Dual polarized yagi antenna
By employing a hybrid structure of magnetic dipoles and electric dipoles in the dual-polarized Yagi antenna, with the current direction parallel and perpendicular to the antenna ground respectively, the problem of the large size of existing dual-polarized Yagi antennas is solved, and a compact low-profile design is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN SUNWAY COMM
- Filing Date
- 2023-05-18
- Publication Date
- 2026-06-23
AI Technical Summary
Existing dual-polarized Yagi antennas are large and not compact enough, making it difficult to achieve a small size and low profile design.
The structure consists of a magnetic dipole module, a central dielectric substrate, and an electric dipole module stacked sequentially from bottom to top. The electric dipole assembly is located on the top surface, and the magnetic dipole assembly is located in the middle. The magnetic dipole and electric dipole are combined to form a dual-polarized Yagi antenna, with the current direction parallel and perpendicular to the antenna ground, respectively, thus reducing the thickness of the central dielectric substrate.
A dual-polarized Yagi antenna design with small size and low profile was achieved, significantly reducing the antenna's size and thickness while maintaining good radiation performance.
Smart Images
Figure CN116505282B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of antenna technology, and particularly to a dual-polarized Yagi antenna. Background Technology
[0002] Yagi antennas have excellent directivity and offer advantages over conventional dipole antennas, including higher gain and a lower profile. They are particularly effective for direction finding and long-distance communication.
[0003] The classic Yagi antenna is based on an array structure consisting of an electric dipole element and a parasitic element, which can only provide horizontal polarization, and its radiated current is parallel to the antenna ground. However, the current technical solutions for dual-polarized Yagi antennas in the industry are based on the vertical placement of two electric dipole modules, so they are very large and not compact. Summary of the Invention
[0004] The technical problem solved by this invention is to provide a small-volume, low-profile dual-polarized Yagi antenna.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a dual-polarized Yagi antenna, comprising a magnetic dipole module, a central dielectric substrate, and an electric dipole module stacked sequentially from bottom to top. The magnetic dipole module includes a lower dielectric substrate, the bottom surface of which is provided with a magnetic dipole ground layer, and the top surface of which is provided with a magnetic dipole assembly connected to the magnetic dipole ground layer. The electric dipole module includes an upper dielectric substrate, the top surface of which is provided with an electric dipole assembly, and the bottom surface of which is provided with an electric dipole ground layer.
[0006] The beneficial effects of this invention are as follows: the current of the electric dipole assembly is parallel to the antenna ground, so it is horizontally polarized, while the current of the magnetic dipole assembly is perpendicular to the antenna ground, so it is vertically polarized. This technical solution utilizes a dual-polarized Yagi antenna composed of a mixture of magnetic and electric dipoles, which has a novel and compact structure. Compared with existing dual-polarized Yagi antennas, it significantly reduces the antenna volume and cross-sectional thickness. Moreover, by placing the electric dipole assembly on the top layer of the dual-polarized Yagi antenna and the magnetic dipole assembly in the middle of the dual-polarized Yagi antenna, the thickness of the central dielectric substrate can be effectively reduced, thereby further reducing the cross-sectional thickness of the dual-polarized Yagi antenna. Attached Figure Description
[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0008] Figure 1 This is a schematic diagram of the overall structure of the dual-polarized Yagi antenna according to Embodiment 1 of the present invention;
[0009] Figure 2 This is a schematic diagram of the structure of the dual-polarized Yagi antenna after the upper dielectric substrate is hidden, according to Embodiment 1 of the present invention.
[0010] Figure 3 This is a front view of the dual-polarized Yagi antenna of Embodiment 1 of the present invention after the upper dielectric substrate, the central dielectric substrate and the lower dielectric substrate are hidden;
[0011] Figure 4 This is a schematic diagram of the structure of the dual-polarized Yagi antenna in Embodiment 1 of the present invention after the magnetic dipole module is hidden in the lower dielectric substrate.
[0012] Explanation of icon numbers:
[0013] 1. Central dielectric substrate; 11. Through-holes;
[0014] 2. Lower layer dielectric substrate;
[0015] 3. Magnetic dipole formation;
[0016] 4. Magnetic dipole assembly; 41. Magnetic dipole driver plate; 42. Magnetic dipole reflector plate; 43. Magnetic dipole parasitic plate; 44. Magnetic dipole connector; 45. Conducting structure;
[0017] 5. Upper layer dielectric substrate;
[0018] 6. Electric dipole formation;
[0019] 7. Electric dipole assembly; 71. Microstrip line; 72. Balun; 73. Electric dipole driver plate; 74. Electric dipole reflector plate; 75. Electric dipole parasitic plate; 76. Electric dipole connector. Detailed Implementation
[0020] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0022] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.
[0023] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.
[0024] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.
