A photoelectric hybrid device based on glass waveguide and its manufacturing method

Abstract

The present invention discloses a glass waveguide-based optoelectronic hybrid device and a manufacturing method thereof, comprising: a first organic substrate, a glass substrate, and an optoelectronic chip; a glass waveguide and an electrical interconnection structure connecting the upper and lower surfaces of the glass substrate are provided on the inner side of the upper surface of the glass substrate; the optoelectronic chip is mounted on the outer side of the upper surface of the glass substrate, an electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure, and the optical connection port of the optoelectronic chip is arranged opposite the first end of the glass waveguide so that light passing through the first end enters the optical connection port; the lower surface of the glass substrate is connected to the first organic substrate and is connected to a first conductive circuit provided in the first organic substrate via the electrical interconnection structure, so that the first conductive circuit is connected to the electrical connection port of the optoelectronic chip; the coupling degree of the optical path and the light transmission efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of component packaging, and in particular to an optoelectronic hybrid device based on a glass waveguide and a manufacturing method thereof. Background Art

[0002] With the rapid growth of traffic within data centers, switch capacity, port density, and interface speed will also face severe challenges. Data center switch systems are also placing increasingly high demands on the performance indicators of optical modules, with data rate, transmission distance, power consumption, and volume becoming important considerations. Currently, traditional data center switch systems mainly use hot-swappable optical modules assembled on the edge of the printed circuit board (PCB). However, as communication frequency and bandwidth continue to increase, the long PCB trace distance between the switching chip on the switch motherboard and the optical module causes large transmission line losses, making the power consumption issue of the switch system a bottleneck restricting system performance improvement.

[0003] To address these issues, a common approach is to use glass as a supporting carrier, fabricating polymer waveguides, conductive circuits, and packaging related chips on a glass substrate to achieve optoelectronic integrated interconnection. However, although the manufacturing process of polymer waveguides is highly compatible with PCBs, they suffer from poor temperature stability, high transmission loss, and poor refractive index matching with optical fibers, resulting in high optical path coupling losses. Summary of the Invention

[0004] Based on this, it is necessary to provide an optoelectronic hybrid device based on glass waveguide and its manufacturing method to address the above technical problems, so as to solve the problem in the existing technology that the polymer waveguide has poor temperature stability, high transmission loss, and poor refractive index matching with the optical fiber, resulting in high optical path coupling loss when using polymer waveguide.

[0005] In a first aspect, the present invention provides an optoelectronic hybrid device based on a glass waveguide, comprising:

[0006] a first organic substrate, a glass substrate, and an optoelectronic chip;

[0007] A glass waveguide and an electrical interconnection structure connecting the upper surface and the lower surface of the glass substrate are provided on the inner side of the upper surface of the glass substrate;

[0008] The optoelectronic chip is mounted on the outer side of the upper surface of the glass substrate, the electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure, and the optical connection port of the optoelectronic chip is arranged to face the first end of the glass waveguide so that light passing through the first end enters the optical connection port;

[0009] The lower surface of the glass substrate is connected to the first organic substrate and is connected to a first conductive circuit disposed in the first organic substrate through the electrical interconnection structure, so that the first conductive circuit is connected to the electrical connection port of the optoelectronic chip.

[0010] The above solution has the following beneficial effects:

[0011] The glass waveguide-based optoelectronic hybrid device of the present invention comprises a glass substrate containing a glass waveguide disposed on an organic substrate containing an internal conductive circuit, forming an optoelectronic hybrid substrate. An optoelectronic chip disposed on the upper surface of the glass substrate transmits optical signals via the glass waveguide and transmits electrical signals via the conductive circuit, thereby achieving optoelectronic hybrid interconnection. The chemical stability of the glass waveguide and its good refractive index matching with the optical fiber are utilized to improve the coupling degree of the optical path and the light transmission efficiency.

[0012] Optionally, a reflective mirror with a preset angle is provided at the first end of the glass waveguide, and the reflective mirror is used to reflect light incident from the second end of the glass waveguide in a direction away from the upper surface of the first organic substrate to the optical connection port of the optoelectronic chip.

