Headphone module

Abstract

The present invention provides an earphone module, comprising a first circuit board. The first circuit board comprises a touch panel layer, a ground layer, an antenna layer and a touch circuit layer group. The ground layer is arranged at intervals below the touch panel layer. The antenna layer comprises an antenna plane portion, an antenna feed trace and an antenna short-circuit trace. The antenna plane portion is arranged at intervals below the ground layer, and the antenna feed trace and the antenna short-circuit trace are connected to the antenna plane portion. The touch circuit layer group is arranged at intervals below the antenna plane portion and comprises a touch chip. The touch panel layer is electrically connected to the touch chip. The earphone module of the present invention integrates touch and antenna structures in the form of a multi-layer stacked assembly, and does not require the use of elastic components to connect between the antenna and the circuit board or between the touch panel and the circuit board. This not only saves internal space of the earphone, but also brings good antenna performance.

Description

Technical Field

[0001] The present invention relates to an earphone module, and more particularly to an earphone module integrating touch and antenna functions. Background Art

[0002] Typical Bluetooth touch headsets use an elastic component to connect the antenna to the circuit board, and another elastic component to connect the touch panel to the circuit board. Because these elastic components are large and numerous, they occupy a significant amount of space inside the headset, hindering space utilization and improving headset performance. Summary of the Invention

[0003] The present invention provides an earphone module that integrates touch and antenna structures using a multi-layer stacked assembly. It eliminates the need for elastic components to connect the antenna and circuit board or between the touch panel and circuit board, thereby saving space inside the earphone and providing good antenna performance.

[0004] An earphone module according to the present invention includes a first circuit board. The first circuit board includes a touch panel layer, a ground layer, an antenna layer, and a touch circuit layer group. The ground layer is disposed at intervals below the touch panel layer. The antenna layer includes an antenna plane portion, an antenna feed trace, and an antenna short-circuit trace. The antenna plane portion is disposed at intervals below the ground layer, and the antenna feed trace and the antenna short-circuit trace are connected to the antenna plane portion. The touch circuit layer group is disposed at intervals below the antenna plane portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

[0005] In one embodiment of the present invention, the touch circuit layer group further includes a touch trace assembly spaced below the antenna short-circuit trace, and the width of the antenna short-circuit trace is greater than or equal to the width of the touch trace assembly.

[0006] In one embodiment of the present invention, the touch circuit layer group further includes a ground trace located next to the touch trace component. The ground trace is located between the touch trace component and a projection of the antenna feed trace on the surface where the touch trace component is located.

[0007] In one embodiment of the present invention, the above-mentioned touch circuit layer group also includes a first touch circuit layer, a second touch circuit layer and a third touch circuit layer. The first touch circuit layer is arranged at intervals below the antenna plane portion, the second touch circuit layer is arranged at intervals below the first touch circuit layer, the third touch circuit layer is arranged at intervals below the second touch circuit layer, and the touch chip is located in the third touch circuit layer.

[0008] In one embodiment of the present invention, the antenna plane portion, the first touch circuit layer, the second touch circuit layer, and the third touch circuit layer are connected to the ground layer through a plurality of ground through holes.

[0009] In one embodiment of the present invention, the touch panel layer is connected to the touch circuit layer group through a plurality of touch through holes on the ground layer and the antenna plane portion, and is electrically connected to the touch chip.

[0010] In one embodiment of the present invention, the touch panel layer includes a plurality of blocks electrically separated from each other, and the plurality of blocks are respectively connected to the touch circuit layer group through a plurality of touch through holes.

[0011] In one embodiment of the present invention, the earphone module further includes a microphone, wherein the first circuit board includes a notch corresponding to the microphone, and a projection of the microphone on the first circuit board is located within the notch.

[0012] In one embodiment of the present invention, the earphone module further includes a second circuit board disposed below the first circuit board, wherein the antenna feed trace from the second circuit board along the edge of the first circuit board to the portion adjacent to the notch forms a resonant path, the resonant path couples out a frequency band, and the length of the resonant path is 0.25 times the wavelength of the frequency band.

