An electric device component and a method for manufacturing the same

Abstract

Disclosed herein are apparatus and methods for a power electronic device assembly, the power electronic device assembly comprising a cooling plate assembly and one or more power device assemblies. The cooling plate assembly has a manifold and a heat sink, the manifold having a heat sink cavity in a first surface, the heat sink comprising one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly comprises an S-cell, a power device, and a directly bonded metal substrate bonded to the S-cell. The S-cell comprises a base layer composed of at least graphite or a graphite composite material, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and electrically coupled to the conductive layer.

Description

Technical Field

[0001] This specification generally relates to devices and methods for power electronic device assemblies, and more particularly, to devices and methods for power electronic device assemblies with enhanced heat dissipation and improved assembly alignment. Background Art

[0002] Due to the increasing use of electronics in vehicles, there is a need to make electronic device systems more compact. One component of these electronic device systems is a power electronic device used as a switch in an inverter. Due to the heat generated, the power electronic device has large cooling requirements. For these and other reasons, there is a need to improve the cooling of the power electronic device and the assembly alignment of the power electronic device while maintaining a compact package size. Summary of the Invention

[0003] In one embodiment, a device for a power electronic device assembly includes a cooling plate assembly and one or more power device assemblies. The cooling plate assembly has a manifold and a heat sink. The manifold has a heat sink cavity in a first surface. The heat sink includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power device assemblies includes an S-unit, a power device, and a direct bonded metal (DBM) substrate bonded to the S-unit. The S-unit includes a base layer composed of at least graphite or a graphite composite material, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and electrically coupled to the conductive layer.

[0004] In one embodiment, the present invention relates to a power electronic device assembly, wherein the power electronic device assembly includes:

[0005] A cooling plate assembly, including:

[0006] A manifold, the manifold including a heat sink cavity in a first surface; and

[0007] A heat sink, the heat sink including one or more substrate cavities, wherein the heat sink is disposed in the heat sink cavity; and

[0008] One or more power device assemblies, the one or more power device assemblies being disposed within the one or more substrate cavities, each power device assembly of the one or more power device assemblies including:

[0009] An S-unit, the S-unit including:

[0010] A base layer composed of at least graphite or a graphite composite material;

[0011] A conductive layer that at least partially surrounds the base layer; and

[0012] A power device cavity;

[0013] A power device disposed in the power device cavity, the power device being electrically coupled to the conductive layer; and

[0014] A direct bonding metal substrate bonded to the S-unit.

[0015] Preferably, the power electronic device assembly further includes a conductive coating at least partially disposed between the power device cavity and the power device, the conductive coating defining a coating height, wherein:

[0016] Each of the one or more substrate cavities defines a substrate cavity depth,

[0017] The power device defines a power device height, and

[0018] The value of the substrate cavity depth is substantially equal to the power device height with the conductive coating.

[0019] Preferably, the power electronic device assembly further includes a bonding layer at least partially disposed between the power device cavity and the power device, the bonding layer defining a bonding height, wherein:

[0020] Each of the one or more substrate cavities defines a substrate cavity depth,

[0021] The power device defines a power device height; and

[0022] The value of the substrate cavity depth is substantially equal to the power device height with the bonding layer.

[0023] Preferably, the direct bonding metal substrate is made of an electrically insulating material.

[0024] Preferably, the shape and size of the power device cavity are configured to receive the power device.

[0025] Preferably, the top surface of the S-unit is substantially in the same plane as the top surface of the power device.

[0026] Preferably, the first surface is substantially in the same plane as the top surface of the power device, and the S-unit and the power device define a channel extending around the perimeter of the power device; the cooling plate assembly is configured to print the channel until the top surface of the channel is in the same plane as the first surface; and the cooling plate assembly is configured to print a printed circuit board on the first surface.

[0027] Preferably, the material printed on the channel is made of a dielectric material.

[0028] Preferably, the power electronics component further includes:

[0029] an inlet of the manifold, the inlet of the manifold being configured to receive coolant;

[0030] an outlet of the manifold, the outlet of the manifold being configured to provide the coolant, the outlet being fluidly coupled to the inlet; and

[0031] a plurality of flow distributors disposed between the inlet and the outlet, the plurality of flow distributors being further fluidly disposed downstream of the inlet and being configured to distribute the coolant flow downstream of the inlet.

