An automatic height adjustment method for chip testing and related components

Abstract

The application discloses an automatic height adjusting method for chip testing and related components, and relates to the field of chip testing. A preset reference pulse number is set, and a control signal corresponding to the preset reference pulse number is sent to a power module, so that the power module controls a driving component to move based on the control signal. The driving component drives a contact for testing to move. When it is determined that the contact for testing and a target chip pin are in a contacted state based on continuously acquired first characteristic data, the power module controls the driving component to stop moving, so that the contact for testing stops moving. Second characteristic data is acquired to correct the preset reference pulse number, and the reliable implementation of the automatic height adjusting process is further ensured. It can be seen that the scheme provided in the application has high automation, is more conducive to realizing contact debugging under high-temperature working conditions, avoids the occurrence of excessive contact or poor contact between a test needle and a pin as much as possible, reduces the quality risk faced by debugging, has higher debugging efficiency, and has better debugging effect.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to an automatic height adjustment method and related components for chip testing. Background Technology

[0002] After chip packaging, a series of tests are required. Before testing, the test system typically needs adjustment, especially if the test environment changes. For example, the test location may have changed, particularly the base where the chip under test is placed; or the test system may have undergone maintenance, repair, or replacement of consumables. In such cases, the test system needs to be adjusted. Generally, adjusting the height requires manually fixing the chip on the test stage and using a motor to control the robotic arm and its test probes to adjust the distance between the test probes and the chip's pins, ensuring the required testing height is reached before testing begins.

[0003] However, in related technologies, the height of the test probe is usually adjusted by engineers at the work site based on experience. The adjustment process is complex and limited by experience, making it difficult to guarantee the adjustment effect and resulting in low efficiency. In addition, if the above-mentioned test bench is in some special environments, such as high-temperature and enclosed environments, this means that there are blind spots in the adjustment that cannot be observed. Relying on the above-mentioned experience-based adjustment method can easily lead to excessive contact between the test probe and the pin, resulting in damage to the semiconductor device and deformation of the pin, or poor contact between the test probe and the pin. These situations will affect the subsequent experiments. For example, poor contact can easily cause arcing under high test current, leading to safety problems. Moreover, manual operation under high-temperature conditions can easily cause burns to the workers, posing a safety hazard.

[0004] Therefore, how to provide a solution to the above-mentioned technical problems is a problem that those skilled in the art need to solve at present. Summary of the Invention

[0005] The purpose of this invention is to provide an automatic height adjustment method and related components for chip testing. This solution has a higher degree of automation, is more conducive to contact debugging under high-temperature working conditions, and avoids burns to personnel. It also minimizes excessive or poor contact between the test probe and the pin, reducing the quality risks faced in debugging. The debugging effect and efficiency are both higher, which is beneficial for practical production applications.

[0006] To solve the above technical problems, the present invention provides an automatic height adjustment method for chip testing, applied to a chip testing system. The chip testing system includes a control module connected to a testing module and a power module. The power module is also connected to a drive component, which is further connected to a testing contact in the testing module. The automatic height adjustment method for chip testing includes:

[0007] Set the preset reference pulse number;

[0008] A control signal corresponding to the preset reference pulse number is sent to the power module, so that the power module controls the movement of the drive component based on the control signal, so that the drive component drives the test contact to move;

[0009] The test module continuously acquires first feature data, which characterizes the contact between the test contact and the target chip pin of the test piece.

[0010] Based on the first feature data, it is determined whether the test contact and the target chip pin are in a contact state;

[0011] If so, a stop signal is sent to the power module to control the drive component to stop moving, so that the test contact stops moving;

[0012] Acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the point of stopping movement;

[0013] The preset reference pulse number is corrected based on the second feature data to obtain a new preset reference pulse number.

[0014] Furthermore, the test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through the test contact to output a constant current signal;

[0015] The voltage acquisition module is connected in parallel with the test contact;

[0016] Continuously acquire the first feature data fed back by the test module, including:

[0017] The voltage acquired by the voltage acquisition module is continuously obtained. The voltage is a first voltage value when the test contact is in contact with the pin of the target chip, and a second voltage value when the test contact is not in contact with the pin of the target chip.

[0018] Furthermore, the test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current providing module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the second contact do not make contact.

[0019] Based on the first feature data, determining that the test contact and the target chip pin are in a contact state includes:

[0020] Determine whether the voltage fed back by the voltage acquisition module is 0;

[0021] If not, it is determined that the test contact and the target chip pin are in contact.

[0022] Furthermore, the first contact and the second contact include a first conductive element, an elastic telescopic element, and a second conductive element connected in sequence.

