Liquid cooling device including compensator for compensating volume changes

Abstract

The present invention discloses a liquid cooling device for receiving and dissipating heat from a chip. The liquid cooling device includes a liquid conduit configured to convey a coolant through the cooling device, and at least one compensator. The liquid conduit is configured to convey a coolant through the cooling device, and each of the at least one compensator has an internal volume configured to contain the coolant. The at least one compensator is characterized in that at least one wall of the at least one compensator includes at least one adaptive portion, such as a bimetallic portion. The at least one adaptive portion is configured to adjust the internal volume of the at least one compensator by increasing the internal volume in response to, or directly in response to, an increase in the coolant temperature, and decreasing the internal volume in response to, or directly in response to, a decrease in the coolant temperature.

Description

Technical Field

[0001] The present invention generally relates to a liquid cooling device for electronic equipment, and more particularly to a liquid cooling device including a compensator, wherein the compensator is used to compensate for volume changes of cooling liquid in the liquid cooling device. Background Art

[0002] Portable electronic devices such as smartphones, laptops, and tablets utilize integrated electronic components, circuit devices, circuit units, or chips, packaged with various other electronic components in a compact space. Technological innovations in semiconductor manufacturing and packaging technologies have enabled the development of high-performance, high-density electronic components, circuit devices, circuit units, or chips. As the geometric dimensions of integrated electronic components, circuit devices, circuit units, or chips decrease, operating speeds increase, and the packaging of integrated electronic components, circuit devices, circuit units, or chips becomes more compact, power density increases, resulting in increased heat generation per unit area. This increased power density effectively limits the achievable integration density and performance levels.

[0003] Heat dissipation has become one of the most important and challenging issues facing computer system designers today. As the power consumption of high-performance integrated electronic components, circuit devices, circuit units, or chips, as well as other such integrated circuits, continues to increase, standard conduction and forced air convection cooling techniques are no longer sufficient to cool these complex electronic components. In modern high-performance electronic devices, closed-circuit cooling devices are used to replace traditional air cooling systems. In these devices, closed-circuit cooling devices with a working fluid are used to cool the integrated electronic components, circuit devices, circuit units, or semiconductor chips by: creating a cooling block in which the working fluid circulates; receiving heat from the integrated electronic components, circuit devices, circuit units, or semiconductor chips; and dissipating the heat to the ambient atmosphere.

[0004] Closed-loop liquid cooling systems use compensators or expansion tanks to compensate for changes in volume of the working fluid used in the cooling system due to temperature fluctuations. Without a compensator, as the temperature within the closed-loop liquid cooling system rises, the working fluid expands, increasing internal pressure and potentially damaging the system. Similarly, as the temperature within the closed-loop liquid cooling system drops, the working fluid contracts, reducing the absolute internal pressure of the circuit and creating undesirable vacuum conditions within the closed-loop liquid cooling system. Depending on the closed-loop system, compensators can be implemented in different ways.

[0005] One of the most popular technical solutions involves a tank with sufficient internal volume to accumulate or process the working fluid in the event of expansion or contraction. This tank compensates for the expansion / contraction of the working fluid caused by the airflow above the reservoir tank by varying the liquid level within the reservoir, raising it when the liquid temperature rises and lowering it when the temperature drops. However, because the open end of the tank is connected to the surrounding environment, the pump may draw in some gas (air) during operation. Furthermore, the tank used for compensating the working fluid takes up a considerable amount of space. Therefore, this type of tank cannot be used in portable electronic devices where the space available for the compensator is limited. Furthermore, efficient operation of the compensator requires regular replenishment of the liquid in the reservoir tank. This need for replenishment is unavoidable due to the inevitable leakage of liquid from the closed-loop tank walls during long-term operation. This is particularly problematic when the tank is made of transparent material to monitor the system coolant level.

[0006] Another known solution is a bellows-shaped compensator. As the temperature of the working fluid increases, its volume increases, leading to an increase in internal pressure. This increased pressure causes the bellows to expand, thereby compensating for the increase in pressure and volume of the working fluid. However, the use of bellows increases the size of the compensator, making it unsuitable for portable devices with limited available space. Furthermore, in order for the bellows to deform or expand from its normal position, a high internal pressure of the working fluid is required. Therefore, in such cases, even small changes in pressure and temperature may not be compensated.

[0007] In another known technical solution, the shape of the connection line or path of the working fluid can also be adjusted instead of changing the internal volume. For example, pi (П)-shaped compensators are used, which use working elements made of flexible materials such as polymers, rubber and silicone. Depending on the absolute internal pressure, the working element expands or contracts, causing the path line volume to increase or decrease, so the pressure change is taken into account. However, the flexible materials used in this article may cause long-term permeation problems. That is, the working fluid may leak through the flexible material. In addition, this type of compensator is a bulky stand-alone device, and the planar movement of the compensator may require more additional space to take into account the expansion of the flexible material when the pressure increases.

[0008] Therefore, in view of the above discussion, there is a need to overcome the above-mentioned shortcomings associated with devices for compensating for volume changes in liquid cooling systems so as to facilitate the use of compensators in confined spaces. There is also a need for a device suitable for use in small devices (e.g., portable devices such as smartphones). Summary of the Invention

[0009] The present invention is directed to a liquid cooling system with a compensator for compensating for volume changes in the coolant during closed-loop operation. The present invention aims to provide a technical solution that at least partially overcomes the problems encountered in the prior art and to provide an improved liquid cooling system capable of efficiently and reliably compensating for such volume changes. The present invention aims to provide a technical solution that addresses existing issues with conventional compensators in liquid cooling systems, including the large space required, the risk of coolant seepage from the tank, pressure losses in the conduit, and the need for specific orientation within the space.

[0010] The objects of the invention are achieved by the measures presented in the appended independent claims. Advantageous implementations of the invention are further defined in the dependent claims.

[0011] In one aspect, the present invention provides a liquid cooling device for receiving and dissipating heat from integrated electronic components, circuit devices, circuit units, and / or chips. The liquid cooling device includes a liquid conduit configured to convey a cooling liquid through the liquid cooling device, and at least one compensator, each of the at least one compensators having an internal volume configured to accommodate the cooling liquid. The at least one compensator is characterized in that at least one wall of the at least one compensator includes at least one adaptive portion, the at least one adaptive portion being configured to adjust the internal volume of the at least one compensator by increasing the internal volume in response to, or directly in response to, an increase in the cooling liquid temperature, and decreasing the internal volume in response to, or directly in response to, a decrease in the cooling liquid temperature.

[0012] The liquid cooling device of the present invention provides a compensator in which the shape of an adaptive portion is adjusted to increase or decrease its internal volume according to changes in the coolant temperature, thereby offsetting changes in the coolant volume. This allows the compensator to avoid pressure changes, thereby providing a more robust compensator.

[0013] In one implementation, the at least one adaptive portion includes a first material having a first coefficient of thermal expansion (CTE) and a second material having a second coefficient of thermal expansion (CTE), wherein the first CTE is different from the second CTE.

[0014] Using different materials with different CTEs allows the adaptive portion to expand and contract as the coolant temperature changes, thereby compensating for the resulting changes in coolant volume.

[0015] In one implementation, the at least one adaptive portion includes at least one bimetallic portion.

[0016] The use of a bimetallic section allows the adaptive section to change its volume in response to temperature changes. The bimetallic section is able to change its volume to compensate for changes in coolant temperature. This provides a more robust solution by adjusting the volume based on temperature changes rather than reacting to pressure, which can wear out components over time.

