Anti-collision control method and system for TFT-LCD glass substrate packaging

By setting up an anti-collision detection device during the TFT-LCD glass substrate packaging process, the device monitors the extension and retraction of the suction cup and generates an anti-collision signal, thus solving the problem of inadequate anti-collision protection and achieving anti-collision monitoring and efficient wafer loading control.

CN116409490BActive Publication Date: 2025-11-18CHENGDU CHINA OPTOELECTRONICS TECH CO LTD +1
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Patent Information

Application Number
CN202310197355.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-03
Publication Date
2025-11-18
Estimated Expiration
2043-03-03

AI Technical Summary

Technical Problem

Existing technologies do not provide adequate impact protection during the packaging of TFT-LCD glass substrates, making robots and products susceptible to damage.

Method used

By installing an anti-collision detection device on the robot suction cup holder, the extension and retraction of the suction cup is monitored, an anti-collision signal is generated, and the operation of the robot suction cup holder is controlled according to the signal, including the low-speed release of the first film and the high-speed release of the remaining films, to ensure anti-collision monitoring.

Benefits of technology

It achieves anti-collision protection during the packaging process of TFT-LCD glass substrates, avoids damage to robots and products, and improves the efficiency of the wafer placement and packaging process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of anti-collision control method and system for TFT-LCD glass substrate packaging, the method comprises: setting the number of TFT-LCD glass substrate is placed;Control the chuck device arranged on the robot chuck rack to execute the first piece of TFT-LCD glass substrate is placed process;According to the anti-collision detection device arranged on the robot chuck rack, the first piece of TFT-LCD glass substrate is placed to carry out anti-collision monitoring;If anti-collision signal is received, the placing process of TFT-LCD glass substrate is suspended, and the robot chuck rack is controlled to return to the origin;If anti-collision signal is not received, the remaining placing process of TFT-LCD glass substrate is executed by the chuck device arranged on the chuck rack, until the package rack is full.This application realizes anti-collision monitoring in the packaging process of TFT-LCD glass substrate by anti-collision detection device, and executes control to subsequent remaining placing process by first piece of anti-collision monitoring, while realizing anti-collision monitoring, improve the efficiency of placing and packaging process.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of control, in particular to a kind of anti-collision control method and system for TFT-LCD glass substrate packaging. BACKGROUND

[0002] TFT-LCD glass substrate product packaging is often carried out by robot installation suction disc rack to take and put piece, generally, by setting robot offset and piece number, accurate put piece control can be completed, but, once piece number setting error, often cause great harm to glass and robot.

[0003] Industrial robot is often built-in moment of force detection function when designing, can be appropriately protected from collision by setting this parameter, but when applied to TFT-LCD glass substrate packaging, often cannot achieve the desired effect, even trigger moment of force abnormal alarm, also cause great harm to product and robot.Therefore, how to realize the anti-collision function in TFT-LCD glass substrate put piece packaging process is a technical problem to be solved urgently. SUMMARY

[0004] The main purpose of the present application is to provide a kind of anti-collision control method and system for TFT-LCD glass substrate packaging, to solve the technical problem that current TFT-LCD glass substrate automatic packaging process is not in place in anti-collision protection.

[0005] To achieve the above-mentioned purpose, the present application provides an anti-collision control method for TFT-LCD glass substrate packaging, the method comprises the following steps:

[0006] S1: set the number of TFT-LCD glass substrate put piece;

[0007] S2: control the suction disc device set on robot suction disc rack to execute the first piece put piece process of TFT-LCD glass substrate;

[0008] S3: according to the anti-collision detection device set on robot suction disc rack, the first piece put piece of TFT-LCD glass substrate is monitored;If anti-collision signal is received, execute step S4;If anti-collision signal is not received, execute step S5;

[0009] S4: pause TFT-LCD glass substrate put piece process, control robot suction disc rack to return to original point, and return to execute step S1;

[0010] S5: execute the remaining put piece process of TFT-LCD glass substrate by the suction disc device set on suction disc rack, until the full rack of packaging rack.

[0011] Optionally, the first TFT-LCD glass substrate placing process is performed by low speed placing control, and the remaining TFT-LCD glass substrate placing process is performed by high speed placing control.

