Fast response temperature and humidity sensor

Abstract

A fast-response temperature and humidity sensor includes a humidity-sensitive material, a cylindrical frame disk, a temperature sensor, and an MCU with on-chip ROM. The frame disk has multiple deep-groove air channels evenly distributed around its perimeter. The frame disk has a socket for fixing the temperature sensor, which is electrically connected to the microcontroller. The temperature sensor measures the ambient temperature around the temperature and humidity sensor, and the MCU performs temperature correction on the humidity measurement value. The MCU's on-chip ROM stores a standard database containing multiple humidity-sensitive resistance (R)-humidity (H) curves of the fast-response temperature and humidity sensor at different temperatures (T). Based on the measured temperature value (T) and resistance value (R), the MCU looks up the corresponding humidity value (H) in the standard database.

Description

Technical Field

[0001] This invention relates to a humidity sensor chip, specifically a fast-response temperature and humidity sensor, which is a further improvement on the prior application CN202111504775.9. Background Technology

[0002] With the development of the times, industrial sectors such as scientific research, agriculture, HVAC, textiles, computer rooms, aerospace, and power increasingly need to use humidity sensors. The requirements for product quality are becoming more and more stringent, and the control of environmental temperature and humidity, as well as the monitoring and analysis of the moisture content of industrial materials, have become common technical requirements.

[0003] Studies have found that humidity sensors are not only sensitive to ambient humidity but also highly sensitive to temperature, with a temperature coefficient typically ranging from 0.2% to 0.8%RH / ℃. Furthermore, the temperature coefficient of some humidity sensors varies under different relative humidity levels. The operating temperature range of the humidity sensor is also an important parameter. Accuracy and long-term stability are also crucial. The accuracy of a humidity sensor should reach ±2% to ±5%RH; anything below this level is difficult to use as a measuring instrument. Achieving an accuracy of ±2% to ±3%RH is quite challenging. Typically, the characteristics given in industry data are measured at room temperature (20℃±10℃) and in clean gas. At different temperatures, humidity sensors often provide different ambient humidity values; the greater the temperature drift, the greater the deviation in the humidity measurement. Our prior application CN202111504775.9 does not solve the above-mentioned technical problems. The inventors have found that the technical solution of our prior application CN202111504775.9 is not suitable for humidity measurement in environments with large temperature variations, and the accuracy of humidity measurement needs improvement. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides a fast-response temperature and humidity sensor, which is a further improvement on the prior application CN202111504775.9. The purpose of the present invention is to provide a temperature coefficient calibrated, highly sensitive, and fast-response humidity sensor.

[0005] The technical solution is as follows: A fast-response temperature and humidity sensor includes a humidity-sensitive material and a frame disk, a temperature sensor, and an MCU (Micro Controller Unit) with on-chip ROM. The frame disk has multiple deep-groove air channels evenly distributed around its perimeter. The frame disk is made of a non-humidity-sensitive insulating material. The frame disk has a socket for fixing the temperature sensor, which is electrically connected to the MCU. The temperature sensor measures the ambient temperature of the temperature and humidity sensor, and the MCU performs temperature correction on the humidity measurement value. Metal circular plates are provided on the relatively parallel upper and lower surfaces of the frame disk, serving as the upper and lower electrodes of the temperature and humidity sensor, respectively. After the humidity-sensitive material is applied, it is electrically connected to the upper and lower electrodes. The resistivity of the humidity-sensitive material is sensitive to ambient humidity. The humidity-sensitive material located between the upper and lower electrodes constitutes a humidity-sensitive resistor, which is electrically connected to the MCU for resistance measurement.

[0006] As another implementation method, to simplify the manufacturing process, the winding method can be abandoned, and the humidity-sensitive material can be directly covered onto the frame disk, that is:

[0007] The humidity sensor includes a humidity-sensitive material and a skeleton disk; the skeleton disk has multiple "T"-shaped skeletons arranged radially and evenly around its circumference, and the humidity-sensitive material completely covers the multiple "T"-shaped skeletons. The space between each two adjacent "T"-shaped skeletons forms an airflow channel, which is used to shorten the moisture absorption response time and desiccation response time of the humidity-sensitive material.

