A dust removal method and device of an electronic device, and a storage medium

Abstract

Embodiments of the present application disclose a dust removal method of an electronic device, comprising: obtaining a fan rotating speed, a first chip temperature and a first ambient temperature of the electronic device; determining a temperature threshold of the first chip temperature based on the fan rotating speed; and determining whether to remove dust from the electronic device based on the first ambient temperature when the first chip temperature is greater than the temperature threshold. Embodiments of the present application also provide a dust removal device of an electronic device and a storage medium.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and relates to but is not limited to a dust removal method and device for electronic equipment, and a storage medium. BACKGROUND

[0002] After the electronic equipment is used for a period of time, the heat dissipation exhaust hole is blocked by fiber dust, the heat dissipation performance is poor, and the temperature in the electronic equipment is higher and higher. However, the temperature of the electronic equipment is too high, which will reduce the wafer performance of the electronic equipment and affect the running speed. Therefore, a dust removal method for electronic equipment is needed to remove the fiber dust in the heat dissipation exhaust hole, so that the heat is discharged from the heat dissipation exhaust hole, the temperature of the electronic equipment is reduced, and the running speed of the electronic equipment is improved. SUMMARY

[0003] The present application provides a dust removal method and device for electronic equipment, and a storage medium.

[0004] The technical scheme of the present application embodiment is implemented as follows:

[0005] The present application provides a dust removal method for electronic equipment, which comprises: obtaining the fan speed, the first chip temperature and the first environment temperature of the electronic equipment; determining the temperature threshold of the first chip temperature based on the fan speed; and determining whether to remove dust from the electronic equipment based on the first environment temperature when the first chip temperature is greater than the temperature threshold.

[0006] The present application provides a dust removal device for electronic equipment, which comprises: an acquisition module for acquiring the fan speed, the first chip temperature and the first environment temperature of the electronic equipment; a first determination module for determining the temperature threshold of the first chip temperature based on the fan speed; and a second determination module for determining whether to remove dust from the electronic equipment based on the first environment temperature when the first chip temperature is greater than the temperature threshold.

[0007] The present application provides an electronic equipment comprising a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and the processor implements the steps in the above method when executing the program.

[0008] The present application provides a computer readable storage medium having a computer program stored thereon, wherein the computer program is executed by a processor to implement the steps in the above method.

[0009] The technical scheme provided by the present application embodiment has at least the following beneficial effects:

[0010] In the embodiment of the present application, the temperature threshold of the first chip temperature is determined based on the fan rotating speed. In this way, whether the temperature of the chip in the electronic device is too high can be determined according to the speed of the fan rotating. In the case that the first chip temperature is greater than the temperature threshold, whether the electronic device needs to be dusted is determined based on the first environment temperature. In this way, the influence of the environment temperature can be excluded, and whether the electronic device needs to be dusted is determined according to the chip temperature, so that the electronic device can automatically determine whether it needs to be cleaned, the cleaning work is divided into small parts, the influence of the dust cleaning on the use of the electronic device by the user is reduced, the use experience of the user is ensured, the electronic device is protected, the probability of overheat of the electronic device is reduced, and the service life of the electronic device is prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0012] Figure 1 A flowchart of a dust removal method of an electronic device provided by the embodiment of the present application is shown in the figure.

[0013] Figure 2 A flowchart of a dust removal method of an electronic device provided by the embodiment of the present application is shown in the figure.

[0014] Figure 3 A flowchart of a dust removal method of an electronic device provided by the embodiment of the present application is shown in the figure.

[0015] Figure 4 A flowchart of a dust removal method of an electronic device provided by the embodiment of the present application is shown in the figure.

[0016] Figure 5 A flowchart of a dust removal method of an electronic device provided by the embodiment of the present application is shown in the figure.

[0017] Figure 6 A composition structure diagram of a dust removal device of an electronic device provided by the embodiment of the present application is shown in the figure.

[0018] Figure 7 A hardware entity diagram of an electronic device provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0019] To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application but not all the embodiments. The following embodiments are used to describe the present application but not to limit the scope of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0020] In the following description, “some embodiments” are related to a subset of all possible embodiments, but it can be understood that “some embodiments” can be the same subset or different subsets of all possible embodiments and can be combined with each other without conflict.

[0021] It should be noted that the terms “first\second\third” involved in the embodiments of the present application are only to distinguish similar objects and do not represent a specific order of the objects. Understandably, “first\second\third” can be interchanged in a specific order or sequence as allowed, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.

[0022] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as generally understood by those skilled in the art to which the embodiments of the present application belong. It should also be understood that terms such as those defined in a general dictionary should be understood as having a meaning consistent with the meaning in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as such.

