A blowtorch, polishing device and method for polishing device surface

Abstract

The present application relates to a blowtorch for polishing the surface of a device, which includes a polishing lamp head, the polishing lamp head has a central feed hole and an annular flame hole surrounding the outer side of the central feed hole; the central feed hole is used to introduce a mixed gas of fluoride and oxygen; the annular flame hole includes a first layer of flame holes and a second layer of flame holes; the first layer of flame holes includes a first layer of oxygen holes and a first layer of hydrogen holes; the second layer of flame holes includes a second layer of oxygen holes and a second layer of hydrogen holes. Fluoride is introduced into the central feed hole. Fluoride has extremely strong oxidizing properties and can react with impurities on the surface of the device, such as reacting with metal impurities to generate gaseous fluoride and be carried away by the airflow. Under high temperature, fluoride will also decompose fluorine gas, and silicon atoms on the surface of the device react with fluorine gas to generate volatile SiF4, and a very thin layer of the surface of the optical fiber preform is etched away, and at the same time, impurities and defects on the surface are also taken away, thereby eliminating microscopic defects on the surface of the device.

Description

Technical Field

[0001] The present application relates to the technical field of optical fiber preform manufacturing, and in particular to a blowtorch, a polishing device and a method for polishing the surface of a device. Background Art

[0002] In the field of communication optical fiber manufacturing, the mainstream optical fiber preform preparation technology is a "two-step" synthesis process. First, VAD (Axial Vapor Deposition), PCVD (plasma chemical vapor deposition), MCVD (Modified Chemical Vapor Deposition) and other methods are used to deposit and prepare the core rod, and then OVD (Outside Vapor Deposition), sleeve and other methods are used to prepare the outer cladding, which can manufacture large-size optical fiber preforms with an outer diameter of more than 150mm.

[0003] The main problem with the "two-step" optical fiber preform manufacturing technology is that a large number of defects and impurities are easily generated at the interface between the core rod and the outer cladding. First, during the preparation of the core rod, certain defects and impurities will be generated on the surface of the core rod. During the storage and transportation of the core rod, the core rod will also absorb dust and impurities. These defects and impurities will be wrapped in the optical fiber preform after the outer cladding is prepared by OVD deposition, and defects will be generated at the core-cladding interface, which will have an adverse effect on the quality of the optical fiber preform.

[0004] In addition, various types of optical fiber preforms and precision optical devices also require high-performance polishing devices to polish the surface to eliminate surface defects without damaging their original structure. Summary of the invention

[0005] The embodiments of the present application provide a blowtorch, a polishing device and a method for polishing a device surface, which can process defects and impurities on the device surface to improve the quality of an optical fiber preform.

[0006] In a first aspect, a blowtorch for polishing a device surface is provided, comprising a polishing lamp head, wherein the polishing lamp head has a central feed hole and an annular flame hole surrounding the outer side of the central feed hole; the central feed hole is opened at the center of the polishing lamp head and is used to pass a mixed gas of fluoride and oxygen;

[0007] The annular flame holes include a first layer of flame holes and a second layer of flame holes distributed sequentially from the inside to the outside;

[0008] The first layer of flame pores includes a first layer of oxygen pores and a first layer of hydrogen pores distributed sequentially from the inside to the outside;

[0009] The second layer of flame pores includes a second layer of oxygen pores and a second layer of hydrogen pores which are sequentially distributed from the inside to the outside.

[0010] In some embodiments, a third layer of annular oxygen holes is further provided outside the annular flame hole.

[0011] In some embodiments, the gas flow rates in the central feed hole, the first layer of oxygen holes, the first layer of hydrogen holes, the second layer of oxygen holes, and the second layer of hydrogen holes gradually decrease.

[0012] In some embodiments, the fluoride is one or more of oxygen difluoride, carbon tetrafluoride, trifluoromethane, and sulfur hexafluoride;

[0013] And / or, the device includes at least one of a core rod, an optical fiber preform rod, a sleeve rod, and a high-purity quartz optical device.

[0014] In a second aspect, a polishing device is provided, which comprises a blowtorch for polishing a device surface as described above.

[0015] In a third aspect, a method for polishing a device surface is provided, comprising the following steps:

[0016] Providing a blowtorch for polishing a device surface as described above;

[0017] Passing hydrogen and oxygen into the annular flame hole and igniting to preheat the device surface;

[0018] A mixed gas of fluoride and oxygen is introduced into the central feed hole, and the flow rates of hydrogen and oxygen in the annular flame hole are increased to etch the surface of the device;

[0019] After the impurities on the device surface are eliminated, the introduction of the mixed gas of fluoride and oxygen is stopped, and the flow rates of hydrogen and oxygen in the annular flame hole are increased to polish the device surface;

[0020] After the surface defects of the device are eliminated, stop introducing hydrogen and oxygen.