[0023] Furthermore, after the power module controls the drive component to stop moving, thereby stopping the movement of the test contact, the method further includes:

[0024] Based on the voltage fed back by the voltage acquisition module, the contact resistance corresponding to the target contact portion after the test contact makes contact with the target chip pin is determined;

[0025] Determine whether the contact resistance is less than a preset resistance threshold;

[0026] If so, determine that the target chip pin is a pin that has passed the height measurement and debugging test.

[0027] Furthermore, it also includes:

[0028] Determine whether each chip pin of the device under test is a pin that has passed the height measurement and debugging test;

[0029] If so, confirm that the test piece has passed the height measurement and debugging test;

[0030] If not, it is determined that the test piece has failed the height measurement and debugging test.

[0031] Furthermore, it also includes:

[0032] Determine whether the cumulative number of uses of the test contact has reached a preset test threshold;

[0033] If so, the control prompt module outputs a prompt message indicating that the test contact needs to be replaced.

[0034] Furthermore, the test contact is a retractable contact;

[0035] Acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the point of cessation of movement, including:

[0036] Obtain the number of redundant pulses corresponding to the target distance during the operation of the power module, where the target distance is the distance that the test contact shortens from the initial contact between the test contact and the pin of the target chip until the test contact stops moving;

[0037] The preset reference pulse number is corrected based on the second feature data to obtain a new preset reference pulse number, including:

[0038] The preset reference pulse number is corrected based on the redundant pulse number to obtain a new preset reference pulse number.

[0039] To address the aforementioned technical problems, the present invention also provides a chip testing system, comprising a control module, a testing module, a power module, and a drive component; the control module is connected to the testing module and the power module, the power module is also connected to the drive component, and the drive component is also connected to a testing contact in the testing module;

[0040] The test module is used to feed back first feature data, which characterizes the contact between the test contact and the target chip pin of the test piece.

[0041] The power module is used to control the movement of the drive component based on the control signal sent by the control module, and to control the drive component to stop moving based on the stop signal sent by the control module.

[0042] The driving component is used to move the test contact during movement and to stop the test contact when the movement stops.

[0043] The control module is used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire the first feature data, and when it is determined based on the first feature data that the test contact and the target chip pin are in contact, send a stop signal to the power module; acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

[0044] Furthermore, the test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through the test contact to output a constant current signal;

[0045] The voltage acquisition module is connected in parallel with the test contact;

[0046] The voltage acquisition module is used to acquire voltage and feed the voltage back to the control module as the first feature data. The voltage is a first voltage value when the test contact is in contact with the pin of the target chip, and a second voltage value when the test contact is not in contact with the pin of the target chip.

[0047] Furthermore, the test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current providing module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the second contact do not make contact.

[0048] The control module is specifically used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire the voltage acquired by the voltage acquisition module, and send a stop signal to the power module when the voltage is determined to be non-zero; acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

[0049] Furthermore, the first contact and the second contact include a first conductive element, an elastic telescopic element, and a second conductive element connected in sequence.

[0050] Furthermore, the control module is also used to determine the contact resistance corresponding to the target contact portion after the test contact makes contact with the target chip pin based on the voltage fed back by the voltage acquisition module, and to determine that the target chip pin is a pin that has passed the height measurement and debugging test when the contact resistance is determined to be less than a preset resistance threshold.

[0051] Furthermore, the control module is also used to determine whether each chip pin of the device under test is a pin that has passed the height measurement and debugging test. If so, it is determined that the device under test has passed the height measurement and debugging test; if not, it is determined that the device under test has failed the height measurement and debugging test.

[0052] Furthermore, the control module is also used to determine whether the cumulative use of the test contact has reached a preset test threshold; if so, the control prompt module outputs a prompt message indicating that the test contact should be replaced.

[0053] Furthermore, the control module is specifically used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire the first feature data, and when it is determined based on the first feature data that the test contact and the target chip pin are in contact, send a stop signal to the power module; acquire the number of redundant pulses corresponding to the target distance during the operation of the power module, where the target distance is the distance the test contact shortens during the process from the initial contact between the test contact and the target chip pin until the test contact stops moving, so as to correct the preset reference pulse number based on the redundant pulse number to obtain a new preset reference pulse number.

[0054] To address the aforementioned technical problems, the present invention also provides a computer-readable storage medium, comprising:

[0055] The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the automatic height adjustment method for chip testing as described above.

[0056] To solve the above-mentioned technical problems, the present invention also provides a control device, comprising:

[0057] Memory, used to store computer programs;

[0058] A processor, when executing the computer program, implements the steps of the automatic height adjustment method for chip testing as described above.