[0023] To help understand the technical solutions of the embodiments of the present application, the concepts involved in the embodiments of the present application are introduced as follows:

[0024] Heat dissipation components in electronic devices: including heat pipes, fans, fins, vapor chamber (VC) heat dissipation technology; among them, heat pipes are also called heat pipe radiators. Heat pipe radiators absorb heat generated by power semiconductors and other devices during the operation of electronic devices, and constantly dissipate heat. The fan removes the heat generated by different devices in the electronic device by rotating. The fin, also known as the heat sink, absorbs heat, conducts heat and dissipates heat in three steps to dissipate the heat absorbed from the device to the environment. VC can take away heat from all directions and can quickly and evenly transfer heat.

[0025] In the related art, electronic device heat dissipation, such as notebook heat dissipation, usually uses a heat pipe + fan + fin, or VC + fan + fin way to take out the heat from the system. As users require higher and higher operating speed of electronic devices, the touch temperature on the surface of the electronic device has become a key indicator affecting user experience. After the electronic device is used for a period of time, the heat dissipation performance becomes poor, the temperature in the electronic device becomes higher and higher, and the operating speed becomes slower and slower, which easily reduces the user experience and generates many related complaints. In addition, in the electronic device with poor heat dissipation performance, the system temperature is too high, which will reduce the performance of the chip of the electronic device. Through big data analysis, the above problems are caused by the fact that the heat dissipation exhaust hole is blocked by fiber dust, so that the heat generated by the chip of the electronic device cannot be dissipated. In order to improve the heat dissipation performance of the electronic device, the blockage can be cleaned by disassembling the machine, dredging the heat dissipation exhaust hole, so that the heat is discharged from the heat dissipation exhaust hole, and the temperature of the electronic device is reduced. However, the above method has the following problems: 1) the disassembly process will increase the maintenance cost; 2) it cannot completely prevent the blockage of fiber in the heat dissipation hole; 3) the user does not know whether the electronic device needs to be cleaned.

[0026] To solve the above problems, the present application provides a dust removal method of an electronic device, applied to an electronic device, Figure 1 A flowchart of a dust removal method of an electronic device provided by an embodiment of the present application is shown in Figure 1 The method comprises the following steps:

[0027] Step S101, obtaining the fan speed, the first chip temperature and the first environment temperature of the electronic device.

[0028] Here, the fan speed is the number of rotations of the fan per minute, and the unit is revolutions per minute (RPM).

[0029] Here, the fan speed of the electronic device can be the speed of at least one fan. Here, the speeds of different fans of the electronic device appear in pairs, for example, in the case of two fans of the electronic device, the fan speed is: Fan 1 (Fan1) 2300 RPM + Fan 2 (Fan2) 2300 RPM.

[0030] Here, the first chip temperature can be the temperature of the central processing unit (CPU), graphics card, sound card, network card, hard disk, disk, mainboard, memory and the like of the electronic device.

[0031] Here, the first chip temperature can be a temperature obtained by data processing of at least one device temperature in the electronic device. As the electronic device runs for a long time, the temperature of the device will also increase, so the device temperature obtained at different times is data processed to obtain the processed device temperature. In this way, the characteristics of the device temperature at all times can be utilized to reduce the influence of abnormal device temperature on the determination of whether the electronic device is dusted.

[0032] Exemplarily, the first chip temperature can be a temperature obtained by arithmetic mean processing of at least one device temperature in the electronic device. N device temperatures are continuously read, and the N continuous device temperatures are arranged in time sequence to form a queue, a new device temperature collected each time is put into the tail of the queue, and the device temperature at the head of the queue is popped out from the queue. Wherein, N is related to the electronic device. In the process of arithmetic mean processing of N device temperatures in the queue, first, the N device temperatures in the queue are removed from a maximum value and a minimum value, then the average value of N-2 data is calculated to obtain the first chip temperature.

[0033] Here, the first environment temperature is the environment temperature at the time when at least one device temperature in the electronic device is obtained. Exemplarily, the environment temperature at the time when the CPU temperature of the electronic device is obtained is 25℃, and the first environment temperature is 25℃.

[0034] Here, in order to solve the system resources of the electronic device, the data processing of the device temperature can be performed again when dusting is required to obtain the first chip temperature operation.

[0035] Step S102, determining the temperature threshold of the first chip temperature based on the fan speed.

[0036] Here, the fan speed can reflect the temperature of the electronic device. If the current speed of the fan of the electronic device at the current time is higher than that at the previous time, or the average speed in the second time range is higher than that in the first time range, the temperature of the electronic device increases, and the fan needs to rotate quickly to reduce the temperature.

