048] Further, in order to avoid single-point failure of the first power supply module 140, which leads to power supply interruption and affects the power supply of the power supply output side, please refer to Figure 9 As shown, in an implementable embodiment, the first power supply module 140 can adopt N groups of power supply circuits in parallel with each other and one power management device 141. The power supply input sides of the N groups of power supply circuits are respectively connected to AC or high-voltage DC from different sources, and the power supply output sides of the N groups of power supply circuits are connected to each other to supply power to the first logic sensor 110, and at the same time supply power to the power management device 141 through a wire. The power management device 141 is connected to the power detection sampling points 145 of the N groups of power supply circuits through signal lines, and at the same time monitors whether the output voltages of the switching power supplies 143 of the N groups of power supply circuits are normal. In this way, the first power supply module 140 has N groups of power supply circuits, and any failure of any power supply circuit does not affect the power supply of the power supply output side.

[0049] The application also provides a dual refrigeration system control method applied to the dual refrigeration system control architecture.

[0050] Referring to Figure 10 A flow chart of a dual refrigeration system control method provided by the embodiment of the application is shown in FIG. 5. The method comprises the following steps.

[0051] In step 501, the running state of the system is detected, and it is determined whether the system has a fault.

[0052] In the embodiment, as shown in FIG. 6, since the detection of the actuator needs to be based on the data fed back by the sensor for PID control, the logic controller of the main system can first determine whether the sensor has an abnormality, and if the sensor has an abnormality, it is directly determined whether the system data is normal, and then it is determined whether the main system (itself) has a fault. If the sensor is normal, the actuator needs to be driven based on the PID control strategy, and then the state of the actuator is detected, and then it is determined whether the system data is normal, and then it is determined whether the main system has a fault. Figure 11 Specifically, the logic controller of the main system can first acquire the measurement value of the sensor, so as to determine whether the measurement value is within the threshold range of the sensor. It should be noted that the threshold range of the sensor refers to the value range that can be detected by the sensor. When the measurement value is out of the threshold range, it indicates that the sensor is abnormal, and then it is determined whether the system data of the main system is normal. If the system data of the main system is normal, it indicates that the main system does not have a fault. If the system data of the main system is abnormal, it indicates that the main system has a fault. When the measurement value is within the threshold range, it indicates that the sensor is normal, and the actuator is driven based on the measurement value and the preset control strategy (which can be a PID control strategy). The feedback state of the actuator is acquired, and the system data of the main system is analyzed in combination with the feedback state. If the system data of the main system is normal, it indicates that the main system does not have a fault. If the system data of the main system is abnormal, it indicates that the main system has a fault.

[0053]

[0054] ​It should be noted that, since the temperature rise and fall is a gradual process, in order to ensure the accuracy of the temperature sensor detection data, for the temperature sensor, when the temperature sensor collected after the normal value, the collected value needs to be further judged whether it is valid. Specifically, when the sensor is a temperature sensor, if the temperature sensor is normal, further judge whether the measurement value of the temperature sensor deviates from the average value by (10000 / f) % or more, wherein the average value refers to: after the system initialization, the average value of the first N times of the temperature sensor collected value, f is the sampling frequency; if the measurement value of the temperature sensor deviates from the average value by (10000 / f) % or more, it means that the measurement value of the temperature sensor is invalid; if the sensor is abnormal or the measurement value is invalid, the system data of the self is comprehensively analyzed whether it is normal; if the system data of the self is normal, it means that the self does not exist fault; if the system data of the self is abnormal, it means that the self exists fault.

[0055] It should be pointed out that, "comprehensive analysis of the system data of the self whether it is normal" includes: when part of the sensor is abnormal or the temperature sensor is invalid, (1) the logic controller of the main system carries out risk assessment on the abnormal sensor, and judges whether the sensor has a significant impact on the refrigeration system, if the impact is not big, it is judged that the refrigeration system does not exist fault, otherwise, it exists fault; (2) the logic controller of the main system carries out risk assessment on other data in the refrigeration system, such as temperature difference, flow difference, etc. These data are calculated under the condition that the sensor is normal, but if the temperature difference is not correct under the current working condition, it does not match the current working condition, which means that the system has a problem, which may be pipe blockage, leakage, heat sink performance degradation, or other non-electrical faults such as local heat preservation decay. After the feedback state of the actuator is taken, (1) the actuator is risk assessed, if the data feedback by the actuator deviates from the normal, but the impact is not big, it is judged that the refrigeration system does not exist fault, otherwise, it exists fault; (2) risk assessment is carried out on other data in the refrigeration system, such as temperature difference, flow difference, etc. These data are calculated under the condition that the sensor is normal, but if the temperature difference is not correct under the current working condition, it does not match the current working condition, which means that the system has a problem, which may be pipe blockage, heat sink performance degradation, or other non-electrical faults such as local heat preservation decay.

