Compatible silicon die sorting equipment

Abstract

The application relates to a compatible silicon wafer sorting device, which comprises a silicon wafer feeding device, a silicon wafer conveying device and a silicon wafer detecting device; the silicon wafer feeding device provides silicon wafers to be sorted to the silicon wafer conveying device; the silicon wafer conveying device comprises at least two conveying mechanisms, each of which comprises at least four conveying belts; a group of conveying belts with a first supporting interval between the at least four conveying belts supports the conveying of whole silicon wafers; two groups of conveying belts with a second supporting interval support the conveying of half silicon wafers and / or whole silicon wafers in parallel; the silicon wafer detecting device is arranged along the conveying direction of the silicon wafer conveying device and detects the silicon wafers conveyed on the silicon wafer conveying device. By configuring four conveying belts and a conveying belt interval adjusting mechanism, the silicon wafer conveying device can compatibly convey whole silicon wafers, half silicon wafers and / or whole silicon wafers in parallel, and the sorting compatibility of half silicon wafers and whole silicon wafers is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to a silicon wafer production equipment in the field of photovoltaic manufacturing, in particular to a compatible silicon wafer sorting equipment. BACKGROUND

[0002] At present, the size specifications of silicon wafers are more and more, in addition to different specifications of whole silicon wafers, various specifications of half silicon wafers, three-quarter silicon wafers, quarter silicon wafers and other split silicon wafers are also more and more applied to the field of photovoltaic manufacturing.

[0003] At present, the silicon wafer sorting equipment is generally designed to be compatible with different specifications of whole silicon wafers, and the compatibility of half silicon wafers and whole silicon wafers of the same specification cannot be met, so it cannot adapt to the development of silicon wafer manufacturing technology. SUMMARY

[0004] The present application provides a compatible silicon wafer sorting equipment which can sort half silicon wafers and whole silicon wafers to solve the problem of poor compatibility of the existing silicon wafer sorting equipment.

[0005] The technical scheme of the present application is as follows: a compatible silicon wafer sorting equipment, comprising a silicon wafer feeding device, a silicon wafer conveying device and a silicon wafer detection device; wherein:

[0006] The silicon wafer feeding device is located at the front station of the silicon wafer conveying device, and is configured to provide the silicon wafer conveying device with silicon wafers to be sorted;

[0007] The silicon wafer conveying device comprises at least two conveying mechanisms, the at least two conveying mechanisms are arranged at intervals along the conveying direction of the silicon wafer conveying device, and the output end of the front conveying mechanism is connected with the input end of the rear conveying mechanism; each conveying mechanism comprises at least four conveying belts arranged in parallel at intervals, at least a first support interval and two parallel second support intervals are formed between the at least four conveying belts, so that a group of conveying belts forming the first support interval support conveying whole silicon wafers, and two groups of conveying belts forming the second support interval respectively support conveying half silicon wafers and / or whole silicon wafers in parallel;

[0008] The silicon wafer detection device is arranged along the conveying direction of the silicon wafer conveying device, and is configured to detect the silicon wafers conveyed on the silicon wafer conveying device.

[0009] By configuring four conveying belts, a group of conveying belts forming the first support interval support conveying whole silicon wafers, and two groups of conveying belts forming the second support interval respectively support conveying half silicon wafers and / or whole silicon wafers in parallel, the compatibility of sorting half silicon wafers and whole silicon wafers is realized.

[0010] Optionally, and corresponding to the conveying belt spacing adjustment mechanism, the conveying belt spacing adjustment mechanism is configured to adjust the spacing between the corresponding at least four conveying belts, so that at least four conveying belts form at least a first support spacing and two parallel second support spacings, and a group of conveying belts forming the first support spacing supports the conveying of the whole silicon wafer, and two groups of conveying belts forming the second support spacing respectively support the conveying of the parallel half silicon wafers and / or the whole silicon wafer.

[0011] By configuring the conveying belt spacing adjustment mechanism, the silicon wafer conveying device can be compatible with conveying different sizes of whole silicon wafers, parallel half silicon wafers, parallel whole silicon wafers, parallel half silicon wafers and whole silicon wafers, and realizes the sorting compatibility of different sizes of half silicon wafers and whole silicon wafers.

[0012] Optionally, the silicon wafer loading device comprises a carrier box and a suction disc assembly, and the carrier box is provided with a detachable baffle, which divides the carrying area in the carrier box into a first carrying area and a second carrying area, and the first carrying area and the second carrying area respectively independently carry the stacked half silicon wafers; when the detachable baffle is not installed in the carrier box, the carrying area in the carrier box carries the stacked whole silicon wafers; the suction disc assembly sucks the silicon wafers to be sorted from the carrier box and releases the silicon wafers to be sorted onto the silicon wafer conveying device.

[0013] By installing the detachable baffle in the carrier box, the carrier box carrying the whole silicon wafers is changed into a carrier box with two carrying areas and can independently carry the half silicon wafers, realizing the compatible storage of the whole silicon wafers and the half silicon wafers, which is simple in structure and low in cost.

[0014] Optionally, the silicon wafer loading device comprises a basket clamping device and a lifting module, and the basket clamping device is movably installed on the lifting module, and the lifting module controls the lifting of the basket clamping device to be connected with the silicon wafer conveying device.

[0015] The basket clamping device is used to clamp whole baskets and half baskets of different sizes, the whole basket has a first storage bin with one end open; the half basket has a second storage bin and a third storage bin with one end open, and the second storage bin and the third storage bin are arranged side by side.

[0016] The basket clamping device comprises a clamping part, and the clamping distance of the clamping part is adjustable, so that the basket clamping device can clamp the whole basket or the half basket by adjusting the clamping distance.

[0017] The whole silicon wafers are carried by the whole basket, two groups of half silicon wafers are carried by the half basket with two storage bins, and the basket clamping device with adjustable clamping distance is used to clamp the whole basket and the half basket, so as to realize the compatible loading of the whole silicon wafers and the half silicon wafers.

[0018] Optionally, the compatible wafer sorting device further comprises a wafer taking conveying device, the wafer taking conveying device is located between the wafer feeding device and the wafer conveying device, and the wafer taking conveying device comprises at least four stretchable conveying belts arranged in parallel and at intervals and a stretchable conveying belt spacing adjustment mechanism;

[0019] The stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the at least four stretchable conveying belts, so that the at least four stretchable conveying belts are docked with the first storage bin of the whole wafer basket, and the whole wafers in the first storage bin are taken out one by one.

[0020] Alternatively, the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the at least four stretchable conveying belts to form two groups of stretchable conveying belts that meet the spacing requirements of the half wafers, and the two groups of stretchable conveying belts are respectively docked with the second storage bin and the third storage bin of the half wafer basket, so that the half wafers in the second storage bin and the third storage bin are taken out synchronously one by one.

[0021] The stretchable conveying belts are configured to take wafers from the wafer feeding device, and the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the at least four stretchable conveying belts to achieve compatible taking of whole wafers and half wafers.

[0022] Optionally, the wafer taking conveying device comprises four stretchable conveying belts arranged in parallel and at intervals, and the four stretchable conveying belts are sequentially a first stretchable conveying belt, a second stretchable conveying belt, a third stretchable conveying belt and a fourth stretchable conveying belt.

[0023] When taking out whole wafers, the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first stretchable conveying belt and the fourth stretchable conveying belt, and at least two stretchable conveying belts are used to take out the whole wafers in the first storage bin one by one.

[0024] When taking out half wafers, the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first stretchable conveying belt and the second stretchable conveying belt and the spacing between the third stretchable conveying belt and the fourth stretchable conveying belt, so that the first stretchable conveying belt and the second stretchable conveying belt are respectively docked with the second storage bin, and the third stretchable conveying belt and the fourth stretchable conveying belt are respectively docked with the third storage bin, so that the half wafers in the second storage bin and the third storage bin are taken out synchronously one by one.

[0025] The stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the four stretchable conveying belts to achieve compatible taking of whole wafers and half wafers, which is simple in structure and convenient to adjust.

[0026] Optionally, each conveying mechanism comprises four conveying belts arranged in parallel and at intervals, and the four conveying belts are sequentially a first conveying belt, a second conveying belt, a third conveying belt and a fourth conveying belt.

[0027] When the conveying mechanism conveys the whole silicon wafer, the conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first conveying belt and the fourth conveying belt, and simultaneously convey the whole silicon wafer using the four conveying belts; or the conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first conveying belt and the fourth conveying belt, and lower the height of the second conveying belt and the third conveying belt, and jointly convey the whole silicon wafer using the first conveying belt and the fourth conveying belt.

[0028] When the conveying mechanism conveys the parallel half silicon wafers and / or whole silicon wafers, the conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first conveying belt and the second conveying belt, and the spacing between the third conveying belt and the fourth conveying belt, and respectively convey the half silicon wafers and / or whole silicon wafers in parallel using the first conveying belt and the second conveying belt, and the third conveying belt and the fourth conveying belt.

[0029] The compatible conveying of the whole silicon wafer and the half silicon wafer is realized by adjusting the spacing between the four telescopic conveying belts through the conveying belt spacing adjustment mechanism, which is simple in structure and convenient to adjust.

[0030] Optionally, the first conveying belt, the second conveying belt, the third conveying belt and the fourth conveying belt are driven by the first motor; or the first conveying belt and the second conveying belt are driven by the first motor, and the third conveying belt and the fourth conveying belt are driven by the second motor.

[0031] The first conveying belt, the second conveying belt, the third conveying belt and the fourth conveying belt are provided with suction holes.

[0032] The four conveying belts are driven by one motor, which can maintain the synchronization of the four conveying belts; the two motors respectively drive two of the four conveying belts, which can control the running speed of the two groups of conveying belts respectively, and increase the flexibility of control.

[0033] The first conveying belt, the second conveying belt, the third conveying belt and the fourth conveying belt are provided with suction holes, which can improve the stability of the silicon wafer conveying under the condition of high-speed conveying of the silicon wafer, especially when the half silicon wafer is conveyed at high speed, the width direction of the half silicon wafer is narrower, and the stability of the silicon wafer conveying can be improved.

[0034] Optionally, the silicon wafer detection device includes at least one of a size detection part, a thickness detection part, a hidden crack detection part, a dirt detection part and a hole detection part.

[0035] The silicon wafer detection device can select one detection item or multiple detection items according to the actual situation, and increase the adaptability of the sorting equipment.

[0036] Optionally, at least one of the inlet ends and the outlet ends of the first conveying belt and the second conveying belt is provided with a first sensing unit, and at least one of the inlet ends and the outlet ends of the third conveying belt and the fourth conveying belt is provided with a second sensing unit,

[0037] When the conveying mechanism conveys the half wafer, the first sensing unit senses the wafer at the location and transmits the sensing information to the host computer, and the second sensing unit senses the wafer at the location and transmits the sensing information to the host computer,

[0038] The host computer performs calculation and processing according to the sensing information transmitted by the first sensing unit and the second sensing unit, and judges whether the half wafer or the whole wafer conveyed by the first conveying belt and the second conveying belt and the half wafer or the whole wafer conveyed by the third conveying belt and the fourth conveying belt has a positional deviation during parallel conveying.

