Modular eyewear antenna assembly

Abstract

Apparatus, methods, and systems for modular eyeglass antenna assemblies are disclosed. A modular eyeglass antenna assembly includes: an eyeglass housing comprising a front frame and a pair of temple arms, wherein the physical dimensions and shape of each temple arm in the pair are selectable from a variety of eyeglass assembly minimum stock unit (SKU) sizes and shapes; a printed circuit board (PCB) (230) including a controller (120) and a radio device (130), wherein the PCB (230) extends along at least one of the temple arms (108), wherein the PCB (230) has a fixed size suitable for placement within one of the temple arms (108); and a modular antenna structure including an antenna carrier (430), wherein the modular antenna structure is connected to the PCB (230) to provide a wireless propagation path for the radio device (130), wherein the modular antenna structure has a fixed size suitable for placement together with the PCB (230) within the one of the temple arms (108).

Description

[0001] The field of the described embodiments

[0002] The described embodiments generally relate to eyeglasses. More specifically, the described embodiments relate to systems, methods, and apparatus for modular antennas for electronic eyeglasses. Background Technology

[0003] For electronic glasses, the various sizes and shapes typically require different antenna designs and configurations. Furthermore, if sold in the consumer electronics sector, millions of electronic glasses may be sold, but these glasses may only have one or two antenna configurations.

[0004] Smart glasses (electronic glasses) that include antennas require custom designs based on industrial design and mechanical constraints. Designing different antennas for each size and shape of electronic glasses leads to longer product development cycles and increases engineering and manufacturing costs.

[0005] Furthermore, augmented reality electronic glasses, including virtual reality glasses, typically include radio frequency (RF) circuitry located near the user's head to support wireless connections to the glasses. In this case, a portion of the RF energy may radiate towards the user's head, and this portion of the RF energy will be absorbed by the user's head. RF energy radiating towards the user's head is undesirable for several reasons. First, radiation towards the user's head means less RF energy is sent to RF receivers (e.g., mobile phones, WiFi access points (WiFi routers), and base stations). Second, according to the Federal Communications Commission (FCC), RF radiation towards the user's head will be limited to a selected threshold.

[0006] Methods, apparatus, and systems for using modular antennas for electronic glasses are desired. Summary of the Invention

[0007] The embodiment includes a modular eyeglass antenna assembly. The modular eyeglass antenna assembly includes: an eyeglass housing including a front frame and a pair of temple arms, wherein the physical size and shape of each of the temple arms can be selected from a variety of eyeglass assembly SKU sizes and shapes; a printed circuit board (PCB) including a controller and a wireless device, wherein the PCB extends along at least one of the temple arms, wherein the PCB has a fixed size adapted to be disposed within the at least one temple arm of the pair of eyeglass assembly SKU sizes and shapes; and a modular antenna structure including a planar antenna, wherein the modular antenna structure is connected to the PCB to provide a wireless propagation path to an external wireless device for the wireless device, wherein the modular antenna structure has a fixed size adapted to be disposed together with the PCB within the at least one temple arm of the pair of temple arms for each eyeglass assembly SKU size and shape.

[0008] The embodiment includes a modular eyeglass antenna assembly. The modular eyeglass assembly includes an eyeglass housing, a printed circuit board (PCB), and a modular antenna structure. The eyeglass housing includes a front frame and a pair of temple arms. The PCB includes a controller and a wireless device, wherein the PCB extends along at least one of the temple arms. The antenna structure is connected to the PCB to provide a wireless propagation path for the wireless device. The modular antenna structure also includes a conductive patch formed on a first surface of the modular antenna structure, a conductive sidewall extending through the modular antenna structure, a conductive grounding element formed on a second surface of the modular antenna structure, and a feed trace located on the first surface and capacitively coupled to a radio frequency integrated circuit (RFIC) on the PCB, wherein the conductive patch, the conductive sidewall, the conductive grounding element, and the feed trace form a planar inverted-F antenna.

[0009] Another embodiment includes a method for assembling a modular antenna structure for electronic glasses. The method includes: forming mechanical holes and alignment features on a PCB including a controller and an RFIC; soldering a plurality of spring clips to both a top (first) surface and a bottom (second) surface of the PCB prior to assembly; inserting the PCB into a mechanical slot of the modular antenna structure, wherein the mechanical holes of the PCB lock with ribs of the mechanical slot of the modular antenna structure, providing alignment of the plurality of spring clips of the PCB with conductive pads of the modular antenna structure, wherein, when the PCB is inserted along the mechanical slot, the ends of the plurality of spring clips deform to ensure force balance on the PCB; and mounting the PCB and the modular antenna structure within curved temple arms of various shapes and SKU sizes of electronic glasses.

