An electronic device

Abstract

The present application discloses an electronic device, which includes: a backlight module for emitting backlight; a display module located on the light-emitting side of the backlight module, for emitting display light based on the backlight; and a photosensitive component for detecting the backlight.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and more specifically, to an electronic device with a display function. Background Art

[0002] With the continuous development of science and technology, more and more electronic devices with display functions are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today.

[0003] For non-actively emitting display modules, such as LCDs (liquid crystal displays), image display relies on backlighting from a backlight module. Typically, the backlight module emits white visible light as backlight, and the display module controls the transmittance of the three primary colors of red, green, and blue (RGB) in the white backlight based on a pixel array to achieve image display.

[0004] When an electronic device displays an image, if the backlight cannot meet the display requirements, the image display quality will be affected. Summary of the Invention

[0005] In view of this, the present application provides an electronic device, the solution is as follows:

[0006] An electronic device, comprising:

[0007] Backlight module, used for emitting backlight;

[0008] a display module, located on the light-emitting side of the backlight module, and configured to emit display light based on the backlight;

[0009] A photosensitive component is used to detect the backlight.

[0010] Preferably, in the above electronic device, the display module includes:

[0011] a first substrate;

[0012] a semiconductor structure array and a pixel structure array located on a side of the first substrate facing away from the backlight module, wherein the semiconductor structure array is located between the first substrate and the pixel structure array;

[0013] Wherein, the semiconductor structure array includes:

[0014] a first semiconductor structure array, configured to control pixel structures in the pixel structure array to convert the backlight into display light;

[0015] The second semiconductor structure array is used as the photosensitive component and can generate a current representing the backlight intensity based on the light irradiation from the backlight.

[0016] Preferably, in the above electronic device, a first light shielding component is provided on the surface of the first substrate, and the first light shielding component is located on a path through which the backlight illuminates a target area of the first semiconductor structure in the first semiconductor structure array; the first light shielding component is located outside a path through which the backlight illuminates a target area of the second semiconductor structure in the second semiconductor structure array;

[0017] The target area is an area where the semiconductor structure can generate current when exposed to light.

[0018] Preferably, in the above electronic device, in a direction perpendicular to the plane of the first substrate, the target area of the first semiconductor structure at least partially overlaps with the first shading component, and the target area of the second semiconductor structure does not overlap with the first shading component.

[0019] Preferably, in the above electronic device, a second light shielding component is covered on a side of the second semiconductor structure in the second semiconductor structure array facing away from the backlight module.

[0020] Preferably, in the above-mentioned electronic device, there is a first filter on the path of the backlight irradiating the photosensitive component, and the first filter is used to allow the first color light in the backlight to pass through, so that the second semiconductor structure array detects the intensity of the first color light in the backlight.

[0021] Preferably, in the above electronic device, the light emitting side of the pixel structure array has a second substrate, and the second substrate has a second filter on a side facing the pixel structure array, and the second filter is used to allow the first color light in the display light to pass through;

[0022] The manufacturing process parameters of the first filter element and the second filter element are the same.

[0023] Preferably, the electronic device further comprises: a light guide structure, the light guide structure having a first end and a second end, the first end facing the backlight module, and the second end facing the photosensitive component;

[0024] The light-guiding structure is used to allow the backlight collected by the first end to be emitted from the second end along the light-guiding path defined by the light-guiding structure and then illuminate the photosensitive component.

[0025] Preferably, in the above electronic device, the electronic device includes a display area and a non-display area surrounding at least one side of the display area; the first semiconductor structure array is located in the display area, and the second semiconductor structure array is located in the non-display area;

[0026] The peripheral edge of the surface of one side of the display module facing the backlight module is mounted and fixed on a frame;

[0027] The frame has a receiving space for receiving the backlight module;

[0028] The light guide structure is embedded in the body of the frame, and the frame has a first opening on the inner wall facing the backlight module to expose the first end; the frame has a second opening towards the top of the display module to expose the second end.

[0029] Preferably, the electronic device includes at least one of the following design methods:

[0030] The surface of the first end or the second end has a conversion member for converting the backlight into infrared light, and the photosensitive component detects the backlight based on the infrared light.

[0031] The second end includes a light-concentrating structure, and the light-concentrating structure is used to converge the light in the light-guiding structure and illuminate the photosensitive component;

[0032] At least two of the semiconductor structures serve as the second semiconductor structure array.

[0033] Preferably, in the above electronic device, the backlight module includes:

[0034] Light-emitting components;

[0035] A light guide assembly, configured to form the backlight based on light emitted by the light emitting assembly;

[0036] Wherein, the photosensitive component is arranged on the light-emitting component.