[0037] Here, by using the historical data of the fan speed and the chip temperature, the chip temperature corresponding to different fan speeds can be determined. Here, the temperature threshold of the first chip temperature can be determined according to the corresponding relationship between the fan speed and the chip temperature.

[0038] Step S103, in the case that the first chip temperature is greater than the temperature threshold, determining whether to dust the electronic device based on the first environment temperature.

[0039] Here, if the first chip temperature exceeds the temperature threshold, the temperature of the electronic device is high, and heat dissipation is needed. Here, the temperature of the electronic device is determined to be high due to the environment temperature or the chip temperature, according to the first environment temperature, and whether the electronic device needs to be cleaned is determined according to the result.

[0040] In an implementable manner, if the environment temperature causes the temperature of the electronic device to be high, whether the electronic device needs to be cleaned is determined after the temperature of the electronic device is lowered.

[0041] In another implementable manner, if the chip temperature causes the temperature of the electronic device to be high, a cleaning program is started to clean the dust in the electronic device.

[0042] For example, the first chip temperature exceeds the temperature threshold, and the temperature of the electronic device is high. In the case where the first environment temperature is 50℃, whether the electronic device needs to be cleaned is determined after the temperature of the electronic device is compensated by lowering the temperature. If the temperature of the electronic device is less than the temperature threshold after compensation, it is determined that the temperature of the electronic device is high due to the environment temperature, and the electronic device does not need to be cleaned. If the temperature of the electronic device is still greater than the temperature threshold after compensation, it is determined that the temperature of the electronic device is not high due to the environment temperature, and a cleaning program is started to clean the dust in the electronic device.

[0043] In the above embodiment, the temperature threshold of the first chip temperature is determined based on the fan speed. In this way, whether the temperature of the chip in the electronic device is too high can be determined according to the speed of the fan rotation. In the case where the first chip temperature is greater than the temperature threshold, whether the electronic device needs to be cleaned is determined based on the first environment temperature. In this way, the influence of the environment temperature can be excluded, and whether the electronic device needs to be cleaned is determined according to the chip temperature, so that the electronic device can automatically determine whether the dust needs to be cleaned. The cleaning work is divided into small parts, the influence of the dust cleaning on the use of the electronic device by the user is reduced, so that the use experience of the user is ensured, the electronic device is protected, the probability of overheating of the electronic device is reduced, and the service life of the electronic device is prolonged.

[0044] The present application provides a dust cleaning method for an electronic device, Figure 2 A flowchart of a dust cleaning method for an electronic device provided by the present application is shown in Figure 2 The method comprises the following steps:

[0045] In step S201, the fan speed, the first chip temperature, and the first environment temperature of the electronic device are obtained.

[0046] Step S202, determining the chip temperature corresponding to the fan rotating speed in the fan rotating speed and chip temperature mapping relationship table based on the fan rotating speed.

[0047] Here, the fan rotating speed and chip temperature mapping relationship table can be a mapping relationship table determined according to the fan rotating speed and chip temperature in the historical time range.

[0048] Exemplarily, Table 1 is a fan rotating speed and chip temperature mapping relationship table. In Table 1, fan 1 and fan 2 include five levels of rotating speeds, and each level of rotating speed corresponds to two temperature values, i.e., the highest temperature and the lowest temperature corresponding to the level.

[0049] For fan 1, when in level 1, the rotating speed is 2300 RPM, corresponding to the highest temperature 50℃ and the lowest temperature 44℃ of the chip temperature; when in level 2, the rotating speed is 2500 RPM, corresponding to the highest temperature 55℃ and the lowest temperature 49℃ of the chip temperature; when in level 3, the rotating speed is 2800 RPM, corresponding to the highest temperature 60℃ and the lowest temperature 54℃ of the chip temperature; when in level 4, the rotating speed is 3100 RPM, corresponding to the highest temperature 64℃ and the lowest temperature 59℃ of the chip temperature.

[0050] For fan 2, when in level 1, the rotating speed is 2300 RPM, corresponding to the highest temperature 50℃ and the lowest temperature 44℃ of the chip temperature; when in level 2, the rotating speed is 2500 RPM, corresponding to the highest temperature 55℃ and the lowest temperature 49℃ of the chip temperature; when in level 3, the rotating speed is 2700 RPM, corresponding to the highest temperature 60℃ and the lowest temperature 54℃ of the chip temperature; when in level 4, the rotating speed is 3100 RPM, corresponding to the highest temperature 64℃ and the lowest temperature 59℃ of the chip temperature.