[0013] Optionally, the optoelectronic hybrid device further includes:

[0014] a second organic substrate, the second organic substrate being disposed on an upper surface of the first organic substrate, the second organic substrate being provided with a groove, the glass substrate being embedded in the groove;

[0015] a third organic substrate, the third organic substrate being disposed on an upper surface of the second organic substrate, the third organic substrate being provided with an optical through hole, one end of the optical through hole being connected to the second end, so that light reflected by the reflective mirror surface passes through the optical through hole to reach the optical connection port of the external optoelectronic chip.

[0016] Optionally, a second conductive circuit is provided in the third organic substrate, and the second conductive circuit is respectively connected to the electrical interconnection structure and the electrical connection port of the external optoelectronic chip.

[0017] Optionally, the glass substrate is located inside the first organic substrate, and an upper surface of the glass substrate and an upper surface of the first organic substrate are in the same plane.

[0018] Optionally, the optoelectronic hybrid device further includes:

[0019] An optical connector, one end of which is connected to the second end of the glass waveguide, and the other end of which is used to connect to an external optical path.

[0020] Optionally, the optoelectronic hybrid device further includes:

[0021] A solder ball is located on the lower surface of the first organic substrate and is connected to the first conductive circuit.

[0022] In a second aspect, the present invention provides a method for manufacturing an optoelectronic hybrid device based on a glass waveguide, comprising:

[0023] Providing a first organic substrate, and fabricating a first conductive circuit on the first organic substrate;

[0024] Providing a glass substrate, fabricating a glass waveguide and an electrical interconnection through-hole connecting two sides of the glass substrate in an upper surface of the glass substrate, and fabricating an electrical interconnection structure in the electrical interconnection through-hole;

[0025] integrating the lower surface of the glass substrate onto the first organic substrate so that the first conductive circuit is connected to the electrical interconnection structure;

[0026] An optoelectronic chip is flipped on the upper surface of the glass substrate so that the optical connection port of the optoelectronic chip faces the first end of the glass waveguide, so that light passing through the first end enters the optical connection port, and the electrical connection port of the optoelectronic chip is connected to the first conductive circuit.

[0027] The above solution has the following beneficial effects:

[0028] The present invention discloses a method for manufacturing a glass waveguide-based optoelectronic hybrid device. The method comprises fabricating a conductive circuit inside an organic substrate, fabricating a glass waveguide on the surface of a glass substrate, integrating the glass substrate onto the upper surface of the organic substrate, and flip-chipping an optoelectronic chip on the upper surface of the glass substrate to achieve optoelectronic hybrid interconnection. The method utilizes the chemical stability of the glass waveguide and its good refractive index matching with the optical fiber to improve the coupling degree of the optical path and the light transmission efficiency.

[0029] Optionally, integrating the lower surface of the glass substrate onto the first organic substrate includes:

[0030] Providing a second organic substrate, and milling grooves at predetermined positions of the second organic substrate according to the size of the glass substrate;

[0031] Providing a third organic substrate, and fabricating a second conductive circuit and an optical through hole connecting two sides of the third organic substrate on the third organic substrate;

[0032] The second organic substrate is placed on the upper surface of the first organic substrate, the glass substrate is placed in the groove, and the third organic substrate is placed on the upper surface of the second organic substrate. The first organic substrate, the second organic substrate, the third organic substrate, and the glass substrate are integrated by lamination so that one end of the optical through hole is connected to the first end of the glass waveguide.

