A high temperature resistant adhesive tape, preparation method thereof and application thereof

Abstract

The present invention belongs to the technical field of electronic component processing, and discloses a high temperature resistant adhesive tape, a preparation method thereof and its application. The high temperature resistant adhesive tape of the present invention comprises a substrate, an adhesive layer and a release film; the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent. When processing electronic components with microstructured surfaces, the high temperature resistant adhesive tape of the present invention protects the microstructured surface by regulating the thickness of the adhesive layer, effectively protects the parts that do not need to be processed, and protects the electronic components from contamination from processes such as powder spraying and powder pressing. The adhesive tape of the present invention has stable performance and can be directly torn off after use without residual adhesive, and does not affect the subsequent processes and applications of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component processing, and in particular to a high temperature resistant adhesive tape, a preparation method thereof and application thereof. Background Art

[0002] In the electronic and electrical industry, especially for chips, electrodes, lithium batteries and other components, the surface of electronic components often needs to be sprayed, powdered, etched, electroplated and other processes. In the process of metal powder pressing, there are concave and convex surfaces between the copper wire and the inductor components of integrated inductors and chip inductors. During these process treatments, other parts need to be shielded and protected to prevent contamination. At present, tape is mostly die-cut into different shapes and pasted on the parts that do not need to be processed to achieve the purpose of protection.

[0003] With the development of science and technology, many electronic components have many microstructures on their surfaces, such as grooves / bumps of a certain size. However, the adhesive layer of existing tapes is relatively thin and can only be applied to flat surfaces. The surface height of electronic components even varies far beyond the thickness of the adhesive layer, so adhesive tape cannot protect the surface. At the same time, in the metal powder pressing process of integrated inductors, chip inductors and other components, as well as the process of electronic component spraying, powder coating, etching, electroplating and other processes, high temperatures are often involved, and the temperature can even reach above 200°C. Moreover, according to process requirements, after the high-temperature treatment of spraying, powder coating, etching, electroplating, pressing and other processes is completed, the adhesive tape needs to be removed from the surface of the component, and no residual adhesive can be left on the surface of the electronic component. This requires the adhesive layer to have good high-temperature resistance and no residue after removal. However, the high-temperature resistance of common adhesives still needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high temperature resistant adhesive tape, a preparation method thereof and an application thereof.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] In a first aspect, the present invention provides a high temperature resistant tape, comprising a substrate, an adhesive layer and a release film; the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0007] When electronic components with microstructured surfaces, or chips, electrodes, lithium battery modules, and other electronic components with grooves / protrusions of a certain size are processed (such as spraying, powder spraying, etching, electroplating, metal powder pressing, etc.), the high temperature resistant tape of the present invention protects the microstructured surface by regulating the thickness of the adhesive layer, effectively protecting the parts that do not need to be processed, preventing the powder from entering through the gap between the adhesive layer and the component surface, and protecting the electronic components from contamination during the powder spraying process. At the same time, the high temperature resistant tape of the present invention has good high temperature resistance, a high solid content, a temperature resistance of more than 330°C, and a short-term temperature resistance of up to 360°C. The tape of the present invention has stable performance and can be directly torn off after use without residual glue, and does not affect the subsequent process and application of the device.

[0008] As a preferred embodiment of the high temperature resistant tape described in the present invention, the substrate is at least one of polypropylene, polyethylene, polyvinyl chloride, styrene-butadiene-acrylonitrile copolymer, polyimide, polyester, polycarbonate, polymethyl methacrylate, polyetheretherketone, polyphenylene sulfide, polyethersulfone, copper foil, and aluminum foil.

[0009] As a preferred embodiment of the high temperature resistant adhesive tape described in the present invention, the adhesive layer includes the following preparation raw materials, measured by weight: 10 to 40 parts of base resin, 10 to 40 parts of tackifying resin, 0.5 to 2.5 parts of cross-linking agent, 0.01 to 2 parts of catalyst, 0.1 to 4 parts of stabilizer, 0.01 to 3 parts of adhesion promoter and 1 to 40 parts of solvent.

