A PCB board secondary board-splitting device

Abstract

The present invention discloses a PCB secondary board splitting device, which includes a frame, a control robot, a board splitting mechanism, and a top plate mechanism. The board splitting mechanism includes a frame, a board suction component, a pressing plate component, a board suction driving cylinder, and a pressing plate driving cylinder. The board suction component includes two connecting columns arranged side by side, and a first board suction base and a second board suction base arranged side by side. The upper ends of the two connecting columns are fixedly connected to the output ends of the two board suction driving cylinders, and the lower ends are respectively fixedly connected to the first board suction base and the second board suction base. A plurality of first suction cups are provided at the lower end of the first board suction base, and a plurality of second suction cups are provided at the lower end of the second board suction base. The plurality of first suction cups and the plurality of second suction cups respectively adsorb adjacent sub-PCBs. The pressing plate component includes a lower pressing bottom plate, a pressing plate base, and a connecting top plate. The lower pressing bottom plate is arranged at the lower end of the pressing plate base, and the connecting top plate is fixedly connected to the pressing plate base and the output end of the pressing plate driving cylinder respectively. It can automatically and efficiently perform secondary board splitting processing on the PCB board.

Description

Technical Field

[0001] The present invention relates to the technical field of automated manufacturing equipment, and in particular to a secondary PCB board splitting device. Background Art

[0002] A PCB (Printed Circuit Board) is an important electronic component, serving as a support for electronic devices, that is, a carrier for the electrical connection of electronic components. To meet the needs of mass production, during the manufacturing process, multiple PCB boards are usually connected together. Therefore, in the subsequent process, it is necessary to separate the multiple connected PCB boards.

[0003] In the prior art, the PCB boards after one cutting are still composed of multiple small circuit boards and cannot be directly used. Moreover, the PCB boards after one cutting are no longer suitable for the original board splitting mechanical equipment for re-cutting and splitting. Currently, the secondary splitting of PCB boards is mainly carried out by manually separating the defective PCB boards directly. However, manual board splitting is time-consuming and laborious, and it is easy to cause pollution and damage to the PCB boards. Therefore, how to quickly re-separate the defective PCB boards after one cutting while avoiding damage to the PCB boards caused by manual secondary splitting has become an urgent problem for those skilled in the art. Summary of the Invention

[0004] In view of this, in view of the deficiencies in the prior art, the main object of the present invention is to provide a secondary PCB board splitting device, which can be compatible with and dock to PCB board splitting equipment, automatically and efficiently perform secondary splitting on PCB boards, avoid damage to the PCB boards caused by manual secondary splitting, ensure the quality of the PCB boards, and improve production efficiency.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A secondary PCB board splitting device includes a frame, a control robot, a board splitting mechanism, and a top plate mechanism. The top plate mechanism is disposed on the frame, and the board splitting mechanism is fixedly installed at the control end of the control robot;

[0007] The board splitting mechanism includes a frame, a board suction component, a pressing plate component, a board suction driving cylinder for driving the board suction component to move up and down, and a pressing plate driving cylinder for driving the pressing plate component to move horizontally;

[0008] The frame includes a fixed top plate, an assembled substrate, and two enclosing side plates. The two enclosing side plates are respectively disposed at the front and rear ends of the assembled substrate. The fixed top plate is fixedly connected to the upper ends of the two enclosing side plates and is also fixedly connected to the control end of the control robot;

[0009] The suction plate driving cylinder and the pressing plate assembly are installed on the assembly substrate;

[0010] The suction plate assembly includes two connecting columns arranged side by side, a first suction plate base and a second suction plate base arranged side by side; the upper ends of the two connecting columns are fixedly connected to the output ends of the two suction plate driving cylinders, and the lower ends are respectively fixedly connected to the first suction plate base and the second suction plate base; a plurality of first suction cups are arranged at the lower end of the first suction plate base, and a plurality of second suction cups are arranged at the lower end of the second suction plate base, and the plurality of first suction cups and the plurality of second suction cups respectively adsorb adjacent sub-PCB boards;