[0017] In one implementation, at least two adaptive portions are configured with different coefficient of thermal expansion (CTE) differences.

[0018] Implementing multiple adaptive sections with different CTE differences improves the compensator's sensitivity because a wider range of temperature variations can be compensated. Furthermore, multiple adaptive sections can achieve a greater volume change, resulting in a greater temperature increase, while reducing the external expansion of the adaptive sections, allowing them to fit into smaller spaces. The adaptive sections can be arranged so that the coolant first encounters the bimetallic section with the larger CTE difference, allowing it to be fully cooled before coming into contact with the bimetallic section with the smaller CTE difference.

[0019] In one implementation, the liquid cooling arrangement further includes a heat dissipation assembly, wherein the heat dissipation assembly includes at least one compensator.

[0020] That is, the compensator is not placed separately, but is integrated with the heat dissipation component. This makes closed liquid cooling suitable for small equipment because no additional space is required to install the compensator as a separate unit.

[0021] In one implementation, the liquid cooling device further includes a heat receiving component, wherein the heat receiving component includes at least one compensator.

[0022] Here, the compensator is disposed within the heat receiving assembly. That is, the heat receiving assembly can include the compensator and can be in contact with the integrated electronic component, circuit device, circuit unit, and / or chip to be cooled. This helps reduce some of the space required for separate installations of the heat receiving assembly and compensator, further enabling the liquid cooling device to be used in portable devices with limited available space.

[0023] In an implementation, the at least one adaptive portion is arranged to operate as a switch of the thermal regulating device, whereby the thermal regulating device is enabled in dependence on the adaptability of the at least one adaptive portion.

[0024] That is, the adaptive portion expands and contracts as the coolant temperature changes, and is used to mechanically open and close the thermal regulation device in synchronization with the temperature change, thereby producing more responsive heat dissipation, thereby improving the overall efficiency of the liquid cooling device.

[0025] In one implementation, the thermal regulation device is configured to regulate the heat dissipation efficiency of the heat dissipation assembly, whereby the thermal regulation device is deactivated when the coolant temperature is within an operating range.

[0026] As described above, the adaptive portion expands and contracts as the coolant temperature changes, and can be used to mechanically open and close the thermal conditioning device in sync with the temperature changes. Thus, when the temperature is within the operating range, the thermal conditioning device can be turned off to save power.

[0027] In one implementation, the at least one bimetallic portion comprises Zn+Invar TM , Al+Cr, Al+W, Cu+Cr, Cu+W, Sandvik Kanthal TM One or a combination of part or all of the .

[0028] The listed material combinations for the at least one adaptive portion are selected to be compatible with each other and thereby avoid corrosion, while providing the appropriate CTE difference required to cool the integrated electronic components, circuit devices, circuit units or chips in the liquid cooling device.

[0029] In one implementation, the bimetallic portion includes a first side and a second side, wherein the first side is configured to face the coolant during operation, and the first side includes a material that is chemically compatible with the coolant.

[0030] Here, the first side is chosen to be made of a compatible material since it is in direct contact with the coolant and therefore does not cause corrosion or any irreversible chemical reaction.

[0031] In one implementation, the liquid cooling device is a closed liquid cooling device.

[0032] Closed loop liquid cooling is implemented because it is generally more efficient and takes up less space than more traditional air cooling, making it suitable for use in portable electronic devices.

[0033] In one implementation, the at least one adaptive portion is circular.

[0034] The circular shape of the adaptive part ensures that stress is evenly distributed over the entire adaptive part, thus minimizing its wear.

[0035] In one implementation, the liquid conduit is configured to deliver the cooling liquid at a pressure that is within a constant within a specified operating range of ambient pressure plus / minus a specified operating range.

[0036] As the coolant temperature changes, the pressure in the conduit typically also changes proportionally. Here, the shape of the compensator changes almost in proportion to the temperature change, thus compensating for pressure changes throughout operation and preventing possible damage to the conduit.

[0037] In one implementation, a portable electronic device includes at least one liquid cooling device, the portable electronic device being an electronic device selected from the group consisting of a smartphone, a laptop, a notebook computer, and a tablet computer.

[0038] Current liquid cooling devices are small enough to be suitable for portable computing devices, where the clearance available for movement of the compensator's working body is typically limited to hundreds of microns.

[0039] In one implementation, the portable electronic device includes a cover wall, and the cover wall is configured as a heat sink for the liquid cooling device.

[0040] Since the cover wall serves as a heat sink for the liquid cooling device, space is saved in the portable electronic device.

[0041] It should be noted that all devices, elements, circuits, units and modules described in this application can be implemented using any form of hardware components. All steps performed by the various entities described in this application and the functions to be performed by the various entities described are intended to refer to the corresponding entities for performing the corresponding steps and functions. Even in the description of the following specific embodiments, the specific functions or steps performed by the external entity are not reflected in the description of the specific detailed elements of the entity performing the specific steps or functions, but the technician should be aware that these methods and functions can be implemented by corresponding hardware components. It will be understood that the features of the present invention are easy to combine in various combinations without departing from the scope of the present invention as defined by the appended claims.

[0042] Other aspects, advantages, features and objects of the present invention will become apparent from the accompanying drawings and detailed description of illustrative implementations when read in conjunction with the following appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above summary of the invention and the following detailed description of illustrative embodiments may be better understood when read in conjunction with the accompanying drawings. For purposes of illustrating the present invention, exemplary configurations of the present invention are shown in the accompanying drawings. However, the present invention is not limited to the specific methods and tools disclosed herein. Furthermore, those skilled in the art will appreciate that the drawings are not drawn to scale. Where possible, similar elements are represented by the same numerals.

[0044] Embodiments of the present invention are described below by way of example only with reference to the accompanying drawings, in which:

[0045] Figure 1is a schematic diagram of a liquid cooling device including a compensator having an adaptive portion provided by one embodiment of the present invention;

[0046] Figure 2 An embodiment of the present invention provides a method for Figure 1 An exemplary cross-sectional view of a liquid conduit for conveying liquid coolant in a liquid cooling device;

[0047] Figures 3A to 3C An embodiment of the present invention provides Figure 1 Cross-sectional view of the compensator in the liquid cooling device at different operating stages;

[0048] Figure 3D is a cross-sectional view of a compensator including at least one circular adaptive portion provided by one embodiment of the present invention;

[0049] Figure 3E An embodiment of the present invention provides Figure 3D Top view of the compensator;

[0050] Figure 4A is a schematic diagram of a liquid cooling device including a compensator having multiple adaptive parts provided by one embodiment of the present invention;

[0051] Figure 4B An embodiment of the present invention provides Figure 4A A cross-sectional view of a compensator comprising two adaptive portions made of the same material combination having a similar CTE difference;

[0052] Figure 4C An embodiment of the present invention provides Figure 4A A cross-sectional view of a compensator including two adaptive portions made of different material combinations with different CTE differences;

[0053] Figure 4D is a cross-sectional view of a compensator including only one adaptive portion in an expanded state provided by one embodiment of the present invention;

[0054] Figure 4E is a cross-sectional view of a compensator including two adaptive parts in corresponding expanded states provided by one embodiment of the present invention;

[0055] Figure 5 is an exemplary schematic diagram of a liquid cooling device including a compensator suitable for use as a heat dissipation component provided by one embodiment of the present invention;

[0056] Figure 6 is an exemplary schematic diagram of a liquid cooling device including a heat regulating device provided by one embodiment of the present invention;

[0057] Figure 7is an exemplary schematic diagram of a liquid cooling device including a compensator suitable for use as a heat receiving component provided by one embodiment of the present invention;

[0058] Figures 8A to 8D is an exemplary schematic diagram of a liquid cooling device including a heat receiving component and a heat dissipating component provided by different embodiments of the present invention;

[0059] Figure 9A and Figure 9B An exemplary graphical representation of the relationship between volume change and temperature change of a bimetallic portion under different configurations provided by one embodiment of the present invention.

