A PCB soldering equipment and its usage method

Abstract

The invention discloses a PCB circuit board soldering device and a use method, belonging to the field of circuit board soldering; the soldering device comprises a workbench, a limiting groove for positioning the PCB circuit board is provided at the upper end of the workbench, and a pressing mechanism is arranged on the workbench to press the PCB circuit board in the limiting groove; a feeding mechanism is arranged on the workbench, the feeding mechanism comprises a first supporting frame fixed at the upper end of the workbench, a mounting plate capable of being lifted and lowered is provided on the first supporting frame, a positioning groove for positioning a chip resistor is provided on the mounting plate, a first fixing plate is respectively arranged on both sides of the lower end of the mounting plate, a clamping plate is arranged at each first fixing plate, a first spring is arranged between the clamping plate and the first fixing plate, and the two clamping plates have a movement tendency of approaching each other; two soldering mechanisms are arranged at the upper end of the workbench, a connecting block capable of being lifted and lowered is provided in the soldering mechanism, an electric soldering iron and a tin wire conveying pipe are provided on the connecting block, and the end of the electric soldering iron can contact the tin wire.

Description

Technical Field

[0001] The invention belongs to the field of circuit board soldering, and in particular relates to a PCB circuit board soldering device and a use method. Background Art

[0002] Most of the electronic components on the PCB circuit board are fixed by soldering. Among them, the chip resistor, as a relatively common electronic component, is also fixed on the PCB circuit board by soldering. However, at present, when soldering the chip resistor, it is mostly manual soldering. The operator first clamps the chip resistor with tweezers and places it at a designated position on the circuit board, and then manually operates the soldering iron and tin wire to complete the soldering of the two ends of the chip resistor in turn. This also makes the operation difficult and the welding efficiency low. Summary of the invention

[0003] In view of the deficiencies in the prior art, the object of the present invention is to provide a PCB circuit board soldering device and a use method to reduce the operating difficulty and improve the soldering efficiency.

[0004] The purpose of the present invention can be achieved by the following technical solutions:

[0005] A PCB circuit board soldering device comprises a workbench, wherein a limit groove for positioning the PCB circuit board is provided at the upper end of the workbench, and a pressing mechanism is provided on the workbench to press the PCB circuit board into the limit groove;

[0006] The workbench is provided with a feeding mechanism, which includes a first support frame fixed to the upper end of the workbench, a lifting mounting plate is provided on the first support frame, a positioning groove for positioning the chip resistor is provided on the mounting plate, a first fixing plate is provided on both sides of the lower end of the mounting plate, a clamping plate is provided at each first fixing plate, a first spring is provided between the clamping plate and the first fixing plate, and the two clamping plates have a movement tendency to approach each other;

[0007] Two soldering mechanisms are arranged at the upper end of the workbench. A lifting connection block is arranged in the soldering mechanism. An electric soldering iron and a tin wire conveying pipe are arranged on the connection block, and the end of the electric soldering iron can contact the tin wire.

[0008] Furthermore, one end of the limiting groove extends to the edge of the workbench.

[0009] Furthermore, a fourth fixing plate is provided on one side of the mounting plate, and a blocking mechanism is installed on the first support frame, the blocking mechanism passes through the first support frame and is a sliding rod slidably connected to the first support frame, a second fixing plate and a third fixing plate are respectively provided at both ends of the sliding rod, a second spring is sleeved on the sliding rod, and both ends of the second spring are respectively fixedly connected to the side surface of the first support frame and the side surface of the third fixing plate, under the elastic force of the second spring, the second fixing plate can be tightly attached to the first support frame, and at this time, the third fixing plate is located below the fourth fixing plate and can prevent the mounting plate from descending.

[0010] Furthermore, an L-shaped plate is fixed to the lower end of the third fixed plate. During the process of placing the PCB circuit board into the limiting groove for positioning, the PCB circuit board can contact the L-shaped plate and drive the sliding rod to slide in a direction away from the PCB circuit board, and when the PCB circuit board is pushed to the end of the limiting groove to complete the positioning, the third fixed plate just leaves the bottom of the fourth fixed plate.

[0011] Furthermore, when the chip resistor and the electric soldering iron are both located at the highest point, the electric soldering iron is located above the position where the chip resistor is to be soldered.