[0037] Preferably, in the above electronic device, the electronic device includes a display area and a non-display area surrounding at least one side of the display area;

[0038] The peripheral edge of the display module facing the backlight module is fixed on a frame; the frame has a receiving space for receiving the backlight module; the peripheral edge is located in the non-display area;

[0039] The side wall of the accommodating space has a first groove for accommodating the light source in the light-emitting component and a second groove for accommodating the photosensitive component; the first groove and the second groove are located in different areas of the side wall; the photosensitive surface of the photosensitive component faces the accommodating space. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0041] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0042] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0043] Figure 2 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0044] Figure 3 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0045] Figure 4 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0046] Figure 5 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0047] Figure 6 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0048] Figure 7 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0049] Figure 8 A top view of an electronic device provided in an embodiment of the present application;

[0050] Figure 9 for Figure 8 A cross-sectional view of the electronic device shown in the A-A' direction;

[0051] Figure 10 for Figure 8 A cross-sectional view of the electronic device shown in the B-B' direction;

[0052] Figure 11A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0053] Figure 12 A schematic structural diagram of a backlight module provided in an embodiment of the present application;

[0054] Figure 13 A schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0055] Figure 14 for Figure 13 A top view of a frame with a backlight module in an electronic device is shown. DETAILED DESCRIPTION

[0056] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0057] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0058] refer to Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, wherein the electronic device includes:

[0059] A backlight module 11 is used to emit backlight;

[0060] The display module 12 is located on the light-emitting side of the backlight module 11 and is used to emit display light based on the backlight;

[0061] The photosensitive component 13 is used to detect backlight.

[0062] The electronic device provided by the technical solution of the present application is integrated with a photosensitive component 13, which is capable of detecting backlight, so that the electronic device has the function of detecting backlight.

[0063] Optionally, the electronic device can determine whether the backlight meets the display requirements based on the backlight detection result.

[0064] Furthermore, when the backlight does not meet the display requirements, the electronic device can control the display module 12 and / or the backlight module 11 to resolve the display deviation caused by the backlight deviation.

[0065] If the backlight detection result indicates that the current backlight deviates from the standard backlight, in order to avoid color deviation / brightness deviation in the display image of the electronic device, one way is to adjust the backlight parameters of the backlight module 11 based on the backlight detection result, so that the backlight emitted by the backlight module 11 meets the same conditions as the standard backlight, that is, the backlight emitted by the backlight module 11 is the same or approximately the same as the standard backlight; another way is to adjust the display parameters of the display module 12 based on the backlight detection result to compensate for the deviation between the current backlight and the standard backlight, which causes the color deviation / brightness deviation in the display image of the electronic device to occur.

[0066] In the embodiment of the present application, Figure 1 As shown, the space in the display module 12 can be used to integrate the photosensitive component 13 into the display module 12, and the space in the backlight module 11 can be used to integrate the photosensitive component 13 into the backlight module 11. In this way, the integration level of the electronic device can be improved, and the miniaturization design of the electronic device can be facilitated.

[0067] refer to Figure 2 As shown, Figure 2 This is a structural diagram of another electronic device provided in an embodiment of the present application, based on the above embodiment, Figure 2 In the electronic device shown, the display module 12 includes:

[0068] a first substrate 121;

[0069] A semiconductor structure array 122 and a pixel structure array 123 are located on a side of the first substrate 121 away from the backlight module 11 , and the semiconductor structure array 122 is located between the first substrate 121 and the pixel structure array 123 ;

[0070] The semiconductor structure array 122 includes:

[0071] A first semiconductor structure array 122a, the first semiconductor structure array 122a is used to control the pixel structures in the pixel structure array 123 to convert backlight into display light;

[0072] The second semiconductor structure array 122b is used as the photosensitive component 13. The second semiconductor structure array 122b can generate a current representing the backlight intensity based on the light irradiation from the backlight.

[0073] based on Figure 2 In the method shown, the second semiconductor structure array 122b is used as the photosensitive component 13, and the second semiconductor structure array 122b can be prepared at the same time as the first semiconductor structure array 122a. It is highly compatible with the preparation process of the existing display module 12, and there is no need to add a separate process step to produce the photosensitive component 13.

[0074] Semiconductor structure array 122 comprises a plurality of semiconductor structures arranged in an array. A portion of the semiconductor structures in semiconductor structure array 122 serves as the first semiconductor structure in first semiconductor structure array 122a, which is used to control the pixel structures in pixel structure array 123 to convert backlight into display light, thereby displaying an image. Another portion of the semiconductor structures in semiconductor structure array 122 serves as the second semiconductor structure in second semiconductor structure array 122b, which is used to generate a current representing the backlight intensity based on illumination from the backlight. The pixel structure array comprises a plurality of pixel structures arranged in an array, each of which includes a pixel electrode.

[0075] In order to improve the photosensitivity of the second semiconductor structure, a target region of the second semiconductor structure is doped with rare metals to improve the characteristics of the photocurrent, wherein the rare metals include lanthanide metals.

[0076] In the embodiment of the present application, the display module is a liquid crystal display module. A liquid crystal layer is arranged on the side of the pixel structure array 123 facing away from the first substrate 121, and a second substrate is arranged on the side of the liquid crystal layer facing away from the first substrate 121. The surface of the second substrate has a filter element (i.e., the second filter element hereinafter) corresponding one-to-one to the pixel structure. The pixel structure can control the light transmittance of the three primary colors of red, green and blue in the backlight through the liquid crystal layer based on the second filter element with different transmittance colors.

[0077] The semiconductor structures in the semiconductor array 122 are thin-film transistors (TFTs), i.e., both the first semiconductor structure and the second semiconductor structure are thin-film transistors. The active region of a thin-film transistor can generate a current under illumination, and the intensity of the current is related to the light intensity. Based on this characteristic of thin-film transistors, they can be used as photosensitive components 13 for backlight detection.

[0078] The electronic device includes a display area and a non-display area surrounding at least one side of the display area. The first semiconductor structure array 122a and the pixel structure array 123 are both located in the display area. To prevent the first semiconductor structure from affecting light emitted from the pixel region where the pixel structure is located, the first semiconductor structure and the pixel region do not overlap in a direction perpendicular to the plane of the first substrate 121. That is, the first semiconductor structure is located within the pixel gap between the pixel regions.