[0013] In one embodiment of the present invention, when the earphone module is placed in a human ear, the antenna feed line is close to the antihelix of the human ear and away from the earlobe, and the resonance path extends from the antihelix along the tragus and antitragus direction.

[0014] In one embodiment of the present invention, the earphone module further includes a second circuit board disposed below the first circuit board, the antenna feed trace and the antenna short-circuit trace are connected to the second circuit board, and the shortest distance between the first circuit board and the second circuit board is greater than or equal to 2.5 mm.

[0015] In one embodiment of the present invention, the above-mentioned earphone module further includes a second circuit board, which is arranged below the first circuit board. The first circuit board includes a first side and a second side relative to each other, and the second circuit board includes a third side and a fourth side relative to each other. The antenna feed line is configured on the first side of the first circuit board and the third side of the second circuit board, and the distance between the second side and the fourth side is greater than or equal to the distance between the first side and the third side.

[0016] In one embodiment of the present invention, when the earphone module is placed in a human ear, the second circuit board is located between the first circuit board and the external auditory canal of the human ear, so that the antenna layer generates an antenna polarization direction that enters the external auditory canal.

[0017] Based on the above, the first circuit board of the earphone module of the present invention includes a touch panel layer, a ground layer, an antenna layer and a touch circuit layer group. The ground layer is arranged at intervals below the touch panel layer. The antenna layer includes an antenna plane portion, an antenna feed trace and an antenna short-circuit trace. The antenna plane portion is arranged at intervals below the ground layer, and the antenna feed trace and the antenna short-circuit trace are connected to the antenna plane portion. The touch circuit layer group is arranged at intervals below the antenna plane portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip. With the above-mentioned multi-layer integrated design, the earphone module of the present invention integrates the touch and antenna structure into the first circuit board, which not only saves the internal space of the earphone, but also brings good antenna performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the appearance of an earphone module according to an embodiment of the present invention;

[0019] Figure 2 yes Figure 1 Schematic diagram of a hidden housing of an earphone module;

[0020] Figure 3 yes Figure 1 An exploded view of the multi-layer structure of the first circuit board of the earphone module and a schematic diagram of the second circuit board;

[0021] Figure 4A yes Figure 1 A schematic diagram of the layout of the touch panel layer of the earphone module;

[0022] Figure 4B yes Figure 1 A schematic diagram of the layout of the ground layer of the earphone module;

[0023] Figure 4C yes Figure 1 A schematic diagram of the layout of the antenna layer of the earphone module;

[0024] Figure 4D yes Figure 1 A schematic diagram of the layout of the first touch circuit layer of the earphone module;

[0025] Figure 4E yes Figure 1 A schematic diagram of the layout of the second touch circuit layer of the earphone module;

[0026] Figure 4F yes Figure 1 A schematic diagram of the layout of the third touch circuit layer of the earphone module;

[0027] Figure 5 yes Figure 1 Schematic diagram of placing the earphone module into the human ear;

[0028] Figure 6A yes Figure 1 A schematic diagram of the relative positions of the first circuit board and the second circuit board of the earphone module;

[0029] Figure 6B is a schematic diagram of another relative position of the first circuit board and the second circuit board of the earphone module according to one embodiment of the present invention;

[0030] Figure 7A yes Figure 1 The relationship between the frequency and radiation efficiency of the earphone module;

[0031] Figure 7B yes Figure 1 Another relationship diagram between frequency and radiation efficiency of the earphone module.