[0051] Table 1 fan rotating speed and chip temperature mapping relationship table

[0052]

[0053] In an implementable manner, the fan rotating speed and chip temperature mapping relationship table includes a first relationship table and a second relationship table, the first relationship table is used to determine the chip temperature corresponding to the current time fan rotating speed when the current time fan rotating speed is greater than the previous time fan rotating speed; the second relationship table is used to determine the chip temperature corresponding to the current time fan rotating speed when the current time fan rotating speed is less than the previous time fan rotating speed; wherein the chip temperature corresponding to the fan rotating speed in the first relationship table is greater than the chip temperature corresponding to the fan rotating speed in the second relationship table.

[0054] In an implementable manner, the step S202, determining the chip temperature corresponding to the fan rotating speed in the fan rotating speed and chip temperature mapping relationship table based on the fan rotating speed, includes:

[0055] In step S2021, if it is determined that the fan speed is greater than the fan speed at the previous moment, the chip temperature corresponding to the fan speed is determined based on the fan speed and the first relationship table.

[0056] In step S2022, if it is determined that the fan speed is less than the fan speed at the previous moment, the chip temperature corresponding to the fan speed is determined based on the fan speed and the second relationship table.

[0057] For example, the first relationship table can be the highest temperature of the chip temperature corresponding to the fan speed at different levels, as shown in Table 2. If the fan speed at the current moment is 2500 RPM, which is greater than 2300 RPM at the previous moment, the chip temperature corresponding to the fan speed at the current moment is determined to be 55°C according to the first relationship table.

[0058] Table 2 First relationship table

[0059]

[0060] For example, the second relationship table can be the lowest temperature of the chip temperature corresponding to the fan speed at different levels, as shown in Table 3. If the fan speed at the current moment is 2500 RPM, which is less than 2800 RPM at the previous moment, the chip temperature corresponding to the fan speed at the current moment is determined to be 49°C according to the first relationship table.

[0061] Table 3 Second relationship table

[0062]

[0063]

[0064] In the above embodiment, if it is determined that the fan speed is greater than the fan speed at the previous moment, the chip temperature corresponding to the fan speed is determined based on the fan speed and the first relationship table; if it is determined that the fan speed is less than the fan speed at the previous moment, the chip temperature corresponding to the fan speed is determined based on the fan speed and the second relationship table. In this way, the corresponding chip temperature under different change trends can be determined according to the change trend of the fan speed, and the electronic equipment temperature more consistent with the implementation process can be obtained.

[0065] In step S203, the temperature threshold of the first chip temperature is determined based on the chip temperature.

[0066] In an implementable manner, for electronic devices of different types and materials, there is a redundant value, i.e., a deviation value of the chip temperature corresponding to the fan speed, so that the accuracy of the temperature threshold of the first chip temperature can be improved through the redundant value. For example, Δ is defined as the redundant value according to product design, for example, 3℃. The temperature threshold of the first chip temperature is the chip temperature plus 3℃. As shown in Table 2, if the fan speed at the current moment is 2500 RPM, which is greater than 2300 RPM at the previous moment, the chip temperature corresponding to the fan speed at the current moment is determined to be 55℃ according to the first relationship table, and the temperature threshold of the first chip temperature is 55℃+3℃. As shown in Table 3, if the fan speed at the current moment is 2500 RPM, which is less than 2800 RPM at the previous moment, the chip temperature corresponding to the fan speed at the current moment is determined to be 49℃ according to the first relationship table, and the temperature threshold of the first chip temperature is 49℃+3℃.

[0067] Step S204, in the case where the first chip temperature is greater than the temperature threshold, determining whether to clean the electronic device based on the first environment temperature.

[0068] In the above embodiment, based on the fan speed, the chip temperature corresponding to the fan speed is determined in the fan speed and chip temperature mapping relationship table; and based on the chip temperature, the temperature threshold of the first chip temperature is determined. In this way, the controller of the electronic device can detect the cleaning state of the electronic device in real time according to the fan speed and the fan speed and chip temperature mapping relationship table, reduce the heat dissipation problem of the electronic device caused by dust blockage, reduce the probability of the chip performance of the electronic device being reduced due to the system temperature being too high, and reduce the problem of the running speed of the electronic device being slower and slower due to the temperature inside the electronic device being higher and higher, thereby improving the user experience.

[0069] The present application provides a dust cleaning method of an electronic device, applied to an electronic device, Figure 3 A flowchart of a dust cleaning method of an electronic device provided by the present application is shown in Figure 3 The method at least includes the following steps:

[0070] Step S301, obtaining the fan speed, the first chip temperature and the first environment temperature of the electronic device.

[0071] Step S302, determining the temperature threshold of the first chip temperature based on the fan speed.

