A gas-liquid separation and collection device for a gluing unit

Abstract

The application provides a gas-liquid separation and collection device for a gluing unit. The collection device comprises a base, the base comprising a first wall and a second wall; a first partition plate; a second partition plate, the second partition plate being connected to the second wall in a matching mode, the first partition plate and the second partition plate being clamped to form a first channel, the first channel being communicated with a containing groove; a third partition plate, the third partition plate being connected to the second partition plate in a matching mode, the second partition plate and the third partition plate being clamped to form a second channel, the second channel being communicated with the containing groove; wherein the first wall surrounds a containing space, the containing space being used for placing a wafer and a bearing seat, waste liquid generated in the wafer gluing process entering the containing groove through the first channel, and waste gas generated in the wafer gluing process entering the containing groove through the second channel. The application solves the problem that the technical solutions in the related art cannot effectively separate and collect the waste gas and waste liquid in the gluing process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a gas-liquid separation and collection device for a coating unit. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits and is the basic material for making chips. With the development of wafer manufacturing technology in the semiconductor industry, the circuit structure of chips has become more complex, and the difficulty of their processing has gradually increased.

[0003] In the spin coating process of wafers, the wafer is placed on a carrier and rotated, and liquids such as photoresist and developer will inevitably splash. An air blowing device is installed above the carrier to clean up impurities during the spin coating process. In the prior art, a waste gas and waste liquid collection device is generally provided to collect the waste gas and waste liquid generated during the spin coating process. During the collection of waste gas and waste liquid, the splashed liquid will cause turbulence to the gas, which can easily contaminate the wafer, resulting in uneven photoresist and affecting the spin coating effect.

[0004] Therefore, it is evident that the problem with the related technologies is that the technical solutions in the related technologies cannot effectively separate and collect the waste gas and waste liquid during the homogenization process. Summary of the Invention

[0005] The problem solved by this invention is that the technical solutions in related technologies cannot effectively separate and collect the waste gas and waste liquid during the homogenization process.

[0006] To address the aforementioned problems, embodiments of the present invention provide a gas-liquid separation and collection device for a coating unit. The collection device includes: a base, comprising a first wall and a second wall, the first wall and the second wall being sandwiched to form a receiving groove, the diameter of the second wall being larger than the diameter of the first wall; a first partition plate, the first partition plate being fitted and connected to the first wall; a second partition plate, the second partition plate being fitted and connected to the second wall, the first partition plate and the second partition plate being sandwiched to form a first channel, the first channel communicating with the receiving groove; and a third partition plate, the third partition plate being fitted and connected to the second partition plate, the second partition plate and the third partition plate being sandwiched to form a second channel, the second channel communicating with the receiving groove. The first wall surrounds and forms a receiving space for placing a wafer and a carrier. Waste liquid generated during wafer coating enters the receiving groove through the first channel, and waste gas generated during wafer coating enters the receiving groove through the second channel.

[0007] Compared with the prior art, the technical effects achieved by adopting this technical solution are as follows: In this embodiment, the waste liquid and waste gas generated during the spin coating process enter through the first channel and the second channel respectively, achieving the effect of diversion; the splashed waste liquid will not interfere with the airflow, reducing the possibility of contamination during the wafer spin coating process and effectively improving the spin coating effect.

[0008] In one embodiment of the present invention, the first partition plate is connected to the first wall by a threaded nut.

[0009] Compared with existing technologies, the technical effects achieved by adopting this technical solution are: the connection method of the threaded nut is simple and reliable, and effectively improves the stability of the connection between the first partition plate and the first wall.

[0010] In one embodiment of the present invention, the first partition plate includes a first fixed baffle and a second fixed baffle, which are sandwiched to form a connecting groove; the first wall includes a connecting groove fitting member, which can engage with the connecting groove.