[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0026] Example 1
[0027] Please refer to Figures 1 to 4 Embodiment 1 of the present invention is a dual-polarized Yagi antenna, comprising a magnetic dipole module, a central dielectric substrate 1, and an electric dipole module stacked sequentially from bottom to top. The magnetic dipole module includes a lower dielectric substrate 2, with a magnetic dipole ground layer 3 on the bottom surface of the lower dielectric substrate 2 and a magnetic dipole assembly 4 connected to the magnetic dipole ground layer 3 on the top surface of the lower dielectric substrate 2. The electric dipole module includes an upper dielectric substrate 5, with an electric dipole assembly 7 on the top surface of the upper dielectric substrate 5 and an electric dipole ground layer 6 on the bottom surface of the upper dielectric substrate 5.
[0028] In this embodiment, the upper dielectric board 5, the central dielectric board 1, and the lower dielectric board 2 are all made of Rogears 5880 substrate. In other embodiments, the upper dielectric board 5, the central dielectric board 1, and the lower dielectric board 2 may be made of other substrates, and at least two of the upper dielectric board 5, the central dielectric board 1, and the lower dielectric board 2 may be made of the same or different substrates.
[0029] like Figure 1 and Figure 2 As shown, specifically, the electric dipole assembly 7 includes a microstrip line 71, a balun 72, an electric dipole driving plate 73, an electric dipole reflector 74, and several electric dipole parasitic plates 75. The electric dipole driving plate 73 has a slot in the middle, which divides the electric dipole driving plate 73 into two sub-driving plates. The balun 72 connects the microstrip line 71 and the two sub-driving plates respectively. The electric dipole reflector 74 is located on one side of the electric dipole driving plate 73 and is connected to the electric dipole ground layer 6. The electric dipole reflector 74 has a through slot for the balun 72 to pass through. The electric dipole parasitic plates 75 are located on the other side of the electric dipole driving plate 73. The electric dipole parasitic plates 75 and the electric dipole driving plate 73 are arranged side by side. The electric dipole ground layer 6 is located on the side of the electric dipole reflector 74 away from the electric dipole driving plate 73.
[0030] In this embodiment, the number of electric dipole parasitic plates 75 is four; please refer to... Figure 1 and Figure 3 The bottom of the magnetic dipole module is provided with an electric dipole connector 76, which is connected to the microstrip line 71.
[0031] like Figure 3 and Figure 4 As shown, the magnetic dipole assembly 4 includes a magnetic dipole driving plate 41, a magnetic dipole reflecting plate 42 located on one side of the magnetic dipole driving plate 41, and a plurality of magnetic dipole parasitic plates 43 located on the other side of the magnetic dipole driving plate 41. The magnetic dipole driving plate 41, the magnetic dipole reflecting plate 42, and the magnetic dipole parasitic plates 43 are arranged side by side and each of them is connected to the magnetic dipole formation 3.
[0032] In this embodiment, the number of magnetic dipole parasitic plates 43 is five; the bottom of the magnetic dipole module is provided with a magnetic dipole connector 44, which is connected to the magnetic dipole driving plate 41.
[0033] It is easy to understand that the electric dipole connector 76 and the magnetic dipole connector 44 are radio frequency connectors, respectively.
[0034] In detail, the lower dielectric plate 2 is provided with multiple sets of conductive structures 45. Each set of conductive structures 45 includes multiple metallized holes arranged in a U-shape. The magnetic dipole driving plate 41, the magnetic dipole reflecting plate 42, and the magnetic dipole parasitic plate 43 are respectively connected to the magnetic dipole ground layer 3 through the conductive structures 45. The orientation of the opening of the conductive structure 45 connecting the magnetic dipole reflecting plate 42 is the same as the orientation of the opening of the conductive structure 45 connecting the magnetic dipole driving plate 41, and the orientation of the opening of the conductive structure 45 connecting the magnetic dipole parasitic plate 43 is opposite to the orientation of the opening of the conductive structure 45 connecting the magnetic dipole driving plate 41.
[0035] When the electric dipole assembly 7 receives a current signal, the current on the electric dipole driving plate 73 flows toward both ends of the electric dipole driving plate 73. At the same time, the induced current on the electric dipole parasitic plate 75 also flows from the middle to both ends. In other words, the current flow direction of the electric dipole unit is parallel to the antenna ground.
[0036] When the magnetic dipole assembly 4 receives a current signal, the current on the magnetic dipole driving plate 41 flows through the metallized hole and air to the magnetic dipole ground layer 3. At the same time, the induced current on the magnetic dipole parasitic plate 43 also flows through the metallized hole and air to the magnetic dipole ground layer 3. In other words, the current flow direction of the magnetic dipole unit is perpendicular to the antenna ground.
