A drying furnace transport device and its application

Abstract

The present invention discloses a drying furnace transport device and its application, wherein the drying furnace transport device comprises: a first transport surface and a second transport surface, the first transport surface and the second transport surface are arranged at an angle, the angle between the first transport surface and the second transport surface is ɑ, the first transport surface is connected to one side of a silicon wafer, and the second transport surface is connected to the other opposite side of the silicon wafer. The damage to the surface of the silicon wafer during transportation can be reduced, and the appearance and performance of the silicon wafer can be improved. The present invention is applied to the field of drying furnaces.

Description

Technical Field

[0001] The invention relates to the field of drying furnaces, and in particular to a drying furnace transportation device and application thereof. Background Art

[0002] In the photovoltaic cell manufacturing process, a drying furnace is required to dry and cool the silicon wafers after screen printing. During the operation of existing drying equipment, the silicon wafers are usually placed directly on the upper surface of the conveyor belt, and are in full surface contact with the conveyor belt. The silicon wafers are easily left with marks during transportation, affecting the appearance and performance of the silicon wafers. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a drying furnace transportation device, which can reduce the damage to the surface of silicon wafers during transportation and improve the appearance and performance of silicon wafers.

[0004] Two drying furnaces having the drying furnace transport device are also proposed.

[0005] A drying method using the drying furnace is also proposed.

[0006] According to the first aspect of the embodiment of the present invention, the drying furnace transportation device includes a first transportation surface and a second transportation surface, the first transportation surface and the second transportation surface are arranged at an angle, the angle between the first transportation surface and the second transportation surface is ɑ, the first transportation surface is connected to one side of the silicon wafer, and the second transportation surface is connected to the other opposite side of the silicon wafer.

[0007] The drying furnace transport device according to the first embodiment of the present invention has at least the following beneficial effects:

[0008] The two opposite sides of the silicon wafer are transported by the first transport surface and the second transport surface, so that only a small amount of the surface of the silicon wafer or no surface is in contact with the transport device, which effectively reduces the displacement of the silicon wafer surface during transportation, avoids scratches, makes the surface of the silicon wafer less susceptible to wear, avoids affecting the performance of the silicon wafer, and reduces the generation of defective products.

[0009] According to some embodiments of the present invention, if 0°<ɑ<180°, a "V"-shaped transport cavity is formed between the first transport surface and the second transport surface, and in the transport cavity, the first transport surface transports a side edge of the silicon wafer, and the second transport surface transports another opposite side edge of the silicon wafer.

[0010] According to some embodiments of the present invention, if ɑ=180°, the first transport surface is flush with the second transport surface and is spaced apart, the first transport surface transports part of the bottom surface on one side of the silicon wafer, and the second transport surface transports part of the bottom surface on the other opposite side of the silicon wafer.

[0011] According to some embodiments of the present invention, if 180°<ɑ<360°, the top edge of the first transport surface is flush with the top edge of the second transport surface and is spaced apart, and the top edge of the first transport surface and the top edge of the second transport surface together support the bottom surface of the silicon wafer.

[0012] According to some embodiments of the present invention, if ɑ=0°, the first transport surface and the second transport surface are opposite to each other and spaced apart, the first transport surface abuts against one side surface of the silicon wafer, and the second transport surface abuts against another opposite side surface of the silicon wafer.

[0013] According to some embodiments of the present invention, it includes a driving source, a first transport mechanism and a second transport mechanism which are separately arranged, the first transport mechanism is provided with the first transport surface, the second transport mechanism is provided with the second transport surface, the first transport mechanism and the second transport mechanism are both connected to the driving source by transmission, and transport synchronously under the drive of the driving source.

[0014] According to some embodiments of the present invention, the number of the driving source is one, and the driving source is transmission-connected to the first transport mechanism via an axial adjustment member, and is transmission-connected to the second transport mechanism via another axial adjustment member.

[0015] According to some embodiments of the present invention, it also includes a first angle adjustment member and a second angle adjustment member, the first angle adjustment member is connected to the first transport mechanism and can adjust the angle of the first transport mechanism relative to the horizontal plane, and the second angle adjustment member is connected to the second transport mechanism and can adjust the angle of the second transport mechanism relative to the horizontal plane.

[0016] According to some embodiments of the present invention, the first transport mechanism and the second transport mechanism are one of a drum conveyor, a belt conveyor or a plate conveyor.

[0017] According to some embodiments of the present invention, the first transport mechanism is a drum conveyor, and the second transport mechanism is a drum conveyor.

[0018] According to some embodiments of the present invention, the rollers of the first transport mechanism and the second transport mechanism are both made of a material that is resistant to cold or heat shock.