[0011] The control robot includes a controller, and the controller is used to control the working states of the plurality of first suction cups, the plurality of second suction cups and the suction plate driving cylinder;

[0012] The pressing plate assembly includes a pressing bottom plate, a pressing plate base and a connecting top plate, the pressing plate base is arranged at the lower end of the connecting top plate, the pressing bottom plate is arranged at the lower end of the pressing plate base, and the connecting top plate is respectively fixedly connected to the pressing plate base and the output end of the pressing plate driving cylinder;

[0013] The top plate mechanism is arranged below the board splitting mechanism, and the top plate mechanism includes a supporting top plate and a supporting frame, and the supporting top plate is arranged at the upper end of the supporting frame.

[0014] As a preferred solution, a plurality of first protruding blocks are arranged at equal intervals on one side of the first suction plate base close to the second suction plate base, a first avoidance groove is formed between adjacent first protruding blocks, and the plurality of first suction cups are arranged at the lower ends of the first protruding blocks,

[0015] A plurality of second protruding blocks are arranged at equal intervals on one side of the second suction plate base close to the first suction plate base, a second avoidance groove is formed between adjacent second protruding blocks, and the plurality of second suction cups are arranged at the lower ends of the second protruding blocks.

[0016] As a preferred solution, two first suction cups are arranged at the lower end of each first protruding block, and two second suction cups are arranged at the lower end of each second protruding block.

[0017] As a preferred solution, a plurality of ventilation holes are arranged at the lower ends of the first suction plate base and the second suction plate base, each ventilation hole is separately connected to a corresponding vacuum machine, and the controller is connected to the vacuum machine.

[0018] As a preferred solution, a camera assembly is arranged on the board splitting mechanism, and the camera assembly is fixedly installed on the side of the board splitting mechanism.

[0019] As a preferred solution, the camera assembly includes a CCD vision detection camera and an LED light board. The LED light board is fixedly installed below the CCD vision detection camera, and a through hole is provided at the position directly below the CCD vision detection camera on the LED light board.

[0020] As a preferred solution, a buffer spring is provided on the pressing plate assembly. The upper end of the buffer spring is connected to the connecting top plate, and the lower end is fixedly connected to the pressing plate base.

[0021] As a preferred solution, there are two pressing plate assemblies. The two pressing plate assemblies are respectively arranged on both sides of the suction plate assembly, and the two pressing plate assemblies are driven by a pressing plate driving cylinder to move in a horizontal direction approaching or moving away from each other.

[0022] As a preferred solution, the top plate mechanism further includes a top plate moving assembly for driving the support frame to move horizontally and a lifting driving assembly for driving the top plate to lift.

[0023] As a preferred solution, a positioning and adjusting mechanism is further included. The positioning and adjusting mechanism is arranged on the frame. The positioning and adjusting mechanism includes a positioning-in-place component, a side positioning component, and a secondary positioning component. A board-splitting station is provided below the board-splitting mechanism, and the positioning-in-place component, the side positioning component, and the secondary positioning component are arranged beside the board-splitting station.

[0024] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions, it can mainly be compatible with and dock with PCB board-splitting equipment, automatically and efficiently perform secondary board-splitting on PCB boards, avoid damage to PCB boards caused by manual secondary board-splitting, ensure the quality of PCB boards, and improve production efficiency.

[0025] To more clearly illustrate the structural features and functions of the present invention, the present invention will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is the assembled structural schematic diagram of the embodiment of the present invention;

[0027] Figure 2 is the assembled structural schematic diagram of the board-splitting mechanism of the embodiment of the present invention;

[0028] Figure 3 is the disassembly and assembly structural schematic diagram of the board-splitting mechanism of the embodiment of the present invention;

[0029] Figure 4 is the front view of the assembled structure of the suction plate assembly of the embodiment of the present invention;

[0030] Figure 5It is a bottom view of the assembly structure of the suction plate assembly according to an embodiment of the present invention;

[0031] Figure 6 It is a schematic diagram of the disassembly and assembly structure of the suction plate base and the suction cup of the suction plate assembly according to an embodiment of the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the pressing plate assembly according to an embodiment of the present invention;

