Circuit liquid cooling radiator

Abstract

The application discloses a circuit liquid cooling radiator, and relates to the technical field of circuit and electric appliance water cooling structures, which comprises a water passing unit and a sealing unit. The water passing unit comprises a heat dissipation module, a water inlet module, and a communication module. The water inlet module is sealingly connected to one end of the heat dissipation module. The communication module is sealingly connected to the other end of the heat dissipation module and is arranged opposite to the water inlet module. The sealing unit comprises two sealing cover plates. The two sealing cover plates are respectively sealingly arranged on the upper end surface and the lower end surface of the water passing unit. Circuit devices can be mounted on the sealing cover plates. A liquid flow channel is formed on the water passing unit. The sealing cover plates are used for isolating the cooling liquid in the liquid flow channel from the circuit devices. The circuit liquid cooling radiator can improve the effective water cooling area ratio and can be used for cooling more circuit devices at the same time.

Description

Technical Field

[0001] This invention relates to the field of circuit and electrical appliance water-cooling structure technology, and in particular to a circuit liquid-cooled radiator. Background Technology

[0002] Generally, liquid cooling is primarily used for heat dissipation of high-power components (such as IGBTs and GTOs) in converters. A typical liquid cooler structure includes an inlet, outlet, cover plate, and base plate; the base plate has fins; the cover plate and base plate are welded together to form a flow channel, where coolant flows and carries away heat. IGBTs and other components are mounted on the upper surface of the cover plate. With advancements in engineering technology, the size requirements for power modules within converters are becoming increasingly smaller. This necessitates the placement of IGBTs and other components on both sides of the liquid cooling plate, increasing power density and heat dissipation while minimizing the size of the power modules. To achieve this, current double-sided liquid coolers employ a single-layer parallel flow channel, primarily consisting of a main flow channel for heat dissipation and side flow channels for water inlet and outlet. In this flow channel layout, the side flow channels occupy more space, reducing the effective cooling area of ​​the water-cooled plate. Summary of the Invention

[0003] The purpose of this invention is to provide a circuit liquid cooling radiator that can improve the effective water cooling area ratio and can be used to cool more circuit devices at the same time.

[0004] The above-mentioned objectives of the present invention can be achieved by the following technical solutions:

[0005] This invention provides a liquid-cooled heat sink for circuits, comprising a water-circulating unit and a sealing unit, wherein the water-circulating unit includes:

[0006] Heat dissipation module;

[0007] The water inlet module is sealed and connected to one end of the heat dissipation module;

[0008] A connecting module is sealed and connected to the other end of the heat dissipation module, and is positioned opposite to the water inlet module;

[0009] The sealing unit includes:

[0010] Two sealing covers are respectively provided to seal the upper and lower end faces of the water supply unit, and circuit devices can be installed on the sealing covers.

[0011] The water-passing unit has a liquid flow channel, and the sealing cover is used to isolate the coolant in the liquid flow channel from the circuit devices.

[0012] In a preferred embodiment, the heat dissipation module includes a heat dissipation plate, a first isolation portion is formed by extending outward from the middle of the upper end face of the heat dissipation plate, and a second isolation portion is formed by extending outward from the middle of the lower end face of the heat dissipation plate. The first isolation portion and the second isolation portion are disposed opposite to each other and have the same height. The first isolation portion and the second isolation portion enable the heat dissipation plate to form a first heat dissipation portion and a second heat dissipation portion.

[0013] The heat sink has multiple through holes arranged in parallel inside. The length direction of the through holes is consistent with the length direction of the first isolation part. The multiple through holes located in the first heat sink part together form a first cooling channel, and the multiple through holes located in the second heat sink part together form a second cooling channel.

[0014] In a preferred embodiment, one edge of the heat sink extends upward and downward to form a first sealing portion, and the other edge of the heat sink extends upward and downward to form a second sealing portion. Both the first sealing portion and the second sealing portion are arranged parallel to the first insulating portion.

[0015] A third cooling channel is formed between the first insulating part and the first sealing part, and a fourth cooling channel is formed between the first insulating part and the second sealing part. The third cooling channel and the fourth cooling channel are isolated from each other.