[0059] This application provides an automatic height adjustment method and related components for chip testing. In this scheme, a preset reference pulse number is set, and a corresponding control signal is sent to a power module. The power module then controls a drive component to move based on this control signal, which in turn moves a test contact. First feature data, representing the contact status between the test contact and the target chip pin of the chip under test, is continuously acquired from the test module for continuous monitoring. When the test contact and the target chip pin are determined to be in contact based on the first feature data, a stop signal is sent, and the power module controls the drive component to stop moving, thus stopping the test contact. Second feature data is then acquired to correct the preset reference pulse number, further ensuring the reliable implementation of the automatic height adjustment process. Compared to related technologies where engineers adjust based on experience, the solution provided in this application has a higher degree of automation, is more conducive to contact debugging under high-temperature operating conditions, and avoids burns to personnel. It also minimizes excessive or poor contact between the test probe and the pin, reducing the quality risks associated with debugging. The debugging efficiency is higher, the debugging effect is better, and it is more suitable for practical production applications. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of the present invention, the relevant technologies and the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 A flowchart of an automatic height adjustment method for chip testing provided by the present invention;

[0062] Figure 2a This invention provides a schematic diagram of the movement process of a test contact.

[0063] Figure 2b This is a schematic diagram of another test contact movement process provided by the present invention;

[0064] Figure 2c This is a schematic diagram of another test contact movement process provided by the present invention;

[0065] Figure 3 A schematic diagram illustrating the height measurement and debugging principle of a test contact and a target chip pin, provided by the present invention;

[0066] Figure 4 This is a schematic diagram showing the height measurement and debugging test results provided by the present invention;

[0067] Figure 5 This is a schematic diagram of the structure of a control device provided by the present invention. Detailed Implementation

[0068] The core of this invention is to provide an automatic height adjustment method and related components for chip testing. This solution has a higher degree of automation, which is more conducive to contact debugging under high-temperature working conditions and avoids burns to personnel. It also minimizes excessive contact or poor contact between the test probe and the pin, reducing the quality risks faced in debugging. The debugging effect and efficiency are both higher, which is beneficial for practical production applications.

[0069] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0070] Please refer to Figure 1 , Figure 1A flowchart of a contact debugging method provided by the present invention.

[0071] In this embodiment, considering that in related technologies, the height of the test probe is usually adjusted by engineers at the work site based on experience, the adjustment process is complex and highly dependent on the engineer's experience, making it difficult to guarantee the adjustment effect and resulting in low adjustment efficiency. Furthermore, due to the existence of unobservable adjustment blind spots, effective visual adjustment is impossible, easily leading to excessive or poor contact between the test probe and the pin, causing safety issues and affecting subsequent experiments. To solve the above technical problems, this application provides a contact adjustment method with a high degree of automation, which is more conducive to practical production applications.

[0072] The automatic height adjustment method for chip testing is applied in a chip testing system. The chip testing system includes a control module, which is connected to a testing module and a power module. The power module is also connected to a drive component, which is further connected to test contacts in the testing module. The automatic height adjustment method for chip testing includes:

[0073] S11: Set the preset reference pulse count;

[0074] S12: Send the control signal corresponding to the preset reference pulse number to the power module so that the power module controls the movement of the drive component based on the control signal so that the drive component can move the test contact.

[0075] S13: Continuously acquire the first feature data fed back by the test module. The first feature data characterizes the contact between the test contact and the target chip pin of the test piece.

[0076] It should be noted that the automatic height adjustment method for chip testing can be specifically used for testing the pins of each chip in the device under test. The device under test includes, but is not limited to, a pre-processed semiconductor device to be tested. The height adjustment in this application refers to adjusting the position of the test contact to ensure reliable contact with the target chip pin of the device under test. The control module specifically includes, but is not limited to, a tester storing a software program corresponding to the method in this application. The power module specifically includes, but is not limited to, a servo motor, the control terminal of which is connected to the control module to receive control signals from the control module. The driving component includes, but is not limited to, a robotic arm, which is connected to the test contact so that the test contact moves with the movement of the robotic arm. Understandably, the test piece can be specifically placed on the test bench (the process of placing it on the test bench can also be completed by a robotic arm, that is, the robotic arm samples one test piece from multiple test pieces and places it on the test bench, so that the debugging personnel can perform non-contact operation to avoid being burned in the high-temperature working environment). The robotic arm, the test contact and the test piece can all be specifically placed in the high-temperature test sealed chamber. During the test, the temperature inside the high-temperature test sealed chamber can be adjusted according to the actual test requirements, up to a maximum of 170 degrees Celsius. There is a visual blind spot in the product test area corresponding to the test piece, but the working area of ​​the robotic arm can cover any position in the product test area.