[0032] In one embodiment, the present application also relates to a power device assembly, wherein the power device assembly includes:

[0033] an S-unit, the S-unit including a base layer made of at least graphite or a graphite composite material, a conductive layer at least partially surrounding the base layer, and one or more power device cavities;

[0034] one or more power devices, each power device being disposed in one of the one or more power device cavities, and each of the one or more power devices being electrically coupled to the conductive layer; and

[0035] a direct bond metal substrate bonded to the S-unit.

[0036] Preferably, the power device assembly further includes a first surface of a heat sink, wherein the direct bond metal substrate is disposed in a heat sink cavity on the first surface.

[0037] Preferably, the first surface is substantially in the same plane as the top surface of the power device assembly.

[0038] Preferably, each of the S-units and each of the one or more power devices define a channel extending around the perimeter of each of the one or more power devices, and wherein the channel is printed up to a top surface of the channel being substantially in the same plane as the first surface.

[0039] Preferably, the material printed on the channel is composed of a dielectric material.

[0040] Preferably, the shape and size of each of the one or more power device cavities are configured to receive a power device of the one or more power devices.

[0041] Preferably, the top surface of the S-unit is substantially in the same plane as the top surface of the power device assembly.

[0042] In one embodiment, the present application also relates to a method of forming a power electronics device assembly, wherein the method includes:

[0043] Positioning a heat sink in a heat sink cavity on a first surface of a cold plate manifold, the heat sink including one or more substrate cavities;

[0044] Embedding one or more power device assemblies into the one or more substrate cavities, each power device assembly including an S-unit having a base layer composed of at least graphite or a graphite composite material, a conductive layer at least partially surrounding the base layer, and a power device cavity;

[0045] Placing a bonding layer at least partially within the power device cavity; and

[0046] Bonding a power device to the power device cavity via the bonding layer, the power device being electrically coupled to the S-unit.

[0047] Preferably, the shape and size of the power device cavity are configured to receive the power device.

[0048] Preferably, the method further includes printing a printed circuit board onto the first surface, wherein the top surface of the S-unit is substantially in the same plane as the top surface of the power device.

[0049] Preferably, the method further includes:

[0050] Receiving a coolant flow via an inlet of the cold plate manifold;

[0051] Providing the coolant flow via an outlet of the cold plate manifold, the outlet being fluidly coupled to the inlet; and

[0052] The coolant flow is distributed downstream of the inlet via a plurality of flow distributors, the plurality of flow distributors being disposed between the inlet and the outlet and the plurality of flow distributors being further fluidly disposed downstream of the inlet.

[0053] These features and additional features provided by the embodiments described herein will be more fully understood in conjunction with the accompanying drawings and in view of the following detailed description. Description of the Drawings

[0054] The embodiments illustrated in the drawings are illustrative and exemplary in nature and are not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments can be understood when read in conjunction with the following drawings, in which like reference numerals indicate like structures and in which:

[0055] Figure 1 A perspective view schematically depicting an illustrative power electronics component including a plurality of embedded power device components according to one or more embodiments shown and described herein;

[0056] Figure 2 A perspective view schematically depicting a power electronics component according to one or more embodiments shown and described herein, in which an exploded view of an embedded power device component is embedded;

[0057] Figure 3 A perspective exploded view schematically depicting a power device component according to one or more embodiments shown and described herein;

[0058] Figure 4 A perspective view schematically depicting an S-unit of an embedded power device component according to one or more embodiments shown and described herein;

[0059] Figure 5A A side cross-sectional view schematically depicting an S-unit of an embedded power device component according to one or more embodiments shown and described herein;

[0060] Figure 5B A side cross-sectional view schematically depicting an S-unit of an embedded power device component according to one or more embodiments shown and described herein;

[0061] Figure 5C A side cross-sectional view schematically depicting an S-unit of an embedded power device component according to one or more embodiments shown and described herein;

[0062] Figure 6 Schematically depicting for Figure 1 of the power device component of a power electronics component as Figure 1Detailed view A-A depicted therein;

[0063] Figure 7 A perspective view schematically depicting a manifold for a cooling plate assembly in accordance with one or more embodiments shown and described herein; and

[0064] Figure 8 A bottom perspective view schematically depicting a heat sink for a cooling plate in accordance with one or more embodiments shown and described herein. Detailed Description