[0033] Figure 8 It is a schematic diagram of the structure of the top plate mechanism according to an embodiment of the present invention;

[0034] Figure 9 It is a schematic diagram of the structure of the steel ring conveying mechanism and the positioning and adjusting mechanism according to an embodiment of the present invention;

[0035] Figure 10 It is a schematic diagram of the structure of the steel ring collecting mechanism according to an embodiment of the present invention;

[0036] Figure 11 It is a schematic diagram of the structure of the NG plate collecting mechanism according to an embodiment of the present invention.

[0037] Explanation of reference numerals:

[0038] 1, frame; 2, control robot;

[0039] 3, plate separating mechanism;

[0040] 30, frame; 301, fixed top plate; 302, assembled substrate; 303, enclosing side plate;

[0041] 31, suction plate assembly; 311, connecting column; 312, first suction plate base; 3121, first suction cup; 3122, first protruding block; 3123, first avoidance groove; 313, second suction plate base; 3131, second suction cup; 3132, second protruding block; 3133, second avoidance groove; 314, ventilation hole;

[0042] 32, pressing plate assembly; 321, pressing bottom plate; 322, pressing plate base; 323, connecting top plate; 324, buffer spring; 33, suction plate driving cylinder; 34, pressing plate driving cylinder;

[0043] 35, camera assembly; 351, CCD vision detection camera; 352, LED light board; 353, through hole;

[0044] 4, top plate mechanism; 40, supporting top plate; 41, support frame; 42, top plate moving assembly;

[0045] 5, steel ring conveying mechanism; 50, belt assembly; 51, belt width adjusting assembly;

[0046] 6. Steel ring collection mechanism; 60. Steel ring lifting assembly; 61. Steel ring collection assembly;

[0047] 7. Positioning and adjusting mechanism; 70. In-place positioning assembly; 71. Side positioning assembly; 72. Secondary positioning assembly; 8. Sub-board station; 9. Collection station; 10. PCB board;

[0048] 11. NG board collection mechanism; 110. Tray support; 111. NG board placement tray. Detailed implementation manners

[0049] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific implementation examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0050] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0051] Please refer to Figures 1 to 11 , an embodiment of the present invention provides a PCB board secondary sub-board device,

[0052] which includes a frame 1, a control robot 2, a sub-board mechanism 3 and a top plate mechanism 4, and the top plate mechanism 4 is arranged on the frame 1; the sub-board mechanism 3 is installed and fixed at the control end of the control robot 2;

[0053] The sub-board mechanism 3 includes a frame 30, a board suction assembly 31, a pressing plate assembly 32, a board suction driving cylinder 33 for driving the board suction assembly 31 to move up and down, and a pressing plate driving cylinder 34 for driving the pressing plate assembly 32 to move horizontally; the sub-board mechanism 3 is used to cooperate with the top plate mechanism 4 to clamp and fix the PCB board 10, facilitate sucking the PCB board 10 in the steel ring, and then perform sub-board processing on the PCB board 10;

[0054] The frame 30 includes a fixed top plate 301, an assembled substrate 302 and two enclosing side plates 303. The two enclosing side plates 303 are respectively arranged at the front and rear ends of the assembled substrate 302. The fixed top plate 301 is fixedly connected to the upper ends of the two enclosing side plates 303 and is also fixedly connected to the control end of the control robot 2; the frame 30 is used to nest and fix other components of the sub-board mechanism 3, making the overall structure of the sub-board mechanism 3 more firm, stable, compact and small.