[0016] A fifth cooling channel is formed between the second insulating part and the first sealing part, and a sixth cooling channel is formed between the second insulating part and the second sealing part. The fifth cooling channel and the sixth cooling channel are isolated from each other.

[0017] In a preferred embodiment, the heat dissipation module includes a plurality of heat dissipation fins, which are evenly distributed on the heat dissipation plate within the third cooling channel, the fourth cooling channel, the fifth cooling channel, and the sixth cooling channel.

[0018] In a preferred embodiment, the water inlet module includes:

[0019] A water inlet substrate, which is sealed to the heat dissipation plate through the first sealing part and the second sealing part;

[0020] A first partition plate is disposed between the water inlet substrate and the heat dissipation plate, wherein the upper end surface of the first partition plate is flush with the upper end surface of the heat dissipation plate.

[0021] A second partition plate is disposed between the water inlet substrate and the heat dissipation plate, and the lower end surface of the second partition plate is flush with the lower end surface of the heat dissipation plate.

[0022] A first water flow channel is formed between the first partition plate and the second partition plate, and the first water flow channel is simultaneously connected to the first cooling channel and the second cooling channel; a second water flow channel is formed at the upper end of the first partition plate, and the second water flow channel is simultaneously connected to the third cooling channel and the fourth cooling channel; a third water flow channel is formed at the lower end of the second partition plate, and the third water flow channel is simultaneously connected to the fifth cooling channel and the sixth cooling channel.

[0023] In a preferred embodiment, a first water passage hole and a second water passage hole are formed on the water inlet substrate, which are arranged opposite to each other. The first water passage hole is connected to the first water passage channel, and the second water passage hole is connected to both the second water passage channel and the third water passage channel.

[0024] In a preferred embodiment, the connecting module includes a connecting member, with connecting portions extending inward from both sides of the connecting member and an isolation portion extending inward from the middle of the connecting member. The connecting member is sealed to the heat sink plate through the connecting portions, the first sealing portion, and the second sealing portion. Two isolated connecting spaces are formed between the isolation portion and the connecting portions on both sides. The first cooling channel is connected to the third cooling channel and the fifth cooling channel through one of the connecting spaces, and the second cooling channel is connected to the fourth cooling channel and the sixth cooling channel through the other connecting space.

[0025] In a preferred embodiment, the upper end face of the water inlet substrate, the upper end face of the first sealing part, the upper end face of the second sealing part, the upper end face of the first isolation part, and the upper end face of the connecting member are all flush with each other. The lower end face of the water inlet substrate, the lower end face of the first sealing part, the lower end face of the second sealing part, the lower end face of the second isolation part, and the lower end face of the connecting member are all flush with each other, so that the two sealing covers can respectively seal and cover the upper and lower end faces of the water supply unit.

[0026] In a preferred embodiment, the heights of the heat dissipation fins, the first isolation portion, and the second isolation portion are all equal, so that the sealing cover can contact the heat dissipation fins.

[0027] In a preferred embodiment, the water supply unit further includes two water supply valves, which are respectively disposed on the first water supply hole and the second water supply hole.

[0028] The features and advantages of this invention are:

[0029] The circuit liquid cooling radiator provided by this invention forms multiple water inlet channels inside the heat dissipation module, allowing the entire surface area of ​​the heat dissipation module to be used for heat dissipation without needing to allocate additional space for the water inlet channels, thereby increasing the effective heat dissipation surface area. In addition, cooling channels are formed on both end faces of the heat dissipation module, enabling both sides of the heat dissipation module to provide effective heat dissipation for multiple circuit components simultaneously, further improving the heat dissipation efficiency of the circuit liquid cooling radiator, and improving the compactness of the circuit component structure, saving internal space of the electrical appliance. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 The diagram shown is a schematic of the assembly structure of the circuit liquid cooling heat sink of the present invention.

[0032] Figure 2 The diagram shown is a schematic representation of the overall structure of the liquid-cooled heat sink of the present invention.

[0033] Figure 3 The diagram shown is a schematic of the internal structure of the circuit liquid-cooled heat sink of the present invention.