[0060] In the accompanying drawings, underlined numbers are used to indicate the item in which the underlined number appears or is adjacent to the underlined number, and ununderlined numbers are used to indicate the item identified by a line connecting the ununderlined number to the item. When a number is ununderlined and has an associated arrow, the ununderlined number is used to identify the general item to which the arrow points. DETAILED DESCRIPTION

[0061] The following detailed description describes embodiments of the present invention and ways in which these embodiments may be implemented. Although some modes of implementing the present invention have been disclosed, those skilled in the art will recognize that there may be other embodiments for implementing or practicing the present invention.

[0062] In this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. The appearance of the phrase "in one embodiment" in different places in the specification does not necessarily refer to the same embodiment, nor does it necessarily mean that separate or alternative embodiments are mutually exclusive of other embodiments. Furthermore, the quantifier "one" in this document does not indicate a limitation of quantity, but rather indicates the presence of at least one referenced item. Furthermore, various features are described that may be exhibited by some embodiments but not by others. Similarly, various requirements are described that may be requirements of some embodiments but not others.

[0063] It should be understood that when an element such as a layer, region, or substrate is referred to as being "on" or "extending onto" another element, the element may be directly on or directly extending onto the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly on" or "extending directly onto" another element, there are no intervening elements. Similarly, it should be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element or "extending onto" another element, the element may be directly on or directly extending onto the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly on" another element or "extending directly onto" another element, there are no intervening elements. It should also be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected or coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0064] Relative terms such as "below," "above," "upper," "lower," "horizontally," or "vertically" are used herein to describe the relationship of one element, layer, or region to another element, layer, or region as illustrated in the figures. It should be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.

[0065] The present invention relates to a liquid cooling device for receiving and dissipating heat from a heating element, wherein the heating element may be an integrated electronic component, circuit device, circuit unit and / or chip in a portable electronic device. In order to make portable electronic devices such as laptops, smart phones, and PDAs work efficiently, it is necessary to incorporate certain cooling mechanisms to dissipate the heat generated when the device is working. Generally speaking, the purpose is to keep the device within a normal operating temperature range, otherwise the device may be damaged. Here, the liquid cooling device is a closed liquid cooling device, wherein a coolant circulates in a closed system to regulate the heat generated, thereby controlling the operating temperature of the heat source (e.g., an integrated electronic component, circuit device, circuit unit and / or chip). In other examples, the liquid cooling device may be open or semi-open, and may also supplement an existing cooling device.

[0066] Figure 1This is a schematic diagram of a liquid cooling device 100 implemented to receive and dissipate heat from integrated electronic components, circuit devices, circuit units, and / or chips 102, according to one embodiment of the present invention. Liquid cooling device 100 includes at least one compensator 104, a liquid conduit 106, and a coolant 108 flowing within liquid conduit 106. Liquid cooling device 100 also includes a heat sink 114. In one embodiment, liquid cooling device 100 is a closed-type liquid cooling device, in which coolant circulates in a closed system to regulate the generated heat and thereby control the operating temperature of the integrated electronic components, circuit devices, circuit units, and / or chips 102. Hereinafter, the terms "liquid cooling device" and "closed-type liquid cooling device" will be used interchangeably. Closed-type liquid cooling devices are implemented because they are generally more efficient, occupy less space, and are therefore suitable for use in portable electronic devices. In other examples, liquid cooling device 100 can be open or semi-open, without departing from the spirit and scope of the present invention, and can also supplement existing cooling devices.

[0067] The integrated electronic component, circuit device, circuit unit or chip 102 can be implemented in many devices, including but not limited to digital computers, microprocessors and random-access memory (RAM). Generally, although the integrated electronic component, circuit device, circuit unit and / or chip 102 is small in size, it has millions of electronic components such as transistors and is therefore able to perform many operations. Therefore, when the integrated electronic component, circuit device, circuit unit and / or chip 102 is in operation, a considerable amount of heat is generated. In order to enable the integrated electronic component, circuit device, circuit unit or chip 102 to operate efficiently, the liquid cooling device 100 in the present invention can help dissipate the generated heat; otherwise, the integrated electronic component, circuit device, circuit unit or chip 102 may be damaged when the temperature exceeds its operating temperature range.

[0068] A circuit device, circuit unit, or chip may include one or more electronic components or semiconductor components. In other words, terms such as electronic device, circuit unit, or chip in the present invention may refer to a single electronic component or a single semiconductor element, or a single chip or a single semiconductor package. For simplicity, the term "chip" will be used as an example in the remainder of the description to explain the present invention.

[0069] The liquid conduit 106 is configured to transport a coolant 108 through the liquid cooling device 100. The liquid conduit 106 utilizes connecting lines such as pipes and tubes that provide connections for all components in the liquid cooling device 100. Figure 2is a cross-sectional view of an exemplary liquid conduit provided by one embodiment of the present invention. Here, the exemplary liquid conduit 106 is shown as having a substantially circular cross-section. Liquid conduit 106 can be made of materials including, but not limited to, plastic, metal, and the like. The shape of liquid conduit 106 can be square, oval, or any other suitable polygonal cross-section, without limitation.

[0070] Coolant 108 circulates through liquid conduit 106. Coolant 108 can be any non-conductive but thermally conductive liquid. The non-conductive nature of coolant 108 eliminates any chance of sparks in liquid cooling device 100 due to an electrical fault in chip 102 or the like. The thermal conductivity of coolant 108 ensures that heat is transferred from chip 102 to coolant 108. Non-dielectric liquids (including, but not limited to, deionized water) can be used as coolant 108. It is contemplated that coolant 108 should be non-corrosive so that components such as compensator 104 and liquid conduit 106 that are in direct contact therewith are not damaged. Furthermore, liquid conduit 106 is sealed and rigid so that coolant 108 does not leak.

[0071] It will be appreciated that coolant 108 has a certain specific volume at ambient temperature. Specific volume is the ratio of a liquid's volume to its mass. The specific volume of coolant 108 varies depending on operating or storage temperature differences. As the operating temperature of chip 102 increases, the volume of coolant 108 increases, which in turn increases the absolute pressure within liquid conduit 106. Similarly, as the ambient temperature of liquid cooling device 100 decreases (e.g., due to cold weather), coolant 108 may contract and its volume may decrease, which in turn may reduce the absolute pressure within liquid conduit 106. As described above, liquid conduit 106 is sealed and rigid. Therefore, it is necessary to compensate for the increase / decrease in the internal volume of coolant 108; otherwise, liquid cooling device 100 may not be able to withstand the absolute pressure changes within liquid conduit 106 and may be damaged. The liquid cooling device 100 of the present invention is designed to address the thermal expansion / contraction of coolant 108 over a wide temperature range, from storage conditions to the maximum heat load of the heat source (i.e., chip 102).