[0055] The suction plate driving cylinder 33 and the pressing plate assembly 32 are installed on the assembled substrate 302; the suction plate driving cylinder 33 is used to drive the suction plate assembly 31 to move up and down;

[0056] The suction plate assembly 31 includes two connecting columns 311 arranged side by side, a first suction plate base 312 and a second suction plate base 313 arranged side by side; the upper ends of the two connecting columns 311 are fixedly connected to the output ends of the two suction plate driving cylinders 33, and the lower ends are respectively fixedly connected to the first suction plate base 312 and the second suction plate base 313; a plurality of first suction cups 3121 are provided at the lower end of the first suction plate base 312, and a plurality of second suction cups 3131 are provided at the lower end of the second suction plate base 313. The plurality of first suction cups 3121 and the plurality of second suction cups 3131 respectively adsorb adjacent sub-PCB boards 10; the first suction cups 3121 and the second suction cups 3131 are used to receive the control signals of the controller and adsorb the PCB boards 10 inside the steel ring;

[0057] The control robot 2 includes a controller. The controller is used to control the working states of the plurality of first suction cups 3121, the plurality of second suction cups 3131 and the suction plate driving cylinder 33; the controller is used to control the movement of the control end of the control robot 2, and the controller controls the lifting of the first suction plate base 312 and the second suction plate base 313 separately / simultaneously through the suction plate driving cylinder 33 to perform the board splitting process on the PCB board 10 or adsorb the PCB board 10; for example, several states such as one rising and one falling, a single rising alone, a single falling alone, rising and falling simultaneously, etc.; it can be understood that after the board splitting process is completed, the controller controls the first suction plate base 312 and the second suction plate base 313 to return to the initial position for the next action of adsorbing the PCB board 10;

[0058] The pressing plate assembly 32 includes a lower pressing bottom plate 321, a pressing plate base 322 and a connecting top plate 323. The pressing plate base 322 is arranged at the lower end of the connecting top plate 323, the lower pressing bottom plate 321 is arranged at the lower end of the pressing plate base 322, and the connecting top plate 323 is fixedly connected to the pressing plate base 322 and the output end of the pressing plate driving cylinder 34 respectively; the pressing plate assembly 32 is used to cooperate with the supporting top plate 40 to clamp and fix the PCB board 10, so as to facilitate the suction plate assembly 31 to adsorb the PCB board 10 in the same steel ring;

[0059] The top plate mechanism 4 is arranged below the board splitting mechanism 3. The top plate mechanism 4 includes a supporting top plate 40 and a supporting frame 41. The supporting top plate 40 is arranged at the upper end of the supporting frame 41; the top plate mechanism 4 is used to support the PCB board 10 and cooperate with the board splitting mechanism 3 to adsorb the PCB board 10. The supporting top plate 40 is used to cooperate with the pressing plate assembly 32 to clamp and fix the PCB board 10, so as to facilitate the suction plate assembly 31 to adsorb the PCB board 10 in the steel ring.

[0060] For the convenience of understanding the complete and clear specific working process of the embodiments of the present invention, a secondary PCB board splitting device provided by the embodiments of the present invention further includes a steel ring conveying mechanism 5, a steel ring collecting mechanism 6, and an NG board collecting mechanism 11; both the steel ring conveying mechanism 5 and the steel ring collecting mechanism 6 are installed on the frame 1. The steel ring conveying mechanism 5 includes a belt assembly 50 and a belt driving assembly for driving the rotation of the belt assembly 50. The steel ring conveying mechanism 5 is used to transfer the steel ring carrying the PCB board 10 to the splitting station 8 below the splitting mechanism 3, and transfer the empty steel ring after splitting to the collecting station 9 arranged below the steel ring collecting mechanism 6; the steel ring collecting mechanism 6 includes a steel ring lifting assembly 60 and a steel ring collecting assembly 61, and the steel ring collecting mechanism 6 is used to lift and hook to collect the empty steel ring; the NG board collecting mechanism 11 is installed beside the frame 1, and the NG board collecting mechanism 11 includes a tray support 110 and an NG board placing tray 111, and the NG board collecting mechanism 11 is used to collect the defective sub-PCB boards 10.