[0010] Other aspects and advantages of the described embodiments will become apparent from the following detailed description taken in conjunction with the accompanying drawings, which illustrate the principles of the described embodiments by way of example.

[0011] According to one aspect of this disclosure, a modular eyeglass antenna assembly is provided, comprising: an eyeglass housing including a front frame and a pair of temple arms, wherein the physical size and shape of each of the pair of temple arms can be selected from a variety of eyeglass assembly sizes and shapes; a printed circuit board (PCB) extending along at least one of the pair of temple arms, wherein the PCB has a fixed size adapted to be disposed within the at least one of the pair of temple arms of each of a variety of eyeglass assembly sizes and shapes; and a modular antenna structure including a planar antenna, wherein the modular antenna structure is connected to the PCB to provide a wireless propagation path to an external wireless device for the wireless device, wherein the modular antenna structure has a fixed size adapted to be disposed together with the PCB within the at least one of the pair of temple arms of each of a variety of eyeglass assembly sizes and shapes.

[0012] The modular antenna structure may include a first part and a second part, wherein the PCB is sandwiched between the first part and the second part when the PCB is assembled in at least one temple arm of the pair of temple arms of each eyeglass assembly SKU size and shape.

[0013] The PCB may include a planar structure, wherein the first portion of the modular antenna structure includes a curved surface adapted to be disposed between the PCB and a curved surface of at least one temple arm in the pair of temple arms of each eyeglass assembly SKU size and shape.

[0014] The curved surface of the modular antenna structure can conform to the inner surface of the at least one temple arm, thereby allowing the antenna formed by the modular antenna structure to be large enough to be operable to support the radiation of electromagnetic signals with the required frequency channel bandwidth.

[0015] The modular antenna structure may include an antenna carrier including a mechanical groove formed between the first portion and the second portion, wherein the mechanical groove is adapted to accommodate the PCB.

[0016] The mechanical slot can form a sandwich-type mechanical structure, wherein the width of the mechanical slot is designed to provide tilted mounting of the PCB together with spring clips located on both sides of the PCB.

[0017] The mechanical slot can be formed between the first and second parts of the modular antenna structure. The mechanical slot includes a rib that is operated to hook the PCB when the PCB is received in the mechanical slot.

[0018] This modular antenna structure can form a planar inverted-F antenna, which is configured to generate an antenna pattern with zero radiation in the direction of the user's head in the eyeglass housing.

[0019] The planar inverted-F antenna can be terminated on the PCB with reactive capacitors.

[0020] The modular antenna structure may further include a conductive patch formed on a first surface of the modular antenna structure, a conductive sidewall extending through the modular antenna structure, a conductive grounding element formed on a second surface of the modular antenna structure, and a feed trace located on the first surface and capacitively coupled to the PCB of a radio frequency integrated circuit (RFIC), wherein the conductive patch, the conductive sidewall, the conductive grounding element and the feed trace form the planar inverted F antenna.

[0021] The conductive patch may include an L-shaped cutout that allows for a reduction in the size of the conductive patch, thereby allowing for a reduction in the size of the planar inverted-F antenna.

[0022] The planar inverted-F antenna can be connected to the ground plane of the PCB via two conductive clips, which create a ground shield that reduces radiation to the head of the user of the modular glasses antenna assembly.

[0023] The component may also include a conductive tuning clip that is operated to electrically connect the radio device to the modular antenna structure, wherein the tuning clip tunes the lower frequency band of the electromagnetic signal radiated from the planar inverted-F antenna.

[0024] The planar inverted-F antenna can be operated to form at least three communication modes, each of which supports wireless communication via the planar inverted-F antenna.

[0025] The frequency response of the first mode can be selected based on the conductive patch, the conductive grounding element, the tuning clip, the first grounding spring clip located between the PCB and the conductive grounding element near the tuning clip, and the second spring clip located between the PCB and the conductive grounding element near the feed trace signal clip.

[0026] The frequency response of the second mode can be selected based on the conductive grounding element, the first grounding spring clip, the second spring clip, and an optional third grounding spring clip located on the second surface of the modular antenna structure. The third grounding spring clip can be a conductive trace of an electrical connection located on the sidewall of the antenna carrier.

[0027] The frequency response of the third mode can be selected based on the feed trace, the feed trace signal clip, and the GND clip located on the first surface of the PCB.

[0028] The tuning clip can be terminated with surface mount technology (SMT) components (inductors or capacitors) on the PCB.

[0029] The PCB may also include one or more mechanical holes for aligning the modular antenna structure with the PCB, wherein the mechanical holes lock with the ribs of the mechanical slots of the modular antenna structure, providing alignment of a plurality of spring clips of one of the PCB and the modular antenna structure with the conductive pads of the other of the PCB and the modular antenna structure.

