A cpga can method

Abstract

The application relates to the field of lead plating, and discloses a CPGA tube shell plating method. According to the method, the internal circuit of CPGA is changed, the bus distribution used for plating is distributed to the detachable CPGA interior, multiple CPGAs are connected together, and unified plating processing can be carried out. The method is simple and easy to implement, can greatly improve the plating efficiency, saves production cost, and after plating is completed, the CPGA is detached to obtain a finished product. The winding plating process of CPGA is improved, winding on the lead is uniform and precise, the "protrusion" formed between the leads by the plating solution is avoided, the plating solution is more uniformly attached, the performance and quality of the processed product are improved, the plating solution is circulated during the plating process, the plating solution in the plating equipment is uniformly mixed, the concentration balance of the plating solution in different distribution areas is maintained, the plating work is more stable, and the plating layer distribution is more uniform.

Description

TECHNICAL FIELD

[0001] The application relates to the field of lead plating, in particular to a CPGA tube shell plating method. BACKGROUND

[0002] The CPGA is short for ceramic pin array package, which is a chip packaging technology widely used in the field of integrated circuits and mainly used for packaging of high-performance processors, digital signal processors and other large-scale integrated circuits.

[0003] In production, in order to protect the pins, the CPGA is subjected to wire winding plating treatment on the outer side to play the roles of wear resistance and corrosion resistance, and the wire winding plating treatment causes wire winding marks to appear on the pins, and for a multi-pin structure, the wire winding plating efficiency of a single product is low, therefore, the CPGA tube shell plating method is proposed to solve the problem. SUMMARY

[0004] 1. Technical problem to be solved

[0005] In view of the problems in the prior art, the purpose of the application is to provide a CPGA tube shell plating method, the internal circuit of the CPGA is changed by design, and the bus for plating is distributed to the CPGA inside which can be detached, a plurality of CPGAs are connected together and can be subjected to unified plating processing, the method is simple and easy to implement, can greatly improve the plating efficiency and save production cost, and after plating is completed, the CPGA is detached to obtain a finished product, the wire winding plating process of the CPGA is improved, the wire winding on the pins is uniform and precise, the "protrusion" formed between the wires by the plating solution is avoided, the plating solution is attached more uniformly, the performance and quality of the processed product are improved, the plating solution is circulated and flows during the plating process, the plating solution in the plating equipment is uniformly mixed, the concentration of the plating solution in different distribution areas is balanced, the plating work is more stable, and the plating layer is more uniformly distributed.

[0006] 2. Technical scheme

[0007] To solve the above problems, the application adopts the following technical scheme.

[0008] A CPGA tube shell plating method, comprising a plating plate and a CPGA, the CPGA adopts a multi-pin structure, a pair of hanging openings are arranged on the side of the plating plate, the internal circuit of the CPGA extends to the side, the surface of the plating plate is provided with array-arranged plating areas, the surface of the plating plate is provided with a connecting bus connecting the plating areas, and the bus corresponds to the circuit of the CPGA.

[0009] By changing the internal circuit of CPGA, the bus distribution for electroplating is used in the detachable CPGA, and multiple CPGAs are connected together to perform unified electroplating processing.

[0010] The specific production steps include:

[0011] S1, cleaning: the CPGA and the wire are put into the cleaning tank, and the alkaline cleaner is used for cleaning to remove the oil stains and oxides on the surface;

[0012] S2, pretreatment: the cleaned CPGA is put into the acid solution for treatment to remove the surface oxides and activate the surface;

[0013] The wire is treated by the polishing equipment, and after removing the oxide layer and dirt, one side is polished smooth and the other side is polished rough, and then washed with clean water;

[0014] S3, winding: the rough side of the wire is wound inward on the pin of the CPGA through the winding equipment, and the adjacent winding turns are attached to each other;

[0015] S4, assembly: the CPGA after winding is installed into the electroplating area of the electroplating plate;