[0079] In a direction perpendicular to the plane where the first substrate 121 is located, the second semiconductor structure may be arranged in the display area and in the pixel gaps between the pixel areas.

[0080] Given that the pixel area size and pixel gap in high-resolution electronic devices are relatively small, in order to ensure that the second semiconductor structure array 122b has sufficient layout space to facilitate the setting of the second semiconductor structure array 122b, while avoiding the impact of the layout of the second semiconductor structure array 122 on the pixel structure in the display area and the first semiconductor structure array 122a, it is preferred to set the second semiconductor structure array 122b in the non-display area.

[0081] refer to Figure 3 As shown, Figure 3 A structural diagram of another electronic device provided in an embodiment of the present application, Figure 2 Based on the electronic equipment shown, Figure 3 In the electronic device shown, a first shading component 14 is provided on the surface of the first substrate 11, and the first shading component 14 is located on the path of the target area of the first semiconductor structure in the first semiconductor structure array 122a when backlight is irradiated; the first shading component 14 is located outside the path of the target area of the second semiconductor structure in the second semiconductor structure array 122b when backlight is irradiated; wherein the target area is the area where the semiconductor structure can generate current when exposed to light.

[0082] exist Figure 3 In the illustrated embodiment, the first shading component 14 is located on the surface of the first substrate 121 , and is not limited to being located on the side of the first substrate 121 facing the semiconductor structure array 122 , but may also be located on the side of the first substrate 121 facing away from the semiconductor structure array 122 .

[0083] The first light shielding assembly 14 is positioned along a path through which backlight illuminates a target region of the first semiconductor structure in the first semiconductor structure array 122a. This arrangement can reduce or even prevent backlight from irradiating the target region of the first semiconductor structure, thereby preventing light current generated in the target region of the first semiconductor structure from affecting the display control signal. Furthermore, the first light shielding assembly 14 is positioned outside a path through which backlight illuminates a target region of the second semiconductor structure in the second semiconductor structure array 122b, allowing light from the backlight to illuminate the target region of the second semiconductor structure, thereby generating light current and enabling backlight detection.

[0084] In a direction perpendicular to the plane of the first substrate 121, the target area of the first semiconductor structure is set to at least partially overlap with the first shading component 14, so that the backlight is blocked by the first shading component 14 from irradiating the target area of the first semiconductor structure, thereby preventing the first semiconductor structure from generating photocurrent; the target area of the second semiconductor structure is set to not overlap with the first shading component 14, so that the light from the backlight can irradiate the target area of the second semiconductor structure, thereby causing the second semiconductor structure to generate photocurrent.

[0085] As described above, the semiconductor structures in the semiconductor structure array 122 may be thin-film transistors. The target region is the active region of the thin-film transistor. In the display module 12, to prevent backlight exposure to the first semiconductor structures in the display area, which may generate current that interferes with the display control signal, a first light shielding assembly 14 is provided between the first semiconductor structure array 122a and the backlight module 11 to prevent backlight exposure to the target region of the first semiconductor structures.

[0086] The first light-shielding component 14 includes a plurality of light-shielding blocks 141 arranged one-to-one opposite to the first semiconductor structure. The vertical projection of the target area of the first semiconductor structure on the first substrate 121 is located within the vertical projection of the corresponding light-shielding block 141 on the first substrate 121, so that the first light-shielding component 14 is located on the path of the target area of the first semiconductor structure illuminated by backlight, so as to better shield the target area of the first semiconductor structure through the light-shielding area 141 to avoid the generation of light current.

[0087] The second semiconductor structures in the second semiconductor structure array 122b are required to generate current based on backlight-induced light for backlight detection. Therefore, the vertical projection of the target area of the second semiconductor structure on the first substrate 121 and the vertical projection of the first light shielding member 14 on the first substrate 121 do not overlap. This positions the first light shielding member 14 outside the path of the backlight irradiating the target area of the second semiconductor structure. This allows light from the backlight to illuminate the target area of the second semiconductor structure, generating light current and enabling backlight detection.

[0088] The first light shielding element 14 is generally a patterned metal layer disposed on the surface of the first substrate 121. When the first light shielding element 14 is located between the first substrate 121 and the semiconductor structure array 122, an insulating layer is provided between the first light shielding element 14 and the semiconductor structure array 122 to prevent short circuits.

[0089] refer to Figure 4 As shown, Figure 4 This is a structural diagram of another electronic device provided in an embodiment of the present application. Based on the above electronic device, Figure 4 In the illustrated electronic device, the side of the second semiconductor structure in the second semiconductor structure array 122b facing away from the backlight module 11 is covered with a second light shielding assembly 15. The second light shielding assembly 15 is used to absorb backlight that illuminates the area where the second light shielding assembly 15 is located and its surrounding area, preventing this portion of backlight from affecting the display effect. At the same time, the second light shielding assembly 15 can also prevent ambient light from irradiating the target area of the second semiconductor structure, preventing ambient light from interfering with the accuracy of backlight detection.

[0090] It should be noted that Figure 4 The method shown in Figure 2The electronic device structure is illustrated based on the method shown in the figure. Obviously, it can also be Figure 3 A second shading component 15 is provided based on the manner shown.