[0030] Before assembly, the multiple spring clips can be soldered to both the top and bottom surfaces of the PCB. When assembled by inserting the PCB along the mechanical slot, the ends of the multiple spring clips deform to ensure a balance of forces on the PCB. Attached Figure Description

[0031] Figure 1 Electronic glasses according to one embodiment are shown.

[0032] Figure 2 The image shows a temple arm of eyeglasses including a modular antenna (or a modular antenna structure) according to one embodiment.

[0033] Figure 3 A modular antenna including a mechanical slot according to one embodiment is shown, the mechanical slot including ribs for accommodating a printed circuit board (PCB).

[0034] Figure 4 A PCB including mechanical holes and alignment features according to one embodiment is shown, which are used to help align the PCB with a modular antenna structure.

[0035] Figure 5 The structure of a modular antenna according to one embodiment is shown.

[0036] Figure 6 A PCB and a modular antenna electrically connected using conductive clips are shown according to one embodiment.

[0037] Figure 7 The frequency response of three modes of wireless communication of electronic glasses according to one embodiment is shown.

[0038] Figure 8 A spring clip according to one embodiment is shown.

[0039] Figure 9 A flowchart illustrating the steps of a method for assembling a modular antenna structure for electronic glasses according to an embodiment is shown. Detailed Implementation

[0040] The described embodiments include methods, apparatus, and systems for using modular antennas for electronic glasses. In one embodiment, the glasses include a glasses housing, a printed circuit board (PCB), and a modular antenna structure. In another embodiment, the glasses housing can be selected from a variety of stock-keeping unit (SKU) sizes and shapes for eyeglass components. That is, the shape and size of the glasses housing can vary from one pair of electronic glasses to another. However, the size and shape of the PCB and the modular antenna structure are configured to be identical for variable, different shapes and sizes of glasses housings. In one embodiment, the PCB includes a controller and a radio, wherein, during assembly, the PCB extends along at least one of a pair of temple arms, and the PCB has a fixed size suitable for being positioned within one of the pair of temple arms for each of the various eyeglass component SKU sizes and shapes. In another embodiment, the modular antenna structure includes a planar antenna, wherein the modular antenna structure is connected to the PCB for providing a wireless propagation path from the radio to an external wireless device. In addition, the modular antenna structure has a fixed size that is suitable for the modular antenna structure to be set together with the PCB in at least one of a pair of temple arms of each eyeglass assembly SKU size and shape.

[0041] The design of electronic glasses (e.g., augmented reality (AR) glasses) is crucial for their widespread adoption in the consumer electronics market. Typically, the front frame of the glasses is designed for style and fashion, rather than functionality. At least some embodiments involve frames specifically designed for curves and fashionable aesthetics, and one or more temples of the electronic glasses are dedicated to housing electronic circuitry and / or batteries.

[0042] Typically, total sales of consumer electronics products reach millions of units with one or two antenna configurations. The booming smart glasses and augmented reality (AR) industries employ different growth strategies. That is, a single product may have more than 10 SKU sizes and popular shapes to meet diverse customer needs. Smart glasses antennas require custom design based on industrial design (ID) and mechanical constraints. Designing different antennas for each size and shape results in longer product development cycles and increases engineering and manufacturing costs.

[0043] Furthermore, AR glasses have radio frequency (RF) circuitry near the head for wireless connectivity. In this case, some of the RF energy radiated towards the head will be absorbed by the head. The more radiation towards the head, the less RF energy can be sent to the RF receiver (i.e., mobile phones, WiFi access points (WiFi routers), and base stations). Moreover, according to FCC regulations, if the radiation towards the head exceeds a certain limit, the RF circuitry must reduce the transmit power sent to the antenna to reduce RF circuitry radiation and comply with regulations. When the transmit power is too low, the power received at the receiver is insufficient to maintain a high-throughput wireless connection.

[0044] In one embodiment, a planar inverted-F antenna (PIFA) is used as a solution to mitigate the head effect because it has directional radiation with zero radiation directed towards the head. Since head-oriented radiation is minimized, the Specific Absorption Rate (SAR) is improved for better RF security and more transmit power is provided.

[0045] At least some of the described embodiments include a modular antenna structure, enabling a single antenna design to be used in glasses / AR products of all sizes and shapes. Furthermore, at least some of the described embodiments are configured to reduce RF radiation toward the head without compromising the quality of the wireless connection between the electronic glasses and external devices.

[0046] Figure 1An electronic glasses 100 according to one embodiment is shown. As shown, the electronic glasses 100 includes a front frame 106 and temple arms 108. Although a single temple arm 108 is shown, it is clear that embodiments of the electronic glasses include a pair of temple arms.