[0012] Furthermore, two mounting frames are provided at the upper end of the first support frame, and a flap mechanism is installed on each of the two mounting frames; the flap mechanism includes a flap, a rotating rod is fixed on the flap, the rotating rod is rotatably connected to the mounting frame, a gear is fixed on the rotating rod, a rack is fixed on the mounting plate, and the rack and the gear are meshed with each other; a baffle is provided on the connecting block, and the flap is located directly below the baffle when the flap is horizontal.

[0013] Furthermore, when the mounting plate is at the highest point, the flap is in a horizontal position and is located directly below the baffle, at which time it can block the connection block from descending; when the mounting plate descends, it can drive the flap to flip downward and leave directly below the baffle.

[0014] Furthermore, the clamping mechanism includes a first cylinder fixed at the lower end of the workbench, a connecting plate is fixed to the end of the driving shaft of the first cylinder, two guide pillars are fixed to the upper end of the connecting plate, the two guide pillars penetrate the workbench in the vertical direction, and a pressure block is fixed on the top of the two guide pillars respectively. By controlling the extension and retraction of the first cylinder, the lifting and lowering movement of the connecting plate can be controlled.

[0015] Beneficial effects of the present invention:

[0016] 1. The PCB circuit board is positioned and fixed by setting a clamping mechanism and a limit groove on the upper end of the workbench, and the chip resistor is pressed at a specified position on the PCB circuit board by a feeding mechanism. Finally, two soldering mechanisms are set to solder the chip resistor on the PCB circuit board. Compared with manual soldering in the prior art, the operation difficulty is reduced and the soldering efficiency is improved;

[0017] 2. By setting a blocking mechanism on the first support frame, the timing of the chip resistor's descent is controlled, so that only after the PCB circuit board is installed in place (after positioning is completed), the feeding mechanism can drive the chip resistor to descend and press the chip resistor to the specified position of the PCB circuit board to ensure the accuracy of the welding position;

[0018] 3. By arranging two flap mechanisms on the first support frame, the operating timing of the two soldering mechanisms can be controlled respectively to prevent the soldering iron from falling before the chip resistor, resulting in the chip resistor not being pressed tightly on the PCB circuit board when the soldering iron acts on the chip resistor, thus causing soldering failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the structure of the clamping mechanism of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the feeding mechanism of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0024] Figure 5 It is a schematic diagram of the mounting plate structure of the present invention;

[0025] Figure 6 It is a schematic diagram of the blocking mechanism structure of the present invention;

[0026] Figure 7 It is a schematic diagram of the soldering mechanism structure of the present invention;

[0027] Figure 8 It is a schematic diagram of the structure of the flap mechanism of the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figure 1-2 As shown, a PCB circuit board soldering equipment comprises a workbench 1, a limiting groove 11 is provided at the upper end of the workbench 1, a PCB circuit board 3 can be placed in the limiting groove 11, and one end of the limiting groove 11 extends to the edge of the workbench 1 to facilitate the removal of the PCB circuit board 3; a pressing mechanism 2 is provided on the workbench 1, and the pressing mechanism 2 can press the PCB circuit board 3 in the limiting groove 11 to complete the positioning and fixing;

[0030] The clamping mechanism 2 includes a first cylinder 21 fixed to the lower end of the workbench 1, a connecting plate 24 is fixed to the upper end of the driving shaft of the first cylinder 21, two guide pillars 22 are fixed to the upper end of the connecting plate 24, the two guide pillars 22 pass through the workbench 1 in the vertical direction, and a pressing block 23 is fixed to the top of the two guide pillars 22 respectively. By controlling the extension and retraction of the first cylinder 21, the lifting and lowering movement of the connecting plate 24 can be controlled, and then the clamping and loosening of the PCB circuit board can be achieved; to ensure that the process of soldering the chip resistor on the PCB circuit board is more stable.