[0010] Preferably, the adhesive layer comprises the following raw materials, measured by weight: 11 to 36 parts of base resin, 14 to 39 parts of tackifying resin, 0.6 to 2.3 parts of cross-linking agent, 0.02 to 0.3 parts of catalyst, 0.1 to 3.2 parts of stabilizer, 0.06 to 2.2 parts of adhesion promoter and 5 to 20 parts of solvent.

[0011] As a preferred embodiment of the high temperature resistant adhesive tape of the present invention, the mass ratio of the base resin to the tackifying resin is 1:(0.3-4); and the solid content of the adhesive layer is ≥70%.

[0012] The adhesive thickness of the adhesive tape of the present invention can be adjusted within a relatively large range according to needs, and the adhesive thickness can reach 5 μm-1000 μm, so as to adapt to the microstructure differences on the surfaces of different devices and achieve full protection.

[0013] As a preferred embodiment of the high temperature resistant tape described in the present invention, the base resin is at least one of polyimide, epoxy resin, silicone resin, acrylic acid, polyurethane, and rubber; the tackifying resin is at least one of octylphenol formaldehyde tackifying resin, silsesquioxane tackifying resin, MQ silicone resin tackifying resin, tert-butylphenol formaldehyde tackifying resin, esterified rosin tackifying resin, terpene phenolic resin tackifying resin, and cage-type siloxane tackifying resin.

[0014] Preferably, the tackifying resin is: a mixture of one or more of primary cyclic siloxane molecules, mainly including but not limited to hexamethylcyclotrisiloxane (D3), octamethylcyclotetrasiloxane (D4), decamethylcyclopentasiloxane (D5), dodecamethylcyclohexasiloxane (D6), etc., which are hydrolyzed and reacted with but not limited to 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, A cage-type siloxane tackifying resin containing a high amount of vinyl side chains is prepared by reacting tetramethyltetravinylcyclotetrasiloxane, 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasilazane, 1,3,5,7,9,11,13,15-octavinylpentacyclo[9.5.1.13,9.15,15.17,13]octasiloxane, 1,3-divinyltetramethyldisiloxane, trinorbornene isobutyl cage-type silsesquioxane, etc.

[0015] As a preferred embodiment of the high temperature resistant tape described in the present invention, the cross-linking agent is at least one of dibenzoyl peroxide, 2,5-dimethyl-2,5-bis(tert-butyl peroxide)hexane, divinylbenzene, diisocyanate, N,N-methylenebisacrylamide, diisopropylbenzene peroxide, diethylenetriamine, vinyltriethoxysilane, hydrogen-containing silicone oil, ethyl orthosilicate, methyl orthosilicate, trimethoxysilane, aluminum isopropoxide, zinc acetate, and titanium acetylacetonate.

[0016] As a preferred embodiment of the high temperature resistant adhesive tape described in the present invention, the catalyst is at least one of dibutyltin dilaurate, an organic zinc catalyst, a platinum catalyst, an organic aluminum catalyst, an organic titanium catalyst, and an organic bismuth catalyst; the stabilizer is at least one of an organic chromium-free passivator, pyridine, N-phenyl-β-naphthylamine, phenothiazine, dinitrobenzene, trinitrotoluene, picric acid, naphthoquinone, 1,4-benzoquinone, phenanthrenequinone, hydroquinone, tert-butylcatechol, and pyrogallol; the adhesion promoter is at least one of Chemlock 220, a silane coupling agent, a titanate coupling agent, and a phosphate ester; the solvent is at least one of methanol, ethyl acetate, ethanol, toluene, xylene, butanone, acetone, DMF, NMP, tetrachloroethylene, chloroform, white oil, n-hexane cyclohexane, kerosene, petroleum ether, and benzene.