[0077] Specifically, firstly, the exact value of the preset reference pulse number is not specifically limited here; for example, it can be 100 standard pulses. In actual testing, it was found that 100 standard pulses correspond to a displacement distance of approximately 0.014 mm. This causes the test contact, driven by the driving component, to continuously move from its original stationary position towards the location of the target chip pin (where the target chip pin is any one of the multiple chip pins of the device under test). Please refer to... Figure 2a , Figure 2b and Figure 2c , Figure 2a This is a schematic diagram of the movement process of a test contact provided by the present invention. Figure 2b This is a schematic diagram of another test contact movement process provided by the present invention. Figure 2c This is a schematic diagram illustrating another test contact movement process provided by the present invention. In the above three figures, the test contacts include a first contact 1-F and a second contact 1-S as an example for illustration. The test piece is represented by label A, and the target chip pin is represented by label B. It can be seen that... Figures 2a to 2b to Figure 2c This demonstrates the process of the test contact gradually approaching the target chip pin of the test device and finally making contact with the target chip pin.

[0078] Secondly, the number of preset reference pulses can be one or more. When multiple preset reference pulses are set, the automatic height adjustment method for chip testing can also include the following steps: based on the distance detection module in the chip testing system, determine the distance between the current test contact and the target chip pin, so as to select one preset reference pulse from multiple preset reference pulses as the target reference pulse, and generate a control signal corresponding to the target reference pulse and send it to the power module. The distance detection module here can be an infrared distance detection device designed based on the infrared ranging principle, or a radar detector. There is no special limitation here, and it can be determined according to the actual needs.

[0079] S14: Based on the first feature data, determine whether the test contact and the target chip pin are in contact; if so, proceed to S15.

[0080] S15: Send a stop signal to the power module to control the drive component to stop moving, so that the test contact stops moving;

[0081] S16: Acquire second feature data on the movement of the test contact from the initial contact with the target chip pin to the point of stopping movement;

[0082] S17: Correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

[0083] It should be noted that during the execution of step S12, steps S13 and S14 will be executed simultaneously to maintain continuous monitoring of the height measurement debugging process, so as to execute different steps in a timely manner according to the debugging situation. More specifically, the first feature data characterizes the contact between the test contact and the target chip pin of the device under test. Based on this, it can be determined whether the test contact and the target chip pin are in a contact state. If it is determined that they are not in a contact state, the test contact can continue to move closer to the target chip pin, and the contact between the two can be monitored. If it is determined that they are in a contact state, step S15 is executed immediately to issue a stop signal, the power module stops power output, the drive component stops moving, and the test contact stops moving to avoid excessive contact between the two. Considering that the test contact will move a small distance from the time it starts to contact the target chip pin until it stops moving, in order to improve the control accuracy of the automatic height measurement method of this application, the second feature data is obtained so that the preset reference pulse number can be modified and debugged based on the second feature data, which is convenient for subsequent applications.

[0084] It is understood that the automatic height adjustment method given in this application is essentially a height measurement and adjustment before chip testing. After the test contact is reliably in contact with the pin of the target chip, subsequent electrical parameter tests can be performed, and no special limitations are made here.

[0085] In summary, this application provides an automatic height adjustment method for chip testing. Compared with the related technologies where engineers adjust based on experience, the solution provided in this application has a higher degree of automation, is more conducive to contact debugging under high-temperature working conditions, avoids burns to debugging personnel, and correspondingly reduces the experience and skill requirements of debugging personnel. Furthermore, it minimizes excessive or poor contact between test probes and pins, reduces the quality risks faced during debugging, and achieves higher debugging efficiency and better debugging results, making it more suitable for practical production applications.

[0086] Based on the above embodiments:

[0087] In some embodiments, the test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through a test contact to output a constant current signal;

[0088] The voltage acquisition module is connected in parallel with the test contacts;

[0089] Continuously acquire the first feature data fed back by the test module, including:

[0090] The voltage is continuously acquired by the voltage acquisition module. The voltage is the first voltage value when the test contact is in contact with the pin of the target chip, and the voltage is the second voltage value when the test contact is not in contact with the pin of the target chip.

[0091] In this embodiment, the test module may include a constant current supply module and a voltage acquisition module. The constant current supply module includes, but is not limited to, a constant current source used to output a constant current signal as required. The voltage acquisition module includes, but is not limited to, a voltmeter that can provide feedback on the acquired voltage information. Of course, it can also be a voltage acquisition circuit composed of other circuit devices, which is not particularly limited here.

[0092] It is understandable that, based on the circuit connection method and circuit structure, when the test contact is not in contact with the target chip pin, the voltage acquired by the voltage acquisition module is the first voltage; when the test contact is in contact with the target chip pin, the corresponding resistance will change, so that the voltage acquired by the voltage acquisition module is the second voltage. The first voltage and the second voltage are different voltage values, and it can be determined whether the test contact is in contact with the target chip pin.

[0093] In some embodiments, the test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current supply module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the other ends of the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the other ends of the second contact do not make contact.

