Conveying device and film forming device

Abstract

The present application provides a kind of conveying device used in series type film forming device, even in the case where there is direction conversion in conveying path, the technology that can make conveying body move is provided. The conveying device for conveying conveying body is provided with a plurality of conveying rollers for conveying conveying body, a driving mechanism for driving a plurality of conveying rollers, a rotating table provided with a plurality of conveying rollers and driving mechanism, and a rotating mechanism for rotating the rotating table to switch the state of a plurality of conveying rollers arranged along the first direction and the state of a plurality of conveying rollers arranged along the second direction intersecting the first direction, and the driving mechanism is arranged in the atmosphere box inside the rotating table.

Description

TECHNICAL FIELD

[0001] The present application relates to a conveyance device and a film forming device using the same. BACKGROUND

[0002] Flat panel display devices such as organic EL display devices and liquid crystal display devices are used. For example, an organic EL display device includes an organic EL element of a multilayer structure that has a functional layer including an organic material layer that emits light, i.e., a light emitting layer, formed between two facing electrodes. The functional layer and the electrode layer of the organic EL element are formed by causing a film forming material to adhere to a substrate such as glass via a mask in a chamber of a film forming device. As an example of a film forming device, there is a tandem type film forming device. The tandem type film forming device is a device in which a plurality of chambers are connected in series under vacuum, and a substrate is moved between the chambers while being film formed. By providing a plurality of film forming chambers in the tandem type film forming device, film formation can be sequentially performed on the substrate, and an organic EL element of a multilayer structure can be produced.

[0003] In Patent Literature 1 (Japanese Patent Application Publication No. 2020-094263), a film forming device having a tandem type structure is disclosed. The device of Patent Literature 1 conveys a mask, a substrate holder, and the like, which are conveyance bodies, by conveyance rollers.

[0004]

Prior Art Documents

[0005]

Patent Literature

[0006]

Patent Literature 1

[0007]

Problems to be Solved by the Invention

[0008] However, in Patent Literature 1, a specific example of how to move the conveyance bodies when a direction change of the conveyance bodies occurs in a conveyance path is not disclosed.

[0009] The present application has been made in view of the above problems, and an object thereof is to provide a technology for moving conveyance bodies even when a direction change occurs in a conveyance path in a conveyance device used in a tandem type film forming device.

[0010]

Means of Solving the Problems

[0011] The present application adopts the following structure. That is,

[0012] A conveyance device that conveys a conveyance body, characterized by comprising:

[0013] a plurality of conveyance rollers that convey the conveyance body;

[0014] a drive mechanism that drives the plurality of conveyance rollers;

[0015] a rotation table provided with the plurality of conveyance rollers and the drive mechanism; and

[0016] a rotation mechanism that rotates the rotation table to switch between a state in which the plurality of conveyance rollers are arranged in a first direction and a state in which the plurality of conveyance rollers are arranged in a second direction that intersects the first direction,

[0017] the drive mechanism is disposed inside an atmosphere tank provided in the rotation table.

[0018] The present application also employs the following structure. That is,

[0019] A film formation apparatus including a conveyance apparatus that conveys a substrate carrier that holds a substrate and a mask, and a film formation source that forms a film on the substrate via the mask, the film formation apparatus conveying the substrate carrier and the mask inside a plurality of chambers by the conveyance apparatus, characterized in that

[0020] the plurality of chambers include a first rotation chamber that rotates the mask of the substrate carrier conveyed in a first direction in a first rotation direction to convey it out, and a second rotation chamber that rotates the mask of the substrate carrier conveyed out from the first rotation chamber in a second rotation direction opposite to the first rotation direction to convey it out in a second direction different from the first direction.

[0021]

Effects of Invention

[0022] According to the present application, it is possible to provide a technology for moving a conveyance body in a conveyance apparatus used in a series-type film formation apparatus, even when there is a direction change in a conveyance path. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a schematic plan view showing the structure of a film formation apparatus.

[0024] Figure 2 is a view showing the support of a substrate by a substrate carrier.

[0025] Figure 3 is a view showing the mounting of a substrate carrier and a mask.

[0026] Figure 4 is a schematic sectional view showing the structure of a chamber having a rotation table.

[0027] Figure 5 is a schematic plan view showing the structure of a chamber having a rotation table.

[0028] Figure 6 is a schematic plan view showing the structure of the chamber after rotation of the rotation table.

[0029] Figure 7 is a coordinate graph illustrating rotation speed control of the rotation table.

[0030] Figure 8 is a diagram illustrating movement and rotation of the carrier between chambers.

[0031] Figure 9 is another diagram illustrating movement and rotation of the carrier between chambers.

[0032] Figure 10 is a sectional view illustrating carrying-in and carrying-out of the substrate carrier and the mask.

[0033] Figure 11 is a continuation of the sectional view illustrating carrying-in and carrying-out of the substrate carrier and the mask.

[0034] Figure 12 is a continuation of the sectional view illustrating carrying-in and carrying-out of the substrate carrier and the mask.

[0035] Figure 13 is a sectional view showing the internal structure of the atmosphere tank.

[0036] Figure 14 is a diagram illustrating the structure of the electronic device.

[0037]

BRIEF DESCRIPTION OF DRAWINGS

[0038] 201: atmosphere tank, 210: mask carrying roller, 241: rotation driving section, 245: rotation table, 280: driving mechanism DETAILED DESCRIPTION

[0039] Hereinafter, the embodiments of the present application will be described in detail. However, the following embodiments only show the preferred structures of the present application by way of example, and the scope of the present application is not limited to these structures. Also, the hardware structure and software structure of the device, the processing flow, the manufacturing conditions, the size, the material, the shape, and the like in the following description are not intended to limit the scope of the present application only to them, unless otherwise specifically described.

[0040] The present application is suitable for use in a film forming apparatus in which a film of a film forming material is formed on a surface of a substrate or the like by evaporation or sputtering, when a direction of a conveyance body conveyed by a conveyance roller is switched or a conveyance path of the conveyance body is branched. The present application is also grasped as a conveyance apparatus, a conveyance method, a control method of a conveyance apparatus, a film forming apparatus, a film forming method, a control method of a film forming apparatus, a manufacturing apparatus of an electronic device or a control method thereof, a manufacturing method of an electronic device. The present application is also grasped as a program for causing a computer to execute a film forming method or a control method, a storage medium in which the program is stored. The storage medium can be a non-transitory storage medium which can be read by a computer.

[0041] The present application can be preferably applied to a film forming apparatus in which a film of a desired pattern is formed on a surface of a substrate to be formed as a film via a mask. As a material of the substrate, any material such as glass, resin, metal, silicon, or the like can be used. As a film forming material, any material such as an organic material, an inorganic material (metal, metal oxide), or the like can be used. Note that, in the following description, "substrate" includes a structure in which film formation has been performed one or more times on a surface of a substrate material. The present application is typically applied to a manufacturing apparatus of an electronic device or an optical member. It is particularly suitable for an organic EL display having an organic EL element, an organic EL display apparatus using the organic EL display, or the like. The present application can also be used for a thin film solar cell or an organic CMOS image sensor. However, the application target of the present application is not limited to this, and the present application can be widely used in an apparatus in which an atmospheric tank is provided in a vacuum chamber.

