Diode appearance inspection jig and detection method

Abstract

An electronic device appearance inspection jig and an inspection method thereof, a multilayer flip composite structure (1) can be detachably installed on the universal moving platform (2), the multilayer flip composite structure (1) includes at least two layers of flip plates; Each layer of flip plate includes sliding limiting area and placing functional area, the placing functional area is provided with mesh matrix, the mesh edge is chamfered; The mesh of the mesh matrix of the upper layer flip plate covers the non-mesh area of the mesh matrix of the lower layer flip plate; The sliding limiting area is located at the four corner areas of the flip plate; The sliding limiting area is provided with a sliding limiting mechanism; Two layers of flip plates are stacked and installed by cooperating with each other by using the sliding limiting mechanism, the mesh of the mesh matrix of the upper layer flip plate is overlapped with the mesh of the corresponding mesh matrix of the lower layer flip plate by horizontal sliding of the sliding limiting mechanism; The bottom of the universal moving platform (2) is provided with a universal pulley (23). The application can inspect the appearance of multiple diodes at a time.

Description

Technical Field

[0001] This invention relates to the field of electronic device inspection technology, and in particular to a diode appearance inspection fixture and inspection method. Background Technology

[0002] Currently, most high-grade surface-mount glass-encapsulated diodes have a cylindrical glass body with polygonal copper electrodes welded to both ends. During inspection, inspectors need to examine each side of the diode device under a stereo microscope. Each side requires manual flipping using tweezers, resulting in extremely low efficiency and high workload. There are currently no suitable devices or tools for continuously flipping and inspecting this type of glass-encapsulated diode. Summary of the Invention

[0003] This invention provides a fixture and method for inspecting the appearance of diodes, solving technical problems such as the continuous flipping and inspection of batch electronic devices like diodes.

[0004] This invention proposes an electronic device appearance inspection fixture, comprising: a multi-layer flip-over composite structure and a universal moving platform; wherein, the multi-layer flip-over composite structure is detachably mounted on the universal moving platform, and the multi-layer flip-over composite structure includes at least two flip-over plates; each flip-over plate includes a sliding limiting area and a placement functional area, the placement functional area being located in the central region of the flip-over plate, the placement functional area having a mesh matrix, and the edges of the mesh being rounded; the mesh of the upper flip-over plate's mesh matrix covers the non-mesh area of ​​the lower flip-over plate's mesh matrix; the sliding limiting area is located in the four corner regions of the flip-over plate; the sliding limiting area is provided with a sliding limiting mechanism; the two flip-over plates are stacked and installed by mutual cooperation using the sliding limiting mechanism, and the two flip-over plates slide horizontally through the sliding limiting mechanism, so that the mesh of the upper flip-over plate's mesh matrix coincides with the corresponding mesh of the lower flip-over plate's mesh matrix; universal casters are installed at the bottom of the universal moving platform.

[0005] Preferably, the mesh matrix is ​​a 10×6 mesh matrix, the mesh is a through hole with a rectangular cross-section, the size of the rounded corners of the mesh is in the range of 0.3mm to 3mm, and the depth of the square through hole is 1.1 to 1.3 times the horizontal height of the device.

[0006] Preferably, the electronic device is a diode device, and the two ends of the diode have polygonal terminals.

[0007] Preferably, the sliding limiting mechanism includes a positioning pin and a U-shaped limiting groove, wherein the positioning pin slides horizontally within the range specified by the U-shaped limiting groove; the odd-numbered layer flip plate is provided with two positioning pins in the lower left and upper right corner areas respectively, and two U-shaped limiting grooves in the upper left and lower right corner areas respectively; the even-numbered layer flip plate is provided with two positioning pins in the upper left and lower right corner areas respectively, and two U-shaped limiting grooves in the lower left and upper right corner areas respectively.

[0008] Preferably, the diameter of the positioning pin and the width of the U-shaped limiting groove are both 3mm, the height of the positioning pin protruding from the flip plate is 2mm, and the tolerance gap between the diameter of the positioning pin and the U-shaped limiting groove is 50μm.

[0009] Preferably, baffles are provided on the top and bottom sides of the omnidirectional mobile platform when viewed from above, and the thickness of the baffles is 3mm to 5mm.

[0010] Preferably, the number of the universal wheels (23) is 4, the height of the universal wheels is 5mm to 20mm, and the diameter of the ball bearings is 3mm to 8mm.

[0011] Preferably, the fixture is made of cemented carbide and has a scratch-resistant coating on its surface.