[0017] In a second aspect, the present invention provides a method for preparing the high temperature resistant adhesive tape, comprising the following steps:

[0018] (1) taking the raw materials for preparing the adhesive layer, stirring them uniformly at 400 rpm to 800 rpm for 10 min to 20 min to obtain adhesive layer glue;

[0019] (2) Take the obtained adhesive layer glue, apply it to the substrate until the thickness of the adhesive layer is 5 μm to 1000 μm (preferably, the thickness is 50 μm to 550 μm; more preferably, the thickness is 250 μm to 550 μm); and attach the release film to the substrate.

[0020] In a third aspect, the present invention applies the high temperature resistant adhesive tape and the preparation method to the processing of electronic components.

[0021] As a preferred embodiment of the application of the present invention, the processing includes spraying, powder spraying, etching, electroplating and metal powder pressing.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The present invention protects the microstructured surface by regulating the thickness of the adhesive layer during the processing (such as spraying, powder spraying, etching, electroplating, metal powder pressing, etc.) of electronic components with microstructured surfaces, or chips, electrodes, lithium battery modules, integrated inductors, and chip inductor molding with grooves / protrusions of a certain size, effectively protecting the parts that do not need to be processed, preventing powder from entering through the gap between the adhesive layer and the component surface, and protecting the electronic components from contamination during the powder spraying process. At the same time, the high-temperature resistant tape of the present invention has good high temperature resistance, and the temperature resistance can reach above 330°C, and the short-term temperature resistance can reach 360°C; the tape of the present invention has stable performance, can be directly torn off after use, and does not leave residual glue, and does not affect the subsequent process and application of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the use of high temperature resistant tape. DETAILED DESCRIPTION

[0025] To better illustrate the purpose, technical solutions and advantages of the present invention, the present invention will be further described below in conjunction with specific embodiments. It should be understood by those skilled in the art that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] Unless otherwise specified, the test methods used in the examples are all conventional methods; the materials and reagents used, unless otherwise specified, can all be obtained from commercial sources. The organic silicone resin involved was purchased from Dow DOWSIL 7 series adhesive base polymer; the platinum catalyst was purchased from Dow Corning's RD or DC series; the organic titanium catalyst was purchased from DuPont Series; silane coupling agents were purchased from Union Carbide Company of the United States, A151, A171, and A172 series; hydrogen-containing silicone oil was purchased from Shin-Etsu Hydrogen-containing Silicone Oil KF series of Japan; phthalate coupling agents were purchased from Kenrich Petrochemical Company of the United States, KR series.

[0027] Example 1: A high temperature resistant tape

[0028] The high temperature resistant adhesive tape comprises a substrate, an adhesive layer and a release film, wherein the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0029] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0030] (1) Preparation of adhesive layer

[0031] Take 110g of organic silicone resin, 390g of cage-type siloxane tackifying resin, 6g of tetraethyl orthosilicate, 0.8g of platinum catalyst, 11g of p-tert-butyl catechol, 2.3g of butyl titanate, and 200g of ethyl acetate. After weighing the above materials, stir them evenly at 600rpm for 15min to obtain glue for the adhesive layer;

[0032] The preparation method of cage-type siloxane tackifying resin is as follows:

[0033] Add 344DMCg as solvent to a 500mL flask, start stirring, and add 37.3g of dodecamethylcyclohexasiloxane, 26.84g of 1,3,5,7,9,11,13,15-octavinylpentacyclo[9.5.1.13,9.15,15.17,13]octasiloxane and 0.25g of anhydrous aluminum trichloride catalyst in sequence. Add monomethyltrichlorosilane to the flask, adjust the drop rate of monomethyltrichlorosilane to 12 seconds / drop, control the reaction temperature at 70°C, and continuously pass nitrogen protection during the reaction. After the dropwise addition is completed, maintain the reaction temperature at 70°C, continue the reaction for 4 hours, transfer to a separating funnel and let stand for stratification, and take the upper layer product. Add carbonamide (urea) to neutralize to neutrality, wash the product with water, then wash it with methanol three times, and filter it to obtain a cage-type siloxane tackifier resin with a high content of vinyl side chains.