[0039] The positional information of the wafer is sensed by the sensing unit, so that the positional deviation during conveying can be processed in time, and the accuracy of wafer detection is improved.

[0040] Optionally, the compatible wafer sorting equipment further comprises an alarm device.

[0041] When the positional deviation exceeds a predetermined value, the host computer controls the alarm device to alarm.

[0042] When the positional deviation is less than the predetermined value, the host computer controls the shooting camera of the wafer detection device to adjust the line scanning number and / or adjust the image capturing range according to the positional deviation.

[0043] The alarm device is arranged to alarm the positional deviation of the wafer, when the positional deviation exceeds a predetermined value, the alarm device is triggered in time to prevent the half wafer during parallel conveying from being incompletely detected and the detection result from being unreliable; when the positional deviation is within the predetermined value, the shooting camera is controlled according to the current positional deviation, so that the shooting camera can adapt to the current positional deviation, and the same detection effect as that without the positional deviation can be achieved.

[0044] Optionally, the size detection part comprises a face array camera, and a shooting range of the face array camera is configured to cover two half wafers conveyed by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt respectively in parallel and having a positional deviation equal to a predetermined value.

[0045] The shooting range of the face array camera is configured to cover two half wafers conveyed by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt respectively in parallel and having a positional deviation equal to a predetermined value. The face array camera can meet the requirements of the shooting range of the whole wafer, two half wafers without positional deviation and two half wafers with positional deviation at the same time, and the compatibility of size detection for the half wafer and the whole wafer is maximized, and the detection accuracy is improved.

[0046] Optionally, the shooting range of the area array camera is configured to cover two whole silicon wafers conveyed by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt respectively in parallel and with a position deviation equal to a predetermined value.

[0047] The shooting range of the area array camera is configured to cover two whole silicon wafers conveyed by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt respectively in parallel and with a position deviation equal to a predetermined value. The area array camera can simultaneously meet the requirements of the shooting range of the whole silicon wafer, two whole silicon wafers conveyed in parallel without position deviation, two whole silicon wafers conveyed in parallel with position deviation, two half silicon wafers conveyed in parallel without position deviation, two half silicon wafers conveyed in parallel with position deviation, a half silicon wafer and a whole silicon wafer conveyed in parallel without position deviation, and a half silicon wafer and a whole silicon wafer conveyed in parallel with position deviation, thereby maximizing the compatibility of the size detection of the half silicon wafer and the whole silicon wafer and improving the detection accuracy.

[0048] Optionally, the thickness detection unit comprises a mounting stand and two sets of detection assemblies, the two sets of detection assemblies are mounted on the mounting stand, the mounting stand is provided with a conveying channel, the first conveying belt, the second conveying belt, the third conveying belt and the fourth conveying belt pass through the conveying channel, and the to-be-sorted silicon wafers conveyed by the first conveying belt, the second conveying belt, the third conveying belt and the fourth conveying belt pass through the conveying channel and are detected by the two sets of detection assemblies.

[0049] The width of the conveying channel is greater than the distance between the first conveying belt and the fourth conveying belt when the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt convey half silicon wafers in parallel.

[0050] The width of the conveying channel is controlled to be greater than the distance between the first conveying belt and the fourth conveying belt when the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt convey half silicon wafers in parallel, so that the whole silicon wafer and the two half silicon wafers conveyed in parallel can pass through the conveying channel to complete the thickness detection, thereby realizing the compatibility of the thickness detection unit for the half silicon wafer and the whole silicon wafer.

[0051] Optionally, the width of the conveying channel is greater than the distance between the first conveying belt and the fourth conveying belt when the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt convey whole silicon wafers in parallel.

[0052] The width of the conveying channel is controlled to be greater than the distance between the first conveying belt and the fourth conveying belt when the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt convey whole silicon wafers in parallel, so that the whole silicon wafer, the two whole silicon wafers conveyed in parallel, the whole silicon wafer and the half silicon wafer conveyed in parallel, and the two half silicon wafers conveyed in parallel can pass through the conveying channel to complete the thickness detection, thereby realizing better compatibility of the thickness detection unit for the half silicon wafer and the whole silicon wafer.

[0053] Optionally, the thickness detection unit further comprises a first distance adjusting mechanism, the first distance adjusting mechanism is connected to the two groups of detection assemblies respectively, and is used for adjusting the distance between the two groups of detection assemblies.

[0054] The two groups of detection assemblies detect the thickness of the whole silicon wafer conveyed by the conveying channel, or the two groups of detection assemblies detect the thickness of the half silicon wafer conveyed in parallel by the conveying channel.

[0055] The first distance adjusting mechanism is used for flexibly adjusting the distance between the two groups of detection assemblies, so that the thickness detection unit can meet the thickness detection requirements of the whole silicon wafer and the half silicon wafer.

[0056] Optionally, each group of detection assemblies comprises at least two detection units and a second distance adjusting mechanism, the second distance adjusting mechanism is connected to the two detection units respectively, and is used for adjusting the distance between the two detection units.

[0057] The second distance adjusting mechanism is used for further adjusting the distance between the two detection units in each group of detection assemblies, so as to further improve the compatibility. For example, when the whole silicon wafer with size A, the half silicon wafer with size A, the whole silicon wafer with size B and the half silicon wafer with size B need to be compatible, the distance between the detection units can be adjusted to realize the compatibility of the silicon wafers with size A and size B, because the silicon wafers with size A and size B have different requirements for the distance between the detection units.

[0058] Optionally, the crack detection unit, the contamination detection unit and the hole detection unit each comprise a strip-shaped light source and a line-scan camera, the extension direction of the strip-shaped light source is perpendicular to the conveying direction of the silicon wafer to be sorted, and the light irradiation surface of the strip-shaped light source is greater than the distance between the first conveying belt and the fourth conveying belt when the half silicon wafers are conveyed in parallel by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt.

[0059] The light irradiation surface of the strip-shaped light source is greater than the distance between the first conveying belt and the fourth conveying belt when the half silicon wafers are conveyed in parallel by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt, so that the strip-shaped light source can meet the lighting requirements of the whole silicon wafer and the two half silicon wafers conveyed in parallel, and the compatibility of the whole silicon wafer and the half silicon wafer in crack detection, contamination detection and hole detection is realized.

[0060] Optionally, the light irradiation surface of the strip-shaped light source is greater than the distance between the first conveying belt and the fourth conveying belt when the whole silicon wafer is conveyed in parallel by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt.

[0061] The light irradiation surface of the strip-shaped light source is set to be greater than the interval between the first conveying belt and the fourth conveying belt when the whole silicon wafer is conveyed by the first conveying belt and the second conveying belt and the third conveying belt and the fourth conveying belt in parallel, so that the strip-shaped light source can simultaneously meet the light irradiation requirements of the whole silicon wafer, two whole silicon wafers conveyed in parallel, the whole silicon wafer and the half silicon wafer conveyed in parallel, and two half silicon wafers conveyed in parallel, and the compatibility of the whole silicon wafer and the half silicon wafer in the hidden crack detection, the dirt detection, and the hole detection is realized.

[0062] Optionally, the compatible silicon wafer sorting device further comprises a defective wafer removing mechanism, which is arranged above the conveying mechanism or between the two conveying mechanisms, and is used for removing the defective wafer existing defects from the silicon wafer conveying device after being detected by the silicon wafer detection device.

[0063] The defective wafer is removed from the conveying device by arranging the defective wafer removing mechanism, which can avoid the invalid detection of the defective wafer and improve the sorting efficiency on the one hand, and if the defective wafer is not removed and continues to be conveyed, the device operation will be affected and the sorting efficiency will be reduced once the wafer is broken at a certain position.

[0064] Optionally, the defective wafer removing mechanism comprises a suction disc removing assembly, and the suction disc removing assembly comprises at least one removing suction disc and at least one first waste box, the removing suction disc is arranged above the conveying mechanism, and the first waste box is arranged at the side of the conveying mechanism.

[0065] The suction disc removing assembly is adopted to remove the defective wafer conveyed on the conveying mechanism, which is simple in structure and can conveniently compatible with the half silicon wafer and the whole silicon wafer.

[0066] Optionally, the defective wafer removing mechanism comprises a turnover removing assembly, and the turnover removing assembly is located between the two conveying mechanisms, the turnover removing assembly comprises at least four turnover conveying belts arranged in parallel and at intervals, a turnover conveying belt interval adjusting mechanism, and a second waste box, the first end and the last end of the at least four turnover conveying belts are respectively connected to the at least four conveying belts of the conveying mechanism in the front and the rear, and the at least four turnover conveying belts are turned downward with the first end as the fulcrum or turned upward with the last end as the fulcrum; the turnover conveying belt interval adjusting mechanism is used for adjusting the interval between the at least four turnover conveying belts; and the second waste box is arranged below the at least four turnover conveying belts and is used for receiving the defective wafer removed after the turnover conveying belt is turned over.

[0067] The turnover removing assembly is adopted, which can continuously remove the defective wafer when the defective wafer continuously appears, and will not affect the sorting efficiency of the sorting device due to the failure to remove in time.

[0068] Optionally, the defective wafer removing mechanism comprises a suction disc removing assembly and a turnover removing assembly,

[0069] The suction disc rejection assembly comprises at least one rejection suction disc arranged above the conveying mechanism and at least one first waste box arranged at the side of the conveying mechanism.

[0070] The turnover rejection assembly is arranged between the two conveying mechanisms, and comprises at least four parallel and spaced turnover conveying belts, a turnover conveying belt spacing adjustment mechanism and a second waste box. The first end and the last end of the at least four turnover conveying belts are respectively connected to the at least four conveying belts of the preceding and subsequent conveying mechanisms. The at least four turnover conveying belts are turned downward with the first end as the fulcrum or turned upward with the last end as the fulcrum. The turnover conveying belt spacing adjustment mechanism is used to adjust the spacing between the at least four turnover conveying belts. The second waste box is arranged below the at least four turnover conveying belts and is used to receive the defective pieces rejected after the turnover conveying belts are turned over.

[0071] The suction disc rejection assembly and the turnover rejection assembly are combined to reject the defective pieces. The corresponding rejection assembly can be flexibly selected according to whether the defective pieces are continuous, and the overall rejection efficiency is improved.

[0072] Optionally, the turnover rejection assembly comprises four parallel and spaced turnover conveying belts, which are sequentially a first turnover conveying belt, a second turnover conveying belt, a third turnover conveying belt and a fourth turnover conveying belt.

[0073] When the defective piece to be rejected is an integral silicon wafer, the turnover conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first turnover conveying belt and the fourth turnover conveying belt, and the four turnover conveying belts are used to turn over and reject the defective piece.

[0074] When the defective piece to be rejected is a parallel half-silicon wafer and / or an integral silicon wafer, the turnover conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first turnover conveying belt and the second turnover conveying belt and the spacing between the third turnover conveying belt and the fourth turnover conveying belt. The first turnover conveying belt and the second turnover conveying belt and the third turnover conveying belt and the fourth turnover conveying belt are used to turn over and reject the defective piece, respectively.