[0094] Based on the first feature data, it is determined that the test contact and the target chip pin are in a contact state, including:

[0095] Determine if the voltage returned by the voltage acquisition module is 0;

[0096] If not, it is determined that the test contact and the target chip pin are in contact.

[0097] In this embodiment, the test contact may include a first contact and a second contact. Please refer to [reference needed]. Figure 3 , Figure 3 This is a schematic diagram illustrating the height measurement and debugging principle of a test contact and a target chip pin provided by the present invention. The diagram is illustrated using an example of a constant current supply module as a constant current output current source, a voltage acquisition module as a voltmeter that can provide feedback on the acquired voltage information, a first contact as test pin 1-F, and a second contact as test pin 1-S. Specifically, the output terminal of the current source can be connected to test pin 1-F via test leads. The connection between test pin 1-S and the voltmeter can also be achieved via test leads. The other end of test pin 1-F does not contact the other end of test pin 1-S. According to the circuit principle, when the test contact is not in contact with pin B of the target chip, no current path is formed, and the voltage collected and fed back by the voltage acquisition module is 0 (that is, the first voltage mentioned above is 0). When the test contact is in contact with pin B of the target chip, test pin 1-F and test pin 1-S are connected through the part between them that is in contact with pin B of the target chip (hereinafter referred to as the contact path part), forming a current path. The voltage collected and fed back by the voltage acquisition module is a non-zero value (that is, the second voltage mentioned above is a non-zero voltage), thus determining that the test contact and pin B of the target chip are in a contact state.

[0098] As can be seen, the above method can simply and reliably determine whether the test contact and the target chip pin have made contact. Furthermore, setting the test contact as the first contact and the second contact facilitates subsequent testing of other electrical parameters, which is beneficial for practical applications.

[0099] In some embodiments, after the drive component is stopped by the power module to stop moving, so that the test contact stops moving, the method further includes:

[0100] Based on the voltage feedback from the voltage acquisition module, determine the contact resistance of the target contact portion after the test contact makes contact with the target chip pin;

[0101] Determine if the contact resistance is less than a preset resistance threshold;

[0102] If so, confirm that the target chip pin is the one that passed the height measurement and debugging test.

[0103] This embodiment further provides the execution logic for determining whether a target chip pin has passed height measurement debugging after confirming reliable contact between the test contact and the target chip pin. Specifically, please refer to... Figure 3 Test probe 1-F is connected to test probe 1-S through the contact path to form a current path. The voltage feedback from the voltage acquisition module (i.e., the second voltage) is a non-zero voltage value. Combining Ohm's law, since the current output by the constant current source is constant, the total resistance of the entire current path can be determined. Since the resistance of the test leads is fixed, the contact resistance corresponding to the target contact part can be determined. Figure 3 The target contact area is marked with C.

[0104] It should also be noted that there is no specific limitation on the specific value of the preset resistance threshold here. For example, it can be 5Ω. The specific value can be set according to the actual needs.

[0105] In some embodiments, it also includes:

[0106] Determine whether each chip pin of the device under test has passed the height measurement and debugging test;

[0107] If so, confirm that the test piece has passed the height measurement and debugging test;

[0108] If not, it is determined that the test piece failed the height measurement and debugging test.

[0109] In this embodiment, considering that the device under test includes multiple chip pins, each chip pin will be used as a target chip pin for height measurement and debugging. Therefore, the device under test is determined to have passed the height measurement and debugging test only if all chip pins pass the height measurement and debugging test; otherwise, the device under test is determined to have failed the height measurement test. As an example, taking a constant current supply module as the constant current source with an output current of 10mA and a preset resistance threshold of 5Ω as an example, further explanation is given. Assuming that the device under test has multiple chip pins, please refer to... Figure 4 , Figure 4This is a schematic diagram showing the height measurement and debugging results provided by the present invention. The upper limit of judgment is the preset resistance threshold, and the lower limit of judgment is 0 (the resistance value must be positive). The test pin sequence is the pin number of each chip. Taking 7 chip pins as an example, it can be seen that the contact resistance values ​​of the 7 chip pins corresponding to the height measurement pass item (corresponding to the first test piece) are all less than the preset resistance threshold of 5Ω. Therefore, the first test piece passes the height measurement and debugging test. In the height measurement failure item (corresponding to the second test piece), the contact resistance value of the 4th chip pin is 8.956Ω, which is greater than the preset resistance threshold. Therefore, the second test piece fails the height measurement and debugging test.

[0110] In some embodiments, it also includes:

[0111] Determine whether the cumulative number of uses of the test contact has reached the preset test threshold;

[0112] If so, the control prompt module outputs a prompt message indicating that the test contact needs to be replaced.