[0091] The second light shielding component 15 at least covers the top surface of the second semiconductor structure facing away from the first substrate 121. In order to achieve a better display effect, the second light shielding component 15 can also surround the sidewalls of the second semiconductor structure.

[0092] The backlight module 11 emits white light, and the display module 12 can control the transmittance of red light, green light, and blue light (three primary colors of visible light) in the white light based on the pixel structure array to achieve color image display.

[0093] In an embodiment of the present application, one method is to directly detect the white backlight through the photosensitive component 13, thereby detecting the intensity of the backlight, and based on the detection result, it can be determined whether the current backlight has a brightness deviation relative to the standard backlight.

[0094] In another way, the photosensitive component 13 can detect at least one of the red, green and blue colors in the white backlight to obtain the intensity of the monochromatic light in the backlight. Based on the detection result, it can be determined whether there is a brightness deviation of a certain color light in the current backlight relative to the same color light in the standard backlight. In order to achieve the purpose of backlight detection, the structure of the electronic device can be as follows: Figure 5 shown.

[0095] refer to Figure 5 As shown, Figure 5 This is a structural diagram of another electronic device provided in an embodiment of the present application. Based on the above electronic device embodiment, Figure 5 In the electronic device shown, a first filter 16 is provided on the path of the backlight irradiating the photosensitive component 13. The first filter 16 is used to allow the first color light in the backlight to pass through so that the second semiconductor structure array 122b detects the intensity of the first color light in the backlight. Figure 5 The dashed arrow in the middle is used to indicate the backlight.

[0096] in, Figure 5 The method shown in Figure 2 The electronic device structure is illustrated based on the method shown in the figure. Obviously, it can also be Figure 3 or Figure 4 The first filter 16 is arranged in the manner shown.

[0097] The first filter 16 is provided so that the photosensitive component 13 can detect the intensity of the first color light in the backlight. When displaying a picture with set brightness, the required standard backlight brightness is determined, and under the standard backlight brightness, the brightness of the three primary colors in the standard backlight is determined.

[0098] Based on the detection result of the first color light, it can be determined whether there is a brightness deviation between the first color light in the current backlight and the first color light in the standard backlight. The first color light can be any one of the three primary colors.

[0099] Optionally, the electronic device includes two different first optical filters 16, each corresponding to a different second semiconductor structure array 122b. The two first optical filters 16 transmit different first color light, each selected from red, green, and blue. This allows detection of brightness deviations between the red, green, and blue light in the backlight, and further, determination of brightness deviations of a third light source.

[0100] When it is uncertain whether the backlight emitted by the backlight module 11 meets the standard backlight, based on Figure 5 The illustrated method can detect whether at least one of the red light, green light, and blue light of the current backlight has a brightness deviation relative to the light of the same color in the standard backlight.

[0101] refer to Figure 6 As shown, Figure 6 A structural schematic diagram of another electronic device provided in an embodiment of the present application, wherein the light-emitting side of the pixel structure array 123 has a second substrate 17, and the surface of the second substrate 17 facing the pixel structure array 123 has a second filter 18, and the second filter 18 is used to allow the first color light in the display light to pass through; wherein, the manufacturing process parameters of the first filter 16 and the second filter 18 are the same.

[0102] The manufacturing process parameters of the first filter element 16 and the second filter element 18 are the same, including the following two methods:

[0103] In the first method, the first filter 16 and the second filter 18 are different parts of the same filter, so that the first filter 16 and the second filter 18 have the same process parameters. In this method, a large filter can be prepared first and then divided into multiple smaller filters. The smaller filters are then placed at designated locations in the electronic device, serving as the first filter 16 or the second filter 18.

[0104] Method 2: Place the second substrate 17 and the target component in the same equipment, and use the same equipment to simultaneously prepare filters on the second substrate 17 and the target component. The filter formed on the surface of the second substrate 17 is the second filter 18, and the filter formed on the surface of the target component is the first filter 16, so that the first filter 16 and the second filter 18 have the same process parameters. The target component is a structural component in the electronic device on which the first filter 16 is to be set.

[0105] Since the operating temperature and driving current of the backlight module 11 will affect the brightness and chromaticity of the backlight. Before the backlight module 11 is assembled with the display module 12, the backlight module can be subjected to luminescence detection to determine the standard operating parameters when the backlight module emits standard backlight. The standard operating parameters include operating temperature parameters and driving current. Therefore, when the electronic device controls the backlight module 11 to operate based on the above-mentioned standard operating parameters, the backlight currently emitted by the backlight module 11 can be a standard backlight without color deviation and brightness deviation. Therefore, when the backlight emitted by the backlight module 11 is a standard backlight, the proportions of red light, green light and blue light in the current backlight are the same, and the brightness of the first color light in the current backlight is a determined value, which is one-third of the brightness of the standard backlight.

[0106] exist Figure 6 In the electronic device shown, the color deviation of the second filter 18 can be determined based on the detection result of the first color light by the photosensitive component 13. Since the manufacturing process parameters of the first filter 16 and the second filter 18 are the same, the light transmission properties of the two are the same. When the detection result and the above-mentioned determined value meet the same conditions, it can be determined that the second filter 18 has no light transmission color deviation. Conversely, when the absolute value of the difference between the detection result and the above-mentioned determined value is greater than a set threshold, it indicates that the second filter 18 has color deviation. The color deviation amount is positively correlated with the absolute value of the above-mentioned difference, and the color deviation amount of the second filter 18 can be determined based on the absolute value of the difference. Based on this color deviation amount, the display control signal of the display module can be adjusted to compensate for this color deviation amount, thereby avoiding color deviation problems in the displayed image.