[0061] It can be understood that the specific working process of a secondary PCB board splitting device provided by the embodiments of the present invention is as follows. When the steel ring carrying the PCB board 10 is conveyed to the splitting station 8 by the steel ring conveying mechanism 5, the top plate mechanism 4 lifts the PCB board 10, and the control robot 2 controls the splitting mechanism 3 to move above the splitting station 8. The suction plate driving cylinder 33 controls the suction plate assembly 31 and the pressing plate driving cylinder 34 controls the pressing plate assembly 32 to move downward. The suction cups on the suction plate assembly 31 adsorb a plurality of PCB boards 10. The controller of the control robot 2 drives the two suction plate bases of the suction plate assembly 31 to move up and down by controlling the suction plate driving cylinder 33, driving the suction cups on the corresponding suction plate bases to lift and lower, completing the splitting process. The control robot 2 transfers the defective PCB boards 10 detected by the camera assembly 35 to the NG board collecting mechanism 11, and then transfers the remaining PCB boards 10 to the next station. The empty steel ring after splitting is transferred to the collecting station 9 by the steel ring conveying mechanism 5. When the empty steel ring is transferred to the collecting station 9, the steel ring lifting assembly 60 lifts the empty steel ring away from the belt assembly 50 and raises it to the steel ring collecting assembly 61, and the steel ring collecting assembly 61 clamps and collects the empty steel ring.

[0062] In another embodiment, a plurality of first protruding blocks 3122 are equidistantly spaced on one side of the first suction plate base 312 close to the second suction plate base 313. A first avoidance groove 3123 is formed between adjacent first protruding blocks 3122, and a plurality of first suction cups 3121 are arranged at the lower ends of the first protruding blocks 3122.

[0063] A plurality of second protruding blocks 3132 are equidistantly arranged on one side of the second suction plate base 313 close to the first suction plate base 312, and a second avoidance groove 3133 is formed between adjacent second protruding blocks 3132. A plurality of second suction cups 3131 are arranged at the lower end of the second protruding blocks 3132; when installed, the first protruding blocks 3122 are embedded in the second avoidance groove 3133, and the second protruding blocks 3132 are embedded in the first avoidance groove 3123; when working, the first protruding blocks 3122 move up and down in the second avoidance groove 3133, and the second protruding blocks 3132 move up and down in the first avoidance groove 3133. 123 moves up and down; the protruding block is used to form an avoidance groove, which limits the positions of the first suction cup 3121 and the second suction cup 3131 on the corresponding suction plate base. The controller controls the lifting and lowering states of the first suction plate base 312 and the second suction plate base 313 to carry out the PCB board separation process in an orderly and rapid manner; the protruding block is embedded in the avoidance groove to make the adsorption points of the suction cups on adjacent PCB boards 10 relatively close to each other, so as to avoid the PCB boards 10 being unable to be separated or incompletely separated due to uneven force during the PCB separation process, resulting in the adjacent PCB boards 10 still sticking together.

[0064] Furthermore, two first suction cups 3121 are provided at the lower end of each first protrusion block 3122, and two second suction cups 3131 are provided at the lower end of each second protrusion block 3132; the two first suction cups 3121 and the second suction cups 3131 are provided to more firmly adsorb the PCB board 10, and when the first suction cup 3121 and the second suction cup 3131 move up and down to separate the board, the board separation process of the PCB board 10 is completed more efficiently and quickly.

[0065] In another embodiment, the lower ends of the first suction plate base 312 and the second suction plate base 313 are provided with multiple ventilation holes 314, each ventilation hole 314 is individually connected to a corresponding vacuum machine, and the controller is connected to the vacuum machine; the vacuum machine is used to individually control the working state of each suction cup, and transfer the defective sub-PCB boards 10 after the depaneling process to the NG board collection mechanism 11, and transfer the remaining sub-PCB boards 10 to the next workstation.

[0066] In another embodiment, a camera assembly 35 is provided on the panel separation mechanism 3, and the camera assembly 35 is installed and fixed on the side of the panel separation mechanism 3; the camera assembly 35 is used to take pictures and locate, detect the current position and direction of the PCB board 10, and thus adjust the position of the panel separation mechanism 3. The camera assembly 35 is also used to take pictures to identify defective sub-PCB boards 10 on the PCB board 10 (the defective sub-PCB boards 10 have been marked after one panel separation).