[0034] (2) Take the obtained adhesive layer glue, coat it on the polyimide substrate, the adhesive layer thickness is 250 μm, and stick it on the release film.

[0035] Example 2: A high temperature resistant tape

[0036] The high temperature resistant adhesive tape comprises a substrate, an adhesive layer and a release film, wherein the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0037] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0038] (1) Preparation of adhesive layer

[0039] Take 290g of organic silicone resin, 200g of cage-type siloxane tackifying resin, 9g of diisopropylbenzene peroxide, 2.4g of organic titanium catalyst, 4g of phenothiazine, 22g of silane coupling agent, and 150g of xylene. After weighing the above materials, stir them evenly at 400rpm for 20min to obtain glue for the adhesive layer;

[0040] The preparation method of cage-type siloxane tackifying resin is as follows:

[0041] In a 500 mL flask, add 68.4 g octamethylcyclotetrasiloxane, 18.7 g hexamethyldisiloxane, and 0.5 g solid acidic resin BF 3 / Al 2 O 3 As a catalyst, 300g DMC. Start stirring, heat to 80℃, and drop 27.6g 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane at a rate of 10 seconds / drop. Nitrogen protection is continuously passed during the reaction. After the addition is completed, the temperature is raised to 105℃ and the reaction is carried out for 8 hours. After the reaction is completed, the DMC non-polymerized low molecular weight is continuously removed at 150℃ and vacuum degree -0.098Mpa to obtain a cage-type siloxane tackifying resin with a high content of vinyl side chains.

[0042] (2) Take the obtained adhesive layer glue, apply it to the polyethylene terephthalate substrate, the adhesive layer thickness is 350 μm, and adhere to the release film.

[0043] Example 3: A high temperature resistant tape

[0044] The high temperature resistant adhesive tape comprises a substrate, an adhesive layer and a release film, wherein the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0045] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0046] (1) Preparation of adhesive layer

[0047] Take 250g of organic silicone resin, 250g of cage-type siloxane tackifying resin, 15g of vinyl triethoxysilane, 12g of dibutyltin dilaurate, 18g of p-tert-butyl catechol, 4g of butyl titanate, and 50g of butanone. After weighing the above materials, stir them evenly at 800rpm for 10min to obtain glue for the adhesive layer;

[0048] The preparation method of cage-type siloxane tackifying resin is as follows:

[0049] In a 1000 mL flask, add 420 g of deionized water and 0.12 g of tetrabutylammonium fluoride as a catalyst, stir at 300 rpm, and heat to 80° C. Add 18.86 g of dimethyltetrachlorodisilane and 27.83 g of dimethyldichlorosilane to form a mixed solution, and gradually add the mixed solution to deionized water at a rate of 12 mL / min for hydrolysis for 8 hours.

[0050] Prepare a 21% sodium carbonate aqueous solution, stir it, add the prepared sodium carbonate solution to the hydrolyzed liquid in batches, check the pH value of the reaction liquid, and stop adding when the reaction liquid is neutral. Continue stirring and reacting for 15 to 20 minutes, transfer to a separatory funnel and let stand to separate. Take the upper neutral hydrolyzed oil, add 8.32g 1,3-divinyltetramethyldisiloxane, 0.45g solid acidic resin H 2 SO 4 / TiO 2 The catalyst was used for rearrangement reaction at 180°C and vacuum degree -0.096MPa for 6 hours. The white precipitate was filtered and washed three times with a methanol / acetone (80:20) mixed solution, and dried to obtain a cage-type siloxane tackifying resin with a high content of vinyl side chains.

[0051] (2) Take the obtained adhesive layer glue, coat it on the polycarbonate substrate, the adhesive layer thickness is 550 μm, and stick it on the release film.