[0107] A second filter 18 for transmitting blue light, a second filter 18 for transmitting green light, and a second filter 18 for transmitting red light are provided on the surface of the second substrate 17 , so that the display module 12 can display color images.

[0108] When a first filter 16 that transmits blue light is provided, based on the detection result of the backlight by the photosensitive component 13 corresponding to the first filter 16, it can be determined whether the second filter 18 that transmits blue light on the second substrate 17 has a color cast; when a first filter 16 that transmits green light is provided, based on the detection result of the backlight by the photosensitive component 13 corresponding to the first filter 16, it can be determined whether the second filter 18 that transmits green light on the second substrate 17 has a color cast; when a first filter 16 that transmits red light is provided, based on the detection result of the backlight by the photosensitive component 13 corresponding to the first filter 16, it can be determined whether the second filter 18 that transmits red light on the second substrate 17 has a color cast.

[0109] In the embodiment of the present application, at least one of the first filter 16 that transmits blue light, the first filter 16 that transmits green light, and the first filter 16 that transmits red light is included, and the first filters 16 with different transmittance colors are respectively provided with independent second semiconductor structure arrays 122b, that is, the photosensitive components 13 are respectively provided with corresponding ones.

[0110] As mentioned above, the display module 12 is a liquid crystal display module. The liquid crystal display module includes an array substrate and a color filter substrate that are arranged opposite to each other, and a liquid crystal layer located between the array substrate and the color filter substrate. Among them, the color filter substrate includes: a first substrate 121; a semiconductor structure array 122 and a pixel structure array 123 on the surface of the first substrate 121. The color filter substrate includes: a second substrate 17 and a second filter 18 on the surface of the second substrate 17, and the second filter 18 is a color resistance unit. The liquid crystal layer is not shown in the drawings of the embodiment of the present application. As mentioned above, the embodiment of the present application can detect whether there is a color deviation problem in the color resistance unit in the color filter substrate. The second substrate 17 has a black matrix 19 on the side surface facing the first substrate 11. The black matrix 19 has pixel openings that correspond one-to-one to the pixel areas, which are used to set the second filter 18.

[0111] refer to Figure 7 As shown, Figure 7 This is a structural diagram of another electronic device provided in an embodiment of the present application. Based on any of the above embodiments, Figure 7 The electronic device shown also includes: a light-guiding structure 19, the light-guiding structure 19 having a first end and a second end, the first end facing the backlight module 11, and the second end facing the photosensitive component 13; wherein, the light-guiding structure 19 is used to make the backlight collected by the first end along the light-guiding path defined by the light-guiding structure 19, and emitted from the second end to illuminate the photosensitive component 13.

[0112] For clarity of illustration, Figure 7 Only the backlight module 11, the light guide structure 19 and the photosensitive component 13 are shown, and other structures of the electronic device are not shown. Other structures can refer to any of the above embodiments and will not be described here. Figure 7 According to the principle shown, a light guide structure 19 is provided.

[0113] By providing the light guide structure 19 in the electronic device, the backlight can illuminate the photosensitive component 13 based on the path defined by the light guide structure 19, which makes it easier to install and arrange the photosensitive component 13 in the electronic device, making the installation and installation of the photosensitive component 13 in the electronic device more flexible and convenient. In addition, the light guide structure 19 can also increase the incidence rate of light from the backlight entering the photosensitive component 13.

[0114] When the electronic device is provided with both the light guide structure 19 and the first light filter 16, the first light filter 16 is provided between the first end and the backlight module 11, or between the second end and the photosensitive component 13. Optionally, the first light filter 16 can be provided to cover the first end surface of the light guide structure 19, or to cover the second end surface of the light guide structure, to save space and improve integration.

[0115] refer to Figures 8-10 As shown, Figure 8 A top view of an electronic device provided in an embodiment of the present application is shown. Figure 9 for Figure 8 The cross-sectional view of the electronic device shown in the A-A' direction, Figure 10 for Figure 8 A cross-sectional view of the electronic device shown in the BB' direction.

[0116] Based on the above embodiments, Figures 8-10 The electronic device shown includes a display area 100 and a non-display area 200 surrounding at least one side of the display area 100. A first semiconductor structure array 122a is located in the display area 100, and a second semiconductor structure array 122b is located in the non-display area 200. The display module 12 is mounted and fixed to a frame 20 at the periphery of a surface on one side facing the backlight module 11; the frame 20 has a receiving space 21 for accommodating the backlight module 11; wherein, the light guide structure 19 is embedded in the body 201 of the frame 20, and the inner wall of the frame 20 facing the backlight module 11 has a first opening 202 to expose the first end; the frame 20 has a second opening 203 on the top facing the display module 12 to expose the second end.

[0117] To avoid the problem of dimmed display brightness in a certain area of the electronic device due to the first opening 202, a transflective coating can be provided inside the opening. The first opening 202 can be placed in an inner wall area where backlight is more concentrated, such as with the light source of the backlight module facing the inner wall area. The first opening 202 can be used to sample the backlight while solving the problem of excessive backlight brightness in certain areas.

[0118] Optionally, the first opening 202 is set to be larger than the second opening 203, so that light is concentrated to illuminate the photosensitive component 13 while increasing the lighting, thereby improving the accuracy and sensitivity of backlight detection.