[0016] S5, electroplating: the electroplating plate is put into the electroplating equipment, and the electroplating liquid in the electroplating equipment starts to circulate, and the electroplating is performed by electrolytic deposition to form a uniform metal plating layer on the surface;

[0017] S6, cleaning: the CPGA after electroplating is detached from the electroplating plate and then put into the cleaning tank to remove the residual electroplating liquid and other impurities on the surface of the CPGA by using the cleaning liquid;

[0018] By improving the winding electroplating process of CPGA, the winding on the lead is uniform and precise, avoiding the formation of "protrusions" between the leads by the electroplating liquid, making the electroplating liquid adhere more uniformly, improving the performance and quality of the processed products, and making the electroplating liquid circulate, which can make the electroplating liquid in the electroplating equipment mix uniformly, keep the concentration of the electroplating liquid in different distribution areas balanced, and make the electroplating work more stable and the electroplating layer distribution more uniform.

[0019] Further, the alkaline cleaner is specifically soap water, the cleaning temperature is 60-85℃, the cleaning effect is effectively improved, the acid solution is hydrochloric acid with a concentration of 5-8%, and the treatment temperature is 55-65℃, and the treatment effect is obviously improved.

[0020] Furthermore, the cleaning solution in the cleaning tank is deionized water, and the water temperature is 25-45℃, which enhances the cleaning effect of the electroplating solution and other impurities, and avoids affecting the subsequent processing or use of CPGA.

[0021] Preferably, the electroplating equipment includes a frame with an electroplating tank on top. The electroplating tank is filled with electroplating solution, and the bottom wall of the electroplating tank is arc-shaped. A suspension mechanism is installed on the outside of the opening of the electroplating tank, and an installation plate immersed in the electroplating solution is installed below the suspension mechanism. A circulation device is installed inside the electroplating tank. By making the bottom wall of the electroplating tank arc-shaped, it is not only convenient for the circulation of the electroplating solution, but also avoids the formation of circulation dead zones, ensuring that the concentration of the electroplating solution remains uniform throughout, and the electroplating thickness is more uniform, without ripples (marks at the junction of thick and thin electroplating layers), thus improving the electroplating effect.

[0022] Furthermore, the circulation equipment specifically includes a guide ring assembled inside the electroplating tank. The lower surface of the guide ring is provided with an arc surface corresponding to the inner wall of the electroplating tank, and the upper extension line of the arc surface intersects with the bottom surface of the mounting plate. A circulation component is installed at the bottom of the electroplating tank. The circulation component has a ring-shaped array of water passage holes inside. The water passage holes are arc-shaped, and both ends of the opening are located above the circulation component. A circular collecting groove is provided between the circulation component and the electroplating tank. The collecting groove is located at the intersection of the circulation components. A connecting pipe is rotatably connected inside the collecting groove. Two turbines are installed inside the connecting pipe. An external interface is provided above the connecting pipe. The outer side of the turbines is provided with teeth extending into the external interface. The external interface is rotatably connected inside. There is a drive gear that meshes with the teeth. Above the circulation component is a drive device that engages with the drive gear. The circulation device drives the electroplating solution to circulate. During electroplating, the drive device drives the turbine to rotate, causing the electroplating solution in the connecting pipe to start flowing. The electroplating solution in the electroplating tank enters from one end through the water inlet, is pushed through the connecting pipe, and returns to the electroplating tank from the other end through the water inlet. The outer circulation promotes the uniform distribution of the electroplating solution. As the electroplating solution is sprayed out from the drive device, this jet is guided by the guide ring and impacts the area below the mounting plate. This can push out air bubbles between the leads or windings of the CPGA, and the flowing electroplating solution can make more thorough contact with the CPGA.

[0023] Furthermore, the curvature of the water passage is the same as that of the bottom surface of the electroplating tank, and the opening edge of the water passage is in contact with the bottom surface of the electroplating tank, which reduces the resistance encountered by the electroplating solution during the flow process and improves the circulation and mixing effect of the electroplating solution.

