A heat dissipation patch for microelectronics

Abstract

The present invention relates to the field of heat dissipation technology for microelectronic components, and discloses a heat dissipation patch for microelectronics, comprising a plastic plate, a metal plate, and a detachable side plate, wherein two fixing ears are provided on both the left and right sides of the plastic plate, a fixing column is provided inside the fixing ears, and a plurality of rubber sleeves are fixedly provided at the bottom end of the plastic plate. The present invention arranges the rubber sleeve, thermal grease, copper tube, metal fixed tube, rotating sleeve, inner plate, and metal plate in coordination with each other, so that the device can be installed above a dense array of electronic components of any shape. At this time, the thermal grease contacts the electronic components and drives the copper tube to move upward to a suitable position. Thereafter, the position of the copper tube and the thermal grease is fixed by the coordination of the rotating sleeve and the metal fixed tube. At this time, the dense thermal grease contacts multiple electronic components, so that multiple components of different shapes and sizes can be cooled with only one heat dissipation device.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of microelectronic components, in particular to a heat dissipation patch for microelectronics. Background Art

[0002] Microelectronics is a new technology that has developed alongside integrated circuits, particularly very large-scale integrated circuits. Microelectronics' primary products include circuit system processors and memory chips, which are soldered onto circuit boards along with other electronic components. Electronic components are components of electronic devices and small machines and instruments, often consisting of multiple parts that can be used across similar products.

[0003] Traditional heat sinks for microelectronics have the following main disadvantages:

[0004] (1) Slicing installation is required. Dense chips and electronic components often have different sizes and shapes. Traditional heat sinks can only be attached to a few chips, and the heat sinks are matched one-to-one with the corresponding chips according to the size of the model.

[0005] (2) Disassembly and assembly are cumbersome. Traditional heat sinks are connected by welding or screws. Welding makes it difficult to disassemble the heat sink, while screw connection requires welding larger studs on the circuit board.

[0006] In summary, it is necessary to design a heat dissipation patch for microelectronics. Summary of the Invention

[0007] (1) Technical problems solved

[0008] In view of the deficiencies of the prior art, the present invention provides a heat dissipation patch for microelectronics, which solves the problems raised by the above-mentioned background technology.

[0009] (2) Technical solution

[0010] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation patch for microelectronics, comprising a plastic plate, a metal plate and a detachable side plate, two fixing ears are provided on the left and right sides of the plastic plate, a fixing column is provided inside the fixing ear, a plurality of rubber sleeves are fixedly provided on the bottom end of the plastic plate, a thermal conductive silicone grease is fixedly provided on the bottom end of the rubber sleeve, a copper tube is provided inside the rubber sleeve and at the bottom end of the plastic plate, a connecting plate is provided at the bottom end of the copper tube, the copper tube and the thermal conductive silicone grease are fixedly connected through the connecting plate, a metal fixing tube is fixedly provided between the plastic plate and the metal plate and above the copper tube, a rotating sleeve is movably provided on the surface of the metal fixing tube, and an arc is provided inside the rotating sleeve. Groove, three connecting plates are provided on the surface of the metal fixed tube, and a movable arc plate and a fixed arc plate are respectively provided at both ends of the connecting plate, the movable arc plate is movably connected to the inner wall of the arc groove, and the fixed arc plate is in pressure contact with the copper tube, and plastic buckles and metal buckles are fixedly installed on the inner surfaces of the left and right sides of the plastic plate, respectively, and movable plates are movably provided on the left and right sides of the plastic plate, and the upper and lower ends of the movable plate are movably connected to the metal buckles and plastic buckles respectively, and the inner surface of the movable plate is provided with an outer plate and an inner plate, and the outer wall of the inner plate is rotatably connected to the rotating sleeve, and two threaded nails are provided inside the disassembly side panel, and the other end of the threaded nail is threadedly connected to the movable plate, and a heat sink is provided on the top of the metal plate.

[0011] Preferably, a third slot is provided inside the fixing column, a fixing nail is movably provided inside the third slot, a first slot is provided at the bottom end of the fixing nail, third rail slots are provided on both sides of the first slot, and a first rail slot is provided at the center of the first slot.

[0012] Preferably, a limit rod and a support rod are rotatably provided on both the left and right sides of the interior of the first groove, one end of the limit rod is fixedly connected to one end of the support rod, and the other end of the limit rod is provided with a first rotating shaft, and one end of the first rotating shaft is movably connected to the inner wall of the third rail groove.

[0013] Preferably, a pull rod is rotatably provided at the other end of the first rotating shaft, a second rotating shaft is rotatably provided at the other end of the pull rod, and the other ends of the two pull rods are rotatably connected through the second rotating shaft, and a metal wire is provided on the surface of the second rotating shaft.

[0014] Preferably, a fourth slide groove is provided at the inner top of the fixing nail, a third limit block is movably provided inside the fourth slide groove, and the top end of the metal wire passes through the interior of the fourth slide groove and is fixedly connected to the bottom end of the third limit block.

[0015] Preferably, a rotating column is movably provided at the top of the third slot, and movable columns are provided on both sides of the rotating column, a second sliding groove is provided at the inner walls on both sides of the top of the third slot, and the other end of the movable column is movably connected to the inner wall of the second sliding groove, and a first tension spring is provided at the bottom end of the rotating column, and the bottom end of the first tension spring passes through the interior of the fourth sliding slot and is fixedly connected to the third limit block, and a third sliding groove is provided at the inner walls on the left and right sides of the third slot, and a second limit block is fixedly provided on the left and right sides of the top of the fixing nail, and the second limit block is movably connected to the inner wall of the third sliding slot.