[0042] [Apparatus structure]

[0043] (Film forming apparatus)

[0044] Figure 1 is a schematic plan view showing a structure of a series type film forming apparatus 500 for manufacturing an organic EL display according to an embodiment. An organic EL display is generally manufactured via a circuit element forming process in which a circuit element is formed, an organic light emitting element forming process in which an organic light emitting element is formed on a substrate, and a sealing process in which a protective layer is formed on the formed organic light emitting layer. The film forming apparatus 500 according to the embodiment mainly performs the organic light emitting element forming process.

[0045] The film formation apparatus 500 has the substrate carrying-in chamber 501, the carrier carrying-in chamber 502, the merging chamber 503, the passage chamber 504, the inversion chamber 505, the mask carrying-in chamber 510, the alignment chamber 511, the buffer chamber 512, the film formation chamber 520, the buffer chamber 521, the rotation chamber 522, the buffer chamber 523, the rotation chamber 524, the buffer chamber 525, the film formation chamber 526, the buffer chamber 530, the carrier separation chamber 531, the carrier separation chamber 532, the mask carrying-out chamber 533, the mask carrying-in chamber 534, the mask handover chamber 535, the inversion chamber 540, the passage chamber 541, the substrate separation chamber 542, the carrier handover chamber 543, the carrier carrying-out chamber 544, and the substrate carrying-out chamber 545.

[0046] If impurities exist in the chamber space at the time of film formation, the possibility of film formation failure increases, and a panel defect can occur. Therefore, at the time of film formation, the inside of the chamber of the film formation apparatus is exhausted to be vacuum. Therefore, each chamber is configured as a vacuum chamber. Also, in order to make the film formation accuracy good, it is preferable that the plurality of chambers of the film formation apparatus be vacuum-connected from the beginning to the end, and the substrate moves between the chambers which are exhausted to be vacuum. Note that the vacuum in the embodiment means a state in which a space is filled with a gas having a lower pressure than the normal atmospheric pressure (1013 hPa).

[0047] In each buffer chamber 512, 521, 523, 525, 530, travel adjustment and speed adjustment at the time of film formation using a plurality of substrate carriers C are performed. The mask handover chamber 535 can have a function as a storage for storing masks M when a plurality of masks M are used, and a function of speed adjustment of the masks M. Thereby, a mask M corresponding to desired film formation can be selected. The carrier handover chamber 543 can have a function as a storage for storing substrate carriers C when a plurality of substrate carriers C are used, and a function of speed adjustment of the substrate carriers C. By the above-described speed adjustment, the substrate carriers C can be carried at a predetermined interval.

[0048] The film formation apparatus 500 further has a carrying mechanism (described later) which carries the substrate carrier C. The substrate carrier C is carried along a predetermined carrying path passing through each vacuum chamber provided in the film formation apparatus 500. That is, the substrate carrier C is carried into the carrier carrying-in chamber 502 as shown by the solid arrow, and is merged with the substrate S in the merging chamber 503. In the merging chamber 503, the substrate carrier C becomes in a state in which the substrate holding surface thereof faces upward in the vertical direction. The substrate S is mounted to the substrate carrier C in a state in which the film formation surface thereof faces upward in the vertical direction.

[0049] Next, the substrate carrier C holding the substrates S passes through the passage chamber 504, and is flipped upside down in the flipping chamber 505. The flipping chamber 505 is provided with a flipping mechanism that flips the substrate-holding surface of the substrate carrier C upside down in the vertical direction. As the flipping mechanism, a known mechanism that changes the posture (orientation) of the substrate carrier C by gripping the substrate carrier C or the like can be used. In the flipping chamber 505, the substrate carrier C is flipped for each substrate S, and becomes in a state in which the film-formation surface of the substrate S faces the vertical direction downward.

[0050] The substrate carrier C merges with the mask M in the mask loading chamber 510, and is aligned with the mask M in the alignment chamber 511. The alignment chamber 511 is provided with an alignment device. The alignment device positionally aligns the substrate carrier C (and the substrates S held thereby) with the mask M, and places the substrate carrier C (substrates S) on the mask M.

[0051] Next, the substrate carrier C holding the substrates S and positionally aligned with the mask M passes through the buffer chamber 512, receives film formation on the substrates S in the film formation chambers 520 (520a to 520d), is rotated by 90 degrees in the rotation chamber 522 (first rotation chamber), passes through the buffer chamber 523, is rotated by 90 degrees in the rotation chamber 524 (second rotation chamber), receives film formation on the substrates S in the film formation chambers 526 (526a to 526d), and passes through the buffer chamber 530. The film formation chambers 520, 526 are provided with evaporation sources (film formation mechanisms) that emit the evaporation material toward the vertical direction upward. In the film formation chambers 520, 526, the substrates S held by the substrate carrier C in a state in which the film-formation surface faces the vertical direction downward are passed over the evaporation sources, whereby the film-formation surface except for the portion shielded by the mask M is formed.

[0052] Next, the substrate carrier C is separated from the mask M during conveyance in the carrier separation chamber 531 (first separation chamber) and the carrier separation chamber 532 (second separation chamber). The processing here is described later. Next, the substrate carrier C holding the substrates S is flipped upside down in the flipping chamber 540, passes through the passage chamber 541, and separates the substrates S in the substrate separation chamber 542. Next, the substrate carrier C is carried out to the outside of the film formation device from the carrier carry-out chamber 544, or is reused in film formation via the carrier handover chamber 543.

[0053] As shown by the dotted arrows, the substrates S are carried in from the substrate carry-in chamber 501, and are held by the substrate carrier C in the merging chamber 503. Then, after moving together with the substrate carrier C, the substrates S are separated from the substrate carrier C in the substrate separation chamber 542, and are carried out to the outside of the film formation device from the substrate carry-out chamber 545.

[0054] The film formation apparatus 500 also has a conveyance mechanism (described later) that conveys the mask M. As shown by the dotted arrows, the mask M is carried in from the mask carry-in chamber 534, passes through the carrier separation chamber 532 and the mask exchange chamber 535, and is combined with the substrate carrier C in the mask loading chamber 510. Then, after moving while the substrate carrier C is placed, the mask M is separated from the substrate carrier C in the carrier separation chamber 531 and carried out from the mask carry-out chamber 533 to the outside of the film formation apparatus, or is separated from the substrate carrier C in the carrier separation chamber 532 and reused in film formation via the mask exchange chamber 535.

[0055] The control section 550 controls various actions of the film formation apparatus 500. The control section 550 transmits and receives information with the structures of the respective chambers, the conveyance mechanism that conveys the conveyance bodies (substrates, substrate carriers, laminates of substrate carriers and substrates, masks, etc.) via control lines or wireless communication that are not shown. As the control section 550, an information processing device (for example, a computer, a processing circuit) having a processor, a memory, a communication mechanism, etc. can be used. Note that the control section 550 can be a structure in which a plurality of information processing devices act in cooperation. For example, a control section can be provided for each chamber.

[0056] The conveyance rollers that are the conveyance mechanism are provided in multiple numbers on both sides of the conveyance path in the conveyance direction, and are rotated by a driving mechanism such as an AC servo motor that is a driving mechanism, whereby the substrate carrier C and the mask M are conveyed. In order to convey the mask M and the substrate carrier C separately through the chambers, mask conveyance rollers and second substrate carrier conveyance rollers can be provided. In this case, the mask conveyance rollers and the second substrate carrier conveyance rollers are provided at different heights, and in the present embodiment, the second substrate carrier conveyance rollers are provided at a higher position.