[0008] The skeleton disk has an upper surface and a lower surface arranged relatively parallel to each other. The upper and lower surfaces of the skeleton disk are both made of conductive material, which serve as the upper and lower electrodes of the high-sensitivity humidity sensor, respectively. The part of the skeleton disk other than the upper and lower surfaces is made of non-humidity-sensitive insulating material. After the humidity-sensitive material is covered, it is led out and connected to the upper and lower electrodes, respectively. The resistivity of the humidity-sensitive material is sensitive to the ambient humidity. The humidity-sensitive material located between the upper and lower electrodes constitutes a humidity-sensitive resistor.

[0009] This invention is a further improvement upon prior application CN202111504775.9, and naturally possesses the advantages of CN202111504775.9: the deep-groove airflow channel allows the humidity-sensitive material to have more sufficient contact with the air, and accelerates the desorption of adsorbed water molecules in the humidity-sensitive material through the airflow channel. This can be used to shorten the moisture absorption response time and desiccation response time of the humidity-sensitive material, greatly improving the response speed of the humidity sensor. When the outer shell of the composite nanoparticles or composite nanowires comes into contact with water, it will expand, increasing the distance between the contacting composite nanoparticles or composite nanowires, thereby reducing the conductivity of the humidity-sensitive material. By using composite nanoparticles or composite nanowires, their specific surface area is increased, and the outer shell is fully exposed to the atmospheric environment, thereby improving its response speed and sensitivity, and increasing the desorption rate of water molecules.

[0010] Meanwhile, this invention also overcomes some shortcomings of the prior application CN202111504775.9, namely, by setting a temperature sensor in the fast-response temperature and humidity sensor, the temperature sensor is used to measure the ambient temperature where the temperature and humidity sensor is located, and the microcontroller unit (MCU) performs temperature compensation for the humidity measurement value, so that the fast-response temperature and humidity sensor has fast response characteristics, and the temperature stability and accuracy of humidity measurement are greatly improved, overcoming the disadvantage of humidity measurement value drift with temperature.

[0011] The inventors have now described in detail the working principle, technical solution, and technical effects of this invention. Any content not described in detail herein is prior art known to those skilled in the art. Attached Figure Description

[0012] Figure 1 The overall shape is a top view of a cylindrical skeleton disk after the winding is completed;

[0013] Figure 2 The overall shape is presented as a top view of a square columnar skeleton disk;

[0014] Figure 3 The overall shape is presented as a top view of a rectangular columnar skeleton disk.

[0015] In the diagram: 1 is the winding skeleton disc, 2 is the "T"-shaped winding skeleton, 3 is the humidity-sensitive winding material, and 4 is the fixing screw hole. Detailed Implementation

[0016] The technical solution of the present invention will be described in detail below with reference to examples.

[0017] A fast-response temperature and humidity sensor includes a humidity-sensitive material and a frame disk, a temperature sensor, and an MCU (Micro Controller Unit) with on-chip ROM. The frame disk has multiple deep-groove air channels evenly distributed around its perimeter and is made of a non-humidity-sensitive insulating material. Metal circular plates are disposed on the relatively parallel upper and lower surfaces of the frame disk, serving as the upper and lower electrodes of the temperature and humidity sensor, respectively. After the humidity-sensitive material is applied, it is electrically connected to the upper and lower electrodes. The humidity-sensitive material located between the upper and lower electrodes forms a humidity-sensitive resistor, which is electrically connected to the MCU for resistance measurement. A Microcontroller Unit (MCU), also known as a Single-Chip Microcomputer, is a chip-level computer that integrates a Central Processing Unit (CPU) with appropriately reduced frequency and specifications, and peripheral interfaces such as memory, timer, USB, A / D converter, UART, PLC, DMA, and even LCD driver circuitry onto a single chip.

[0018] The overall shape of the skeleton disk can be any one of cylindrical, square, or prismatic. Preferably, the cylindrical skeleton disk is cylindrical. Preferably, the circumference of the cylindrical skeleton disk is provided with multiple radially evenly distributed "T"-shaped skeletons. Preferably, the humidity-sensitive material completely covers the multiple "T"-shaped skeletons, and the space between each two adjacent "T"-shaped skeletons forms a deep groove-type airflow channel. The airflow channel is used to shorten the moisture absorption response time and desiccation response time of the humidity-sensitive material.