[0024] Furthermore, the water passages adopt a bifurcated design. The number of water passages above the circulation component is an integer multiple of the number of water passages inside the collection tank. Since there is a diameter difference between the collection tank and the circulation component, the bifurcated design of the water passages allows for a wider and more uniform spraying range of the electroplating solution.

[0025] Furthermore, a central shaft is rotatably connected between the connecting pipe and the inner wall of the circulation component. Both ends of the connecting pipe are in contact with the inner wall of the collecting tank, and the inner diameter of the connecting pipe is the same as the inner diameter of the water passage hole. The rotation state of the connecting pipe is more stable, and the diversion effect of the electroplating solution is better.

[0026] Furthermore, the top wall of the collecting tank is provided with pushing grooves arranged in a ring array around the drive gear. A receiving groove is provided on the surface of one tooth on the outside of the turbine, and a pushing block corresponding to the pushing groove is slidably connected inside the receiving groove. A return spring is fixedly connected to the bottom end of the pushing block. The side of the pushing block adopts an inclined design. Through the cooperation of the pushing groove and the pushing block, as the turbine rotates with the drive gear through the teeth, the pushing block will probe into the pushing groove at a certain moment. The force between the two will cause the connecting pipe to deflect around the drive device. Then the pushing block is squeezed into the receiving groove to wait for the next probe. The connecting pipe also rotates slowly with the rotation of the turbine, thereby connecting to the water passages in different directions. This also allows the mounting plate to be impacted by the electroplating solution from different directions, enhancing the electroplating effect.

[0027] Furthermore, there are two turbines, which are symmetrically distributed based on the drive device. The blades inside the two turbines are oriented in opposite directions. The two turbines can enhance the driving effect on the electroplating solution, allowing the electroplating solution to circulate and mix more fully. Pushing two push blocks that are separated on both sides of the drive device can make the rotation of the connecting pipe more stable.

[0028] 3. Beneficial effects

[0029] Compared with the prior art, the advantages of this invention are:

[0030] 1. This solution modifies the internal circuitry of the CPGA and distributes the electroplating control lines to the inside of the detachable CPGA. Multiple CPGAs are connected together for unified electroplating. This method is simple and easy to implement, significantly improves electroplating efficiency, saves production costs, and the finished product can be obtained by simply removing the CPGA after electroplating.

[0031] 2. By improving the wire-winding electroplating process of CPGA, the wire is wound evenly and precisely on the lead wire, avoiding the formation of "bumps" between the lead wires by the electroplating solution. This allows the electroplating solution to adhere more evenly, improving the performance and quality of the processed products. Furthermore, the circulation of the electroplating solution allows for uniform mixing of the solution within the electroplating equipment, maintaining the concentration balance of the electroplating solution in different distribution areas, resulting in more stable electroplating operations and a more uniform distribution of the electroplated layer.

[0032] 3. By making the bottom wall of the electroplating tank arc-shaped, it not only facilitates the circulation of the electroplating solution but also avoids dead zones in the circulation, ensuring that the concentration of the electroplating solution remains uniform throughout. This also results in a more uniform electroplating thickness, eliminating ripples (marks at the junction of thick and thin plating layers) and improving the electroplating effect.

[0033] 4. The electroplating solution is circulated by a circulation device. During electroplating, the drive device rotates the turbine, causing the electroplating solution in the connecting pipe to start flowing. The electroplating solution in the electroplating tank enters from one end through the water inlet, is pushed through the connecting pipe, and returns to the electroplating tank from the other end through the water inlet. The outer circulation promotes the uniform distribution of the electroplating solution. As the electroplating solution is sprayed out from the drive device, this jet is guided by the guide ring and impacts the area below the mounting plate. This can push out air bubbles between the CPGA leads or windings, and the flowing electroplating solution can make more thorough contact with the CPGA.

