A miniaturized three-dimensional vibration sensor system

Abstract

The present invention discloses a miniaturized three-dimensional vibration sensor system. The miniaturized three-dimensional vibration sensor system of the present invention utilizes an optical chip measurement module to integrate three laser transceiver units. The three laser transceiver units are used to emit three beams of measurement lasers that are parallel to each other and have different wavelengths to avoid mutual interference between the three beams of measurement lasers. This can make the laser transceiver units more compact and achieve miniaturization of the sensor system. At the same time, an optical path deflection unit is utilized to deflect the three beams of measurement lasers that are parallel to each other to the same point on the object being measured, thereby changing the laser optical axis so that the three beams of measurement lasers are all at the same angle to the central axis, thereby achieving three-dimensional vibration measurement of the vibrating object being measured at a fixed distance, further achieving miniaturization of the sensor system. The miniaturized three-dimensional vibration sensor system of the present invention has the advantages of simple structure, easy operation, miniaturization, and low cost, and effectively guarantees measurement accuracy.

Description

Technical Field

[0001] The present invention relates to the field of vibration measurement technology, and in particular to a miniaturized three-dimensional vibration measurement sensor system. Background Art

[0002] The principle of the frequency modulated continuous wave (FMCW) ranging method is to send a continuous signal with a certain bandwidth and linear frequency variation, then perform a fast Fourier transform on the received continuous signal, calculate the time difference between the two signals by the frequency difference between the sent and received signals, and finally obtain the corresponding distance value from the time difference. The FMCW method is based on the coherence principle and has strong anti-interference and high signal-to-noise ratio advantages, which has attracted widespread attention. Due to its high-precision measurement, it has begun to be widely used in vibration measurement of vibrating objects, thereby obtaining the acceleration value of the measured object. However, the existing three-dimensional vibration measurement system based on the FMCW method requires at least three optical chip measurement modules, which is difficult to miniaturize. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a miniaturized three-dimensional vibration sensor system with a reasonable structure and miniaturization.

[0004] To solve the above technical problems, the present invention provides a miniaturized three-dimensional vibration sensor system, which includes:

[0005] An optical chip measurement module, wherein the optical chip measurement module integrates three laser transceiver units, and the three laser transceiver units are used to emit three parallel measurement laser beams of different wavelengths;

[0006] Three reflecting units, each of which is disposed in an optical path of three measuring laser beams, each reflecting unit reflects a corresponding measuring laser beam, and the three reflected measuring laser beams are parallel to each other and not in the same plane; wherein a circle defined by the three reflected measuring laser beams is a target circle, a surface on which the target circle is located is a target surface, and an axis passing through the center of the target circle and perpendicular to the target surface is denoted as a central axis;

[0007] an optical path deflection unit, the optical path deflection unit being used to deflect the three reflected measuring laser beams to the same point on the measured object, and the point is located on the central axis;

[0008] A calculation unit is used to calculate the three-dimensional vibration value of the vibrating object under measurement based on the displacement values ​​respectively measured by the three laser transceiver units.

[0009] In one embodiment of the present invention, the incident points of the three measuring laser beams on the three reflecting units form an equilateral triangle.

[0010] In one embodiment of the present invention, the three laser transceiver units include a first laser transceiver unit, a second laser transceiver unit, and a third laser transceiver unit; the three reflective units include a first reflective unit, a second reflective unit, and a third reflective unit; the projection of the measuring laser emitted by the first laser transceiver unit on the XY plane is aligned with the X axis, the central axis is aligned with the Z axis, and the angles of each measuring laser beam with the X, Y, and Z axes after deflection are as follows:

[0011] θ x1 =π / 2-θ,θ y1 =π / 2,θ z1 =θ,

[0012]

[0013]

[0014] The distance between each measuring laser beam and the central axis after reflection and before deflection is r, the angle between each measuring laser beam and the central axis after deflection is θ, and the optical path from the measuring laser emitted by the first laser transceiver unit to the incident point on the first reflecting unit is d 11 The optical path from the measuring laser emitted by the second laser transceiver unit to the incident point on the second reflective unit is d 21 The optical path from the measuring laser emitted by the third laser transceiver unit to the incident point on the third reflective unit is d 31 The optical path from the measuring laser on the first reflection unit to the optical path deflection unit is d 12 The optical path from the measuring laser on the second reflecting unit to the optical path deflection unit is d 22 The optical path from the measuring laser on the third reflective unit to the optical path deflection unit is d 32 ,θ x1 ,θ x2 ,θ x3 They represent the angles between the laser emitted by the first laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit; θ y1 ,θ y2 ,θ y3 They represent the angles between the laser emitted by the second laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit; θ z1 ,θ z2 ,θ z3 They respectively represent the angles between the laser emitted by the third laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit;

[0015] The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula:

[0016] d1=v xcos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0017] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0018] d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 )

[0019] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object measured along their respective laser directions, respectively, obtained by the first laser transceiver unit, the second laser transceiver unit, and the third laser transceiver unit; v x 、v y 、v z They are the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

[0020] In one embodiment of the present invention, a collimating unit is provided between the laser transceiver unit and the reflective unit, and the collimating unit is used to collimate the measuring laser and then make it incident on the reflective unit.