[0011] Compared with the prior art, the technical effects achieved by adopting this technical solution are as follows: In actual use, the groove fitting part is first connected to the connecting groove, and then the first partition plate is fixed to the first wall with nuts; the solution of this embodiment effectively improves the convenience of the installation process and the stability and reliability of the connection between the first partition plate and the first wall.

[0012] In one embodiment of the present invention, the second partition plate includes: a connecting plate, which is connected to the second wall; and a diverting plate, which is connected to the connecting plate by a plurality of circumferentially uniformly arranged connecting members; wherein the connecting plate, the diverting plate and the plurality of connecting members are integrally formed.

[0013] Compared with the prior art, the technical effects achieved by adopting this technical solution are as follows: the connecting plate, the diversion plate and multiple connecting parts are integrally formed, which effectively improves the strength of the second partition plate; at the same time, the solution of this embodiment allows the exhaust gas to enter the receiving tank after entering the second channel, which effectively improves the reliability of the collection device.

[0014] In one embodiment of the present invention, the diversion plate includes a first plate and a second plate connected to each other. The first plate is farther away from the support seat than the second plate. When the collecting device is placed horizontally, the angle between the first plate and the horizontal plane is greater than the angle between the second plate and the horizontal plane.

[0015] Compared with the prior art, the technical effects achieved by adopting this technical solution are as follows: In this embodiment, the diversion plate includes a first plate and a second plate connected to each other. The first plate is away from the support seat, and the second plate is close to the support seat. When the collection device is placed horizontally, the angle between the first plate and the horizontal plane is greater than the angle between the second plate and the horizontal plane; that is, the slope of the first plate is steeper and the slope of the second plate is gentler. The solution of this embodiment effectively improves the passage efficiency of exhaust gas in the second channel and enhances the reliability of the collection device.

[0016] In one embodiment of the invention, the connecting plate is detachably connected to the second wall.

[0017] Compared with the existing technology, the technical effect achieved by adopting this technical solution is that the connecting plate is detachably connected to the second wall, which facilitates the disassembly and installation between the second partition plate and the base.

[0018] In one embodiment of the invention, the third partition plate is detachably connected to the second partition plate.

[0019] Compared with the existing technology, the technical effect achieved by adopting this technical solution is that the third partition plate is detachably connected to the second partition plate, which facilitates the disassembly and installation of the third partition plate and the second partition plate.

[0020] In one embodiment of the invention, the third partition includes a liquid baffle that protrudes relative to the upper surface of the third partition.

[0021] Compared with the prior art, the technical effect achieved by adopting this technical solution is: the solution of this embodiment can effectively block splashing waste liquid and improve the reliability of the collection device.

[0022] In one embodiment of the present invention, the base includes a drain outlet located on the bottom surface of the base.

[0023] Compared with existing technologies, the technical effects achieved by adopting this technical solution are as follows: the drain port is used to discharge the liquid in the receiving tank, so that the collection device can continuously discharge the waste liquid generated during the homogenization process.

[0024] In one embodiment of the invention, the base includes at least one air vent that protrudes relative to the bottom surface of the base.

[0025] Compared with existing technologies, the technical effects achieved by adopting this technical solution are as follows: the air guide is used to discharge the waste gas in the receiving tank, so that the collection device can continuously discharge the waste gas generated during the homogenization process. Attached Figure Description

[0026] Figure 1 This is one of the structural schematic diagrams of the collection device according to some embodiments of the present invention;

[0027] Figure 2 This is a second schematic diagram of the structure of the collection device according to some embodiments of the present invention;

[0028] Figure 3 This is a cross-sectional view of a collection device according to some embodiments of the present invention;

[0029] Figure 4 This is a schematic diagram of the base structure according to some embodiments of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the second partition plate in some embodiments of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100-Base; 110-First wall; 111-Accommodation space; 112-Connecting groove fitting; 120-Second wall; 130-Accommodation groove; 140-Drain outlet; 150-Air guide; 200-First partition plate; 210-First channel; 231-First fixed baffle; 232-Second fixed baffle; 234-Connecting groove; 300-Second partition plate; 310-Second channel; 320-Connecting plate; 321-Connecting fitting; 330-Diverter plate; 331-First plate; 332-Second plate; 400-Third partition plate; 410-Baffle plate. Detailed Implementation