[0033] Optionally, integrating the lower surface of the glass substrate onto the first organic substrate includes:

[0034] milling grooves at preset positions on the upper surface of the first organic substrate according to the size of the glass substrate;

[0035] The glass substrate is fixed in the groove by gluing, so that the upper surface of the glass substrate and the upper surface of the first organic substrate are in the same plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] Figure 1 1 is a schematic structural diagram of a first glass waveguide-based optoelectronic hybrid device provided in one embodiment of the present invention;

[0038] Figure 2 1 is a schematic structural diagram of a second glass waveguide-based optoelectronic hybrid device provided in one embodiment of the present invention;

[0039] Figure 3 1 is a schematic structural diagram of a third glass waveguide-based optoelectronic hybrid device provided in one embodiment of the present invention;

[0040] Figure 4 This is a schematic flow chart of a method for manufacturing an optoelectronic hybrid device based on a glass waveguide provided in one embodiment of the present invention;

[0041] The symbols are explained as follows:

[0042] 100, first organic substrate; 110, first conductive circuit; 200, glass substrate; 210, glass waveguide; 211, reflective mirror; 220, electrical interconnect structure; 300, optoelectronic chip; 400, second organic substrate; 500, third organic substrate; 510, optical via; 520, second conductive circuit; 600, optical connector; 700, main control chip; 800, solder ball. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0044] It should be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to implement the embodiments and to illustrate the best mode of implementing the embodiments. After reading the following description in light of the accompanying drawings, those skilled in the art will understand the concepts of the present disclosure and will recognize applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of the present disclosure and the appended claims.

[0045] It should also be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of this disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0046] It should also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0047] It should also be understood that the terms "upper", "lower", "left", "right", "front", "back", "bottom", "middle", "center", "top", etc. may be used in this document to describe various elements, and the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, so these elements should not be restricted by these terms.

[0048] These terms are only used to distinguish one element from another. For example, a first element can be referred to as an "upper" element, and similarly, a second element can be referred to as an "upper" element based on the relative orientation of these elements without departing from the scope of the present disclosure.

[0049] It is further understood that the terms “comprises,” “includes,” “includes,” and / or “comprising” when used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that the terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0051] In one embodiment, a method is provided as follows Figure 1 The optoelectronic hybrid device based on glass waveguide shown includes: a first organic substrate 100, a glass substrate 200 and an optoelectronic chip 300; wherein, a glass waveguide 210 and an electrical interconnection structure 220 connecting the upper surface and the lower surface of the glass substrate 200 are provided on the inner side of the upper surface of the glass substrate 200.

[0052] In this embodiment, the optoelectronic chip 300 is mounted on the outer side of the upper surface of the glass substrate 200. The electrical connection port of the optoelectronic chip 300 is connected to the electrical interconnection structure 220. The optical connection port of the optoelectronic chip 300 is arranged to face the first end of the glass waveguide 210, so that light entering from the second end of the glass waveguide 210 enters the optical connection port of the optoelectronic chip 300 through the first end.

[0053] In this embodiment, the lower surface of the glass substrate 200 is connected to the first organic substrate 100, and is connected to the first conductive circuit 110 provided in the first organic substrate 100 through the electrical interconnection structure 200, so that the first conductive circuit 100 is connected to the electrical connection port of the optoelectronic chip 300, thereby realizing optoelectronic interconnection of the optoelectronic chip 300.

[0054] The glass waveguide-based optoelectronic hybrid device of this embodiment comprises a glass substrate containing a glass waveguide disposed on an organic substrate internally containing a first conductive circuit, forming an optoelectronic hybrid substrate. This allows an optoelectronic chip disposed on the upper surface of the glass substrate to transmit optical signals via the glass waveguide and electrical signals via the conductive circuit, thereby achieving optoelectronic hybrid interconnection of the optoelectronic chips. The chemical stability of the glass waveguide and its good refractive index matching with optical fibers are utilized to improve the coupling degree of the optical path and the light transmission efficiency.

[0055] In one embodiment, a method is provided as follows Figure 2 The optoelectronic hybrid device based on glass waveguide shown includes: a first organic substrate 100 , a glass substrate 200 , an optoelectronic chip 300 , a main control chip 700 , an optical connector 600 and solder balls 800 .

[0056] A groove is provided on the upper surface of the first organic substrate 100, and the glass substrate 200 is disposed in the groove. The upper surface of the glass substrate 200 is coplanar with the upper surface of the first organic substrate 100. A glass waveguide 210 and an electrical interconnection structure 220 connecting the upper and lower surfaces of the glass substrate 200 are provided on the inner side of the upper surface of the glass substrate 200, that is, on the shallow surface layer of the glass substrate 200.