[0031] A feeding mechanism 4 is provided at the upper end of the workbench 1, and the feeding mechanism 4 is used to fix the chip resistor at a designated position on the PCB circuit board, which is conducive to batch welding of the same type of PCB circuit boards;

[0032] like Figure 3-5 As shown, the feeding mechanism 4 includes a first support frame 41 fixed to the upper end of the workbench 1, a second cylinder 43 is fixed to the first support frame 41, a clamping assembly 44 is fixed to the end of the driving shaft of the second cylinder 43, and the clamping assembly 44 is used to clamp and position the chip resistor 45. Driven by the second cylinder 43, the chip resistor 45 can be pressed tightly at a designated position on the PCB circuit board to facilitate subsequent soldering;

[0033] The clamping assembly 44 includes a mounting plate 441 fixed to the lower end of the driving shaft of the second cylinder 43, and a positioning groove 4411 is provided on the mounting plate 441, and the chip resistor can cooperate with the positioning groove 4411; a first fixing plate 4412 is respectively provided on both sides of the lower end of the mounting plate 441, and a clamping plate 442 is provided at each first fixing plate 4412, and two guide rods 443 are fixed on the clamping plate 442, and the guide rod 443 passes through the first fixing plate 4412 and is slidably connected to the first fixing plate 4412, and a first spring 444 is sleeved on the guide rod 443, and the two ends of the first spring 444 are respectively fixedly connected to the first fixing plate 4412 and the clamping plate 442, and under the elastic force of the first spring 444, the two clamping plates 442 have a tendency to move closer to each other and can clamp the chip resistor 45;

[0034] When in use, the chip resistor 45 is inserted into the positioning groove 4411 and clamped by the clamping assembly 44. The chip resistor 45 is pressed against the upper end of the PCB circuit board 3 by controlling the operation of the second cylinder 43; and after soldering is completed, the chip resistor 45 is fixed on the PCB circuit board 3. At this time, by controlling the second cylinder 43 to rise, the clamping plate 442 in the clamping assembly 44 can be separated from the chip resistor 45, and there is no need to set up a separate release mechanism to release the chip resistor.

[0035] The first support frame 41 is provided with a blocking mechanism 5, which can block the descending action of the feeding mechanism 4 and control the descending timing of the chip resistor 45, so that only after the PCB circuit board is installed in place (after the positioning is completed), the feeding mechanism 4 can drive the chip resistor 45 to descend and press the chip resistor 45 to the designated position of the PCB circuit board to ensure the accuracy of the welding position;

[0036] like Figure 6 As shown, the blocking mechanism 5 includes a sliding rod 51, which passes through the first support frame 41 and is slidably connected to the first support frame 41, and a second fixing plate 52 and a third fixing plate 53 are respectively provided at both ends of the sliding rod 51. A second spring 54 is sleeved on the sliding rod 51, and the two ends of the second spring 54 are respectively fixedly connected to the side surface of the first support frame 41 and the side surface of the third fixing plate 53. Under the elastic force of the second spring 54, the second fixing plate 52 can be tightly attached to the first support frame 41, and a fourth fixing plate 4413 is provided on one side of the mounting plate 441. At this time, the third fixing plate 53 is located below the fourth fixing plate 4413 and can prevent the mounting plate 441 from descending.

[0037] An L-shaped plate 55 is fixed to the lower end of the third fixing plate 53. When the PCB circuit board 3 is placed in the limiting groove 11 for positioning, the PCB circuit board 3 can contact the L-shaped plate 55 and drive the sliding rod 51 to slide in the direction away from the PCB circuit board 3. Moreover, when the PCB circuit board 3 is pushed to the end of the limiting groove 11 to complete the positioning, the third fixing plate 53 just leaves the bottom of the fourth fixing plate 4413, so that the installation plate 441 will not be blocked by the third fixing plate 53 during the descending process; thereby, the descending timing of the chip resistor 45 is controlled, so that only after the PCB circuit board is installed in place (after positioning is completed), the feeding mechanism 4 can drive the chip resistor 45 to descend and press the chip resistor 45 to the specified position of the PCB circuit board to ensure the accuracy of the welding position.

[0038] Two soldering mechanisms 6 are provided at the upper end of the workbench 1, and the two soldering mechanisms 6 are respectively used to solder the two sides of the chip resistor 45 to the PCB circuit board 3; compared with the manual soldering in the prior art, the feeding mechanism 5 is used to feed the material in this embodiment, and the soldering mechanism 6 is used to complete the soldering, which reduces the difficulty of operation and improves the soldering efficiency;

[0039] like Figure 7 As shown, the soldering mechanism 6 includes a second support frame 61 fixed on the upper end of the workbench 1, a third cylinder 62 is fixed on the upper end of the second support frame 61, a connecting block 63 is fixed to the end of the driving shaft of the third cylinder 62, an electric soldering iron 65 and a tin wire conveying tube 66 are fixed on the connecting block 63, the tin wire conveying tube 66 can convey the tin wire, and the end of the electric soldering iron 65 can contact the tin wire, and the connecting block 63 is lowered by controlling the third cylinder 62, so that the electric soldering iron 65 and the tin wire act on the side of the chip resistor 45 to complete the soldering.