[0052] Example 4: A high temperature resistant tape

[0053] The high temperature resistant adhesive tape comprises a substrate, an adhesive layer and a release film, wherein the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0054] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0055] (1) Preparation of adhesive layer

[0056] Take 150g of organic silicone resin, 360g of cage-type siloxane tackifying resin prepared in Example 2, 16g of hydrogenated silicone oil, 0.2g of platinum catalyst, 32g of p-tert-butylcatechol, 14g of Chemlock 220, and 80g of toluene. After weighing the above materials, stir them evenly at 800rpm for 10min to obtain glue for the adhesive layer;

[0057] (2) Take the obtained adhesive layer glue, coat it on the aluminum foil substrate, the adhesive layer thickness is 500 μm, and stick it on the release film.

[0058] Example 5: A high temperature resistant tape

[0059] The high temperature resistant adhesive tape comprises a substrate, an adhesive layer and a release film, wherein the adhesive layer is between the substrate and the release film; the adhesive layer comprises the following preparation raw materials: a base resin, a tackifying resin, a cross-linking agent, a catalyst, a stabilizer, an adhesion promoter and a solvent.

[0060] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0061] (1) Preparation of adhesive layer

[0062] Take 360g of organic silicone resin, 140g of cage-type siloxane tackifying resin prepared in Example 2, 23g of methyl orthosilicate, 3g of platinum catalyst, 1g of hydroquinone, 0.6g of phthalate coupling agent, and 100g of DMF solvent. After weighing the above materials, stir them evenly at 800rpm for 10min to obtain glue for the adhesive layer;

[0063] (2) Take the obtained adhesive layer glue, coat it on the aluminum foil substrate, the adhesive layer thickness is 420 μm, and stick it on the release film.

[0064] Comparative Example 1: A high temperature resistant tape

[0065] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0066] (1) Preparation of adhesive layer

[0067] Take 390g of the cage-type siloxane tackifying resin prepared in Example 2, 6g of tetraethyl orthosilicate, 0.8g of platinum catalyst, 11g of p-tert-butyl catechol, 2.3g of butyl titanate, and 200g of ethyl acetate. After weighing the above materials, stir them evenly at 600rpm for 15min to obtain a glue layer glue;

[0068] (2) Take the obtained adhesive layer glue, coat it on the polyimide substrate, the thickness of the adhesive layer is 350 μm, and attach a release film to it.

[0069] Comparative Example 2: A high temperature resistant tape

[0070] The preparation method of the high temperature resistant adhesive tape is specifically as follows:

[0071] (1) Preparation of adhesive layer

[0072] Take 110g of silicone resin, 6g of tetraethyl orthosilicate, 0.8g of platinum catalyst, 11g of p-tert-butyl catechol, 2.3g of butyl titanate, and 200g of ethyl acetate. After weighing the above materials, stir them evenly at 600rpm for 15min to obtain glue for the adhesive layer;

[0073] (2) Take the obtained adhesive layer glue, coat it on the polyimide substrate, the adhesive layer thickness is 60 μm, and stick it on the release film.

[0074] Comparative Example 3: A high temperature resistant tape

[0075] The difference from Example 1 is that:

[0076] In the preparation method of the high temperature resistant adhesive tape, 30 g of cage-type siloxane tackifying resin is used.

[0077] Comparative Example 4: A high temperature resistant tape

[0078] The difference from Example 1 is that:

[0079] In the preparation method of the high temperature resistant adhesive tape, 700 g of cage-type siloxane tackifying resin is used.

[0080] Comparative Example 5: A high temperature resistant tape

[0081] The difference from Example 1 is that:

[0082] In the adhesive layer, high viscosity organic silicone adhesive resin (Dow Corning 7657) is used to replace cage-type siloxane tackifying resin and organic silicone resin.

[0083] The preparation method of the adhesive layer is as follows: 110 g of high-viscosity organic silicone adhesive resin, 6 g of tetraethyl orthosilicate, 0.8 g of platinum catalyst, 11 g of p-tert-butyl catechol, 2.3 g of butyl titanate, and 200 g of ethyl acetate are taken. After weighing the above materials, stir them evenly at 600 rpm for 15 minutes.