[0056] Further, the measurement value of the sensor is obtained, including: after the electric signal of the sensor is filtered, the filtered electric signal is converted into a digital signal through an AD module, and the digital signal is operated to obtain the measurement value of the sensor.

[0057] In practical application, taking the first subsystem as the main system as an example, the logic controller of the main system serves as an execution subject, the logic controller detects the running state of the main system, and judges whether the main system has a fault. The main system and the standby system need to execute an initialization program after power-off to power-on or reset, which serves to make necessary preparations for starting and avoid system misoperation. The initialization program clears the RAM area register and the counter, and sets or resets the output of the respective logic controller. In work, the electrical signal of the sensor of the main system can be filtered first, and the filter device is a capacitor or an inductor or a combination of both. After filtering, the sensor can effectively reduce the interference of external electromagnetic signals on the sensor, improve the sensor acquisition precision and electrical signal quality, which is conducive to the correct reception of the sensor signal by the logic controller and the correct analysis of the system state. After filtering, the sensor signal is converted into a digital signal by an analog-to-digital converter, and then the digital signal is operated by the logic sensor of the main system. The value after operation is the true value measured by the sensor. The logic sensor of the main system processes the value after operation, compares the threshold value of the sensor, and judges whether the sensor is abnormal. If the sensor is normal, the logic controller of the main system drives the actuator according to the sensor data combined with the PID control strategy, and the actuator is not limited to a fan or a water pump. Then, the logic controller of the main system receives the feedback state of the actuator, comprehensively analyzes the program, analyzes whether the data fed back by the sensor and the actuator are normal, and if the data are not normal, further analyzes the faulty sensor or actuator and whether the remaining parts in the system have an impact on the system operation, so as to decide whether to output a fault signal.

[0058] Step 502, if there is no fault in itself, output a closed signal to the interconnection module, and do not switch the refrigeration system for refrigerating the equipment to be cooled.

[0059] In this embodiment, when the logic controller of the main system determines that the system itself has no fault, the logic controller of the main system outputs a closed signal to the interconnection module, and the logic controller of the standby system receives the closed signal and continues to be in standby state, and still uses the main system to continue to refrigerate the equipment to be cooled.

[0060] Step 503, if there is a fault in itself, output an open circuit signal to the interconnection module, and detect the state of the standby system.

[0061] In this embodiment, when the logic controller of the main system determines that the system itself has a fault, the logic controller of the main system outputs an open circuit signal to the interconnection module, the logic controller of the standby system receives the open circuit signal and controls the standby system to start, and then the logic controller of the main system obtains the state of the standby system through the interconnection module.

[0062] At step 504, based on the self failure, the state of the standby system and the first control strategy, the main system or the standby system is selected to cool the device to be cooled.

[0063] The first control strategy includes that the logic controller of the main system judges whether the standby system has a failure based on the state of the standby system. If the main system has a failure and the standby system has no failure, the standby system is switched to cool the device to be cooled and the main system is closed. If the main system has a failure and the standby system also has a failure, the system with a lower failure degree is selected to cool the device to be cooled by comparing the failure degree of the self with the failure degree of the standby system.

[0064] When the standby system is switched to cool the device to be cooled, the standby system can make a system switching decision according to the failure judgment method of the main system, that is, when the standby system cools the device to be cooled, the logic controller of the standby system monitors whether the standby system has a failure and detects the state of the main system, and selects the main system or the standby system to cool the device to be cooled. The specific judgment method is the same as the method when the main system cools the device to be cooled, and will not be described here.

[0065] Further, the standby system can also set a first switching priority. Specifically, the first switching priority is that when the standby system cools the device to be cooled, when the standby system detects that the main system has a failure, the standby system is actively switched to cool the device to be cooled by the main system.

[0066] The dual-cooling control architecture can also include a second control mode. When the dual-cooling system control architecture is in the second control mode, the method further includes: if the first subsystem or the second subsystem is selected to cool the device to be cooled, the cooling system is not switched. That is, when a subsystem is selected to cool the device to be cooled, the subsystem is continuously used to cool the device to be cooled unless manually switched, even if the subsystem has a failure. The second control mode is mainly applied to the debugging stage.

[0067] As can be seen, the technical scheme provided by the present application includes a first subsystem, a second subsystem and an interconnection module. The first subsystem and the second subsystem are used to cool the same device to be cooled, and the first subsystem and the second subsystem communicate with each other through the interconnection module. That is, the present application can adopt a redundant cooling scheme of two cooling systems. The two cooling systems operate independently, and the failure of any one subsystem will not affect the other subsystem. The mutual spread of failures can be avoided, and the mutual running state can be detected in real time through the interconnection module, so that the two cooling systems can be switched in real time and accurately, and uninterrupted cooling of the device to be cooled is realized, and the continuous and stable cooling of the device to be cooled is ensured.