[0040] In this embodiment, when the chip resistor 45 and the electric soldering iron 65 are both at the highest point, the electric soldering iron 65 is located above the position of the chip resistor 45 to be soldered; and two flap mechanisms 7 are provided on the first support frame 41 to control the operating timing of the two soldering mechanisms 6 respectively, so as to prevent the electric soldering iron 65 from falling before the chip resistor 45, resulting in the chip resistor 45 not being pressed on the PCB circuit board when the electric soldering iron 65 acts on the chip resistor 45, thereby causing soldering failure;

[0041] Two mounting frames 42 are provided at the upper end of the first support frame 41, and a flap mechanism 7 is installed on each of the two mounting frames 42; Figure 8 As shown, the flap mechanism 7 includes a flap 71, a rotating rod 72 is fixed on the flap 71, the rotating rod 72 is rotatably connected to the mounting frame 42, a gear 73 is fixed on the rotating rod 72, a rack 74 is fixed on the mounting plate 441, and the rack 74 and the gear 73 are meshed with each other; a baffle 64 is provided on the connecting block 63;

[0042] When the mounting plate 441 is at the highest point, the flap 71 is in a horizontal position and is located directly below the baffle 64. At this time, it can prevent the connection block 63 from descending. When the mounting plate 441 is driven by the second cylinder 43 to descend, it can drive the flap 71 to flip downward and leave directly below the baffle 64. At this time, the connection block 63 can be driven by the third cylinder 62 to descend and complete soldering.

[0043] Thereby, the operation sequence between the soldering mechanism 6 and the feeding mechanism 4 is controlled, so that the feeding mechanism 4 operates before the soldering mechanism 6, thereby avoiding welding failure.

[0044] In this embodiment, the method for using the PCB circuit board soldering device includes the following steps:

[0045] S1, PCB circuit board positioning;

[0046] Place the PCB circuit board into the limiting groove 11 and push it to the end to complete the positioning; then use the pressing mechanism 2 to press and fix the PCB circuit board in the limiting groove 11 to complete the positioning and fixing;

[0047] S2, installation of chip resistors;

[0048] The chip resistor is placed in the positioning groove 4411 in the mounting plate 441 and clamped and fixed by the clamping assembly 44; the second cylinder 43 is then controlled to press and fix the chip resistor at a designated position on the PCB circuit board;

[0049] S3, soldering;

[0050] By controlling the operation of the two soldering mechanisms 6, the chip resistor is soldered on the PCB circuit board;

[0051] S4, taking materials;

[0052] After soldering is completed, first control the third cylinder 62 to move the soldering iron 65 to the highest point; then control the second cylinder 43 to operate so that the mounting plate 441 moves to the highest point; finally, control the first cylinder 21 to make the two pressing blocks 23 rise and leave the PCB circuit board, and move the PCB circuit board out from the open side of the limit groove 11.

[0053] Working principle:

[0054] By arranging a clamping mechanism 2 and a limiting groove 11 at the upper end of the workbench 1 to position and fix the PCB circuit board, and by using a feeding mechanism 4 to press the chip resistor to a specified position on the PCB circuit board, and finally by arranging two soldering mechanisms 6 to solder the chip resistor to the PCB circuit board, compared with manual soldering in the prior art, the operation difficulty is reduced and the soldering efficiency is improved; by arranging a blocking mechanism 5 on the first support frame 41, the descending timing of the chip resistor 45 is controlled, so that only after the PCB circuit board is installed in place (after positioning is completed), the feeding mechanism 4 can drive the chip resistor 45 to descend and press the chip resistor 45 to the specified position of the PCB circuit board to ensure the accuracy of the welding position; by arranging two flap mechanisms 7 on the first support frame 41, the operating timing of the two soldering mechanisms 6 is controlled respectively to prevent the electric soldering iron 65 from descending before the chip resistor 45, resulting in the chip resistor 45 not being pressed on the PCB circuit board when the electric soldering iron 65 acts on the chip resistor 45, thereby causing soldering failure.