[0057] In this embodiment, the optoelectronic chip 300 is mounted on the outer side of the upper surface of the glass substrate 200, the electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure 220, and the optical connection port of the optoelectronic chip 300 is arranged to face the first end of the glass waveguide 210, so that light entering from the second end of the glass waveguide 210 enters the optical connection port of the optoelectronic chip 300 through the first end; the main control chip 700 is mounted in the middle area of ​​the first organic substrate 100, and the optoelectronic chip 300 and the main control chip 700 are connected via the first conductive line 110 to realize electrical signal transmission between the optoelectronic chip 300 and the main control chip 700.

[0058] In this embodiment, the lower surface of the glass substrate 200 is connected to the first organic substrate 100, and is connected to the first conductive circuit 110 provided in the first organic substrate 100 through the electrical interconnection structure 200, so that the first conductive circuit 100 is connected to the electrical connection port of the optoelectronic chip 300, thereby realizing optoelectronic interconnection of the optoelectronic chip 300.

[0059] In this embodiment, an optical connector 600 is disposed at an edge of the first organic substrate 100. One end of the optical connector 600 is connected to the second end of the glass waveguide, and the other end of the optical connector 600 is connected to an external standard optical fiber, enabling a simple, low-loss connection between the glass waveguide and the external optical fiber to receive optical signals transmitted by external light.

[0060] A solder ball 800 is further provided on the lower surface of the first organic substrate 100 , wherein the solder ball 800 is connected to the first conductive circuit 110 in the first organic substrate 100 , and connection with external chips and circuits can be achieved through the solder ball 800 .

[0061] The optoelectronic hybrid device based on glass waveguide of this embodiment has the following characteristics:

[0062] (1) The optoelectronic chip transmits optical signals through glass waveguides and electrical signals through conductive lines, realizing optoelectronic hybrid interconnection of optoelectronic chips; the chemical stability of glass waveguides and their good refractive index matching with optical fibers are used to improve the coupling degree of the optical path and the light transmission efficiency;

[0063] (2) The glass substrate can be used as a reinforcement layer for the hybrid waveguide substrate, which improves the dimensional stability of the hybrid waveguide substrate and increases the reliability of the packaging structure.

[0064] (3) The glass substrate is embedded in the first organic substrate, so that the thickness of the optoelectronic hybrid substrate is reduced and the integration of the overall package is improved.

[0065] In one embodiment, a method is provided as follows Figure 3 The optoelectronic hybrid device based on glass waveguide shown includes: a first organic substrate 100 , a glass substrate 200 , an optoelectronic chip 300 , a second organic substrate 400 , a third organic substrate 500 , a main control chip 700 and an optical connector 600 .

[0066] A first conductive circuit 110 is provided in the first organic substrate 100, a second organic substrate 400 is provided on the upper surface of the first organic substrate 100, a groove is provided on the second organic substrate 400, and the glass substrate 200 is embedded in the groove of the second organic substrate 400. The thickness of the second organic substrate 400 is the same as that of the glass substrate 200, so that the upper surface of the glass substrate 200 and the upper surface of the second organic substrate 400 are in the same plane, and the lower surface of the glass substrate 200 and the lower surface of the second organic substrate 400 are in the same plane.

[0067] In this embodiment, an electrical interconnect structure 220 is disposed within the glass substrate 200 and is perpendicular to the glass substrate 200. One end of the electrical interconnect structure 220 is connected to the first conductive line 110. A glass waveguide 210 is disposed on the inner side of the upper surface of the glass substrate 200, i.e., on the shallow surface layer of the glass substrate 200. A reflective mirror 211 is disposed at a preset angle at one end of the glass waveguide 210, away from the edge of the glass substrate 200. The reflective mirror 211 is configured to reflect light incident from the other end in a direction away from the upper surface of the first organic substrate 100 toward the optical connection port of the optoelectronic chip 300 disposed thereon. As a preferred parameter, the inclination angle of the reflective mirror 211 can be set to 45° to reflect horizontally incident light into vertical light.