[0012] This invention also proposes an inspection method for an electronic device appearance inspection fixture, comprising:

[0013] Step S1: Place the electronic device to be tested into the mesh matrix of the uppermost flip plate placement functional area of ​​the multi-layer flip composite structure;

[0014] Step S2: Perform visual inspection on the electronic components in the mesh matrix in sequence, remove unqualified components, slide the upper flip plate after the inspection is completed, roll the electronic components into the mesh matrix of the next flip plate, remove the upper flip plate, and continue visual inspection.

[0015] Step S3: Repeat step S2 until the electronic device has completed the appearance inspection at the required angle. Then, the electronic device falls to the bottom omnidirectional moving platform to screen out qualified electronic devices.

[0016] Preferably, the electronic device is a diode device, and the two ends of the diode have polygonal terminals.

[0017] The diode appearance inspection fixture and testing method of this invention enable the flipping of the glass surface during device appearance inspection. Its multi-layer flipping composite structure allows for the placement and flipping of multiple products to be inspected, while the omnidirectional moving platform enables planar movement during the operation. Combined with the corresponding inspection method, multiple surface-mount diodes can be placed and flipped simultaneously, allowing for the simultaneous appearance inspection of multiple diodes. This enables batch inspection of electronic components, significantly improving inspection efficiency and accuracy. Attached Figure Description

[0018] Figure 1 To examine the overall cross-sectional view of the fixture;

[0019] Figure 2 This is a top view of the front structure of the flip panel.

[0020] Figure 3 This is a top view of the front structure of the omnidirectional mobile platform. Detailed Implementation

[0021] The solution to the technical problem of this invention is to provide an inspection fixture and inspection method, which consists of a multi-layer flipping composite structure and a universal moving platform. The multi-layer flipping composite structure is mainly used to realize the placement and flipping of multiple products to be inspected, and the universal moving platform is mainly used to realize planar movement during the operation process.

[0022] Preferably, the multi-layer flip-over composite structure comprises multiple flip-over plates, the number of which can be customized according to the number of flips. Each flip-over plate includes two areas: a placement functional area and a sliding limiting area. The placement functional area mainly utilizes chamfering and through-hole depth to achieve the placement and flipping of components, while the sliding limiting area mainly utilizes the cooperation of positioning pins and U-shaped limiting grooves to achieve the horizontal sliding displacement of the single board, with a horizontal displacement distance W2. The placement functional area is located in the central region of the flip-over plate and has a mesh matrix, wherein the mesh holes are square through holes with rounded edges; the mesh area of ​​the upper flip-over plate's mesh matrix covers the non-mesh area of ​​the lower flip-over plate's mesh matrix.

[0023] The sliding limit area is located in the four corner areas of the flip plate; the sliding limit area is provided with a sliding limit mechanism; the two flip plates are stacked and installed by mutual cooperation of the sliding limit mechanism, and the two flip plates slide horizontally within a specified range through the sliding limit mechanism, so that the mesh area of ​​the upper flip plate mesh matrix coincides with the mesh area of ​​the lower flip plate mesh matrix.

[0024] Preferably, the placement functional area is horizontally displaced as a whole according to the stacking order of different flip plates, and the horizontal displacement distance needs to be coordinated with the length of the U-shaped limiting groove.

[0025] Preferably, the chamfer size of the placement functional area of ​​the multi-layer flip plate ranges from 0.3mm to 3mm, and the depth of the through holes is 1.1 to 1.3 times the height of the device placement. This ensures that the device under test within the mesh can roll down to the corresponding mesh of the lower flip plate, and that the hole depth does not affect the observation equipment's ability to observe the device under test, thus ensuring the detection effect.

[0026] Preferably, the sliding limiting area is set on both sides of the placement functional area, and the positions of the positioning pin and the U-shaped limiting groove are interchanged according to different flip plate sequences.

[0027] Preferably, the diameter of the locating pin is the same as the width of the U-shaped groove, and the dimensional fit is achieved by tolerance design.

[0028] Preferably, baffles are provided on the front and rear sides of the mobile platform to prevent accidental contact between components and fixtures during the inspection process. The thickness of the baffles ranges from 3mm to 5mm.

[0029] Preferably, four miniature casters are provided under the mobile platform, with a height of 5mm to 20mm and a ball bearing diameter of 3mm to 8mm.