[0067] In another embodiment, the camera assembly 35 includes a CCD vision detection camera 351 and an LED light board 352. The LED light board 352 is installed and fixed below the CCD vision detection camera 351. A through hole 353 is provided at the position directly below the CCD vision detection camera 351 on the LED light board 352. The CCD vision detection camera 351 is used for taking pictures for positioning, detecting the current position and orientation of the PCB board 10, so as to adjust the position of the board splitting mechanism 3. The CCD vision detection camera 351 is also used for taking pictures to identify the defective sub-PCB boards 10 on the PCB board 10 (the defective sub-PCB boards 10 have been marked after the first board splitting). The LED light board 352 is used to provide a shadowless light source for the CCD vision detection camera 351 to take pictures for positioning and identification.

[0068] In another embodiment, a buffer spring 324 is provided on the pressing plate assembly 32. The upper end of the buffer spring 324 is connected to the connecting top plate 323, and the lower end is fixedly connected to the pressing plate base 322. The buffer spring 324 is used to buffer the pressure when the pressing plate assembly 32 presses down, so that the pressing plate assembly 32 presses down with a smoother speed, avoiding damage to the PCB board 10. At the same time, after the board splitting process, the pressing plate assembly 32 can be automatically bounced back to the initial position.

[0069] In another embodiment, there are two pressing plate assemblies 32, which are respectively arranged on both sides of the board suction assembly 31. The two pressing plate assemblies 32 are driven by a pressing plate driving cylinder 34 to move horizontally towards or away from each other. The two pressing plate assemblies 32 are provided to prevent the steel ring from being unevenly stressed when the board suction assembly 31 adsorbs the PCB board 10, resulting in tipping or offset, and damage to the PCB board 10.

[0070] In another embodiment, the top plate mechanism 4 further includes a top plate moving assembly 42 for driving the support top plate 41 to move horizontally and a lifting driving assembly for driving the top plate to lift. The top plate moving assembly 42 is used to drive the support top plate 40 and the support frame 41 to move horizontally, so that the support top plate 40 can move to directly below the PCB board 10 to be processed by board splitting, avoiding tilting or dropping of the PCB board 10 during jacking. The lifting driving assembly is used to drive the support top plate 40 to perform lifting activities.

[0071] In another embodiment, a positioning and adjusting mechanism 7 is further included. The positioning and adjusting mechanism 7 is arranged on the frame 1 and includes a in-place positioning component 70, a side positioning component 71 and a secondary positioning component 72. A board splitting station 8 is arranged below the board splitting mechanism 3. The in-place positioning component 70, the side positioning component 71 and the secondary positioning component 72 are arranged beside the board splitting station 8. The positioning and adjusting mechanism 7 is used to detect the position of the steel ring at the board splitting station 8. If the steel ring is not in place, the horizontal position of the steel ring is adjusted to make it at the board splitting station 8 to cooperate with the top plate mechanism 4 and the board splitting mechanism 3 for board splitting processing. The in-place positioning component 70 is used to detect the forward position of the steel ring at the board splitting station 8. The side positioning component 71 is used to detect the side position of the steel ring at the board splitting station 8. The secondary positioning component 72 is used to adjust the horizontal position of the steel ring to make it located at the board splitting station 8 when the steel ring is not in place.