[0021] In some embodiments, the preheating time is 5 min to 10 min.

[0022] In some embodiments, the etching time is 20 min to 30 min.

[0023] In some embodiments, the polishing time is 5 min to 10 min.

[0024] In some embodiments, the device surface defects include one or more of bright spots, protrusions, pits, scratches, bubbles, and air lines;

[0025] And / or, the impurities on the device surface include one or more of metal particles, dust, and crystallization.

[0026] The beneficial effects of the technical solution provided by this application include:

[0027] The embodiment of the present application provides a blowtorch, a polishing device and a method for polishing the surface of a device. When polishing, oxygen is introduced into the first layer of oxygen pores and the second layer of oxygen pores, and hydrogen is introduced into the first layer of hydrogen pores and the second layer of hydrogen pores, and a flame is ignited to preheat the device; then, a mixed gas of fluoride and oxygen is introduced into the central feed hole, and the flow rate of hydrogen and oxygen is increased to remove impurities and polish the device. Fluoride has a strong oxidizing property and can react with impurities on the surface of the device, such as reacting with metal impurities to generate gaseous fluoride and be carried away by the airflow. In the high temperature environment of the flame, fluoride will also decompose fluorine gas. Silicon atoms on the surface of the device, such as the optical fiber preform, react with fluorine gas to generate volatile SiF4. A very thin layer is etched off the surface of the optical fiber preform, and impurities and defects on the surface are also taken away. After the impurities are completely eliminated, the fluoride gas is turned off, and the surface of the device is polished with a large flow of hydrogen and oxygen flame to eliminate microscopic defects on the surface of the device.

[0028] It can be seen that the blowtorch provided in the present application can effectively eliminate surface defects and impurities of the device, including bright spots, pits, convex spots, scratches caused by the core rod, optical fiber preform rod or sleeve rod during the preparation, storage and transportation, as well as impurity particles formed on the surface of the core rod, optical fiber preform rod or sleeve rod during the manufacturing process, pollutants adsorbed when exposed to the air, and metal impurities, particles, inorganic impurities and organic impurities adsorbed on the surface during the turnover process, thereby avoiding the formation of air lines, bright spots, bubbles, crystallization, etc. at the interface of the core rod, optical fiber preform rod or sleeve rod, thereby preparing high-quality optical fiber preform rods. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of the structure of a blowtorch for polishing a device surface provided in an embodiment of the present application;

[0031] Figure 2 A flow chart of a method for polishing a device surface provided in an embodiment of the present application.

[0032] In the figure: 1. Polished lamp holder; 2. Central feed hole; 3. First layer oxygen holes; 4. First layer hydrogen holes; 5. Second layer oxygen holes; 6. Second layer hydrogen holes; 7. Third layer oxygen holes. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] The embodiment of the present application provides a blowtorch for polishing the surface of a device, which can process defects and impurities on the surface of the device to improve the quality of the optical fiber preform.

[0035] See also Figure 1 As shown, a blowtorch for polishing the surface of a device provided in an embodiment of the present application includes a polishing lamp head 1, which is in the shape of a cylinder and has a central feed hole 2 and an annular flame hole surrounding the outer side of the central feed hole 2; the central feed hole 2 is opened at the center of the polishing lamp head 1, and is used to pass a mixed gas of fluoride and oxygen, the role of oxygen is to provide an oxidizing atmosphere for decomposing fluoride into fluorine gas, and when in use, the central feed hole 2 is connected to a feed pipe.

[0036] The annular flame hole comprises a first layer of flame holes and a second layer of flame holes sequentially distributed from the inside to the outside; the first layer of flame holes comprises a first layer of oxygen holes 3 and a first layer of hydrogen holes 4 sequentially distributed from the inside to the outside, the first layer of oxygen holes 3 comprises a plurality of holes, the function of which is to pass oxygen, and is connected to a feed pipe when in use, and the holes are distributed in an annular shape outside the central feed hole 2, the first layer of hydrogen holes 4 comprises a plurality of holes, the function of which is to pass hydrogen, and is connected to a feed pipe when in use, and the holes are The second layer of flame pores includes a second layer of oxygen pores 5 and a second layer of hydrogen pores 6 which are sequentially distributed from the inside to the outside. The second layer of oxygen pores 5 include a plurality of pores which are used to introduce oxygen and are connected to a feed pipe when in use. The pores are annularly distributed outside the first layer of hydrogen pores 4. The second layer of hydrogen pores 6 include a plurality of pores which are used to introduce hydrogen and are connected to a feed pipe when in use. The pores are annularly distributed outside the second layer of oxygen pores 5.