[0065] The embodiments described herein generally relate to a power electronics device assembly having an S-cell at least partially composed of graphite or a graphite composite material. The S-cell has a power device cavity in which a power electronics device is placed. Since the S-cell is at least partially composed of graphite or a graphite composite material, the power electronics device can dissipate more heat through the S-cell and can also be cooled more effectively when compared to conventional methods. Additionally, since the S-cell is at least partially composed of graphite or a graphite composite material, the S-cell defines more precise tolerances, thereby reducing assembly misalignment when compared to conventional methods. The power device cavity is designed such that the top surface of the power electronics device is flush with the top surface of the cooling plate assembly while allowing the power electronics device to be electrically coupled to the bottom electrode of the S-cell. The flat surface allows a printed circuit board (PCB) to be directly printed on the cooling plate assembly. Since the heat-generating power electronics device is close to the cooling plate, cooling of the power electronics device assembly can be improved. This allows the power electronics device to output higher power while maintaining a compact package size.

[0066] In this document, ranges can be expressed as from “about” a particular value, and / or to “about” another particular value. When expressing such a range, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when a value is expressed as an approximation by use of the antecedent “about”, it should be understood that the particular value forms another embodiment. It should be further understood that each endpoint value of each range is significant both in relation to and independent of the other endpoint value.

[0067] Directional terms used herein - such as upward, downward, right, left, front, back, top, bottom - are constituted only with reference to the figures as drawn and do not imply an absolute orientation.

[0068] Unless otherwise expressly set forth, no method recited herein is intended to be construed as requiring that its steps be performed in a particular order, nor is any apparatus-specific orientation intended. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or where any apparatus claim does not actually recite an order or orientation of components, or where the claims or specification do not otherwise specifically recite that the steps are to be limited to a particular order, or that a particular order or orientation of the components of an apparatus is to be followed, no order or orientation is intended to be inferred in any respect. This applies to any possible non-express basis for interpretation, including: logical matters regarding arrangements of steps, operational flows, orders of components, or orientations of components; plain meaning derived from grammatical organization or punctuation; and the number or type of embodiments described in the specification.

[0069] As used herein, the singular forms of the terms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a" component includes aspects having two or more such components unless the context clearly indicates otherwise.

[0070] In a conventional system, the S-unit may be limited in terms of heat dissipation capacity, which may result in insufficient cooling of the power device. This may limit the output of the power device. Additionally, when the S-unit is manufactured by etching, the manufacturing precision of the S-unit may be limited. The reduced manufacturing precision may cause the PCB vias to be misaligned with the signal pads of the power device after assembly. Various embodiments of a power electronics component, a method of manufacturing a power electronics component, and an operation of a power electronics component are described in more detail herein. The power electronics component described herein may have improved heat dissipation to improve cooling of the power device. The power electronics component may also have an S-unit having improved manufacturing precision to reduce misalignment of the power electronics component during assembly. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0071] Each structure shown and described herein provides advantages over conventional structures (e.g., power electronics components) due to compact package size, improved heat dissipation, improved manufacturing precision, improved assembly tolerances, and better flow distribution, all of which result in higher cooling capacity. Additionally, the structures shown and described herein may also be deployed in non-traditional spaces and / or integrated with existing components. For example, the structures shown and described herein may be integrated with a motor cooling system (e.g., a motor within a wheel) or other systems that use a coolant such that the coolant can be used for more than one purpose.

[0072] Now refer to Figure 1-2 and, by way of example, illustrate an exemplary power electronic device assembly 100 according to one or more embodiments described herein. In particular, Figure 1 depicts a power electronic device assembly 100 that includes a plurality of power device assemblies 114 in an assembled configuration, while Figure 2 depicts a power electronic device assembly 100 having individual power device assemblies of the plurality of power device assemblies 114 shown in an exploded view.

[0073] In some embodiments, the exemplary power electronic device assembly 100 is used in an electric vehicle. In other embodiments, the power electronic device assembly 100 is used in an electric drive device, such as but not limited to a hybrid vehicle, any electric motor, generator, industrial tool, household appliance, etc. The power electronic device assembly 100 may be electrically coupled to an electric motor and / or a battery and is configured to receive power from the electric motor and / or the battery.

