Method of manufacturing a display device and display device

Abstract

Embodiments of the present application provide a display device preparation method and a display device. The display device preparation method comprises preparing a display unit of the display device. In the display unit, a main screen and a secondary screen are connected. The main screen has a first outer frame area, and the secondary screen has a first inner frame area. An opening area is formed between the first outer frame area and the first inner frame area. The display unit has an evaporation area on the opening area. The first outer frame area and the first inner frame area are both connected with the evaporation area. The evaporation area on the display unit is removed to obtain the display device. When facing the main screen and the secondary screen with different curvatures, the evaporation area supports and fills the opening area between the first outer frame area and the first inner frame area, so that the mask does not appear in the relatively fragile acute angle area at the connection of the main screen and the secondary screen, thereby avoiding the problems of mask sagging or deformation under the action of gravity.

Description

Technical Field

[0001] This application relates to the technical field of display devices, and more particularly to a method for manufacturing a display device and a display device. Background Technology

[0002] Flexible display devices are evolving from two-dimensional to three-dimensional variability. For example, wearable watches not only strive to maximize the frontal display but also require displays on the sides, aiming for the best viewing angle and sensory experience through a surround display.

[0003] A planar circular main display screen is directly bonded to a flexible secondary screen to create a ring-shaped 3D display. Since the main and secondary screens are a single display, they are manufactured using the same process and a single mask. However, the different curvatures of the main and secondary screens in the mask design result in sharp-angled openings at the junction of the two screens. These sharp-angled areas, due to gravity, experience significant sagging and deformation. Summary of the Invention

[0004] This application provides a method for manufacturing a display device and a display device in order to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of the embodiments of this application, this application provides a method for manufacturing a display device, the method comprising:

[0006] Based on a mask, a display unit of a display device is fabricated, wherein a main screen and a sub-screen are connected on the display unit, the main screen has a first outer frame area, the sub-screen has a first inner frame area, an opening area is formed between the first outer frame area and the first inner frame area, the display unit has a vapor deposition area on the opening area, and both the first outer frame area and the first inner frame area are connected to the vapor deposition area.

[0007] Remove the vapor-deposited area on the display unit to obtain the display device.

[0008] In one embodiment, the display unit of the manufacturing display device includes:

[0009] Prepare a planarization layer;

[0010] An organic common layer is configured on the planarization layer;

[0011] A cathode layer is disposed on the side of the organic common layer away from the planarization layer;

[0012] Multiple partitions are configured on the planar layer, wherein the partitions are located on the outer frame of the main screen and / or the inner frame of the sub-screen, respectively, to separate the organic common layer and the cathode layer.

[0013] In one embodiment, along the first direction, the projected area of ​​the top of the partition member is at least greater than one of the projected areas of the middle part of the partition member and the projected area of ​​the bottom of the partition member.

[0014] In one embodiment, the display unit of the display device further includes:

[0015] Multiple dams are configured on the flat layer, with the dams located on the outer frame of the main screen and the inner frame of the sub-screen, and partitions arranged on both sides of the dams.

[0016] In one implementation, the method further includes:

[0017] A deposition layer is disposed on the side of the cathode layer away from the planar layer;

[0018] A first filling layer is disposed on the side of the sediment layer away from the flat layer. The first filling layer is located on the side of the dam body away from the display area of ​​the main screen and the display area of ​​the secondary screen. The first filling layer extends to a position below the top of the partition.

[0019] In one embodiment, the first outer frame area is located on the outer frame of the main screen, and the main screen also has a second outer frame area. Part of the partition is located on the first outer frame area, and the first outer frame area and the second outer frame area are independent of each other.

[0020] The first inner frame area is located on the inner frame of the secondary screen, and part of the partition is located on the first inner frame area.

[0021] Both the second outer frame area and the outer frame of the sub-screen have cathode overlap areas.

[0022] In one implementation, the method further includes:

[0023] Multiple support members are configured at at least one position in the second outer frame area and the outer frame of the sub-screen. The dam body is also disposed on the outer frame of the sub-screen. The support member disposed in the second outer frame area is located on the side of the dam body away from the display area of ​​the main screen, and the support member disposed on the outer frame of the sub-screen is located on the side of the dam body away from the display area of ​​the sub-screen. The deposition layer covers the support member.

[0024] A second filling layer is disposed on the side of the deposited layer away from the flat layer, wherein a portion of the second filling layer extends below the top of the support.

[0025] In one embodiment, the display unit has a connection point, through which the outer frame of the main screen and the inner frame of the sub-screen are connected. The connection point includes a connection area and an opening area, which are arranged alternately.

[0026] As another aspect of the embodiments of this application, the embodiments of this application provide a display device, the display device comprising:

[0027] Planarization layer;

[0028] An organic common layer is located on the planar layer;

[0029] The cathode layer is located on the side of the organic common layer away from the planarization layer; and

[0030] Multiple partitions are located on the planar layer and on the outer frame of the main screen and the inner frame of the sub-screen, respectively, to separate the organic common layer and the cathode layer.

[0031] In one embodiment, along the first direction, the projected area of ​​the top of the partition member is at least greater than one of the projected areas of the middle part of the partition member and the projected area of ​​the bottom of the partition member.

[0032] In one implementation, it further includes:

[0033] Multiple dam bodies are located on a flat layer, and are respectively located on the outer frame of the main screen and the inner frame of the secondary screen. The partitions are arranged on both sides of the dam bodies.

[0034] In one implementation, it further includes:

[0035] The deposition layer is located on the side of the cathode layer away from the planar layer;

[0036] The first filling layer is located on the side of the dam body away from the display area of ​​the sub-screen and the display area of ​​the sub-screen, on the side of the sediment layer away from the flat layer, wherein a portion of the first filling layer extends to a position below the top of the partition.

[0037] In one embodiment, the outer frame of the main screen has a first outer frame area and a second outer frame area, and a portion of the partition is located on the first outer frame area. The first outer frame area and the second outer frame area are independent of each other.

[0038] The inner frame of the secondary screen has a first inner frame area, and part of the partition is located on the first inner frame area;

[0039] Both the second outer frame area and the outer frame of the sub-screen have cathode overlap areas.

[0040] In one implementation, it further includes:

[0041] A support member is located at at least one position in the second outer frame area and the outer frame of the sub-screen. The dam body is also disposed on the outer frame of the sub-screen. The support member disposed in the second outer frame area is located on the side of the dam body away from the display area of ​​the main screen, and the support member disposed on the outer frame of the sub-screen is located on the side of the dam body away from the display area of ​​the sub-screen. The deposition layer covers the support member.

[0042] The second filler layer is located on the side of the deposited layer away from the flattening layer, wherein a portion of the second filler layer extends below the top of the support.

[0043] In one embodiment, the connection between the outer frame of the main screen and the inner frame of the secondary screen is a connection point, wherein the connection point includes a connection area and an opening area, and the connection area and the opening area are arranged alternately.