[0075] The spacing between the four turnover conveying belts is adjusted by the turnover conveying belt spacing adjustment mechanism, so that the rejection of the integral silicon wafer defective piece and the half-silicon wafer defective piece is realized.

[0076] Optionally, the first turnover conveying belt and the second turnover conveying belt are driven to turn over by a first driving part, and the third turnover conveying belt and the fourth turnover conveying belt are driven to turn over by a second driving part.

[0077] By dividing the four turnover conveying belts into two groups and driving them to turn over by two driving parts, one group of turnover conveying belts can be driven to turn over without affecting the normal operation of the other group of turnover conveying belts (not turning over, as conveying belts conveying silicon wafers backward).

[0078] Optionally, the feeding end of the wafer conveying device is provided with a dynamic clamping and sizing mechanism, which is configured to size the whole wafer or the half wafer.

[0079] The dynamic clamping and sizing mechanism is installed at the feeding end of the wafer conveying device to size the whole wafer or the half wafer, so that the whole wafer or the half wafer is aligned before entering the detection area, thereby improving the detection efficiency.

[0080] Optionally, the discharging end of the wafer conveying device is provided with a dynamic clamping and sizing mechanism, which is configured to size the whole wafer or the half wafer.

[0081] The dynamic clamping and sizing mechanism is installed at the discharging end of the wafer conveying device to size the whole wafer or the half wafer, so that the whole wafer or the half wafer is aligned before entering the detection area, thereby improving the detection efficiency.

[0082] Optionally, the feeding end of the wafer conveying device is provided with a dynamic clamping and sizing mechanism, which is configured to size the whole wafer or the half wafer.

[0083] The dynamic clamping and sizing mechanism is installed at the feeding end of the wafer conveying device to size the whole wafer or the half wafer, so that the whole wafer or the half wafer is aligned before entering the detection area, thereby improving the detection efficiency.

[0084] Optionally, the dynamic clamping and sizing mechanism includes four sets of sizing wheel groups and sizing wheel group spacing adjustment mechanisms,

[0085] The four sets of sizing wheel groups are a first sizing wheel group, a second sizing wheel group, a third sizing wheel group and a fourth sizing wheel group arranged in sequence and at intervals, the first sizing wheel group and the second sizing wheel group are installed on one sizing wheel group spacing adjustment mechanism, and the third sizing wheel group and the fourth sizing wheel group are installed on another sizing wheel group spacing adjustment mechanism.

[0086] When sizing the whole wafer, the two sizing wheel group spacing adjustment mechanisms are configured to adjust the spacing between the first sizing wheel group and the fourth sizing wheel group, and to lower the height of the second sizing wheel group and the third sizing wheel group, and the first sizing wheel group and the fourth sizing wheel group are used to size the whole wafer.

[0087] When trimming the parallel half-silicon wafers and / or whole silicon wafers, the two trimming wheel set spacing adjustment mechanisms are configured to adjust the spacing between the first trimming wheel set and the second trimming wheel set, and the spacing between the third trimming wheel set and the fourth trimming wheel set, respectively; a half-silicon wafer or a whole silicon wafer is trimmed using the first trimming wheel set and the second trimming wheel set, and another half-silicon wafer or whole silicon wafer is trimmed using the third trimming wheel set and the fourth trimming wheel set.

[0088] The spacing of the four trimming wheel sets is adjusted by the trimming wheel set spacing adjustment mechanisms, so that the dynamic clamping trimming mechanism can be compatible with the trimming of whole silicon wafers and two half-silicon wafers. BRIEF DESCRIPTION OF DRAWINGS

[0089] Figure 1 A plan view of an optional embodiment of the present application, which illustrates sorting whole silicon wafers.

[0090] Figure 2 A plan view of an optional embodiment of the present application, which illustrates sorting whole silicon wafers. Figure 1 A plan view of the sorting device shown in FIG. 8 when sorting half-silicon wafers.

[0091] Figure 3 A plan view of an optional embodiment of the present application, which illustrates sorting half-silicon wafers.

[0092] Figure 4 A perspective view of the basket clamping device in an optional embodiment of the silicon wafer loading device in the present application.

[0093] Figure 5 A perspective view of the basket clamping device in an optional embodiment of the silicon wafer loading device in the present application. Figure 4 A perspective view from another angle.

[0094] Figure 6 A perspective view of the basket clamping device in an optional embodiment of the silicon wafer loading device in the present application. Figure 4 , Figure 5 A perspective view of the whole flower basket clamped by the basket clamping device shown in FIG. 10.

[0095] Figure 7 A perspective view of the basket clamping device in an optional embodiment of the silicon wafer loading device in the present application. Figure 4 , Figure 5 A perspective view of the half flower basket clamped by the basket clamping device shown in FIG. 12.

[0096] Figures 8a-8g A schematic view of the shooting range of the various detection states of the size detection part in the present application.

[0097] Figure 9a A structural schematic view of the thickness detection part in the present application, Figure 9b A structural schematic view of a group of detection components in the present application. Figure 9a A structural schematic view of a group of detection components in the present application.

[0098] Figures 10a-10eThe schematic diagram of various detection states of the thickness detection part in the application.

[0099] Figure 11 The schematic diagram of the three-dimensional structure of the dynamic clamping and sizing mechanism in the application.

[0100] Figures 1-11 In the application, comprising:

[0101] The compatible silicon wafer sorting equipment 1;

[0102] The silicon wafer feeding device 10, the basket clamping device 11, the clamping part 111, the turnover part 112, the clamping support 113, the whole wafer basket 12, the first storage bin 121, the half wafer basket 13, the second storage bin 131, the third storage bin 132, the side edge clamping mechanism 14, the jaw spacing adjusting mechanism 141, the jaw 142, the adjusting plate 143, the jaw driver 144, the end clamping mechanism 15, the lower positioning block 151, the anti-tipping mechanism 152, the air cylinder 153, the connecting rod mechanism 154, the clamping jaw 155;

[0103] The silicon wafer conveying device 20, the conveying mechanism 21, the first conveying belt 211, the second conveying belt 212, the third conveying belt 213, and the fourth conveying belt 214;

[0104] The silicon wafer detection device 30, the size detection part 31, the shooting range 311, the thickness detection part 32, the hidden crack detection part 33, the dirt detection part 34, and the hole detection part 35;

[0105] The defective wafer removal mechanism 40;

[0106] The dynamic clamping and sizing mechanism 50, the first sizing wheel group 51, the sizing wheel 511, the mounting plate 512, the second sizing wheel group 52, the third sizing wheel group 53, the fourth sizing wheel group 54, the sizing wheel group spacing adjusting mechanism 55, the motor 551, the rotating rod 552, the first connecting rod 553, the first sliding plate 554, the first sliding rail 555, the second connecting rod 556, the second sliding plate 557, the second sliding rail 558, and the vertical plate 56;

[0107] The whole wafer silicon wafer 101 and the half wafer silicon wafer 102. DETAILED DESCRIPTION

[0108] In order to make the above-mentioned purposes, features and advantages of the application more obvious and easy to understand, the application will be further described in detail below in combination with the drawings and specific embodiments.

[0109] The application is a compatible silicon wafer sorting equipment for compatible processing of half wafer silicon wafers and whole wafer silicon wafers.

[0110] Figure 1 、 Figure 2An optional embodiment of the compatible wafer sorting equipment 1 is shown. The compatible wafer sorting equipment 1 comprises a wafer feeding device 10, a wafer conveying device 20 and a wafer detecting device 30.

[0111] The wafer feeding device 10 is located at a front station of the wafer conveying device 20, and is configured to provide the wafer conveying device 20 with wafers to be sorted.

[0112] The wafer conveying device 20 comprises at least two conveying mechanisms 21, which are arranged in intervals along a conveying direction of the wafer conveying device 20, and the output end of a front conveying mechanism 21 is connected to the input end of a rear conveying mechanism 21.

[0113] Each conveying mechanism 21 comprises at least four conveying belts arranged in parallel and intervals, and at least a first support interval and two parallel second support intervals are formed between the at least four conveying belts, so that a group of conveying belts forming the first support interval supports the conveying of whole wafers, and two groups of conveying belts forming the second support intervals respectively support the conveying of half wafers and / or whole wafers in parallel.

[0114] The wafer detecting device 30 is arranged along the conveying direction of the wafer conveying device 20, and is configured to detect the wafers conveyed on the wafer conveying device 20.

[0115] By configuring at least four conveying belts, and using a group of conveying belts forming the first support interval to support the conveying of whole wafers, and using two groups of conveying belts forming the second support intervals to respectively support the conveying of half wafers and / or whole wafers in parallel, the sorting compatibility of half wafers and whole wafers is realized.

[0116] An optional embodiment of the compatible wafer sorting equipment 1 is shown. The compatible wafer sorting equipment 1 comprises a wafer feeding device 10, a wafer conveying device 20 and a wafer detecting device 30.

[0117] The wafer feeding device 10 is located at a front station of the wafer conveying device 20, and is configured to provide the wafer conveying device 20 with wafers to be sorted.

[0118] The wafer conveying device 20 comprises at least two conveying mechanisms 21, which are arranged in intervals along a conveying direction of the wafer conveying device 20, and the output end of a front conveying mechanism 21 is connected to the input end of a rear conveying mechanism 21.

[0119] Each conveying mechanism 21 comprises at least four conveying belts arranged in parallel and spaced apart, and a corresponding conveying belt spacing adjustment mechanism configured to adjust the spacing between the corresponding at least four conveying belts, so as to form at least a first support spacing and two parallel second support spacings, so that a group of conveying belts forming the first support spacing supports a whole silicon wafer, and two groups of conveying belts forming the second support spacing respectively support parallel half silicon wafers and / or whole silicon wafers.

[0120] The silicon wafer detection device 30 is arranged along the conveying direction of the silicon wafer conveying device 20, and is configured to detect the silicon wafers conveyed on the silicon wafer conveying device 20.

[0121] By configuring at least four conveying belts and a conveying belt spacing adjustment mechanism, the silicon wafer conveying device 20 can be compatible with conveying different sizes of whole silicon wafers, parallel half silicon wafers, parallel whole silicon wafers, parallel half silicon wafers and whole silicon wafers, and realizes the sorting compatibility of different sizes of half silicon wafers and whole silicon wafers. When sorting parallel whole silicon wafers, the productivity of whole sorting can be improved; when sorting parallel whole silicon wafers and half silicon wafers, the sorting of whole silicon wafers and half silicon wafers can be carried out at the same time, thereby increasing the utilization rate of the equipment; when sorting parallel half silicon wafers, the productivity of half silicon wafers is consistent with that of whole silicon wafers, thereby ensuring the overall efficiency of the sorting equipment.

[0122] Here, the consistency of productivity refers to, for example, when the productivity of whole silicon wafers is 8000 pieces / hour, the productivity of half silicon wafers should be 16000 pieces / hour. This is because half silicon wafers are obtained by slicing whole silicon wafers, or are cut into half silicon wafers when a silicon rod is cut. When a whole silicon wafer is sorted in the sorting equipment, two half silicon wafers need to be sorted.

[0123] The components of the compatible silicon wafer sorting equipment 1 will be described below.

[0124] An optional embodiment of the silicon wafer loading device 10 comprises a carrier box and a suction disc assembly.