[0019] A drying furnace according to an embodiment of the second aspect of the present invention comprises:

[0020] The drying section is equipped with a drying device;

[0021] A cooling section, provided with a cooling device;

[0022] The transport device passes through the drying section and the cooling section in sequence, and is used to transport silicon wafers through the drying section and the cooling section in sequence. The transport device is the drying furnace transport device described in the embodiment of the first aspect of the present invention.

[0023] The drying furnace according to the embodiment of the second aspect of the present invention has at least the following beneficial effects: the silicon wafer surface is less worn due to transportation by the drying furnace transportation device, the silicon wafer has a more beautiful appearance and less impact on performance.

[0024] A drying furnace according to an embodiment of the third aspect of the present invention comprises:

[0025] The drying section is equipped with a drying device;

[0026] A drying and transporting device is arranged through the drying section and is capable of transporting silicon wafers for drying by the drying device;

[0027] A cooling section, provided with a cooling device;

[0028] The cooling transport device is arranged through the cooling section, and can receive the silicon wafers transported by the drying transport device and continue to transport them for cooling by the cooling device. The cooling transport device is the drying furnace transport device described in the embodiment of the first aspect of the present invention.

[0029] The drying furnace according to the third aspect of the present invention has at least the following beneficial effects: the drying and transporting device and the cooling and transporting device are separately arranged, and the drying and transporting device is only transported in the drying section, and its heat will be accumulated in the drying section, and will not be cooled by the cooling section after passing through the cooling section, so the heat utilization efficiency is higher, and the drying and transporting device is subject to a small amount of heat change, and will not pass through the drying section and the cooling section in sequence, causing sudden cooling and heating, so the material requirements are lower, and it will not be damaged due to the sudden cooling and heating environment during long-term use.

[0030] According to some embodiments of the present invention, the drying and transporting device is the drying furnace transporting device described in the embodiment of the first aspect of the present invention.

[0031] According to some embodiments of the present invention, the cooling device includes a lower cooling assembly, which is arranged along the transport direction of the cooling transport device and is located in the middle of the cooling transport device.

[0032] According to some embodiments of the present invention, the cooling transport device is a cold and heat shock resistant transport device.

[0033] According to the drying method of the fourth embodiment of the present invention, using the drying furnace described in the second embodiment of the present invention, the specific steps include:

[0034] The drying and transporting device and the cooling and transporting device are separately arranged, and the two are synchronously rotated and transported;

[0035] The silicon wafer is transported by the drying and transporting device through the drying section for drying;

[0036] After drying, the silicon wafers are transferred from the drying transport device to the cooling transport device, and are transported by the cooling transport device through a cooling section for cooling.

[0037] According to the drying method of the fourth aspect of the present invention, there are at least the following beneficial effects: the drying and transporting device and the cooling and transporting device rotate and transport synchronously to realize the synchronous transportation of silicon wafers, so that when the silicon wafers pass through the drying section and the cooling section, the transportation rhythm is consistent with their original transportation rhythm, and the transportation rhythm is not affected by the separately arranged drying and transporting device and the cooling and transporting device. The silicon wafers can be transported in an orderly manner. The separately arranged drying and transporting device and the cooling and transporting device can improve the utilization efficiency of thermal energy, are less prone to damage, and have lower equipment maintenance costs.

[0038] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0040] Figure 1 It is a structural schematic diagram of a drying furnace transportation device according to an embodiment of the present invention;

[0041] Figure 2 This is an exploded schematic diagram of a drying furnace transportation device according to an embodiment of the present invention;

[0042] Figure 3 A schematic diagram of the specific structure of a drum of a drying furnace transport device according to an embodiment of the present invention;

[0043] Figure 4 It is a structural schematic diagram of a drying furnace according to an embodiment of the third aspect of the present invention;

[0044] Figure 5 A schematic side view of a drying furnace according to a third embodiment of the present invention;

[0045] Figure 6 It is a schematic top view of a drying furnace according to an embodiment of the third aspect of the present invention.