[0074] The exemplary power electronic device assembly 100 may include a cooling plate assembly 102 that is configured to house power device assemblies 114 embedded therein while absorbing heat generated by the power device assemblies 114. As discussed in more detail herein, the cooling plate assembly 102 receives a coolant that can absorb the heat generated by the power device assemblies 114 and provides the coolant to a downstream cooling system. In this way, the cooling plate assembly 102 is able to remove heat from the power electronic device assembly 100 in an efficient manner. The cooling plate assembly 102 may be machined, forged, extruded, or cast from a block of thermally conductive material. In some embodiments, the cooling plate assembly 102 is 3D printed.

[0075] The exemplary cooling plate assembly 102 may include a manifold 104 (e.g., a manifold plate). The manifold 104 is configured to receive and provide coolant to remove heat from the power electronic device assembly 100. The manifold 104 has a first surface 106 (e.g., a first plane) and a second surface 107 (e.g., a second plane) that is positioned opposite the first surface 106. The first surface 106 may define a generally flat profile. As discussed in more detail herein, a printed circuit board may be printed on the first surface 106 (e.g., by three-dimensional printing (3D printing)). This is advantageous because it reduces the thermal resistance of the power electronic device assembly 100. In embodiments, the first surface 106 may define a concave or convex profile. In embodiments, the first surface 106 may define a cavity or an extruded boss. In these embodiments, the mating surface of the printed circuit board is shaped to receive the profile of the first surface 106.

[0076] The manifold 104 includes an inlet 132 (e.g., an input port), a radiator cavity 108, and a radiator 110. The inlet 132 is configured to receive coolant from a cooling system (not shown). After entering the inlet 132, the coolant interacts with the radiator 110 positioned within the radiator cavity 108. After interacting with the radiator 110, the coolant receives heat from the radiator 110. The cold plate assembly 102 further includes an outlet 134 (e.g., an output port). The warmed coolant exits the cold plate assembly 102 via the outlet 134. In this manner, the cold plate assembly 102 is capable of cooling the power electronics assembly 100. In some embodiments, the inlet 132 and the outlet 134 are positioned on opposite sidewalls of the manifold 104. In some embodiments, the inlet 132 and the outlet 134 are positioned on the same sidewall or adjacent sidewalls of the manifold 104. In some embodiments, the inlet 132 and / or the outlet 134 may be positioned on the first surface 106 or the second surface 107 of the manifold 104.

[0077] After placing the radiator 110 into the radiator cavity 108, the top surface of the radiator 110 may be flush with the first surface 106 (e.g., flat along the same plane). This is advantageous because it provides a flush surface for a printed circuit board to be printed on the power electronics assembly 100. The radiator 110 may include a plurality of substrate cavities 112 positioned on the top surface of the radiator 110. Each of the plurality of substrate cavities 112 defines a substrate cavity depth large enough such that when a component is placed into each of the plurality of substrate cavities 112, the top surface of each of the plurality of substrate cavities 112 may be flush with the first surface 106. This is advantageous because it provides a flush surface for a printed circuit board to be printed on the power electronics assembly 100.

[0078] In some embodiments, the entire power electronics assembly 100 is 3D printed. Due to the self - alignment of the radiator cavity 108, the substrate cavities 112, and the power device cavities 122, each component has a corresponding reference point. This results in lower assembly tolerances for the entire assembly. Lower assembly tolerances can reduce misalignment between the vias of the 3D - printed printed circuit board and the electrical pads of the power electronics devices. In some embodiments, the entire power electronics assembly 100 can be 3D printed because there is less variability in the power electronics assembly 100.

[0079] Now refer to Figure 4 and 5A, showing the S-unit 116 for the power device component 114. The S-unit 116 includes a base layer 116a at least partially composed of graphite or a graphite composite material, and the base layer 116a is encapsulated by a conductive layer 116b. Due to the high thermal conductivity of graphite, graphite and graphite composites provide improved heat diffusion for the S-unit 116. Due to the improved heat diffusion of the S-unit 116, the S-unit 116 can then transfer more heat to the heat sink 110. This improves the cooling of each power device component 114. Due to this improved cooling, the power output of each power device component 114 can be increased. This can result in a more compact size and higher power density of the power electronics component 100. The top surface of the power device cavity 122 defines a thick layer 132 of the conductive layer 116b such that the power device cavity 122 defines a first depth D1. In this way, the conductivity between the power device 126 and the conductive layer 116b can be improved.