[0047] As shown, in one embodiment, the temple arm 108 includes a controller 120 and a wireless device 130, which operates to establish a wireless link with an external device. The described embodiment includes a printed circuit board (PCB) and a modular antenna suitable for configuration within the temple arm 108. In one embodiment, the PCB includes the controller 120 and the wireless device 130. In one embodiment, the modular antenna of the described embodiment is configured to form an antenna for the wireless device 130, which supports a wireless link 150 between the electronic glasses 100 and an external wireless device.

[0048] Figure 2 A temple arm 210 of eyeglasses including a modular antenna according to one embodiment is shown. As illustrated, the temple arm 210 is curved so that the eyeglasses having the temple arm 210 can fit the head 220 of the user of the electronic glasses. At least some embodiments of the electronic glasses include a modular eyeglass assembly (PCB and modular antenna) configured to be disposed within a curved temple arm of the electronic glasses in various shapes and SKU sizes.

[0049] like Figure 2 As shown, in one embodiment, the modular eyeglass antenna assembly includes an eyeglass housing, a printed circuit board (PCB) 230, and a modular antenna structure. In another embodiment, the eyeglass housing includes a front frame and a pair of temple arms 210, wherein the physical dimensions and shape of the pair of temple arms can be selected from a variety of eyeglass assembly SKU sizes and shapes. That is, since the eyeglass housing can be selected from a variety of eyeglass assembly SKU sizes and shapes, each of the pair of temple arms can be selected from a variety of eyeglass assembly SKU sizes and shapes.

[0050] As previously described, in one embodiment, the printed circuit board (PCB) 230 includes at least a controller and a wireless device. Furthermore, in one embodiment, the PCB 230 extends along at least one of a plurality of temple arms 210, wherein the PCB 230 has a fixed size adapted to be disposed within at least one of the plurality of temple arms 210 for each eyeglass assembly SKU size and shape.

[0051] In at least some embodiments, the modular antenna structure includes a planar antenna, wherein the modular antenna structure is connected to PCB 230 to provide a wireless propagation path (e.g., wireless link 150) for a wireless device to an external wireless device. As previously described, in one embodiment, the modular antenna structure has a fixed size suitable for being disposed together with the PCB within at least one of a plurality of temple arms for each eyeglass assembly SKU size and shape. That is, the eyeglass assembly can have multiple sizes and shapes, while the dimensions of the PCB and the modular antenna structure are fixed.

[0052] The term "SKU" (pronounced "skew") is an abbreviation for the smallest unit of inventory, used by retailers to identify and track their stock or inventory. An SKU is a unique code consisting of letters and numbers that indicates characteristics of each product, such as manufacturer, brand, style, color, and size.

[0053] In one embodiment, the modular antenna structure includes a first portion (an external portion disposed away from the user's head 220) 232 and a second portion (an internal portion disposed closer to the user's head 220) 234, wherein the PCB 230 is sandwiched between the first portion 232 and the second portion 234 when assembled within the temple arm 210. As shown, the temple arm includes a curved surface 236 to adapt the eyeglasses to be worn on the user's head 220. In one embodiment, the PCB 230 includes a planar structure. Specifically, the PCB 230 is planar and includes a rigid structure that must be mounted or disposed within the curved temple arm 210 according to the surface 236. Thus, in one embodiment, both the internal portion 234 and the external portion 232 of the modular antenna structure include curved surfaces adapted to be disposed between the planar PCB 230 and the curved surface of the housing cover 240 of at least one of the plurality of temple arms 210 for each eyeglass assembly SKU size and shape.

[0054] In one embodiment, the curved surface of the modular antenna structure corresponds to the curved surface 236 of the temple arm housing cover 240 of the temple 210. By maintaining the curved surface, the antenna formed by the modular antenna structure is allowed to be large enough to be operable to support the radiation of electromagnetic signals with the desired frequency channel bandwidth. That is, the desired or required frequency channel bandwidth of the communication signals transmitted between the antenna of the modular antenna structure of the electronic glasses and the external wireless device requires the antenna to be formed to be large enough to provide the desired level of antenna gain. The curved surface of the planar antenna module (i.e., the modular antenna structure described above) allows for the required volume while still accommodating the rigid planar structure of the PCB 230.

[0055] In other words, in one embodiment, the modular antenna structure has a curved surface that conforms to the inner surface of the temple arm 210 (the surface closest to the user's head on the electronic glasses), allowing the antenna volume to be maximized in three dimensions. A larger antenna volume results in better antenna performance, especially for planar inverted-F antennas (PIFA). For PIFA topologies, meeting the required frequency channel bandwidth is very challenging if the antenna volume is not well utilized.