[0125] The carrier box is provided with a detachable baffle, which divides the carrier area in the carrier box into a first carrier area and a second carrier area, and the first carrier area and the second carrier area independently carry the stacked half silicon wafers, respectively. When the detachable baffle is not installed in the carrier box, the carrier area in the carrier box carries the stacked whole silicon wafers. The suction disc assembly sucks the silicon wafers to be sorted from the carrier box and releases the silicon wafers to be sorted onto the silicon wafer conveying device 20. The carrier box and the suction disc assembly can adopt any structure in the prior art.

[0126] One storage mode of the silicon wafer is that the silicon wafers are stacked in the carrier box without spacing, when the sorting equipment is connected with the silicon wafers stacked in the carrier box, in order to realize the feeding of the silicon wafers stacked in the carrier box, the suction cup assembly is needed to adsorb and feed the silicon wafers, and the suction cup is used to adsorb the silicon wafers from the carrier box to the silicon wafer conveying device.

[0127] By installing the detachable baffle in the carrier box, the carrier box carrying the whole silicon wafer is changed into the carrier box having two carrying areas and being capable of independently carrying the half silicon wafer, the compatible storage of the whole silicon wafer and the half silicon wafer is realized, and the structure is simple and the cost is low.

[0128] Another optional embodiment of the silicon wafer feeding device 10 comprises the basket clamping device 11 and the lifting module, the basket clamping device 11 is movably installed on the lifting module, and the lifting module controls the lifting of the basket clamping device 11 to be connected with the silicon wafer conveying device 20.

[0129] As shown in Figure 4 , Figure 5 , the basket clamping device 11 is used to clamp the whole flower basket 12 and the half flower basket 13 with different sizes. As shown in Figure 6 , the whole flower basket 12 has a first storage bin 121 with one end being open. As shown in Figure 7 , the half flower basket 13 has a second storage bin 131 and a third storage bin 132 with one end being open, and the second storage bin 131 and the third storage bin 132 are arranged side by side.

[0130] The basket clamping device 11 comprises a clamping part 111, the clamping interval of the clamping part is adjustable, and the clamping of the whole flower basket 12 or the half flower basket 13 by the basket clamping device 11 can be realized by adjusting the clamping interval.

[0131] The whole silicon wafer is carried by the whole flower basket 12, two groups of half silicon wafers are carried by the half flower basket 13 having two storage bins, and the compatible clamping of the whole flower basket 12 and the half flower basket 13 is realized by the basket clamping device 11 with adjustable clamping interval, so as to realize the compatible feeding of the whole silicon wafer and the half silicon wafer.

[0132] In this embodiment, the clamping part 111 is installed on the movable part of the turnover part 112; the clamping part 111 is configured to clamp the whole flower basket 12 or the half flower basket 13, and the turnover part 112 is configured to drive the clamping part 111 to turn between the horizontal plane and the vertical plane. Optionally, the turnover part 112 adopts a motor.

[0133] In one of the embodiments, the clamping part 111 comprises a clamping support 113, a side edge clamping mechanism 14 and an end clamping mechanism 15. Through the cooperation of the side edge clamping mechanism 14 and the end clamping mechanism 15, not only the clamping of the flower basket from both sides can be implemented, but also the clamping of the flower basket from both ends can be implemented, thereby improving the clamping effect of the flower basket and preventing the flower basket from slipping during rotation.

[0134] Optionally, the side edge clamping mechanism 14 comprises a jaw spacing adjustment mechanism 141 and two jaws 142 oppositely installed on both sides of the clamping support 113, and the jaw spacing adjustment mechanism 141 is configured to adjust the spacing between the two jaws 142 to adapt to the clamping of the whole flower basket 12 or the half flower basket 13 from both sides.

[0135] By setting the jaw spacing adjustment mechanism 141 capable of driving the movement of the jaw 142, the clamping distance and clamping force of the side edge clamping mechanism 14 can be flexibly adjusted.

[0136] Optionally, the end clamping mechanism 15 comprises a lower positioning block 151 and an anti-tipping mechanism 152, the lower positioning block 151 is installed at one end of the clamping support 113 close to the turnover part 112, and the anti-tipping mechanism 152 is installed at the other end of the clamping support 113 away from the turnover part 112, and the lower positioning block 151 cooperates with the anti-tipping mechanism 152 to clamp the whole flower basket 12 or the half flower basket 13 from both ends.

[0137] Through the cooperation of the lower positioning block 151 and the anti-tipping mechanism 152, the clamping of the end of the flower basket is realized.

[0138] Optionally, the anti-tipping mechanism 152 comprises a gas cylinder 153, a connecting rod mechanism 154 and a clamping jaw 155, the first end of the connecting rod mechanism 154 is connected to the movable part of the gas cylinder 153, and the second end of the connecting rod mechanism 154 is connected to the clamping jaw 155. The gas cylinder 153 drives the clamping jaw 155 to overturn through the connecting rod mechanism 154, clamps the flower basket, and prevents the flower basket from tipping over during rotation.

[0139] The anti-tipping mechanism 152 adopts the combination of the gas cylinder 153 and the connecting rod mechanism 154, which is simple in structure and easy to install.

[0140] Optionally, the jaw spacing adjustment mechanism 141 comprises an adjusting plate 143 and a jaw driver 144, one of the two jaws 142 is installed on the adjusting plate 143, and the other of the two jaws 142 is installed on the movable part of the jaw driver 144, the adjusting plate 143 is configured to manually adjust the position of one of the jaws 142, and the jaw driver 144 is configured to drive the other jaw 142 to move to adjust the distance between the two jaws 142 and clamp the whole flower basket 12 or the half flower basket 13. Optionally, the jaw driver 144 adopts a gas cylinder.

[0141] The jaw spacing adjustment mechanism 141 adopts an adjustment plate 143 and a jaw driver 144, which is convenient to adjust and low in cost.

[0142] When the wafer feeding device 10 adopts the full wafer basket 12 and the half wafer basket 13, in order to take out the wafer from the wafer feeding device 10, the compatible wafer sorting device 1 also comprises a wafer taking conveying device (not shown in the figure) located between the wafer feeding device 10 and the wafer conveying device 20.

[0143] As an optional embodiment, the wafer taking conveying device comprises at least four stretchable conveying belts arranged in parallel and at intervals and a stretchable conveying belt spacing adjustment mechanism.

[0144] When the sorting device sorts the full wafer 101, the stretchable conveying belt spacing adjustment mechanism of the wafer taking conveying device is configured to adjust the spacing between the at least four stretchable conveying belts, so that the at least four stretchable conveying belts are docked with the first storage bin 121 of the full wafer basket 12, and the full wafer 101 in the first storage bin 121 is taken out one by one.

[0145] When the sorting device sorts the half wafer 102, the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the at least four stretchable conveying belts, so as to form two groups of stretchable conveying belts meeting the spacing requirements of the half wafer, and the two groups of stretchable conveying belts are respectively docked with the second storage bin 131 and the third storage bin 132 of the half wafer basket 13, so as to take out the half wafer 102 in the second storage bin 131 and the third storage bin 132 synchronously one by one.

[0146] The stretchable conveying belts are configured to take out the wafer from the wafer feeding device 10, and the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the at least four stretchable conveying belts to achieve the compatibility of taking out the full wafer 101 and the half wafer 102.

[0147] In this embodiment, specifically, the wafer taking conveying device comprises four stretchable conveying belts arranged in parallel and at intervals, and the four stretchable conveying belts are sequentially a first stretchable conveying belt, a second stretchable conveying belt, a third stretchable conveying belt and a fourth stretchable conveying belt. It should be noted that, according to different compatibility requirements, the wafer taking conveying device can also be designed as six stretchable conveying belts arranged in parallel and at intervals, eight stretchable conveying belts arranged in parallel and at intervals, etc., to meet the requirements of the wafer body on the conveying support surface.

[0148] When the full wafer 101 is taken out, the stretchable conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first stretchable conveying belt and the fourth stretchable conveying belt, and at least two stretchable conveying belts are used to take out the full wafer in the first storage bin 121 one by one.

[0149] In one embodiment, four telescopic conveyor belts are used simultaneously to pick up and transport the entire silicon wafer. This is a preferred wafer picking method.

[0150] In another embodiment, a first and a fourth telescopic conveyor belt are used together to retrieve and transport the entire silicon wafer. In this embodiment, it is necessary to lower the conveying surfaces of the second and third telescopic conveyor belts or to remove both of the telescopic conveyor belts.

[0151] When half of the silicon wafer 102 is removed, the telescopic conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first telescopic conveyor belt and the second telescopic conveyor belt, as well as the spacing between the third telescopic conveyor belt and the fourth telescopic conveyor belt, so that the first telescopic conveyor belt and the second telescopic conveyor belt are connected to the second storage bin 131, and the third telescopic conveyor belt and the fourth telescopic conveyor belt are connected to the third storage bin 132, so as to synchronously and sequentially remove the half of the silicon wafer 102 from the second storage bin 131 and the third storage bin 132.

[0152] The compatibility of picking up whole silicon wafers 101 and half silicon wafers 102 is achieved by adjusting the spacing of the four telescopic conveyor belts through a telescopic conveyor belt spacing adjustment mechanism. The structure is simple and the adjustment is convenient.

[0153] In this embodiment, the telescopic conveyor belt spacing adjustment mechanism can adopt any structure in the prior art, which will not be described in detail here.

[0154] like Figure 1 , Figure 2 As shown, specifically, each conveying mechanism 21 includes four conveyor belts arranged in parallel at intervals. The four conveyor belts of each conveying mechanism 21 are, in sequence, a first conveyor belt 211, a second conveyor belt 212, a third conveyor belt 213, and a fourth conveyor belt 214. It should be noted that, depending on different compatibility requirements, the conveying mechanism can also be designed with six or eight conveyor belts arranged in parallel at intervals to meet the requirements of the sheet body for the conveying support surface.

[0155] When the conveying mechanism 21 is conveying a whole silicon wafer 101, the conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first conveyor belt 211 and the fourth conveyor belt 214, and use all four conveyor belts to convey the whole silicon wafer 101; or, the conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first conveyor belt 211 and the fourth conveyor belt 214, and lower the height of the second conveyor belt 212 and the third conveyor belt 213, and use the first conveyor belt 211 and the fourth conveyor belt 214 to jointly convey the whole silicon wafer 101.

[0156] When the conveying mechanism 21 conveys the parallel half-silicon wafers 102 and / or the whole silicon wafer 101, the conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first conveying belt 211 and the second conveying belt 212, and the spacing between the third conveying belt 213 and the fourth conveying belt 214, using the first conveying belt 211 and the second conveying belt 212, and the third conveying belt 213 and the fourth conveying belt 214 to convey the half-silicon wafers 102 and / or the whole silicon wafer 101 in parallel, respectively.

[0157] The compatible conveying of the whole silicon wafer 101 and the half-silicon wafer 102 is achieved by adjusting the spacing of the four stretchable conveying belts through the conveying belt spacing adjustment mechanism, which is simple in structure and convenient to adjust.

[0158] In this embodiment, the conveying belt spacing adjustment mechanism can adopt any structure in the prior art, which will not be described here.