[0113] In this embodiment, considering that the test contact may age and other problems as the number of uses increases, affecting contact debugging, its service life can also be monitored. That is, after each test contact performs the above-mentioned automatic height adjustment method on a target chip pin, the corresponding cumulative number of uses is incremented by 1. By accumulating, it is determined whether the cumulative number of uses of the test contact has reached the preset test threshold. The specific value of the preset test threshold is not particularly limited here, and can be set according to actual needs.

[0114] If yes, the control prompt module outputs a prompt message to remind the debugging personnel to replace the test contact to avoid affecting the test results. The specific prompting method is not particularly limited, including but not limited to display, voice broadcast, email or SMS. If no, continue to use the test contact and continue monitoring.

[0115] In some embodiments, the first contact and the second contact include a first conductive element, an elastic telescopic element, and a second conductive element connected in sequence.

[0116] In this embodiment, to further ensure that the test contact has a certain degree of contact elasticity, both the first and second contact can be designed as follows: they include a first conductive element, an elastic telescopic element, and a second conductive element connected in sequence. The elastic telescopic element includes, but is not limited to, a spring. The first and second conductive elements are specifically made of conductive materials, without particular limitation. Therefore, the above method further ensures that the test contact minimizes damage to the target pin during contact with it.

[0117] In some embodiments, the test contact is a retractable contact;

[0118] Acquire second characteristic data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop of movement, including: acquiring the number of redundant pulses corresponding to the target distance of the power module operation, where the target distance is the distance shortened by the test contact from the initial contact with the target chip pin to the stop of movement of the test contact;

[0119] The preset reference pulse number is corrected based on the second feature data to obtain a new preset reference pulse number, including:

[0120] The preset reference pulse number is corrected based on the number of redundant pulses to obtain a new preset reference pulse number.

[0121] In this embodiment, to further improve the debugging accuracy of the scheme, it is considered that even though the process of judgment and issuing instructions is very fast, the test contact will still shorten a certain distance, i.e., the target distance, from the time the test contact contacts the target chip pin until the test contact finally stops moving. This target distance corresponds to the redundant number of pulses of the power module, such as the servo motor. Therefore, the preset reference pulse number can be corrected according to the redundant pulse number. Through this feedback control method, a new preset reference pulse number is obtained. It can be seen that by calibrating and correcting the preset reference pulse number, the accuracy of the contact debugging process can be guaranteed as much as possible, and excessive contact between the test contact and the target chip pin can be avoided to prevent damage to the target chip pin, which is beneficial to actual production applications.

[0122] It is understood that the test contact is a retractable contact, and its specific structure can adopt the retractable elastic design of the first contact and the second contact described in the above embodiments.

[0123] Furthermore, as an example, taking a servo motor as the power module, it includes a servo encoder, which can accurately determine the number of pulses the servo motor has passed. Therefore, the number of redundant pulses corresponding to the target distance that the power module runs can be obtained based on the feedback of the servo encoder.

[0124] The present invention also provides a chip testing system, including a control module, a testing module, a power module, and a driving component; the control module is connected to the testing module and the power module, the power module is also connected to the driving component, and the driving component is also connected to the testing contact in the testing module;

[0125] The test module is used to provide feedback on the first feature data, which characterizes the contact between the test contact and the target chip pin of the test piece.

[0126] The power module is used to control the movement of the drive components based on the control signals sent by the control module, and to control the drive components to stop moving based on the stop signals sent by the control module.

[0127] The driving component is used to move the test contact during movement and to stop the test contact when the movement stops.

[0128] The control module is used to set a preset reference pulse number and send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire first feature data, and send a stop signal to the power module when it is determined based on the first feature data that the test contact and the target chip pin are in contact; acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

[0129] For a description of the chip testing system provided in this invention, please refer to the embodiment of the automatic height adjustment method for chip testing described above; it will not be repeated here.

[0130] In some embodiments, the test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through a test contact to output a constant current signal;

[0131] The voltage acquisition module is connected in parallel with the test contacts;

[0132] The voltage acquisition module is used to acquire voltage and feed the voltage back to the control module as the first characteristic data. The voltage is the first voltage value when the test contact is in contact with the pin of the target chip, and the voltage is the second voltage value when the test contact is not in contact with the pin of the target chip.

[0133] In some embodiments, the test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current supply module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the other ends of the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the other ends of the second contact do not make contact.

[0134] The control module is specifically used to set a preset reference pulse number and send the control signal corresponding to the preset reference pulse number to the power module; continuously acquire the voltage collected by the voltage acquisition module and send a stop signal to the power module when the voltage is not 0; acquire the second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

[0135] In some embodiments, the first contact and the second contact include a first conductive element, an elastic telescopic element, and a second conductive element connected in sequence.