[0072] Step S303, if the first chip temperature is greater than the temperature threshold, determining an environment temperature compensation value based on the first environment temperature, wherein the environment temperature compensation value is used to compensate the first chip temperature affected by the environment temperature.

[0073] In an implementable manner, in step S303, if the first chip temperature is greater than the temperature threshold, an environment temperature compensation value is determined based on the first environment temperature, including:

[0074] In step S3031, if the first chip temperature is greater than the temperature threshold, a second environment temperature is obtained, wherein the first environment temperature and the second environment temperature are temperatures at different times in the environment where the electronic device is located.

[0075] In step S3032, the environment temperature compensation value is determined based on the first environment temperature and the second environment temperature.

[0076] For example, if the first chip temperature is greater than the temperature threshold, the environment temperature at the current time is obtained to obtain the second environment temperature 30℃, and if the first environment temperature is 27℃, the environment temperature compensation value δ is 3℃.

[0077] In step S304, the first chip temperature is temperature-compensated by using the environment temperature compensation value to obtain a second chip temperature.

[0078] Here, the temperature difference caused by the environment temperature needs to be subtracted by the environment temperature compensation value to obtain the second chip temperature X-δ which is not affected by the environment temperature, and if the temperature threshold Y+Δ of the first chip temperature is still higher than the preset chip temperature, it is considered that the chip temperature is high because of dust accumulation, and the dust removal fan needs to be started.

[0079] In step S305, if the second chip temperature is greater than the temperature threshold, it is determined to remove dust from the electronic device.

[0080] For example, when the second chip temperature X-δ is greater than the temperature threshold Y+Δ, the dust removal fan needs to be started to remove dust.

[0081] In the above embodiment, if the first chip temperature is greater than the temperature threshold, an environment temperature compensation value is determined based on the first environment temperature, wherein the environment temperature compensation value is used to compensate the influence of the environment temperature on the first chip temperature, so that the influence of the environment temperature on the chip temperature can be excluded, and the performance of the automatic dust removal of the electronic device is improved.

[0082] In an implementable manner, the method further includes: outputting prompt information during loading of the basic output input system of the electronic device or before the electronic device is powered off, wherein the prompt information is used to prompt the user whether to select dust removal.

[0083] Here, the prompt information can be prompted before loading the operating system, and the user can select dust removal and load the operating system after dust removal is performed; or the user can select dust removal and load the operating system and then perform dust removal.

[0084] Here, the system of the electronic device provides the user with a dust removal selection by outputting the prompt information, and the user can determine whether to select dust removal according to actual needs.

[0085] For example, after the user starts the electronic device or before the electronic device is shut down, for example, after a basic input / output system (BIOS) is loaded or before the electronic device is shut down, an embedded controller (EC) determines whether the electronic device needs to be dusted according to a first relationship table shown in Table 2 and a second relationship table shown in Table 3, and outputs prompt information to inquire whether the user wants to perform dust removal.

[0086] In an implementable manner, if the user does not select dust removal, the electronic device is inquired again whether to perform dust removal before the electronic device is shut down.

[0087] In another implementable manner, the method further includes: if the electronic device outputs the prompt information before being shut down, if the user does not select dust removal, the electronic device is prompted again during loading of a basic input / output system (BIOS) after the electronic device is started next time.

[0088] In an implementable manner, after the user selects dust removal, a control signal can be sent through a pin of a fan to control the fan to perform dust removal. For example, the fan is controlled to rotate faster, or to rotate reversely to perform dust removal, or a dust removal fan is controlled to perform dust removal.

[0089] In another implementable manner, a dust removal method of the electronic device can be implemented by injecting a BIOS or an EC into the electronic device on a factory production line. Here, the dust removal method is completed in the BIOS system, and does not affect the timing of the operating system. Unexpected shutdown during dust removal will not cause damage to the machine.

[0090] For example, Figure 4 A flowchart of a dust removal method of an electronic device provided in an embodiment of the present application is shown in FIG. 4. Figure 4 As shown in FIG. 4, in step S402, it is determined whether to perform dust removal. The determination can be performed after the electronic device is started in step S401, or can be performed after a shutdown button in an operating system is clicked in step S404, without affecting the timing of the operating system. Here, the BIOS determines whether the electronic device can be shut down after the shutdown button in the operating system is clicked, and a breakpoint is added in this process to output prompt information to inquire whether the user wants to perform dust removal.

[0091] Here, in the process of executing step S403, on the one hand, it is necessary to determine whether dust removal is needed according to the fan speed, the first chip temperature and the first ambient temperature three parameters and the fan speed and chip temperature mapping relationship table; on the other hand, after dust removal, it is necessary to determine whether the temperature is reduced after the dust removal operation is executed according to the fan speed and chip temperature mapping relationship table, so as to determine whether the dust removal operation is executed.