[0068] Further, the interconnection module comprises a plurality of first interconnection subunits and a plurality of second interconnection subunits, each of which can perform anti-interference and interference elimination processing on signals, and the signals have isolation function from input to output, avoiding reverse flow situation and ensuring stable operation of the refrigeration system.

[0069] Further, the sensor is connected with the logic controller through the filter conversion circuit, the signal of the sensor is filtered by the filter conversion circuit, thereby eliminating the interference of external electromagnetic field on the sensor, ensuring the accuracy of signal acquisition of the logic controller, and eliminating the interference of the sensor signal on the interconnection module, and ensuring the safe and reliable operation of the logic controller connected with the sensor.

[0070] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A control architecture for a dual-cooling system, characterized in that, It includes at least a first subsystem, a second subsystem, and an interconnection module; The first subsystem and the second subsystem are used to cool the same device to be cooled. The first subsystem has a first logic controller, and the second subsystem has a second logic controller. The interconnection module includes a plurality of first interconnection sub-units and a plurality of second interconnection sub-units. The input terminal of the first interconnection sub-unit is connected to the first logic controller, and the output terminal of the first interconnection sub-unit is connected to the second logic controller. The first interconnection sub-unit is used to send the output signal of the first logic controller to the second logic controller after eliminating interference. The input terminal of the second interconnection sub-unit is connected to the second logic controller, and the output terminal of the second interconnection sub-unit is connected to the first logic controller. The second interconnection sub-unit is used to send the output signal of the second logic controller to the first logic controller after eliminating interference, so that the first subsystem and the second subsystem can communicate with each other through the interconnection module, and the first subsystem and the second subsystem can detect each other's operating status. When the first subsystem cools the device to be cooled, the first subsystem selects either the first subsystem or the second subsystem to cool the device based on its own operating status and the detected operating status. Alternatively, when the second subsystem cools the device to be cooled, the second subsystem selects either the first subsystem or the second subsystem to cool the device based on its own operating status and the detected operating status.

2. The control architecture of the dual-cooling system according to claim 1, characterized in that, First interconnect sub-unit Includes: signal input terminal, reference potential input terminal, signal output terminal, reference potential output terminal, first Zener diode, first high-frequency filter capacitor, first low-frequency filter capacitor, and first filter inductor, wherein: Along the signal transmission direction of the first interconnect sub-unit, the first high-frequency filter capacitor is located between the first Zener diode and the first low-frequency filter capacitor, and the first filter inductor is located between the first Zener diode and the first high-frequency filter capacitor. The positive terminal of the first Zener diode is connected to the reference potential input terminal and the reference potential output terminal, and the negative terminal of the first Zener diode is connected to the signal input terminal and the signal output terminal; One end of the first high-frequency filter capacitor is connected to the reference potential input terminal and the reference potential output terminal, and the other end of the first high-frequency filter capacitor is connected to the signal input terminal and the signal output terminal; One end of the first low-frequency filter capacitor is connected to the reference potential input terminal and the reference potential output terminal, and the other end of the first low-frequency filter capacitor is connected to the signal input terminal and the signal output terminal; One end of the first filter inductor is connected to the negative terminal of the first Zener diode, and the other end of the first filter inductor is connected to the other end of the first high-frequency filter capacitor.

3. The dual-cooling system control architecture according to claim 2, characterized in that, The first interconnect sub-unit also includes a first light-emitting diode; Along the signal output direction of the first interconnect sub-unit, the first light-emitting diode is located between the first filter inductor and the first high-frequency filter capacitor; The positive terminal of the first light-emitting diode is connected to the other end of the first filter inductor, and the negative terminal of the first light-emitting diode is connected to the other end of the first high-frequency filter capacitor.

4. The control architecture of the dual-cooling system according to any one of claims 1 to 3, characterized in that, The first subsystem also includes several first sensors; The first sensor is connected to the first logic controller through a first filtering and conversion circuit. The first filtering and conversion circuit is used to eliminate interference from the output signal of the first sensor, convert it into a digital signal, and send it to the first logic controller. The second subsystem also includes several second sensors; The second sensor is connected to the second logic controller through a second filtering and conversion circuit. The second filtering and conversion circuit is used to eliminate interference from the output signal of the second sensor, convert it into a digital signal, and send it to the second logic controller.