[0046] Figure Number:

[0047] Drying furnace transport device 100; first transport surface 110; second transport surface 120; first transport mechanism 130; frame 131; roller 132; connecting member 133; gear 134; second transport mechanism 140; first angle adjustment member 150; second angle adjustment member 160;

[0048] Drying section 200; drying device 210;

[0049] Drying and transporting device 300;

[0050] Cooling section 400; cooling device 410; lower cooling assembly 411; upper box 412;

[0051] The transport device 500 is cooled. DETAILED DESCRIPTION

[0052] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0053] In the description of the present invention, it should be understood that descriptions involving orientation, such as orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0054] In the description of the present invention, "a number" refers to one or more than one, and "a plurality" refers to two or more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0055] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0056] It should be understood that in the related art, a drying furnace is usually provided with a drying section and a cooling section. After the silver paste on the surface of the silicon wafer is dried, it is cooled by the cooling section. The silicon wafer is usually transported by a pulley conveying structure. The bottom surface of the silicon wafer is directly placed on the upper surface of the conveyor belt of the pulley conveying structure. The transportation is achieved by the friction between the bottom surface of the silicon wafer and the conveyor belt. In the drying section, there is often airflow to heat the silicon wafer. The cooling section is also mostly cooled by air blowing. The silicon wafer is easy to be displaced on the conveyor belt, which leads to scratches on the surface of the silicon wafer due to friction. In order to smoothly transport the silicon wafer, the surface of the conveyor belt must maintain a certain roughness to maintain the existence of friction. Therefore, it is necessary to choose between the roughness of the conveyor belt surface and the degree of damage to the silicon wafer surface, which is difficult to achieve both. During the conveyor belt transportation process, scratches will always appear on the surface of the silicon wafer, affecting the appearance and performance of the silicon wafer. Wafers are called silicon wafers after cutting. Silicon wafers for solar cells are mostly rectangular.

[0057] Reference Figure 1 and Figure 2 As shown, the drying furnace transport device 100 includes a first transport surface 110 and a second transport surface 120. The first transport surface 110 and the second transport surface 120 are arranged at an angle. The angle between the first transport surface 110 and the second transport surface 120 is ɑ. The first transport surface 110 is connected to one side of the silicon wafer, and the second transport surface 120 is connected to the other opposite side of the silicon wafer.

[0058] It is worth understanding that by transporting the two opposite sides of the silicon wafer through the first transport surface 110 and the second transport surface 120, only a small amount of surface or no surface of the silicon wafer is in contact with the drying furnace transport device 100, which effectively reduces the displacement of the silicon wafer surface during transportation, avoids scratches, makes the surface of the silicon wafer less susceptible to wear, avoids affecting the performance of the silicon wafer, and reduces the production of defective products.

[0059] Specifically, the first transport surface 110 and the second transport surface 120 are arranged at an angle so that the first transport surface 110 is only connected to one side of the silicon wafer, and the second transport surface 120 is connected to the other opposite side of the silicon wafer. The first transport surface 110 and the second transport surface 120 together support the two opposite sides of the silicon wafer, and the transportation of the silicon wafer is achieved through the movement of the drying furnace transport device 100. During transportation, only the two opposite sides of the silicon wafer are respectively connected to the first transport surface 110 and the second transport surface 120 of the drying furnace transport device 100. The contact range between the silicon wafer and the drying furnace transport device 100 is smaller, scratches are not easily generated on the surface of the silicon wafer, and the transportation quality is higher.

[0060] Reference Figure 1 and Figure 2 As shown, if 0°<ɑ<180°, a “V”-shaped transport cavity is formed between the first transport surface 110 and the second transport surface 120. In the transport cavity, the first transport surface 110 transports the side of the silicon wafer, and the second transport surface 120 transports the other opposite side of the silicon wafer.

[0061] Among them, the "V"-shaped transport cavity can be that the first transport surface 110 and the second transport surface 120 are arranged at intervals, and the first transport surface 110 or its extended surface and the second transport surface 120 or its extended surface form a "V" shape, or the first transport surface 110 or its extended surface and the second transport surface 120 or its extended surface form a "Y" shape, and a "V"-shaped transport cavity is formed at the upper part of the "Y" shape.

[0062] It is worth understanding that when the silicon wafer is located in the "V"-shaped transport cavity, only one side of the silicon wafer is connected to the first transport surface 110, and the other opposite side of the silicon wafer is connected to the second transport surface 120, thereby realizing suspended transportation of the silicon wafer, and the surface of the silicon wafer is not in contact with the first transport surface 110 and the second transport surface 120, thereby avoiding scratches on the surface of the silicon wafer and making the surface of the silicon wafer less prone to wear.

[0063] In this embodiment, if ɑ=180°, the first transport surface 110 and the second transport surface 120 are flush and spaced apart, the first transport surface 110 transports part of the bottom surface on one side of the silicon wafer, and the second transport surface 120 transports part of the bottom surface on the other opposite side of the silicon wafer.