[0072] Back to Figure 1 Compensator 104, within liquid cooling device 100, has an internal volume configured to accommodate coolant 108. Generally, compensator 104 changes its internal volume based on the temperature of coolant 108, thereby increasing or decreasing the total internal volume of liquid cooling device 100 based on the change in specific volume of coolant 108. Due to the change in internal volume of compensator 104, the absolute pressure within coolant 108 can be maintained within a safe range that helps avoid any destructive effects on rigid components of liquid cooling device 100.

[0073] At least one compensator 104 is characterized in that at least one wall 112 of the at least one compensator 104 includes at least one adaptive portion 110. The at least one adaptive portion 110 is configured to adjust the internal volume of the at least one compensator 104 by increasing the internal volume in response to, or directly in response to, an increase in coolant temperature, and decreasing the internal volume in response to, or directly in response to, a decrease in coolant temperature. Here, the adaptive portion 110 contracts or expands based on changes in the temperature of the coolant 108 in contact with it. Specifically, the adaptive portion 110 converts changes in the temperature of the coolant 108 in contact with it into mechanical displacement of the wall 112, thereby increasing the internal volume of the coolant. When the temperature of the coolant 108 increases, the volume of the coolant 108 increases, which is balanced by the increase in internal volume caused by the adaptive portion 110. Similarly, when the temperature of the coolant 108 decreases, the volume of the coolant 108 decreases, which is balanced by the decrease in internal volume caused by the adaptive portion 110. It should be noted that the adaptive portion 110 changes its shape in response to, or directly in response to, the temperature of the coolant 108. Here, the term "direct response" may be understood as a response to a temperature change, rather than a response to a pressure increase caused by an increase in temperature while the volume remains constant. In the present invention, the adaptive portion 110 is able to change its volume before any pressure increase.

[0074] As described above, the wall 112 of the compensator 104 includes the adaptive portion 110. For example, for a liquid cooling device 100 including a liquid conduit 106 having a square cross-section, the compensator 104 is also a hollow cube or a hollow cuboid having a square cross-section, and both ends of the hollow cube or hollow cuboid are open. The cooling liquid 108 flows into the compensator 104 through one open end and flows out from the other open end. In addition to the two open ends, the compensator 104 in the shape of a hollow cube or a hollow cube has six walls. At least one of the six walls (i.e., wall 112) has an adaptive portion 110 formed therein. Figure 1 As can be seen in FIG. 1 , the compensator 104 is part of the liquid conduit 106 , and in one example, the adaptive portion 110 serves as a cover for the compensator 104 .

[0075] Optionally, in one embodiment, the adaptive portion 110 includes a first material having a first coefficient of thermal expansion (CTE) and a second material having a second coefficient of thermal expansion (CTE), wherein the first CTE is different from the second CTE. It will be appreciated that the coefficient of thermal expansion (CTE) is a measure of how a material changes in size in response to changes in temperature. In other words, CTE is the ratio of a change in size to a change in temperature. CTE can be expressed in various ways, such as as a linear expansion coefficient. Here, the linear thermal expansion coefficient is the ratio of a change in length to a change in temperature. The adaptive portion 110 is made of two different materials with different CTEs, bonded together layer by layer. The use of two materials with different CTEs facilitates changing the internal volume of the compensator 104 as the temperature of the coolant 108 changes within the liquid conduit 106. This phenomenon is well known in the art and, for the sake of brevity, will not be further described.

[0076] Optionally, in one embodiment, the at least one adaptive portion includes at least one bimetallic portion 302. A bimetallic portion is a temperature-sensitive device made of at least two materials with different CTEs, and is typically used as a thermostat. The bimetallic portion 302 herein changes shape in response to changes in the temperature of the liquid conduit 106. The use of a bimetallic portion implicitly limits the effect of temperature increases on the direct response.

[0077] Here, the adaptive portion 110, included in the wall 112 of the compensator 104, is made of a metallic material, rather than the traditional non-metallic material described in detail in the previous paragraph. This is because, in a compensator, flexible components made of non-metallic materials such as polymers and rubber present a disadvantage: due to the relatively high permeability of flexible materials compared to metals, working fluid can leak from the closed liquid cooling system during operation. After the coolant molecules leave the closed loop and evaporate into the atmosphere, the coolant volume is displaced by air, thereby compromising the sealing of the closed coolant system. Furthermore, air bubbles can enter the pump cavity, disrupting the continuity of the liquid flow, potentially creating the risk of stalling the liquid circulation and overheating the heat source. Furthermore, it is conceivable that using a flexible material such as rubber for the adaptive portion allows the volume of the adaptive portion to change only in response to changes in the coolant pressure. In other words, as the temperature increases, the volume of the liquid conduit remains constant, resulting in an immediate increase in the coolant pressure. This increased pressure causes the volume of the adaptive portion to increase. However, for the adaptive portion 110 being a bimetallic portion, as the temperature of the coolant 108 increases, the bimetallic portion expands, causing the volume of the liquid conduit 106 to increase, thereby (at least partially) compensating for the possible pressure increase. Therefore, in this case, the coolant 108 generally does not suffer a pressure loss that would cause the adaptive portion 110 to expand.

[0078] Figures 3A to 3C The compensator 300 provided by one embodiment of the present invention is provided in a liquid cooling device (eg, Figure 1 sectional views of the liquid cooling device 100 in different operating stages. Here, the shape of the compensator 300 is a substantially rectangular cross section. The compensator 300 includes a bimetallic portion 302. Here, the bimetallic portion 302 serves as an adaptive portion (e.g., Figure 1 100). The terms "adaptive portion" and "bimetallic portion" are generally used interchangeably in the context of the present invention without limitation. Specifically, the wall of compensator 300 includes bimetallic portion 302. It will be appreciated that bimetallic portion 302 serves as the adaptive portion of compensator 300. Bimetallic portion 302 includes a first material 302A having a first CTE and a second material 302B having a second CTE. In an exemplary configuration, the first CTE is different from the second CTE.

[0079] Parameters to consider when designing compensator 300, including bimetallic portion 302 located on at least one of its walls, include the metal material of each layer, the shape of bimetallic portion 302, the size of bimetallic portion 302, the thickness of each metal layer in bimetallic portion 302, and the possible temperature range of the coolant (e.g., coolant 108). Bimetallic portion 302 changes its shape based on temperature changes resulting from combining two metals 302A and 302B having different CTE values ​​in each layer. The output parameters of compensator 300 are the displacement of bimetallic portion 302 and the volume change of liquid cooling device 100 based on temperature changes.

[0080] Will Figure 1 and Figures 3A to 3C For reference, it should be noted that when the temperature of coolant 108 increases, coolant 108 expands, causing its specific volume to increase. This ultimately leads to an increase in pressure within liquid conduit 106. If this pressure increase is not checked, liquid conduit 106 may rupture due to its inability to withstand the increased pressure, ultimately damaging liquid cooling device 100. Similarly, when the temperature of coolant 108 decreases, liquid conduit 106 contracts, creating a vacuum within liquid conduit 106 and potentially damaging liquid cooling device 100. This increase / decrease in specific volume is balanced by compensator 104. Here, bimetallic portion 302 responds to the increase and decrease in temperature of liquid conduit 106, thereby changing its shape accordingly.