[0057] Note that the present application is not limited to the upward deposition structure (a structure in which the film formation surface of the substrate S faces the lower side in the vertical direction at the time of film formation) described above. It can also be a downward deposition structure (a structure in which the film formation surface of the substrate S faces the upper side in the vertical direction at the time of film formation) or a lateral deposition structure (a structure in which the substrate S is vertically erected at the time of film formation).

[0058] (Substrate Carrier and Substrate)

[0059] The structure of the substrate carrier C and the holding of the substrate S will be described. Figure 2 (a) is a schematic plan view of the substrate carrier C. The substrate carrier C is a structure that is a substantially rectangular flat plate in plan view. Here, in the film formation apparatus, a plurality of carrier conveyance rollers are provided on both sides of the carrier conveyance path. At the time of conveyance of the substrate carrier C, opposite two of the four edges of the substrate carrier C in the conveyance direction are supported by the carrier conveyance rollers. The substrate carrier C is moved in the conveyance direction by rotation of the carrier conveyance rollers.

[0060] The substrate carrier C has a carrier panel 401 which is a flat plate-like member in a rectangular shape, a plurality of chuck members 402, and a plurality of support bodies 403. The substrate S is held so as to oppose a holding surface 405 of the carrier panel 401 of the substrate carrier C. In the drawing, for the sake of simplicity, a broken line corresponding to the outer edge of the substrate S when the substrate S is held is shown. The area inside the broken line is also referred to as a substrate holding portion, and the area outside the broken line is also referred to as a peripheral portion. The substrate holding portion and the peripheral portion are defined for the sake of simplicity, and there can be no difference in structure between the two. The carrier panel 401 is a plate-like member composed of metal or the like, and has a certain degree of rigidity (at least higher rigidity than the substrate S). The carrier panel 401 holds the substrate S by the holding surface 405, thereby suppressing deflection of the substrate S.

[0061] The chuck member 402 is a protrusion having a chuck surface which chucks the substrate S. The chuck surface is composed of an adhesive member (PSC: Physical Sticky Chucking), and holds the substrate S by physical adhesion or suction force. The plurality of chuck members 402 respectively chuck the substrate S, whereby the substrate S is held along the holding surface 405 of the carrier panel 401. The plurality of chuck members 402 are respectively arranged so that the chuck surfaces protrude from the holding surface 405 of the carrier panel 401 by a prescribed distance.

[0062] The chuck member 402 is preferably arranged in accordance with the shape of the mask M, and more preferably is arranged so as to correspond to a boundary portion (portion of a crosspiece) of the substrate S which divides the deposition region of the mask M. Thereby, it is possible to suppress the influence on the temperature distribution of the deposition region of the substrate S which is caused by contact of the chuck member 402 with the substrate S. Also, the chuck member 402 is preferably arranged outside the active region of the display. This is because stress caused by suction of the chuck member 402 can possibly deform the substrate S or possibly affect the temperature distribution at the time of deposition.

[0063] Figure 2 (b) of FIG. 1 is Figure 2 A cross-sectional view of (a) of FIG. 1, showing a state in which the holding surface 405 faces upward. When the substrate carrier C is placed on the mask M with the holding surface 405 of the carrier panel 401 which holds the substrate S facing downward, the support body 403 supports the substrate carrier C to the mask M. Note that, although the support body 403 is configured as a protrusion which protrudes from the holding surface 405 of the carrier panel 401, it can also be a structure in which the entire substrate S is in close contact with the mask M after being flipped over. Also, it can be a structure in which, at least in the vicinity of the support body 403, the substrate S held by the substrate carrier C is separated from the mask M, and the support body 403 supports the substrate carrier C.

[0064] It should be noted that the mechanism of the substrate carrier C for holding the substrate S is not limited to a chuck member; any mechanism that can stably hold the substrate S during transport or flipping is acceptable. For example, the substrate carrier C may have a clamping mechanism for holding the substrate S. Furthermore, an electrostatic chuck that holds the substrate S by means of electrostatic force generated by applying voltage to electrodes may be disposed inside the carrier panel 401 or on the surface of the carrier panel 401 opposite to the holding surface 405.

[0065] The substrate carrier C may also have a magnetic force generating mechanism for pulling the mask M closer together via the held substrate S using magnetic force. As the magnetic force generating mechanism, a permanent magnet, an electromagnet, or a magnetic plate equipped with a permanent electromagnet can be used. Furthermore, if the substrate carrier C is equipped with an electrostatic chuck, the electrostatic chuck can attract the mask M in addition to the substrate S.

[0066] (Substrate carrier and mask)

[0067] Figure 3 This is a schematic cross-sectional view showing the situation where the substrate S is mounted onto the substrate carrier C, and the substrate carrier C is flipped over and placed onto the mask M. Figure 3 (a) shows a case in which a substrate S is supported by a substrate carrier C with its holding surface 405 facing upwards, in a confluence chamber 503, etc. The substrate S descends toward the holding surface 405 of the carrier panel 401, as... Figure 3 As shown in (b), it becomes the state held by the chuck member 402.

[0068] from Figure 3 (b) to Figure 3 (c) shows the substrate carrier C being flipped up and down in the flipping chamber 505, etc., according to each substrate S. This results in the substrate carrier C having its holding surface 405 facing downwards. At this time, the substrate S is held by the holding force of the chuck member 402 and adheres to the holding surface 405 from below, with the film-forming surface facing downwards. The substrate carrier C in this state is then moved into the mask loading chamber 510 and moved upwards towards the mask M.

[0069] Then, the substrate carrier C and the mask M holding the substrate S are moved toward the alignment chamber 511. After the alignment device disposed in the alignment chamber 511 aligns the substrate carrier C with the mask M, it places the substrate carrier C onto the mask M. Thus, it becomes... Figure 3 The state of (d). It should be noted that the substrate S and the mask M can also be in close contact. Moreover, at least a portion of the substrate S and the mask M can be in close contact.

[0070] In the alignment chamber 511, a photographing mechanism that photographs the substrate carrier C in a manner of looking down from the chamber ceiling is arranged. The control section of the alignment device photographs the substrate alignment mark on the substrate and the mask alignment mark on the mask by the photographing mechanism, and relatively moves the substrate carrier C and the mask M in the XY plane in a manner that the substrate alignment mark and the mask alignment mark become a prescribed positional relationship. Then, at least either one of the substrate carrier C and the mask M is moved in the Z direction at the point when the prescribed positional relationship is achieved, and the substrate carrier C is placed on the mask M. Then, as shown in (d) of FIG. 1, the mask M on which the substrate carrier C is placed is moved within the film formation system by the mask carrying roller, and receives film formation. Figure 3

[0071] Note that, after the film formation is completed, when the substrate carrier C is separated from the mask M in the carrier separation chamber, the state becomes the separated state as in (c) of FIG. 1 again. In this state, the substrate carrying roller is moved to the lower side of the peripheral portion of the substrate carrier C, and thus the substrate carrier C and the mask M can be carried individually. Figure 3

[0072] (chamber including an atmosphere tank)

[0073] Inside the vacuum chamber, a structure called an atmosphere tank that maintains the inside space as an atmospheric environment is sometimes arranged. The inside space of the atmosphere tank is in communication with the outside of the chamber. A signal line, a pipe, or the like is arranged between the atmosphere tank and the outside of the chamber, and is used in the exchange of information and substances. The atmosphere tank, which is an atmospheric environment inside, is kept airtight and separated from the chamber space that needs to be exhausted to vacuum.