[0044] The following beneficial effects can be obtained by adopting the above technical solution in the embodiments of this application:

[0045] In this embodiment, the method for fabricating the display device includes first fabricating a display unit based on a mask. The main screen has a first outer frame area, and the sub-screen has a first inner frame area. The display unit has a vapor deposition area on the opening area formed between the first outer frame area and the first inner frame area. Both the first outer frame area and the first inner frame area are connected to the vapor deposition area. When dealing with main and sub-screens with different curvatures, the vapor deposition area supports and fills the opening area between the first outer frame area and the first inner frame area. This prevents empty, fragile, sharp-angled areas from appearing on the opening area of ​​the display unit, thus avoiding problems such as sagging or deformation of the mask at the connection point between the main and sub-screens under gravity. This ensures control over the accuracy and impact range of the display device during vapor deposition and encapsulation processes, while also keeping any missed areas within an acceptable range. The vapor deposition area can be removed by cutting or other methods to obtain the display device without causing any substantial impact on it. At the same time, it can ensure the stability and precision of the display device during the processing, reduce the rework rate and scrap rate, improve the product yield, and ensure the electrical connection and display effect of the sub-screen and the main screen.

[0046] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0047] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0048] Figure 1 A schematic diagram showing a method for manufacturing a display device according to an embodiment of this application is provided.

[0049] Figure 2 A schematic diagram of the structure of a display device is shown, illustrating a method for manufacturing a display device according to an embodiment of this application.

[0050] Figure 3A schematic diagram of the structure of a mask for a method of fabricating a display device according to an embodiment of this application is shown.

[0051] Figure 4 A schematic diagram of the structure of a display unit is shown in a method for manufacturing a display device according to another embodiment of this application.

[0052] Figure 5 A schematic diagram of the structure of a display unit or display device is shown, illustrating a method for manufacturing a display device according to another embodiment of this application.

[0053] Figure 6 A schematic diagram of the structure of a display unit or display device is shown, illustrating a method for manufacturing a display device according to another embodiment of this application.

[0054] Figure 7 A schematic diagram showing the structure of a partition or a partition of a display device according to another embodiment of this application is provided.

[0055] Figure 8 A schematic diagram showing the structure of a partition or a partition of a display device according to another embodiment of this application is provided.

[0056] Figure 9 A schematic diagram showing the structure of a partition or a partition of a display device according to another embodiment of this application is provided.

[0057] Figure 10 A schematic diagram of the structure of a display unit or display device is shown, illustrating a method for manufacturing a display device according to another embodiment of this application.

[0058] Figure 11 A schematic diagram of the structure of a display unit or display device is shown, illustrating a method for manufacturing a display device according to another embodiment of this application.

[0059] Figure 12 A schematic diagram of the structure of a display unit or display device is shown, illustrating a method for manufacturing a display device according to another embodiment of this application.

[0060] Figure 13 A schematic diagram of the structure of a display unit or a connection point of a display device according to another embodiment of the present application is shown.

[0061] Figure label:

[0062] 1. Mask; 10. Display unit; 100. Main screen; 110. First outer frame area; 120. Second outer frame area; 200. Sub-screen; 210. First inner frame area; 220. Outer frame of sub-screen; 230. Display area of ​​sub-screen; 300. Connection point; 310. Opening area; 320. Connection area; 400. Opening area; 500. Evaporation area; 610. Organic common layer; 620. Cathode layer; 630. Planarization layer; 640. Deposition layer; 650. Filler layer; 700. Partition; 800. Dam body; 900. Support component. Detailed Implementation

[0063] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0064] like Figure 1-4 As shown, Figure 1 This illustration shows a structural schematic diagram of a method for fabricating a display device according to an embodiment of this application. One aspect of this application provides a method for fabricating a display device, the method comprising:

[0065] S110: Based on mask 1, a display unit 10 of a display device is fabricated, wherein a main screen 100 and a sub-screen 200 are connected on the display unit 10, the main screen 100 has a first outer frame area 110, the sub-screen 200 has a first inner frame area 210, an opening area 400 is formed between the first outer frame area 110 and the first inner frame area 210, and the display unit 10 has a vapor deposition area 500 on the opening area 400, the vapor deposition area 500 is connected to the first outer frame area 110 and the first inner frame area 210;

[0066] S120: Remove the vapor deposition area 500 on the display unit 10 to obtain the display device.

[0067] In the manufacturing method of the display device in this embodiment, the display device is manufactured using a display unit 10. The main screen 100 and the secondary screen 200 in the display device are treated as a single display, employing the same process and manufactured using the same set of display units 10. In related technologies, during the manufacturing of the display unit 10, due to the different curvatures between the outer frame of the main screen 100 and the inner frame of the secondary screen 200—that is, the outer frame of the main screen 100 and the inner frame of the secondary screen 200 are not uniformly fitted—the main screen 100 and the secondary screen 200 are connected through a connection point 300 between the outer frame of the main screen 100 and the inner frame of the secondary screen 200. Along both sides of the connection point 300, an acute-angled opening region 400 is formed between the outer frame of the main screen 100 and the inner frame of the secondary screen 200. The presence of the opening area 400 makes the area near the connection point 300 relatively fragile. This causes problems such as deformation and sagging of the mask at the connection point between the main screen and the sub-screen due to the sharp angle of the opening, which is caused by gravity. This results in larger areas of incomplete plating and impact, reducing the yield of the manufactured display device.

[0068] Display devices generally include a display layer, a sensor layer, and an anti-reflective layer, as well as a cover glass structure. The display layer may include a substrate, a TFT circuit layer, a light-emitting element layer, and an encapsulation layer. TFT circuit structures include LTPS or LPTO, and displays include OLED displays, quantum dot displays, mini / micro LED displays, etc. The fabrication process of the display device in this embodiment involves the light-emitting element layer and the encapsulation layer, wherein the display unit involves the light-emitting element layer.

[0069] In this embodiment, the method for fabricating the display device includes first fabricating a display unit 10 of the display device based on a mask 1. The main screen 100 corresponds to the front circular display area, and the sub-screen 200 corresponds to the side annular display area. The outer border portion of the main screen 100's display area along the width direction is the outer border of the main screen 100, and the first outer border area 110 is a part of the outer border of the main screen 100. The main screen 100 includes the display area of ​​the main screen 100 and the outer border of the main screen 100. The sub-screen 200 includes the outer border 220 of the sub-screen, the display area 230 of the sub-screen, and the inner border of the sub-screen 200. The outer border includes a VSS region, a cathode overlap region, and a GOA (similar to conventional border designs). The border portions on both sides of the display area 230 of the secondary screen along the width direction are the borders of the secondary screen 200. The borders of the secondary screen 200 include the inner border and the outer border 220 of the secondary screen 200. The inner border of the secondary screen 200 is the border on the side closer to the outer border of the main screen 100, and the outer border 220 of the secondary screen is the border of the secondary screen 200 on the side away from the outer border of the main screen 100. The first inner border area 210 is a part of or the entire inner border of the secondary screen 200.