[0037] The blowtorch provided in this embodiment introduces oxygen into the first layer oxygen pores 3 and the second layer oxygen pores 5, introduces hydrogen into the first layer hydrogen pores 4 and the second layer hydrogen pores 6, ignites to form a flame, and preheats the device; then, a mixed gas of fluoride and oxygen is introduced into the central feed hole 2, and the flow rate of hydrogen and oxygen is increased to remove impurities and polish the device. Fluoride has a strong oxidizing property and can react with impurities on the surface of the device, such as reacting with metal impurities to generate gaseous fluoride and be carried away by the airflow. In the high temperature environment of the flame, fluoride will also decompose fluorine gas, and silicon atoms on the surface of the device, such as the optical fiber preform, react with fluorine gas to generate volatile SiF4. A very thin layer is etched off the surface of the optical fiber preform, and impurities and defects on the surface are also taken away. After the impurities are completely eliminated, the fluoride gas is turned off, and the surface of the device is polished with a large flow of hydrogen and oxygen flame to eliminate microscopic defects on the surface of the device. It can be seen that the blowtorch provided in this application can effectively eliminate surface defects and impurities of the device.

[0038] Wherein, the fluoride is one or more of oxygen difluoride, carbon tetrafluoride, trifluoromethane, and sulfur hexafluoride.

[0039] Device surface defects include one or more of bright spots, protrusions, pits, scratches, bubbles, and air lines.

[0040] Impurities on the device surface include one or more of metal particles, dust, and crystallization.

[0041] The device comprises at least one of a core rod, an optical fiber preform rod, a sleeve rod, and a high-purity quartz optical device.

[0042] That is to say, the blowtorch of the present application can polish the surfaces of core rods, optical fiber preform rods, sleeve rods, high-purity quartz optical devices, etc. to eliminate defects and impurities.

[0043] See also Figure 1 As shown, a third layer of annular oxygen holes 7 are also provided outside the annular flame hole. When in use, oxygen is introduced to isolate the internal flame airflow from being disturbed by the external environmental airflow.

[0044] When in use, in order to form an ultra-high temperature stable flame, the gas flow rates in the central feed hole 2, the first layer of oxygen holes 3, the first layer of hydrogen holes 4, the second layer of oxygen holes 5 and the second layer of hydrogen holes 6 are gradually reduced to form a flame shape that converges toward the center. The temperature at the center of the flame is higher, which is more conducive to the etching reaction and improves the polishing effect.

[0045] An embodiment of the present application also provides a polishing device, which includes a blowtorch as described above for polishing the surface of a device.

[0046] See also Figure 2As shown, the embodiment of the present application also provides a method for polishing a device surface, which comprises the following steps:

[0047] 101: Provide a blowtorch for polishing a device surface as described in any of the above embodiments.

[0048] Install the device such as the optical fiber preform on the fixed bracket, and adjust the distance between the device and the blowtorch. Perform preliminary cleaning on the surface of the device such as the optical fiber preform, and wipe the surface with alcohol and dust-free paper.

[0049] 102: hydrogen and oxygen are introduced into the annular flame holes and ignited to preheat the device surface; specifically, oxygen is introduced into the first layer oxygen holes 3 and the second layer oxygen holes 5, and hydrogen is introduced into the first layer hydrogen holes 4 and the second layer hydrogen holes 6, and ignited to form flames to preheat the device surface.

[0050] The preheating time is determined according to actual polishing requirements. For example, as an example, the preheating time may be 5 minutes to 10 minutes. Specifically, the preheating time may be 10 minutes.

[0051] 103: A mixed gas of fluoride and oxygen is introduced into the central feed hole 2, and the flow rates of hydrogen and oxygen in the annular flame hole are increased. In the high-temperature environment formed by the hydrogen and oxygen gases, the fluoride will also decompose into fluorine gas, which reacts with the material on the surface of the device to etch the surface of the device. The etching time is determined according to the actual polishing needs. For example, as an example, the etching time can be 20 minutes to 30 minutes, and specifically, it can be etched for 20 minutes.

[0052] 104: After the impurities on the device surface are eliminated, stop introducing the mixed gas of fluoride and oxygen, and increase the flow rate of hydrogen and oxygen in the annular flame hole. Under the ultra-high temperature flame formed by hydrogen and oxygen, the device surface is melted to achieve the healing of defects on the device surface and achieve a polishing effect. The polishing time is determined according to the actual polishing needs. For example, as an example, the polishing time can be 5 minutes to 10 minutes, and specifically, the etching can be 8 minutes.

[0053] 105: After the surface defects of the device are eliminated, stop introducing hydrogen and oxygen, close all gas lines, and complete polishing.