[0056] Figure 3 A modular antenna structure including a mechanical slot according to one embodiment is shown, the mechanical slot including ribs 320 for receiving a printed circuit board (PCB). In one embodiment, the modular antenna structure includes an antenna carrier 330 including a mechanical slot 310 formed between an outer portion and an inner portion of the modular antenna structure, wherein the mechanical slot 310 is adapted to receive the PCB. In another embodiment, the modular antenna structure includes a plastic antenna carrier 330 and conductive copper traces, wherein the conductive copper traces are plated on the surface of the plastic antenna carrier 330.

[0057] In one embodiment, the mechanical slot 310 forms a sandwich-shaped mechanical structure, wherein the width of the mechanical slot 310 is designed to accommodate the PCB and, together with spring clips located on both sides of the PCB, provide tilted mounting of the PCB. As will be described, a plurality of conductive clips provide electrical connections between the PCB and the modular antenna structure. In one embodiment, at least some of the conductive clips are soldered to the PCB before the PCB is inserted into the mechanical slot 310. Furthermore, as previously stated, the shape of the temples and the rigid planar structure of the PCB allow the PCB to have a tilted physical relationship with the temples of the electronic glasses. Therefore, as stated, in one embodiment, the dimensions (at least the width) of the mechanical slot 310 are designed to accommodate the PCB when the conductive clips are attached to the PCB. Furthermore, the dimensions (at least the width of the mechanical slot) of the mechanical slot 310 are designed to accommodate the PCB in a tilted manner relative to the modular antenna structure.

[0058] In one embodiment, the mechanical slot 310 formed between the outer and inner portions of the modular antenna structure includes a rib 320 that is operated to hook the PCB when it is received into the mechanical slot. After the PCB is inserted into the mechanical slot 310, the rib 320 is operated to hold the PCB in place.

[0059] Figure 4A PCB 400 according to one embodiment is shown, including mechanical holes 410 and alignment features 420, which are used to assist in aligning the PCB 400 with a modular antenna structure. In one embodiment, the PCB 400 includes one or more mechanical holes 410 for aligning the modular antenna structure with the PCB 400, wherein these mechanical holes lock with ribs of the planar antenna module (antenna carrier 430), providing alignment of multiple spring clips of one of the PCB 400 and the planar antenna module (antenna carrier 430) with conductive pads of the other of the PCB 400 and the planar antenna module (antenna carrier 430). In one embodiment, during assembly, the mechanical holes 410 lock with ribs on the antenna carrier 430. In one embodiment, after assembly, five clips (described later) on the PCB 400 contact small conductive pads on the antenna carrier 430. Precise alignment of the spring clips and conductive pads is achieved during assembly through this mechanical structure and mechanism.

[0060] In one embodiment, prior to assembly, multiple spring clips are soldered to both the top and bottom surfaces of the PCB. During assembly by inserting the PCB along a mechanical slot 440, the ends of the spring clips deform to ensure force balance on the PCB 400. In another embodiment, prior to assembling the modular antenna, the ends of the spring clips soldered to the top and bottom of the PCB 400 using an SMT (Surface Mount Technology) process stand upright at a greater height than after assembly. When the modular antenna is assembled onto the PCB 400 along the mechanical slot 440 on the antenna carrier 430, the ends of the spring clips deform to ensure a larger contact area with the conductive pads on the antenna carrier 430. After assembly, mechanical structures such as the mechanical slot, mechanical hole 410, alignment feature 420, and the spring clips deforming on the top and bottom of the PCB 400 ensure balanced forces at the PCB 400.

[0061] Figure 5 The structure of a modular antenna according to one embodiment is shown. In one embodiment, the modular antenna structure forms a planar inverted-F antenna, which is configured to generate an antenna pattern with a zero-radiation pattern in the direction of the user's head on the eyeglass housing. That is, the planar inverted-F antenna is formed such that when the electronic glasses communicate with another device, the electromagnetic radiation of the planar inverted-F antenna is directed away from the user's head.

[0062] An inverted-F antenna is an antenna used for wireless communication. It consists of a monopole that runs parallel to the ground plane and is grounded at one end. The antenna is fed from a midpoint a certain distance from the ground end. Inverted-F antennas resonate at a quarter wavelength (thus reducing the space required on devices using them) and typically also have good SAR (Specific Absorption Ratio) characteristics.

[0063] The unique difference in the planar inverted-F antenna of the described embodiment lies in that the radio frequency (RF) signal of the wireless device of the Radio Frequency Integrated Circuit (RFIC) is coupled to the planar inverted-F antenna. More specifically, in one embodiment, the RF signal of the RFIC on PCB 520 is capacitively coupled to the inverted-F antenna of the modular antenna structure. The planar inverted-F antenna is terminated on PCB 520, which has reactive capacitance. That is, the planar inverted-F antenna is not directly fed by the RF signal from PCB 520. Instead, the planar inverted-F antenna is terminated with a reactive surface mount technology (SMT) capacitor on PCB 520.