[0034] 5. Through the cooperation of the push slot and the push block, as the turbine rotates with the drive gear through the teeth, the push block will probe into the push slot at a certain moment. The force between the two will cause the connecting pipe to deflect around the drive device. Then the push block is squeezed into the receiving slot to wait for the next probe. The connecting pipe also rotates slowly with the rotation of the turbine, thereby connecting to the water holes in different directions. This also allows the mounting plate to be impacted by the electroplating solution from different directions, enhancing the electroplating effect.

[0035] 6. There are two turbines, which are symmetrically distributed based on the drive device. The blades inside the two turbines are in opposite directions. The two turbines can enhance the driving effect on the electroplating solution, allowing the electroplating solution to circulate and mix more fully. Pushing two push blocks that are separated on both sides of the drive device can make the rotation of the connecting pipe more stable. Attached Figure Description

[0036] Figure 1 This is a view of the electroplated plate surface of the present invention;

[0037] Figure 2 This is a single-room illustration of the CPGA of the present invention;

[0038] Figure 3 This is a display diagram of the stand for the present invention;

[0039] Figure 4 This is a top view of the disassembled stand of the present invention;

[0040] Figure 5 This is a lower view of the disassembled stand of the present invention;

[0041] Figure 6 This is a diagram showing the interior of the stand of the present invention;

[0042] Figure 7 This is a top view of the disassembled circulation device of the present invention;

[0043] Figure 8 The following is a disassembled view of the circulation device of the present invention;

[0044] Figure 9 This is a diagram showing the interior of the connecting pipe of the present invention;

[0045] Figure 10 This is a diagram showing the deflection state of the connecting pipe in this invention.

[0046] Explanation of the labels in the diagram:

[0047] 1. Stand; 2. Electroplating tank; 3. Mounting plate; 4. Circulation equipment; 41. Guide ring; 42. Circulation component; 43. Water passage hole; 44. Collection tank; 45. Connecting pipe; 451. Central shaft; 452. Turbine; 453. Gear; 46. External interface; 47. Drive gear; 48. Drive equipment; 49. Pushing groove; 410. Pushing block. Detailed Implementation

[0048] This embodiment will be described clearly and completely with reference to the accompanying drawings, making the purpose, technical solution, and beneficial effects of the embodiments of this disclosure clearer. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0049] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the conventional meaning as understood by those skilled in the art. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "above," "below," "inner," and "outer" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0050] Example 1:

[0051] Please see Figures 1-2 A method for electroplating CPGA tube shells includes an electroplating plate and a CPGA. The CPGA adopts a multi-lead structure. A pair of hanging ports are provided on the side of the electroplating plate. The internal circuit of the CPGA extends to the side. An array of electroplating areas is provided on the surface of the electroplating plate. A connecting line connecting each electroplating area is laid on the surface of the electroplating plate, and the connecting line corresponds to the CPGA circuit.

[0052] The specific production steps include:

[0053] S1. Cleaning: Place the CPGA and the winding into a cleaning tank and clean with an alkaline cleaner, specifically soapy water, at a cleaning temperature of 60℃. This will remove surface oil and oxides.

[0054] S2. Pretreatment: The cleaned CPGA is placed in an acidic solution, which is 5% hydrochloric acid, and the treatment temperature is 55℃. This can remove surface oxides and activate the surface.

[0055] The wire is treated with polishing equipment to remove the oxide layer and dirt, then one side is polished smooth and the other side is polished rough, and then rinsed with clean water.

[0056] S3, Winding: The rough side of the wire is wound inward onto the pin of the CPGA using a winding device. During the winding process, adjacent winding loops are in close contact with each other.

[0057] S4. Assembly: Install the wound CPGA into the electroplating area of ​​the electroplating plate;

[0058] S5. Electroplating: The electroplating plate is placed in the electroplating equipment, and the electroplating solution in the electroplating equipment begins to circulate. Electroplating is carried out by electrolytic deposition to form a uniform metal coating on its surface.

[0059] S6. Cleaning: Remove the electroplated CPGA from the electroplating plate and put it into the cleaning tank. Use the cleaning solution to remove the residual electroplating solution and other impurities on the surface of the CPGA. The cleaning solution in the cleaning tank is deionized water and the water temperature is 25℃.