[0092] The application provides a dust removal method of an electronic device, applied to an electronic device, Figure 5 A flowchart of a dust removal method of an electronic device provided by the embodiment of the application is shown in the figure, Figure 5 The method at least includes the following steps:

[0093] Step S501, reading at least one device temperature and a first ambient temperature T1;

[0094] Step S502, data processing is performed on the at least one device temperature to obtain a first chip temperature X;

[0095] Step S503, determining a chip temperature Y corresponding to a fan speed based on the fan speed, the fan speed and chip temperature mapping relationship table;

[0096] Step S504, judging whether to start dust removal based on the chip temperature Y corresponding to the fan speed, the first chip temperature X and a redundancy value Δ;

[0097] If dust removal is started, step S505 is executed to read a second ambient temperature T2; if dust removal is not started, step S506 is executed to not start dust removal.

[0098] Step S507, determining an ambient temperature compensation value δ based on the first ambient temperature and the second ambient temperature;

[0099] Step S508, judging whether to start dust removal based on the ambient temperature compensation value δ, the chip temperature Y corresponding to the fan speed, the first chip temperature X and the redundancy value Δ;

[0100] If dust removal is started, step S509 is executed to need dust removal; if dust removal is not started, step S510 is executed to not start dust removal.

[0101] Based on the foregoing embodiments, the embodiments of the present application further provide a dust removal device of an electronic device, which comprises various modules and can be implemented by a processor in the electronic device. Of course, the dust removal device can also be implemented by a specific logic circuit. In the implementation process, the processor can be a central processing unit (CPU), a micro processing unit (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA).

[0102] Figure 6 A constituent structure diagram of a dust removal device of an electronic device provided by the embodiments of the present application is shown in FIG. 6. As shown in FIG. 6, the device 600 comprises an acquisition module 601, a first determination module 602, and a second determination module 603, wherein: Figure 6

[0103] The acquisition module 601 is configured to acquire a fan rotating speed, a first chip temperature, and a first ambient temperature of the electronic device.

[0104] The first determination module 602 is configured to determine a temperature threshold of the first chip temperature based on the fan rotating speed.

[0105] The second determination module 603 is configured to determine whether to remove dust from the electronic device based on the first ambient temperature when the first chip temperature is greater than the temperature threshold.

[0106] In an implementable manner, the first determination module 602 comprises a first determination submodule and a second determination submodule, wherein: the first determination submodule is configured to determine a chip temperature corresponding to the fan rotating speed in a fan rotating speed and chip temperature mapping relationship table based on the fan rotating speed; and the second determination submodule is configured to determine a temperature threshold of the first chip temperature based on the chip temperature.

[0107] In an implementable manner, the fan rotating speed and chip temperature mapping relationship table comprises a first relationship table and a second relationship table. The first relationship table is configured to determine a chip temperature corresponding to a current moment fan rotating speed when the current moment fan rotating speed is greater than a previous moment fan rotating speed. The second relationship table is configured to determine a chip temperature corresponding to the current moment fan rotating speed when the current moment fan rotating speed is less than the previous moment fan rotating speed. The chip temperature corresponding to the fan rotating speed in the first relationship table is greater than the chip temperature corresponding to the fan rotating speed in the second relationship table.

[0108] ​In an implementable manner, the first determining submodule comprises a first determining unit and a second determining unit, wherein: the first determining unit is configured to, if it is determined that the fan rotating speed is greater than the fan rotating speed at the previous moment, determine the chip temperature corresponding to the fan rotating speed based on the fan rotating speed and the first relationship table; and the second determining unit is configured to, if it is determined that the fan rotating speed is less than the fan rotating speed at the previous moment, determine the chip temperature corresponding to the fan rotating speed based on the fan rotating speed and the second relationship table.

[0109] In an implementable manner, the second determining module 603 comprises a third determining submodule, a processing submodule and a fourth determining submodule, wherein: the third determining submodule is configured to, if the first chip temperature is greater than the temperature threshold, determine an environmental temperature compensation value based on the first environmental temperature, wherein the environmental temperature compensation value is used to compensate the first chip temperature from the influence of the environmental temperature; the processing submodule is configured to perform temperature compensation on the first chip temperature by using the environmental temperature compensation value to obtain a second chip temperature; and the fourth determining submodule is configured to, if the second chip temperature is greater than the temperature threshold, determine to perform dust removal on the electronic device.