[0074] As an example of a device that uses an atmosphere tank, there is a tandem type film formation device. The tandem type film formation device is a device in which a plurality of chambers are linked in vacuum from the beginning to the end, and a substrate is formed while being moved between the chambers. A plurality of film formation chambers are provided in the tandem type film formation device, and thus film formation is sequentially performed on a substrate, and a multilayer structure organic EL element can be produced. A carrying roller for moving a substrate is provided inside the chamber of the tandem type film formation device. Also, a driving mechanism such as a motor for driving the carrying roller is housed in the atmosphere tank inside the chamber. The driving mechanism receives power and a control signal from the outside of the chamber via a signal line, and transmits power to the carrying roller via a shaft that is inserted into a hole provided in the atmosphere tank.

[0075] In order to maintain the airtightness between the atmosphere tank and the chamber, the shaft insertion hole is sealed by a sealing member or grease, but there are cases where leakage occurs and the airtightness decreases due to aging or the like. The above-mentioned leakage can cause a decrease in the degree of vacuum in the chamber during film formation, and can cause film formation failure. Therefore, at the time of maintenance of the device, it is necessary to detect whether or not leakage occurs from the hole provided in the atmosphere tank.

[0076] ​​If the opening (e.g., a hole through which the shaft is inserted) that becomes a candidate for a leakage occurrence site in the atmosphere tank is one, the existing device such as a helium detector can be used to detect the leakage. However, in the case where a plurality of openings exist in the atmosphere tank, although it is possible to detect that a leakage occurs from the atmosphere tank, it is difficult to detect at which opening the leakage occurs.

[0077] Referring to Figure 4 , an example of the structure of a chamber including an atmosphere tank and a rotary table is described. Figure 4 is a sectional view of the inside of the chamber of the carrier separation chamber 531 (first separation chamber), showing a state in which the mask M in a state where the substrate carrier C is placed is carried into the chamber.

[0078] The mask M in the chamber is supported at opposite two edges thereof by the mask carrying roller 210. The mask carrying roller 210 is supported by a drive shaft portion 211. The drive shaft portion 211 is connected to a driving mechanism such as a motor housed inside the atmosphere tank 201, and rotates the mask carrying roller 210 by transmitting power from the motor. A seal portion 202 for air-tightly holding for preventing leakage from the inside of the atmosphere tank to the inside of the chamber is provided between the drive shaft portion 211 and the atmosphere tank 201. As the seal portion, any mechanism such as a mechanical seal, a seal ring, or the like can be used.

[0079] A plurality of atmosphere tanks 201 are provided on a rotary table 245 supported by a shaft 240. The rotary table 245 and the shaft 240 are driven by a rotary drive portion 241 (turning mechanism) having a rotary mechanism such as a motor, and rotate in the XY plane with the rotation axis 244 as the center. The shaft 240 and the chamber wall are sealed by a magnetic fluid seal or the like to maintain the vacuum inside the chamber. Along with the rotation of the rotary drive portion 241, the mask carrying roller 210 connected to the atmosphere tank and the mask M supported by the mask carrying roller 210 also rotate in the XY plane. As the rotary table 245, an existing turntable or the like can be used. Further, it is also preferable to provide a base 246 fixed in the chamber, and stably support the rotary table 245. Further, it is also preferable to provide a groove-shaped guide in advance in the base 246, and stabilize the rotation operation by combining with a protruding portion of the rotary table 245.

[0080] The chamber is also equipped with a carrier support 230 (substrate carrier holding mechanism), a carrier drive shaft 232, a carrier conveying roller 220, a drive shaft 221 for the carrier conveying roller, and a drive unit 222 for the carrier conveying roller. Furthermore, a carrier Z drive unit 231 is disposed on the upper wall of the chamber. In this embodiment, the conveying device for conveying the conveyor body includes at least a mechanism for conveying the conveyor body and a mechanism for rotating the conveyor body. The mechanism for conveying the conveyor body includes at least a drive mechanism inside the air chamber and a mask conveying roller 210. The mechanism for rotating the conveyor belt includes at least a rotation drive unit 241 and a rotary table 245. The conveying device may also include a carrier support as a mechanism for holding the substrate carrier, and a carrier conveying roller as a mechanism for conveying the substrate carrier.

[0081] The carrier support portion 230 is connected to the carrier Z drive portion 231 via the carrier drive shaft 232. A protrusion of the carrier support portion 230a engages with a groove provided on the outer periphery of the substrate carrier C from the left side of the paper, and a protrusion of the carrier support portion 230b engages with a groove provided on the outer periphery of the substrate carrier C from the right side of the paper, thereby supporting the substrate carrier C. After the carrier support portion 230 supports the substrate carrier C, the carrier Z drive portion 231 moves the carrier drive shaft 232 upward in the Z direction. As a result, the substrate carrier C supported by the carrier support portion 230 moves upward in the Z direction and separates from the mask M. It should be noted that the carrier support portion 230 and the carrier drive shaft 232 can be integrated.

[0082] The carrier conveyor roller 220 is connected to the drive unit 222 via a drive shaft 221 and is positioned slightly above the mask conveyor roller 210 in the Z direction. The drive unit 222 enables the carrier conveyor roller 220 to move in the XY plane (in... Figure 4 The carrier carrier C moves along the Y direction. Specifically, the drive unit 222a moves the carrier conveyor roller 220a in the positive Y direction, and the drive unit 222b moves the carrier conveyor roller 220b in the negative Y direction. Thus, the carrier conveyor rollers 220a and 220b move from a retracted position to a carrier support position. The retracted position is a position in the Y direction where the distance between the carrier conveyor rollers 220a and 220b is wider than the width of the substrate carrier C, allowing the substrate carrier C to move freely up and down. The carrier support position is a position in the Y direction where the distance between the carrier conveyor rollers 220a and 220b is the same as or wider than the width of the substrate carrier C, and is a position capable of supporting the substrate carrier C.

[0083] The mechanism that moves the carrier support portion 230 up and down, and the mechanism that moves the carrier conveying roller 220 in the roller rotation axis direction (Y direction on the paper) by driving the carrier conveying roller 222 of the carrier Z driving portion 231 can employ any existing mechanism. For example, a device equipped with a guide, a ball screw, and a rotary encoder, or a device equipped with a linear motor and a linear encoder can be used.

[0084] The carrier Z driving portion 231 having the above structure operates in conjunction with the driving portion 222, and thereby can lift the substrate carrier C placed on the mask M and place it on the carrier conveying roller 220. As a result, the substrate carrier C can be separated from the mask M and conveyed separately. Moreover, in a state where the mask M is rotated in accordance with each rotary table 245, the substrate carrier C separated from the mask M is carried out, and thereby the mask M and the substrate carrier C can be carried out in different directions.

[0085] In the atmosphere tank 201, various lines and cables are connected from the outside of the chamber through the hollow of the shaft 240, the opening provided in the rotary table 245, and the inside of the relay tank 243. As the lines to be connected, there are, for example, a power line that supplies power from the outside of the chamber, a signal line that transmits and receives information inside and outside the chamber, a pipe that carries in a gas from the outside of the chamber to the atmosphere tank 201, and the like. Therefore, the inside of the atmosphere tank 201 is maintained in the same atmospheric environment as the outside of the chamber. In Figure 4 The pipe 250 is exemplified in the middle. The cable is connected to the mechanism built in the atmosphere tank 201. The kind of the built-in mechanism differs depending on the chamber in which the atmosphere tank 201 is disposed. For example, in the case of a chamber that moves a substrate carrier, a driving mechanism connected to a carrier conveying mechanism (carrier conveying roller) is built in. Moreover, in the case of a chamber that moves a mask, a driving mechanism connected to a mask conveying mechanism (mask conveying roller) is built in. Furthermore, in the case of a film formation chamber that performs film formation while moving a film formation source (evaporation source), a driving mechanism connected to a film formation source conveying mechanism is built in.