[0019] MCUs can be categorized into two types based on their memory type: those without on-chip ROM and those with on-chip ROM. For chips without on-chip ROM, an external EPROM is required for operation (a typical example is the 8031). Chips with on-chip ROM are further divided into on-chip EPROM type (a typical example is the 87C51), on-chip EEPROM type, mask on-chip ROM type (a typical example is the 8051), and on-chip FLASH type (a typical example is the 89C51), etc. Some companies also offer chips with on-chip one-time programmable ROM (OTP) (a typical example is the 97C51). More "user-friendly" MCU designs integrate both FLASH and EEPROM, both non-volatile memories.

[0020] In this invention, preferably, an MCU with on-chip ROM is used.

[0021] The frame plate is provided with a socket for fixing a temperature sensor. The temperature sensor is electrically connected to the microcontroller unit. The temperature sensor is used to measure the ambient temperature where the temperature and humidity sensor is located, and the MCU performs temperature correction on the humidity measurement value.

[0022] As an optional implementation, the MCU communicates with the temperature sensor via I / O. 2 C bus connection. I 2 The C bus occupies two MCU input / output lines, and communication between them is entirely software-based. The temperature sensor's address can be set via two address pins, allowing one I / O pin to be used for... 2 Up to eight such sensors can be connected simultaneously on the C-bus. In this solution, the 7-bit address of the sensor is set to 1001000. When the MCU needs to access the sensor, it first sends an 8-bit register pointer, and then sends the sensor's address (7-bit address, with the lower bit being the WR signal). The sensor has three registers available to the MCU; the 8-bit register pointer is used to determine which register the MCU should use. In this invention, one implementation involves the program continuously updating the sensor's configuration register, which causes the sensor to operate in single-step mode, measuring the temperature once per update.

[0023] In this invention, in order to achieve temperature correction of humidity measurement values ​​by the MCU, the on-chip ROM of the MCU stores a standard database. The standard database includes multiple humidity-sensitive resistance R-humidity H curves of the fast-response temperature and humidity sensor at different temperatures T, i.e., R(H). T Curves, each R(H) T The curve records the humidity-sensitive resistor R corresponding to different humidity values ​​H.

[0024] Preferably, the standard database includes multiple humidity-sensitive resistance R-humidity H curves of the fast-response temperature and humidity sensor at different temperatures T, with temperature intervals of 1℃, 0.5℃, 0.2℃, or 0.1℃, and humidity intervals of 1%RH, 0.5%RH, 0.2%RH, or 0.1%RH.

[0025] The MCU looks up the corresponding humidity value H in the standard database based on the measured temperature value T and resistance value R. Specifically, the MCU finds the value point in the standard database that is closest to the measured temperature value T and resistance value R, and outputs the humidity value H of the closest value point as the ambient humidity measurement value.

[0026] Clearly, the MCU looks up the corresponding humidity value H in a standard database based on the measured temperature value T and resistance value R. The smaller the temperature and humidity intervals in the standard database, the more accurate the output humidity value H. Those skilled in the art will readily understand that for the final measured environmental humidity value to have sufficient precision and accuracy, the temperature and humidity intervals in the standard database must be sufficiently small, and the R(H) interval in the standard database must be... T The more curves and the denser the data points, the easier it is to find a closer and more accurate humidity value.

[0027] Furthermore, those skilled in the art will readily recognize that to obtain sufficiently accurate and precise environmental humidity values, an MCU with a large enough ROM capacity should be selected. This may result in a smaller selection of MCU models and an increase in MCU prices.

[0028] Of course, to improve the flexibility of sensor manufacturing, the MCU with on-chip ROM can be replaced with an MCU without on-chip ROM and an external ROM, such as EPROM, EEPROM or FLASH.

[0029] In order to write a standard database into a ROM (such as EPROM, EEPROM, or FLASH), a pre-calibrated R(H) needs to be used. T Curve data is written to ROM via a series of instructions. As an example, using EEPROM, this section introduces a method for using EEPROM:

[0030] AVR-GCC includes built-in EEPROM read / write functions. The compilation, download, installation, and use of the AVR microcontroller development environment GCC are existing technologies well-known to those skilled in the art.

[0031] The header file `#include <sys / types.h>` must be included when using this feature. Some of the read / write functions are as follows:

[0032] #define eeprom_is_ready() bit_is_clear(EECR, EEWE) / / Check if the EEPROM is ready. OK returns 1 (returns the EEWE bit).