[0110] In an implementable manner, the third determining submodule comprises an obtaining unit and a third determining unit, wherein: the obtaining unit is configured to, if the first chip temperature is greater than the temperature threshold, obtain a second environmental temperature, wherein the first environmental temperature and the second environmental temperature are temperatures at different moments of the environment in which the electronic device is located; and the third determining unit is configured to determine the environmental temperature compensation value based on the first environmental temperature and the second environmental temperature.

[0111] In an implementable manner, the apparatus 600 further comprises a first output module configured to output prompt information during loading of a basic output input system of the electronic device or before shutdown of the electronic device, wherein the prompt information is used to prompt the user whether to select dust removal.

[0112] In an implementable manner, the apparatus 600 further comprises a second output module, wherein: the second output module is configured to, if the prompt information is output before shutdown of the electronic device and the user does not select dust removal, output the prompt information after the electronic device is started again and during loading of a basic output input system.

[0113] It should be noted that: the above description of the apparatus embodiment is similar to the description of the above method embodiment, and has similar beneficial effects to the method embodiment. For technical details not disclosed in the apparatus embodiment of the present application, please refer to the description of the method embodiment of the present application for understanding.

[0114] It should be noted that, in the embodiments of this application, if the above methods are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, or the parts that contribute to related technologies, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause an electronic device to execute all or part of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), magnetic disks, or optical disks. Thus, the embodiments of this application are not limited to any specific hardware and software combination.

[0115] Correspondingly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of any of the methods described in the above embodiments.

[0116] Correspondingly, in this embodiment of the application, a chip is also provided, the chip including programmable logic circuits and / or program instructions, which, when the chip is running, are used to implement the steps in any of the methods described in the above embodiments.

[0117] Correspondingly, in this embodiment of the application, a computer program product is also provided, which, when executed by the processor of an electronic device, is used to implement the steps in any of the methods described in the above embodiments.

[0118] Based on the same technical concept, this application provides an electronic device for implementing the dust removal method of the electronic device described in the above method embodiments. Figure 7 This is a hardware entity diagram of an electronic device provided in an embodiment of this application, such as... Figure 7 As shown, the electronic device 700 includes a memory 710 and a processor 720. The memory 710 stores a computer program that can run on the processor 720. When the processor 720 executes the program, it implements the steps in any of the methods described in the embodiments of this application.

[0119] The memory 710 is configured to store instructions and applications executable by the processor 720, and can also cache data to be processed or already processed by the processor 720 and various modules in the electronic device (e.g., image data, audio data, voice communication data and video communication data), which can be implemented by flash memory or random access memory (RAM).

[0120] The processor 720 implements the steps of the dust removal method of the electronic device of any one of the above when executing a program. The processor 720 generally controls the overall operation of the electronic device 700.

[0121] The processor described above can be at least one of an application specific integrated circuit (ASIC), a digital signal processor (DSP), a digital signal processing device (DSPD), a programmable logic device (PLD), a field programmable gate array (FPGA), a central processing unit (CPU), a controller, a microcontroller, or a microprocessor. It can be understood that the electronic device implementing the functions of the processor described above can also be other electronic devices, and the embodiments of the present application are not limited in this regard.

[0122] The computer storage medium / memory described above can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a ferromagnetic random access memory (FRAM), a flash memory, a magnetic surface memory, an optical disc, or a compact disc read-only memory (CD-ROM), etc. The computer storage medium / memory can also be various electronic devices including one or any combination of the above memories, such as a mobile phone, a computer, a tablet device, a personal digital assistant, etc.

[0123] It should be noted here that the description of the above storage medium and device embodiments is similar to the description of the above method embodiments, and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium and device embodiments of the present application, please refer to the description of the method embodiments of the present application for understanding.

[0124] It should be understood that every feature, structure, or characteristic described herein is within a preferred embodiment of the present application. Thus, it is meant that the features, structures, or characteristics can be combined with each other in any manner within a preferred embodiment of the present application. In addition, it is contemplated that each feature, structure, or characteristic can be implemented in hardware, software, or a combination thereof.

[0125] It should be noted that, as used herein, the terms "includes," "including," "has," "having" or the like are intended to be open-ended: such that the use of "includes," "including," "has," "having" or the like in reference to a process, a method, an article or an apparatus that comprises one or more elements does not (and is not) mean that there are no other elements. It will be apparent that aspects, as described herein, can be implemented in various forms of hardware, software, or combinations thereof; and that the terms "include," "including" or the like means "comprising," "comprising" or the like.

[0126] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other manners. The above described device embodiments are merely schematic. For example, the division of the units is only a logical function division. There can be another division manner for the actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling, or the direct coupling or communication connection between the components can be indirect coupling or communication connection through some interfaces, devices, or units, and can be electrical, mechanical, or in other forms.