[0068] In this embodiment, the glass waveguide 210 can be manufactured by ion exchange, vapor deposition, radio frequency sputtering, sol-gel, etc., and a glass waveguide with a gradient refractive index manufactured by ion exchange is preferred; the inclined surface with a preset angle can be manufactured by wafer cutting, picosecond laser cutting, etc.; the reflective mirror 211 is formed of a metal material, which can be one of copper, silver, aluminum, nickel, etc., preferably copper or silver, and the thickness of the reflective mirror 211 is 10nm-5μm, preferably 100nm-1000nm.

[0069] The material of the glass substrate 200 can be Pyrex glass, BK-7 glass, quartz glass and fused silica glass. The thickness of the glass substrate 200 is 0.1 mm to 2 mm, preferably 0.5 mm to 1 mm. The glass waveguide 210 on the glass substrate 200 replaces the traditional polymer-based waveguide because the glass waveguide has lower cost, lower transmission loss, better chemical stability, and excellent high temperature resistance and aging resistance. The refractive index of glass is close to that of optical fiber, and the two are highly compatible, and can achieve efficient optical path coupling with optical fiber.

[0070] In this embodiment, the third organic substrate 500 is disposed on the upper surfaces of the second organic substrate 400 and the glass substrate 200. A second conductive circuit 520 and an optical via 510 are disposed within the third organic substrate 500. One end of the optical via 510 is connected to the end of the glass waveguide 210 having the reflective mirror 211, forming an optical path with the glass waveguide 210. Light incident from the second end of the glass waveguide 210 is reflected by the reflective mirror 211 into the optical via 510 and then enters the optical connection port of the optoelectronic chip 300, thereby achieving optical signal transmission.

[0071] The optoelectronic chip 300 and the main control chip 700 are flip-mounted on the upper surface of the third organic substrate 500. The optoelectronic chip 300 includes an optical connection port and an electrical connection port. The optical connection port is located above the optical through-hole 510 to receive light reflected from the reflective mirror. The electrical connection port is connected to the second conductive circuit 520 in the third organic substrate 500. At the same time, the second conductive circuit 520 is connected to the first conductive circuit 110 in the first organic substrate 100 via the electrical interconnect structure 220 in the glass substrate 200. The main control chip 700 is connected to the electrical connection port of the optoelectronic chip 300 via the second conductive circuit 520, thereby forming an optoelectronic interconnect structure.

[0072] In this embodiment, the number of optoelectronic chips 300 and the main control chip 700 can be set according to actual design requirements and are not limited here; the number of layers of the first conductive circuit 110 in the first organic substrate 100 and the number of layers of the second conductive circuit 520 in the third organic substrate 500 can also be set according to actual design requirements and are not limited here.

[0073] A plurality of solder balls 800 are further provided on the lower surface of the first organic substrate 100 . Each solder ball 800 is connected to the first conductive circuit 110 in the first organic substrate 100 . Connection with external chips and circuits can be achieved through the solder balls 800 .

[0074] In this embodiment, an optical connector 600 is disposed at an edge of the first organic substrate 100. One end of the optical connector 600 is connected to the second end of the glass waveguide, and the other end of the optical connector 600 is connected to an external standard optical fiber, enabling a simple, low-loss connection between the glass waveguide and the external optical fiber to receive optical signals transmitted by external light.

[0075] The optoelectronic hybrid device based on glass waveguide of this embodiment has the following characteristics:

[0076] (1) The optoelectronic chip transmits optical signals through glass waveguides and electrical signals through conductive lines, realizing optoelectronic hybrid interconnection of optoelectronic chips; the chemical stability of glass waveguides and their good refractive index matching with optical fibers are used to improve the coupling degree of the optical path and the light transmission efficiency;

[0077] (2) The glass substrate can be used as a reinforcement layer for the hybrid waveguide substrate, which improves the dimensional stability of the hybrid waveguide substrate and increases the reliability of the packaging structure.