[0119] Double-shot molding technology can be used to embed the light guide structure 19 into the body 201 of the frame 20, which not only improves the integration and saves the installation space of the light guide structure 19, but also enables the backlight to be transmitted based on the required path while ensuring the intensity of the incident backlight.

[0120] To facilitate the installation and fixation of the display module 12, the frame 20 is provided with a groove for accommodating the display module 12 on the top facing the display module 12, and the second opening 203 is located at the bottom of the groove in an area corresponding to the photosensitive component 13. In other embodiments, the top can also be provided as a flat surface, with the second opening 203 located in an area of the flat surface corresponding to the photosensitive component 13, and the display module 12 can be directly bonded and fixed to the flat surface using double-sided tape.

[0121] Figures 8-10 In the illustrated electronic device, the light guide structure 19 is embedded within the frame 20, eliminating the need for additional mounting space, thereby facilitating miniaturization. Furthermore, the second semiconductor structure array 122b is positioned within the non-display area 200, providing ample space for the second semiconductor structure array 122b without affecting the layout of the first semiconductor structure array 122a and the pixel structure array 123 within the display area 100.

[0122] The backlight module 11 includes a light emitting component 112 , a light guide component 111 , and a reflector 113 . The reflector 113 is located on a surface of the light guide component 111 that faces away from the display module 12 . Figure 9 Taking the edge-lit light source as an example, the light emitting component 112 is located on the side of the light guide component 111. The backlight module 11 may also adopt a direct-lit light source, that is, the light emitting component 112 is located on the side of the light guide component 111 away from the display module 12.

[0123] In order to improve the quality of the backlight emitted by the backlight module 11, an optical film layer structure can be set on the surface of the light guide component facing the display module 12. The optical film layer structure includes: a diffuser for improving the uniformity of the backlight, and / or a prism for improving the collimation of the backlight. Figure 9 The optical film layer structure is not shown in FIG.

[0124] The display module 12 includes an array substrate 21 and a color filter substrate 22 that are oppositely disposed, and a liquid crystal layer located between the array substrate 21 and the color filter substrate 22 . Figure 9 The liquid crystal layer is not shown. The array substrate 21 includes the first substrate 121, the semiconductor structure array 122, and the pixel structure array 123 in the above embodiment. The color filter substrate 22 includes the second substrate 17 and the second filter 18 in the above embodiment. Polarizers need to be provided on the side of the display module 12 facing away from the backlight module 11 and the side facing the backlight module 11, respectively. Figure 9 Polarizers are not shown.

[0125] exist Figures 8-10In the illustrated method, an electronic device is provided with multiple semiconductor structures as the second semiconductor structure array 122b as an example for illustration. In the embodiment of the present application, one semiconductor structure or multiple semiconductor structures can be provided as the second semiconductor structure array 122b based on the needs. When multiple semiconductor structures are provided as the second semiconductor structure array 122b, the positions of the multiple semiconductor structures on the first substrate 11 can be set based on the needs, and are not limited to Figure 8 The non-display area 200 is shown disposed on the same side of the display area 100 .

[0126] Optionally, a conversion element may be provided on the surface of the first or second end of the light-guiding structure 19. The conversion element is used to convert backlight into infrared light, and the photosensitive component 13 detects the backlight based on the infrared light. The conversion element may be an infrared quantum dot coating. By providing the conversion element, the backlight can be converted into red light, and the photosensitive component 13 detects the backlight based on the infrared light. This prevents backlight that is not absorbed by the photosensitive component 13 from entering the display module 12 when the backlight directly illuminates the photosensitive component 13, thereby affecting the image display quality.

[0127] refer to Figure 11 As shown, Figure 11 This is a schematic diagram of the structure of another electronic device provided in an embodiment of the present application. In the electronic device shown in this embodiment, the above-mentioned first filter 16 and the conversion element 23 for converting backlight into infrared light are both provided. The first filter 16 is covered on the first end surface of the light guide structure 19, and the conversion element 23 is covered on the second end surface of the light guide structure 19. This embodiment can allow only the first color light in the backlight to enter the light guide structure 19 through the first filter 16, and convert the first color light into infrared light at the second end, so that the photosensitive component 13 can detect the infrared light based on the conversion of the first color light in the backlight, and thus can obtain the intensity of the first color light in the backlight based on the detection result.

[0128] like Figure 11 As shown, the setting frame 20 is fixed to the bottom periphery of the display assembly 12 by a black double-sided tape 24. The black double-sided tape 24 covers the first end with the conversion member 23, and infrared light can pass through the black double-sided tape 24.

[0129] The backlight brightness within the accommodating cavity 21 is extremely high, reaching over 8,000 nits, and some backlight module 11 configurations can reach over hundreds of thousands of nits. To prevent light leakage in the non-display area 200 of the electronic device, black double-sided tape 24 is provided. This not only secures the bottom perimeter of the display assembly 12 to the frame 20, but also prevents backlight leakage in the area where the frame 20 and display module 12 are relatively fixed, thereby preventing any impact on the display effect.