[0084] Test example:

[0085] The high temperature resistant adhesive tapes prepared in Examples 1 to 6 and Comparative Examples 1 to 5 were taken and their adhesive layer solid content, thickness, peeling force and high temperature resistance were tested respectively.

[0086] The solid content is tested using GB1725-1979 "Determination of Solid Content of Coatings";

[0087] The thickness of the adhesive layer is tested according to GBT 7125-2014 "Test method for thickness of adhesive tape";

[0088] The peeling force is tested according to the national standard GB / T 2792-2014 "180° peel strength test method standard".

[0089] High temperature resistance is tested by attaching the tape to a standard stainless steel test plate, baking it at a set temperature for 24 hours, and then cooling it down to test the peeling force according to the national standard GB / T 2792-2014 "180° Peel Strength Test Method Standard", and recording the temperature at which the peeling force decreases by less than 5%.

[0090] Short-term high temperature resistance test: stick the tape on a standard stainless steel test plate at a set temperature for 5 seconds, and then test the peeling force according to the national standard GB / T 2792-2014 "180° Peel Strength Test Method Standard" after cooling, and record the temperature when the peeling force decreases by less than 5%.

[0091] Residual adhesive performance test: stick the tape on the surface of a steel plate with a surface roughness of level 1 (Ra=100), and heat press for 10 minutes at a temperature of 180°C and a pressure of 2.5MPa. After cooling, remove the tape and observe the surface of the steel plate with a microscope to see if there is any residual adhesive film.

[0092] The test results are shown in Table 1.

[0093] Table 1 Performance test results

[0094] Test items Solid content Glue layer hardness Glue layer thickness 180° peel force High temperature resistance Short-term high temperature resistance Residual glue Example 1 72.23％ Hard 250μm 3400 ＞330℃ 360 No residual glue Example 2 77.86％ soft 350μm 2500 ＞330℃ 360 No residual glue Example 3 91.65％ soft 550μm 3000 ＞330℃ 360 No residual glue Example 4 87.73％ soft 500μm 3200 ＞330℃ 360 No residual glue Example 5 84.07％ soft 420μm 2800 ＞330℃ 360 No residual glue Comparative Example 1 67.22％ Crisp Unable to form film 0 ＞330℃ 360 / Comparative Example 2 39.41％ soft 60μm 1000 ＞300℃ 330 Residue Comparative Example 3 45.96％ soft 100μm 1500 ＞330℃ 360 Slight adhesive residue Comparative Example 4 80.58％ Harder glue layer 350μm 3400 ＞330℃ 360 Serious adhesive residue Comparative Example 5 39.41 soft 60μm 1000 ＞300℃ 330 Residue

[0095] When electronic components with microstructured surfaces, or chips, electrodes, lithium battery modules, integrated inductors, chip inductors, etc. with grooves / protrusions of a certain size are processed (such as spraying, powder spraying, etching, electroplating, metal powder pressing, etc.), the high temperature resistant adhesive tape of the present invention protects the microstructured surface (such as Figure 1 As shown), it effectively protects the parts that do not need to be treated, prevents powder from entering through the gap between the adhesive layer and the surface of the component, and protects the electronic components from being contaminated by the powder spraying process. At the same time, the high temperature resistant tape of the present invention has good high temperature resistance, and the temperature resistance can reach above 330°C, and the short-term temperature resistance can reach 360°C. The adhesive tape of the present invention has stable performance and high solid content. It can be directly torn off after use without residual glue, and does not affect the subsequent process and application of the device. The thickness of the adhesive tape of the present invention can be adjusted within a large range as needed, and the thickness range can reach 5μm to 1000μm to adapt to the microstructural differences on the surfaces of different devices and achieve full protection.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A high temperature resistant tape, It is characterized in that It includes a substrate, a glue layer and a release film; the glue layer is between the substrate and the release film; the glue layer includes the following preparation raw materials: base resin, tackifying resin, cross-linking agent, catalyst, stabilizer, adhesion promoter and solvent; The base resin is a silicone resin; The tackifying resin is a cage-type siloxane tackifying resin containing a high amount of vinyl side chains, which is prepared by reacting primary cyclic siloxane molecules, mainly including but not limited to one or a mixture of two or more of hexamethylcyclotrisiloxane (D3), octamethylcyclotetrasiloxane (D4), decamethylcyclopentasiloxane (D5), and dodecamethylcyclohexasiloxane (D6), with but not limited to tetramethyltetravinylcyclotetrasiloxane, 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasilazane, 1,3,5,7,9,11,13,15-octavinylpentacyclo[9.5.1.13,9.15,15.17,13]octasiloxane, and 1,3-divinyltetramethyldisiloxane, after hydrolysis under the action of a catalyst and a promoter; The mass ratio of the base resin to the tackifying resin is 1:(0.3~4).