[0078] (3) Setting a metal reflective mirror at the end of the glass waveguide away from the glass substrate can improve the reflection efficiency of light and increase the transmission power of the optical signal;

[0079] (4) Placing the glass substrate containing the glass waveguide between two organic substrates can increase the mechanical strength of the optoelectronic hybrid substrate and improve the overall stability and reliability of the packaging structure.

[0080] In one embodiment, a method is provided as follows Figure 4 The method for manufacturing an optoelectronic hybrid device based on a glass waveguide may include the following steps:

[0081] Step S100: providing a first organic substrate, and forming a first conductive circuit on the first organic substrate.

[0082] According to the design requirements, an organic substrate of a certain thickness is provided, and then a conductive circuit is made on the surface of the organic substrate according to the designed circuit pattern. The specific method of making the conductive circuit is the same as the method of making the conductive circuit in the printed circuit board manufacturing process, which will not be repeated here.

[0083] Step S200: providing a glass substrate, fabricating a glass waveguide and electrical interconnection through holes connecting two sides of the glass substrate in the upper surface of the glass substrate, and fabricating an electrical interconnection structure in the electrical interconnection through holes.

[0084] A glass substrate of a certain thickness is provided. The material of the glass substrate can be Pyrex glass, BK-7 glass, quartz glass and fused quartz glass. The thickness of the glass substrate is 0.1 mm-2 mm, preferably 0.5 mm-1 mm.

[0085] At a preset position on the glass substrate, the glass substrate is etched by wet etching to form an electrical interconnection through-hole that penetrates the glass substrate. The shape of the electrical interconnection through-hole is not limited and can be circular, square, or any other shape. The number of electrical interconnection through-holes is set according to actual packaging needs and is not limited here. As another embodiment, the electrical interconnection through-holes can also be made by laser and mechanical drilling methods.

[0086] A metal material is deposited on the sidewalls of the electrical interconnection through-hole using physical vapor deposition (PVD) or atomic layer deposition (ALD) to form a seed layer. Copper metal is then electroplated on the seed layer on the inner wall of the electrical interconnection through-hole and annealed to form an electrical interconnection structure within the electrical interconnection through-hole.

[0087] The glass waveguide can be produced by ion exchange, vapor deposition, radio frequency sputtering, sol-gel, etc., and the glass waveguide with a gradient refractive index produced by ion exchange is preferred; at the end of the glass waveguide away from the edge of the glass substrate, a bevel with a preset angle is produced by wafer cutting, picosecond laser cutting, etc., and the preset angle is preferably 45°, and then metal is deposited on the bevel to form a reflective mirror surface; the metal material can be one of copper, silver, aluminum, nickel, etc., preferably copper or silver, and the thickness of the reflective mirror surface 211 is 10nm-5μm, preferably 100nm-1000nm.

[0088] Step S300: integrating the lower surface of the glass substrate onto the first organic substrate so that the first conductive circuit is connected to the electrical interconnection structure.

[0089] In this embodiment, the lower surface of the glass substrate is integrated onto the first organic substrate in two ways. The first way is:

[0090] According to the size of the glass substrate, a groove is milled at a preset position on the upper surface of the first organic substrate; the glass substrate is fixed in the groove by ABF conductive adhesive so that the upper surface of the glass substrate and the upper surface of the first organic substrate are in the same plane.

[0091] The second method is:

[0092] A second organic substrate and a third organic substrate are provided, and then the three organic substrates are stacked. The three stacked organic substrates are drilled using a drilling system. The drilling is mainly used to produce positioning holes within the substrate and positioning holes at the edge of the substrate. The positioning holes within the substrate are mainly used for alignment with the glass substrate during lamination. The positioning holes at the edge of the substrate are mainly used for alignment when multiple organic substrates are pressed together, as well as for milling groove alignment on the second organic substrate. The glass substrate includes at least three positioning holes, which are used for alignment with the second organic substrate via pins.