[0060] Example 2:

[0061] Please see Figures 1-2 Please see Figures 1-2 A method for electroplating CPGA tube shells includes an electroplating plate and a CPGA. The CPGA adopts a multi-lead structure. A pair of hanging ports are provided on the side of the electroplating plate. The internal circuit of the CPGA extends to the side. An array of electroplating areas is provided on the surface of the electroplating plate. A connecting line connecting each electroplating area is laid on the surface of the electroplating plate, and the connecting line corresponds to the CPGA circuit.

[0062] The specific production steps include:

[0063] S1. Cleaning: Place the CPGA and the winding into a cleaning tank and clean with an alkaline cleaner, specifically soapy water, at a cleaning temperature of 85℃. This will remove surface oil and oxides.

[0064] S2. Pretreatment: The cleaned CPGA is placed in an acidic solution, which is 8% hydrochloric acid, and the treatment temperature is 65℃. This can remove surface oxides and activate the surface.

[0065] The wire is treated with polishing equipment to remove the oxide layer and dirt, then one side is polished smooth and the other side is polished rough, and then rinsed with clean water.

[0066] S3, Winding: The rough side of the wire is wound inward onto the pin of the CPGA using a winding device. During the winding process, adjacent winding loops are in close contact with each other.

[0067] S4. Assembly: Install the wound CPGA into the electroplating area of ​​the electroplating plate;

[0068] S5. Electroplating: The electroplating plate is placed in the electroplating equipment, and the electroplating solution in the electroplating equipment begins to circulate. Electroplating is carried out by electrolytic deposition to form a uniform metal coating on its surface.

[0069] S6. Cleaning: After electroplating, the CPGA is removed from the electroplating plate and then placed into a cleaning tank. The cleaning solution is used to remove the residual electroplating solution and other impurities on the surface of the CPGA. The cleaning solution in the cleaning tank is deionized water and the water temperature is 45℃.

[0070] Example 3:

[0071] Please see Figures 3-10The electroplating equipment includes a frame 1, with an electroplating tank 2 located above the frame 1. The electroplating tank 2 is filled with electroplating solution, and its bottom wall is arc-shaped. A suspension mechanism is installed on the outside of the opening of the electroplating tank 2. The electroplating plate is specifically a mounting plate 3, which is immersed in the electroplating solution. A circulation device 4 is installed inside the electroplating tank 2. The circulation device 4 specifically includes a guide ring 41 assembled inside the electroplating tank 2. The lower surface of the guide ring 41 is arc-shaped, corresponding to the inner wall of the electroplating tank 2, and the upper extension line of the arc-shaped surface intersects the bottom surface of the mounting plate 3. A circulation component 42 is installed at the bottom of the electroplating tank 2. The circulation component 42 has a ring-shaped array of water passage holes 43 inside, which are arc-shaped and have openings at both ends located above the circulation component 42. The curvature of the water passage 43 is the same as that of the bottom surface of the electroplating tank 2, and the opening edge of the water passage 43 is in contact with the bottom surface of the electroplating tank 2, which reduces the resistance encountered during the flow of the electroplating solution and improves the circulation and mixing effect of the electroplating solution. A circular collecting groove 44 is provided between the circulating component 42 and the electroplating tank 2. The collecting groove 44 is located at the intersection of the circulating component 42. The inside of the collecting groove 44 is rotatably connected to the connecting pipe 45. Two turbines 452 are installed inside the connecting pipe 45. An external interface 46 is provided above the connecting pipe 45. Teeth 453 extending into the external interface 46 are provided on the outside of the turbines 452. A drive gear 47 that meshes with the teeth 453 is rotatably connected inside the external interface 46. A drive device 48 that engages with the drive gear 47 is mounted above the circulating component 42.