[0021] In one embodiment of the present invention, the collimating unit is a collimating lens.

[0022] In one embodiment of the present invention, the optical path deflecting unit is a focusing lens or a prism.

[0023] In one embodiment of the present invention, the reflecting unit is a reflecting mirror.

[0024] In one embodiment of the present invention, the reflected measuring laser light is at 90 degrees to the measured laser light before reflection.

[0025] In one embodiment of the present invention, a PCBA board is further included, and the PCBA board is connected to the optical chip measurement module.

[0026] In one embodiment of the present invention, a plug connector is further included, and the PCBA board is connected to the outside through the plug connector.

[0027] The above technical solution of the present invention has the following advantages over the prior art:

[0028] The miniaturized three-dimensional vibration sensor system of the present invention utilizes an optical chip measurement module to integrate three laser transceiver units. The three laser transceiver units are used to emit three parallel measurement laser beams of different wavelengths to avoid mutual interference among the three measurement laser beams. This can make the laser transceiver units more compact and realize the miniaturization of the sensor system.

[0029] At the same time, the optical path deflection unit is used to deflect three parallel measuring laser beams to the same point on the object to be measured, thereby changing the laser optical axis so that the three measuring laser beams are at the same angle to the central axis, thereby realizing three-dimensional vibration measurement of the vibrating object to be measured at a fixed distance, and further realizing the miniaturization of the sensor system.

[0030] The miniaturized three-dimensional vibration sensor system of the present invention has the advantages of simple structure, convenient operation, miniaturization, and low cost, and can effectively ensure measurement accuracy.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0033] Figure 1 1 is an exploded view of a miniaturized three-dimensional vibration sensor system according to an embodiment of the present invention;

[0034] Figure 2 is a cross-sectional view of a miniaturized three-dimensional vibration sensor system according to an embodiment of the present invention;

[0035] Figure 3 1 is a diagram of the optical path and vibration measurement principle of a miniaturized three-dimensional vibration measurement sensor system in an embodiment of the present invention.

[0036] Marking Description:

[0037] 1. Optical chip measurement module; 2. Optical chip; 3. Laser transceiver unit; 31. First laser transceiver unit; 32. Second laser transceiver unit; 33. Third laser transceiver unit; 4. Collimation unit; 5. First bracket; 6. Reflection unit; 61. First reflection unit; 62. Second reflection unit; 63. Third reflection unit; 7. Second bracket; 8. Optical path deflection unit; 9. PCBA board; 10. Connector; 11. Housing. DETAILED DESCRIPTION

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0039] Example 1

[0040] Reference Figure 1-3 As shown, this embodiment discloses a miniaturized three-dimensional vibration sensor system, which includes:

[0041] An optical chip measurement module 1, wherein the optical chip 2 in the optical chip measurement module 1 is integrated with three laser transceiver units 3, and the three laser transceiver units 3 are used to emit three parallel measurement laser beams of different wavelengths;

[0042] Three reflecting units 6, each of which is disposed in an optical path of the three measuring laser beams. Each reflecting unit 6 reflects a corresponding measuring laser beam, and the three reflected measuring laser beams are parallel to each other and not in the same plane. The circle defined by the three reflected measuring laser beams is the target circle, the surface on which the target circle is located is the target surface, and the axis passing through the center of the target circle and perpendicular to the target surface is denoted as the central axis.

[0043] an optical path deflection unit 8, the optical path deflection unit 8 being used to deflect the three reflected measuring laser beams to the same point on the object being measured, and the point is located on the central axis;

[0044] A calculation unit is used to calculate the three-dimensional vibration value of the vibrating object under measurement based on the displacement values ​​respectively measured by the three laser transceiver units.

[0045] The miniaturized three-dimensional vibration sensor system of the present invention utilizes an optical chip measurement module to integrate three laser transceiver units. The three laser transceiver units are used to emit three parallel measurement laser beams of different wavelengths to avoid mutual interference among the three measurement laser beams. This can make the laser transceiver units more compact and realize the miniaturization of the sensor system.