[0064] For at least some embodiments, the modular antenna structure includes a conductive patch 550, a conductive sidewall 570 (along the side of the entire antenna carrier 510), a ground plane 530, and a feed trace 580. The conductive patch is formed on a first surface 512 of the antenna carrier 510 of the modular antenna structure. The conductive sidewall extends through the modular antenna structure. The ground plane is formed on a second surface 514 of the modular antenna structure. The feed trace is located on the first surface 512 and is capacitively coupled to a radio frequency integrated circuit (RFIC) of a PCB 520. The conductive patch 550, conductive sidewall 570, ground plane 530, and feed trace 580 form a planar inverted F antenna with an F-shaped structure 554.

[0065] like Figure 5 As shown, the conductive patch 550, conductive sidewall 570, and a pair (two) conductive clips 560 form an F-shaped structure 554 for a planar inverted-F antenna. In this embodiment, the conductive patch 550 is plated onto a matching (first) surface 512 of the antenna carrier of the modular antenna structure. As previously described, unlike possible conventional planar inverted-F antennas, the RF signal is not directly fed into the spring clips in the "F"-shaped structure. The RF signal is connected to a feed track 580, which is capacitively coupled to the planar inverted-F antenna structure.

[0066] In at least some embodiments, the conductive patch 550 includes an L-shaped notch (e.g., an L-shaped slot notch) 552, which allows for a reduction in the size of the conductive patch 550, thereby allowing for a reduction in the size of the planar inverted-F antenna. This reduced size provides design flexibility.

[0067] Figure 5 Also shown are the ribs 522 and alignment features 524 of the mechanical slot of the antenna carrier 510. As previously described, when the PCB 520 is inserted into the mechanical slot of the antenna carrier after assembly, the ribs 522 and alignment features 524 are used to align the conductive springs with the conductive pads.

[0068] Figure 6 A PCB 520 and a modular antenna structure using conductive clips for electrical connection are shown according to one embodiment. In at least some embodiments, the planar inverted-F antenna is connected to a ground plane via two conductive clips (tuning clip 610 and grounding spring clip 620), wherein the two conductive clips create a ground shield that reduces radiation to the head of the user of the modular glasses antenna assembly.

[0069] In one embodiment, a conductive tuning clip 610 is operated to electrically connect the wireless device of the PCB 520 to a conductive patch located on a first surface of the antenna carrier of the modular antenna structure. In one embodiment, the tuning clip 610 tunes for the lower frequency band of the electromagnetic signal radiated from the planar inverted-F antenna.

[0070] In one embodiment, grounding spring clips 620, 640, and 670 are operated to form multiple communication modes for the electronic glasses. That is, the grounding spring clips 620, 640, and 670 form a communication channel used by the electronic glasses to create a wireless communication channel for communication with external wireless devices.

[0071] In other words, in one embodiment, the planar inverted-F antenna operates to form at least three communication modes, each of which supports wireless communication via the planar inverted-F antenna. In one embodiment, the frequency response of the first mode is selected based on a conductive patch 550, a conductive grounding element (e.g., ground plane) 530, a tuning clip 610, a first grounding spring clip 620 located between the PCB 520 and the conductive grounding element 530 near the tuning clip 610, and a second spring clip 640 located between the PCB 520 and the conductive grounding element 530 near the feed trace signal clip 660.

[0072] The novelty of the modular antenna structure lies in the operation of the ground plane 530 in the high-frequency band of wireless communication. Due to the careful arrangement of grounding clips 620, 640, and 670, two modes (Mode 2 and Mode 3) are optionally available in the high-frequency band. Typically, the frequency response of Mode 2 is determined by the conductive grounding element 530 located at the bottom (second surface) of the modular antenna structure and three grounding clips (a first grounding spring clip 620, a second spring clip 640, and a third grounding spring clip 670 electrically connected to conductive traces located on the sidewall of the antenna carrier 510). All three grounding clips (first grounding spring clip 620, second spring clip 640, and third grounding spring clip 670) are connected to the ground plane on the PCB 520. Typically, the frequency response of Mode 3 is created by the feed trace 580, the feed trace signal clip 660, and the GND clip located at the top of the PCB 520. Both Mode 2 and Mode 3 operate as low-quality element (Q-element) modes with wide frequency bandwidth coverage. Specifically, in one embodiment, the frequency response of the second mode is selected based on the conductive grounding element 530, the first grounding spring clip 620, and the second spring clip 640. Specifically, in one embodiment, the frequency response of the third mode is selected based on the conductive feed trace 580, the third grounding spring clip 670, and the feed trace signal clip that electrically connects the RFIC to the feed trace signal clip 660.