[0064] It is worth understanding that when the first transport surface 110 and the second transport surface 120 are arranged flush and spaced apart, the first transport surface 110 contacts part of the bottom surface of one side of the silicon wafer, and the second transport surface 120 contacts part of the bottom surface of the other opposite side of the silicon wafer. The bottom surface of the silicon wafer corresponding to the gap between the first transport surface 110 and the second transport surface 120 is suspended in the air, and the bottom surface of the suspended part of the silicon wafer will not be scratched due to friction, and only a small part of the bottom surface of the silicon wafer is worn. When designing the silicon wafer, wear areas can be reserved on both sides of the silicon wafer, and the wear areas correspond to the transport positions, thereby reducing the impact of the transport positions on both sides of the silicon wafer on the silicon wafer as a whole, and improving the performance of the silicon wafer.

[0065] In this embodiment, if 180°<ɑ<360°, the top edge of the first transport surface 110 is flush with the top edge of the second transport surface 120 and is spaced apart, and the top edge of the first transport surface 110 and the top edge of the second transport surface 120 together support the bottom surface of the silicon wafer.

[0066] It is worth understanding that the top edge of the first transport surface 110 and the top edge of the second transport surface 120 together bear the bottom surface of the silicon wafer to achieve transportation of the silicon wafer, while the bottom surface of the silicon wafer is only in line contact with the first transport surface 110 and the second transport surface 120, and its contact area is smaller, the area scratched on the bottom of the silicon wafer is smaller, and the surface of the other parts of the silicon wafer is not easy to wear. Similarly, when designing the silicon wafer, strip-shaped wear areas can be reserved on both sides of the silicon wafer, and the wear areas correspond to the transport positions, reducing the impact of the transport positions on both sides of the silicon wafer on the silicon wafer as a whole, and improving the performance of the silicon wafer.

[0067] In this embodiment, if ɑ=0°, the first transport surface 110 and the second transport surface 120 are opposite and spaced apart, the first transport surface 110 abuts against one side of the silicon wafer, and the second transport surface 120 abuts against the other opposite side of the silicon wafer.

[0068] It is worth understanding that the first transport surface 110 and the second transport surface 120 together clamp the two opposite sides of the silicon wafer to realize the transportation of the silicon wafer. Even if there are certain scratches on the side of the silicon wafer, it is not easy to affect the appearance and performance of the silicon wafer. Only certain scratches are generated on the side of the silicon wafer, and the lower surface of the silicon wafer is completely suspended, which effectively prevents the lower surface of the silicon wafer from being worn due to friction.

[0069] Specifically, the first transport surface 110 can be an elastic surface, and the second transport surface 120 can also be an elastic surface, which can be made of elastic materials that are easy to be concave, such as sponge, to apply appropriate clamping force to the silicon wafer to prevent the silicon wafer from being broken due to excessive clamping force.

[0070] It is worth understanding that ɑ=0° is equal to ɑ=360°.

[0071] Reference Figure 1 and Figure 2 As shown, the drying furnace transport device 100 includes a driving source, a separately arranged first transport mechanism 130 and a second transport mechanism 140, the first transport mechanism 130 is provided with a first transport surface 110, the second transport mechanism 140 is provided with a second transport surface 120, the first transport mechanism 130 and the second transport mechanism 140 are both connected to the driving source by transmission, and are transported synchronously under the drive of the driving source.

[0072] It is worth understanding that a space will be left between the separately arranged first transport mechanism 130 and the second transport mechanism 140 to avoid mutual interference between the two, and other devices can be arranged between the two, such as a drying device 210 or a cooling device 410, so as to increase the direct contact area between the silicon wafer and the drying device 210 or the direct contact area between the silicon wafer and the cooling device 410, thereby improving the drying effect or cooling effect of the silicon wafer and making silicon wafer processing more efficient.

[0073] As another embodiment, the drying furnace transport device 100 may also be an integral transport mechanism, in which the first transport surface 110 and the second transport surface 120 are integrally arranged. For example, a plurality of V-shaped wheels are connected to a driving source through a chain belt to achieve synchronous rotation, and the V-shaped grooves of the plurality of V-shaped wheels form the first transport surface 110 and the second transport surface 120 which are arranged at an angle, or a conveyor belt with two opposite sides tilted in the same direction, and the tilted parts on the two opposite sides of the conveyor belt form the first transport surface 110 and the second transport surface 120.

[0074] In this embodiment, the number of driving sources is one, and the driving source is transmission-connected to the first transport mechanism 130 via an axial adjustment member, and is transmission-connected to the second transport mechanism 140 via another axial adjustment member.