[0033] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] See Figure 1 , Figure 2 and Figure 3 This embodiment provides a gas-liquid separation and collection device for an adhesive coating unit. The collection device includes: a base 100, which includes a first wall 110 and a second wall 120, which are sandwiched to form a receiving groove 130, and the diameter of the second wall 120 is larger than the diameter of the first wall 110; a first partition plate 200, which is connected to the first wall 110; and a second partition plate 300, which is connected to the second wall 120, and the first partition plate 200 and the second partition plate 300 are sandwiched to form a first channel 21. 0. The first channel 210 is connected to the receiving tank 130; the third partition plate 400 is connected to the second partition plate 300, and the second partition plate 300 and the third partition plate 400 are sandwiched to form the second channel 310, which is connected to the receiving tank 130; wherein, the first wall 110 surrounds to form a receiving space 111, which is used to place the wafer and the carrier. The waste liquid generated by wafer homogenization enters the receiving tank 130 through the first channel 210, and the waste gas generated by wafer homogenization enters the receiving tank 130 through the second channel 310.

[0035] In this embodiment, the collection device includes a base 100, a first partition plate 200, a second partition plate 300, and a third partition plate 400. The base 100 includes a first wall 110 and a second wall 120, which are sandwiched to form a receiving groove 130. The diameter of the second wall 120 is larger than the diameter of the first wall 110. The first wall 110 surrounds and forms a receiving space 111, which is used to place a wafer and a carrier. The wafer is fixed to the carrier, and the carrier rotates to perform homogenization. During the homogenization process, waste liquid and waste gas are generated. The waste liquid generated by wafer homogenization enters the receiving groove 130 through the first channel 210, and the waste gas generated by wafer homogenization enters the receiving groove 130 through the second channel 310.

[0036] In actual use, the second partition plate 300 divides the space between the first partition plate 200 and the third partition plate 400 into the first channel 210 and the second channel 310. Since the height of the support is between the first partition plate 200 and the second partition plate 300, the waste liquid thrown out by the support during the rotation and homogenization process will enter the receiving tank 130 through the first channel 210. The gas used to clean the impurities in the homogenization process is blown downward from above the support, and the waste gas enters the receiving tank 130 through the second channel 310.

[0037] Understandably, in this embodiment, the waste liquid and waste gas generated during the spin coating process enter through the first channel 210 and the second channel 310 respectively, achieving the effect of diversion; the splashed waste liquid will not interfere with the airflow, reducing the possibility of contamination during the wafer spin coating process and effectively improving the spin coating effect.

[0038] Further, see Figure 1 , Figure 2 and Figure 3 In one specific embodiment, the first partition plate 200 is connected to the first wall 110 by a threaded nut.

[0039] In this embodiment, the first partition plate 200 is provided with a through hole for the nut to pass through, and the corresponding position of the first wall 110 is provided with a threaded hole for engaging with the nut.

[0040] Understandably, the threaded nut connection method is simple and reliable, effectively improving the stability of the connection between the first partition plate 200 and the first wall 110.

[0041] Further, see Figure 1 , Figure 2 , Figure 3 and Figure 4In one specific embodiment, the first partition plate 200 includes a first fixed baffle 231 and a second fixed baffle 232, which are clamped together to form a connecting groove 234; the first wall 110 includes a connecting groove mating member 112, which can be engaged with the connecting groove 234.

[0042] In this embodiment, the first partition plate 200 includes a first fixed baffle 231 and a second fixed baffle 232, which are clamped to form a connecting groove 234. The connecting groove mating member 112 can engage with the connecting groove 234. The width of the connecting groove mating member 112 is slightly smaller than the width of the connecting groove 234 so that the connecting groove mating member 112 can engage with the connecting groove 234 more easily.