[0070] A mask 1 is pre-designed, and the display unit 10 of the display device is fabricated on the mask 1. The structure of the mask 1 is as follows: Figure 3 As shown.

[0071] The main screen 100 has a first outer bezel area 110, and the secondary screen 200 has a first inner bezel area 210. The display unit 10 has a vapor-deposited area 500 on the opening area 400 formed between the first outer bezel area 110 and the first inner bezel area 210. Both the first outer bezel area 110 and the first inner bezel area 210 are connected to the vapor-deposited area 500. When facing main screens 100 and secondary screens 200 with different curvatures, the vapor-deposited area 500 supports and fills the opening area 400 between the first outer bezel area 110 and the first inner bezel area 210, preventing empty, vulnerable, sharp-angled areas from appearing in the opening area 400 of the display unit 10. Figure 3 The mask design shown avoids fragile sharp-angle areas. This prevents issues such as sagging or deformation of the mask at the connection between the main and sub-screens due to gravity, ensuring control over the precision and impact range of the display device during evaporation and encapsulation processes. It also keeps undeposited areas within acceptable limits. The evaporation area 500 can be removed by cutting or other methods to obtain the display device without substantial impact, while ensuring stability and precision during manufacturing. This reduces rework and scrap rates, improves product yield, and ensures the electrical connection and display effect between the sub-screen 200 and the main screen 100.

[0072] In this embodiment, the vapor deposition area 500 typically uses an organic EL material. The vapor deposition area 500 can be directly filled in the opening area 400 between the first outer frame area 110 and the first inner frame area 210. The vapor deposition area 500 can be connected to the entire inner frame of the sub-screen 200, or it can be connected only to a portion of the inner frame of the sub-screen 200. The vapor deposition area 500 can be a single area co-formed with the main screen 100 and the sub-screen 200, or it can be composed of multiple vapor deposition areas 500 connected to the first outer frame area 110 on one side and the first inner frame on the other side. Both the main screen 100 and the sub-screen 200 employ vapor deposition technology, while the flexible sub-screen 200 employs a thin-film encapsulation process. The common layer of the EL material in the vapor deposition area 500, the cathode, and the inorganic layer of the thin-film encapsulation all use an open mask to fabricate the display unit 10.

[0073] The display unit 10 can be obtained by directly removing the vapor-deposited area through cutting or other methods to obtain a display device.

[0074] like Figure 5-11 As shown, in one embodiment, the display unit for fabricating the display device includes:

[0075] Prepare planarization layer 630;

[0076] An organic common layer 610 is disposed on the planarization layer 630;

[0077] A cathode layer 620 is disposed on the side of the organic common layer 610 away from the planarization layer 630;

[0078] Multiple partitions 700 are configured on the planarization layer 630, wherein the partitions are located on the outer frame of the main screen 100 and / or the inner frame of the sub-screen 200, respectively, for separating the organic common layer 610 and the cathode layer 620.

[0079] In the above embodiments, the vapor deposition area 500 needs to be removed during the fabrication of the display device. The main screen 100, the secondary screen 200, and the vapor deposition area 500 all have an organic common layer 610 and a cathode layer 620. Because the cathode layer 620 and the organic common layer 610 evaporate during the removal of the vapor deposition area 500, the cathode layer 620 and the organic common layer 610 extend towards the display area of ​​the main screen 100 and the display area 230 of the sub-screen. They cross the outer frame of the main screen 100 and enter or approach the display area of ​​the main screen 100, and / or cross the inner frame of the sub-screen 200 and enter or approach the display area 230 of the sub-screen. This exposes the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen by the cathode layer 620 and the organic common layer 610. Moisture can then pass through the cathode layer 620 and the organic common layer 610 and enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, causing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail due to the entry of moisture.

[0080] To prevent moisture from entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen through the cathode layer 620 and the organic common layer 610, thus causing water absorption failure in the display area 230 of the main screen 100 and / or the sub-screen, in this embodiment, a partition 700 is provided on the planar layer 630. From the planar direction, the partition 700 is located on the outer frame of the main screen 100 and the inner frame of the sub-screen 200. This allows the cathode layer 620 and the organic common layer 610 to evaporate during the removal of the vapor deposition area 500, preventing the cathode layer 620 and the organic common layer 610 from extending towards the display area 230 of the main screen 100 and the sub-screen. This prevents the cathode layer 620 and the organic common layer 610 from continuing to extend towards the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. This prevents the cathode layer 620 and the organic common layer 610 from continuing to the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, thereby blocking the intrusion of the cathode layer 620 and the organic common layer 610 into the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, which would otherwise cause the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail due to water absorption.

[0081] Some of the partitions 700 are located on the inner frame of the secondary screen 200, specifically on the first inner frame area 210 of the secondary screen 200, and some of the partitions 700 are located on the outer frame of the main screen 100, specifically on the first outer frame of the main screen 100.

[0082] Since the first inner bezel area 210 of the secondary screen 200 is connected to the vapor deposition area 500, a partition is installed in the first inner bezel area 210 to disconnect the moisture transmission path formed by the organic common layer 610 and the cathode layer 620 extending to the display area 230 of the secondary screen, ensuring the reliability of the first inner bezel area 210 after cutting. Furthermore, because the inner bezel of the secondary screen 200 has no GOA or overlapping wiring design, the inner bezel of the secondary screen 200 can be made extremely narrow, achieving a seamless display effect with the display area of ​​the main screen 100. The first outer bezel area of ​​the main screen 100 has the same design as the inner bezel of the secondary screen 200. After bonding, both the first outer bezel area of ​​the main screen 100 and the inner bezel of the secondary screen 200 have extremely narrow bezels, maximizing the integration and immersive experience of the display.

[0083] Among them, such as Figure 7-9As shown, partition 700 is usually a structure that is wider at the top and narrower at the bottom, but it can also be a structure that is wider at the top, narrower in the middle, and wider at the bottom. For example, the cross-section can be an I-shaped, inverted L-shaped, or inverted trapezoidal structure. It can be a partition column such as SD partition column, PLN partition column, PI partition column, or PS partition column. There are many types of partition 700. Designs with a bottom-cut structure that are wider at the top and narrower at the bottom can be used for partition 700. Because the thermal evaporation of the organic common layer 610 and the cathode layer 620 has vertical characteristics, and the partition 700 has a structure that is wider at the top and narrower at the bottom, or it can be a structure that is wider at the top, narrower in the middle, and wider at the bottom, during the thermal evaporation process, the organic common layer 610 and the cathode layer 620 will form a plating failure area on the concave sidewall of the partition 700. This causes the organic common layer 610 and the cathode layer 620 to break at the partition 700, forming a discontinuous film. When water vapor enters into this discontinuous film, it will be blocked, and a complete path for water vapor to enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen will not be formed. This avoids the problem of water vapor entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, causing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail to absorb water.