[0080] In some embodiments, the base composition of the graphite or graphite composite material can be reoriented such that the graphite or graphite composite material has an increased thermal conductivity along the Z-axis (as Figure 4 depicted). This is advantageous because it can control the direction of heat transfer to increase the cooling rate of each power device component 114. In some embodiments, the graphite or graphite composite material can also be reoriented such that the graphite or graphite composite material has an increased thermal conductivity along the Z-axis and a second axis (e.g., the X-axis or Y-axis as Figure 4 depicted). In some embodiments, the graphite or graphite composite material can be reoriented such that the graphite or graphite composite material has an increased thermal conductivity along the X-axis and / or Y-axis. The graphite or graphite composite material can be reoriented by any known means (e.g., a carbonization process, a magnetic process).

[0081] Conventional systems may have misalignments due to high assembly tolerances. High assembly tolerances may be the result of manufacturing inaccuracies of the various components of these conventional systems. Thus, these conventional systems may be prone to misaligning printed circuit board vias to the electrical pads of the power electronics device, which may prevent the printed circuit board from being 3D printed on these conventional systems.

[0082] In addition to improved thermal dissipation, the fabrication of the base layer 116a composed of graphite or graphite composite material can be carried out via machining. This can reduce the manufacturing tolerance of the base layer 116a. Additionally, the S-unit 116 disclosed herein is directly related to the manifold 104 (e.g., arranged to the manifold 104). This enables the position of each of the plurality of power device components 114 to be known by fixing each of the plurality of power device components 114 to a designated position, which in turn reduces the overall assembly tolerance of the power electronics component 100. This allows the printed circuit board to be directly printed on the power electronics component 100.

[0083] As Figure 5A shown, the S-unit 116 further includes a conductive layer 116b surrounding the base layer 116a. The conductive layer 116b provides an electrical conduit for each power device component 114. The conductive layer 116b can be composed of copper, aluminum, or any other suitable conductive material. The conductive layer 116b includes a top layer surface 117 (e.g., a top plate) that is substantially flush with the first surface 106 when mounted to the manifold 104. The S-unit 116 further includes a power device cavity 122 defined within the top layer surface 117 for receiving the power device 126 of the power device component 114.

[0084] Now referring Figure 5A-5C , side cross-sectional views of the S-unit 116 according to three different embodiments are shown. In Figure 5A , the top surface of the power device cavity 122 defines a thick layer 132 of the conductive layer 116b such that the power device cavity 122 defines a first depth D1. In this way, the conductivity between the power device 126 and the conductive layer 116b can be improved.

[0085] In Figure 5B , the conductive layer 116b' does not extend to the top surface of the power device cavity 122. In these embodiments, a conductive coating 134 can be applied to the exposed base layer 116a composed of graphite or graphite composite material. Then, the power device 126 can be directly bonded to the base layer 116a and the conductive coating 134. In this way, the thermal conductivity from the power device 126 to the conductive layer 116b' can be increased. Additionally, the conductive coating 134 can increase the adhesion between the power device 126 and the S-unit 116'. In these embodiments, the height of the power device 126 and the coating height of the conductive coating 134 are configured such that when the power device 126 is assembled into the power device cavity 122, the height of the power device 126 is substantially equal to the depth of the power device cavity 122. This makes the top surface of the power device component 114 flush with the first surface 106.

[0086] In Figure 5CIn this case, the surface of the power device cavity 122 defines a thin layer 132” of the conductive layer 116b” such that the power device cavity 122 of the S-cell 116” defines a second depth D2 greater than the first depth D1. In this way, the heat dissipation from the power device 126 to the conductive layer 116 can be improved.

[0087] Now refer to Figure 3 , which shows a power device assembly 114 according to various embodiments in an exploded view. A plurality of power device assemblies 114 are embedded (e.g., disposed) on a plurality of substrate cavities 112. As a non-limiting example, the plurality of power device assemblies 114 may define an inverter circuit for powering an electric device such as an electric motor. Each power device assembly 114 includes a direct bond metal (DBM) substrate 119 (shown in Figure 6 ). The direct bond metal substrate 119 includes a ceramic layer (e.g., alumina) clamped (e.g., interposed) between two metal layers (e.g., Cu or Al). The direct bond metal substrate 119 provides electrical insulation between the power device assemblies 114. Each direct bond metal substrate 119 is bonded to the power device cavity 122 via a first bonding layer (e.g., an adhesive layer). The first bonding layer is located on the bottom surface and / or side surface of the power device cavity 122 and is configured to bond components to the power device cavity 122. The first bonding layer may be composed of silver sintering, welding, transient liquid phase bonding (TLP), or any other suitable bonding material. Then, the S-cell 116 can be bonded to the direct bond metal substrate 119 via a second bonding layer interposed between the S-cell 116 and the direct bond metal substrate 119.