[0043] Understandably, in actual use, the connecting groove fitting 112 is first connected to the connecting groove 234, and then the first partition plate 200 is fixed to the first wall 110 with nuts. The solution of this embodiment effectively improves the convenience of the installation process and the stability and reliability of the connection between the first partition plate 200 and the first wall 110.

[0044] Further, see Figure 5 In one specific embodiment, the second partition plate 300 includes: a connecting plate 320, which is connected to the second wall 120; and a diversion plate 330, which is connected to the connecting plate 320 by a plurality of circumferentially uniformly arranged connectors 321; wherein the connecting plate 320, the diversion plate 330 and the plurality of connectors 321 are integrally formed.

[0045] In this embodiment, the second partition plate 300 includes a connecting plate 320 and a diversion plate 330. The diversion plate 330 and the connecting plate 320 are connected by a plurality of circumferentially evenly arranged connectors 321. A hollow space is formed between every two connectors 321. The plurality of hollow spaces are used to allow the exhaust gas to enter the second channel 310 and then enter the receiving groove 130 through the plurality of hollow spaces.

[0046] Understandably, the connecting plate 320, the diversion plate 330, and the multiple connecting parts 321 are integrally formed, which effectively improves the strength of the second partition plate 300. At the same time, the solution of this embodiment allows the exhaust gas to enter the receiving tank 130 after entering the second channel 310, which effectively improves the reliability of the collection device.

[0047] Further, see Figure 3In one specific embodiment, the diversion plate 330 includes a first plate 331 and a second plate 332 connected to each other. The first plate 331 is farther away from the support than the second plate 332. When the collecting device is placed horizontally, the angle between the first plate 331 and the horizontal plane is greater than the angle between the second plate 332 and the horizontal plane.

[0048] Understandably, in this embodiment, the diversion plate 330 includes a first plate 331 and a second plate 332 connected to each other. The first plate 331 is away from the support seat, and the second plate 332 is close to the support seat. When the collection device is placed horizontally, the angle between the first plate 331 and the horizontal plane is greater than the angle between the second plate 332 and the horizontal plane; that is, the slope of the first plate 331 is steeper, and the slope of the second plate 332 is gentler. The solution of this embodiment effectively improves the passage efficiency of exhaust gas in the second channel 310 and enhances the reliability of the collection device.

[0049] Further, see Figure 1 , Figure 2 and Figure 3 In one specific embodiment, the connecting plate 320 is detachably connected to the second wall 120.

[0050] Understandably, the connecting plate 320 is detachably connected to the second wall 120, facilitating the disassembly and installation between the second partition plate 300 and the base 100.

[0051] Further, see Figure 1 , Figure 2 and Figure 3 In one specific embodiment, the third partition plate 400 is detachably connected to the second partition plate 300.

[0052] Understandably, the third partition 400 is detachably connected to the second partition 300, which facilitates the disassembly and installation of the third partition 400 and the second partition 300.

[0053] Further, see Figure 3 In one specific embodiment, the third partition plate 400 includes a liquid baffle 410 that protrudes relative to the upper surface of the third partition plate 400.

[0054] In this embodiment, the third partition plate 400 includes a liquid baffle plate 410, which is disposed on the top of the third partition plate 400 and protrudes from the upper surface of the third partition plate 400. In actual use, most of the waste liquid will enter the receiving tank 130 through the first channel 210, and a very small amount of waste liquid will splash. The liquid baffle plate 410 is used to block the splashed waste liquid.

[0055] Understandably, the solution in this embodiment can effectively block splashing waste liquid and improve the reliability of the collection device.

[0056] Further, see Figures 1 to 4 In one specific embodiment, the base 100 includes a drain port 140, which is located on the bottom surface of the base 100.