[0084] On the other hand, the deposition layer 640 is usually formed by chemical vapor deposition (CVD), which is relatively fragile. During the removal of the vapor-deposited area 500, the deposition layer 640 may fracture under stress. In this embodiment, the deposition layer 640 formed by CVD has excellent step coverage. The deposition layer 640 can protectively cover the partition 700, thereby increasing its strength. During the removal of the vapor-deposited area 500, under stress on the deposition layer 640, the partition 700 can absorb the force, and a stress-relieving zone is formed at the bottom of the partition 700. This prevents the deposition layer 640 from fracture or further propagation of cracks, protecting the integrity and stability of the outer frame of the main screen 100 and the inner frame of the secondary screen 200, thus improving the yield rate and reliability of the display device.

[0085] In one embodiment, along the first direction, the projected area of ​​the top of the partition 700 is at least greater than one of the projected areas of the middle part of the partition 700 and the projected area of ​​the bottom of the partition 700.

[0086] The first direction is along the thickness direction of the display unit 10. The projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, or the projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, or the projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, and the projected area of ​​the bottom of the partition 700 is larger than the projected area of ​​the bottom of the partition 700. That is, in cross-section, a recessed sidewall with an inward concave direction is formed between the top and bottom or the middle part of the partition 700. Due to the vertical characteristics of the thermal evaporation of the organic common layer 610 and the cathode layer 620, the partition 700 has a recessed sidewall with an inward concave direction. During the thermal evaporation process, the materials of the organic common layer 610 and the cathode layer 620 will form a plating failure area on the recessed sidewall of the partition 700 in the width direction. This causes the organic common layer 610 and the cathode layer 620 to break at the partition 700, forming a discontinuous film. When water vapor enters into this discontinuous film, it will be blocked, preventing the formation of a complete path for water vapor to enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. This avoids the problem of water vapor entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, thus preventing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen from failing to absorb water.

[0087] The partition 700 is typically a structure that is wider at the top and narrower at the bottom, but it can also be a structure that is wider at the top, narrower in the middle, and wider at the bottom. For example, the cross-section can be an I-shaped, inverted L-shaped, or inverted trapezoidal structure. It can be a partition column such as SD partition column, PLN partition column, PI partition column, or PS partition column. The types of partition 700 can be diverse, and designs with an undercut structure that are wider at the top and narrower at the bottom can be used for partition 700.

[0088] like Figure 5 and Figure 6 As shown, in one embodiment, the display unit used to manufacture the display device further includes:

[0089] Multiple dam bodies 800 are configured on the flat layer 630, wherein the dam bodies 800 are located on the outer frame of the main screen 100 and the inner frame of the secondary screen 200, respectively, and the partitions 700 are arranged on both sides of the dam bodies 800.

[0090] The dam 800 is arranged around the display area of ​​the main screen 100 and the display area 230 of the secondary screen, and is located on the outer frame of the main screen 100 and the inner frame of the secondary screen 200. The dam 800 is also located on the outer frame 220 of the secondary screen. The dam 800 is used to define the position of the organic encapsulation layer. Multiple partitions 700 are provided on both the inner and outer sides of the dam 800 to ensure that the water vapor passage is blocked and cannot directly enter the display area of ​​the main screen 100 and / or the display area 230 of the secondary screen.

[0091] like Figure 6 As shown, in one embodiment, the method further includes:

[0092] A deposition layer 640 is disposed on the side of the cathode layer 620 away from the planarization layer 630;

[0093] A first filling layer 650 is disposed on the side of the sedimentation layer 640 away from the flattening layer 630. The first filling layer is disposed on the side of the dam body 800 away from the display area 230 of the sub-screen and the display area 230 of the sub-screen. A portion of the first filling layer 650 extends to a position below the top of the partition member 700.

[0094] The deposition layer 640 is typically formed using chemical vapor deposition (CVD). This inorganic CVD process results in a relatively fragile deposition layer 640, which may fracture under stress during the removal of the vapor-deposited area 500. In this embodiment, the CVD-formed deposition layer 640 exhibits excellent step coverage. It can protectively cover the partition 700, thereby enhancing its strength. During the removal of the vapor-deposited area 500, the partition 700 absorbs the stress on the deposition layer 640, while a stress-relieving zone forms at its bottom. This prevents the deposition layer 640 from fracture or further propagating cracks, protecting the integrity and stability of the outer bezel of the main screen 100 and the inner bezel of the secondary screen 200, thus improving the yield rate and reliability of the display device.

[0095] Meanwhile, on the deposition layer 640 on the side of the display area 230 of the dam body 800 away from the sub-screen and the side of the display area 230 of the sub-screen, when the vapor deposition area 500 is cut and removed, the deposition layer 640 located on the shoulder of the partition 700 is more prone to fracture under stress than other locations. Specifically, the deposition layer 640 near the top of the partition 700 is subjected to greater stress, especially the deposition layer 640 between the tops of two adjacent partitions 700, which is prone to fracture. By adding a first filler layer 650, which is typically an organic planar layer 630, and part of the first filler layer 650 extends below the top of the partition 700, the stress on the deposition layer 640 at the top of the partition 700 can be relieved, thereby preventing the deposition layer 640 from fracture near the top of the partition 700 and improving product reliability. Meanwhile, since there is a flat layer 630 on the other side of the dam body 800, the thickness of the display device on that side is relatively large. After filling the filling layer 650, the structural thickness on both sides of the dam body 800 can be made to be nearly uniform, which facilitates the subsequent configuration of touch panels, etc., and also increases the structural stability of the display device.

[0096] In addition, at the edge of the connection 300 between the main screen 100 and the secondary screen 200, laser cutting may cause the deposited layer 640 to break. Therefore, a partition 700 in the same direction as the cutting line is provided at the edge to prevent the crack in this direction from extending to the wiring area of ​​the connection 300 and causing a break.

[0097] like Figure 4 As shown, in one embodiment, the first outer frame area 110 is located on the outer frame of the main screen 100, and the outer frame of the main screen 100 also has a second outer frame area 120. Part of the partition 700 is located on the first outer frame area 110, and the first outer frame area 110 and the second outer frame area 120 are independent of each other.

[0098] The first inner frame area 210 is located on the inner frame of the secondary screen 200, and part of the partition 700 is located on the first inner frame area 210.

[0099] Both the second outer frame area 120 and the outer frame 220 of the sub-screen have cathode bonding areas.

[0100] The outer frame of the main screen 100 can be composed of a first outer frame area 110 and a second outer frame area 120, or the first outer frame area 110 and the second outer frame area 120 together constitute only part of the outer frame. The first outer frame area 110 is at least the outer frame portion of the main screen 100 near the connection point 300 between the main screen 100 and the sub-screen 200. Generally, the first outer frame area 110 is located on both sides of the connection point 300 between the main screen 100 and the sub-screen 200. The first outer frame area 110 and the second outer frame area 120 are independent of each other. The first outer frame area 110 defines the range of the vapor deposition area 500, thereby leaving space for the second outer frame area 120 where the cathode overlap area is set, so as to realize the cathode electrical connection of the main screen 100 and the sub-screen 200 respectively, ensuring the display effect.