[0075] The axial adjustment member may be a universal coupling or a bevel gear 134 set, through which the direction of the output shaft of the driving source can be adjusted and its rotation speed and direction can be kept consistent, so as to achieve synchronous transportation of the first transport mechanism 130 and the second transport mechanism 140. The bevel gear 134 set is a pair of bevel gears 134 used in conjunction, and the bevel gear 134 itself is used to adjust the direction of the output shaft.

[0076] It is worth understanding that the first transport mechanism 130 and the second transport mechanism 140 are driven by the same driving source for transport, the first transport mechanism 130 and the second transport mechanism 140 are powered by the same power, can transport at the same rate, have a higher degree of synchronization, and can stably transport silicon wafers.

[0077] As another embodiment, the first transport mechanism 130 and the second transport mechanism 140 are separately provided, and the number of driving sources can be two, one driving source is connected to the first transport mechanism 130 by transmission, and the other driving source is connected to the second transport mechanism 140 by transmission, and the synchronous transportation of the first transport mechanism 130 and the second transport mechanism 140 can be achieved by controlling the two driving sources to operate at the same speed. However, it is actually difficult to control the two driving sources to operate at the same speed, and the different speeds of the driving sources can easily lead to different transportation speeds of the first transport mechanism 130 and the second transport mechanism 140, which in turn leads to the displacement or uneven force of the transported silicon wafers, making it difficult to transport the silicon wafers stably.

[0078] Reference Figure 1 , Figure 2 and Figure 3 As shown, in this embodiment, the drying furnace transportation device 100 also includes a first angle adjustment member 150 and a second angle adjustment member 160. The first angle adjustment member 150 is connected to the first transportation mechanism 130 and can adjust the angle of the first transportation mechanism 130 relative to the horizontal plane. The second angle adjustment member 160 is connected to the second transportation mechanism 140 and can adjust the angle of the second transportation mechanism 140 relative to the horizontal plane.

[0079] Specifically, the first transport mechanism 130 is provided with a rotating shaft along its transport direction, and the first angle adjustment member 150 is an adjustment plate. The adjustment plate is provided with an installation side, which is connected to the end side of the first transport mechanism 130 along the transport direction. The first transport mechanism 130 is provided with a protruding screw on this end side, and the adjustment plate is provided with an arc groove. The axis of the arc groove is coaxially arranged with the axis of the rotating shaft. The screw passes through the arc groove and extends out of the adjustment plate, and can be locked to the arc groove by a nut. When the nut is not locked, the first transport mechanism 130 rotates around the rotating shaft along the arc groove to adjust the angle of the first transport mechanism 130. When adjusted to the required angle, the locking nut fixes the first transport mechanism 130.

[0080] A circular arc scale is provided on the other side of the adjustment plate opposite to the installation side, so as to facilitate determination of the rotation angle of the first transport mechanism 130 .

[0081] The structure and installation method of the second angle adjustment member 160 are the same as those of the first angle adjustment member 150 , and will not be described in detail herein.

[0082] It is worth understanding that the first transport mechanism 130 is adjusted in angle through a first angle adjustment, and the second transport mechanism 140 is adjusted in angle through a second angle adjustment member 160, so as to facilitate adjusting the angle between the first transport mechanism 130 and the second transport mechanism 140, and the first transport mechanism 130 and the second transport mechanism 140 can be adjusted to a symmetrical setting. During transportation, the first transport mechanism 130 and the second transport mechanism 140 apply the same force direction to the silicon wafers, thereby avoiding uneven force on the silicon wafers and being more conducive to conveying the silicon wafers.

[0083] Furthermore, the distance between the first transport mechanism 130 and the second transport mechanism 140 can also be adjusted. By adjusting the angle and distance between the first transport mechanism 130 and the second transport mechanism 140, silicon wafers of different sizes can be accommodated, thereby improving the transportation effect of silicon wafers.

[0084] In this embodiment, the first transport mechanism 130 and the second transport mechanism 140 are one of a drum conveyor, a belt conveyor or a plate conveyor.

[0085] It is worth understanding that the specific structures of the first transport mechanism 130 and the second transport mechanism 140 are not affected by the transport structure thereof, but are only related to the angle between the first transport surface 110 of the first transport mechanism 130 and the second transport surface 120 of the second transport mechanism 140, and any of the above transport structures can be used to achieve transportation. The above transport structures are conventional settings in the art, and their specific structures will not be described in detail here.

[0086] Reference Figure 1 , Figure 2 and Figure 3As shown, in this embodiment, the first transport mechanism 130 is a drum conveyor, and the second transport mechanism 140 is a drum conveyor.