[0072] During electroplating, the drive device 48 starts, and the power is transmitted to the drive gear 47. The drive gear 47 drives the turbine 452 to rotate through the teeth 453. The rotation of the turbine 452 pushes the electroplating solution in the connecting pipe 45. The electroplating solution in the connecting pipe 45 begins to affect the electroplating solution in the water passage 43. The electroplating solution in the electroplating tank 2 enters from one end water passage 43, is pushed by the connecting pipe 45, and flows out from the other end water passage 43 back into the electroplating tank 2. At the same time, as the electroplating solution is sprayed out from the drive device 48, this torrent first flows along the bottom wall of the electroplating tank 2, and then is guided by the guide ring 41, impacting the area below the mounting plate 3, which can push out the air bubbles between the leads or windings of the CPGA.

[0073] The water passage 43 adopts a bifurcated design. The number of openings of the water passage 43 above the circulation component 42 is an integer multiple of the number of openings of the water passage 43 inside the collection tank 44. Since there is a diameter difference between the collection tank 44 and the circulation component 42, the bifurcated design of the water passage 43 allows the electroplating solution to be sprayed over a wider and more uniform range. The connecting pipe 45 is rotatably connected to the inner wall of the circulation component 42 by a central shaft 451. Both ends of the connecting pipe 45 are in contact with the inner wall of the collection tank 44, and the inner diameter of the connecting pipe 45 is the same as the inner diameter of the water passage 43. The rotation state of the connecting pipe 45 is more stable, and the diversion effect of the electroplating solution is better.

[0074] The top wall of the collecting groove 44 is provided with pushing grooves 49 arranged in a ring array around the drive gear 47. A receiving groove is provided on the surface of a tooth 453 on the outer side of the turbine 452, and a pushing block 410 corresponding to the pushing groove 49 is slidably connected inside the receiving groove. A return spring is fixedly connected to the bottom end of the pushing block 410, and the side of the pushing block 410 is designed to be inclined.

[0075] As the turbine 452 rotates with the drive gear 47 via the teeth 453, when the push block 410 rotates to the outer interface 46, the reset spring pushes the push block 410 out of the receiving groove and into the push groove 49. As the push block 410 rotates with the turbine 452, it will generate a force between itself and the inner wall of the push groove 49. The force between the two will cause the connecting pipe 45 to deflect around the drive device 48. After the deflection is completed, the push block 410 is squeezed into the receiving groove to wait for the next protrusion. The connecting pipe 45 also rotates slowly with the rotation of the turbine 452, thereby connecting with the water passage holes 43 in different directions.

[0076] There are two turbines 452, and the two turbines 452 are symmetrically distributed based on the drive device 48. The blades in the two turbines 452 are in opposite directions. The two turbines 452 can enhance the driving effect on the electroplating solution, allowing the electroplating solution to circulate and mix more fully. Pushing two push blocks 410 that are separated on both sides of the drive device 48 can make the rotation of the connecting pipe 45 more stable.