[0032] Description of Reference Numerals

[0033] D1, D2: distance;

[0034] E1: first side;

[0035] E2: second side;

[0036] E3: third side;

[0037] E4: fourth side;

[0038] H1: grounding through hole;

[0039] H2: touch through hole;

[0040] 10: earphone module;

[0041] 50: housing;

[0042] 100: first circuit board;

[0043] 105: gap;

[0044] 110: touch panel layer;

[0045] 111: block;

[0046] 120: ground layer;

[0047] 130: antenna layer;

[0048] 131: antenna plane portion;

[0049] 132: antenna feed line;

[0050] 133: Antenna short circuit routing;

[0051] 140: touch circuit layer group;

[0052] 141: first touch circuit layer;

[0053] 142: second touch circuit layer;

[0054] 143: third touch circuit layer;

[0055] 144: touch wiring component;

[0056] 145: ground wiring;

[0057] 150: touch chip;

[0058] 210: second circuit board;

[0059] 220: Microphone;

[0060] 230: plastic parts;

[0061] 240: antenna feed point;

[0062] 250: human ear;

[0063] 251: Antihelix crus;

[0064] 252: tragus;

[0065] 253: antitragus;

[0066] 254: earlobe. DETAILED DESCRIPTION

[0067] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0068] Figure 1 FIG. 1 is a schematic diagram of the appearance of an earphone module according to an embodiment of the present invention. Figure 2 yes Figure 1 Schematic diagram of the hidden shell of the earphone module. Figure 2 In order to clearly show the internal structure of the earphone module, the earphone shell 50 is hidden.

[0069] See also Figure 1 and Figure 2 The earphone module 10 of this embodiment includes a housing 50, a first circuit board 100 located in the housing 50, a second circuit board 210, and at least one microphone 220 ( Figure 2 ) and plastic part 230( Figure 2 , indicated by dotted lines).

[0070] In this embodiment, the second circuit board 210 is disposed below the first circuit board 100, and a plastic member 230 ( Figure 2), for supporting the first circuit board 100. Of course, the material of the plastic part 230 is not limited to plastic, and can also be other non-conductive materials.

[0071] In this embodiment, the earphone module 10 integrates the touch function and antenna structure into the first circuit board 100 through multi-layer integration, and the first circuit board 100 is electrically connected to the second circuit board 210 (main board) through a flexible circuit board. The first circuit board 100 will be described below.

[0072] Figure 3 yes Figure 1 The exploded view of the multi-layer structure of the first circuit board of the earphone module and the schematic diagram of the second circuit board. Figure 3 In the embodiment, multiple dielectric layers between these circuit layers are hidden, and in fact these circuit layers are separated from each other.

[0073] See also Figure 3 In this embodiment, the first circuit board 100 includes a touch panel layer 110 , a ground layer 120 , an antenna layer 130 and a touch circuit layer group 140 .

[0074] The touch panel layer 110 includes a plurality of electrically isolated blocks 111 to sense different touch gestures of the user, thereby realizing multi-touch functionality. In this embodiment, the number of blocks 111 is four, but this is not a limitation. The number of blocks 111 can be adjusted according to design requirements.

[0075] The ground layer 120 is disposed below the touch panel layer 110 at intervals and electrically isolates the touch panel layer 110 from the antenna layer 130 , so that the first circuit board 100 is compatible with touch and antenna signals.

[0076] The antenna layer 130 is spaced apart and disposed beneath the ground layer 120. It includes an antenna plane 131, an antenna feed trace 132, and an antenna shorting trace 133, forming a planar inverted-F antenna architecture (PIFA). The contour and shape of the antenna plane 131 roughly correspond to those of the touch panel layer 110 and the ground layer 120. The antenna feed trace 132 and the antenna shorting trace 133 are separate and connected to the antenna plane 131.

[0077] In this embodiment, the antenna planar portion 131 is connected to the antenna feed point 240 of the second circuit board 210 via the antenna feed trace 132, allowing the RF signal from the second circuit board 210 to be transmitted to the antenna planar portion 131. The earphone module 10 of this embodiment does not require the use of elastic components between the antenna and the circuit board as in conventional structures. Instead, it connects to the second circuit board 210 via the antenna feed trace 132, effectively reducing the size and providing a more stable antenna signal.

[0078] In addition, the antenna short-circuit trace 133 is connected to the second circuit board 210 to serve as a reference ground for the touch circuit layer assembly 140 to avoid high-frequency interference that may be generated by the touch circuit layer assembly 140 .