5. The dual-cooling system control architecture according to claim 4, characterized in that, When the first sensor is a voltage-type sensor, the first filtering and conversion circuit includes: a first AD module, a second filter inductor, a second high-frequency filter capacitor, a second low-frequency filter capacitor, and a second resistor, wherein: The first AD module is connected to the voltage sensor via a first reference potential line and a first signal line, respectively; The second filter inductor is connected in series on the first signal line, and the second filter inductor is located between the voltage sensor and the second high-frequency filter capacitor; One end of the second high-frequency filter capacitor, one end of the second low-frequency filter capacitor, and one end of the second resistor are respectively connected to the first reference potential line, and the other ends of the second high-frequency filter capacitor, the second low-frequency filter capacitor, and the second resistor are respectively connected to the first signal line. The second low-frequency filter capacitor and the second resistor are located between the second high-frequency filter capacitor and the first AD module, and the second resistor is located between the second low-frequency filter capacitor and the first AD module.

6. The dual-cooling system control architecture according to claim 4, characterized in that, When the first sensor is a current-type sensor, the first filtering and conversion circuit includes: a first AD module, a second filter inductor, a second high-frequency filter capacitor, a second low-frequency filter capacitor, a second resistor, and a third resistor, wherein: The first AD module is connected to the current-type sensor via a first reference potential line and a first signal line, respectively; The second filter inductor is connected in series on the first signal line, and the second filter inductor is located between the third resistor and the second high-frequency filter capacitor. The third resistor is located between the current-type sensor and the third resistor. One end of the second high-frequency filter capacitor, one end of the second low-frequency filter capacitor, one end of the second resistor, and one end of the third resistor are respectively connected to the first reference potential line; the other ends of the second high-frequency filter capacitor, the second low-frequency filter capacitor, the second resistor, and the third resistor are respectively connected to the first signal line. The second low-frequency filter capacitor and the second resistor are located between the second high-frequency filter capacitor and the first AD module, and the second resistor is located between the second low-frequency filter capacitor and the first AD module.

7. A control method for a dual-refrigeration system, characterized in that, The dual-cooling system control method is applied to the dual-cooling system control architecture according to any one of claims 1 to 6, wherein the dual-cooling system control architecture includes a first control mode, and when the dual-cooling system control architecture is in the first control mode, the first subsystem acts as the primary system and the second subsystem acts as the backup system; the method includes: It detects its own operating status and determines whether it has any faults; If there is no fault in itself, it outputs a closed signal to the interconnect module and does not switch the cooling system that cools the device to be cooled; If it has a fault, it outputs an open circuit signal to the interconnect module to detect the status of the backup system; Based on its own fault, the status of the backup system, and the first control strategy, the primary system or the backup system is selected to cool the device to be cooled.

8. The dual-refrigeration system control method according to claim 7, characterized in that, The first control strategy includes: Determine whether the backup system is faulty based on its status. If the device itself is faulty and the backup system is not faulty, then the backup system will be switched to cool the device to be cooled. If the system itself has a fault, and the backup system also has a fault, then the system with the lower fault level is selected to cool the device to be cooled, by comparing the severity of the fault in the system itself and the severity of the fault in the backup system.

9. The dual-refrigeration system control method according to claim 8, characterized in that, If the backup system cools the device to be cooled, the backup system switches over according to the fault diagnosis method of the main system.

10. The dual-refrigeration system control method according to claim 9, characterized in that, The backup system has a first switching priority; The first switching priority is: when the backup system is cooling the device to be cooled, if the backup system detects that the main system has been repaired, then the main system will switch to cooling the device to be cooled.

11. The dual-refrigeration system control method according to claim 7, characterized in that, The process of detecting its own operating status and determining whether it has a fault includes: Acquire the measurement value from the sensor and determine whether the measurement value is within the threshold range of the sensor; If the measured value exceeds the threshold range, it indicates that the sensor is abnormal, and the system data itself is analyzed to determine whether it is normal. If the system data is normal, it indicates that there is no fault in the system itself. If the system data is abnormal, it indicates that the system itself has a fault.

12. The dual-cooling system control method according to claim 11, characterized in that, If the measured value is within the threshold range, it indicates that the sensor is normal, and the actuator is driven based on the measured value and the preset control strategy; Obtain the feedback status of the actuator, and combine the feedback status to comprehensively analyze whether the system data is normal; If the system data is normal, it indicates that there is no fault in the system itself. If the system data is abnormal, it indicates that the system itself has a fault.

13. The dual-cooling system control method according to claim 11, characterized in that, When the sensor is a temperature sensor, if the temperature sensor is normal, it is further determined whether the measured value of the temperature sensor deviates from the average value by more than (10000 / f)%. If the measured value of the temperature sensor deviates from the average value by more than (10000 / f)%, then the measured value of the temperature sensor is invalid. If the sensor malfunctions or the measured value is invalid, a comprehensive analysis is conducted to determine whether the system data itself is normal. If the system data is normal, it indicates that the system itself is not faulty; If the system data is abnormal, it indicates that the system itself has a fault.

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