[0127] The units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units; they can be located in one place, or distributed on multiple network units; and some or all of the units can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0128] In addition, each functional unit in each embodiment of the present application can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; and the integrated unit can be realized in the form of hardware or hardware plus software functional unit.

[0129] Alternatively, the above-mentioned integrated unit of the present application, if realized in the form of a software function module and sold or used as an independent product, can also be stored in a computer-readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable the equipment automatic test line to execute all or part of the methods described in the embodiments of the present application. The foregoing storage medium includes mobile storage devices, ROM, magnetic discs or optical discs and various media that can store program codes.

[0130] The methods disclosed in the several method embodiments provided by the present application can be combined arbitrarily without conflict to obtain new method embodiments.

[0131] The features disclosed in the several method or device embodiments provided by the present application can be combined arbitrarily without conflict to obtain new method embodiments or device embodiments.

[0132] The above is only an implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A dust removal method of an electronic device, applied to the electronic device, the method comprising: obtaining a fan rotating speed, a first chip temperature and a first ambient temperature of the electronic device; determining a temperature threshold of the first chip temperature based on the fan rotating speed; if the first chip temperature is greater than the temperature threshold, determining an ambient temperature compensation value based on the first ambient temperature, wherein the ambient temperature compensation value is used to compensate the first chip temperature affected by the ambient temperature; performing temperature compensation on the first chip temperature by using the ambient temperature compensation value to obtain a second chip temperature; if the second chip temperature is greater than the temperature threshold, determining to remove dust from the electronic device.

2. The method of claim 1, wherein, The determining of the temperature threshold of the first chip temperature based on the fan rotating speed comprises: determining a chip temperature corresponding to the fan rotating speed in a fan rotating speed and chip temperature mapping relationship table based on the fan rotating speed; determining the temperature threshold of the first chip temperature based on the chip temperature. 3.The method of claim 2, wherein the fan rotating speed and chip temperature mapping relationship table comprises a first relationship table and a second relationship table, the first relationship table is used to determine a chip temperature corresponding to a current fan rotating speed when the current fan rotating speed is greater than a previous fan rotating speed; the second relationship table is used to determine a chip temperature corresponding to the current fan rotating speed when the current fan rotating speed is less than the previous fan rotating speed; wherein the chip temperature corresponding to the fan rotating speed in the first relationship table is greater than the chip temperature corresponding to the fan rotating speed in the second relationship table. 4.The method of claim 3, wherein the determining of the chip temperature corresponding to the fan rotating speed in the fan rotating speed and chip temperature mapping relationship table based on the fan rotating speed comprises: if it is determined that the fan rotating speed is greater than the previous fan rotating speed, determining the chip temperature corresponding to the fan rotating speed based on the fan rotating speed and the first relationship table; if it is determined that the fan rotating speed is less than the previous fan rotating speed, determining the chip temperature corresponding to the fan rotating speed based on the fan rotating speed and the second relationship table. 5.The method of claim 1, wherein the determining of the ambient temperature compensation value based on the first ambient temperature if the first chip temperature is greater than the temperature threshold comprises: obtaining a second ambient temperature in a case that the first chip temperature is greater than the temperature threshold, wherein the first ambient temperature and the second ambient temperature are temperatures at different time in an environment where the electronic device is located; determining the ambient temperature compensation value based on the first ambient temperature and the second ambient temperature. 6.The method of any one of claims 1 to 5, further comprising: outputting prompt information in a process that the electronic device loads a basic output input system or before the electronic device is powered off, wherein the prompt information is used to prompt a user whether to select dust removal. 7.The method of claim 6, further comprising: If the prompt information is output before the electronic device is powered off, and the user does not select dust removal, the prompt information is output when the electronic device is powered on again and a basic output input system is loaded.

8. A dust removal device of an electronic device, the device comprising: an acquisition module, configured to acquire a fan rotating speed, a first chip temperature and a first ambient temperature of the electronic device; a first determination module, configured to determine a temperature threshold of the first chip temperature based on the fan rotating speed; a second determination module, configured to determine an ambient temperature compensation value based on the first ambient temperature if the first chip temperature is greater than the temperature threshold, wherein the ambient temperature compensation value is used to compensate the first chip temperature from the influence of the ambient temperature; and perform temperature compensation on the first chip temperature by using the ambient temperature compensation value to obtain a second chip temperature; and determine to remove dust from the electronic device if the second chip temperature is greater than the temperature threshold.

9. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program, when executed by a processor, implements the steps in the method of any one of claims 1 to 7.

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