[0079] The touch circuit layer group 140 is disposed below the antenna plane portion 131 at intervals. The touch circuit layer group 140 includes a first touch circuit layer 141, a second touch circuit layer 142, and a third touch circuit layer 143. Figure 3 As shown, the first touch circuit layer 141 is disposed below the antenna plane portion 131 at intervals, the second touch circuit layer 142 is disposed below the first touch circuit layer 141 at intervals, and the third touch circuit layer 143 is disposed below the second touch circuit layer 142 at intervals.

[0080] The first touch circuit layer 141, the second touch circuit layer 142, and the third touch circuit layer 143 are all part of the touch circuit layout. Specifically, the first touch circuit layer 141 may have touch power traces (not shown) and control signal traces (not shown) on a plane.

[0081] Furthermore, the first touch circuit layer 141 also includes a downwardly extending touch trace assembly 144. The touch trace assembly 144 is spaced apart and disposed below the antenna shorting trace 133. In this embodiment, the width of the antenna shorting trace 133 is greater than or equal to the width of the touch trace assembly 144, thereby providing better interference resistance. Of course, the widths of the antenna shorting trace 133 and the touch trace assembly 144 can be adjusted as needed and are not limited to the above.

[0082] In addition, the second touch circuit layer 142 includes a touch power supply line (not shown), a control signal line (not shown), a touch circuit reference ground line (not shown), and a voltage stabilization circuit reference ground line (not shown). Furthermore, the third touch circuit layer 143 includes a touch chip 150 ( Figure 4F ) and a voltage stabilizing circuit (not shown), the touch chip 150 is used to process the touch signal of the touch panel layer 110.

[0083] In addition, in this embodiment, the touch chip 150 can be bridged with the power traces (not shown) and control signal traces (not shown) of the Bluetooth single chip (not shown) of the second circuit board 210 through the touch trace component 144 of the first touch circuit layer 141 .

[0084] Figures 4A to 4F They are Figure 1 Schematic diagram of the layout of the touch panel layer, ground layer, antenna layer, first touch circuit layer, second touch circuit layer and third touch circuit layer of the first circuit board 100 of the earphone module.

[0085] See also Figures 4A to 4FThese blocks 111 of the touch panel layer 110, the antenna plane portion 131, the first touch circuit layer 141, the second touch circuit layer 142, and the third touch circuit layer 143 can be electrically connected to the ground layer 120 through a plurality of ground through holes H1 provided at the periphery of each layer to achieve a common ground effect for the system.

[0086] In addition, the blocks 111 of the touch panel layer 110 are connected to the ground layer 120, the antenna plane portion 131, the first touch circuit layer 141 and the second touch circuit layer 142 through the plurality of touch through holes H2 ( Figures 4B to 4E ) is connected to the third touch circuit layer 143.

[0087] Therefore, the touch panel layer 110 can be electrically connected to the touch chip 150 of the third touch circuit layer 143. In other words, the capacitance change signal caused by the user's finger touch on the touch panel layer 110 can be transmitted to the touch chip 150 through these touch through holes H2. The touch chip 150 can process the received touch signal to determine the user's gesture change, thereby realizing the multi-touch function.

[0088] Conventional earphone modules use an elastic component to connect the touch panel to the circuit board, and another elastic component to connect the antenna to the circuit board. Because the elastic components themselves are bulky, they not only take up considerable space inside the earphones, but also, due to limited space, it's difficult to increase the number of elastic components, making multi-touch functionality difficult to implement.

[0089] Compared to conventional earphone modules, the earphone module 10 of this embodiment does not require the use of elastic components to connect the antenna and the circuit board or between the touch panel and the circuit board. Instead, it uses a multi-layer integrated first circuit board 100 and directly connects the touch panel layer 110 and the third touch circuit layer 143 where the touch chip 150 is located using touch through holes H2, greatly shortening the distance between the two and eliminating the internal space originally occupied by the elastic components.