[0130] The electronic device provided in the embodiments of the present application includes at least one of the following design methods:

[0131] 1) The surface of the first end has a conversion element 23 for converting backlight into infrared light, which is then detected by the photosensitive component 13 based on infrared light. When both the conversion element 23 and the first optical filter 16 are provided, the conversion element 23 is preferably positioned at the second end, and the first optical filter 16 is preferably positioned at the first end. Alternatively, both elements can be positioned at the same end of the light guide structure 19. In this case, the first optical filter 16 is positioned at the front end of the propagation path from the backlight to the photosensitive component 13, that is, the backlight passes through the first optical filter 16 before passing through the conversion element 23.

[0132] 2) The second end includes a light-concentrating structure, which is used to converge the light in the light-guiding structure 19 and illuminate the photosensitive component 13; the light-concentrating structure can be a convex lens-shaped second end of the light-guiding structure 19;

[0133] 3) At least two semiconductor structures are used as the second semiconductor structure array 122b to reduce the difficulty of assembling related structures of the second semiconductor structure, improve product yield, and simultaneously, during the calibration process for determining backlight intensity and current, select one or more second semiconductor structures with high photocurrent efficiency as the final photosensitive component 13. Furthermore, photosensitive components 13 can be formed in multiple different areas of the electronic device, preventing the impact of local variations on backlight detection results and improving the precision and accuracy of backlight detection.

[0134] In the embodiment of the present application, the electronic device may include one or any combination of methods 1) to 3).

[0135] The electronic device may be configured based on requirements to include at least one of the light guide structure 19, the first filter element 16, and the conversion element 23. The present embodiment of the application will not be described one by one in the drawings.

[0136] In the above embodiments, the photosensitive component 13 is integrated into the display module 12 as an example for description. In other embodiments, the photosensitive component 13 can also be integrated into the backlight module 11. In this case, the structure of the electronic device can be as follows: Figure 12 shown.

[0137] refer to Figure 12 As shown, Figure 12 This is a structural diagram of a backlight module provided in an embodiment of the present application. Figure 12 This is a top view of the backlight module 11 in the backlight emission direction. In this way, the photosensitive component 13 is integrated into the backlight module 11. Specifically, the backlight module 11 includes:

[0138] Light emitting component 112;

[0139] A light guide assembly 111, the light guide assembly 111 is used to form a backlight based on the light emitted by the light emitting assembly 112;

[0140] The photosensitive component 13 is disposed on the light emitting component 112 .

[0141] Figure 12 The backlight module 12 with an edge-type light source is illustrated, and the light-emitting component 112 is located on the side of the light-guiding component 111. The light-emitting component 112 includes a circuit board 31 and a plurality of light sources 32 disposed on the circuit board 31. The light sources 32 may be LEDs.

[0142] In this manner, the photosensitive component 13 may be a photosensitive chip, and the circuit board 31 of the light source 32 may be directly reused to bind the photosensitive component 13. The sampling wavelength of the photosensitive chip is between 400nm and 500nm, preferably between 440nm and 460nm.

[0143] refer to Figure 13 and Figure 14 As shown, Figure 13 This is a structural diagram of another electronic device provided in an embodiment of the present application. Figure 14 for Figure 13 A top view of a frame with a backlight module is shown in the electronic device. In this embodiment, the electronic device includes a display area 100 and a non-display area 200 surrounding at least one side of the display area 100. The display module 12 is mounted and fixed to a frame 20 at the periphery of a surface facing the backlight module 11. The frame 20 has a receiving space 21 for accommodating the backlight module 11. The periphery of the display module 12 is located in the non-display area 200. The sidewall of the receiving space 21 has a first groove 41 for accommodating the light source 32 and a second groove 42 for accommodating the photosensitive component 13. The first groove 41 and the second groove 42 are located in different areas of the sidewall. The photosensitive surface of the photosensitive component 13 faces the receiving space 21.

[0144] The first groove 41 is used to accommodate the light source 32, and the second groove 42 is used to accommodate the photosensitive component 13. This can save installation space for the light source 32 and the photosensitive component 13, improve integration, and facilitate miniaturization of electronic equipment. In order to improve the backlight output efficiency, a reflective member 113 can be provided below the light guide component 111.

[0145] Optionally, in combination with the reflector 113 or the bottom iron frame at the bottom of the accommodating space 21, the second groove 42 is a closed cavity in all directions except for the opening toward the interior of the accommodating space 21. By increasing the opening, the amount of backlight incident is increased. To avoid the problem of dark corners, the opening is no larger than 1 mm.

[0146] The sidewall of the second groove 42 is provided with a semi-reflective, semi-transmissive optical structure at the location corresponding to the opening of the second groove, thereby ensuring that light enters the opening while preventing the corners of the electronic device from being darkened. The light transmittance of the semi-reflective, semi-transmissive optical structure is not less than the transmittance of the display module, for example, the transmittance is not less than 5%.

[0147] The inner surface of the cavity formed by the second groove 42 has a sealing layer to ensure the stability of the amount of light entering. The reflectivity of the sealing layer is not less than 70% to reduce the loss of sampling light of the photosensitive component 13.

[0148] A photosensitive component 13 can be installed at opposite ends of the circuit board 31, with one component 13 serving as the main photosensitive element and the other as the calibration component. If the detection values of both components 13 match their respective calibration brightness / current curves, the average of their rates of change is used as the sampling value for brightness adjustment. Furthermore, installing two photosensitive components 13 increases system redundancy and improves the reliability of the sampling system.

[0149] Since the backlight brightness is 10-30 times the display brightness of the display module 12, the photosensitive component 13 is directly set in the accommodating space 21 that accommodates the backlight module 11. Compared with the conventional external backlight detection solution based on display light, the sampling accuracy can be improved by 10-30 times.