[0101] In the secondary screen 200, the first inner frame area 210 is part or all of the inner frame of the secondary screen 200, while the outer frame 220 of the secondary screen is independent of the inner frame of the secondary screen 200. The vapor deposition layer will only affect the first inner frame area 210, and at most the entire inner frame of the secondary screen 200. However, the outer frame 220 of the secondary screen will not be affected by the vapor deposition area 500. Therefore, a cathode overlap area can be configured on the outer frame 220 of the secondary screen to realize the cathode electrical connection between the main screen 100 and the secondary screen 200 respectively, ensuring the display effect.

[0102] like Figure 5 As shown, in one embodiment, the method further includes:

[0103] Multiple support members 900 are disposed at at least one location in the second outer frame area 120 and the outer frame 220 of the sub-screen. A dam body 800 is also disposed on the outer frame 220 of the sub-screen. The support member 900 disposed in the second outer frame area 120 is located on the side of the dam body 800 away from the display area of ​​the main screen 100, and the support member 900 disposed in the outer frame 220 of the sub-screen is located on the side of the dam body 800 away from the display area 230 of the sub-screen. A deposition layer 640 covers the support member 900.

[0104] A second filling layer 650 is disposed on the side of the deposited layer 640 away from the planarization layer 630, wherein a portion of the second filling layer 650 extends to a position below the top of the support member 900.

[0105] The support member 900 can be one of the partition members 700, or other structures capable of absorbing stress. The support member 900 can be located on the flat layer.

[0106] Since the removal of the vapor deposition area 500 is not required for the second outer frame area 120 and the outer frame 220 of the sub-screen, there is no issue regarding the extension of the cathode layer 620 and the organic common layer 610 to the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. However, the first outer frame area 110 and the outer frame 220 of the sub-screen are also encapsulated by the deposition layer 640. The deposition layer 640 is usually formed by chemical vapor deposition, which is relatively fragile and prone to breakage. In this embodiment, the deposition layer 640 formed by chemical vapor deposition has excellent step coverage, so the deposition layer 640 can protectively cover the support member 900, and the support member 900 enhances the strength of the deposition layer 640. When the deposited layer 640 on the second outer frame area 120 and the outer frame 220 of the sub-screen is under stress, the support member 900 can absorb the force on the deposited layer 640. At the same time, a stress relief zone will be formed at the bottom of the support member 900, preventing the deposited layer 640 from breaking or preventing the cracks in the deposited layer 640 from expanding further. This protects the integrity and stability of the outer frame of the main screen 100 and the outer frame 220 of the sub-screen, and improves the yield rate and product reliability of the display device.

[0107] After the addition of the support member 900, the deposition layer 640 near the top of the support member 900 is more prone to fracture under stress compared to other locations. Specifically, the deposition layer 640 near the top of the support member 900 experiences greater stress, especially the deposition layer 640 between the tops of two adjacent support members 900, making it more susceptible to fracture. In this embodiment, by adding a second filler layer 650, which is typically an organic planarization layer 630, and extending a portion of the second filler layer 650 below the top of the support member 900, the stress on the deposition layer 640 near its top can be alleviated, thereby preventing the deposition layer 640 from fractureing near the top of the support member 900 and improving product reliability. Simultaneously, because the other side of the dam 800 has a planarization layer 630, the thickness of that side of the display device is relatively large. After filling with the filler layer 650, the structural thickness on both sides of the dam 800 becomes nearly uniform, facilitating subsequent configuration of touch panels, etc., and increasing the structural stability of the display device.

[0108] like Figure 4 as well as Figure 12 , Figure 13 As shown, in one embodiment, the display unit 10 has a connection 300, and the outer frame of the main screen 100 and the inner frame of the sub-screen 200 are connected through the connection 300. The connection 300 includes a connection area 320 and an opening area 310, which are arranged alternately.

[0109] The connection point 300 is the junction between the outer frame of the main screen 100 and the inner frame of the sub-screen 200, and it is also fabricated together with the display unit 10 based on the mask 1. The connection point 300 includes a connection area 320 and an opening area 310. The connection area 320 is used to arrange wiring, and several wirings on the same connection area 320 connect the main screen 100 and the sub-screen 200. The width of each wiring can be 10-5000 μm, specifically 300-2000 μm, preferably 500-1000 μm. The connection area 320 and the opening area 310 are staggered to form a comb-like structure, which gives the connection point 300 circumferential compressibility during 3D bonding, reducing wrinkles or broken lines caused by bonding, thereby increasing the deformation capability of the connection point 300.

[0110] The aperture region 310 consists of a series of aperture structures formed on the PI substrate. The aperture region 310 can be formed by etching or subsequent laser processing, thereby increasing the deformability of the connection 300. Depending on the number of interconnects and the required space, different aperture structures can be set in the aperture region 310. For example, the width of the aperture region 310 can be 10-3000 μm, specifically in the range of 10 μm-700 μm, preferably in the range of 50-300 μm.

[0111] The wiring area avoids the opening area 310. The partition 700 is located above the wiring area, and the opening structure is placed in the connection area 320. Because there are partitions 700 for the main screen 100 and the sub-screen 200 at the top and bottom, the water vapor passages entering the display areas of the main screen 100 and the sub-screen 200 at the top and bottom are blocked. Only the connecting wiring is on the left and right sides, which is covered by the deposition layer 640 and the filling layer 650. No water vapor will enter the wiring, ensuring the reliability of the display device.

[0112] like Figure 5-13 As shown, as another aspect of the embodiments of this application, this application provides a display device. The display device of this embodiment can be prepared by the preparation method of the display device of the above embodiments. The display device includes:

[0113] Leveling layer 630;

[0114] Organic common layer 610 is located on planarization layer 630;

[0115] The cathode layer 620 is located on the side of the organic common layer 610 away from the planarization layer 630; and

[0116] Multiple partitions 700 are located on the planarization layer 630 and on the outer frame of the main screen 100 and the inner frame of the sub-screen 200, respectively, to separate the organic common layer 610 and the cathode layer 620.

[0117] When manufacturing the display device, the vapor deposition area 500 needs to be removed. The main screen 100, the secondary screen 200, and the vapor deposition area 500 all have an organic common layer 610 and a cathode layer 620. Because the cathode layer 620 and the organic common layer 610 evaporate during the removal of the vapor deposition area 500, the cathode layer 620 and the organic common layer 610 extend towards the display area of ​​the main screen 100 and the display area 230 of the sub-screen. They cross the outer frame of the main screen 100 and enter or approach the display area of ​​the main screen 100, and / or cross the inner frame of the sub-screen 200 and enter or approach the display area 230 of the sub-screen. This exposes the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen by the cathode layer 620 and the organic common layer 610. Moisture can then pass through the cathode layer 620 and the organic common layer 610 and enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, causing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail due to the entry of moisture.