[0090] Furthermore, the earphone module 10 of this embodiment eliminates the need for multiple elastic components. Instead, it utilizes multiple touch through-holes H2 corresponding to these blocks 111, enabling multi-touch functionality within a limited footprint. Furthermore, the shortened distance between the touch panel layer 110 and the touch chip 150 effectively reduces touch signal errors. In this embodiment, the number of ground through-holes H1 and touch through-holes H2 can be increased or decreased based on design requirements.

[0091] It is worth mentioning that Figure 4C and Figure 4DAs shown, the ground trace 145 of the first touch circuit layer 141 is located next to the touch trace component 144 and between the touch trace component 144 and the projection of the antenna feed trace 132 on the surface where the touch trace component 144 is located. This design allows the ground trace 145 to effectively isolate the antenna signal from the touch signal, thereby preventing interference between the two.

[0092] Figure 5 yes Figure 1 Schematic diagram of the earphone module being placed in the human ear. It must be noted that in order to clearly show the positions of the internal components, the housing of the earphone module 10 is shown in perspective. Figure 5 As shown, the human ear 250 includes an antihelix 251 located above the ear canal hole (the part that is inserted into the earphone module 10, not shown), a tragus 252 located on the right side of the ear canal hole, an antitragus 253 located below the ear canal hole, and an earlobe 254 located at the lower part of the human ear.

[0093] Since the earphone module 10 forms a Bluetooth connection with an electronic device (not shown), such as a mobile phone or tablet computer, when in use, taking a mobile phone as an example, the mobile phone may be placed in a pocket or held by the user. In this case, the Bluetooth connection between the earphone module 10 and the electronic device will be blocked by the human body. Figure 5 As shown, in this embodiment, when the earphone module 10 is placed in the human ear 250, the antenna feed line 132 will be close to the antihelix 251 of the human ear 10 and away from the earlobe 254, so that the radiation direction of the antenna is toward Figure 5 This design can provide good cross-body (across the human body) performance for the Bluetooth connection between the earphone module 10 and the electronic device when in use.

[0094] The antenna resonant path of this embodiment ( Figure 5 The central thick black arrow line of the earphone module 10) is from the antenna feeding point 240 (close to the lower foot 251 of the antihelix) Figure 2 ), along the antenna feed trace 132 and gradually away from the auditory canal hole, then along the periphery of the first circuit board 100 near the tragus 252, extending toward the antitragus 253, and finally to the notch 105 ( Figure 2 ) next to the area.

[0095] See also Figure 2 and Figure 5 The first circuit board 100 and the second circuit board 210 are connected by a plastic member 230 (dielectric constant ε r =2.7) and air (ε r= 1) as the medium. Under these conditions, the antenna resonant path length is 26.8 mm, capable of coupling a frequency band 0.25 times the wavelength. The frequency band coupled by the earphone module 10 is, for example, the 2.4 GHz Bluetooth band, but this frequency band is not limited to this. Furthermore, the earphone module 10 includes an impedance matching circuit, which allows for optimized antenna radiation efficiency after assembly.

[0096] In addition, in this embodiment, the number of at least one microphone 220 is two and is disposed on the second circuit board 210 ( Figure 2 The position of the microphone 220 is determined based on the best simulation result of the microphone algorithm, and the line between the two microphones 220 is roughly toward the user's mouth (not shown, located at Figure 5 ), which helps the antenna's signal transmission and reception performance, but the location is not limited to this.

[0097] Furthermore, to orient the connection between the two microphones 220 substantially toward the user's mouth, the first circuit board 100 includes a notch 105 corresponding to the microphones 220, so that the projection of the microphones 220 onto the first circuit board 100 is located within the notch 105. This design allows the first circuit board 100 to avoid the microphones 220, providing greater spatial flexibility in the placement of the microphones 220.

[0098] In this embodiment, since the second circuit board 210 ( Figure 2 ) is located below the first circuit board 100. When the earphone module 10 is placed in the human ear 250, the second circuit board 210 will be located between the first circuit board 100 and the external auditory canal of the human ear 250 (not shown, at the auditory canal hole), which helps the antenna layer 130 to generate an antenna polarization direction that is emitted into the external auditory canal, so as to reduce the impact of the human body on the antenna performance.