[0077] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. A method for electroplating CPGA tube shells, comprising an electroplating plate and CPGA, wherein the CPGA adopts a multi-lead structure, and a pair of hanging slots are provided on the side of the electroplating plate, characterized in that, The internal circuit of the CPGA extends to the side, and the surface of the electroplating plate is provided with an array of electroplating areas. The surface of the electroplating plate is covered with connecting lines that connect the various electroplating areas. The specific production steps include: S1. Cleaning: Place the CPGA and the winding into a cleaning tank and clean with an alkaline cleaner to remove surface oil and oxides. S2. Pretreatment: The cleaned CPGA is placed in an acidic solution for treatment; The wire is treated with polishing equipment to remove the oxide layer and dirt, then one side is polished smooth and the other side is polished rough, and then rinsed with clean water. S3, Winding: The rough side of the wire is wound inward onto the pin of the CPGA using a winding device. During the winding process, adjacent winding loops are in close contact with each other. S4. Assembly: Install the wound CPGA into the electroplating area of ​​the electroplating plate; S5. Electroplating: The electroplating plate is placed in the electroplating equipment, and the electroplating solution in the electroplating equipment begins to circulate. Electroplating is carried out by electrolytic deposition to form a uniform metal coating on its surface. S6. Cleaning: Remove the electroplated CPGA from the electroplating plate and put it into the cleaning tank to remove the residual electroplating solution and other impurities on the surface of the CPGA using the cleaning solution. The electroplating equipment includes a frame (1), an electroplating tank (2) is provided above the frame (1), the electroplating tank (2) is filled with electroplating solution, the bottom wall of the electroplating tank (2) is arc-shaped, a suspension mechanism is provided on the outside of the opening of the electroplating tank (2), the electroplating plate is specifically a mounting plate (3), and the mounting plate (3) is immersed in the electroplating solution, and a circulation device (4) is provided inside the electroplating tank (2); The circulation device (4) specifically includes a guide ring (41) assembled inside the electroplating tank (2). The lower surface of the guide ring (41) is provided with an arc surface corresponding to the inner wall of the electroplating tank (2), and the upper extension line of the arc surface intersects with the bottom surface of the mounting plate (3). A circulation component (42) is installed at the bottom of the electroplating tank (2). The circulation component (42) has a ring array of water passage holes (43) inside. The water passage holes (43) are arc-shaped, and both ends of the water passage holes are located above the circulation component (42). A circular collection groove (44) is provided between the circulation component (42) and the electroplating tank (2). The collecting groove (44) is located at the intersection of the circulation component (42). The collecting groove (44) is rotatably connected to the connecting pipe (45). The connecting pipe (45) is equipped with a turbine (452). An external interface (46) is provided on the top of the connecting pipe (45). The outer side of the turbine (452) is provided with teeth (453) extending into the external interface (46). The external interface (46) is rotatably connected to a drive gear (47) that meshes with the teeth (453). A drive device (48) that engages with the drive gear (47) is mounted on the top of the circulation component (42).

2. The CPGA tube shell electroplating method according to claim 1, characterized in that: The alkaline cleaning agent is specifically soapy water, with a cleaning temperature of 60-85℃, and the acidic solution is hydrochloric acid with a concentration of 5-8%, with a treatment temperature of 55-65℃.

3. The CPGA tube shell electroplating method according to claim 1, characterized in that: The cleaning solution in the cleaning tank is deionized water, and the water temperature is 25-45℃.

4. The CPGA tube shell electroplating method according to claim 1, characterized in that: The curvature of the water passage (43) is the same as the curvature of the bottom surface of the electroplating tank (2), and the opening edge of the water passage (43) is in contact with the bottom surface of the electroplating tank (2).

5. The CPGA tube shell electroplating method according to claim 1, characterized in that: The water passage (43) adopts a bifurcated design, and the number of openings of the water passage (43) above the circulation component (42) is an integer multiple of the number of openings of the water passage (43) inside the collection tank (44).

6. The CPGA tube shell electroplating method according to claim 1, characterized in that: A central shaft (451) is rotatably connected between the inner wall of the connecting pipe (45) and the circulation component (42). Both ends of the connecting pipe (45) are in contact with the inner wall of the collecting trough (44), and the inner diameter of the connecting pipe (45) is the same as the inner diameter of the water passage (43).

7. The CPGA tube shell electroplating method according to claim 1, characterized in that: The top wall of the collecting groove (44) is provided with pushing grooves (49) arranged in a ring array around the drive gear (47). A receiving groove is provided on the surface of a tooth (453) on the outer side of the turbine (452). A pushing block (410) corresponding to the pushing groove (49) is slidably connected inside the receiving groove. A return spring is fixedly connected to the bottom end of the pushing block (410). The side of the pushing block (410) is designed with an inclination.

8. The CPGA tube shell electroplating method according to claim 7, characterized in that: There are two turbines (452), and the two turbines (452) are symmetrically distributed based on the drive device (48), and the blades in the two turbines (452) are oriented in opposite directions.

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