[0030] Preferably, the fixture material is cemented carbide, including but not limited to aluminum alloy and stainless steel. The surface is coated with a scratch-resistant coating to reduce the likelihood of surface damage.

[0031] The present invention also provides a method for visual inspection, which uses the inspection fixture described above, and the method for visual inspection includes the following steps:

[0032] Step S1: Place multiple devices to be tested onto the first flip plate of the multi-layer flip composite structure;

[0033] Step S2: Move the inspection fixture under the microscope and inspect the devices in sequence. Remove unqualified devices. After the inspection is completed, slide the upper flip plate to roll the device to the next flip plate and then remove the upper flip plate.

[0034] Step S3: Repeat step S2 until all angles have been inspected. Then, the device is lowered to the bottom universal moving platform and the qualified device is transferred to the next process.

[0035] Example

[0036] Please refer to Figure 1 An embodiment of the present invention provides a curved glass appearance inspection fixture, which consists of a multi-layer flipping composite structure 1 and a universal moving platform 2. The multi-layer flipping composite structure 1 is mainly used to realize the placement and flipping of multiple products to be inspected, and the universal moving platform 2 is mainly used to realize planar movement during the operation process.

[0037] Preferably, according to the specific application of this embodiment, the multi-layer flip-over composite structure 1 is configured as a 4-layer flip-over plate, suitable for glass diodes with square leads. The horizontal displacement of each layer can realize the rapid 90° flip-over of the array devices. Each flip-over plate includes two areas: a placement functional area 11 and a sliding limiting area 12. The placement functional area mainly uses chamfering and horizontal displacement to realize the placement and flipping of devices, respectively. The sliding limiting area mainly uses the cooperation of positioning pins and U-shaped limiting grooves to realize the horizontal unidirectional sliding displacement of the single plate.

[0038] Preferably, the four flip-board layers are arranged from top to bottom as flip-board 1#, 2#, 3#, and 4#. The placement areas of board 1# and board 2# are shifted as a whole according to the stacking order. This embodiment has been further verified to achieve efficient array-style transfer and flipping of devices within a horizontal displacement distance W2 of 0.9 to 1.2 times the side length of the diode lead and a chamfer angle ∠R2 of 55° to 70°. The hole positions of boards 2#, 3#, and 4# need to be staggered according to the horizontal movement distance W2, so that the mesh area of ​​the upper flip-board's mesh matrix covers the non-mesh area of ​​the lower flip-board's mesh matrix, ensuring that devices do not slip to the next layer when stacked. In one embodiment, the chamfer angle ∠R2 = 60°, the chamfer radius R2 = 1mm, and the horizontal movement distance W2 = 3.5mm.

[0039] like Figure 2 The image shows a top view of the flip panel. The placement area 11 of the flip panel features a 10×6 mesh matrix, with the central hole having a length L = 5mm, a width W1 = 3.55mm, and a rectangular edge with a rounded corner R1 = 0.5mm. Sufficient distance must be maintained between the edges of adjacent mesh holes in the mesh array for the fit of the multilayer board array holes. In this embodiment, the distance between the edges is 15.5mm, which is generally the product of the width W1 and the number of translations. The through-hole depth is 2.5mm, which is 1.1 times the horizontal placement height of the device.

[0040] Preferably, the sliding limiting areas 12 of the flip plates are distributed on both sides of the placement area. The positioning pins of flip plates #1 and #3 are in the same position, with two positioning pins respectively located at the lower left and upper right positions, and two U-shaped limiting grooves respectively located at the upper left and lower right positions. The positions of the positioning pins and U-shaped limiting grooves of flip plates #2 and #4 are interchanged with those of flip plates #1 and #3.

[0041] Preferably, the diameter of the positioning pin and the width of the U-shaped limiting groove are both 3mm, and the protrusion height of the positioning pin is 2mm. The two are matched by tolerance, and the tolerance gap is set to 50μm.

[0042] like Figure 3The image shows a top view of the mobile platform. Baffles 21 are installed on the front and rear sides of the mobile platform to prevent accidental contact between components and fixtures during the inspection process. The thickness of the baffles is 3mm.

[0043] Preferably, two positioning pins 22 are provided on the upper surface of the mobile platform. The positioning pins have a diameter of 3mm and a protrusion height of 2mm, which are used for overall positioning with the upper flip plate.

[0044] Preferably, four miniature casters 23 are provided under the mobile platform, with a height of 8mm and a ball bearing diameter of 3mm.