[0118] To prevent moisture from entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen through the cathode layer 620 and the organic common layer 610, thus causing water absorption failure in the display area 230 of the main screen 100 and / or the sub-screen, in this embodiment, a partition 700 is provided on the planar layer 630. From the planar direction, the partition 700 is located on the outer frame of the main screen 100 and the inner frame of the sub-screen 200. This allows the cathode layer 620 and the organic common layer 610 to evaporate during the removal of the vapor deposition area 500, preventing the cathode layer 620 and the organic common layer 610 from extending towards the display area 230 of the main screen 100 and the sub-screen. This prevents the cathode layer 620 and the organic common layer 610 from continuing to extend towards the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. This prevents the cathode layer 620 and the organic common layer 610 from continuing to the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, thereby blocking the intrusion of the cathode layer 620 and the organic common layer 610 into the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, which would otherwise cause the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail due to water absorption.

[0119] Some of the partitions 700 are located on the inner frame of the secondary screen 200, specifically on the first inner frame area 210 of the secondary screen 200, and some of the partitions 700 are located on the outer frame of the main screen 100, specifically on the first outer frame of the main screen 100.

[0120] Since the first inner bezel area 210 of the secondary screen 200 is connected to the vapor deposition area 500, a partition is installed in the first inner bezel area 210 to disconnect the moisture transmission path formed by the organic common layer 610 and the cathode layer 620 extending to the display area 230 of the secondary screen, ensuring the reliability of the first inner bezel area 210 after cutting. Furthermore, because the inner bezel of the secondary screen 200 has no GOA or overlapping wiring design, the inner bezel of the secondary screen 200 can be made extremely narrow, achieving a seamless display effect with the display area of ​​the main screen 100. The first outer bezel area of ​​the main screen 100 has the same design as the inner bezel of the secondary screen 200. After bonding, both the first outer bezel area of ​​the main screen 100 and the inner bezel of the secondary screen 200 have extremely narrow bezels, maximizing the integration and immersive experience of the display.

[0121] Among them, such as Figure 7-9 As shown, partition 700 is usually a structure that is wider at the top and narrower at the bottom, but it can also be a structure that is wider at the top, narrower in the middle, and wider at the bottom. For example, the cross-section can be an I-shaped, inverted L-shaped, or inverted trapezoidal structure. It can be a partition column such as SD partition column, PLN partition column, PI partition column, or PS partition column. There are many types of partition 700. Designs with a bottom-cut structure that are wider at the top and narrower at the bottom can be used for partition 700. Because the thermal evaporation of the organic common layer 610 and the cathode layer 620 has vertical characteristics, and the partition 700 has a structure that is wider at the top and narrower at the bottom, or it can be a structure that is wider at the top, narrower in the middle, and wider at the bottom, during the thermal evaporation process, the organic common layer 610 and the cathode layer 620 will form a plating failure area on the concave sidewall of the partition 700. This causes the organic common layer 610 and the cathode layer 620 to break at the partition 700, forming a discontinuous film. When water vapor enters into this discontinuous film, it will be blocked, and a complete path for water vapor to enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen will not be formed. This avoids the problem of water vapor entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, causing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen to fail to absorb water.

[0122] On the other hand, the deposition layer 640 is usually formed by chemical vapor deposition (CVD), which is relatively fragile. During the removal of the vapor-deposited area 500, the deposition layer 640 may fracture under stress. In this embodiment, the deposition layer 640 formed by CVD has excellent step coverage. The deposition layer 640 can protectively cover the partition 700, thereby increasing its strength. During the removal of the vapor-deposited area 500, under stress on the deposition layer 640, the partition 700 can absorb the force, and a stress-relieving zone is formed at the bottom of the partition 700. This prevents the deposition layer 640 from fracture or further propagation of cracks, protecting the integrity and stability of the outer frame of the main screen 100 and the inner frame of the secondary screen 200, thus improving the yield rate and reliability of the display device.

[0123] In one embodiment, along the first direction, the projected area of ​​the top of the partition 700 is at least greater than one of the projected areas of the middle part of the partition 700 and the projected area of ​​the bottom of the partition 700.

[0124] One of the projected areas of the middle part of the partition 700 and the projected area of ​​the bottom part of the partition 700.

[0125] The first direction is along the thickness direction of the display device. The projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, or the projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, or the projected area of ​​the top of the partition 700 is larger than the projected area of ​​the middle part of the partition 700, and the projected area of ​​the bottom of the partition 700 is larger than the projected area of ​​the bottom of the partition 700. That is, in cross-section, a recessed sidewall with an inward concave direction is formed between the top and bottom or the middle part of the partition 700. Due to the vertical characteristics of the thermal evaporation of the organic common layer 610 and the cathode layer 620, the partition 700 has a recessed sidewall with an inward concave direction. During the thermal evaporation process, the materials of the organic common layer 610 and the cathode layer 620 will form a plating failure area on the recessed sidewall of the partition 700 in the width direction. This causes the organic common layer 610 and the cathode layer 620 to break at the partition 700, forming a discontinuous film. When water vapor enters into this discontinuous film, it will be blocked, preventing the formation of a complete path for water vapor to enter the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. This avoids the problem of water vapor entering the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen, thus preventing the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen from failing to absorb water.

[0126] The partition 700 is typically a structure that is wider at the top and narrower at the bottom, but it can also be a structure that is wider at the top, narrower in the middle, and wider at the bottom. For example, the cross-section can be an I-shaped, inverted L-shaped, or inverted trapezoidal structure. It can be a partition column such as SD partition column, PLN partition column, PI partition column, or PS partition column. The types of partition 700 can be diverse, and designs with an undercut structure that are wider at the top and narrower at the bottom can be used for partition 700.

[0127] like Figure 5 and Figure 6 As shown, in one embodiment, it further includes:

[0128] Multiple dam bodies 800 are located on the flat layer 630, and are respectively located on the outer frame of the main screen 100 and the inner frame of the secondary screen 200. The partition 700 is arranged on both sides of the dam body 800.

[0129] The dam 800 is arranged around the display area of ​​the main screen 100 and the display area 230 of the secondary screen, and is located on the outer frame of the main screen 100 and the inner frame of the secondary screen 200. The dam 800 is also located on the outer frame 220 of the secondary screen. The dam 800 is used to define the position of the organic encapsulation layer. Multiple partitions 700 are provided on both the inner and outer sides of the dam 800 to ensure that the water vapor passage is blocked and cannot directly enter the display area of ​​the main screen 100 and / or the display area 230 of the secondary screen.

[0130] like Figure 6 As shown, in one embodiment, it further includes:

[0131] Deposition layer 640 is located on the side of cathode layer 620 away from planarization layer 630;

[0132] The first filling layer 650 is located on the side of the dam body 800 away from the display area 230 of the sub-screen and the display area 230 of the sub-screen, and on the side of the sedimentation layer 640 away from the flattening layer 630, wherein a portion of the first filling layer 650 extends to a position below the top of the partition member 700.