[0081] It will be appreciated that at ambient temperature, the coolant is in a reference state, wherein the reference volume is defined by the ambient conditions. The bimetallic portion 302 is constructed in such a way that, in the reference state, there is no significant mechanical displacement, and thus the bimetallic portion 302 remains substantially planar (e.g., Figure 3A ). In addition, when the temperature of the coolant 108 increases, the coolant expands. The bimetallic portion 302 is constructed in such a way that it expands when the temperature increases, thereby forming a convex shape (as shown). Figure 3B Here, the first material 302A and the second material 302B of the bimetallic portion 302 are bulged outward, forming a convex shape (as shown). This increases the total volume of the liquid conduit 106, thereby compensating for the increase in the specific volume of the coolant 108. In addition, when the temperature of the coolant 108 decreases, the coolant 108 contracts. The bimetallic portion 302 is constructed in such a way that it contracts when the temperature decreases, thereby forming a concave shape (as shown). Figure 3C That is, the first material 302A and the second material 302B of the bimetallic portion 302 move inward, thereby forming a concave shape (as shown). This causes the total volume of the liquid conduit 106 to decrease, thereby compensating for the decrease in the specific volume of the coolant 108.

[0082] Alternatively, in one embodiment (e.g. Figure 3A As shown, combined Figure 1 ), at least one bimetallic portion 302 includes a first side 304 and a second side 306, wherein the first side 304 is configured to face the coolant 108 during operation and comprises a material chemically compatible with the coolant 108. It can be imagined that when designing a compensator 300 including the bimetallic portion 302, two important issues must be considered. The first issue is the chemical compatibility between the coolant 108 and the first material 302A of the bimetallic portion 302. Here, the first material 302A of the bimetallic portion 302 is the material of the first side 304 that contacts the coolant 108. The first material 302A and the coolant 108 should be chemically compatible. In other words, the first material 302A and the coolant 108 within the closed liquid cooling device 100 must not chemically react, corrode, or undergo other irreversible chemical processes over the entire operating temperature range.

[0083] The second issue that should be addressed is the compatibility between the two materials 302A and 302B to avoid corrosion that may occur between the two materials when they are combined in the bimetallic portion 302. Optionally, one or more of the at least one adaptive portion 110 is made of Zn+Invar TM , Al+Cr, Al+W, Cu+Cr, Cu+W, Sandvik Kanthal TM The pairs Al+Cr, Al+W, Cu+Cr, and Cu+W were chosen because they were found to be safe in combination with each other and well compatible with most coolants while being highly efficient and providing sufficient CTE differences to achieve the design goals. It is understood that some of the listed material combinations are widely accepted and used, such as bimetallic strips (e.g., Sandvik Kanthal TM and Zn+Invar TM etc. business names).

[0084] Optionally, in one embodiment, at least one adaptive portion is circular. Figure 3D , shows a schematic cross-sectional view of a compensator 308 provided by one embodiment of the present invention, wherein the compensator 308 includes an adaptive portion 310 disposed on a wall 312 thereof. In addition, Figure 3E is a schematic top view of the compensator 308 including the adaptive portion 310. Figure 3D and Figure 3E, the adaptive portion 310 is rounded (circular or elliptical) in shape, rather than a generally planar bimetallic portion (e.g., bimetallic portion 302), as described in the previous paragraph. The rounded shape of the adaptive portion 310 makes it easier to position the adaptive portion 310 on the wall 312 of the compensator 308. Furthermore, the stress in the rounded (e.g., elliptical or circular) adaptive portion 310 is evenly distributed. In contrast to the rounded shape, the rectangular or square shape of the adaptive portion 310 may result in uneven stress on each side as the adaptive portion 310 adjusts to rising coolant temperature; that is, as the temperature rises, the adaptive portion 310 increases in volume, and stress increases at the corners of each side. However, with the rounded shape, the stress is evenly distributed as the adaptive portion 310 expands and contracts in response to changes in the coolant 108 temperature.

[0085] Traditionally, at least one compensator responds to the internal pressure of the liquid conduit, changing its shape accordingly. For example, when the coolant temperature increases, the coolant expands, increasing the internal pressure of the liquid conduit. This increased pressure pushes on the compensator, causing it to expand, increasing the volume of the liquid conduit; however, this can cause mechanical damage. This can further increase coolant infiltration (due to the high internal pressure of the circuit), potentially forming bubbles in the circuit and reducing the efficiency of the liquid cooling system. In other words, traditionally, compensator wall movement occurs due to changes in absolute internal pressure. If the temperature rises, the specific volume of the coolant increases, increasing the absolute internal pressure of the system, causing the flexible portion to move upward until equilibrium is reached. At this point, the system is under a gauge pressure greater than ambient pressure. Similarly, when the temperature drops, the specific volume of the coolant decreases, reducing the absolute internal pressure of the closed liquid cooling system, causing the flexible portion to move downward until equilibrium is reached. At this point, the system is under a vacuum pressure less than ambient pressure.

[0086] Optionally, in one embodiment, the liquid conduit of the liquid cooling device is configured to deliver the cooling liquid at a pressure that is within a constant within a specified operating range of ambient pressure plus / minus a specified operating range. Figure 1It should be noted that, unlike conventional liquid cooling devices, compensator 104 does not change its shape based on pressure. The compensator 104, including adaptive portion 110, in the present invention changes its shape based on temperature changes in the coolant 108, rather than based on the pressure of the liquid cooling device 100. Here, the pressure of the liquid cooling device 100 refers to the absolute pressure of the coolant 108 therein. In other words, the adaptive portion 110 included in compensator 104 in the present invention changes its shape without any external force (pressure) applied by the coolant 108. In other words, the adaptive portion 110 changes due to temperature changes in the coolant 108, rather than changes in the absolute internal pressure of the liquid cooling device 100. The adaptive portion 110 responds to temperature changes, not pressure changes, meaning (ideally) that the pressure of the coolant 108 remains unchanged. Here, the shape change of compensator 104 is proportional to the temperature change of the coolant 108, thus compensating for pressure changes throughout operation and preventing potential damage to the conduit. This differs from known compensators, which include a rubber portion that reacts to an increase in coolant pressure in the fluid conduit due to an increase in coolant temperature by increasing its volume to reduce the coolant pressure. In the compensator 104 of the present invention, including the adaptive portion 110, the absolute internal pressure of the coolant can be maintained within a defined range, preferably close to ambient pressure. The absolute internal pressure can be within a constant within a specified operating range of ambient pressure plus or minus a specified operating range.

[0087] Optionally, in one embodiment, at least two adaptive parts are provided with different differences in coefficient of thermal expansion (CTE). Figure 4A , shows a liquid cooling device 400 for dissipating heat from a chip 402, and includes a compensator 404 in fluid communication with a liquid conduit 406 for containing a cooling liquid 408. Here, the compensator 404 includes two adaptive portions 410 and 412 disposed on a wall 414 thereof, rather than including a single adaptive portion as described in the previous embodiment. Here, implementing multiple adaptive portions 410 and 412 with different CTE differences improves the sensitivity of the compensator 404 because a wider range of temperature changes can be compensated. Moreover, by using multiple adaptive portions 410 and 412, a larger volume change can be achieved to increase the temperature more, while reducing the overall external expansion of the adaptive portions 410 and 412 so that they can be placed in a smaller space. In addition, the liquid cooling device 400 includes a heat sink 415.

[0088] In one example, at least two of the plurality of adaptive sections of the liquid cooling device are configured to operate within the same temperature range, wherein at least two of the plurality of adaptive sections are configured to have the same CTE difference. As described above, one of the walls 414 of the compensator 404 includes two adaptive sections, namely a first adaptive section 410 and a second adaptive section 412. The first adaptive section 410 and the second adaptive section 412 are both made of materials having the same CTE difference. In other words, the composition of the two adaptive sections 410 and 412 is the same. In another example, the first adaptive section 410 and the second adaptive section 412 may be composed of different elements; however, the CTE difference between the elements of the first adaptive section 410 is the same as the CTE difference between the elements of the second adaptive section 412.