[0088] Each power device component 114 further includes a power device 126. The power device 126 can be an insulated gate bipolar transistor (IGBT), a metal oxide semiconductor field effect transistor (MOSFET), or any other suitable power device. The power device 126 is embedded in the power device cavity 122. The power device 126 can be bonded, welded, or adhered to the power device cavity 122 via a bonding layer 124. The power device 126 includes an electrical pad 128 to enable electrical connection for components with high voltage requirements. The power device 126 further includes a smaller electrical pad 130 that receives control signals from a driver (e.g., a gate driver) and can provide signals from sensors (e.g., a temperature sensor, a current sensor) embedded in the power device component 114. The power device 126 includes a bottom electrode (not shown) electrically coupled to the S-unit 116. The height of the power device 126 and the bonding height of the bonding layer 124 are configured such that they are substantially equal to the depth of the power device cavity 122. This makes the top surface of the power device component 114 flush with the first surface 106.

[0089] Since each power device 126 is positioned in one of the power device cavities 122, each power device 126 is self-aligned relative to the cooling plate assembly 102. In other words, the position of each power device 126 is known by fixing each power device 126 to a designated position. This reduces the overall assembly tolerance of the power electronics component 100. Additionally, this arrangement facilitates direct 3D printing of a printed circuit board onto the first surface 106. This is because the height of each power device of the power electronics component 100 is flush with the first surface 106 and each cavity enables self-alignment of the corresponding components.

[0090] Now referring to Figure 6 shows a perspective view of the power device assembly Figure 1 taken from a detailed view A-A of Figure 1 . The power device assembly 114 defines a channel 602 (e.g., a space, an open area) between the perimeter of the power device assembly 114 and the substrate cavity 112. In some embodiments, before placing or 3D printing a printed circuit board onto the power electronics component 100, the manifold 104 can undergo a reflow process. The reflow process can include applying a reflow fixture aligned with the cooling plate assembly 102 to the manifold 104. Then the manifold 104 can be reheated such that each power device assembly 114 is temporarily movable within each substrate cavity 112. Then each power device assembly 114 can be moved to align with the reflow fixture. In this way, each of the power device assemblies 114 is aligned with the cooling plate assembly 102 to compensate for any misalignment caused by the direct bonding of the metal substrate 119.

[0091] Once the recirculation process has been completed, the channels 602 can be filled so that they are flush with the first surface 106. The channels 602 can be filled through a manual filling process or printed by a 3D printer. This is advantageous because it enables the first surface 106 to be flush across the entire top surface of the cold plate assembly 102. Additionally, the channels can be filled with a dielectric material so that each power device assembly 114 can be further electrically insulated from one another.

[0092] Now referring to Figure 7 , a perspective view of the manifold 104 in an unassembled state is shown. The inlet 132 of the manifold 104 includes an inlet opening 702 and a manifold inlet 704. The inlet 132 receives coolant via the inlet opening 702. As depicted, the inlet opening 702 defines a circular shape; however, other geometries (e.g., an oval shape, a rectangular shape) are contemplated and possible. The inlet 132 provides the coolant to the radiator cavity 108 via the manifold inlet 704. As depicted, the manifold inlet 704 defines an oval shape; however, other geometries (e.g., a circular shape, a rectangular shape) are contemplated and possible.

[0093] The manifold 104 includes a plurality of flow distributors 708. The plurality of flow distributors 708 extend from the bottom surface of the radiator cavity 108 and are further positioned between the inlet 132 and the outlet 134. Each of the plurality of flow distributors 708 cooperates to direct the coolant flow to a predetermined area of the manifold 104. This is advantageous because the coolant can be directed to areas of the manifold 104 that require increased cooling. For example, additional coolant can be directed to flow directly beneath a power device assembly 114 that operates at a higher voltage relative to other power device assemblies 114. In this way, the cooling rate from the power device assemblies 114 to the coolant within the manifold 104 can be improved overall.