[0099] Figure 6A yes Figure 1 Schematic diagram of the relative positions of the first circuit board and the second circuit board of the earphone module. Figure 6A , the second circuit board 210 is located on the right side of the first circuit board 100 , and the external auditory canal (not shown) of the human ear 250 is located on the right side of the second circuit board 210 .

[0100] In this embodiment, the first circuit board 100 includes a first side E1 and a second side E2 opposite to each other, the second circuit board 210 includes a third side E3 and a fourth side E4 opposite to each other, and the antenna feed trace 132 ( Figure 2 ) are disposed on the first side E1 and the third side E3. Such a design enables the antenna layer 130 ( Figure 2) will be emitted in the direction of the second circuit board 210 (as shown by the arrow) through the first circuit board 100 in the form of an electric field, that is, towards the direction of the external auditory canal, thereby reducing the human body's absorption of the antenna signal and avoiding affecting the antenna performance.

[0101] In this embodiment, the first circuit board 100 and the second circuit board 210 are parallel to each other. That is, the distance D1 between the first side E1 and the third side E3 is equal to the distance D2 between the second side E2 and the fourth side E4. When the shortest distance between the first circuit board 100 and the second circuit board 210 is greater than or equal to 2.5 mm, good antenna radiation efficiency and operating bandwidth are maintained.

[0102] Of course, the first circuit board 100 and the second circuit board 210 are not limited thereto. Figure 6B FIG. 1 is a schematic diagram of another relative position of the first circuit board and the second circuit board of the earphone module according to an embodiment of the present invention. Figure 6B As shown, the first circuit board 100 and the second circuit board 210 may also be non-parallel to each other. When the distance D2' between the second side E2 and the fourth side E4 is greater than the distance D1' between the first side E1 and the third side E3, the antenna layer 130 ( Figure 2 ) will be emitted in the direction indicated by the arrow in the form of an electric field through the first circuit board 100, thereby improving the radiation energy of the lower hemisphere of the earphone module 10 and helping to enhance cross-body performance.

[0103] Figure 7A yes Figure 1 A graph showing the relationship between frequency and radiation efficiency of an earphone module. Figure 7B yes Figure 1 Another relationship diagram between frequency and radiation efficiency of the earphone module. Figure 7A and Figure 7B The difference lies in whether the user touches the earphone module 10 with his hand (not shown). Specifically, Figure 7A is the case when the earphone module 10 is worn on the human ear 250, and Figure 7B This is a case where the earphone module 10 is worn on the human ear 250 and the user touches the earphone module 10 with their hand.

[0104] Please also see Figure 7A and 7B, according to actual measurements, in this embodiment, when the earphone module 10 is worn on a person's ear, the radiation efficiency at a frequency of 2.44 GHz is -6.95 dB, which is approximately 2 dB better than the radiation efficiency of conventional technology. Even when the user's hand touches the earphone module 10, the radiation efficiency of the present invention only slightly changes to -6.85 dB. In other words, the antenna signal is not easily interfered with by the human body. Furthermore, even when the user's hand touches the earphone module 10, the radiation efficiency of the present invention is also approximately 2 dB better than that of conventional technology, demonstrating excellent performance.

[0105] Furthermore, actual testing has shown that when the earphone module 10 is powered on, playing music, or playing music with the touch function enabled, the difference in the antenna receiving end is less than 1dB, indicating that the design of the earphone module 10 can maintain a stable signal and provide good antenna efficiency.