[0086] In addition, a photographing mechanism 252 such as a camera can be provided on the top surface of the chamber. The control portion 550 analyzes a photographed image using the photographing mechanism 252 and can use it in conveying control that adjusts the speed and position of the conveyed body. For example, the control portion 550 analyzes an image obtained by the photographing mechanism 252 photographing the rotated rotary table 245 and can determine whether the rotary table 245 is accommodated in a prescribed position. Thereby, even if the conveying direction of the mask conveying roller 210 deviates, it can be corrected to the correct direction. By providing a plurality of photographing mechanisms 252, the position deviation can be detected with higher accuracy and controlled.

[0087] In addition, a probe 270 of a helium detector can be provided at a desired position in the chamber (an upper partition in the illustrated example). The probe 270 is connected to a main body of the helium detector outside the chamber, and draws the surrounding gas for helium detection and delivers it to the main body.

[0088] Figure 5 and Figure 6 is a plan view of the inside of the chamber when viewed from above the carrier separation chamber 531, showing a state in which the mask M and the substrate carrier C are not carried in. As shown in the drawing, two rows of four each, for a total of eight, atmospheric tanks 201 are provided above the rotary table 245, and each atmospheric tank 201 supports two mask carrying rollers 210. However, the number and arrangement of the atmospheric tanks are not limited to this. In Figure 5 In the drawing, the mask carrying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side of the paper and carried out to the carrier separation chamber 532 (second separation chamber) on the left side of the paper.

[0089] In Figure 5 In the drawing, the mask carrying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side of the paper and carried out to the carrier separation chamber 532 (second separation chamber) on the left side of the paper.

[0090] Figure 6 is a plan view showing a state in which the rotary drive section 241 has rotated the rotary table 245 90 degrees in the XY plane about the rotation axis 244. In this case, when the direction in which the mask carrying rollers 210 are aligned in Figure 5 In the drawing, the mask carrying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side of the paper and carried out to the carrier separation chamber 532 (second separation chamber) on the left side of the paper. Figure 6 In the drawing, the mask carrying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side of the paper and carried out to the carrier separation chamber 532 (second separation chamber) on the left side of the paper. Figure 6 In the drawing, the mask carrying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side of the paper and carried out to the carrier separation chamber 532 (second separation chamber) on the left side of the paper. Figure 6In the state where the mask M is placed, the fixed conveyance roller 260 and the fixed driven roller 263 cannot be used in the conveyance of the mask M, but since the width in the up-down direction in the chamber is narrower than the width in the left-right direction, stability at the time of conveyance of the mask M does not become a problem. Note that the placement site and the number of the fixed conveyance roller 260 and the fixed driven roller 263 can be appropriately determined in accordance with the shape of the chamber, the size and strength of the conveyance object. For example, the fixed conveyance roller 260 and the fixed driven roller 263 can be provided in both directions obtained by the direction conversion of the mask conveyance roller 210. Also, if not needed, the fixed conveyance roller 260 and the fixed driven roller 263 can not be provided.

[0091] In addition, the control section 550 can rotate the rotary table 245 at a constant speed, but can also change the rotation speed in accordance with the timing and the state. Figure 7 is a graph showing an example of a method of controlling the rotation speed of the rotary table 245. The horizontal axis shows the angle at the time of rotation of the rotary table 245 by 90 degrees, and the vertical axis shows the relative value of the rotation speed, with the fastest speed in the state where the mask is placed being set to 100. In the example shown in the graph, the rotation speed is accelerated from the start of rotation (0 degrees) to the timing tl, is constant from the timing tl to the timing t2, and is decelerated from the timing t2 to the end of rotation (90 degrees). Figure 7 In the example shown in the graph, the control section 550 gradually accelerates the rotary table 245 in the acceleration stage from the start of rotation (0 degrees) to the timing tl, rotates at a constant speed in the constant speed stage from the timing tl to the timing t2, and decelerates in the deceleration stage from the timing t2 to the end of rotation (90 degrees). By controlling in such a trapezoidal type of speed curve, it is possible to make the movement of the rotary table 245 smooth while maintaining the stability of the mask M, and to complete the rotation as soon as possible. Note that the control curve is not limited to a trapezoidal shape, but can be controlled in the order of acceleration-constant speed-deceleration. For example, S-shaped control in which the speed is gently changed at the start of acceleration or at the transition to the constant speed can also be used.

[0092] In addition, the control section 550 can change the rotation speed in the rotation control when the conveyance body such as the mask M or the substrate carrier C is placed and when the conveyance body is not placed. Figure 7 In the example shown in the graph, the speed at the constant speed is controlled to be slower when the conveyance body is placed (dotted line) than when the conveyance body is not placed (solid line).

[0093] [Example 1]

[0094] In this embodiment, the mounting, separation, carrying-in and carrying-out of the substrate carrier C and the mask M in each chamber in the film formation apparatus 500 are described with reference to the drawings. Therefore, an application example of the rotation of the mask M in the chamber of the film formation apparatus 500 is described. Specifically, the operation in the mask loading chamber 510 in which the substrate carrier C and the mask M meet, the rotation chambers 522 (first rotation chamber) and 524 (second rotation chamber) in which the mask M is rotated while the substrate carrier C is placed, and the carrier separation chambers 531 (first separation chamber) and 532 (second separation chamber) in which the substrate carrier C is separated from the mask M are described.

[0095] Figure 8 is a schematic view of the carrying-out, carrying-in and rotation of the carriers (substrate carrier C and mask M) in each of the above chambers. Table 1 is a table that describes the operation in each of the chambers shown in FIG. 6. In the following description, "up", "down", "left" and "right" are for facilitating the illustration of the example and do not limit the arrangement of the chambers, the orientation of the carriers, and the carrying direction in the actual film formation apparatus. Moreover, the carriers do not necessarily have to be rotated in each chamber, and the presence or absence of rotation can be appropriately determined depending on the structure of the apparatus and the connection state of the chambers. Figure 8

[0096]

Table 1

[0097]

[0098] (1) Mask loading chamber 510

[0099] The substrate carrier C is carried into the mask loading chamber 510 from the left direction, and the mask M is carried into the mask loading chamber 510 from the lower direction. The mask loading chamber 510 is provided with a rotation table similar to the carrier separation chamber 531, and the mask M is rotated in the XY plane by the rotation table, and the orientation of the mask M is also changed by 90 degrees. The substrate carrier C is carried to the right by the carrier carrying roller, and the mask M is carried to the right by the mask carrying roller. Note that in the structure of the embodiment, the substrate carrier C is placed on the mask M in the alignment chamber 511, but the placement can be performed in the mask loading chamber 510.