[0033] #define eeprom_busy_wait() do {} while (!eeprom_is_ready()) / / Wait for EEPROM operations to complete.

[0034] extern uint8_t eeprom_read_byte (const uint8_t *addr); / / Reads one byte (8 bits) of EEPROM data from the specified address.

[0035] extern uint16_t eeprom_read_word (const uint16_t *addr); / / Reads a 16-bit word of EEPROM data from the specified address.

[0036] extern void eeprom_read_block (void *buf, const void *addr, size_tn); / / Reads EEPROM data of a specified length starting at the specified address.

[0037] extern void eeprom_write_byte (uint8_t *addr, uint8_t val); / / Writes one byte (8 bits) of EEPROM data to the specified address.

[0038] extern void eeprom_write_word (uint16_t *addr, uint16_t val); / / Writes a 16-bit word of EEPROM data to the specified address.

[0039] Configuration commands are sent to the MCU (microcontroller) via serial port. Upon receiving the command, the MCU uses the function `write_EEPROM_config()` to store the corresponding configuration information in the EEPROM. During system initialization, the function `read_EEPROM_config()` retrieves the corresponding data from the EEPROM for system initialization.

[0040] The humidity-sensitive material is a humidity-sensitive winding material, which is wound on multiple "T"-shaped winding skeletons on a cylindrical skeleton disk. The space between every two adjacent "T"-shaped winding skeletons simultaneously forms a winding limiting groove and an air flow channel for the humidity-sensitive winding material. After the humidity-sensitive winding material is wound, there is still space left that facilitates air circulation, i.e., an air flow channel. The air flow channel is used to shorten the moisture absorption response time and desiccation response time of the humidity-sensitive winding material.

[0041] As one specific implementation method, see Figure 1A humidity sensor includes a humidity-sensitive winding material and a winding frame disk 1. The circumference of the winding frame disk 1 is provided with a plurality of radially evenly distributed "T"-shaped winding frames 2. The humidity-sensitive winding material is wound on the plurality of "T"-shaped winding frames 2. The space between each two adjacent "T"-shaped winding frames 2 simultaneously forms a winding limiting groove and an air flow channel. After the humidity-sensitive winding material 3 is wound, there is still space left that is conducive to air circulation, i.e., an air flow channel. The air flow channel is used to shorten the moisture absorption response time and dehumidification response time of the humidity-sensitive winding material.

[0042] The winding bobbin 1 has an upper surface and a lower surface arranged in parallel. The upper surface and the lower surface are respectively provided with an upper electrode and a lower electrode. After the humidity-sensitive winding material 3 is wound, it is led out and connected to the upper electrode and the lower electrode respectively. The upper electrode and the lower electrode are not shown in the figure. The resistivity of the humidity-sensitive winding material 3 is sensitive to the ambient humidity. The humidity-sensitive winding material 3 located between the upper electrode and the lower electrode constitutes a humidity-sensitive resistor.

[0043] Figure 2 The image shows a top view of the overall shape of the present invention, which is a square columnar skeleton disk, excluding the moisture-sensitive material. Figure 3 The image shows a top view of the overall shape of the present invention, which is a rectangular columnar skeleton disk, before the humidity-sensitive material is covered. Figure 3 The structure shown is compared to Figure 2 The structure within the sensor is more conducive to increasing the air contact area.

[0044] For humidity-sensitive materials, any other known materials with humidity-sensitive properties can be selected.

[0045] In a preferred embodiment, when the humidity-sensitive winding material 3 is led out and connected to the upper and lower electrodes respectively, it includes multiple lead-out taps;

[0046] Preferably, the humidity-sensitive winding material is coated with conductive paste on the upper and lower surfaces near the winding bobbin 1, and the conductive paste is used to lead out and connect to the upper and lower electrodes, respectively. It is worth noting that the winding bobbin is made of a non-humidity-sensitive insulating material.

[0047] After coating with conductive paste, a low-temperature drying and curing process should be performed.

[0048] In the above embodiments, the humidity-sensitive winding material is formed by covering the outer surface of a non-humidity-sensitive inner core with a humidity-sensitive material. The outer surface of the humidity-sensitive winding material is covered with a humidity-sensitive material.