[0106] In summary, the first circuit board of the earphone module of the present invention includes a touch panel layer, a ground layer, an antenna layer and a touch circuit layer group. The ground layer is arranged at intervals below the touch panel layer. The antenna layer includes an antenna plane portion, an antenna feed trace and an antenna short-circuit trace. The antenna plane portion is arranged at intervals below the ground layer, and the antenna feed trace and the antenna short-circuit trace are connected to the antenna plane portion. The touch circuit layer group is arranged at intervals below the antenna plane portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip. With the above-mentioned multi-layer integrated design, the earphone module of the present invention integrates the touch and antenna structure into the first circuit board, and there is no need to use elastic components to connect between the antenna and the circuit board or between the touch panel and the circuit board, which not only saves space inside the earphone, but also produces good antenna performance.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An earphone module, characterized in that: include: A first circuit board includes: Touch panel layer; A ground layer is disposed below the touch panel layer at intervals; an antenna layer, comprising an antenna plane portion, an antenna feed trace, and an antenna short-circuit trace, wherein the antenna plane portion is disposed below the ground layer at intervals, and the antenna feed trace and the antenna short-circuit trace are connected to the antenna plane portion; as well as The touch circuit layer group is arranged at intervals below the antenna plane portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip. The touch circuit layer group also includes a touch trace component arranged at intervals below the antenna short-circuit trace. The width of the antenna short-circuit trace is greater than or equal to the width of the touch trace component.

2. The earphone module according to claim 1, wherein: The touch circuit layer group further includes a ground trace located beside the touch trace component. The ground trace is located between the touch trace component and a projection of the antenna feed trace on the surface where the touch trace component is located.

3. The earphone module according to claim 1, wherein: The touch circuit layer group also includes a first touch circuit layer, a second touch circuit layer and a third touch circuit layer. The first touch circuit layer is arranged at intervals below the antenna plane portion, the second touch circuit layer is arranged at intervals below the first touch circuit layer, and the third touch circuit layer is arranged at intervals below the second touch circuit layer. The touch chip is located in the third touch circuit layer.

4. The earphone module according to claim 3, characterized in that The antenna plane portion, the first touch circuit layer, the second touch circuit layer, and the third touch circuit layer are connected to the ground layer through a plurality of ground through holes.

5. The earphone module according to claim 1, wherein: The touch panel layer is connected to the touch circuit layer group through the ground layer and a plurality of touch through holes on the antenna plane portion, and is electrically connected to the touch chip.

6. The earphone module according to claim 5, characterized in that: The touch panel layer includes a plurality of blocks electrically separated from each other, and the plurality of blocks are respectively connected to the touch circuit layer group through the plurality of touch through holes.

7. The earphone module according to claim 1, characterized in that The circuit board further includes a microphone, wherein the first circuit board includes a notch corresponding to the microphone, and a projection of the microphone on the first circuit board is located within the notch.

8. The earphone module according to claim 7, characterized in that: It also includes a second circuit board, which is arranged below the first circuit board, wherein the antenna feed line from the second circuit board along the edge of the first circuit board to the position next to the notch is a resonant path, the resonant path couples out a frequency band, and the length of the resonant path is 0.25 times the wavelength of the frequency band.

9. The earphone module according to claim 8, characterized in that: When the earphone module is placed in a human ear, the antenna feeding line is close to the lower crus of the antihelix of the human ear and away from the earlobe, and the resonance path extends from the lower crus of the antihelix along the direction of the tragus and the antitragus.

10. The earphone module according to claim 1, characterized in that It also includes a second circuit board, which is arranged below the first circuit board, wherein the antenna feed trace and the antenna short-circuit trace are connected to the second circuit board, and the shortest distance between the first circuit board and the second circuit board is greater than or equal to 2.5 mm.

11. The earphone module according to claim 1, characterized in that: It also includes a second circuit board, which is arranged below the first circuit board. The first circuit board includes a first side and a second side that are opposite to each other. The second circuit board includes a third side and a fourth side that are opposite to each other. The antenna feed line is configured on the first side of the first circuit board and the third side of the second circuit board. The distance between the second side and the fourth side is greater than or equal to the distance between the first side and the third side.

12. The earphone module according to claim 10 or 11, characterized in that: When the earphone module is placed in a human ear, the second circuit board is located between the first circuit board and the external auditory canal of the human ear, so that the antenna layer generates an antenna polarization direction that is emitted into the external auditory canal.

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