[0100] (2) Rotation chambers 522, 524

[0101] ​The mask M on which the substrate carrier C is placed is carried into the rotation chamber 522 (first rotation chamber) from the left to the right (in the first direction). A rotation table is also provided in the rotation chamber 522, and the mask M and the substrate carrier C are rotated by 90 degrees in orientation by rotation of the rotation table, and the rotated mask M and substrate carrier C are carried out from the rotation chamber 522. The mask M on which the substrate carrier C is placed is carried into the rotation chamber 524 (second rotation chamber) from above. A rotation table is also provided in the rotation chamber 524, and the mask M and the substrate carrier C are rotated by 90 degrees in orientation by rotation of the rotation table, and the rotated mask M and substrate carrier C are carried out from the rotation chamber 524 from the right to the left (in the second direction).

[0102] (3) Carrier separation chamber 531 (first separation chamber)

[0103] The mask M on which the substrate carrier C is placed is carried into the carrier separation chamber 531 from the right. In the carrier separation chamber 531, the substrate carrier C is separated from the mask by the action of the carrier Z drive section 231, and is supported by the carrier carrying roller 220.

[0104] (3-1)

[0105] In the carrier separation chamber 531, the mask M can perform a two-pass action. First, in the case where the mask M is carried out from the film formation device 500 for reasons such as mask replacement, the rotation table 245 in the carrier separation chamber 531 is rotated, and the orientation of the mask M is changed by 90 degrees. Then, when the mask carrying roller 210 is made to continue in the Y direction as shown in Figure 6 , the mask M is carried out downward.

[0106] (3-2)

[0107] On the other hand, when the mask M is to be reused in the next film formation, the rotation table 245 is not rotated, and the mask M is carried out to the left in a state in which the mask carrying roller 210 is made to continue in the X direction as shown in Figure 5 . Note that in either case of (3-1) and (3-2), the substrate carrier C is carried out to the left by the substrate carrying roller. In the structure of the embodiment, the substrate carrier C is necessarily separated in the carrier separation chamber 531, but the present application is not limited to this. In the case where the mask M is reused as in (3-2), the mask M can be carried out to the left with the substrate carrier C mounted thereto, and separation is performed in the carrier separation chamber 532.

[0108] (4) Carrier separation chamber 532 (second separation chamber)

[0109] (4-1)

[0110] In the case of mask exchange, the mask M is carried in from below into the carrier separation chamber 532. Here, a rotary table is also provided in the carrier separation chamber 532, and in the case of (4-1), the mask carrying rollers are controlled in a manner that they are continuous in the up-down direction. As a result, the carried-in mask M is carried out upward without changing the orientation.

[0111] (4-2)

[0112] On the other hand, in the case of reusing the mask M, the mask M is carried in from the right into the carrier separation chamber 532. In this case, the rotary table is controlled in a manner that the mask carrying rollers are continuous in the left-right direction. Also, after the mask M is carried in, the rotary table is rotated by 90 degrees. Then, the mask M is carried out upward. Note that in both cases of (4-1) and (4-2), the substrate carrier C holding the substrate S on which film formation is completed is carried in from the right and carried out to the left. Therefore, in the case of (4-1), the mask M and the substrate carrier C are carried while being separated in the up-down direction and being supported by the mask carrying rollers and the carrier carrying rollers, respectively.

[0113] The mechanisms provided in each chamber are appropriately determined based on Table 1 described above. For example, the carrier separation chamber 531 is provided with mask carrying rollers, a Z drive mechanism that lifts the substrate carrier C from the mask M, carrier carrying rollers that support the lifted substrate carrier C, and a rotation mechanism that changes the orientation of the mask carrying rollers. On the other hand, in the carrier separation chamber 532 and the mask loading chamber 510, only the mask carrying rollers, the carrier carrying rollers, and the rotation mechanism are present. Also, in the rotation chambers 522 and 524, only the mask carrying rollers and the rotation mechanism are present. Furthermore, the structure of each chamber can be determined depending on whether the rotation is necessary based on the separation of the mask M and the substrate carrier C, the presence or absence of placement, and the moving direction of the carrying body.

[0114] (Modified Example)

[0115] Reference Figure 9 (a) illustrates another example of the rotation of the carrying body in each chamber. Compared with Figure 9 the direction of rotation in the rotation chamber 524 is different. Note that in this example, the rightward rotation direction is set as the first rotation direction, and the leftward rotation direction is set as the second rotation direction. The second rotation direction is opposite to the first rotation direction.

[0116] Figure 9(b) is a case where the mask M and the substrate carrier C which are carried in the rotation chamber 522 in the first direction (from left to right direction) are rotated, the rotation center is indicated by a black circle, and the rotation direction is indicated by an arrow. "C+M(tl)" indicates the orientation of the mask M and the substrate carrier C at a first timing tl before the rotation is started. "C+M(t2)" indicates the orientation of the mask M and the substrate carrier C at a second timing t2 after the rotation is completed. That is, in the rotation chamber 522 of (b), the mask M and the substrate carrier C are rotated by 90 degrees in the first rotation direction. Figure 8 (b) is a case where the mask M and the substrate carrier C which are carried in the rotation chamber 522 in the first direction (from left to right direction) are rotated, the rotation center is indicated by a black circle, and the rotation direction is indicated by an arrow. "C+M(tl)" indicates the orientation of the mask M and the substrate carrier C at a first timing tl before the rotation is started. "C+M(t2)" indicates the orientation of the mask M and the substrate carrier C at a second timing t2 after the rotation is completed. That is, in the rotation chamber 522 of (b), the mask M and the substrate carrier C are rotated by 90 degrees in the first rotation direction. Figure 9 (b) is a case where the mask M and the substrate carrier C which are carried in the rotation chamber 522 in the first direction (from left to right direction) are rotated, the rotation center is indicated by a black circle, and the rotation direction is indicated by an arrow. "C+M(tl)" indicates the orientation of the mask M and the substrate carrier C at a first timing tl before the rotation is started. "C+M(t2)" indicates the orientation of the mask M and the substrate carrier C at a second timing t2 after the rotation is completed. That is, in the rotation chamber 522 of (b), the mask M and the substrate carrier C are rotated by 90 degrees in the first rotation direction.

[0117] Figure 9 (c) shows a case of rotation in the rotation chamber 524. "C+M(t3)" indicates the orientation of the mask M and the substrate carrier C at a third timing t3 before the rotation is started. "C+M(t4)" indicates the orientation of the mask M and the substrate carrier C at a fourth timing t4 after the rotation is completed. That is, in the rotation chamber 524 of (c), unlike (b), the mask M and the substrate carrier C are rotated by 90 degrees in the second rotation direction. Figure 8 (c) shows a case of rotation in the rotation chamber 524. "C+M(t3)" indicates the orientation of the mask M and the substrate carrier C at a third timing t3 before the rotation is started. "C+M(t4)" indicates the orientation of the mask M and the substrate carrier C at a fourth timing t4 after the rotation is completed. That is, in the rotation chamber 524 of (c), unlike (b), the mask M and the substrate carrier C are rotated by 90 degrees in the second rotation direction. Figures 10-12 (c) shows a case of rotation in the rotation chamber 524. "C+M(t3)" indicates the orientation of the mask M and the substrate carrier C at a third timing t3 before the rotation is started. "C+M(t4)" indicates the orientation of the mask M and the substrate carrier C at a fourth timing t4 after the rotation is completed. That is, in the rotation chamber 524 of (c), unlike (b), the mask M and the substrate carrier C are rotated by 90 degrees in the second rotation direction.