[0012] Optionally, the suction cup device comprises a vacuum suction cup and a suction cup telescopic rod, and the suction cup device performs the picking and placing process of the TFT-LCD glass substrate according to the control instruction of the PLC.

[0013] Optionally, the anti-collision detection device comprises a sensor mounting plate and an optical fiber sensor, which is used to monitor the telescopic amount of the suction cup telescopic rod and send the monitored telescopic amount to the PLC.

[0014] Optionally, the sensor mounting plate is arranged on the robot suction cup frame, and the optical fiber sensor is arranged on the sensor mounting plate corresponding to the position of the suction cup telescopic rod.

[0015] Optionally, the PLC performs anti-collision monitoring according to the telescopic amount when receiving the telescopic amount, and generates an anti-collision signal when the telescopic amount is greater than a preset value.

[0016] In addition, in order to achieve the above purpose, the application also provides an anti-collision control system for TFT-LCD glass substrate packaging, which comprises:

[0017] A robot suction cup frame is provided with a suction cup device and an anti-collision detection device, the suction cup device performs the picking and placing process of the TFT-LCD glass substrate according to the control instruction of the PLC, and the anti-collision detection device performs anti-collision monitoring on the placing process of the TFT-LCD glass substrate and feeds back the anti-collision signal to the PLC.

[0018] A PLC is used to perform the anti-collision control method for TFT-LCD glass substrate packaging as described above.

[0019] The embodiment of the present application provides a kind of anti-collision control method and system for TFT-LCD glass substrate packaging, the method comprises: setting the number of TFT-LCD glass substrate sheet;Control the chuck device of robot chuck frame is set to carry out the first piece of TFT-LCD glass substrate sheet process;According to the anti-collision detection device of robot chuck frame set to TFT-LCD glass substrate first piece is monitored;If anti-collision signal is received, pause TFT-LCD glass substrate sheet process, control robot chuck frame returns to original point;If anti-collision signal is not received, the remaining TFT-LCD glass substrate sheet process is executed by the chuck device set to chuck frame, until the full rack of packaging rack.This application realizes anti-collision monitoring in TFT-LCD glass substrate packaging process by anti-collision detection device, and executes control to subsequent remaining sheet process by first piece anti-collision monitoring, while realizing anti-collision monitoring, improve the efficiency of sheet and packaging process. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 For the schematic diagram of the anti-collision control method for TFT-LCD glass substrate packaging of the present application;

[0021] Figure 2 For the schematic diagram of the robot chuck frame of the present application;

[0022] Figure 3 For the schematic diagram of the anti-collision detection sensor installation of the present application;

[0023] Figure 4 For the schematic diagram of the control flow of the present application;

[0024] Figure 5 For the signal monitoring ladder diagram (instruction table form) of the sensor of the present application;

[0025] Figure 6 For the schematic diagram of low speed and conventional speed control program of the present application;

[0026] Figure 7 For the schematic diagram of robot executing low speed sheet program of the present application;

[0027] Figure 8 For the schematic diagram of alarm program of the present application;

[0028] Figure 9 For the schematic diagram of robot pause processing program of the present application.

[0029] The implementation of the present application, functional characteristics and advantages will be further described with reference to the drawings. DETAILED DESCRIPTION

[0030] It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0031] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0032] The embodiment of the present application provides a collision prevention control method for TFT-LCD glass substrate packaging. Figure 1 , Figure 1 The embodiment of the present application provides a collision prevention control method for TFT-LCD glass substrate packaging.

[0033] In the embodiment, the collision prevention control method for TFT-LCD glass substrate packaging comprises the following steps.

[0034] S1: setting the number of TFT-LCD glass substrates to be placed;

[0035] S2: controlling the suction cup device arranged on the robot suction cup rack to perform the first TFT-LCD glass substrate placing process;

[0036] S3: monitoring the first TFT-LCD glass substrate placing according to the collision prevention detection device arranged on the robot suction cup rack; if a collision prevention signal is received, performing step S4; if no collision prevention signal is received, performing step S5;

[0037] S4: pausing the TFT-LCD glass substrate placing process, controlling the robot suction cup rack to return to the original position, and returning to perform step S1;

[0038] S5: performing the remaining TFT-LCD glass substrate placing process by the suction cup device arranged on the suction cup rack until the packaging rack is full.