[0049] In practice, the various inner cores can be immersed in a suspension of humidity-sensitive material, then removed and dried. The humidity-sensitive material adheres to the surface of the inner core, forming a humidity-sensitive winding material.

[0050] Preferably, the upper electrode and the lower electrode are two metal discs, and a fixing screw hole 4 is provided at the center of the disc for tightening and fixing the lead wire.

[0051] Preferably, the conductive paste is a carbon-based conductive paste or a metal powder paste;

[0052] Preferably, the carbon-based conductive paste is conductive carbon black, conductive graphite, carbon nanotubes, graphene, or a mixture of the above materials.

[0053] Preferably, the metal powder slurry is a mixture of metal powder, glass powder and synthetic resin, wherein the metal powder is silver powder, gold powder, copper powder, nickel powder or a mixture of gold and palladium.

[0054] As another approach, to simplify the manufacturing process, the winding method can be abandoned, and the humidity-sensitive material can be directly applied to the frame plate.

[0055] The conductive paste is a carbon-based conductive paste or a metal powder paste.

[0056] As a more preferred embodiment, in the above-described embodiments, the humidity-sensitive material is selected as follows:

[0057] The humidity-sensitive winding material or humidity-sensitive material is a core-shell structured composite nanoparticle or composite nanowire, which consists of a conductive core and a humidity-sensitive non-conductive shell.

[0058] Preferably, the conductive core of the composite nanoparticles or composite nanowires is any one of poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid), polyaniline, polypyrrole, or polythiophene with a diameter of tens to hundreds of nanometers, and the non-conductive outer shell of the composite nanoparticles or composite nanowires is humidity-sensitive poly(styrene sulfonic acid). When the poly(styrene sulfonic acid) of the outer shell of the composite nanoparticles or composite nanowires comes into contact with water, it will expand, increasing the distance between the contacting composite nanoparticles or composite nanowires, thereby reducing the conductivity of the humidity-sensitive material. By using composite nanoparticles or composite nanowires, their specific surface area is increased, and the outer shell is fully exposed to the atmospheric environment, thereby improving their response speed and sensitivity, and increasing the desorption rate of water molecules.

[0059] It should be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of the present invention. Throughout the accompanying drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding the present invention.

[0060] Furthermore, the shapes and dimensions of the components in the figures do not reflect actual size and proportion, but are only illustrative of embodiments of the present invention. Additionally, any reference signs placed between parentheses in the claims should not be construed as limiting the claims.

[0061] Unless expressly intended to the contrary, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to the desired characteristics obtained from the content of this invention. Specifically, all figures used in the specification and claims to indicate the content of components, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that there may be variations of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0062] Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0063] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0064] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0065] Similarly, it should be understood that, in order to simplify the invention and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this inventive approach should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single embodiment of the foregoing invention. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0066] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fast response temperature and humidity sensor, characterized by: The fast response type temperature and humidity sensor comprises humidity sensitive material and a skeleton disc, a temperature sensor, and a band piece in-rom type MCU; the skeleton disc is uniformly provided with a plurality of deep groove type air flow channels around; the skeleton disc is made of non-humidity sensitive type insulating material; The skeleton disc is provided with a jack for fixing the temperature sensor; the temperature sensor is electrically connected with the micro control unit; the temperature sensor is used for measuring the ambient temperature of the temperature and humidity sensor; and the temperature sensor is used for temperature correction of the humidity measurement value by the MCU; The opposite parallel upper surface and lower surface of the skeleton disc are provided with metal round plates as upper electrode and lower electrode of the temperature and humidity sensor respectively; after the humidity sensitive material is covered, the humidity sensitive material is electrically connected to the upper electrode and lower electrode respectively; the resistivity of the humidity sensitive material is sensitive to the ambient humidity; the humidity sensitive material between the upper electrode and lower electrode forms a humidity sensitive resistor; the humidity sensitive resistor is electrically connected to the MCU; and the measurement of the resistor is performed by the MCU; The MCU has a standard database stored in the on-chip ROM, which includes a plurality of humidity-sensitive resistance R-humidity H curves of the fast-response temperature and humidity sensor at different temperatures T, i.e. R(H) T Each R(H) T curve records the humidity-sensitive resistance R corresponding to different humidity values H; the periphery of the skeleton disc is provided with a plurality of "T" shaped skeletons uniformly distributed in a radial manner, the humidity-sensitive material completely covers the plurality of "T" shaped skeletons, and the space between every two adjacent "T" shaped skeletons forms a deep groove air flow channel, which is used for shortening the humidity absorption response time and the humidity desorption response time of the humidity-sensitive material. The humidity sensitive material is humidity sensitive winding material; the humidity sensitive winding material is wound on a plurality of "T" shaped winding skeletons of the cylindrical skeleton disc; the space between every two adjacent "T" shaped winding skeletons simultaneously forms a winding limiting groove and the humidity sensitive winding material air flow channel; and after the humidity sensitive winding material is wound, there is still space for air flow, i.e. the air flow channel.