[0118] Accordingly, the orientation of the mask M and the substrate carrier C between the rotation chamber 524 and the carrier separation chamber 531 is identical to the orientation of the mask M and the substrate carrier C in the alignment chamber 511 and the rotation chamber 522. As a result, the orientation of the substrate S in the film formation chamber 520 (520a to 520d) is identical to the orientation of the substrate S in the film formation chamber 526 (526a to 526d). Thus, for example, it is possible to advance the subsequent process without changing the orientation of the orientation flat surface (Orifla) of the substrate S.

[0119] (Specific Example)

[0120] Next, a specific example of the rotation and the transfer of the mask M will be described with reference to the cross-sectional views of the chamber of (a) to (c). Here, as in (3-1) above, a case where mask replacement occurs in the carrier separation chamber 531 will be described as an example. In each drawing, the reference numerals or the description of the constituent elements which are not needed in the explanation are omitted. Figure 10

[0121] (a) shows a case where the mask M and the substrate carrier C on which the substrate S is placed are transferred to the carrier separation chamber 531. At this time, the power transmitted from the motor provided in the inside of the atmosphere tank 201 via the drive shaft portion 211 rotates the mask transfer roller 210. As a result, the mask M whose end portion is supported by the mask transfer roller 210 is moved to a predetermined position in the chamber. Figure 10

[0122] Thus, the mask M and the substrate carrier C are transferred to the carrier separation chamber 531.Figure 11 (b) shows the case where the substrate carrier C moves upward in the Z direction, supported by the carrier conveying roller 220. First, the protruding portion of the carrier support portion 230 engages with the groove portion of the substrate carrier C, supporting the substrate carrier C. Also, the carrier Z drive portion 231 lifts the carrier support portion 230 via the carrier drive shaft 232, whereby the substrate carrier C separates from the mask M and rises. The carrier Z drive portion 231 lifts the substrate carrier C to a position higher than the height at which the carrier conveying roller 220 is provided. Next, the drive portions 222a, 222b of the carrier conveying roller cause the carrier conveying rollers 220a, 220b to approach in the direction of the rotation axis of the rollers, whereby the carrier conveying rollers 220a, 220b move from the retracted position to the support position. Next, the carrier Z drive portion 231 lowers the substrate carrier C and places it on the carrier conveying roller 220.

[0123] Figure 11 (a) shows the case where the substrate carrier C is conveyed to the carrier separation chamber 532. After the substrate support is released based on the carrier support portion 230, the drive portion 222 of the carrier conveying roller transmits power to the carrier conveying roller 220 via the drive shaft 231. Thereby, the carrier conveying roller 220 rotates and conveys out the substrate carrier C.

[0124] Figure 10 (b) is a cross-sectional view of (a) rotated by 90 degrees. It shows a state in which the shaft 240 and the rotary stage 245 that supports the mask M have rotated by 90 degrees by driving of the rotation drive portion 241. Figure 11 (a) ~ (c) of FIG. 24 are cross-sectional views of the mask conveying mechanism 210 of the mask conveying mechanism 200. Figure 12 (a) is a cross-sectional view in the vertical direction of the atmosphere tank 201. The partition wall of the atmosphere tank 201 is provided with a number of through holes 275 corresponding to the mask conveying rollers 210 (two in this embodiment). The drive shaft portion 211 is disposed in the through hole 275, and the gap between the through hole 275 and the drive shaft portion 211 is sealed by the seal portion 202. From the outside of the chamber, a pipe 250 is introduced into the inside of the atmosphere tank 201 for each through hole 275. The through hole 275 is a through hole for a member (here, the drive shaft portion) disposed through from the inside to the outside of the atmosphere tank 201, and corresponds to a candidate for a leakage site in this embodiment. However, the candidate for a leakage site is not limited to this.

[0125] Figure 13 (a) shows the case where the mask M is conveyed out downward. The mask conveying roller 210 is driven by a drive mechanism inside the atmosphere tank, and the fixed conveying roller 260 is driven by the drive portion 262, whereby the mask M supported by the mask conveying roller 210, the fixed driven roller 263, and the fixed conveying roller 260 moves and is conveyed out.

[0126] (Internal structure of the atmosphere tank)

[0127] Figure 13 (a) is a cross-sectional view in the vertical direction of the atmosphere tank 201. The partition wall of the atmosphere tank 201 is provided with a number of through holes 275 corresponding to the mask conveying rollers 210 (two in this embodiment). The drive shaft portion 211 is disposed in the through hole 275, and the gap between the through hole 275 and the drive shaft portion 211 is sealed by the seal portion 202. From the outside of the chamber, a pipe 250 is introduced into the inside of the atmosphere tank 201 for each through hole 275. The through hole 275 is a through hole for a member (here, the drive shaft portion) disposed through from the inside to the outside of the atmosphere tank 201, and corresponds to a candidate for a leakage site in this embodiment. However, the candidate for a leakage site is not limited to this.

[0128] Figure 14 (b) is a top sectional view of the atmospheric chamber 201. The drive shaft is connected to the drive mechanism 280 inside the atmospheric chamber and to the mask conveying roller 210 outside the atmospheric chamber. In this embodiment, the drive mechanism 280 is a motor connected to the outside of the chamber via power lines and signal lines (not shown).

[0129] As described above, according to the structure of the embodiment, by providing a rotatable mechanism within the cavity, the conveying direction of the conveying body, such as the mask, can be changed. As a result, for example, in the embodiment, the path of the conveying body can be flexibly set so that the destination of the mask from the carrier separation chamber 531 branches to the left and downward.

[0130] <Manufacturing Methods of Electronic Devices>

[0131] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be shown, and a method for manufacturing an organic EL display device will be illustrated.

[0132] First, the manufactured organic EL display device will be explained. Figure 14 (a) represents an overall view of the organic EL display device 700. Figure 14 (b) represents the cross-sectional structure of a pixel.

[0133] like Figure 14 As shown in (a), multiple pixels 702, each equipped with a plurality of light-emitting elements, are arranged in a matrix in the display area 701 of the organic EL display device 700. Each light-emitting element has a structure having an organic layer held by a pair of electrodes, as will be described in detail later. It should be noted that a pixel, as used here, refers to the smallest unit in the display area 701 capable of displaying a desired color. In the case of the organic EL display device of this embodiment, the pixel 702 is constructed by a combination of a first light-emitting element 702R, a second light-emitting element 702G, and a third light-emitting element 702B that exhibit different light emission. The pixel 702 is mostly constructed by a combination of red, green, and blue light-emitting elements, but it can also be a combination of yellow, cyan, and white light-emitting elements, as long as there is at least one color, there is no particular limitation.

[0134] Figure 14 (b) is Figure 14A local cross-sectional view of the B-B line of (a). The pixel 702 is composed of a plurality of light emitting elements each of which has a first electrode (anode) 704, a hole transporting layer 705, any one of light emitting layers 706R, 706G, 706B, an electron transporting layer 707, and a second electrode (cathode) 708 on a substrate 703. The hole transporting layer 705, the light emitting layers 706R, 706G, 706B, and the electron transporting layer 707 among them correspond to the organic layer. Also, in the present embodiment, the light emitting layer 706R is an organic EL layer that emits red light, the light emitting layer 706G is an organic EL layer that emits green light, and the light emitting layer 706B is an organic EL layer that emits blue light. The light emitting layers 706R, 706G, 706B are formed in a pattern corresponding to light emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue light, respectively.