[0087] It is worth understanding that when the first transport mechanism 130 and the second transport mechanism 140 are both drum conveyors, the contact between the first transport mechanism 130 and the second transport mechanism 140 and the silicon wafer is point contact or line contact, and the contact area between the first transport mechanism 130 and the second transport mechanism 140 and the silicon wafer is further reduced, so that the area where the silicon wafers transported by the first transport mechanism 130 and the second transport mechanism 140 will produce wear is smaller, and the impact on the silicon wafers is smaller.

[0088] Specifically, when 0°<ɑ<180° and 180°<ɑ<360°, the first transport mechanism 130 and the second transport mechanism 140 are in point contact with the silicon wafer, and when ɑ=180° and ɑ=0°, the first transport mechanism 130 and the second transport mechanism 140 are in line contact with the silicon wafer.

[0089] Specifically, the specific structure of the first transport mechanism 130 includes: a frame 131 and a plurality of rollers 132 arranged in parallel along the transport direction, both ends of the rollers 132 are connected to the frame 131 through connectors 133, and the rollers 132 are rotatably connected to the connectors 133, one end of the roller 132 is provided with a gear 134, the axis of the gear 134 is colinearly arranged with the axis of the roller 132, all the gears 134 can be connected to the driving source through the same chain belt, the driving source can be a motor, the motor rotates to drive the chain belt to rotate, the chain belt drives all the gears 134 to rotate together, and all the gears 134 drive all the rollers 132 to rotate together, so as to realize the transport of the first transport mechanism 130. The structure of the second transport mechanism 140 is the same as that of the first transport mechanism 130, and will not be repeated here.

[0090] The frame 131 may be made of aluminum profile, which can effectively reduce the overall weight of the first transport mechanism 130 and facilitate adjustment of the angle between the first transport mechanism 130 and the horizontal plane.

[0091] In this embodiment, the rollers 132 of the first conveying mechanism 130 and the second conveying mechanism 140 are made of materials that are resistant to thermal shock.

[0092] The material resistant to thermal shock refers to a material that can withstand both the drying temperature of the drying section 200 in the drying furnace and the cooling temperature of the cooling section 400 and is not easily damaged by temperature differences, such as ceramics and stainless steel.

[0093] It is worth understanding that when the first transport mechanism 130 and the second transport mechanism 140 are used in the entire drying furnace or in the cooling section 400 of the drying furnace, the first transport mechanism 130 and the second transport mechanism 140 made of a material resistant to heat and heat shock are not easily deformed by heat or cold, and are not easily damaged after long-term use, and have a longer service life.

[0094] In this embodiment, a drying furnace according to the second aspect of the present invention includes:

[0095] The drying section 200 is provided with a drying device 210;

[0096] The cooling section 400 is provided with a cooling device 410;

[0097] The transport device passes through the drying section 200 and the cooling section 400 in sequence, and is used to transport silicon wafers through the drying section 200 and the cooling section 400 in sequence. The transport device is the drying furnace transport device 100 of the first embodiment of the present invention.

[0098] It is worth understanding that the transportation by the drying furnace transport device 100 reduces the wear on the surface of the silicon wafer, makes the appearance of the silicon wafer more beautiful, and reduces the impact on performance.

[0099] Reference Figure 4 , Figure 5 and Figure 6 As shown, a drying furnace according to an embodiment of the third aspect of the present invention comprises:

[0100] The drying section 200 is provided with a drying device 210;

[0101] The drying and transporting device 300 is arranged via the drying section 200 and is capable of transporting silicon wafers for drying by the drying device 210;

[0102] The cooling section 400 is provided with a cooling device 410;

[0103] The cooling transport device 500 is arranged via the cooling section 400, and can receive the silicon wafers transported by the drying transport device 300 and continue to transport them for cooling by the cooling device 410. The cooling transport device 500 is the drying furnace transport device 100 of the first embodiment of the present invention.

[0104] It should be understood that when the same transport device is used to pass through the drying section 200 and the cooling section 400, the transport device is heated in the drying section 200, and is cooled when passing through the cooling section 400. The transport device is repeatedly heated and cooled, and the extreme temperature difference that the transport device is subjected to is large. When the transport device is subjected to the shock of heat and cold for a long time, its material is prone to aging, becoming brittle, and its life is shortened, which is not conducive to long-term use. At the same time, when the cooled transport device enters the drying section 200, it will reabsorb the heat in the drying section 200, reducing the heating effect of the drying section 200. When the heated transport device enters the cooling section 400, it will dissipate heat together with the silicon wafer, reducing the cooling effect of the cooling section 400, and its energy utilization efficiency is low.