[0089] Figure 4B FIG is an exemplary cross-sectional view of a compensator 404A including two adaptive parts made of the same material according to an embodiment of the present invention. Figure 4A Wall 414 of compensator 404A includes a first adaptive portion 410 and a second adaptive portion 412. First adaptive portion 410 is composed of two materials 410A and 410B, while second adaptive portion 412 is also composed of two materials 412A and 412B. Here, the compositions of first adaptive portion 410 and second adaptive portion 412 are identical. That is, material 410A is identical to material 412A, and material 410B is identical to material 412B. Therefore, the CTE difference between the materials of first adaptive portion 410 is the same as the CTE difference between the materials of second adaptive portion 412. Therefore, the percentage change in shape with respect to temperature change is substantially the same for first adaptive portion 410 and second adaptive portion 412. In other words, first adaptive portion 410 and second adaptive portion 412 deform in a similar manner in response to changes in the temperature of coolant 408.

[0090] Figure 4C FIG is an exemplary cross-sectional view of a compensator 404B including two adaptive portions with different CTE differences provided by one embodiment of the present invention. Here, the wall 414 of the compensator 404B includes a first adaptive portion 410 and a second adaptive portion 412. Figure 4CThe first adaptive portion 410 is made of two materials, 410C and 410D. The second adaptive portion 412 is made of two materials, 412C and 412D. The compositions of the first portion 410 and the second adaptive portion 412 are different. That is, materials 410C, 410D, 412C, and 412D are different. Therefore, the CTE difference between elements 410C and 410D of the first adaptive portion 410 is different from the CTE difference between elements 412C and 412D of the second adaptive portion 412. Furthermore, the use of different materials for the first and second adaptive portions 410, 412 results in different temperature ranges for the first and second adaptive portions 410, 412. That is, the first adaptive portion 410 operates within a first temperature range, while the second adaptive portion 412 operates within a second temperature range. The first and second temperature ranges are distinct but may overlap. This helps expand the operating temperature range of the closed liquid cooling device 400.

[0091] Figure 4D is a schematic cross-sectional view of a compensator 400D including only one adaptive portion 416; and Figure 4E FIG is a schematic cross-sectional view of a compensator 400E including two adaptive parts (ie, a first adaptive part 418 and a second adaptive part 420) provided by one embodiment of the present invention. Figure 4D and Figure 4E , it can be observed that for the liquid conduit to require the same volume change due to an increase in coolant temperature, the expansion of the adaptive portion 416 is much greater than the individual expansions of the first adaptive portion 418 and the second adaptive portion 420. This is because for the compensator 400E, the adaptive portion 416 must expand alone to compensate for the increase in coolant temperature. However, for the compensator 400E, the first adaptive portion 418 and the second adaptive portion 420 expand simultaneously to compensate for the same increase in coolant temperature. Therefore, the first adaptive portion 418 or the second adaptive portion 420 does not need to bulge out too much individually. Therefore, the compensator 400E can be used in applications where clearance or mounting space is very limited. In some examples, when the first adaptive portion 418 and the second adaptive portion 420 can have different bimetallic constructions, the extent of expansion and contraction of the two can be different (such as Figure 4E shown).

[0092] Optionally, in one embodiment, the liquid cooling device further includes a heat dissipation component, wherein the heat dissipation component includes at least one compensator. Figure 5This is an exemplary schematic diagram of a liquid cooling device 500 including a heat dissipation assembly, according to one embodiment of the present invention. Liquid cooling device 500 includes a chip 502, a heat dissipation assembly 504, a liquid conduit 506, and coolant 508. Here, heat dissipation assembly 504 also functions as a compensator, including an adaptive portion 510. That is, the compensator is included in heat dissipation assembly 504. Heat dissipation assembly 504 is typically a radiator. The radiator absorbs heat from liquid conduit 506 and transfers it to the atmosphere.

[0093] refer to Figure 5 , the coolant 508 is in thermal contact with the chip 502 and absorbs heat from the chip 502. The coolant 508 circulates through the liquid conduit 506. The heat dissipation component 504 includes an adaptive portion 510 on one of its walls. The adaptive portion 510 contracts and expands according to the temperature of the coolant 508. One side of the adaptive portion 510 faces the liquid conduit 506, and the other side faces the atmosphere. Here, the bottom surface of the adaptive portion 510 faces the liquid conduit 506, while the top surface faces the atmosphere. In this way, the bottom surface of the adaptive portion 510 that contacts the coolant 508 is heated, and the adaptive portion 510 expands outward. The heat dissipation component 504 functions as a compensator, making the liquid cooling device 500 more compact because the heat dissipation component and the compensator 504 do not require separate space.

[0094] Optionally, in one embodiment, at least one adaptive portion of the liquid cooling device is configured to operate as a switch of the thermal regulation device, whereby the thermal regulation device is enabled based on a change in the adaptability of the at least one adaptive portion. Furthermore, optionally, in one embodiment, the thermal regulation device is configured to adjust the heat dissipation efficiency of the heat dissipation component, whereby the thermal regulation device is disabled when the coolant temperature is within an operating range. Figure 6 6 is an exemplary schematic diagram of a liquid cooling device 600 provided by an embodiment of the present invention. The liquid cooling device 600 includes a chip 602, a compensator 604, a liquid conduit 606, a cooling liquid 608, an adaptive portion 610 disposed in the compensator 604, and a thermal adjustment device 612. Here, the thermal adjustment device 612, including but not limited to a fan, helps to achieve efficient heat dissipation of the liquid cooling device 600. Figure 6 The heat generated by chip 602 is absorbed by coolant 608. Coolant 608 circulates in liquid conduit 606. Adaptive portion 610 in compensator 604 expands or contracts according to the temperature change of coolant 608. The expansion and contraction of adaptive portion 610 can be used to drive a piezoelectric element (not shown) to generate an electrical signal for controlling thermal regulation device 612.

[0095] Here, piezoelectric elements can be used as electrical switches based on the piezoelectric effect. Certain materials generate an electrical charge under mechanical stress. For example, in an electric kettle with an automatic shutoff function, this can be achieved by including a bimetallic portion and a switch made of piezoelectric material. When the temperature of the liquid in the kettle reaches boiling point, the bimetallic portion expands to a sufficient degree to trigger the piezoelectric switch, turning off the kettle.

[0096] In one example, as described above, thermal conditioning device 612 is a fan. In this case, when the temperature rises and more efficient heat dissipation is required, thermal conditioning device 612 is activated and the fan rotates, thereby helping to dissipate heat from liquid conduit apparatus 600 by dissipating heat to the surrounding area. When the temperature drops and active heat dissipation is no longer required, thermal conditioning device 612 is deactivated and the fan stops rotating to conserve energy. Optionally, the speed of the rotating fan can be controlled. Here, the fan speed varies according to the deformation of adaptive portion 610. Thus, adaptive portion 610 eliminates the need for additional switching circuitry required to operate thermal conditioning device 612 and enables thermal conditioning device 612 to be self-controlled, without requiring any external intervention in its operation.