[0094] As depicted, the plurality of flow distributors 708 define three flow distributors. However, any number of flow distributors can be present in the plurality of flow distributors 708. As depicted, the plurality of flow distributors 708 are adjacent to the inlet 132. However, the plurality of flow distributors 708 can be positioned at equal distances between the inlet 132 and the outlet 134, or can be positioned adjacent to the outlet 134. In an embodiment, there are multiple groups of the plurality of flow distributors 708, each group positioned at a different point within the manifold 104.

[0095] Outlet 134 includes manifold outlet 710 and outlet opening 712. After receiving heat from radiator 110, coolant can leave the radiator cavity 108 via manifold outlet 710. As depicted, manifold outlet 710 defines an oval shape; however, other geometries (e.g., circular shape, rectangular shape) are contemplated and possible. The coolant can then be provided to a downstream component (not shown) via outlet opening 712.

[0096] Manifold 104 further includes manifold mating surface 706. Manifold mating surface 706 is shaped such that it can receive radiator 110. As depicted, manifold mating surface 706 defines a flat profile; however, other profiles are contemplated and possible.

[0097] Now referring Figure 8 , a bottom perspective view of radiator 110 is shown. Radiator 110 includes radiator mating surface 802. In the assembled state, radiator mating surface 802 contacts (e.g., rests on) manifold mating surface 706. As depicted, radiator mating surface 802 defines a flat profile; however, other profiles are contemplated and possible.

[0098] Radiator 110 can include a plurality of channels 804 located on the bottom surface of radiator 110. When each of the power device assemblies 114 generates heat, the heat is transferred to radiator 110. Radiator 110 transfers the heat to the bottom surface of radiator 110 such that the heat can be dissipated by the coolant in manifold 104. The plurality of channels 804 extend along the width of radiator 110 and interact with the coolant within manifold 104. Each of the plurality of channels 804 includes a channel inlet 806, a channel 808, and a channel outlet 810.

[0099] A plurality of flow distributors 708 can cooperate with the plurality of channels 804 to enhance the cooling capacity of the cooling plate assembly 102. For example, after the coolant enters the radiator cavity 108, each of the plurality of flow distributors 708 can distribute the coolant to a corresponding set of the plurality of channels 804. The coolant then enters each corresponding set of the plurality of channels 804 via channel inlet 806. The coolant then interacts with radiator 110 to absorb heat via channel 808. The coolant leaves each corresponding set of the plurality of channels 804 via channel outlet 810. In this way, the flow path of the coolant can be further controlled to enhance the cooling capacity of the cooling plate assembly 102.

[0100] As can be understood from the foregoing, embodiments defined herein generally relate to a power electronic device assembly having an S-cell at least partially composed of graphite or a graphite composite material. The S-cell has a power device cavity in which a power electronic device is placed. Since the S-cell is at least partially composed of graphite or a graphite composite material, the power electronic device can dissipate more heat to the S-cell and can be cooled more effectively when compared to conventional methods. Additionally, since the S-cell is at least partially composed of graphite or a graphite composite material, the S-cell defines more precise tolerances, thereby reducing assembly misalignment when compared to conventional methods. The power device cavity is designed such that the top surface of the power electronic device is flush with the top surface of the cooling plate assembly while allowing the power electronic device to be electrically coupled to the bottom electrode of the S-cell. The flat surface allows a printed circuit board (PCB) to be directly printed on the cooling plate assembly. Since the heat-generating power electronic device is close to the cooling plate, the cooling of the power electronic device assembly can be improved. This allows the power electronic device to output higher power while maintaining a compact package size.

[0101] It should be noted that the terms "substantially" and "" can be used herein to represent the inherent degree of uncertainty that may be attributed to any number of comparisons, values, measurements, or other representations. These terms are also used herein to represent the degree to which a quantitative representation can differ from the stated reference without causing a fundamental change in the basic function of the subject matter being discussed.

[0102] Although specific embodiments have been illustrated and described herein, it should be understood that various other changes and modifications can be made without departing from the scope of the claimed subject matter. Additionally, although various aspects of the claimed subject matter have been described herein, these aspects need not be used in combination. Accordingly, the appended claims are intended to cover all such changes and modifications within the scope of the claimed subject matter.