[0045] Preferably, the fixture is made of aluminum alloy and has a brown aluminum oxide anti-scratch coating on its surface to reduce the chance of surface damage.

[0046] This invention discloses an inspection fixture that enables the flipping of a curved glass surface during the visual inspection of devices. It comprises a multi-layer flipping composite structure and a universal moving platform. The multi-layer flipping composite structure is primarily used for placing and flipping multiple products to be inspected, while the universal moving platform is primarily used for planar movement during the operation. Combined with appropriate inspection methods, it can simultaneously place and flip multiple surface-mount diodes, thereby allowing for the simultaneous visual inspection of multiple diodes during the surface-mount diode visual inspection process, significantly improving inspection efficiency and accuracy.

[0047] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A fixture for inspecting the appearance of electronic devices, characterized in that, The utility model relates to a kind of multi-layer flip composite structure and universal mobile platform;Wherein, The multi-layer flip composite structure (1) is detachably mounted on the universal mobile platform (2), and the multi-layer flip composite structure (1) includes at least two flip plates; The flip plate includes sliding limit area (12) and placement functional area (11), and the placement functional area (11) is located in the central region of the flip plate, and the placement functional area (11) has a mesh matrix, the mesh is square through-hole, and the mesh edge is rounded; The mesh of the mesh matrix of the upper flip plate covers the non-mesh area of the mesh matrix of the lower flip plate. The sliding limit area (12) is located in the four corner regions of the flip plate;The sliding limit area is provided with a sliding limit mechanism (12);Two flip plates are stacked and installed by cooperating with the sliding limit mechanism, and the mesh of the mesh matrix of the upper flip plate is overlapped with the mesh of the corresponding mesh matrix of the lower flip plate by horizontal sliding of the sliding limit mechanism. The bottom of the universal mobile platform (2) is provided with universal wheels (23). The electronic device is a surface-mounted diode with a cylindrical glass curved surface and polygonal terminals at both ends. The mesh matrix is a 10x6 mesh matrix, the mesh is a through-hole with a rectangular cross section, the mesh chamfer size is 0.3mm-3mm, and the square through-hole depth is 1.1-1.3 times the horizontal height of the device.

2. The electronic device appearance inspection jig according to claim 1, characterized by, The sliding limit mechanism includes a positioning pin and a U-shaped limit groove, and the positioning pin slides horizontally within the range defined by the U-shaped limit groove;Odd-numbered flip plates are provided with two positioning pins in the left lower and right upper corner regions respectively, and two U-shaped limit grooves in the left upper and right lower corner regions respectively;Even-numbered flip plates are provided with two positioning pins in the left upper and right lower corner regions respectively, and two U-shaped limit grooves in the left lower and right upper corner regions respectively.

3. The electronic device appearance inspection jig according to claim 1, wherein The diameter of the positioning pin and the width of the U-shaped limit groove are both 3mm, the positioning pin protrudes from the flip plate by 2mm, and the tolerance gap between the diameter of the positioning pin and the width of the U-shaped limit groove is 50μm.

4. The electronic device appearance inspection jig according to claim 3, wherein The universal mobile platform (2) is provided with baffles (21) on the top of the upper and lower sides in the top view direction, and the thickness of the baffles is 3mm-5mm.

5. The electronic appearance inspection tool of claim 3, wherein, The number of universal wheels (23) is four, the height of the universal wheels (23) is 5mm-20mm, and the diameter of the balls is 3mm-8mm.

6. The electronic appearance inspection tool of claim 1, wherein, The jig material is hard alloy with a scratch-resistant coating on the surface.

7. The electronic appearance inspection tool of claim 1, wherein, The utility model relates to a kind of multi-layer flip composite structure and universal mobile platform;Wherein, 8. An inspection method using the electronic device appearance inspection jig according to any one of claims 1 to 7, characterized by, Step S1: placing the electronic device to be detected into the mesh matrix of the placement functional area of the uppermost flip plate of the multi-layer flip composite structure; Step S2: sequentially performing appearance inspection on the electronic device in the mesh matrix, rejecting unqualified devices, after the inspection is completed, sliding the upper flip plate, rolling the electronic device to the mesh matrix of the next flip plate, and then removing the upper flip plate to continue the appearance inspection; Step S3: repeating step S2 until the appearance inspection of the electronic device is completed at the required angle, and the qualified electronic device is screened out by falling to the bottom layer of the universal mobile platform. The electronic device is a diode device, and the diode has polygonal terminals at both ends.

9. The method of claim 8, wherein, ​

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