The utility model provides a
wafer overturning structure, which relates to the technical field of
semiconductor processing, and comprises an overturning platform mounting plate and an overturning
assembly, the overturning
assembly comprises a motor arranged on the overturning platform mounting plate, the output end of the motor is provided with a rotating plate, the bottom of the rotating plate is fixedly provided with a
cantilever, the
cantilever is provided with an adsorption plate, and the adsorption plate is arranged on the overturning platform mounting plate. According to the utility model, the motor drives the rotating plate to rotate and drives the
cantilever and the adsorption plate to realize
wafer overturning, the parallel finger cylinder pushes the cylinder clamping plate to enable the centering clamping plate to move along the direction of the
wafer so as to realize centering calibration of the wafer, and the first cylinder and the second cylinder are linked to adjust the telescopic
stroke of the adsorption plate so as to adapt to different wafer sizes. The vacuum chuck is connected with an
air channel through an air
pipe connector to generate negative pressure to adsorb the wafer, then the motor is started, constant-speed rotation is achieved through the speed
reducer, the cantilever drives the wafer to complete turning over, and therefore the wafers of different sizes can be turned over in a compatible mode.