[0133] The deposition layer 640 is typically formed using chemical vapor deposition (CVD). This inorganic CVD process results in a relatively fragile deposition layer 640, which may fracture under stress during the removal of the vapor-deposited area 500. In this embodiment, the CVD-formed deposition layer 640 exhibits excellent step coverage. It can protectively cover the partition 700, thereby enhancing its strength. During the removal of the vapor-deposited area 500, the partition 700 absorbs the stress on the deposition layer 640, while a stress-relieving zone forms at its bottom. This prevents the deposition layer 640 from fracture or further propagating cracks, protecting the integrity and stability of the outer bezel of the main screen 100 and the inner bezel of the secondary screen 200, thus improving the yield rate and reliability of the display device.

[0134] Meanwhile, on the deposition layer 640 on the side of the display area 230 of the dam body 800 away from the sub-screen and the side of the display area 230 of the sub-screen, when the vapor deposition area 500 is cut and removed, the deposition layer 640 located on the shoulder of the partition 700 is more prone to fracture under stress than other locations. Specifically, the deposition layer 640 near the top of the partition 700 is subjected to greater stress, especially the deposition layer 640 between the tops of two adjacent partitions 700, which is prone to fracture. By adding a first filler layer 650, which is typically an organic planar layer 630, and part of the first filler layer 650 extends below the top of the partition 700, the stress on the deposition layer 640 at the top of the partition 700 can be relieved, thereby preventing the deposition layer 640 from fracture near the top of the partition 700 and improving product reliability. Meanwhile, since there is a flat layer 630 on the other side of the dam body 800, the thickness of the display device on that side is relatively large. After filling the filling layer 650, the structural thickness on both sides of the dam body 800 can be made to be nearly uniform, which facilitates the subsequent configuration of touch panels, etc., and also increases the structural stability of the display device.

[0135] In addition, at the edge of the connection 300 between the main screen 100 and the secondary screen 200, laser cutting may cause the deposited layer 640 to break. Therefore, a partition 700 in the same direction as the cutting line is provided at the edge to prevent the crack in this direction from extending to the wiring area of ​​the connection 300 and causing a break.

[0136] In one embodiment, the outer frame of the main screen 100 has a first outer frame area 110 and a second outer frame area 120, and a portion of the partition 700 is located on the first outer frame area 110. The first outer frame area 110 and the second outer frame area 120 are independent of each other.

[0137] The inner frame of the secondary screen 200 has a first inner frame area 210, and part of the partition 700 is located on the first inner frame area 210.

[0138] Both the second outer frame area 120 and the outer frame 220 of the sub-screen have cathode bonding areas.

[0139] The outer frame of the main screen 100 can be composed of a first outer frame area 110 and a second outer frame area 120, or the first outer frame area 110 and the second outer frame area 120 together constitute only part of the outer frame. The first outer frame area 110 is at least the outer frame portion of the main screen 100 near the connection point 300 between the main screen 100 and the sub-screen 200. Generally, the first outer frame area 110 is located on both sides of the connection point 300 between the main screen 100 and the sub-screen 200. The first outer frame area 110 and the second outer frame area 120 are independent of each other. The first outer frame area 110 defines the range of the vapor deposition area 500, thereby leaving space for the second outer frame area 120 where the cathode overlap area is set, so as to realize the cathode electrical connection of the main screen 100 and the sub-screen 200 respectively, ensuring the display effect.

[0140] In the secondary screen 200, the first inner frame area 210 is part or all of the inner frame of the secondary screen 200, while the outer frame 220 of the secondary screen is independent of the inner frame of the secondary screen 200. The vapor deposition layer will only affect the first inner frame area 210, and at most the entire inner frame of the secondary screen 200. However, the outer frame 220 of the secondary screen will not be affected by the vapor deposition area 500. Therefore, a cathode overlap area can be configured on the outer frame 220 of the secondary screen to realize the cathode electrical connection between the main screen 100 and the secondary screen 200 respectively, ensuring the display effect.

[0141] like Figure 5 As shown, in one embodiment, it further includes:

[0142] A support member 900 is located at at least one position in the second outer frame area 120 and the outer frame 220 of the sub-screen. A dam body 800 is also disposed on the outer frame 220 of the sub-screen. Specifically, the support member 900 located in the second outer frame area 120 is situated on the side of the dam body 800 away from the display area of ​​the main screen 100, and the support member 900 located on the outer frame 220 of the sub-screen is situated on the side of the dam body 800 away from the display area 230 of the sub-screen. A deposition layer 640 covers the support member 900.

[0143] The second filler layer 650 is located on the side of the deposited layer 640 away from the planarization layer 630, wherein a portion of the second filler layer 650 extends to a position below the top of the support 900.

[0144] The support member 900 can be one of the partition members 700, or other structures capable of absorbing stress. The support member 900 can be located on the flat layer.

[0145] Since the removal of the vapor deposition area 500 is not required for the second outer frame area 120 and the outer frame 220 of the sub-screen, there is no issue regarding the extension of the cathode layer 620 and the organic common layer 610 to the display area of ​​the main screen 100 and / or the display area 230 of the sub-screen. However, the first outer frame area 110 and the outer frame 220 of the sub-screen are also encapsulated by the deposition layer 640. The deposition layer 640 is usually formed by chemical vapor deposition, which is relatively fragile and prone to breakage. In this embodiment, the deposition layer 640 formed by chemical vapor deposition has excellent step coverage, so the deposition layer 640 can protectively cover the support member 900, and the support member 900 enhances the strength of the deposition layer 640. When the deposited layer 640 on the second outer frame area 120 and the outer frame 220 of the sub-screen is under stress, the support member 900 can absorb the force on the deposited layer 640. At the same time, a stress relief zone will be formed at the bottom of the support member 900, preventing the deposited layer 640 from breaking or preventing the cracks in the deposited layer 640 from expanding further. This protects the integrity and stability of the outer frame of the main screen 100 and the outer frame 220 of the sub-screen, and improves the yield rate and product reliability of the display device.

[0146] After the addition of the support member 900, the deposition layer 640 near the top of the support member 900 is more prone to fracture under stress compared to other locations. Specifically, the deposition layer 640 near the top of the support member 900 experiences greater stress, especially the deposition layer 640 between the tops of two adjacent support members 900, making it more susceptible to fracture. In this embodiment, by adding a second filler layer 650, which is typically an organic planarization layer 630, and extending a portion of the second filler layer 650 below the top of the support member 900, the stress on the deposition layer 640 near its top can be alleviated, thereby preventing the deposition layer 640 from fractureing near the top of the support member 900 and improving product reliability. Simultaneously, because the other side of the dam 800 has a planarization layer 630, the thickness of that side of the display device is relatively large. After filling with the filler layer 650, the structural thickness on both sides of the dam 800 becomes nearly uniform, facilitating subsequent configuration of touch panels, etc., and increasing the structural stability of the display device.

[0147] like Figure 12 and Figure 13 As shown, in one embodiment, the connection between the outer frame of the main screen 100 and the inner frame of the secondary screen 200 is a connection point 300, wherein the connection point 300 includes a connection area 320 and an opening area 310, and the connection area 320 and the opening area 310 are arranged alternately.