[0103] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the scope of the claimed subject matter. Accordingly, this specification is intended to cover modifications and variations of the various embodiments described herein, provided such modifications and variations fall within the scope of the appended claims and their equivalents.

Claims

1. A power electronic device assembly, comprising: A cooling plate assembly, the cooling plate assembly comprising: a manifold comprising a heat sink cavity in the first surface; and a heat sink comprising one or more substrate cavities, wherein the heat sink is disposed in the heat sink cavities; and One or more power device components, the one or more power device components are disposed in the one or more substrate cavities, each of the one or more power device components comprising: An S-unit, the S-unit comprising: at least a base layer consisting of graphite or a graphite composite; a conductive layer at least partially surrounding the base layer; and Power device cavity; an electric device disposed in the electric device cavity, the electric device being electrically coupled to the conductive layer; and Direct bonding to the metal substrate of the S-cell.

2. The power electronic device assembly according to claim 1, characterized in that: The power electronics assembly further includes a conductive coating disposed at least partially between the power device cavity and the power device, the conductive coating defining a coating height, wherein: Each of the one or more substrate cavities defines a substrate cavity depth, The power device defines a power device height, and The value of the substrate cavity depth is substantially equal to the height of the electrical device having the conductive coating.

3. The power electronic device assembly according to claim 1, characterized in that: The power electronic device assembly further comprises a bonding layer at least partially disposed between the power device cavity and the power device, the bonding layer defining a bonding height, wherein: Each of the one or more substrate cavities defines a substrate cavity depth, The power device defines a power device height; and The value of the substrate cavity depth is substantially equal to the height of the power device having the bonding layer.

4. The power electronic device assembly according to claim 1, characterized in that: The direct-bonded metal substrate is composed of an electrically insulating material.

5. The power electronic device assembly according to claim 1, characterized in that: The power device cavity is shaped and dimensioned to receive the power device.

6. The power electronic device assembly according to claim 1, characterized in that: The top surface of the S-cell is substantially in the same plane as the top surface of the power device.

7. The power electronic device assembly according to claim 1, characterized in that: The first surface is substantially in the same plane as a top surface of the power device, The S-unit and the power device define a channel extending around a perimeter of the power device; The cooling plate assembly is configured to print the channel until a top surface of the channel is on the same plane as the first surface; as well as The cooling plate assembly is configured for printing a printed circuit board on the first surface.

8. The power electronic device assembly according to claim 7, characterized in that: The material printed on the vias consists of a dielectric material.

9. The power electronic device assembly according to claim 1, characterized in that: The power electronic device assembly further comprises: an inlet of the manifold, the inlet of the manifold being configured to receive a coolant; an outlet of the manifold, the outlet of the manifold being configured to provide the coolant, the outlet being fluidly coupled to the inlet; and A plurality of flow distributors are disposed between the inlet and the outlet, the plurality of flow distributors being further fluidly disposed downstream of the inlet, the plurality of flow distributors being configured to distribute the flow of the coolant downstream of the inlet.

10. An electric power device assembly, comprising: An S-unit comprising at least a base layer composed of graphite or a graphite composite material, a conductive layer at least partially surrounding the base layer, and one or more power device cavities; one or more power devices, each power device disposed in one of the one or more power device cavities, each of the one or more power devices being electrically coupled to the conductive layer; and a direct-bonded metal substrate bonded to said S-cell, The power device assembly further comprises a first surface of a heat sink, wherein the direct-bonded metal substrate is disposed in a heat sink cavity on the first surface.

11. The electric device assembly according to claim 10, characterized in that: The first surface is substantially in the same plane as a top surface of the power device assembly.

12. The power device assembly according to claim 10, characterized in that: The S-cell and each of the one or more electrical devices define a channel extending around a perimeter of each of the one or more electrical devices, and wherein the channel is printed until a top surface of the channel is substantially on the same plane as the first surface.

13. The electric power device assembly according to claim 12, characterized in that: The material printed on the vias consists of a dielectric material.

14. The power device assembly according to claim 10, characterized in that: Each of the one or more power device cavities is shaped and dimensioned to receive one of the one or more power devices.

15. The power device assembly according to claim 10, characterized in that: A top surface of the S-cell is substantially in the same plane as a top surface of the power device assembly.

Images