[0072] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A secondary PCB board splitting device, characterized in that: It includes a frame, a control robot, a circuit board splitting mechanism, and a top plate mechanism. The top plate mechanism is arranged on the frame; the circuit board splitting mechanism is installed and fixed at the control end of the control robot; The circuit board splitting mechanism includes a frame, a circuit board suction component, a pressing plate component, a circuit board suction driving cylinder for driving the circuit board suction component to move up and down, and a pressing plate driving cylinder for driving the pressing plate component to move horizontally; The frame includes a fixed top plate, an assembled substrate, and two enclosing side plates. The two enclosing side plates are respectively arranged at the front and rear ends of the assembled substrate. The fixed top plate is fixedly connected to the upper ends of the two enclosing side plates and is fixedly connected to the control end of the control robot; The circuit board suction driving cylinder and the pressing plate component are installed on the assembled substrate; The circuit board suction component includes two connecting columns arranged side by side, a first circuit board suction base and a second circuit board suction base arranged side by side; the upper ends of the two connecting columns are fixedly connected to the output ends of the two circuit board suction driving cylinders, and the lower ends are respectively fixedly connected to the first circuit board suction base and the second circuit board suction base; a plurality of first suction cups are arranged at the lower end of the first circuit board suction base, and a plurality of second suction cups are arranged at the lower end of the second circuit board suction base. The plurality of first suction cups and the plurality of second suction cups respectively adsorb adjacent sub-PCB boards; The control robot includes a controller, and the controller is used to control the working states of the plurality of first suction cups, the plurality of second suction cups, and the circuit board suction driving cylinder; The pressing plate component includes a pressing bottom plate, a pressing plate base, and a connecting top plate. The pressing plate base is arranged at the lower end of the connecting top plate, the pressing bottom plate is arranged at the lower end of the pressing plate base, and the connecting top plate is respectively fixedly connected to the pressing plate base and the output end of the pressing plate driving cylinder; The top plate mechanism is arranged below the circuit board splitting mechanism. The top plate mechanism includes a supporting top plate and a supporting frame, and the supporting top plate is arranged at the upper end of the supporting frame.

2. The secondary circuit board splitting device for PCB boards according to claim 1, wherein: A plurality of first protruding blocks are equidistantly and spacedly arranged on one side of the first circuit board suction base close to the second circuit board suction base. A first avoidance groove is formed between adjacent first protruding blocks. The plurality of first suction cups are arranged at the lower ends of the first protruding blocks, A plurality of second protruding blocks are equidistantly and spacedly arranged on one side of the second circuit board suction base close to the first circuit board suction base. A second avoidance groove is formed between adjacent second protruding blocks. The plurality of second suction cups are arranged at the lower ends of the second protruding blocks.

3. The secondary PCB board splitting device according to claim 2, characterized in that: Two first suction cups are arranged at the lower end of each first protruding block, and two second suction cups are arranged at the lower end of each second protruding block.

4. A secondary PCB board splitting device according to claim 1, characterized in that: A plurality of ventilation holes are arranged at the lower ends of the first circuit board suction base and the second circuit board suction base. Each ventilation hole is separately connected to a corresponding vacuum machine, and the controller is connected to the vacuum machine.

5. A secondary PCB board splitting device according to claim 1, characterized in that: A camera component is arranged on the circuit board splitting mechanism, and the camera component is installed and fixed on the side of the circuit board splitting mechanism.

6. The secondary PCB board splitting device according to claim 5, characterized in that: The camera assembly includes a CCD vision detection camera and an LED light board. The LED light board is fixedly installed below the CCD vision detection camera, and a through hole is provided at the position directly below the CCD vision detection camera on the LED light board.

7. A secondary PCB board splitting device according to claim 1, characterized in that: A buffer spring is provided on the pressing plate assembly. The upper end of the buffer spring is connected to the connecting top plate, and the lower end is fixedly connected to the pressing plate base.

8. A secondary PCB board splitting device according to claim 1, characterized in that: There are two pressing plate assemblies, and the two pressing plate assemblies are respectively arranged on both sides of the suction plate assembly. The two pressing plate assemblies are driven by a pressing plate driving cylinder to move in a horizontal direction of approaching or separating from each other.

9. A secondary PCB board splitting device according to claim 1, characterized in that: The top plate mechanism further includes a top plate moving assembly for driving the support frame to move horizontally and a lifting driving assembly for driving the top plate to lift.

10. A secondary PCB board splitting device according to claim 1, characterized in that: It further includes a positioning and adjusting mechanism. The positioning and adjusting mechanism is arranged on the frame. The positioning and adjusting mechanism includes a positioning-in-place component, a side positioning component, and a secondary positioning component; a board separation station is provided below the board separation mechanism, and the positioning-in-place component, the side positioning component, and the secondary positioning component are arranged beside the board separation station.

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