[0136] In some embodiments, the control module is further configured to determine the contact resistance corresponding to the target contact portion after the test contact contacts the target chip pin based on the voltage fed back by the voltage acquisition module, and determine the target chip pin as a pin that has passed the height measurement debugging test when the contact resistance is determined to be less than a preset resistance threshold.

[0137] In some embodiments, the control module is further configured to determine whether each chip pin of the device under test is a pin that has passed the height measurement and debugging test; if so, it is determined that the device under test has passed the height measurement and debugging test; if not, it is determined that the device under test has failed the height measurement and debugging test.

[0138] In some embodiments, the control module is further configured to determine whether the cumulative use of the test contact has reached a preset test threshold; if so, the control prompt module outputs a prompt message indicating that the test contact needs to be replaced.

[0139] In some embodiments, the control module is specifically used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire first feature data, and when it is determined based on the first feature data that the test contact and the target chip pin are in contact, send a stop signal to the power module; acquire the number of redundant pulses corresponding to the target distance during the operation of the power module, where the target distance is the distance shortened by the test contact from the initial contact between the test contact and the target chip pin until the test contact stops moving, so as to correct the preset reference pulse number based on the number of redundant pulses to obtain a new preset reference pulse number.

[0140] The present invention also provides a computer-readable storage medium, comprising:

[0141] The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the automatic height adjustment method for chip testing as described above.

[0142] For a description of the computer-readable storage medium provided in this invention, please refer to the embodiments of the automatic height adjustment method for chip testing described above, which will not be repeated here.

[0143] Please refer to Figure 5 , Figure 5 This is a schematic diagram of the structure of a control device provided by the present invention.

[0144] The control device includes:

[0145] Memory 31 is used to store computer programs;

[0146] The processor 32 is configured to, when executing the computer program, implement the steps of the automatic height adjustment method for chip testing as described above.

[0147] For a description of the control device provided in this invention, please refer to the embodiment of the automatic height adjustment method for chip testing described above; it will not be repeated here.

[0148] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section. Relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0149] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can implement the described functions using different methods for each specific application, but such implementation should not be considered beyond the scope of the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic height adjustment method for chip testing, characterized in that, An automatic height adjustment method for chip testing is applied in a chip testing system, the chip testing system including a control module connected to a testing module and a power module, the power module also connected to a drive component, and the drive component also connected to test contacts in the testing module. Set a preset reference pulse number; the preset reference pulse number is a target reference pulse number determined based on the distance between the current test contact and the target chip pin; A control signal corresponding to the preset reference pulse number is sent to the power module, so that the power module controls the movement of the drive component based on the control signal, so that the drive component drives the test contact to move; The test module continuously acquires first feature data, which characterizes the contact between the test contact and the target chip pin of the test piece. Based on the first feature data, it is determined whether the test contact and the target chip pin are in a contact state; If so, a stop signal is sent to the power module to control the drive component to stop moving, so that the test contact stops moving; Acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the point of stopping movement; The preset reference pulse number is corrected based on the second feature data to obtain a new preset reference pulse number.

2. The automatic height adjustment method for chip testing as described in claim 1, characterized in that, The test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through the test contact to output a constant current signal. The voltage acquisition module is connected in parallel with the test contact; Continuously acquire the first feature data fed back by the test module, including: The voltage acquired by the voltage acquisition module is continuously obtained. The voltage is a first voltage value when the test contact is in contact with the pin of the target chip, and a second voltage value when the test contact is not in contact with the pin of the target chip.

3. The automatic height adjustment method for chip testing as described in claim 2, characterized in that, The test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current providing module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the second contact do not make contact. Based on the first feature data, determining that the test contact and the target chip pin are in a contact state includes: Determine whether the voltage fed back by the voltage acquisition module is 0; If not, it is determined that the test contact and the target chip pin are in contact.

4. The automatic height adjustment method for chip testing as described in claim 3, characterized in that, The first contact and the second contact include a first conductive element, an elastic telescopic element and a second conductive element connected in sequence.

5. The automatic height adjustment method for chip testing as described in claim 2, characterized in that, After the power module controls the drive component to stop moving, thereby stopping the movement of the test contact, the method further includes: Based on the voltage fed back by the voltage acquisition module, the contact resistance corresponding to the target contact portion after the test contact makes contact with the target chip pin is determined; Determine whether the contact resistance is less than a preset resistance threshold; If so, determine that the target chip pin is a pin that has passed the height measurement and debugging test.

6. The automatic height adjustment method for chip testing as described in claim 5, characterized in that, Also includes: Determine whether each chip pin of the device under test is a pin that has passed the height measurement and debugging test; If so, confirm that the test piece has passed the height measurement and debugging test; If not, it is determined that the test piece has failed the height measurement and debugging test.