[0105] It is worth understanding that the drying and transporting device 300 and the cooling and transporting device 500 are separately arranged, and the drying and transporting device 300 is only transported in the drying section 200, and its heat will be accumulated in the drying section 200, and will not be cooled by the cooling section 400 after passing through the cooling section 400. The heat utilization efficiency is higher, and the drying and transporting device 300 is subjected to a small amount of cold and heat changes, and will not pass through the drying section 200 and the cooling section 400 in sequence, causing sudden cooling and heating, and has lower requirements on materials. It will not be damaged due to the sudden cooling and heating environment during long-term use.

[0106] Specifically, the drying and transporting device 300 and the cooling and transporting device 500 can be arranged adjacent to each other, so that the silicon wafers can be directly transferred from the drying and transporting device 300 to the cooling and transporting device 500, thereby realizing the transfer of the silicon wafers. Of course, after the transporting rhythm of the silicon wafers is selected, the drying and transporting device 300 and the cooling and transporting device 500 can also be separated by a long distance, and the silicon wafers on the drying and transporting device 300 can be received by the transfer device and transferred to the cooling and transporting device 500. The transfer device can be a robot.

[0107] In addition, a centering structure can be set on the drying and transporting device 300 so that the silicon wafer is always located at the central axis position of the drying and transporting device 300, which facilitates the alignment of the silicon wafer with the central axis of the cooling and transporting device 500 and the transfer of the silicon wafer from the drying and transporting device 300 to the cooling and transporting device 500.

[0108] In this embodiment, the drying and transporting device 300 is the drying furnace transporting device 100 of the first embodiment of the present invention.

[0109] It is worth understanding that using the drying furnace transport device 100 in the drying section 200 can also directly reduce the area of ​​silicon wafer surface wear in the drying section 200, so that the lower surface of the silicon wafer is not easily worn in the drying section 200.

[0110] Reference Figure 4 , Figure 5 and Figure 6As shown, the cooling device 410 includes a lower cooling assembly 411 , which is arranged along the transport direction of the cooling transport device 500 and is located in the middle of the cooling transport device 500 .

[0111] The cooling device 410 is mostly air-cooled, and the silicon wafer is cooled by blowing normal temperature or low temperature gas toward the silicon wafer. The lower cooling component 411 can blow normal temperature or low temperature airflow toward the lower surface of the silicon wafer.

[0112] It is worth understanding that when the first transport mechanism 130 and the second transport mechanism 140 are separately arranged, and the first transport surface 110 and the second transport surface 120 are spaced apart, the middle part of the lower surface of the silicon wafer is suspended in the air, and the lower surface of the silicon wafer will be easier to contact with the airflow of the lower cooling component 411 to achieve convective heat exchange, and the lower surface of the silicon wafer is blown by the airflow as a whole, and the heat dissipation is more uniform.

[0113] In addition, the silicon wafer may deflect to a certain extent during transportation, causing the silicon wafer to be transported at an angle. The cooling airflow blows the silicon wafer upward, and the airflow is evenly distributed on the surface of the silicon wafer. When the silicon wafer is tilted, the airflow exerts a greater force on the tilted part, which can play a certain correcting role, allowing the silicon wafer to be transformed from a tilted state to a horizontal state during transportation.

[0114] Specifically, the lower cooling assembly 411 may be a plurality of fans.

[0115] In addition, the cooling device 410 also includes an upper box body 412 , in which an exhaust assembly connected to the outside is provided. The exhaust assembly can extract the airflow after passing through the silicon wafer to form a complete air duct, thereby improving the cooling efficiency of the cooling device 410 .

[0116] In some specific embodiments of the present invention, the cooling transport device 500 is a cold and heat shock resistant transport device. The cold and heat shock resistant transport device means that the material of its conveying surface is a cold and heat shock resistant material, and its specific material can be ceramic or stainless steel.

[0117] It is worth understanding that when the cooling and transporting device 500 is used in the cooling section 400, it will come into contact with the silicon wafers that are still in a high temperature state after drying, and perform heat exchange, so that the cooling and transporting device 500 is heated up. At the same time, the cooling and transporting device 500 and the silicon wafers are cooled by the cooling device 410. The cooling and transporting device 500 is subjected to certain thermal shocks, and the temperature difference resistant transport mechanism can better withstand this cooling shock, is not easily deformed by thermal shocks, is not easily damaged by long-term use, and has a longer service life.

[0118] In this embodiment, the drying method according to the fourth aspect of the present invention uses the drying furnace according to the second aspect of the present invention, and the specific steps include:

[0119] The drying and transporting device 300 and the cooling and transporting device 500 are separately provided, and the two are synchronously rotated and transported;

[0120] The silicon wafer is transported by the drying transport device 300 through the drying section 200 for drying;

[0121] After drying, the silicon wafers are transferred from the drying transport device 300 to the cooling transport device 500 , and are transported by the cooling transport device 500 through the cooling section 400 for cooling.