[0073] Figure 7 The frequency response of three modes of wireless communication for electronic glasses according to one embodiment is shown. That is, Figure 7 The text shows the output of a document. Figure 6 The modular antenna structure features three operating modes. In the first mode, the channel frequency response is concentrated at approximately 2.5 GHz, with a bandwidth of approximately 500 MHz. In the second mode, the channel frequency response is concentrated at approximately 5.1 GHz, with a bandwidth of approximately 500 MHz. In the third mode, the channel frequency response is concentrated at approximately 5.7 GHz, with a bandwidth of approximately 500 MHz.

[0074] Figure 8 A spring clip 810 according to one embodiment is shown. When the modular antenna structure is mounted onto a PCB, the spring clip 810 has an initial shape 830 before deformation. That is, as previously described, the PCB is inserted into a mechanical slot in the antenna carrier of the modular antenna structure. When the PCB is inserted into the mechanical slot, a deformation force 820 applied to the spring clip 810 deforms the spring clip 810, giving it a deformed shape 832. In other words, after the modular antenna is mounted onto the PCB, the end of the spring clip 810 deforms. This deformation increases the contact area between the conductive pads on the antenna carrier and the spring clip, ensuring good conductivity.

[0075] Figure 9 A flowchart illustrating the steps of a method for assembling a modular antenna structure for electronic glasses according to an embodiment is shown. The first step 910 includes forming mechanical holes and alignment features on a PCB including a controller and an RFIC. The second step 920 includes soldering a plurality of spring clips to both the top (first) surface and the bottom (second) surface of the PCB prior to assembly. The third step 930 includes inserting the PCB into a mechanical slot in the modular antenna structure, wherein the mechanical holes of the PCB lock with the ribs of the mechanical slot in the modular antenna structure to provide alignment of the plurality of spring clips of the PCB with the conductive pads of the modular antenna structure, wherein the ends of the plurality of spring clips deform as the PCB is inserted along the mechanical slot to ensure force balance on the PCB. The fourth step 940 includes setting the PCB and the modular antenna structure within curved temple arms of various shapes and SKU sizes of electronic glasses.

[0076] While the described embodiments include variations in the shape and size of the eyeglass housing from one pair of electronic glasses to another, and the dimensions and shape of the PCB and modular antenna structure are configured to be identical for variable, different shapes and sizes of eyeglass housings, at least some embodiments are not necessarily limited to satisfying these features. That is, more generally, for one embodiment, the modular eyeglass assembly includes an eyeglass housing, a printed circuit board, and a modular antenna structure. The eyeglass housing includes a front frame and a pair of temple arms. The printed circuit board (PCB) includes a controller and a wireless device, wherein the PCB extends along at least one of the pair of temple arms. The antenna structure is connected to the PCB to provide a wireless propagation path for the wireless device. The modular antenna structure also includes a conductive patch formed on a first surface of the modular antenna structure, conductive sidewalls extending through the modular antenna structure, a ground plane formed on a second surface of the modular antenna structure, and a feed trace located on the first surface and capacitively coupled to the PCB of a radio frequency integrated circuit (RFIC), wherein the conductive patch, conductive sidewalls, ground plane, and feed trace form a planar inverted-F antenna.

[0077] In at least some embodiments, the planar inverted-F antenna is connected to the ground plane of the PCB via two conductive clips, wherein these two conductive clips are configured to create a ground shield that reduces radiation to the head of the user of the modular glasses antenna assembly. In at least some embodiments, the planar inverted-F antenna is configured to generate an antenna pattern with a zero-radiation pattern in the direction of the user's head on the glasses housing. In at least some embodiments, the planar inverted-F antenna is terminated on a PCB with reactive capacitors.

[0078] Although specific embodiments have been described and shown, the embodiments are not limited to the specific form or arrangement of the components so described and shown. The described embodiments are defined only by the claims.

Claims

1. A modular glasses antenna assembly, comprising: Eyeglass housing, the eyeglass housing including a front frame and a pair of temple arms, wherein the physical size and shape of each temple arm can be selected from a variety of eyeglass component sizes and shapes; A printed circuit board (PCB) extending along at least one of a pair of temple arms, wherein the PCB has a fixed size to be adapted to be disposed within at least one of the pair of temple arms for each of a plurality of eyeglass component sizes and shapes; and A modular antenna structure, comprising a planar antenna, wherein the modular antenna structure is connected to the PCB to provide a wireless propagation path to an external wireless device for a wireless device, wherein the modular antenna structure has a fixed size to be adapted to be disposed together with the PCB within at least one of a pair of temple arms of each of a variety of eyeglass assembly sizes and shapes; The modular antenna structure includes an internal portion and an external portion, wherein the PCB is sandwiched between the internal portion and the external portion when the PCB is assembled within at least one of a pair of temple arms of each of the various eyeglass component sizes and shapes.