2. The high temperature resistant tape according to claim 1, It is characterized in that The substrate is at least one of polypropylene, polyethylene, polyvinyl chloride, styrene-butadiene-acrylonitrile copolymer, polyimide, polyester, polycarbonate, polymethyl methacrylate, polyetheretherketone, polyphenylene sulfide, polyethersulfone, copper foil and aluminum foil.

3. The high temperature resistant tape according to claim 1, It is characterized in that The adhesive layer includes the following raw materials by weight: 10-40 parts of base resin, 10-40 parts of tackifying resin, 0.5-2.5 parts of cross-linking agent, 0.01-2 parts of catalyst, 0.1-4 parts of stabilizer, 0.01-3 parts of adhesion promoter and 1-40 parts of solvent.

4. The high temperature resistant tape according to claim 1 or 3, It is characterized in that The solid content of the adhesive layer is ≥70%.

5. The high temperature resistant tape according to claim 1 or 3, It is characterized in that The crosslinking agent is at least one of dibenzoyl peroxide, 2,5-dimethyl-2,5-bis(tert-butyl peroxide)hexane, divinylbenzene, diisopropylbenzene peroxide, vinyl triethoxysilane, hydrogenated silicone oil, ethyl orthosilicate, methyl orthosilicate and trimethoxysilane.

6. The high temperature resistant tape according to claim 1 or 3, It is characterized in that The catalyst is at least one of dibutyltin dilaurate, an organic zinc catalyst, a platinum catalyst, an organic aluminum catalyst, an organic titanium catalyst, and an organic bismuth catalyst; the stabilizer is at least one of pyridine, N-phenyl-β-naphthylamine, phenothiazine, dinitrobenzene, trinitrotoluene, picric acid, naphthoquinone, 1,4-benzoquinone, phenanthrenequinone, hydroquinone, catechol, p-tert-butylcatechol, and pyrogallol; the adhesion promoter is at least one of Chemlock 220, a silane coupling agent, a titanate coupling agent, and phosphates; the solvent is at least one of methanol, ethyl acetate, ethanol, toluene, xylene, butanone, acetone, DMF, NMP, tetrachloroethylene, chloroform, white gasoline, n-hexane, cyclohexane, kerosene, petroleum ether, and benzene.

7. The method for preparing the high temperature resistant adhesive tape according to any one of claims 1 to 6, It is characterized in that The following steps are involved: (1) Take the raw materials for preparing the adhesive layer, stir them evenly at 400 rpm to 800 rpm for 10 min to 20 min to obtain adhesive layer glue; (2) Take the obtained adhesive layer glue, apply it to the substrate until the thickness of the adhesive layer is 5 μm to 1000 μm, and attach the release film to the substrate.

8. Use of the high temperature resistant adhesive tape according to any one of claims 1 to 6 or the high temperature resistant adhesive tape prepared by the preparation method according to claim 7 in the processing of electronic components.

9. The use according to claim 8, It is characterized in that The processing includes spraying, powder spraying, etching and electroplating.

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