[0159] In this embodiment, optionally, the first conveying belt 211, the second conveying belt 212, the third conveying belt 213 and the fourth conveying belt 214 are driven by the first motor; or the first conveying belt 211 and the second conveying belt 212 are driven by the first motor, and the third conveying belt 213 and the fourth conveying belt 214 are driven by the second motor.

[0160] The four conveying belts are driven by one motor, which can maintain the synchronization of the four conveying belts; the two groups of conveying belts are driven by two motors respectively, which can control the running speed of the two groups of conveying belts respectively, increasing the flexibility of control.

[0161] Optionally, the first conveying belt 211, the second conveying belt 212, the third conveying belt 213 and the fourth conveying belt 214 are provided with suction holes, which can improve the stability of the silicon wafer conveying under the condition of high-speed conveying of the silicon wafer, especially when the half-silicon wafer is conveyed at high speed, the width direction of the half-silicon wafer is narrower, which can further improve the stability of the silicon wafer conveying.

[0162] As shown in Figures 1-3 The silicon wafer detection device 30 includes at least one of a size detection part 31, a thickness detection part 32, a hidden crack detection part 33, a dirt detection part 34 and a hole detection part 35.

[0163] The silicon wafer detection device 30 can select one detection item or multiple detection items according to the actual situation, increasing the adaptability of the sorting equipment.

[0164] In order to sense the position of the silicon wafer, optionally, at least one of the first sensing unit is arranged between the entry end and the exit end of the first conveying belt 211 and the second conveying belt 212, and at least one of the second sensing unit is arranged between the entry end and the exit end of the third conveying belt 213 and the fourth conveying belt 214.

[0165] When the conveying mechanism 21 is conveying the half wafer 102, the first sensing unit senses the wafer at the location and transmits the sensing information to the host computer, and the second sensing unit senses the wafer at the location and transmits the sensing information to the host computer.

[0166] The host computer performs calculation and processing according to the sensing information transmitted by the first sensing unit and the second sensing unit, and judges whether the half wafer 102 and / or the whole wafer 101 conveyed by the first conveying belt 211 and the second conveying belt 212 and the half wafer 102 and / or the whole wafer 101 conveyed by the third conveying belt 213 and the fourth conveying belt 214 have position deviation during parallel conveying.

[0167] The position information of the wafer is sensed by the sensing unit, so that the position deviation during conveying can be processed in time, and the accuracy of wafer detection is improved.

[0168] Optionally, the compatible wafer sorting equipment 1 further comprises an alarm device.

[0169] When the position deviation exceeds a predetermined value, the host computer controls the alarm device to alarm; when the position deviation is less than the predetermined value, the host computer controls the shooting camera of the wafer detection device 30 to adjust the line scan number and / or adjust the image capturing range according to the position deviation.

[0170] Specifically, when the shooting camera in the wafer detection device 30 is a face array camera, the host computer controls the shooting camera to adjust the image capturing range according to the position deviation, and if the position deviation is from small to large, the image capturing range of the shooting camera is increased; if the position deviation is from large to small, the image capturing range of the shooting camera is decreased.

[0171] When the shooting camera in the wafer detection device 30 is a line scan camera, the host computer controls the line scan number of the shooting camera according to the position deviation, and if the position deviation is from small to large, the line scan number of the shooting camera is increased; if the position deviation is from large to small, the line scan number of the shooting camera is decreased.

[0172] The alarm device is arranged to alarm the position deviation of the wafer, when the position deviation exceeds a predetermined value, the alarm device is triggered in time to prevent the half wafer in parallel conveying from being incompletely detected and the detection result from being unreliable; when the position deviation is within the predetermined value, the shooting camera is controlled according to the current position deviation, so that the shooting camera can adapt to the current position deviation, and the same detection effect as without position deviation can be achieved.

[0173] In one embodiment, the size detection unit 31 includes a line camera, and the imaging range 311 of the line camera is configured to cover two pieces of the half wafer 102 conveyed in parallel by the first and second conveyors 211 and 212, the third and fourth conveyors 213 and 214, respectively, with a positional deviation equal to a predetermined value.

[0174] As shown in FIG. 6, when the size detection unit 31 detects the whole wafer 101, the imaging range 311 of the line camera needs to cover the whole wafer 101. Figure 8a

[0175] As shown in FIG. 7, when the size detection unit 31 detects two pieces of the half wafer 102 conveyed in parallel without a positional deviation in the advancing direction, the imaging range 311 of the line camera needs to cover the two pieces of the half wafer 102 conveyed in parallel and the wafer interval a between the two pieces of the half wafer 102. Figure 8b

[0176] As shown in FIG. 8, when the size detection unit 31 detects two pieces of the half wafer 102 conveyed in parallel with a positional deviation in the advancing direction, the imaging range 311 of the line camera needs to cover the two pieces of the half wafer 102 conveyed in parallel, the wafer interval a between the two pieces of the half wafer 102, and the positional deviation b of the two pieces of the half wafer 102 in the advancing direction. Figure 8c

[0177] As described above, when the imaging range 311 of the line camera is set, the imaging range is configured to cover two pieces of the half wafer 102 conveyed in parallel by the first and second conveyors 211 and 212, the third and fourth conveyors 213 and 214, respectively, with a positional deviation b equal to a predetermined value. This allows the line camera to satisfy the requirements for the imaging range for the whole wafer 101, for two pieces of the half wafer 102 without a positional deviation, and for two pieces of the half wafer 102 with a positional deviation, and maximizes the compatibility of the size detection for the half wafer 102 and the whole wafer 101, thereby improving the detection accuracy.

[0178] As shown in FIG. 9, when the size detection unit 31 detects two pieces of the whole wafer 101 conveyed in parallel without a positional deviation in the advancing direction, the imaging range 311 of the line camera needs to cover the two pieces of the whole wafer 101 conveyed in parallel and the wafer interval c between the two pieces of the whole wafer 101. Figure 8d

[0179] As shown in FIG. 10, when the size detection unit 31 detects two pieces of the whole wafer 101 conveyed in parallel with a positional deviation in the advancing direction, the imaging range 311 of the line camera needs to cover the two pieces of the whole wafer 101 conveyed in parallel, the wafer interval c between the two pieces of the whole wafer 101, and the positional deviation d of the two pieces of the whole wafer 101 in the advancing direction. Figure 8e ​​​​As shown in FIG. 6, when the size detecting unit 31 detects two parallel full wafer silicon wafers 101 and the two full wafer silicon wafers 101 have a positional deviation in the direction of travel, the shooting range 311 of the area array camera must cover the two parallel full wafer silicon wafers 101 and the wafer spacing c between the two full wafer silicon wafers 101 and the positional deviation d of the two full wafer silicon wafers 101 in the direction of travel.

[0180] As shown in FIG. 7, when the size detecting unit 31 detects two parallel full wafer silicon wafers 101 and half wafer silicon wafers 102 and the full wafer silicon wafers 101 and the half wafer silicon wafers 102 have no positional deviation in the direction of travel, the shooting range 311 of the area array camera must cover the full wafer silicon wafers 101 and the half wafer silicon wafers 102 when they are conveyed in parallel and the wafer spacing e between the full wafer silicon wafers 101 and the half wafer silicon wafers 102. Figure 8f As shown in FIG. 8, when the size detecting unit 31 detects two parallel full wafer silicon wafers 101 and half wafer silicon wafers 102 and the full wafer silicon wafers 101 and the half wafer silicon wafers 102 have a positional deviation in the direction of travel, the shooting range 311 of the area array camera must cover the full wafer silicon wafers 101 and the half wafer silicon wafers 102 when they are conveyed in parallel and the wafer spacing e between the full wafer silicon wafers 101 and the half wafer silicon wafers 102 and the positional deviation f of the full wafer silicon wafers 101 and the half wafer silicon wafers 102 in the direction of travel.

[0181] Figure 8g

[0182] In summary, when setting the shooting range 311 of the area array camera, the shooting range of the area array camera is configured to cover two full wafer silicon wafers 101 conveyed in parallel by the first conveying belt 211 and the second conveying belt 212 and the third conveying belt 213 and the fourth conveying belt 214 and having a positional deviation d equal to a predetermined value. This allows the area array camera to simultaneously satisfy the requirements for shooting range for full wafer silicon wafers, two full wafer silicon wafers conveyed in parallel and having no positional deviation, two full wafer silicon wafers conveyed in parallel and having a positional deviation, two half wafer silicon wafers conveyed in parallel and having no positional deviation, two half wafer silicon wafers conveyed in parallel and having a positional deviation, a half wafer silicon wafer and a full wafer silicon wafer conveyed in parallel and having no positional deviation, and a half wafer silicon wafer and a full wafer silicon wafer conveyed in parallel and having a positional deviation, thereby maximizing the compatibility of size detection for half wafer silicon wafers and full wafer silicon wafers and improving the accuracy of detection.

[0183] ​​In one of the embodiments, the thickness detection unit 32 comprises a mounting vertical plate and two sets of detection assemblies mounted on the mounting vertical plate, the mounting vertical plate is provided with a conveying channel, the first conveying belt 211, the second conveying belt 212, the third conveying belt 213 and the fourth conveying belt 214 pass through the conveying channel, and the to-be-sorted silicon wafers conveyed by the first conveying belt 211, the second conveying belt 212, the third conveying belt 213 and the fourth conveying belt 214 pass through the conveying channel and are detected by the two sets of detection assemblies.

[0184] In order to enable the whole silicon wafer 101 and the two parallel half silicon wafers 102 to pass through the conveying channel to complete the thickness detection, and realize the compatibility of the thickness detection unit 32 to the half silicon wafer 102 and the whole silicon wafer 101, the width of the conveying channel is greater than the distance between the first conveying belt 211 and the fourth conveying belt 214 when the half silicon wafer 102 is conveyed in parallel by the first conveying belt 211 and the second conveying belt 212 and the third conveying belt 213 and the fourth conveying belt 214.

[0185] In order to enable the whole silicon wafer 101, the two parallel half silicon wafers 102, the two parallel whole silicon wafers 101, the parallel whole silicon wafer 101 and the half silicon wafer 102 to pass through the conveying channel to complete the thickness detection, and better realize the compatibility of the thickness detection unit 32 to the half silicon wafer 102 and the whole silicon wafer 101, the width of the conveying channel is greater than the distance between the first conveying belt 211 and the fourth conveying belt 214 when the whole silicon wafer 101 is conveyed in parallel by the first conveying belt 211 and the second conveying belt 212 and the third conveying belt 213 and the fourth conveying belt 214.

[0186] Optionally, the thickness detection unit 32 further comprises a first distance adjusting mechanism 324 connected to the two sets of detection assemblies respectively, for adjusting the distance between the two sets of detection assemblies. The two sets of detection assemblies detect the thickness of the whole silicon wafer 101 conveyed by the conveying channel 323; or, the two sets of detection assemblies respectively detect the thickness of the half silicon wafer 102 conveyed in parallel by the conveying channel 323.

[0187] The first distance adjusting mechanism is used to flexibly adjust the distance between the two sets of detection assemblies, so that the thickness detection unit 32 can meet the thickness detection requirements of the whole silicon wafer 101 and the half silicon wafer 102.