2. The fast response temperature and humidity sensor according to claim 1, wherein: The band piece in-rom type MCU is selected from any one of the following: band piece in-rom one-time programmable ROM type MCU, band piece in-rom EPROM type MCU, band piece in-rom EEPROM type MCU, band piece in-rom mask ROM type MCU, band piece in-rom FLASH type MCU, and MCU integrated with FLASH and EEPROM.

3. The fast response temperature and humidity sensor according to any one of claims 1-2, wherein: The standard database comprises a plurality of humidity sensitive resistor R-humidity H curves of the fast response type temperature and humidity sensor at different temperatures T; the temperature interval is 1℃ or 0.5℃ or 0.2℃ or 0.1℃; and the humidity interval is 1%RH or 0.5%RH or 0.2%RH or 0.1%RH.

4. The fast response temperature and humidity sensor according to claim 2, wherein: The MCU looks up the standard database according to the measured temperature value T and resistance value R, and outputs the corresponding humidity value H; the smaller the temperature interval and humidity interval in the standard database, the more accurate the output corresponding humidity value H.

5. The fast response temperature and humidity sensor according to claim 4, wherein: The MCU looks up the standard database according to the measured temperature value T and resistance value R, and outputs the corresponding humidity value H; the smaller the temperature interval and humidity interval in the standard database, the more accurate the output corresponding humidity value H.

6. The fast response temperature and humidity sensor of claim 1, wherein: The overall shape of the skeleton disc is any one of cylindrical shape, square column shape, rectangular column shape, and prism shape.

7. The fast response temperature and humidity sensor according to claim 6, wherein: The overall shape of the skeleton disc is cylindrical shape.

8. The fast response temperature and humidity sensor according to claim 6, wherein: When the humidity sensitive winding material is connected to the upper electrode and lower electrode respectively, the humidity sensitive winding material comprises a plurality of lead-out taps; The humidity sensitive winding material is coated with conductive paste near the upper surface and lower surface of the cylindrical skeleton disc, and is connected to the upper electrode and lower electrode respectively through the conductive paste; The humidity-sensitive winding material is a non-humidity-sensitive inner core covered with a humidity-sensitive material on the outer surface; The edges of the upper and lower electrodes on the close winding frame disc are coated with conductive paste, so that the humidity-sensitive material is connected to the upper and lower electrodes respectively through the conductive paste, and a humidity-sensitive resistor is formed; The conductive paste is a carbon-based conductive paste or a metal powder paste; the carbon-based conductive paste is conductive carbon black, conductive graphite, carbon nanotube, graphene, or a mixed paste of the above materials; the metal powder paste is a mixture of metal powder, glass powder and synthetic resin, and the metal powder is silver powder, gold powder, copper powder, nickel powder or gold-palladium mixed powder.

9. The fast response temperature and humidity sensor according to claim 8, wherein: The humidity-sensitive winding material or humidity-sensitive material is a core-shell structure composite nanoparticle or composite nanowire; The core-shell structure composite nanoparticle or composite nanowire is composed of a conductive inner core and a non-conductive shell sensitive to humidity; The non-conductive shell of the composite nanoparticle or composite nanowire is a humidity-sensitive material, which will swell after absorbing water molecules, so that the distance between the composite nanoparticles or composite nanowires in contact with each other increases, thereby reducing the conductivity of the humidity-sensitive material.

10. The fast response temperature and humidity sensor of claim 1, wherein: the temperature sensing element is a thermistor; and the humidity sensing element is a humidity sensor. The on-chip ROM type MCU is replaced with an off-chip ROM type MCU, and an external EPROM or EEPROM or FLASH is connected.

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