[0097] Optionally, the liquid cooling device further includes a heat receiving component, wherein the heat receiving component includes at least one compensator. Figure 7 : is an exemplary schematic diagram of a liquid cooling device 700 provided by an embodiment of the present invention. The liquid cooling device 700 includes a chip 702, a heat receiving component 704, a liquid conduit 706, a cooling liquid 708 flowing in the liquid conduit 706, and a radiator 712. Figure 7 , heat receiving component 704 is in thermal contact with chip 702. Heat receiving component 704 can be any thermally conductive material that transfers heat from chip 702 to coolant 708. This prevents coolant 708 from coming into direct contact with chip 702, thereby preventing corrosion and failure of chip 702, which may otherwise occur.

[0098] Here, the heat receiving component 704 functions as a compensator. Specifically, one of the walls of the heat receiving component 704 is formed of an adaptive portion (e.g., a bimetallic portion). The heat receiving component 704, including the adaptive portion, has a characteristic of changing its internal volume according to the temperature of the chip 702. The heat receiving component 704 adjusts its shape according to the temperature of the chip 702, thereby reducing or increasing its volume. Since a separate compensator can be omitted, using the heat receiving component 704 as a compensator helps make the liquid cooling device 700 compact.

[0099] Figures 8A to 8DSchematic diagrams of exemplary liquid cooling devices 800A to 800D provided in different embodiments of the present invention. Liquid cooling devices 800A, 800B, 800C, and 800D all include a heat sink assembly 802, a heat receiving assembly 804, a compensator 806, and an optional pump 808. Heat sink assembly 802 is a cooling plate that dissipates heat into the environment, thereby helping to cool liquid cooling device 800A. Receiving assembly 804 absorbs heat from chip 702 and transfers it to the coolant. Compensator 806 includes at least one adaptive portion (not shown) that changes its shape based on the temperature of the coolant. The adaptive portion can be the top cover, bottom cover, or side wall of compensator 806, or two or more of the top cover, bottom cover, and side walls. The adaptive portion depends on the available clearance within the device where liquid cooling device 800 is installed, as well as the total volume change requirements of compensator 806 in liquid cooling device 800.

[0100] refer to Figure 8A , the heat dissipation component 802, the receiving component 804 and the compensator 806 are all separate components and occupy a certain amount of space. Therefore, in the case of limited space, the liquid cooling device 800A may not be implemented. Figure 8B , the heat receiving assembly 804 and the compensator 806 are integrated together. That is, one wall of the heat receiving assembly 804 is used as the adaptive part. Therefore, no additional space is required to install the compensator 806, making the liquid cooling device 800B suitable for equipment with very limited space. Figure 8C , the heat dissipation assembly 802 and the compensator 806 are integrated together. That is, one wall of the heat dissipation assembly 802 is used as the adaptive part. The inclusion relationship between the compensator 806 and the heat dissipation assembly 802 makes it unnecessary to install the compensator 806 in an additional space. Figure 8D The heat receiving assembly 804 includes a first compensator 806 integrated therewith, and the heat dissipating assembly 802 includes a second compensator 810 integrated therewith. Including the second compensator 810 further improves the efficiency of the liquid cooling device 800D.

[0101] Optionally, the liquid cooling device of the present invention is included in a portable electronic device selected from the group consisting of, but not limited to, smartphones, laptops, notebook computers, and tablet computers. Small devices such as smartphones, laptops, notebook computers, and tablet computers require thermal management solutions to operate efficiently. Otherwise, the internal temperature of the device may continue to rise while it is operating, potentially damaging its internal components. The liquid cooling device of the present invention is suitable for implementation in such portable electronic devices due to its compact size, high controllability in its expansion and contraction, and further operation within a wider temperature range.

[0102] Understandably, at this scale of application, the clearance available for movement of the compensator's working body is typically limited to a few hundred microns. Traditionally, compensators are used as standalone devices, connected to other circuit components via fluid conduits. The present invention combines a compensator with a heat sink or heat sink assembly. In this case, the heat sink / heat sink operates using a coupled function that heats / cools the coolant and adjusts the internal volume of the closed system to the operating temperature of the closed liquid cooling system. This particular function is particularly useful in closed cooling systems where system components (e.g., laptop or notebook personal computers) have limited available space. In these cases, the internal space is primarily occupied by electronics, and it is desirable for the liquid cooling system to occupy as little space as possible. Therefore, embodiments of the present invention address the design and implementation of closed liquid cooling systems in such space-constrained applications. The compensator's implementation allows for the use of less than 1 mm of space normal to the heat sink / heat sink assembly to modify its shape. Consequently, the internal volume of the closed system is minimally increased to cover the specific volume of the fluid conduits according to the operating temperature level. Therefore, the liquid cooling device of the present invention can be applied to these devices because not much additional space is required to install the compensator as a separate unit.

[0103] In addition to being compatible with portable electronic devices, the liquid cooling device 100 of the present invention is advantageous because it can operate without orientation restrictions, compared to conventional closed systems that include a reservoir. In conventional closed systems, the reservoir is not 100% filled with working liquid, allowing air to partially penetrate the micropump cavity, disrupting the coolant's continuity, thereby halting circulation and overheating the chip. With the present invention, the internal volume of the liquid cooling device 100 is 100% filled, eliminating the need for any air gap within the closed system. Here, the bimetallic portion changes shape to compensate for changes in coolant volume due to temperature fluctuations.

[0104] Optionally, the portable electronic device includes a cover wall, wherein the liquid cooling device is dependent on claim 5, and the cover wall is configured as a heat sink for the liquid cooling device. As described above, the liquid cooling device can be used in a portable electronic device. The portable electronic device can include a cover wall. The cover wall is an outer wall that hides the adaptive portion from the user. The cover wall can also serve as a heat sink component and can help efficiently cool the portable electronic device. Using the cover wall to dissipate heat further helps make the liquid cooling device compact because a separate cover wall and a separate heat sink component are not required.

[0105] As described above, by setting input parameters, a compensator 806 with a necessary maximum displacement value can be designed. For example, the liquid cooling device 800B can be incorporated into a portable electronic device so that the heat dissipation component 802 and the heat receiving component 804 are combined and integrated into the back cover of the device. In this case, the compensator 806 including a bimetallic portion is integrated on the heat receiving component 804. Alternatively, the compensator 806 including a bimetallic portion is integrated on the heat dissipation component 802. The volume of the liquid cooling device 800B can be adjusted according to the temperature of the cooling liquid using the compensator 806. In order to avoid any external component (such as a cover wall) of the portable electronic device from moving or bending against the bimetallic portion, the inner side of the cover wall including the heat dissipation component 802 and / or the heat receiving component 804 can be provided with an adaptive portion. Therefore, the portable electronic device can hide the shape change of the bimetallic portion to compensate for the temperature change therein.

[0106] As mentioned above, the bimetallic part must be made of two metals with different CTEs. The greater the CTE difference between the metals, the greater the maximum displacement of the plate for a given temperature change. For example, in this article, a CTE of 4.00e is considered. –05 K –1 Zinc (Zn) and CTE of 1.50e –06 K –1 Invar TM The circular shape is designed to maximize the volume change caused by the shape change within a given space and a 50mm diameter. Typical laptop computer requirements require a compensator operating temperature range of -40°C to +70°C. This means that when the closed cooling system is exposed to -40°C (as might be the case during storage or transportation), the bimetallic portion undergoes the greatest shape change from flat to concave. On the other hand, when the liquid cooling system is exposed to +70°C (e.g., under maximum chip load), the bimetallic portion undergoes the greatest shape change from flat to convex.