[0188] Optionally, each set of detection assembly comprises at least two detection units and a second distance adjusting mechanism connected to the two detection units respectively, for adjusting the distance between the two detection units.

[0189] The second spacing adjustment mechanism can further adjust the spacing between the two detection parts in each detection assembly, further improving compatibility. For example, when the whole silicon wafer of size A, the half silicon wafer of size A, the whole silicon wafer of size B, and the half silicon wafer of size B need to be compatible, since the distance requirements between the detection parts of the silicon wafers of size A and size B are not exactly the same, the distance between the detection parts can be adjusted to achieve compatibility of the silicon wafers of size A and size B.

[0190] An embodiment of the thickness detection part 32 will be described in detail below. As shown in FIG. 3, the thickness detection part 32 includes a mounting stand 320, a first detection assembly 321, and a second detection assembly 322. The first detection assembly 321 and the second detection assembly 322 are both mounted on the mounting stand 320. The mounting stand 320 is provided with a conveying channel 323. Figure 9a

[0191] The first conveying belt 211, the second conveying belt 212, the third conveying belt 213, and the fourth conveying belt 214 pass through the conveying channel (not shown in the drawings). The silicon wafers to be sorted conveyed by the first conveying belt 211, the second conveying belt 212, the third conveying belt 213, and the fourth conveying belt 214 pass through the conveying channel and are detected by the two detection assemblies. Figure 9a

[0192] The first spacing adjustment mechanism 324 is connected to the first detection assembly 321 and the second detection assembly 322, respectively, for adjusting the spacing between the first detection assembly 321 and the second detection assembly 322. The first detection assembly 321 and the second detection assembly 322 detect the thickness of the whole silicon wafer 101 conveyed by the conveying channel 323. Alternatively, the first detection assembly 321 and the second detection assembly 322 detect the thickness of the half silicon wafer 102 conveyed in parallel by the conveying channel 323.

[0193] Specifically, the first spacing adjustment mechanism 324 includes a motor 3241, a rotating rod 3242, a first connecting rod 3243, and a second connecting rod 3244. The motor 3241 is arranged on the mounting stand 320. The rotating rod 3242 is fixedly connected to the driving end of the motor 3241. The first end of the first connecting rod 3243 is rotatably connected to the first end of the rotating rod 3242, and the second end of the first connecting rod 3243 is rotatably connected to the second detection assembly 322. The first end of the second connecting rod 3244 is rotatably connected to the second end of the rotating rod 3242, and the second end of the second connecting rod 3244 is rotatably connected to the first detection assembly 321.

[0194] ​​The first group of detection assemblies 321 and the second group of detection assemblies 322 are slidably installed on the mounting bracket 320 by the first sliding plate, and the first distance adjusting mechanism 324 is used to drive the first group of detection assemblies 321 and the second group of detection assemblies 322 to slide in opposite directions to adjust the distance between the first group of detection assemblies 321 and the second group of detection assemblies 322.

[0195] When the silicon wafer passes through the conveying channel 323, the first group of detection assemblies 321 and the second group of detection assemblies 322 detect the thickness of the silicon wafer.

[0196] The first group of detection assemblies 321 and the second group of detection assemblies 322 are the same in structure, and the first group of detection assemblies 321 is taken as an example for description. Please refer to Figure 9a and 9b The first group of detection assemblies 321 includes a first detection part, a second detection part, and a second sliding plate. The two detection parts are slidably installed on the first sliding plate by the second sliding plate. The first detection part includes a first laser 3211 and a second laser 3212. The first laser 3211 and the second laser 3212 are arranged on the second sliding plate and located on the upper and lower sides of the conveying channel 323.

[0197] The second detection part includes a third laser 3213 and a fourth laser 3214. The third laser 3213 and the fourth laser 3214 are arranged on the second sliding plate and located on the upper and lower sides of the conveying channel 323.

[0198] The second distance adjusting mechanism includes a second motor 3215, a second rotating rod 3216, a third connecting rod 3217, and a fourth connecting rod 3218. One end of the third connecting rod 3217 is connected to the second rotating rod 3216, and the other end is connected to the second detection part. One end of the fourth connecting rod 3218 is connected to the second rotating rod 3216, and the other end is connected to the first detection part.

[0199] The second distance adjusting mechanism can adjust the distance between the first detection part and the second detection part.

[0200] When the silicon wafer passes through the conveying channel 323, the first laser 3211 and the second laser 3212 synchronously scan the two opposite surfaces of the first side part of the silicon wafer to be detected to implement the thickness detection of the first side part of the silicon wafer to be detected. The third laser 3213 and the fourth laser 3214 synchronously scan the two opposite surfaces of the second side part of the silicon wafer to be detected to implement the thickness detection of the second side part of the silicon wafer to be detected.

[0201] In the thickness detection of the silicon wafer by the thickness detection unit 32, the length of several edges of the silicon wafer can be detected according to the requirements, which can be one, two, three, etc. In general, the more the number of detection, the more accurate the thickness detection of the silicon wafer, and the more close to the average value. When the detection of the half-silicon wafer and the whole-silicon wafer needs to be compatible, two or more groups of lasers need to be set.

[0202] The thickness detection process of the whole-silicon wafer and the half-silicon wafer will be described below by taking the thickness detection unit 32 with six groups of lasers as an example. The laser group here refers to a group of lasers on the upper and lower sides of the conveying channel, such as the first laser 3211 and the second laser 3212 shown in Figure 9b .

[0203] As shown in Figures 10a-10e , the six groups of lasers are marked as 1, 2, 3, 4, 5, and 6, respectively.

[0204] As shown in Figure 10a , when the thickness of three edges of the whole-silicon wafer needs to be detected, the laser groups 1, 4, and 6 in the figure can be used for detection; as shown in Figure 10b , when the thickness of six edges of the whole-silicon wafer 101 needs to be detected, the laser groups 1, 2, 3, 4, 5, and 6 in the figure can be used for detection.

[0205] As shown in Figure 10c , when the thickness of three edges of the half-silicon wafer needs to be detected, the laser groups 1, 2, and 3 in the figure can be used for detection of the first half-silicon wafer 102, and the laser groups 4, 5, and 6 can be used for detection of the second half-silicon wafer 102.

[0206] As shown in Figure 10d , when the thickness of two edges of the half-silicon wafer needs to be detected, the laser groups 1 and 3 in the figure can be used for detection of the first half-silicon wafer 102, and the laser groups 4 and 6 can be used for detection of the second half-silicon wafer 102.

[0207] As shown in Figure 10e , when the thickness of one edge of the half-silicon wafer needs to be detected, the laser group 2 in the figure can be used for detection of the first half-silicon wafer, and the laser group 5 can be used for detection of the second half-silicon wafer.

[0208] In one of the embodiments, the crack detection unit 33, the dirt detection unit 34 and the hole detection unit 35 each include a bar light source and a line scan camera, the bar light source is arranged perpendicularly to the conveying direction of the silicon wafer to be sorted, and the light radiation surface of the bar light source is greater than the interval between the first conveying belt 211 and the fourth conveying belt 214 when the half silicon wafer 102 is conveyed in parallel by the first conveying belt 211 and the second conveying belt 212, and the third conveying belt 213 and the fourth conveying belt 214.

[0209] The light radiation surface of the bar light source is arranged to be greater than the interval between the first conveying belt 211 and the fourth conveying belt 214 when the half silicon wafer 102 is conveyed in parallel by the first conveying belt 211 and the second conveying belt 212, and the third conveying belt 213 and the fourth conveying belt 214, so that the bar light source can simultaneously meet the lighting requirements of the whole silicon wafer 101, two parallel half silicon wafers 102, and realize the compatibility of the whole silicon wafer 101 and the half silicon wafer 102 in crack detection, dirt detection and hole detection.

[0210] In one of the embodiments, the light radiation surface of the bar light source is arranged to be greater than the interval between the first conveying belt 211 and the fourth conveying belt 214 when the whole silicon wafer 101 is conveyed in parallel by the first conveying belt 211 and the second conveying belt 212, and the third conveying belt 213 and the fourth conveying belt 214, so that the bar light source can simultaneously meet the lighting requirements of the whole silicon wafer 101, two parallel whole silicon wafers 101, a whole silicon wafer 101 and a half silicon wafer 102 in parallel, and two parallel half silicon wafers 102, and realize the compatibility of the whole silicon wafer 101 and the half silicon wafer 102 in crack detection, dirt detection and hole detection.

[0211] In one of the embodiments, the compatible silicon wafer sorting device 1 further comprises a defective wafer removing mechanism 40, which is arranged above the conveying mechanism 21 or between the two conveying mechanisms 21, and is used to remove the defective wafer with defects from the silicon wafer conveying device 20 after being detected by the silicon wafer detection device 30.

[0212] By setting the defective wafer removing mechanism 40 to remove the defective wafer from the conveying device, on the one hand, it can avoid invalid detection of the defective wafer and improve the sorting efficiency; on the other hand, if the defective wafer is not removed and continues to be conveyed, once a fragment occurs at a certain position, it will affect the operation of the equipment and reduce the sorting efficiency.

[0213] In this embodiment, optionally, the defective wafer removing mechanism 40 includes a suction disc removing assembly, and the suction disc removing assembly includes at least one removing suction disc and at least one first waste box, the removing suction disc is arranged above the conveying mechanism 21, and the first waste box is arranged at the side of the conveying mechanism 21.

[0214] The suction disc removing assembly is used for removing the defective wafer on the conveying mechanism, and has simple structure and can conveniently accommodate the half wafer and the whole wafer.

[0215] Optionally, the defective wafer removing mechanism 40 comprises a turnover removing assembly, the turnover removing assembly is located between the two conveying mechanisms 21, and the turnover removing assembly comprises at least four turnover conveying belts arranged in parallel and at intervals, a turnover conveying belt spacing adjusting mechanism and a second waste box.

[0216] The first end and the last end of the at least four turnover conveying belts are respectively connected to the at least four conveying belts of the conveying mechanisms 21 in the front and rear processes, and the at least four turnover conveying belts are turned downward with the first end as a fulcrum or turned upward with the last end as a fulcrum. The turnover conveying belt spacing adjusting mechanism is used for adjusting the spacing between the at least four turnover conveying belts. The second waste box is arranged below the at least four turnover conveying belts and is used for receiving the defective wafers removed after the turnover of the turnover conveying belts.

[0217] When the continuous defective wafers are encountered, the turnover removing assembly can continuously remove the defective wafers, and the sorting efficiency of the sorting equipment is not affected due to the failure to timely remove the defective wafers.

[0218] Optionally, the defective wafer removing mechanism 40 comprises the suction disc removing assembly and the turnover removing assembly, wherein:

[0219] The suction disc removing assembly comprises at least one removing suction disc and at least one first waste box, the removing suction disc is arranged above the conveying mechanism 21, and the first waste box is arranged at the side of the conveying mechanism 21.