2. The assembly of claim 1, wherein, The PCB includes a planar structure, wherein the outer portion of the modular antenna structure includes a curved surface adapted to be disposed between the PCB and the curved surface of at least one of the pair of temple arms of each of the plurality of eyeglass assembly sizes and shapes.

3. The assembly of claim 2, wherein, The curved surface of the modular antenna structure corresponds to the inner surface of the at least one temple arm.

4. The assembly of any one of claims 1-3, wherein, The modular antenna structure includes an antenna carrier comprising a mechanical groove formed between the outer portion and the inner portion, wherein the mechanical groove is adapted to accommodate the PCB.

5. The assembly of claim 4, wherein, The mechanical slot forms a sandwich-type mechanical structure, wherein the width of the mechanical slot is designed to provide tilted mounting of the PCB together with spring clips located on both sides of the PCB.

6. The assembly of claim 4, wherein, The mechanical slot formed between the outer portion and the inner portion of the modular antenna structure includes ribs that are operated to hook the PCB when the PCB is received into the mechanical slot.

7. The assembly of any one of claims 1-3, wherein, The modular antenna structure forms a planar inverted-F antenna, which is configured to generate an antenna pattern with zero radiation in the direction of the user's head on the eyeglass housing.

8. The component according to claim 7, wherein, The planar inverted-F antenna is connected to the PCB with a reactive capacitor.

9. The component according to claim 7, wherein, The modular antenna structure further includes a conductive patch formed on a first surface of the modular antenna structure, a conductive sidewall extending through the modular antenna structure, a conductive grounding element formed on a second surface of the modular antenna structure, and a feed trace located on the first surface and capacitively coupled to the PCB of a radio frequency integrated circuit (RFIC), wherein the conductive patch, the conductive sidewall, the conductive grounding element, and the feed trace form the planar inverted-F antenna.

10. The component of claim 9, wherein, The conductive patch includes an L-shaped cutout, which allows for a reduction in the size of the conductive patch, thereby allowing for a reduction in the size of the planar inverted-F antenna.

11. The component of claim 9, wherein, The planar inverted-F antenna is connected to the ground plane of the PCB via two conductive clips, wherein the two conductive clips create a ground shield that reduces radiation to the head of the user of the modular glasses antenna assembly.

12. The component of claim 9, further comprising a conductive tuning clip operable to electrically connect the radio device to the modular antenna structure, wherein, The tuning clip tunes the lower frequency band of the electromagnetic signal radiated from the planar inverted-F antenna.

13. The component of claim 12, wherein, The planar inverted-F antenna operates to form at least three communication modes, wherein each of the three communication modes supports wireless communication via the planar inverted-F antenna.

14. The component of claim 13, wherein, The frequency response of the first mode is selected based on the conductive patch, the conductive grounding element, the tuning clip, a first grounding spring clip located between the PCB and the conductive grounding element near the tuning clip, and a second spring clip located between the PCB and the conductive grounding element near the feed trace signal clip.

15. The component of claim 14, wherein, The frequency response of the second mode is selected based on the conductive grounding element, the first grounding spring clip, and the second spring clip located on the second surface of the modular antenna structure.

16. The component of claim 14, wherein, The frequency response of the second mode is selected based on the conductive grounding element, the first grounding spring clip, the second spring clip, and the third grounding spring clip located on the second surface of the modular antenna structure.

17. The component of claim 14, wherein, The frequency response of the third mode is selected based on the feed trace, the feed trace signal clip, and the GND clip located on the first surface of the PCB.

18. The component of claim 13, wherein, The tuning clip terminates with a surface mount technology (SMT) component on the PCB.

19. The component of claim 18, wherein, The terminal surface mount technology components include inductors or capacitors.

20. The component of claim 4, wherein, The PCB also includes one or more mechanical holes for aligning the modular antenna structure with the PCB, wherein the mechanical holes lock with the ribs of the mechanical slots of the modular antenna structure, providing alignment of a plurality of spring clips of one of the PCB and the modular antenna structure with the conductive pads of the other of the PCB and the modular antenna structure.

21. The component of claim 20, wherein, Prior to assembly, the plurality of spring clips are soldered to both the top and bottom surfaces of the PCB, wherein, when assembled by inserting the PCB along the mechanical slots, the ends of the plurality of spring clips deform to ensure a balance of forces on the PCB.

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