[0055] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0056] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A PCB circuit board soldering equipment, characterized in that: The workbench (1) comprises a workbench (1), wherein a limiting groove (11) for positioning a PCB circuit board is provided at the upper end of the workbench (1), and a pressing mechanism (2) is provided on the workbench (1) to press the PCB circuit board into the limiting groove (11); The workbench (1) is provided with a loading mechanism (4), the loading mechanism (4) comprising a first support frame (41) fixed to the upper end of the workbench (1), a mounting plate (441) capable of being raised and lowered is provided on the first support frame (41), a positioning groove (4411) for positioning the chip resistor is provided on the mounting plate (441), a first fixing plate (4412) is provided on both sides of the lower end of the mounting plate (441), a clamping plate (442) is provided at each first fixing plate (4412), a first spring (444) is provided between the clamping plate (442) and the first fixing plate (4412), and the two clamping plates (442) have a tendency to move towards each other; Two soldering mechanisms (6) are arranged at the upper end of the workbench (1), and a lifting connection block (63) is arranged in the soldering mechanism (6). An electric soldering iron (65) and a tin wire conveying pipe (66) are arranged on the connection block (63), and the end of the electric soldering iron (65) can contact the tin wire; When the chip resistor and the electric soldering iron (65) are both at the highest point, the electric soldering iron (65) is located above the position where the chip resistor is to be soldered. Two mounting frames (42) are arranged at the upper end of the first support frame (41), and a flap mechanism (7) is respectively installed on the two mounting frames (42); the flap mechanism (7) comprises a flap (71), a rotating rod (72) is fixed on the flap (71), the rotating rod (72) is rotatably connected to the mounting frame (42), a gear (73) is fixed on the rotating rod (72), a rack (74) is fixed on the mounting plate (441), and the rack (74) and the gear (73) are meshed with each other; a baffle (64) is arranged on the connecting block (63), and the flap (71) is located directly below the baffle (64) when it is horizontal; When the mounting plate (441) is at the highest point, the flap (71) is in a horizontal position and is located directly below the baffle (64), and can block the connection block (63) from descending; when the mounting plate (441) descends, it can drive the flap (71) to flip downward and leave directly below the baffle (64).

2. A PCB circuit board soldering equipment according to claim 1, characterized in that: One end of the limiting groove (11) extends to the edge of the workbench (1).

3. A PCB circuit board soldering equipment according to claim 2, characterized in that: A fourth fixing plate (4413) is provided on one side of the mounting plate (441), and a blocking mechanism (5) is installed on the first support frame (41). The blocking mechanism (5) is a sliding rod (51) that penetrates the first support frame (41) and is slidably connected to the first support frame (41). A second fixing plate (52) and a third fixing plate (53) are respectively provided at both ends of the sliding rod (51). A second spring (54) is sleeved on the sliding rod (51), and both ends of the second spring (54) are respectively fixedly connected to the side surface of the first support frame (41) and the side surface of the third fixing plate (53). Under the elastic force of the second spring (54), the second fixing plate (52) can be tightly attached to the first support frame (41), and at this time, the third fixing plate (53) is located below the fourth fixing plate (4413) and can prevent the mounting plate (441) from descending.

4. A PCB circuit board soldering equipment according to claim 3, characterized in that: An L-shaped plate (55) is fixed to the lower end of the third fixing plate (53). When the PCB circuit board is placed in the limiting groove (11) for positioning, the PCB circuit board can contact the L-shaped plate (55) and drive the sliding rod (51) to slide in a direction away from the PCB circuit board. Moreover, when the PCB circuit board is pushed to the end of the limiting groove (11) to complete the positioning, the third fixing plate (53) just leaves the bottom of the fourth fixing plate (4413).

5. A PCB circuit board soldering equipment according to claim 1, characterized in that: The clamping mechanism (2) comprises a first cylinder (21) fixed at the lower end of the workbench (1); a connecting plate (24) is fixed to the upper end of the driving shaft of the first cylinder (21); two guide pillars (22) are fixed to the upper end of the connecting plate (24); the two guide pillars (22) penetrate the workbench (1) in a vertical direction; a pressing block (23) is respectively fixed to the top of the two guide pillars (22); and by controlling the extension and retraction of the first cylinder (21), the lifting and lowering movement of the connecting plate (24) can be controlled.

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