[0046] At the same time, the optical path deflection unit is used to deflect three parallel measuring laser beams to the same point on the object to be measured, thereby changing the laser optical axis so that the three measuring laser beams are at the same angle to the central axis, thereby realizing three-dimensional vibration measurement of the vibrating object to be measured at a fixed distance, and further realizing the miniaturization of the sensor system.

[0047] The miniaturized three-dimensional vibration sensor system of the present invention has the advantages of simple structure, convenient operation, miniaturization, and low cost, and can effectively ensure measurement accuracy.

[0048] In some embodiments, the incident points of the three measuring laser beams on the three reflective units form an equilateral triangle, which facilitates calculations. The three laser transceiver units 3 can be arranged on the same side of the optical chip 2 or on both sides of the optical chip 2, without limitation. When the three laser transceiver units 3 are arranged on both sides of the optical chip 2, i.e., one laser transceiver unit 3 is arranged on one side and two laser transceiver units 3 are arranged on the other side, the structure can be made more compact.

[0049] Further, refer to Figure 3 The three laser transceiver units 3 include a first laser transceiver unit 31, a second laser transceiver unit 32, and a third laser transceiver unit 33. The three reflective units 6 include a first reflective unit 61, a second reflective unit 62, and a third reflective unit 63. The projection of the measuring laser emitted by the first laser transceiver unit 31 on the XY plane is aligned with the X axis, and the central axis is aligned with the Z axis. The angles of each measuring laser beam with the X, Y, and Z axes after deflection are as follows:

[0050] θ x1 =π / 2-θ,θ y1 =π / 2,θ z1 =θ,

[0051]

[0052]

[0053] The distance between each measuring laser beam and the central axis after reflection and before deflection is r, the angle between each measuring laser beam and the central axis after deflection is θ, and the optical path from the measuring laser beam emitted by the first laser transceiver unit 31 to the incident point on the first reflecting unit 61 is d 11 The optical path from the measuring laser emitted by the second laser transceiver unit 32 to the incident point on the second reflective unit 62 is d 21 The optical distance from the measuring laser emitted by the third laser transceiver unit 33 to the incident point on the third reflective unit 63 is d 31 The optical path from the measuring laser on the first reflecting unit 61 to the optical path deflecting unit 8 is d 12 The optical path from the measuring laser on the second reflecting unit 63 to the optical path deflecting unit 8 is d 22 The optical path from the measuring laser on the third reflecting unit 63 to the optical path deflecting unit 8 is d 32 ,θ x1 ,θ x2 ,θ x3 θ respectively represent the angles between the laser light emitted by the first laser transceiver unit 31 and the X, Y, and Z axes after passing through the optical path deflection unit; y1 ,θ y2 ,θ y3θ respectively represent the angles between the laser light emitted by the second laser transceiver unit 32 and the X, Y, and Z axes after passing through the optical path deflection unit; z1 ,θ z2 ,θ z3 They respectively represent the angles between the laser light emitted by the third laser transceiver unit 33 and the X, Y, and Z axes after passing through the optical path deflection unit;

[0054] The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula:

[0055] d1=v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0056] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0057] d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 )

[0058] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object measured along the respective laser directions obtained by the first laser transceiver unit 31, the second laser transceiver unit 32, and the third laser transceiver unit 33, respectively; v x 、v y 、v z They are the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

[0059] In one embodiment, a collimator 4 is disposed between the laser transceiver unit 3 and the reflector unit 6. The collimator 4 is configured to collimate the measurement laser beam before it is incident on the reflector 6. The laser beam emitted by the laser transceiver 3 is divergent, and the collimator 4 converts the divergent laser beam into parallel light. Optionally, the collimator 4 is a collimating lens or other collimating device. Furthermore, a first bracket 5 is included, upon which the optical chip measurement module 1 and the collimator 4 are disposed.

[0060] Optionally, the optical path deflecting unit 8 is a focusing lens or a prism, etc. As long as it can deflect three mutually parallel measuring laser beams and converge them at the same point, it will suffice.

[0061] Optionally, the reflecting unit 6 is a reflector. In one embodiment, the reflector is a 45-degree reflector, and the angle of the reflected measuring laser light is 90 degrees to that of the reflected measuring laser light before and after the reflection. Furthermore, a second bracket 7 is included, and the reflecting unit 6 is disposed on the second bracket 7.