[0039] In the preferred embodiment, the first TFT-LCD glass substrate placing process is performed by low-speed placing control, and the remaining TFT-LCD glass substrate placing process is performed by high-speed placing control.

[0040] In the preferred embodiment, the suction cup device comprises a vacuum suction cup and a suction cup telescopic rod, and the suction cup device performs the TFT-LCD glass substrate picking and placing process according to the control instruction of the PLC.

[0041] In the preferred embodiment, the collision prevention detection device comprises a sensor mounting plate and an optical fiber sensor, which is used for monitoring the telescopic amount of the suction cup telescopic rod and sending the monitored telescopic amount to the PLC.

[0042] In a preferred embodiment, the sensor mounting plate is arranged on a robot chuck rack, and the fiber sensor is arranged on the sensor mounting plate corresponding to the position of the chuck telescopic rod.

[0043] In a preferred embodiment, the PLC performs anti-collision monitoring according to the telescopic amount when receiving the telescopic amount; and when the telescopic amount is greater than a preset value, an anti-collision signal is generated.

[0044] The application also provides an embodiment of an anti-collision control system for TFT-LCD glass substrate packaging. Specifically, an anti-collision control system for TFT-LCD glass substrate packaging, the system comprises:

[0045] a robot chuck rack, the robot chuck rack is provided with a chuck device and an anti-collision detection device, the chuck device performs a picking and placing process of TFT-LCD glass substrates according to a control instruction of a PLC, and the anti-collision detection device performs anti-collision monitoring on the placing process of TFT-LCD glass substrates and feeds back an anti-collision signal to the PLC;

[0046] a PLC, the PLC is used to perform the anti-collision control method for TFT-LCD glass substrate packaging as described above.

[0047] In order to more clearly explain the application, a specific example of an anti-collision control system for TFT-LCD glass substrate packaging is provided below.

[0048] In this example, a detection sensor is installed below the robot chuck telescopic rod, the detection position of the sensor is adjustable, when the telescopic rod is compressed to a preset position, the sensor signal is connected, indicating that the robot has a collision phenomenon, since the communication between the machine and the PLC realizes signal intercommunication, the PLC can immediately respond and immediately pause the robot to avoid collision damage. The robot chuck rack is shown in Figure 2 , and the anti-collision detection sensor mounting details are shown in Figure 3 .

[0049] Since the collision generally occurs after the wrong setting of the number of pieces, in actual use, in order to ensure the beat, it is often only necessary to modify the number of pieces and then perform the first piece anti-collision monitoring, in order to achieve better protection effect, we can set two speeds for placing, that is, after modifying the number of pieces, the first piece is placed at a low speed, and if the anti-collision signal is not detected during low-speed placing, the normal packaging speed is restored from the second piece. If the anti-collision signal is connected during low-speed placing, it means that there is a risk of collision, the robot is immediately paused, the robot is manually returned to the original point, the number of pieces is reset and the packaging is started again, and the low-speed placing detection is performed again, if the low-speed placing is normal, the normal speed is used to package the full rack. The collision signal can be monitored in real time through the robot trapezoidal diagram, and the signal is shared to the PLC for processing. The control process is shown in Figure 4 .

[0050] For the detection of collision avoidance signals.

[0051] The sensor's signal monitoring ladder diagram (instruction list format) is as follows: Figure 5 Address #2041 corresponds to the robot's telescopic rod position detection signal, used for collision avoidance detection. It is transmitted to addresses #0010 and #3080 respectively. #0010 is used for general robot input signals and can be called in the user program. #3080 is used on the PLC side.

[0052] Signal processing.

[0053] (1) After the PLC detects the set number of discs, it starts the low-speed control program for the first disc. After one disc is normally played, the low-speed control is turned off, and the normal speed is restored. The low-speed and normal speed control programs are as follows: Figure 6 As shown.