7. The automatic height adjustment method for chip testing as described in claim 1, characterized in that, Also includes: Determine whether the cumulative number of uses of the test contact has reached a preset test threshold; If so, the control prompt module outputs a prompt message indicating that the test contact needs to be replaced.

8. The automatic height adjustment method for chip testing as described in any one of claims 1 to 7, characterized in that, The test contact is a retractable contact. Acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the point of cessation of movement, including: Obtain the number of redundant pulses corresponding to the target distance during the operation of the power module, where the target distance is the distance that the test contact shortens from the initial contact between the test contact and the pin of the target chip until the test contact stops moving; The preset reference pulse number is corrected based on the second feature data to obtain a new preset reference pulse number, including: The preset reference pulse number is corrected based on the redundant pulse number to obtain a new preset reference pulse number.

9. A chip testing system, characterized in that, It includes a control module, a test module, a power module, and a drive component; the control module is connected to the test module and the power module, the power module is also connected to the drive component, and the drive component is also connected to the test contact in the test module; The test module is used to feed back first feature data, which characterizes the contact between the test contact and the target chip pin of the test piece. The power module is used to control the movement of the drive component based on the control signal sent by the control module, and to control the drive component to stop moving based on the stop signal sent by the control module. The driving component is used to move the test contact during movement and to stop the test contact when the movement stops. The control module is used to set a preset reference pulse number, which is a target reference pulse number determined based on the distance between the current test contact and the target chip pin. The control signal corresponding to the preset reference pulse number is sent to the power module; the first feature data is continuously acquired, and when it is determined based on the first feature data that the test contact and the target chip pin are in contact, a stop signal is sent to the power module; the second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement is acquired, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

10. The chip testing system as described in claim 9, characterized in that, The test module includes a constant current supply module and a voltage acquisition module; the output terminal of the constant current supply module is grounded through the test contact to output a constant current signal. The voltage acquisition module is connected in parallel with the test contact; The voltage acquisition module is used to acquire voltage and feed the voltage back to the control module as the first feature data. The voltage is a first voltage value when the test contact is in contact with the pin of the target chip, and a second voltage value when the test contact is not in contact with the pin of the target chip.

11. The chip testing system as described in claim 10, characterized in that, The test contact includes a first contact and a second contact. One end of the first contact is connected to the output terminal of the constant current providing module and the first input terminal of the voltage acquisition module. One end of the second contact is connected to the second input terminal of the voltage acquisition module and then grounded. The other ends of the first contact and the second contact are both used to connect to the pins of the target chip, and the other ends of the first contact and the second contact do not make contact. The control module is specifically used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire the voltage acquired by the voltage acquisition module, and send a stop signal to the power module when the voltage is determined to be non-zero; acquire second feature data characterizing the movement of the test contact from the initial contact with the target chip pin to the stop movement, so as to correct the preset reference pulse number based on the second feature data to obtain a new preset reference pulse number.

12. The chip testing system as described in claim 11, characterized in that, The first contact and the second contact include a first conductive element, an elastic telescopic element and a second conductive element connected in sequence.

13. The chip testing system as described in claim 10, characterized in that, The control module is also used to determine the contact resistance of the target contact portion after the test contact makes contact with the target chip pin based on the voltage fed back by the voltage acquisition module, and to determine that the target chip pin is a pin that has passed the height measurement and debugging test when the contact resistance is less than a preset resistance threshold.

14. The chip testing system as described in claim 13, characterized in that, The control module is also used to determine whether each chip pin of the device under test is a pin that has passed the height measurement and debugging test. If so, it is determined that the device under test has passed the height measurement and debugging test; if not, it is determined that the device under test has failed the height measurement and debugging test.

15. The chip testing system as described in claim 9, characterized in that, The control module is also used to determine whether the cumulative use of the test contact has reached a preset test threshold; if so, the control prompt module outputs a prompt message indicating that the test contact needs to be replaced.

16. The chip testing system as described in claim 9, characterized in that, The control module is specifically used to set a preset reference pulse number, send a control signal corresponding to the preset reference pulse number to the power module; continuously acquire the first feature data, and send a stop signal to the power module when it is determined based on the first feature data that the test contact and the target chip pin are in a contact state; The redundant pulse count corresponding to the target distance during the operation of the power module is obtained. The target distance is the distance that the test contact shortens during the process from the initial contact between the test contact and the target chip pin until the test contact stops moving. The preset reference pulse count is then corrected based on the redundant pulse count to obtain a new preset reference pulse count.

17. A computer-readable storage medium, characterized in that, include: The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the automatic height adjustment method for chip testing as described in any one of claims 1 to 8.

18. A control device, characterized in that, include: Memory, used to store computer programs; A processor, when executing the computer program, implements the steps of the automatic height adjustment method for chip testing as described in any one of claims 1 to 8.

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