[0135] In addition, the first electrode 704 is formed separately for each light emitting element. The hole transporting layer 705, the electron transporting layer 707, and the second electrode 708 can be formed in common among the plurality of light emitting elements 702R, 702G, 702B, or can be formed for each light emitting element. Note that, in order to prevent the first electrode 704 from short-circuiting with the second electrode 708 due to impurities, an insulating layer 709 is provided between the first electrodes 704. Furthermore, since the organic EL layer deteriorates due to moisture or oxygen, a protective layer 710 is provided for protecting the organic EL element from moisture or oxygen.

[0136] In ​ In (b), the hole transporting layer 705 and the electron transporting layer 707 are represented by one layer, but depending on the structure of the organic EL display element, they can also be formed by a plurality of layers with a hole blocking layer and an electron blocking layer. Also, a hole injection layer can be formed between the first electrode 704 and the hole transporting layer 705, the hole injection layer having a band structure that enables smooth injection of holes from the first electrode 704 to the hole transporting layer 705. Similarly, an electron injection layer can be formed between the second electrode 708 and the electron transporting layer 707.

[0137] Next, an example of a manufacturing method of an organic EL display device will be described in detail.

[0138] First, a substrate (sample glass) 703 on which a circuit (not shown) for driving the organic EL display device and the first electrode 704 are formed is prepared.

[0139] An acrylic resin is formed on the substrate 703 on which the first electrode 704 is formed by spin coating, and the acrylic resin is patterned by a photolithography method to form the insulating layer 709 in a manner that an opening is formed in the portion on which the first electrode 704 is formed. The opening portion corresponds to a light emitting region in which the light emitting element actually emits light.

[0140] The substrate 703 on which the insulating layer 709 is patterned is placed on the substrate holder on which the adhesive member is arranged. The substrate 703 is held by the adhesive member. The substrate is carried into the first organic material film forming apparatus, and after being flipped, the hole transporting layer 705 is formed as a common layer over the first electrode 704 in the display region. The hole transporting layer 705 is formed by vacuum evaporation. In fact, the hole transporting layer 705 is formed to have a larger size than the display region 701, and thus a high-precision mask is not required.

[0141] Next, the substrate 703 on which the hole transporting layer 705 is formed is carried into the second organic material film forming apparatus. The substrate is aligned with the mask, and placed on the mask, and a red-emitting light emitting layer 706R is formed in the portion of the substrate 703 on which the red-emitting element is arranged.

[0142] Similarly to the formation of the light emitting layer 706R, a green-emitting light emitting layer 706G is formed by the third organic material film forming apparatus, and a blue-emitting light emitting layer 706B is formed by the fourth organic material film forming apparatus. After the formation of the light emitting layers 706R, 706G, 706B is completed, an electron transporting layer 707 is formed over the entire display region 701 by the fifth film forming apparatus. The electron transporting layer 707 is formed as a common layer over the three color light emitting layers 706R, 706G, 706B.

[0143] The substrate on which the electron transporting layer 707 is formed is moved by the metallic evaporation material film forming apparatus, and a second electrode 708 is formed.

[0144] Then, the substrate 703 is moved to the plasma CVD apparatus, and a protective layer 710 is formed, and the film forming process on the substrate 703 is completed. After being flipped, the adhesive member is peeled from the substrate 703, and thus the substrate 703 is separated from the substrate holder. Then, the organic EL display device 700 is completed by dicing.

[0145] From the carrying of the substrate 703 on which the insulating layer 709 is patterned into the film forming apparatus to the completion of the film forming of the protective layer 710, if exposed to an atmosphere containing moisture and oxygen, the light emitting layer composed of the organic EL material can be deteriorated by the moisture or oxygen. Thus, in this embodiment, the carrying in and out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or a non-reactive gas atmosphere.

Claims

1. A conveying device for conveying a conveying body, characterized in that, have: Multiple conveying rollers, which convey the conveying body; A drive mechanism that drives the plurality of conveying rollers; A rotary table, wherein the rotary table is provided with the plurality of conveying rollers and the drive mechanism; and A rotating mechanism is provided to rotate the rotary table, thereby switching between a state in which the plurality of conveying rollers are arranged along a first direction and a state in which the plurality of conveying rollers are arranged along a second direction intersecting the first direction. The drive mechanism is located inside the atmospheric chamber set on the rotary table. After the rotation begins, the rotational speed of the rotary table is controlled in the sequence of acceleration phase, constant speed phase, and deceleration phase. The rotational speed during the constant speed phase when the rotary table is not carrying the conveyor is slower than the rotational speed during the constant speed phase when the rotary table is carrying the conveyor.

2. The conveying device according to claim 1, characterized in that, The transport body is a stack of a substrate carrier that holds the substrate and a mask used for film deposition on the substrate. The conveying device further includes a substrate carrier holding mechanism for holding the substrate carrier and separating the substrate carrier from the mask. The plurality of conveying rollers convey the mask. The conveying device further includes a second conveying roller, which conveys the substrate carrier that has been separated from the mask by the substrate carrier holding mechanism. The second conveying roller can change position along the direction of its rotation axis.

3. The conveying device according to claim 2, characterized in that, The second conveying roller is positioned at a different height than the plurality of conveying rollers.

4. The conveying device according to claim 1, characterized in that, The transport body is a stack of a substrate carrier that holds the substrate and a mask used for film deposition on the substrate. The rotating mechanism rotates the rotary table after the substrate carrier separates from the mask and while the mask is placed on the plurality of conveying rollers.

5. The conveying device according to claim 1, characterized in that, The transport body is a stack of a substrate carrier that holds the substrate and a mask used for film deposition on the substrate. The rotating mechanism rotates the rotary table while the substrate carrier and the mask stack are placed on the plurality of conveying rollers.

6. The conveying device according to claim 1, characterized in that, The conveying device also includes a hollow shaft, which is connected to the rotary table. The cable connected to the drive mechanism is inserted into the hollow shaft.

7. The conveying device according to any one of claims 1 to 6, characterized in that, The conveying device is located inside the chamber. The conveying device also has multiple imaging mechanisms arranged on the top surface of the chamber.

8. The conveying device according to claim 7, characterized in that, The conveying device also has a control mechanism that controls the positional deviation of the conveyed body after the rotating platform has been rotated by the rotating mechanism, based on the image captured by the shooting mechanism.

9. The conveying device according to claim 8, characterized in that, Inside the chamber, there are rollers fixed on the extension lines of the plurality of conveying rollers when the plurality of conveying rollers are arranged in at least one of the states of being arranged along the first direction and the state of being arranged along the second direction.

10. A film-forming apparatus comprising a conveying device and a film-forming source, the conveying device conveying a substrate carrier holding a substrate and a mask, the film-forming source forming a film on the substrate via the mask, the film-forming apparatus conveying the substrate carrier and the mask within a plurality of chambers via the conveying device, characterized in that, The conveying device is the conveying device according to any one of claims 1 to 9.

11. The film-forming apparatus according to claim 10, characterized in that, The plurality of chambers include a first rotating chamber and a second rotating chamber. The first rotating chamber rotates the mask, which is loaded with the substrate carrier and is moved in in a first direction, in a first rotating direction and moves it out. The second rotating chamber rotates the mask, which is loaded with the substrate carrier and is moved out of the first rotating chamber, in a second rotating direction opposite to the first rotating direction and moves it out in a second direction different from the first direction.

Images