[0122] It is worth understanding that the drying and transporting device 300 and the cooling and transporting device 500 rotate and transport synchronously to realize the synchronous transportation of silicon wafers, so that when the silicon wafers pass through the drying section 200 and the cooling section 400, the transportation rhythm is consistent with their original transportation rhythm, and the transportation rhythm is not affected by the separately arranged drying and transporting device 300 and the cooling and transporting device 500. The silicon wafers can be transported in an orderly manner. The separately arranged drying and transporting device 300 and the cooling and transporting device 500 can improve the thermal energy utilization efficiency, are less prone to damage, and have lower equipment maintenance costs.

[0123] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A drying furnace transport device, characterized in that: include: A first transport surface and a second transport surface, wherein the first transport surface and the second transport surface are arranged at an angle, the included angle between the first transport surface and the second transport surface is ɑ, the first transport surface is connected to one side of the silicon wafer, and the second transport surface is connected to the other opposite side of the silicon wafer; If ɑ=180°, the first transport surface is flush with the second transport surface and spaced apart, the first transport surface transports a portion of the bottom surface on one side of the silicon wafer, and the second transport surface transports a portion of the bottom surface on the other opposite side of the silicon wafer; If 180°<ɑ<360°, the top edge of the first transport surface is flush with the top edge of the second transport surface and is spaced apart, and the top edge of the first transport surface and the top edge of the second transport surface together support the bottom surface of the silicon wafer; If ɑ=0°, the first transport surface and the second transport surface are opposite to each other and spaced apart, the first transport surface abuts against one side surface of the silicon wafer, and the second transport surface abuts against another opposite side surface of the silicon wafer; A driving source, a first transport mechanism and a second transport mechanism which are separately arranged, wherein the first transport mechanism is provided with the first transport surface, and the second transport mechanism is provided with the second transport surface, and the first transport mechanism and the second transport mechanism are both transmission-connected with the driving source and transport synchronously under the drive of the driving source; A first angle adjusting member and a second angle adjusting member, wherein the first angle adjusting member is connected to the first transport mechanism and can adjust the angle of the first transport mechanism relative to the horizontal plane, and the second angle adjusting member is connected to the second transport mechanism and can adjust the angle of the second transport mechanism relative to the horizontal plane.

2. The drying furnace transport device according to claim 1, characterized in that: The number of the driving source is one, and the driving source is connected to the first transport mechanism through an axial adjustment member, and is connected to the second transport mechanism through another axial adjustment member.

3. The drying furnace transport device according to claim 1, characterized in that: The first transport mechanism and the second transport mechanism are one of a drum conveyor, a belt conveyor or a plate conveyor.

4. The drying furnace transport device according to claim 3, characterized in that: The first transport mechanism is a drum conveyor, and the second transport mechanism is a drum conveyor.

5. A drying furnace, characterized in that: include: The drying section is equipped with a drying device; A cooling section, provided with a cooling device; A transport device passes through the drying section and the cooling section in sequence, and is used to transport silicon wafers through the drying section and the cooling section in sequence. The transport device is the drying furnace transport device according to any one of claims 1 to 4.

6. A drying furnace, characterized in that: include: The drying section is equipped with a drying device; A drying and transporting device is arranged through the drying section and is capable of transporting silicon wafers for drying by the drying device; A cooling section, provided with a cooling device; A cooling transport device is arranged through the cooling section, and can receive the silicon wafers transported by the drying transport device and continue to transport them for cooling by the cooling device. The cooling transport device is the drying furnace transport device according to any one of claims 1 to 4.

7. The drying oven according to claim 6, characterized in that: The drying and transporting device is the drying furnace transporting device according to any one of claims 1 to 4.

8. The drying oven according to claim 6, characterized in that: The cooling device comprises a lower cooling assembly, which is arranged along the transport direction of the cooling transport device and is located in the middle of the cooling transport device.

9. The drying oven according to claim 6, characterized in that: The cooling transport device is a transport device resistant to cold and heat shocks.

10. A drying method, characterized in that: Using the drying furnace according to any one of claims 6 to 9, the specific steps include: The drying and transporting device and the cooling and transporting device are separately arranged, and the two are synchronously rotated and transported; The silicon wafer is transported by the drying and transporting device through the drying section for drying; After drying, the silicon wafers are transferred from the drying transport device to the cooling transport device, and are transported by the cooling transport device through a cooling section for cooling.

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