[0107] Figure 9A and Figure 9B This is an exemplary graphical representation of the volume change of a bimetallic portion versus temperature for different portion thicknesses, provided by one embodiment of the present invention. It will be appreciated that the total volume change of the liquid cooling device required in each case will vary, depending on the total coolant volume under a reference state, which can be the room conditions, temperature range, type of working fluid, and the maximum allowable absolute internal pressure of the closed liquid cooling device. The compensation capability of a compensator including a bimetallic portion depends on the metal pair (the CTE of each metal), the thickness of each metal, its shape, and the specific dimensions and temperature range.

[0108] refer to Figure 9A , provides a diagram 900A, showing different sizes of zinc and Invar TMThe volume change of the bimetallic portion of the fabricated bimetallic strip relative to temperature. Here, the volume change is in milliliters and the temperature is in degrees Celsius. It can be seen that the volume increases with the metal size of the adaptive portion according to the temperature change. For example, line 902 depicts the volume change of the bimetallic portion of the fabricated bimetallic strip with a zinc thickness of 0.1 mm and an Invar thickness of 0.1 mm. TM The volume variation with temperature for the first combination with a thickness of 0.1 mm, line 904 depicts the volume variation with temperature for the first combination with a thickness of 0.2 mm and Invar TM The volume change of the second combination with a thickness of 0.2 mm over temperature. As can be seen from graph 900A, for the same temperature change, the volume change of the second combination (shown by line 904) is much greater than the volume change of the first combination (shown by line 902). For example, at a temperature of 60°C, the volume change of the first combination is 0.5 ml, while the volume change of the second combination is approximately 0.7 ml. In general, as can be seen from graph 900A, it is possible to compensate for internal volume changes of + / - 1 ml for closed liquid cooling systems.

[0109] refer to Figure 9B , provides a graphical method 900B showing the volume change of the bimetallic portion with respect to temperature for different bimetallic combinations. The input parameters are as follows: each layer is 0.1 mm thick, the total thickness of the bimetallic portion is 0.2 mm, and at least one adaptive portion is circular with a diameter of 50 mm. Lines 906, 908, 910, and 912 are respectively related to Sandvik Kanthal TM The volume change of the bimetallic portion of the copper-chromium (Cu+Cr), aluminum-chromium (Al+Cr), and aluminum-tungsten (Al+W) combinations relative to temperature changes. It can be seen that at 20°C, lines 906 and 908 have the same volume change. However, at around 60°C, the volume change represented by line 906 is much greater than that of line 908. Therefore, Sandvik Kanthal TM Material combinations can be used to compensate for devices operating over a wide temperature range. Similarly, at the starting point of the graph, 40°C, lines 910 and 912 show that the volume change for the Al+W combination is greater than that for the Al+Cr combination. However, as the temperature increases, for example, at 70°C, the volume change for the Al+Cr combination becomes greater than that for the Al+W combination. Therefore, it can be inferred that Al+W can be used over a narrow temperature range, while Al+Cr is more sensitive to temperature changes over a wide temperature range.

[0110] The embodiments of the present invention described above may be modified without departing from the scope of the invention as defined by the appended claims. Expressions such as "including", "combining / incorporating", "having", "being / being" used to describe and claim the present invention are intended to be interpreted in a non-exclusive manner, i.e., allowing items, components or elements that are not explicitly described to also exist. References to the singular should also be interpreted as involving the plural. The word "exemplary" as used herein means "as an example, instance or illustration". Any embodiment described as "exemplary" is not necessarily interpreted as being more preferred or more advantageous than other embodiments, and / or excluding the combination of features of other embodiments. The word "optionally" as used herein means "provided in some embodiments and not provided in other embodiments". It should be understood that certain features of the present invention described in the context of a separate embodiment for the sake of clarity may also be provided in a single embodiment by combination. Conversely, the various features of the present invention described in the context of a single embodiment for the sake of brevity may also be provided individually or in any suitable combination or as any other described embodiment of the present invention.

Claims

1. A liquid cooling device (100, 500, 600, 700), characterized in that: The liquid cooling device is used to receive and dissipate heat from electronic components / circuits, the liquid cooling device comprising a liquid conduit (106, 506, 606, 706) and at least one compensator (104, 504, 604, 704), the liquid conduit being configured to convey a cooling liquid (108, 508, 608, 708) through the liquid cooling device, the at least one compensator each having an internal volume configured to accommodate the cooling liquid, wherein The at least one compensator is characterized in that at least one wall (112) of the at least one compensator includes at least two adaptive portions (410, 412) provided with different coefficient of thermal expansion (CTE) differences, at least one of the adaptive portions being configured to adjust the internal volume of the at least one compensator by increasing the internal volume in response to or directly in response to an increase in the coolant temperature and decreasing the internal volume in response to or directly in response to a decrease in the coolant temperature.

2. The liquid cooling device (100) according to claim 1, characterized in that The adaptive portion (302) includes a first material (302A) having a first coefficient of thermal expansion (CTE) and a second material (302B) having a second coefficient of thermal expansion (CTE), wherein the first CTE is different from the second CTE.

3. The liquid cooling device (100) according to claim 2, characterized in that: The adaptive portion (302) includes at least one bimetallic portion.

4. The liquid cooling device (500) according to any one of claims 1 to 3, characterized in that: The liquid cooling device further comprises a heat dissipation component (504), wherein the heat dissipation component comprises at least one compensator.

5. The liquid cooling device (700) according to any one of claims 1 to 4, characterized in that: The liquid cooling device further comprises a heat receiving component (704), wherein the heat receiving component comprises at least one compensator.

6. The liquid cooling device (600) according to claim 4, characterized in that At least one of the adaptive portions (610) is arranged to operate as a switch for a thermal regulation device (612), whereby the thermal regulation device is enabled in dependence on the adaptation of the at least one adaptive portion.

7. The liquid cooling device (500, 600) according to claim 6, characterized in that: The thermal regulation device (612) is configured to regulate heat of the heat sink assembly (504), whereby the thermal regulation device is deactivated when the coolant temperature is within an operating range.

8. The liquid cooling device (100) according to claim 3, characterized in that The at least one bimetallic portion includes one or a combination of part or all of Zn+Invar™, Al+Cr, Al+W, Cu+Cr, Cu+W, and Sandvik Kanthal™.

9. The liquid cooling device (100) according to claim 3, characterized in that The bimetallic portion (302) includes a first side and a second side (304, 306), wherein the first side is configured to face the coolant (108) during operation, and the first side includes a material that is chemically compatible with the coolant.

10. The liquid cooling device (100, 500, 600, 700) according to any one of claims 1 to 9, characterized in that: The liquid cooling device is a closed liquid cooling device.

11. The liquid cooling device (100, 500, 600, 700) according to any one of claims 1 to 10, characterized in that: At least one of the adaptive portions (310) is circular.

12. The liquid cooling device (100, 500, 600, 700) according to any one of claims 1 to 11, characterized in that: The liquid conduit (106) is configured to deliver the cooling liquid (108) at a pressure that is within a constant within a specified operating range of ambient pressure plus / minus a specified operating range.

13. A portable electronic device comprising at least one liquid cooling device (100, 500, 600, 700) according to any one of claims 1-12, characterized in that: The portable electronic device is an electronic device selected from the group consisting of a smartphone, a laptop computer, and a tablet computer.

14. The portable electronic device according to claim 13, wherein: The portable electronic device comprises a cover wall, which is configured as a heat sink for the liquid cooling device.

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