[0093] According to the size of the glass substrate, the drilling system is used to mill grooves at preset positions of the second organic substrate, and the number of grooves is the same as the number of glass substrates; a second conductive circuit and optical through holes connecting the two sides of the third organic substrate are made on the third organic substrate.

[0094] A second organic substrate is placed on the upper surface of the first organic substrate, a glass substrate is placed in the groove, and a third organic substrate is placed on the upper surface of the second organic substrate. The first, second, third, and glass substrates are integrated by lamination so that one end of the optical through-hole is connected to the first end of the glass waveguide. During the lamination process, the organic substrates and the glass substrate are aligned using positioning holes produced by the drilling system. The glass substrate is bonded to the first and third organic substrates by at least one layer of high-transparency pure adhesive, where high transparency refers to a light transmittance greater than 85% at a communication wavelength.

[0095] As another embodiment, the optical through hole may not be formed first. The first organic substrate, the second organic substrate, the third organic substrate and the glass substrate may be pressed together first, and then an optical through hole may be formed on the upper surface of the third organic substrate at a position corresponding to the reflective mirror surface of the glass waveguide, so that the reflective mirror surface of the glass waveguide is exposed.

[0096] Step S400: flip-chipping the optoelectronic chip on the upper surface of the glass substrate, so that the optical connection port of the optoelectronic chip faces the first end of the glass waveguide, so that light passing through the first end enters the optical connection port, and the electrical connection port of the optoelectronic chip is connected to the first conductive circuit.

[0097] For the optoelectronic hybrid substrate manufactured using the first method in step S300, the upper surface of the glass substrate is connected to the glass substrate via anisotropic conductive adhesive (ABF), so that the optical connection port of the optoelectronic chip is aligned with the end of the glass waveguide away from the glass substrate, so that light can be transmitted to the optical connection port of the optoelectronic chip; and the electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure.

[0098] For the optoelectronic hybrid substrate manufactured using the second method in step S300, the upper surface of the third organic substrate is connected to the glass substrate via anisotropic conductive adhesive (ABF), so that the optical connection port of the optoelectronic chip is aligned with the optical through-hole, and light reflected by the glass waveguide through the reflective mirror can enter the optical connection port of the optoelectronic chip, realizing optical signal transmission; and the electrical connection port of the optoelectronic chip is connected to the second conductive circuit to realize electrical signal transmission.

[0099] Finally, the main control chip is flipped on the upper surface of the third organic substrate to connect the pad of the main control chip to the second conductive circuit; and solder balls are planted on the lower surface of the first organic substrate to connect the solder balls to the first conductive circuit.

[0100] The method for manufacturing the optoelectronic hybrid device based on glass waveguide of this embodiment has the following characteristics:

[0101] (1) Fabricate conductive circuits inside the organic substrate, fabricate glass waveguides on the surface of the glass substrate, integrate the glass substrate onto the upper surface of the organic substrate, and flip-chip the optoelectronic chip onto the upper surface of the glass substrate to achieve optoelectronic hybrid interconnection; utilize the chemical stability of the glass waveguide and its good refractive index matching with the optical fiber to improve the coupling degree of the optical path and the light transmission efficiency;

[0102] (2) The fixed holes in the board are made by the same set of drilling equipment. The hole positions of the glass substrate correspond to the hole positions of the organic substrate. This can prevent the glass substrate from shifting during lamination, thereby improving the relative position accuracy of the two.

[0103] (3) Using pure glue with high transparency to bond the smooth glass waveguide substrate and the organic substrate can achieve good bonding between the two. Pure glue has better adhesion, and its good transparency can ensure that the light loss of vertical reflection is small;

[0104] (4) The use of 45° mirror reflection makes the interconnection structure relatively simple, which can improve the assembly efficiency of the system and thus reduce costs;

[0105] (5) Using anisotropic conductive adhesive (ABF) to package optoelectronic chips through flip-chip packaging is beneficial to improving the link optical transmission efficiency.