[0150] When the photosensitive component 13 is integrated into the backlight module, Figure 12 and Figure 14 As shown, a photosensitive chip can be mounted in the corner of the circuit board 31 of the light source 32 as a photosensitive component 13 for backlight detection. As described above, the backlight detection results are related to the display of the electronic device. Based on the backlight detection results, the electronic device can adjust the backlight parameters of the backlight module 11 and / or the display parameters of the display module 12 to address display brightness differences and / or color shift.

[0151] From the above description, it can be seen that the electronic device provided by the embodiment of the present application integrates a photosensitive component 13 capable of detecting backlight, and the photosensitive component 13 is integrated into the display module 12 or the backlight module 11. The photosensitive component 13 is integrated using the redundant space already in the electronic device, and has good structural compatibility and manufacturing process compatibility with existing liquid crystal display devices, which facilitates the miniaturization design of electronic devices and has low manufacturing costs. Moreover, high-precision backlight detection can be achieved based on the photosensitive component 13, and the product structure is simple, and the manufacturing cost is low. Moreover, the technical solution of the present application can be used to achieve high-precision display adjustment based on a low-precision photosensitive solution.

[0152] The various embodiments in this specification are described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and reference can be made to the same or similar parts between the various embodiments.

[0153] It should be noted that in the description of this application, it should be understood that the descriptions of the drawings and embodiments are illustrative rather than restrictive. The same drawings throughout the embodiments of the specification mark the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on..." refers to positioning an element on or below another element, but does not essentially mean positioning on the upper side of another element according to the direction of gravity.

[0154] The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like, indicating positions or locations, are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate and simplify the description of this application. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0155] It should also be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such article or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the article or device comprising the aforementioned elements.

[0156] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device comprising: Backlight module, used for emitting backlight; a display module, located on the light-emitting side of the backlight module, and configured to emit display light based on the backlight; The peripheral edge of the surface of the display module facing the backlight module is fixed on a frame; the frame has a receiving space for receiving the backlight module; A photosensitive component, the photosensitive component is used to detect the backlight; A light-guiding structure having a first end and a second end, wherein the first end faces the backlight module and the second end faces the photosensitive component; wherein the light-guiding structure is configured to allow the backlight collected by the first end to be emitted from the second end along a light-guiding path defined by the light-guiding structure and then illuminate the photosensitive component; the light-guiding structure is embedded in the body of the frame, and the inner wall of the frame facing the backlight module has a first opening to expose the first end; and the frame has a second opening toward the top of the display module to expose the second end.

2. The electronic device according to claim 1, wherein the display module comprises: a first substrate; a semiconductor structure array and a pixel structure array located on a side of the first substrate facing away from the backlight module, wherein the semiconductor structure array is located between the first substrate and the pixel structure array; Wherein, the semiconductor structure array includes: a first semiconductor structure array, configured to control pixel structures in the pixel structure array to convert the backlight into display light; The second semiconductor structure array is used as the photosensitive component and can generate a current representing the backlight intensity based on the light irradiation from the backlight.

3. The electronic device according to claim 2, wherein a first light shielding component is provided on a surface of the first substrate, the first light shielding component being located on a path through which the backlight illuminates a target area of the first semiconductor structure in the first semiconductor structure array; and the first light shielding component being located outside a path through which the backlight illuminates a target area of the second semiconductor structure in the second semiconductor structure array. in, The target area is an area of the semiconductor structure that can generate current when illuminated by light. 4 . The electronic device according to claim 3 , wherein, in a direction perpendicular to the plane of the first substrate, the target area of the first semiconductor structure at least partially overlaps with the first shading component, and the target area of the second semiconductor structure does not overlap with the first shading component. 5 . The electronic device according to claim 2 , wherein a side of the second semiconductor structure in the second semiconductor structure array facing away from the backlight module is covered with a second light shielding component.

6. The electronic device according to claim 2, has a first filter on the path of the backlight irradiating the photosensitive component, and the first filter is used to allow the first color light in the backlight to pass through, so that the second semiconductor structure array detects the intensity of the first color light in the backlight.

7. The electronic device according to claim 6, wherein the light-emitting side of the pixel structure array comprises a second substrate, and a surface of the second substrate facing the pixel structure array comprises a second filter, wherein the second filter is configured to transmit the first color light in the display light; in, The manufacturing process parameters of the first filter element and the second filter element are the same.

8. The electronic device according to any one of claims 2 to 7, comprising a display area and a non-display area surrounding at least one side of the display area; the first semiconductor structure array is located in the display area, and the second semiconductor structure array is located in the non-display area.

9. The electronic device according to claim 8, comprising at least one of the following design methods: A conversion element is provided on the surface of the first end or the second end for converting the backlight into infrared light, and the photosensitive component detects the backlight based on the infrared light; The second end includes a light-concentrating structure, and the light-concentrating structure is used to converge the light in the light-guiding structure and illuminate the photosensitive component; At least two semiconductor structures serve as the second semiconductor structure array.

10. The electronic device according to claim 1, wherein the backlight module comprises: Light-emitting components; A light guide component is used to form the backlight based on the light emitted by the light emitting component.

11. The electronic device according to claim 10, comprising a display area and a non-display area surrounding at least one side of the display area; The periphery is located in the non-display area; The side wall of the accommodation space has a first groove for accommodating the light source in the light emitting assembly.

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