[0220] The turnover removing assembly is located between the two conveying mechanisms 21, and the turnover removing assembly comprises at least four turnover conveying belts arranged in parallel and at intervals, a turnover conveying belt spacing adjusting mechanism and a second waste box. The first end and the last end of the at least four turnover conveying belts are respectively connected to the at least four conveying belts of the conveying mechanisms 21 in the front and rear processes, and the at least four turnover conveying belts are turned downward with the first end as a fulcrum or turned upward with the last end as a fulcrum. The turnover conveying belt spacing adjusting mechanism is used for adjusting the spacing between the at least four turnover conveying belts. The second waste box is arranged below the at least four turnover conveying belts and is used for receiving the defective wafers removed after the turnover of the turnover conveying belts.

[0221] The suction disc removing assembly and the turnover removing assembly are combined to remove the defective wafers, the corresponding removing assembly can be flexibly selected according to whether the defective wafers are continuous, and the removing efficiency is improved as a whole.

[0222] In this embodiment, specifically, the turnover rejection assembly includes four turnover conveying belts arranged in parallel and at intervals, which are a first turnover conveying belt, a second turnover conveying belt, a third turnover conveying belt, and a fourth turnover conveying belt in sequence. It should be noted that, according to different compatibility requirements, the turnover rejection assembly can also be designed as six turnover conveying belts arranged in parallel and at intervals, eight turnover conveying belts arranged in parallel and at intervals, and the like, so as to meet the requirements of the wafer on the conveying support surface.

[0223] When the defective wafer to be rejected is a whole wafer, the turnover conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first turnover conveying belt and the fourth turnover conveying belt, and the four turnover conveying belts are used to turn over the defective wafer.

[0224] When the defective wafer to be rejected is a half wafer and / or a whole wafer, the turnover conveying belt spacing adjustment mechanism is configured to adjust the spacing between the first turnover conveying belt and the second turnover conveying belt and the spacing between the third turnover conveying belt and the fourth turnover conveying belt, and the first turnover conveying belt and the second turnover conveying belt and the third turnover conveying belt and the fourth turnover conveying belt are used to turn over the defective wafer.

[0225] The spacing between the four turnover conveying belts is adjusted by the turnover conveying belt spacing adjustment mechanism, so as to realize the rejection of the whole wafer defective wafer and the half wafer defective wafer.

[0226] Optionally, the first turnover conveying belt and the second turnover conveying belt are driven to turn over by a first driving part, and the third turnover conveying belt and the fourth turnover conveying belt are driven to turn over by a second driving part.

[0227] By dividing the four turnover conveying belts into two groups and driving the turnover conveying belts to turn over by two driving parts, one group of turnover conveying belts can be driven to turn over without affecting the normal operation of the other group of turnover conveying belts (not turning over, as a conveying belt conveying the wafer backward).

[0228] Optionally, the feeding end of the wafer conveying device 20 is provided with a dynamic clamping and sizing mechanism 50, which is configured to size the whole wafer 101 or the half wafer 102.

[0229] The dynamic clamping and sizing mechanism 50 is installed at the feeding end of the wafer conveying device 20, and is configured to size the whole wafer 101 or the half wafer 102, so that the whole wafer 101 or the half wafer 102 is aligned before entering the detection area, thereby improving the detection efficiency.

[0230] Optionally, the feeding end of the wafer conveying device 20 is provided with a dynamic clamping and sizing mechanism 50, which is configured to size the whole wafer 101 or the half wafer 102.

[0231] The dynamic clamping and sizing mechanism 50 is installed at the discharge end of the silicon wafer conveying device 20 to size the whole silicon wafer 101 or the half silicon wafer 102. Before the silicon wafer is put into the box, the whole silicon wafer 101 or the half silicon wafer 102 is sized, which can improve the stability and neatness of the silicon wafer into the box.

[0232] Optionally, as shown in Figure 3 The dynamic clamping and sizing mechanism 50 is installed at the discharge end of the silicon wafer conveying device 20 to size the whole silicon wafer 101 or the half silicon wafer 102. Before the silicon wafer is put into the box, the whole silicon wafer 101 or the half silicon wafer 102 is sized, which can improve the stability and neatness of the silicon wafer into the box.

[0233] The dynamic clamping and sizing mechanism 50 is installed at the discharge end of the silicon wafer conveying device 20 to size the whole silicon wafer 101 or the half silicon wafer 102. Before the silicon wafer is put into the box, the whole silicon wafer 101 or the half silicon wafer 102 is sized, which can improve the stability and neatness of the silicon wafer into the box.

[0234] As shown in Figure 11 As an optional embodiment, the dynamic clamping and sizing mechanism 50 includes four sets of sizing wheel groups and sizing wheel group spacing adjustment mechanisms 55.

[0235] The four sets of sizing wheel groups are the first sizing wheel group 51, the second sizing wheel group 52, the third sizing wheel group 53, and the fourth sizing wheel group 54 arranged in sequence and at intervals. The first sizing wheel group 51 and the second sizing wheel group 52 are installed on one sizing wheel group spacing adjustment mechanism 55, and the third sizing wheel group 53 and the fourth sizing wheel group 54 are installed on another sizing wheel group spacing adjustment mechanism 55.

[0236] When sizing the whole silicon wafer 101, the two sizing wheel group spacing adjustment mechanisms 55 are configured to adjust the spacing between the first sizing wheel group 51 and the fourth sizing wheel group 54, and to lower the height of the second sizing wheel group 52 and the third sizing wheel group 53 (for lowering the height of the second sizing wheel group 52 and the third sizing wheel group 53, a lifting adjustment hole can be set to realize manual adjustment). The first sizing wheel group 51 and the fourth sizing wheel group 54 are used to size the whole silicon wafer 101.

[0237] When trimming the parallel half-silicon wafers 102 and / or the whole silicon wafer 101, the two sets of trimming wheel spacing adjustment mechanisms 55 are configured to adjust the spacing between the first set of trimming wheels 51 and the second set of trimming wheels 52, and the spacing between the third set of trimming wheels 53 and the fourth set of trimming wheels 54, respectively; one half-silicon wafer 102 or whole silicon wafer 101 is trimmed by the first set of trimming wheels 51 and the second set of trimming wheels 52, and another half-silicon wafer 102 or whole silicon wafer 101 is trimmed by the third set of trimming wheels 53 and the fourth set of trimming wheels 54.

[0238] The spacing of the four sets of trimming wheels is adjusted by the sets of trimming wheel spacing adjustment mechanisms 55, so that the dynamic clamping and trimming mechanism 50 can be compatible with the trimming of the whole silicon wafer 101 and two half-silicon wafers 102.

[0239] In this embodiment, each set of trimming wheel spacing adjustment mechanism 55 includes a motor 551, a rotating rod 552, a first connecting rod 553, a second connecting rod 556, a first sliding plate 554, a second sliding plate 557, a first sliding rail 555 and a second sliding rail 558.

[0240] The motor 551 is installed on the first side of the vertical plate 56, and the output shaft of the motor 551 extends through the vertical plate 56 to the second side of the vertical plate 56.

[0241] The rotating rod 552 is installed on the output shaft of the motor 551; the first end of the first connecting rod 553 is rotatably connected to the first end of the rotating rod 552, the second end of the first connecting rod 553 is rotatably connected to the first sliding plate 554, and the first sliding plate 554 is slidingly fitted on the first sliding rail 555; the first end of the second connecting rod 556 is rotatably connected to the second end of the rotating rod 552, the second end of the second connecting rod 556 is rotatably connected to the second sliding plate 557, and the second sliding plate 557 is slidingly fitted on the second sliding rail 558. The first sliding rail 555 and the second sliding rail 558 are installed on the second side of the vertical plate 56. Optionally, the first sliding rail 555 and the second sliding rail 558 each have two.

[0242] Each set of trimming wheels includes a plurality of trimming wheels 511 installed on the top of the mounting plate 512, and the mounting plate 512 of one set of trimming wheels is installed on the first sliding plate 554, and the mounting plate 512 of the adjacent other set of trimming wheels is installed on the second sliding plate 557.

[0243] The motor 551 drives the rotating rod 552 to rotate, the rotating rod 552 drives the first sliding plate 554 to move along the first sliding rail 555 through the first connecting rod 553, and the rotating rod 552 simultaneously drives the second sliding plate 557 to move along the second sliding rail 558 through the second connecting rod 556, thereby adjusting the spacing between the two adjacent sets of trimming wheels.

[0244] The foregoing has been a sufficient description of the invention to enable one of ordinary skill in the art to make and use the invention. It is understood that the description of the embodiments is merely exemplary and that all changes that do not depart from the true spirit and scope of the invention are intended to be included within the scope of the invention. The scope of the invention is defined by the claims set forth below rather than the description of the embodiments set forth above.

Claims

1. A compatible silicon wafer sorting device, characterized in that, The compatible silicon wafer sorting equipment includes a silicon wafer feeding device, a silicon wafer conveying device, and a silicon wafer detection device; wherein: The silicon wafer feeding device is located at the upstream station of the silicon wafer conveying device, and the silicon wafer feeding device is configured to provide silicon wafers to be sorted to the silicon wafer conveying device; The silicon wafer conveying device includes at least two conveying mechanisms, which are arranged at intervals along the conveying direction of the silicon wafer conveying device, and the output end of the front conveying mechanism is connected to the input end of the rear conveying mechanism; each conveying mechanism includes at least four conveyor belts arranged in parallel at intervals, and at least a first support spacing and two parallel second support spacings are formed between the at least four conveyor belts, such that a set of conveyor belts forming the first support spacing supports the conveying of a whole silicon wafer, and the two sets of conveyor belts forming the second support spacing respectively support the conveying of parallel half silicon wafers and / or whole silicon wafers; The silicon wafer inspection device is arranged along the conveying direction of the silicon wafer conveying device, and the silicon wafer inspection device is configured to inspect the silicon wafers conveyed on the silicon wafer conveying device; Each of the conveying mechanisms also includes a corresponding conveyor belt spacing adjustment mechanism. When each of the conveying mechanisms includes four conveyor belts arranged in parallel intervals, the four conveyor belts are, in order, a first conveyor belt, a second conveyor belt, a third conveyor belt, and a fourth conveyor belt. When the conveying mechanism is conveying a whole silicon wafer, the conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first conveyor belt and the fourth conveyor belt, and use all four conveyor belts to convey the whole silicon wafer; or, the conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first conveyor belt and the fourth conveyor belt, and reduce the height of the second conveyor belt and the third conveyor belt, and use the first conveyor belt and the fourth conveyor belt to jointly convey the whole silicon wafer; When the conveying mechanism conveys parallel half-wafers and / or whole-wafers, the conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first conveyor belt and the second conveyor belt, and the spacing between the third conveyor belt and the fourth conveyor belt, so that the first conveyor belt and the second conveyor belt, and the third conveyor belt and the fourth conveyor belt respectively convey half-wafers and / or whole-wafers in parallel. The compatible silicon wafer sorting equipment also includes a defective wafer rejection mechanism, which includes a flip rejection component; The flipping rejection assembly is located between two conveying mechanisms. The flipping rejection assembly includes at least four flipping conveyor belts arranged in parallel at intervals, a flipping conveyor belt spacing adjustment mechanism, and a second waste box. The beginning and end of the at least four flipping conveyor belts are respectively connected to at least four conveyor belts of the preceding and following conveying mechanisms. The at least four flipping conveyor belts flip downwards with the beginning end as the fulcrum or flip upwards with the end end as the fulcrum. The flipping conveyor belt spacing adjustment mechanism is used to adjust the spacing between the at least four flipping conveyor belts. The second waste box is located below the four flipping conveyor belts and is used to receive defective pieces rejected after the flipping conveyor belts flip.

2. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The silicon wafer feeding device includes a carrier box and a suction cup assembly. A detachable baffle is provided inside the carrier box, which divides the carrier area inside the carrier box into a first carrier area and a second carrier area. The first carrier area and the second carrier area independently carry stacked half silicon wafers. When the detachable baffle is not installed inside the carrier box, the carrier area inside the carrier box carries stacked whole silicon wafers. The suction cup assembly picks up the silicon wafers to be sorted from the carrier box and releases the silicon wafers to be sorted onto the silicon wafer conveying device.

3. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The silicon wafer feeding device includes a basket clamping device and a lifting module. The basket clamping device is movably mounted on the lifting module, and the lifting module controls the lifting of the basket clamping device to dock with the silicon wafer conveying device. The basket clamping device is used to clamp whole flower baskets and half flower baskets of different sizes. The whole flower basket has a first storage bin with one end open. The half flower basket has a second storage bin and a third storage bin with one end open. The second storage bin and the third storage bin are arranged side by side. The basket clamping device includes a clamping part, and the clamping distance of the clamping part is adjustable. By adjusting the clamping distance, the basket clamping device can clamp the whole basket or the half basket respectively.

4. The compatible silicon wafer sorting equipment according to claim 3, characterized in that, The compatible silicon wafer sorting equipment also includes a wafer picking and conveying device, which is located between the silicon wafer feeding device and the silicon wafer conveying device. The wafer picking and conveying device includes at least four telescopic conveyor belts arranged in parallel at intervals and a telescopic conveyor belt spacing adjustment mechanism. The telescopic conveyor belt spacing adjustment mechanism is configured to adjust the spacing between at least four telescopic conveyor belts so that at least four telescopic conveyor belts are connected to the first storage bin of the whole flower basket, and the whole silicon wafer in the first storage bin is taken out one by one. Alternatively, the telescopic conveyor belt spacing adjustment mechanism is configured to adjust the spacing between at least four telescopic conveyor belts to form two symmetrical sets of telescopic conveyor belts that meet the half-wafer spacing requirements. The two sets of telescopic conveyor belts are respectively connected to the second and third storage bins of the half-wafer basket, and the half-wafers of the second and third storage bins are taken out synchronously and sequentially.

5. The compatible silicon wafer sorting equipment according to claim 4, characterized in that, The film taking and conveying device includes four telescopic conveyor belts arranged in parallel at intervals, the four telescopic conveyor belts being, in order, a first telescopic conveyor belt, a second telescopic conveyor belt, a third telescopic conveyor belt, and a fourth telescopic conveyor belt; When the whole silicon wafer is removed, the telescopic conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first telescopic conveyor belt and the fourth telescopic conveyor belt, and use at least two telescopic conveyor belts to remove the whole silicon wafer from the first storage bin one by one. When the half-wafer is removed, the telescopic conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first telescopic conveyor belt and the second telescopic conveyor belt, and the spacing between the third telescopic conveyor belt and the fourth telescopic conveyor belt, so that the first telescopic conveyor belt and the second telescopic conveyor belt are connected to the second storage bin, and the third telescopic conveyor belt and the fourth telescopic conveyor belt are connected to the third storage bin, so as to synchronously and sequentially remove the half-wafers from the second storage bin and the third storage bin.

6. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The first conveyor belt, the second conveyor belt, the third conveyor belt, and the fourth conveyor belt are all driven by a first motor; or the first conveyor belt and the second conveyor belt are driven by a first motor, and the third conveyor belt and the fourth conveyor belt are driven by a second motor. The first conveyor belt, the second conveyor belt, the third conveyor belt, and the fourth conveyor belt are provided with adsorption holes.

7. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The silicon wafer inspection device includes at least one of a size inspection unit, a thickness inspection unit, a microcrack inspection unit, a dirt inspection unit, and a hole inspection unit.

8. The compatible silicon wafer sorting equipment according to claim 7, characterized in that, A first sensing unit is provided at least at one location between the infeed end and the outfeed end of the first conveyor belt and the second conveyor belt, and a second sensing unit is provided at least at one location between the infeed end and the outfeed end of the third conveyor belt and the fourth conveyor belt. When the conveying mechanism is conveying half a silicon wafer, the first sensing unit senses the silicon wafer at its location and transmits the sensing information to the host computer; the second sensing unit senses the silicon wafer at its location and transmits the sensing information to the host computer. The host computer performs calculations based on the sensing information transmitted by the first sensing unit and the second sensing unit to determine whether there is a positional deviation in the parallel transport of the half-wafer or whole-wafer transported by the first conveyor belt and the second conveyor belt, and the half-wafer or whole-wafer transported by the third conveyor belt and the fourth conveyor belt.

9. The compatible silicon wafer sorting equipment according to claim 8, characterized in that, The compatible silicon wafer sorting equipment also includes an alarm device; When the position deviation exceeds a predetermined value, the host computer controls the alarm device to sound an alarm. When the position deviation is less than a predetermined value, the host computer controls the imaging camera of the silicon wafer detection device to adjust the number of line scans and / or adjust the image capture range according to the position deviation.

10. The compatible silicon wafer sorting equipment according to claim 9, characterized in that, The size detection unit includes an area array camera, the shooting range of which is configured to cover two half-wafers of silicon wafers that are transported in parallel by the first conveyor belt and the second conveyor belt, the third conveyor belt and the fourth conveyor belt, respectively, and whose positional deviation is equal to the predetermined value. or, The area array camera is configured to cover two whole silicon wafers that are transported in parallel by the first conveyor belt and the second conveyor belt, the third conveyor belt and the fourth conveyor belt, respectively, with a positional deviation equal to the predetermined value.

11. The compatible silicon wafer sorting equipment according to claim 9, characterized in that, The thickness detection unit includes a mounting plate and two sets of detection components. The two sets of detection components are mounted on the mounting plate, which is provided with a conveying channel. The first conveyor belt, the second conveyor belt, the third conveyor belt, and the fourth conveyor belt pass through the conveying channel. The silicon wafers to be sorted, conveyed by the first conveyor belt, the second conveyor belt, the third conveyor belt, and the fourth conveyor belt, pass through the conveying channel and are detected by the two sets of detection components. The width of the conveying channel is greater than the distance between the first conveyor belt and the fourth conveyor belt when half a silicon wafer is conveyed in parallel by the first conveyor belt and the second conveyor belt, and the third conveyor belt and the fourth conveyor belt; or, The width of the conveying channel is greater than the distance between the first conveyor belt and the fourth conveyor belt when the first conveyor belt and the second conveyor belt, and the third conveyor belt and the fourth conveyor belt convey the whole silicon wafer in parallel.

12. The compatible silicon wafer sorting equipment according to claim 11, characterized in that, The thickness detection unit further includes a first spacing adjustment mechanism, which is connected to the two sets of detection components respectively, and is used to adjust the spacing between the two sets of detection components. The two sets of detection components perform thickness detection on the whole silicon wafer conveyed by the conveying channel; or, the two sets of detection components perform thickness detection on the half silicon wafers conveyed in parallel by the conveying channel.

13. The compatible silicon wafer sorting equipment according to claim 12, characterized in that, Each detection assembly includes at least two detection units and a second spacing adjustment mechanism. The second spacing adjustment mechanism is connected to the two detection units respectively and is used to adjust the spacing between the two detection units.

14. The compatible silicon wafer sorting equipment according to claim 9, characterized in that, The microcrack detection unit, the dirt detection unit, and the hole detection unit all include a strip light source and a line scan camera. The extension direction of the strip light source is perpendicular to the conveying direction of the silicon wafer to be sorted, and the illumination radiation surface of the strip light source is greater than the distance between the first conveyor belt and the fourth conveyor belt when half a silicon wafer is conveyed in parallel by the first conveyor belt and the second conveyor belt, and the third conveyor belt and the fourth conveyor belt. or, The illumination radiation surface of the strip light source is greater than the distance between the first conveyor belt and the fourth conveyor belt when the whole silicon wafer is transported in parallel by the first conveyor belt and the second conveyor belt, and the third conveyor belt and the fourth conveyor belt.

15. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The flipping rejection assembly includes four flipping conveyor belts arranged in parallel at intervals, the four flipping conveyor belts being, in sequence, a first flipping conveyor belt, a second flipping conveyor belt, a third flipping conveyor belt, and a fourth flipping conveyor belt; When the defective wafer to be rejected is a whole silicon wafer, the flip conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first flip conveyor belt and the fourth flip conveyor belt, and use the four flip conveyor belts to flip and reject the defective wafer. When the defective wafers to be rejected are parallel half-wafers and / or whole wafers, the flip conveyor belt spacing adjustment mechanism is configured to adjust the spacing between the first flip conveyor belt and the second flip conveyor belt, and the spacing between the third flip conveyor belt and the fourth flip conveyor belt, respectively using the first flip conveyor belt and the second flip conveyor belt, and the third flip conveyor belt and the fourth flip conveyor belt to flip and reject the defective wafers.

16. The compatible silicon wafer sorting equipment according to claim 15, characterized in that, The first and second flip conveyor belts are flipped by a first drive unit, and the third and fourth flip conveyor belts are flipped by a second drive unit.

17. The compatible silicon wafer sorting equipment according to claim 1, characterized in that, The infeed end and / or the discharge end of the silicon wafer conveying device are equipped with a dynamic clamping and straightening mechanism, which is configured to straighten the whole silicon wafer or the half silicon wafer.

18. The compatible silicon wafer sorting equipment according to claim 17, characterized in that, The dynamic clamping and straightening mechanism includes four sets of straightening wheel groups and a straightening wheel group spacing adjustment mechanism. The four sets of regularizing wheel groups are a first regularizing wheel group, a second regularizing wheel group, a third regularizing wheel group, and a fourth regularizing wheel group arranged at intervals in sequence. The first regularizing wheel group and the second regularizing wheel group are mounted on one regularizing wheel group spacing adjustment mechanism, and the third regularizing wheel group and the fourth regularizing wheel group are mounted on another regularizing wheel group spacing adjustment mechanism. When aligning a silicon wafer, the two alignment wheel groups are configured to adjust the distance between the first alignment wheel group and the fourth alignment wheel group, and to reduce the height of the second alignment wheel group and the third alignment wheel group, using the first alignment wheel group and the fourth alignment wheel group to align the entire silicon wafer. When aligning parallel half-wafers and / or whole-wafers, the two alignment wheel groups are configured to adjust the spacing between the first alignment wheel group and the second alignment wheel group, and the spacing between the third alignment wheel group and the fourth alignment wheel group, respectively; the first alignment wheel group and the second alignment wheel group are used to align one half-wafer or whole-wafer, and the third alignment wheel group and the fourth alignment wheel group are used to align another half-wafer or whole-wafer.

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