[0034] Figure 4 The diagram shown is a schematic of the heat dissipation module structure of the circuit liquid cooling heat sink of the present invention.

[0035] Figure 5 The diagram shown is a schematic of the water inlet module structure of the circuit liquid cooling heat sink of the present invention. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The terms "installed," "connected," and "connected" should be interpreted broadly. For example, it can be a mechanical connection or an electrical connection, or it can be a connection within two elements. It can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0037] Please refer to the following: Figures 1 to 3 As shown, the present invention provides a circuit liquid cooling radiator, including a water-passing unit 1 and a sealing unit 2. The water-passing unit 1 includes: a heat dissipation module 11; a water inlet module 12, which is sealed and connected to one end of the heat dissipation module 11; and a connecting module 13, which is sealed and connected to the other end of the heat dissipation module 11 and is disposed opposite to the water inlet module 12. The sealing unit 2 includes: two sealing cover plates 21, which are respectively sealed and covered on the upper end face and the lower end face of the water-passing unit 1. Circuit device A can be installed on the sealing cover plate 21. The water-passing unit 1 has a liquid flow channel, and the sealing cover plate 21 is used to isolate the coolant in the liquid flow channel from the circuit device A.

[0038] To further illustrate the specific structure of the circuit liquid-cooled heat sink according to the embodiments of the present invention, its specific structure, connection relationship, and size limitations are further described below, wherein:

[0039] Please see Figure 4As shown, in a preferred embodiment, the heat dissipation module 11 includes a heat dissipation plate 111. A first isolation portion 112 is formed by extending outward from the middle of the upper end face of the heat dissipation plate 111, and a second isolation portion 113 is formed by extending outward from the middle of the lower end face of the heat dissipation plate 111. The first isolation portion 112 and the second isolation portion 113 are arranged opposite to each other and have the same height. The first isolation portion 112 and the second isolation portion 113 enable the heat dissipation plate 111 to form a first heat dissipation portion 111a and a second heat dissipation portion 111b. A plurality of through holes 114 are formed inside the heat dissipation plate 111. The length direction of the through holes 114 is consistent with the length direction of the first isolation portion 112. The plurality of through holes 114 located in the first heat dissipation portion 111a together form a first cooling channel 114a, and the plurality of through holes 114 located in the second heat dissipation portion 111b together form a second cooling channel 114b.

[0040] In a preferred embodiment, one edge of the heat sink 111 extends upward and downward to form a first sealing portion 115, and the other edge of the heat sink 111 extends upward and downward to form a second sealing portion 116. Both the first sealing portion 115 and the second sealing portion 116 are arranged parallel to the first insulating portion 112. A third cooling channel 117a is formed between the first insulating portion 112 and the first sealing portion 115, and a fourth cooling channel 117b is formed between the first insulating portion 112 and the second sealing portion 116. The third cooling channel 117a and the fourth cooling channel 117b are isolated from each other. A fifth cooling channel 118a is formed between the second insulating portion 113 and the first sealing portion 115, and a sixth cooling channel 118b is formed between the second insulating portion 113 and the second sealing portion 116. The fifth cooling channel 118a and the sixth cooling channel 118b are isolated from each other.

[0041] In a preferred embodiment, the heat dissipation module 11 includes a plurality of heat dissipation fins 119, which are evenly distributed on the heat dissipation plate 111 within the third cooling channel 117a, the fourth cooling channel 117b, the fifth cooling channel 118a, and the sixth cooling channel 118b.

[0042] Please refer to the following: Figure 3 and Figure 5As shown, in a preferred embodiment, the water inlet module 12 includes: a water inlet base 121, which is sealed to the heat sink 111 via a first sealing part 115 and a second sealing part 116; a first partition plate 122, disposed between the water inlet base 121 and the heat sink 111, with its upper end face flush with the upper end face of the heat sink 111; and a second partition plate 123, disposed between the water inlet base 121 and the heat sink 111, with its lower end face flush with the lower end face of the heat sink 111; wherein, the first partition plate 123... A first water flow channel 124a is formed between the first partition plate 122 and the second partition plate 123. The first water flow channel 124a is connected to both the first cooling channel 114a and the second cooling channel 114b. A second water flow channel 124b is formed at the upper end of the first partition plate 122. The second water flow channel 124b is connected to both the third cooling channel 117a and the fourth cooling channel 117b. A third water flow channel 124c is formed at the lower end of the second partition plate 123. The third water flow channel 124c is connected to both the fifth cooling channel 118a and the sixth cooling channel 118b.