[0057] In this embodiment, the base 100 includes a drain port 140, which is located on the bottom surface of the base 100 and is used to drain the liquid in the receiving tank 130.

[0058] Understandably, the drain port 140 is used to drain the liquid in the receiving tank 130, so that the collection device can continuously drain the waste liquid generated during the homogenization process.

[0059] Further, see Figures 1 to 4 In one specific embodiment, the base 100 includes at least one air vent 150 that protrudes relative to the bottom surface of the base 100.

[0060] In this embodiment, the base 100 includes at least one air vent 150, which protrudes from the bottom surface of the base 100. Waste liquid in the receiving tank 130 cannot flow out through the air vent 150, but waste gas can flow out from the air vent 150.

[0061] Understandably, the air vent 150 is used to discharge the waste gas in the receiving tank 130, so that the collection device can continuously discharge the waste gas generated during the homogenization process.

[0062] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A gas-liquid separation and collection device for a coating unit, characterized in that, The collection device includes: A base (100) includes a first wall (110) and a second wall (120), the first wall (110) and the second wall (120) are sandwiched to form a receiving groove (130), and the diameter of the second wall (120) is larger than the diameter of the first wall (110); The first partition plate (200) is connected to the first wall (110). The second partition plate (300) is connected to the second wall (120). The first partition plate (200) and the second partition plate (300) are sandwiched to form a first channel (210). The first channel (210) is connected to the receiving groove (130). The third partition plate (400) is connected to the second partition plate (300). The second partition plate (300) and the third partition plate (400) are sandwiched to form a second channel (310). The second channel (310) is connected to the receiving groove (130). The first wall (110) surrounds and forms a receiving space (111), which is used to place the wafer and the carrier, and the height of the carrier is located at the first partition. Between the plate (200) and the second partition plate (300), the waste liquid generated by the wafer spin coating enters the receiving tank (130) through the first channel (210), and the waste gas generated by the wafer spin coating enters the receiving tank (130) through the second channel (310); The second partition plate (300) includes a connecting plate (320) and a diversion plate (330). The connecting plate (320) is connected to the second wall (120). The diversion plate (330) and the connecting plate (320) are connected by a plurality of circumferentially evenly arranged connecting pieces (321). A hollow space is formed between every two connecting pieces (321). The plurality of hollow spaces are used to allow the exhaust gas to enter the second channel (310) and then enter the receiving groove (130) through the plurality of hollow spaces. The base (100) includes a drain port (140) and at least one air guide port (150), the drain port (140) being disposed on the bottom surface of the base (100); the air guide port (150) protruding relative to the bottom surface of the base (100).

2. The collecting device according to claim 1, characterized in that, The first partition plate (200) is connected to the first wall (110) by a threaded nut.

3. The collecting device according to claim 2, characterized in that, The first partition plate (200) includes a first fixed baffle (231) and a second fixed baffle (232), and the first fixed baffle (231) and the second fixed baffle (232) are sandwiched to form a connecting groove (234); The first wall (110) includes a connecting groove fitting (112), which can engage with the connecting groove (234).

4. The collecting device according to claim 1, characterized in that, The connecting plate (320), the diverter plate (330), and the plurality of connecting parts (321) are integrally formed.

5. The collecting device according to claim 4, characterized in that, The diversion plate (330) includes a first plate (331) and a second plate (332) connected to each other. The first plate (331) is farther away from the support than the second plate (332). When the collecting device is placed horizontally, the angle between the first plate (331) and the horizontal plane is greater than the angle between the second plate (332) and the horizontal plane.

6. The collecting device according to claim 4, characterized in that, The connecting plate (320) is detachably connected to the second wall (120).

7. The collecting device according to claim 1, characterized in that, The third partition plate (400) is detachably connected to the second partition plate (300).

8. The collecting device according to claim 1, characterized in that, The third partition (400) includes a liquid baffle (410) that protrudes relative to the upper surface of the third partition (400).

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