[0054] (2) When the PLC's low-speed status signal Y11AE is turned on, it corresponds to the robot's IN87 being turned on, and the robot executes low-speed chip loading. The robot program (partial program) is as follows: Figure 7 Only C00005 and C00006 need to be set to the same target point, but at different speeds. When IN87 is turned on, C00005 is executed at low speed. The first chip runs normally at low speed, and then the second chip starts to execute C00006 at normal speed.

[0055] (3) The PLC-side signal corresponding to machine-side #3080 is X1248. When performing low-speed film feeding, if the compression of the telescopic rod is too large and reaches the sensor detection position, the sensor will activate, indicating a risk of collision. The PLC side processes this signal, triggering an alarm and pausing the robot to prevent continued operation from damaging the product and the robot. The alarm procedure is as follows: Figure 8 As shown, the robot pause procedure is as follows: Figure 9 As shown.

[0056] Through the above process, speed control was used to prevent collisions during the TFT-LCD packaging process, ensuring the packaging cycle time and protecting the product and robot from collision damage.

[0057] In this embodiment, a collision prevention control method and system for TFT-LCD glass substrate packaging is provided. The collision prevention detection device realizes collision prevention monitoring during the TFT-LCD glass substrate packaging process, and the subsequent remaining wafer placement process is controlled by the first wafer collision prevention monitoring. While realizing collision prevention monitoring, the efficiency of wafer placement and packaging processes is improved.

[0058] It is understood that in the description of this specification, references to terms such as "one embodiment," "another embodiment," "other embodiments," or "first embodiment to Nth embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0060] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0061] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0062] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for anti-collision control in the packaging of TFT-LCD glass substrates, characterized in that, The method includes the following steps: S1: Set the number of TFT-LCD glass substrates to be placed; S2: Control the suction cup device set on the robot suction cup frame to perform the first wafer placement process of TFT-LCD glass substrate; the first wafer placement process of TFT-LCD glass substrate is performed using low-speed wafer placement control; S3: Perform anti-collision monitoring on the first TFT-LCD glass substrate using the anti-collision detection device installed on the robot suction cup frame; if an anti-collision signal is received, proceed to step S4; if no anti-collision signal is received, proceed to step S5. The anti-collision detection device includes a sensor mounting plate and an optical fiber sensor, which are used to monitor the extension and retraction of the suction cup telescopic rod and send the monitored extension and retraction to the PLC. When the PLC receives the extension amount, it performs anti-collision monitoring based on the extension amount; wherein, when the extension amount is greater than a preset value, an anti-collision signal is generated. S4: Pause the TFT-LCD glass substrate placement process, control the robot suction cup holder to return to the origin, and return to execute step S1; S5: The remaining TFT-LCD glass substrate is placed using a suction cup device mounted on the suction cup holder until the packaging rack is full; the remaining TFT-LCD glass substrate placement process is performed using high-speed placement control.

2. The anti-collision control method for TFT-LCD glass substrate packaging as described in claim 1, characterized in that, The suction cup device includes a vacuum suction cup and a suction cup telescopic rod. The suction cup device executes the process of picking up and placing the TFT-LCD glass substrate according to the control instructions of the PLC.

3. The anti-collision control method for TFT-LCD glass substrate packaging as described in claim 1, characterized in that, The sensor mounting plate is mounted on the robot suction cup frame, and the fiber optic sensor is mounted on the sensor mounting plate corresponding to the position of the suction cup telescopic rod.

4. A collision avoidance control system for packaging TFT-LCD glass substrates, characterized in that, The system includes: The robot suction cup holder is equipped with a suction cup device and an anti-collision detection device. The suction cup device executes the process of picking up and placing TFT-LCD glass substrates according to the control instructions of the PLC. The anti-collision detection device monitors the anti-collision process of placing TFT-LCD glass substrates and feeds back the anti-collision signal to the PLC. The PLC is used to execute the anti-collision control method for TFT-LCD glass substrate packaging as described in any one of claims 1-3.

Citation Information

Patent Citations

  • A robot arm and robot for inciting somebody to action on glass substrate places packing frame

    CN205367100U

  • Method and apparatus of loading pallet with glass plate

    JP2007000940A