[0062] Furthermore, the system includes a PCBA board 9, which is connected to the optical chip measurement module 1. The PCBA board 9 enables data acquisition and algorithm implementation. Furthermore, the system includes a connector 10, which connects the PCBA board 9 to the outside world, providing power to the three-dimensional vibration sensor and enabling information input and output.

[0063] Optionally, a housing 11 is further included, and components such as the optical chip measurement module 1 are arranged in the housing 11 .

[0064] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A miniaturized three-dimensional vibration sensor system, characterized in that: include: An optical chip measurement module, wherein the optical chip measurement module integrates three laser transceiver units, and the three laser transceiver units are used to emit three parallel measurement laser beams of different wavelengths; Three reflecting units, each disposed in an optical path of three measuring laser beams, each reflecting unit reflecting a corresponding measuring laser beam, wherein the three reflected measuring laser beams are mutually parallel and not in the same plane; wherein a circle defined by the three reflected measuring laser beams is a target circle, a surface on which the target circle is located is a target surface, and an axis passing through the center of the target circle and perpendicular to the target surface is denoted as a central axis; and the incident points of the three measuring laser beams on the three reflecting units form an equilateral triangle. an optical path deflection unit, the optical path deflection unit being used to deflect the three reflected measuring laser beams to the same point on the measured object, and the point is located on the central axis; A calculation unit for calculating the three-dimensional vibration value of the vibrating object under test according to the displacement values ​​respectively measured by the three laser transceiver units; The three laser transceiver units include a first laser transceiver unit, a second laser transceiver unit, and a third laser transceiver unit; the three reflective units include a first reflective unit, a second reflective unit, and a third reflective unit; the projection of the measuring laser emitted by the first laser transceiver unit on the XY plane is made to coincide with the X axis, the central axis coincides with the Z axis, and the angles of each measuring laser beam with the X, Y, and Z axes after deflection are as follows: i x1 =π / 2-θ,θ y1 =π / 2,θ z1 =θ, i x2 =arccos(r / 2(d2-d 21 -d 22 )), i z2 =θ, i x3 =-arccos(r / 2(d3-d 31 -d 32 )), i z3 =θ, The distance between each measuring laser beam and the central axis after reflection and before deflection is r, the angle between each measuring laser beam and the central axis after deflection is θ, and the optical path from the measuring laser emitted by the first laser transceiver unit to the incident point on the first reflecting unit is d 11 The optical path from the measuring laser emitted by the second laser transceiver unit to the incident point on the second reflective unit is d 21 The optical path from the measuring laser emitted by the third laser transceiver unit to the incident point on the third reflective unit is d 31 The optical path from the measuring laser on the first reflection unit to the optical path deflection unit is d 12 The optical path from the measuring laser on the second reflecting unit to the optical path deflection unit is d 22 The optical path from the measuring laser on the third reflective unit to the optical path deflection unit is d 32 ,θ x1 ,θ x2 ,θ x3 They represent the angles between the laser emitted by the first laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit; θ y1 ,θ y2 ,θ y3 They represent the angles between the laser emitted by the second laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit; θ z1 ,θ z2 ,θ z3 They respectively represent the angles between the laser emitted by the third laser transceiver unit and the X, Y, and Z axes after passing through the optical path deflection unit; The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula: d1=v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 ) d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 ) d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 ) Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object measured along their respective laser directions, respectively, obtained by the first laser transceiver unit, the second laser transceiver unit, and the third laser transceiver unit; v x 、v y 、v z They are the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

2. The miniaturized three-dimensional vibration sensor system according to claim 1, characterized in that: A collimating unit is provided between the laser transceiver unit and the reflective unit, and the collimating unit is used to collimate the measuring laser and then make it incident on the reflective unit.

3. The miniaturized three-dimensional vibration sensor system according to claim 2, characterized in that: The collimating unit is a collimating lens.

4. The miniaturized three-dimensional vibration sensor system according to claim 1, characterized in that: The optical path deflection unit is a focusing lens or a prism.

5. The miniaturized three-dimensional vibration sensor system according to claim 1, characterized in that: The reflecting unit is a reflecting mirror.

6. The miniaturized three-dimensional vibration sensor system according to claim 1, characterized in that: The measurement laser after reflection is 90 degrees to the measurement laser before reflection.

7. The miniaturized three-dimensional vibration sensor system according to claim 1, characterized in that: It also includes a PCBA board, which is connected to the optical chip measurement module.

8. The miniaturized three-dimensional vibration sensor system according to claim 7, characterized in that: It also includes a plug-in connector, and the PCBA board is connected to the outside through the plug-in connector.

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