[0043] In a preferred embodiment, a first water passage 125a and a second water passage 125b are formed on the water inlet substrate 121. The first water passage 125a is connected to the first water passage 124a, and the second water passage 125b is connected to both the second water passage 124b and the third water passage 124c.

[0044] Please see Figure 3 As shown, in a preferred embodiment, the connecting module 13 includes a connecting member 131. The two sides of the connecting member 131 extend inward to form connecting portions 132, and the middle of the connecting member 131 extends inward to form an isolation portion 133. The connecting member 131 is sealed and connected to the heat sink 111 through the connecting portions 132, the first sealing portion 115, and the second sealing portion 116. The isolation portion 133 and the connecting portions 132 on both sides form two isolated connecting spaces 134. The first cooling channel 114a is connected to the third cooling channel 117a and the fifth cooling channel 118a through one connecting space 134, and the second cooling channel 114b is connected to the fourth cooling channel 117b and the sixth cooling channel 118b through the other connecting space 134.

[0045] In a preferred embodiment, the upper end face of the water inlet base 121, the upper end face of the first sealing part 115, the upper end face of the second sealing part 116, the upper end face of the first isolation part 112, and the upper end face of the connecting member 131 are all flush with each other, and the lower end face of the water inlet base 121, the lower end face of the first sealing part 115, the lower end face of the second sealing part 116, the lower end face of the second isolation part 113, and the lower end face of the connecting member 131 are all flush with each other, so that the two sealing cover plates 21 can respectively seal and cover the upper end face and the lower end face of the water supply unit 1.

[0046] In a preferred embodiment, the heights of the heat dissipation fins 119, the first insulating portion 112, and the second insulating portion 113 are all equal, so that the sealing cover 21 can contact the heat dissipation fins 119.

[0047] In a preferred embodiment, the water supply unit 1 further includes two water supply valves 14, which are respectively disposed on the first water supply hole 125a and the second water supply hole 125b.

[0048] Based on the above structural description, the circuit liquid-cooled heat sink of the present invention has the following beneficial effects:

[0049] The circuit liquid cooling radiator provided in this embodiment of the invention forms multiple water inlet channels inside the heat dissipation module 11, allowing the entire surface area of ​​the heat dissipation module 11 to be used for heat dissipation without needing to allocate additional space for the water inlet channels, thereby increasing the effective heat dissipation surface area. In addition, cooling channels are formed on both end faces of the heat dissipation module 11, so that both sides of the heat dissipation module 11 can simultaneously provide effective heat dissipation for multiple circuit components, further improving the heat dissipation efficiency of the circuit liquid cooling radiator, and improving the compactness of the circuit component structure, saving internal space of the electrical appliance.

[0050] The above are merely embodiments of the present invention. Those skilled in the art can make various modifications or variations to the embodiments of the present invention based on the content disclosed in the application documents without departing from the spirit and scope of the present invention. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