[0054] In this embodiment, when polishing, oxygen is introduced into the first layer oxygen pores 3 and the second layer oxygen pores 5, and hydrogen is introduced into the first layer hydrogen pores 4 and the second layer hydrogen pores 6, and flames are ignited to preheat the device; then, a mixed gas of fluoride and oxygen is introduced into the central feed hole 2, and the flow rate of hydrogen and oxygen is increased to remove impurities and polish the device. Fluoride has a strong oxidizing property and can react with impurities on the surface of the device, such as reacting with metal impurities to generate gaseous fluoride that is carried away by the airflow. In the high temperature environment of the flame, fluoride will also decompose fluorine gas. Silicon atoms on the surface of the device, such as the optical fiber preform, react with fluorine gas to generate volatile SiF4. A very thin layer is etched off the surface of the optical fiber preform, and impurities and defects on the surface are also taken away. After the impurities are completely eliminated, the fluoride gas is turned off, and the surface of the device is polished with a large flow of hydrogen and oxygen flame to eliminate microscopic defects on the surface of the device.

[0055] It can be seen that the blowtorch provided in the present application can effectively eliminate surface defects and impurities of the device, including bright spots, pits, convex spots, scratches caused by the core rod, optical fiber preform rod or sleeve rod during the preparation, storage and transportation, as well as impurity particles formed on the surface of the core rod, optical fiber preform rod or sleeve rod during the manufacturing process, pollutants adsorbed when exposed to the air, and metal impurities, particles, inorganic impurities and organic impurities adsorbed on the surface during the turnover process, thereby avoiding the formation of air lines, bright spots, bubbles, crystallization, etc. at the interface of the core rod, optical fiber preform rod or sleeve rod, thereby preparing high-quality optical fiber preform rods.

[0056] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0057] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0058] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A blowtorch for polishing the surface of a device, characterized in that: The invention comprises a polishing lamp holder (1), wherein the polishing lamp holder (1) has a central supply hole (2) and an annular flame hole surrounding the outer side of the central supply hole (2); the central supply hole (2) is opened at the center of the polishing lamp holder (1) and is used to pass a mixed gas of fluoride and oxygen to etch the surface of the device; The annular flame holes include a first layer of flame holes and a second layer of flame holes distributed sequentially from the inside to the outside; The first layer of flame pores comprises a first layer of oxygen pores (3) and a first layer of hydrogen pores (4) which are sequentially distributed from the inside to the outside; The second layer of flame pores comprises a second layer of oxygen pores (5) and a second layer of hydrogen pores (6) which are sequentially distributed from the inside to the outside.

2. The burner for polishing a device surface as claimed in claim 1, characterized in that: A third layer of annular oxygen holes (7) are also provided outside the annular flame hole.

3. The blowtorch for device surface polishing according to claim 1, characterized in that: The gas flow rates in the central feed hole (2), the first layer of oxygen pores (3), the first layer of hydrogen pores (4), the second layer of oxygen pores (5) and the second layer of hydrogen pores (6) gradually decrease.

4. The blowtorch for device surface polishing according to claim 1, characterized in that: The fluoride is one or more of oxygen difluoride, carbon tetrafluoride, trifluoromethane, and sulfur hexafluoride; And / or, the device includes at least one of a core rod, an optical fiber preform rod, a sleeve rod, and a high-purity quartz optical device.

5. A polishing device, characterized in that: It comprises the blowtorch for polishing the surface of a device as claimed in any one of claims 1 to 4.

6. A method for polishing a device surface, characterized in that: It includes the following steps: Providing a blowtorch for device surface polishing as claimed in any one of claims 1 to 4; Passing hydrogen and oxygen into the annular flame hole and igniting to preheat the device surface; A mixed gas of fluoride and oxygen is introduced into the central feed hole (2), and the flow rates of hydrogen and oxygen in the annular flame hole are increased to etch the surface of the device; After the impurities on the device surface are eliminated, the introduction of the mixed gas of fluoride and oxygen is stopped, and the flow rates of hydrogen and oxygen in the annular flame hole are increased to polish the device surface; After the surface defects of the device are eliminated, stop introducing hydrogen and oxygen.

7. The method for polishing a device surface as claimed in claim 6, characterized in that: The preheating time is 5min to 10min.

8. The method for polishing a device surface as claimed in claim 6, characterized in that: The etching time is 20min to 30min.

9. The method for polishing a device surface as claimed in claim 6, characterized in that: The polishing time is 5min to 10min.

10. The method for polishing a device surface as claimed in claim 6, characterized in that: Device surface defects include one or more of bright spots, protrusions, pits, scratches, bubbles, and air lines; And / or, the impurities on the device surface include one or more of metal particles, dust, and crystallization.

Images