[0106] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. An optoelectronic hybrid device based on a glass waveguide, characterized in that: include: a first organic substrate, a glass substrate, and an optoelectronic chip; A glass waveguide and an electrical interconnection structure connecting the upper surface and the lower surface of the glass substrate are provided on the inner side of the upper surface of the glass substrate; The optoelectronic chip is mounted on the outer side of the upper surface of the glass substrate, the electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure, and the optical connection port of the optoelectronic chip is arranged to face the first end of the glass waveguide so that light passing through the first end enters the optical connection port; The lower surface of the glass substrate is connected to the first organic substrate, and is connected to a first conductive circuit provided in the first organic substrate through the electrical interconnection structure, so that the first conductive circuit is connected to the electrical connection port of the optoelectronic chip; A reflective mirror with a preset angle is provided at the first end of the glass waveguide, and the reflective mirror is used to reflect the light incident from the second end of the glass waveguide in a direction away from the upper surface of the first organic substrate to the optical connection port of the optoelectronic chip; The optoelectronic hybrid device further comprises: a second organic substrate, the second organic substrate being disposed on an upper surface of the first organic substrate, the second organic substrate being provided with a groove, the glass substrate being embedded in the groove; a third organic substrate, the third organic substrate being arranged on the upper surface of the second organic substrate, the third organic substrate being provided with an optical through hole, one end of the optical through hole being connected to the second end, so that light reflected by the reflective mirror surface reaches the optical connection port of the optoelectronic chip through the optical through hole.

2. The optoelectronic hybrid device according to claim 1, characterized in that: A second conductive circuit is provided in the third organic substrate, and the second conductive circuit is respectively connected to the electrical interconnection structure and the electrical connection port of the optoelectronic chip.

3. The optoelectronic hybrid device according to claim 1, characterized in that: The glass substrate is located inside the first organic substrate, and an upper surface of the glass substrate and an upper surface of the first organic substrate are in the same plane.

4. The optoelectronic hybrid device according to claim 1, characterized in that: The optoelectronic hybrid device further comprises: An optical connector, one end of which is connected to the second end of the glass waveguide, and the other end of which is used to connect to an external optical path.

5. The optoelectronic hybrid device according to claim 1, characterized in that: The optoelectronic hybrid device further comprises: A solder ball is located on the lower surface of the first organic substrate and is connected to the first conductive circuit.

6. A method for manufacturing an optoelectronic hybrid device based on a glass waveguide, characterized in that: include: Providing a first organic substrate, and fabricating a first conductive circuit on the first organic substrate; Providing a glass substrate, fabricating a glass waveguide and an electrical interconnection through-hole connecting two sides of the glass substrate in an upper surface of the glass substrate, and fabricating an electrical interconnection structure in the electrical interconnection through-hole; integrating the lower surface of the glass substrate onto the first organic substrate so that the first conductive circuit is connected to the electrical interconnection structure; flip-mounting an optoelectronic chip on the upper surface of the glass substrate so that the optical connection port of the optoelectronic chip faces the first end of the glass waveguide, so that light passing through the first end enters the optical connection port, and the electrical connection port of the optoelectronic chip connects to the first conductive circuit; It is characterized in that the lower surface of the glass substrate is integrated on the first organic substrate, comprising: Providing a second organic substrate, and milling grooves at predetermined positions of the second organic substrate according to the size of the glass substrate; Providing a third organic substrate, and forming a second conductive circuit and an optical through hole connecting two sides of the third organic substrate on the third organic substrate; The second organic substrate is placed on the upper surface of the first organic substrate, the glass substrate is placed in the groove, and the third organic substrate is placed on the upper surface of the second organic substrate. The first organic substrate, the second organic substrate, the third organic substrate, and the glass substrate are integrated by lamination so that one end of the optical through hole is connected to the first end of the glass waveguide.

7. The method for manufacturing an optoelectronic hybrid device according to claim 6, wherein: Integrating the lower surface of the glass substrate onto the first organic substrate comprises: milling grooves at preset positions on the upper surface of the first organic substrate according to the size of the glass substrate; The glass substrate is fixed in the groove by gluing, so that the upper surface of the glass substrate and the upper surface of the first organic substrate are in the same plane.

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