Claims

1. A liquid-cooled heat sink for circuits, characterized in that, It includes a water-passing unit and a sealing unit, wherein the water-passing unit includes: Heat dissipation module; The water inlet module is sealed and connected to one end of the heat dissipation module; A connecting module is sealed and connected to the other end of the heat dissipation module, and is positioned opposite to the water inlet module; The sealing unit includes: Two sealing covers are respectively provided to seal the upper and lower end faces of the water supply unit, and circuit devices can be installed on the sealing covers. The water-passing unit has a liquid flow channel, and the sealing cover is used to isolate the coolant in the liquid flow channel from the circuit components. The heat dissipation module includes a heat dissipation plate. A first isolation portion extends outward from the middle of the upper end face of the heat dissipation plate, and a second isolation portion extends outward from the middle of the lower end face of the heat dissipation plate. The first isolation portion and the second isolation portion are arranged opposite to each other and have the same height. The first isolation portion and the second isolation portion enable the heat dissipation plate to form a first heat dissipation portion and a second heat dissipation portion. The interior of the heat dissipation plate has a plurality of parallel through holes. The length direction of the through holes is consistent with the length direction of the first isolation portion. The plurality of through holes located in the first heat dissipation portion together form a first cooling flow channel. The multiple through holes in the second heat dissipation section together form a second cooling channel; one side edge of the heat dissipation plate extends upward and downward to form a first sealing section, and the other side edge of the heat dissipation plate extends upward and downward to form a second sealing section. The first sealing section and the second sealing section are both arranged parallel to the first isolation section; a third cooling channel is formed between the first isolation section and the first sealing section, and a fourth cooling channel is formed between the first isolation section and the second sealing section. The third cooling channel and the fourth cooling channel are isolated from each other; a fifth cooling channel is formed between the second isolation section and the first sealing section, and a sixth cooling channel is formed between the second isolation section and the second sealing section. The fifth cooling channel and the sixth cooling channel are isolated from each other. The first cooling channel is connected to the third and fifth cooling channels, and the second cooling channel is connected to the fourth and sixth cooling channels; The water inlet module includes: a water inlet base, which is sealed to the heat dissipation plate through a first sealing part and a second sealing part; a first partition plate, disposed between the water inlet base and the heat dissipation plate, with the upper end face of the first partition plate flush with the upper end face of the heat dissipation plate; and a second partition plate, disposed between the water inlet base and the heat dissipation plate, with the lower end face of the second partition plate flush with the lower end face of the heat dissipation plate. A first water flow channel is formed between the first partition plate and the second partition plate, and the first water flow channel is simultaneously connected to the first cooling channel and the second cooling channel; a second water flow channel is formed at the upper end of the first partition plate, and the second water flow channel is simultaneously connected to the third cooling channel and the fourth cooling channel; a third water flow channel is formed at the lower end of the second partition plate, and the third water flow channel is simultaneously connected to the fifth cooling channel and the sixth cooling channel; a first water flow hole and a second water flow hole are formed on the water inlet substrate, which are arranged opposite to each other, the first water flow hole is connected to the first water flow channel, and the second water flow hole is simultaneously connected to the second water flow channel and the third water flow channel.

2. The circuit liquid-cooled heat sink as described in claim 1, characterized in that, The heat dissipation module includes multiple heat dissipation fins, which are evenly distributed on the heat dissipation plates within the third, fourth, fifth, and sixth cooling channels.

3. The circuit liquid-cooled heat sink as described in claim 1, characterized in that, The connecting module includes a connecting member, with two sides of the connecting member extending inward to form connecting portions, and the middle of the connecting member extending inward to form an isolation portion. The connecting member is sealed to the heat sink plate through the connecting portions, the first sealing portion, and the second sealing portion. Two isolated connecting spaces are formed between the isolation portion and the connecting portions on both sides. The first cooling channel is connected to the third cooling channel and the fifth cooling channel through one of the connecting spaces, and the second cooling channel is connected to the fourth cooling channel and the sixth cooling channel through the other connecting space.

4. The circuit liquid-cooled heat sink as described in claim 3, characterized in that, The upper end face of the water inlet base, the upper end face of the first sealing part, the upper end face of the second sealing part, the upper end face of the first isolation part, and the upper end face of the connecting member are all flush with each other. The lower end face of the water inlet base, the lower end face of the first sealing part, the lower end face of the second sealing part, the lower end face of the second isolation part, and the lower end face of the connecting member are all flush with each other, so that the two sealing covers can respectively seal and cover the upper and lower end faces of the water supply unit.

5. The circuit liquid-cooled heat sink as described in claim 2, characterized in that, The heights of the heat dissipation fins, the first isolation portion, and the second isolation portion are all equal, so that the sealing cover can contact the heat dissipation fins.

6. The circuit liquid-cooled heat sink as described in claim 5, characterized in that, The water supply unit also includes two water valves, which are respectively installed on the first water inlet and the second water inlet.

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