[0148] Other configurations of the display device manufacturing method in the above embodiments can be adopted from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0149] The connection point 300 is the junction between the outer frame of the main screen 100 and the inner frame of the sub-screen 200, and it is also fabricated together with the display unit 10 based on the mask 1. The connection point 300 includes a connection area 320 and an opening area 310. The connection area 320 is used to arrange wiring, and several wirings on the same connection area 320 connect the main screen 100 and the sub-screen 200. The width of each wiring can be 10-5000 μm, specifically 300-2000 μm, preferably 500-1000 μm. The connection area 320 and the opening area 310 are staggered to form a comb-like structure, which gives the connection point 300 circumferential compressibility during 3D bonding, reducing wrinkles or broken lines caused by bonding, thereby increasing the deformation capability of the connection point 300.

[0150] The aperture region 310 consists of a series of aperture structures formed on the PI substrate. The aperture region 310 can be formed by etching or subsequent laser processing, thereby increasing the deformability of the connection 300. Depending on the number of interconnects and the required space, different aperture structures can be set in the aperture region 310. For example, the width of the aperture region 310 can be 10-3000 μm, specifically in the range of 10 μm-700 μm, preferably in the range of 50-300 μm.

[0151] The wiring area avoids the opening area 310. The partition 700 is located above the wiring area, and the opening structure is placed in the connection area 320. Because there are partitions 700 for the main screen 100 and the sub-screen 200 at the top and bottom, the water vapor passages entering the display areas of the main screen 100 and the sub-screen 200 at the top and bottom are blocked. Only the connecting wiring is on the left and right sides, which is covered by the deposition layer 640 and the filling layer 650. No water vapor will enter the wiring, ensuring the reliability of the display device.

[0152] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0153] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0154] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0155] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0156] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure of this application, the components and arrangements of specific examples are described above.

[0157] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a display device, characterized in that, include: Based on a mask, a display unit of a display device is fabricated, wherein a main screen and a sub-screen are connected on the display unit, the main screen has a first outer frame area, the sub-screen has a first inner frame area, an opening area is formed between the first outer frame area and the first inner frame area, and the display unit has a vapor deposition area on the opening area, and both the first outer frame area and the first inner frame area are connected to the vapor deposition area. Remove the vapor-deposited area on the display unit to obtain the display device.

2. The method for manufacturing a display device according to claim 1, characterized in that, The display unit of the fabrication display device includes: Prepare a planarization layer; An organic common layer is disposed on the planarization layer; A cathode layer is disposed on the side of the organic common layer away from the planar layer; Multiple partitions are disposed on the flat layer, wherein the partitions are respectively located on the outer frame of the main screen and / or the inner frame of the sub-screen, for separating the organic common layer and the cathode layer.

3. The method for manufacturing a display device according to claim 2, characterized in that, Along the first direction, the projected area of ​​the top of the partition is at least greater than one of the projected areas of the middle part of the partition and the projected area of ​​the bottom of the partition.

4. The method for manufacturing a display device according to claim 2, characterized in that, The display unit of the fabrication display device further includes: Multiple dams are configured on the flat layer, wherein the dams are located on the outer frame of the main screen and the inner frame of the sub-screen, and the partitions are arranged on both sides of the dams.

5. The method for manufacturing a display device according to claim 4, characterized in that, The method further includes: A deposition layer is disposed on the side of the cathode layer away from the planarization layer; A first filling layer is disposed on the side of the deposition layer away from the flat layer. The first filling layer is disposed on the side of the dam body away from the display area of ​​the main screen and the display area of ​​the secondary screen. A portion of the first filling layer extends to a position below the top of the partition.

6. The method for manufacturing a display device according to claim 5, characterized in that, The first outer frame area is located on the outer frame of the main screen, and the outer frame of the main screen also has a second outer frame area. Part of the partition is located on the first outer frame area, and the first outer frame area and the second outer frame area are independent of each other. The first inner frame area is located on the inner frame of the sub-screen, and part of the partition is located on the first inner frame area; Both the second outer frame area and the outer frame of the sub-screen have cathode overlap areas.

7. The method for manufacturing a display device according to claim 6, characterized in that, The method further includes: Multiple support members are disposed at at least one position in the second outer frame area and the outer frame of the sub-screen. The dam body is also disposed on the outer frame of the sub-screen. The support member disposed in the second outer frame area is located on the side of the dam body away from the display area of ​​the main screen, and the support member disposed on the outer frame of the sub-screen is located on the side of the dam body away from the display area of ​​the sub-screen. The deposition layer covers the support member. A second filler layer is disposed on the side of the deposited layer away from the flattened layer, wherein a portion of the second filler layer extends below the top of the support.

8. The method for manufacturing a display device according to claim 1, characterized in that, The display unit has a connection point, and the outer frame of the main screen and the inner frame of the sub-screen are connected through the connection point. The connection point includes a connection area and an opening area, and the connection area and the opening area are arranged alternately.

9. A display device, characterized in that, include: Planarization layer; An organic common layer is located on the planar layer; A cathode layer is located on the side of the organic common layer away from the planar layer; as well as Multiple partitions are located on the planar layer and on the outer frame of the main screen and the inner frame of the sub-screen, respectively, to separate the organic common layer and the cathode layer.

10. The display device according to claim 9, characterized in that, Along the first direction, the projected area of ​​the top of the partition is at least greater than one of the projected areas of the middle part of the partition and the projected area of ​​the bottom of the partition.

11. The display device according to claim 9, characterized in that, Also includes: Multiple dam bodies are located on the flat layer and are respectively located on the outer frame of the main screen and the inner frame of the sub-screen. The partitions are arranged on both sides of the dam bodies.

12. The display device according to claim 11, characterized in that, Also includes: The deposition layer is located on the side of the cathode layer away from the planarization layer; The first filling layer is located on the side of the dam body away from the display area of ​​the sub-screen and the display area of ​​the sub-screen, on the side of the deposition layer away from the flattening layer, wherein the first filling layer extends to a position below the top of the partition.

13. The display device according to claim 12, characterized in that, The outer frame of the main screen has a first outer frame area and a second outer frame area, and part of the partition is located on the first outer frame area. The first outer frame area and the second outer frame area are independent of each other. The inner frame of the secondary screen has a first inner frame area, and part of the partition is located on the first inner frame area; Both the second outer frame area and the outer frame of the sub-screen have cathode overlap areas.

14. The display device according to claim 13, characterized in that, Also includes: A support member is located at at least one position in the second outer frame area and the outer frame of the sub-screen. The dam body is also disposed on the outer frame of the sub-screen. The support member disposed in the second outer frame area is located on the side of the dam body away from the display area of ​​the main screen, and the support member disposed on the outer frame of the sub-screen is located on the side of the dam body away from the display area of ​​the sub-screen. The deposition layer covers the support member. A second filler layer is located on the side of the deposited layer away from the planarization layer, wherein the second filler layer extends to a position below the top of the support.

15. The display device according to claim 9, characterized in that, The outer border of the main screen and The connecting portion of the inner frame of the sub-screen is called the connection point, which includes a connection area and an opening area. The connection area and the opening area are arranged alternately.

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