[0037] The electric dipole assembly 7 is located on the top surface of the dual-polarized Yagi antenna. This allows for a thinner central dielectric plate 1, thereby reducing the cross-sectional thickness of the dual-polarized Yagi antenna. The reason for this is that if the positions of the electric dipole assembly 7 and the magnetic dipole assembly 4 were interchanged, the thickness of the central dielectric plate 1 would need to be greater than or equal to 2λ (where λ is the operating wavelength of the dual-polarized Yagi antenna) to ensure that the magnetic dipole ground layer 3 has no impact on the electric dipole assembly 7. However, as in this embodiment, by placing the electric dipole assembly 7 on the top surface of the dual-polarized Yagi antenna, since the current direction of the magnetic dipole unit is perpendicular to the antenna, the thickness of the central dielectric plate 1 only needs to be greater than or equal to 0.15λ to ensure that the electric dipole ground layer 6 has no impact on the magnetic dipole assembly 4.
[0038] Preferably, the central dielectric plate 1 is provided with a plurality of through holes 11, which penetrate the top and bottom surfaces of the central dielectric plate 1. In this embodiment, the plurality of through holes 11 are arranged in a rectangular array. The dense arrangement of through holes 11 on the central dielectric plate 1 can prevent the electric dipole ground layer 6 from affecting the radiation pattern of the magnetic dipole assembly 4.
[0039] The electric dipole assembly 7 and the magnetic dipole assembly 4 are staggered, meaning that when viewed from above and through the dual-polarized Yagi antenna, the electric dipole assembly 7 and the magnetic dipole assembly 4 have no overlapping area or only a small overlapping area. In this embodiment, only the electric dipole reflector 74 and the magnetic dipole assembly 4 have an overlapping area in the electric dipole assembly 7. This allows for minimizing the length of the dual-polarized Yagi antenna while ensuring its performance, thus reducing its overall size.
[0040] In this embodiment, the electric dipole assembly 7 and the magnetic dipole assembly 4 are both microstrip structures, which allows the dual-polarized Yagi antenna to be manufactured using only circuit board processing technology, thus facilitating the processing and manufacturing of the dual-polarized Yagi antenna.
[0041] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.
Claims
1. A dual-polarized Yagi antenna, characterized in that: The system comprises, from bottom to top, a magnetic dipole module, a central dielectric plate, and an electric dipole module, all stacked and connected in sequence. The magnetic dipole module includes a lower dielectric plate, with a magnetic dipole ground layer on its bottom surface and a magnetic dipole assembly connected to the magnetic dipole ground layer on its top surface. The electric dipole module includes an upper dielectric plate, with an electric dipole assembly on its top surface and an electric dipole ground layer on its bottom surface. The electric dipole assembly and the magnetic dipole assembly are misaligned; The central medium plate is provided with multiple through holes, which penetrate the top and bottom surfaces of the central medium plate.
2. The dual-polarized Yagi antenna according to claim 1, characterized in that: The electric dipole assembly includes a microstrip line, a balun, an electric dipole driver plate, an electric dipole reflector plate, and several electric dipole parasitic plates. The electric dipole driver plate has a slot in the middle, which divides the electric dipole driver plate into two sub-driver plates. The balun connects the microstrip line and the two sub-driver plates respectively. The electric dipole reflector plate is located on one side of the electric dipole driver plate and is connected to the electric dipole ground layer. The electric dipole reflector plate has a through slot for the balun to pass through. The electric dipole parasitic plates are located on the other side of the electric dipole driver plate and are arranged side by side with the electric dipole driver plate.
3. The dual-polarized Yagi antenna according to claim 2, characterized in that: The number of the electric dipole parasitic plates is four.
4. The dual-polarized Yagi antenna according to claim 2, characterized in that: The electric dipole formation is located on the side of the electric dipole reflector away from the electric dipole drive plate.
5. The dual-polarized Yagi antenna according to claim 2, characterized in that: The bottom of the magnetic dipole module is provided with an electric dipole connector, which is connected to the microstrip line for conduction.
6. The dual-polarized Yagi antenna according to claim 1, characterized in that: The magnetic dipole assembly includes a magnetic dipole driving plate, a magnetic dipole reflecting plate located on one side of the magnetic dipole driving plate, and a plurality of magnetic dipole parasitic plates located on the other side of the magnetic dipole driving plate. The magnetic dipole driving plate, the magnetic dipole reflecting plate, and the magnetic dipole parasitic plates are arranged side by side and each of them is connected to the magnetic dipole formation.
7. The dual-polarized Yagi antenna according to claim 6, characterized in that: The bottom of the magnetic dipole module is provided with a magnetic dipole connector, which is connected to the magnetic dipole drive plate.
8. The dual-polarized Yagi antenna according to claim 6, characterized in that: The lower dielectric substrate contains multiple sets of conductive structures. Each set of conductive structures includes multiple metallized holes arranged in a U-shape. The magnetic dipole driving plate, magnetic dipole reflecting plate, and magnetic dipole parasitic plate are connected to the magnetic dipole ground layer through the conductive structures. The orientation of the opening of the conductive structure connecting the magnetic dipole reflecting plate is the same as the orientation of the opening of the conductive structure connecting the magnetic dipole driving plate, and the orientation of the opening of the conductive structure connecting the magnetic dipole parasitic plate is opposite to the orientation of the opening of the conductive structure connecting the magnetic dipole driving plate.