[0016] Preferably, a rotating ring is rotatably provided at the bottom end of the fixed column, and three sections of arc teeth are evenly provided on the inner surface of the rotating ring. A second groove is opened on both sides of the bottom end of the fixed column, and the horizontal height of the second groove is adapted to the horizontal height of the rotating ring.

[0017] Preferably, an extrusion block is movably provided inside the second groove, the top end of the extrusion block is movably connected to the arc tooth, the bottom end of the extrusion block is in pressure contact with the surface of the fixing nail, and a fixed vertical rod is rotatably provided at the center of the extrusion block, the surface of the fixed vertical rod is sleeved with a torsion spring, and the two ends of the torsion spring are fixedly connected to the fixed vertical rod and the extrusion block respectively.

[0018] Preferably, a second rail groove is provided on the inner wall of the second groove, a first slide groove is provided inside the fixed column and on one side of the second rail groove, and the first slide groove and the second groove are connected through the second rail groove, the other end of the fixed vertical rod passes through the interior of the first slide groove and is fixedly sleeved with a first limit block, a second tension spring is provided on the top of the first limit block, and the top of the second tension spring is fixedly connected to the inner wall of the first slide groove.

[0019] Preferably, a plastic sleeve is provided at the bottom end of the plastic plate and located on the surface of the copper tube, and the plastic plate and the rubber sleeve are fixedly connected through the plastic sleeve. A matching ring is provided at the bottom end of the metal plate and located above the rotating sleeve, and the matching ring is in pressure contact with the top end of the rotating sleeve.

[0020] (3) Beneficial effects

[0021] The present invention provides a heat dissipation patch for microelectronics, which has the following beneficial effects:

[0022] (1) The present invention arranges a rubber sleeve, thermal grease, a copper tube, a metal fixed tube, a rotating sleeve, an inner plate and a metal plate to cooperate with each other, so that the device can be installed above a dense array of electronic components of any shape. At this time, the thermal grease contacts the electronic components and drives the copper tube to move upward to a suitable position. Then, the position of the copper tube and the thermal grease is fixed by the cooperation of the rotating sleeve and the metal fixed tube. At this time, the dense thermal grease will contact multiple electronic components, so that only one heat dissipation device can be used to dissipate heat for multiple components of different shapes and sizes.

[0023] (2) The present invention cooperates with structures such as a fixed column, a rotating ring, arc teeth, an extrusion block, a fixed nail, a fixed vertical pole and a first limit block, so that only by continuously rotating the rotating ring can the arc teeth be maintained to push the extrusion block downward, thereby allowing the extrusion blocks on the left and right sides to push the fixed nail downward alternately. When the rotating ring stops rotating, the torsion spring separates the extrusion block from the fixed nail. At this time, the fixed nail will be pulled up by the action of the first tension spring. At this time, as long as the fixed nail passes through the circuit board and the limit rod is stuck on the circuit board, it can play a fixing role.

[0024] (3) The present invention cooperates with the structures of the rotating column, the first tension spring, the third limit block, the metal wire, the limit rod and the pull rod, so that after the fixing nail is pushed down and passes through the circuit board, the first tension spring will pull up the third rotating shaft and the pull rod through the metal wire. At this time, the limit rod and the support rod will be stretched open and can be opened on the back of the circuit board. When the device needs to be removed, there is no need to continue to slowly rotate the rotating ring. It is only necessary to use a screwdriver to insert the rotating column and rotate it to screw the rotating column into the bottom end of the fixed column. At this time, the tension of the first tension spring is reduced and the limit rod can be easily received in the first groove to facilitate the removal of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a partial cross-sectional view from the main perspective of the present invention;

[0027] Figure 3 For the present invention Figure 2 Cross-sectional view of area A in the middle;

[0028] Figure 4 A top sectional view of the rotary sleeve structure of the present invention;

[0029] Figure 5 It is a partial cross-sectional view from a top view of the present invention;

[0030] Figure 6 is a cross-sectional view of the fixed column structure of the present invention;

[0031] Figure 7 For the present invention Figure 6 Enlarged view of area B in the middle;

[0032] Figure 8 For the present invention Figure 6 Cross-sectional view of area B in the middle;

[0033] Figure 9 is a schematic cross-sectional view of the rotating ring structure of the present invention;

[0034] Figure 10 A top view of the rotating ring structure of the present invention;

[0035] Figure 11 For the present invention Figure 6 Magnified view of area C in the middle.

[0036] In the figure: 1. Plastic plate; 2. Metal plate; 3. Disassembly side plate; 4. Fixing ear; 5. Fixing column; 6. Rotating ring; 7. Rubber sleeve; 8. Outer plate; 9. Thermal grease; 10. Heat sink; 11. Inner plate; 12. Plastic buckle; 13. Screw nail; 14. Metal buckle; 15. Movable plate; 16. Rotating sleeve; 17. Connecting plate; 18. Copper tube; 19. Plastic sleeve; 20. Metal fixed tube; 21. Movable arc plate; 22. Fixed arc plate; 23. Matching ring; 24. Arc groove; 25. Connecting plate; 26. First slide groove; 27. Rotating column; 28. First slide groove; 29. A limit block; 29. ​​A movable column; 30. A second slide; 31. A first tension spring; 32. A third slide; 33. A second limit block; 34. A third limit block; 35. A fourth slide; 36. An arc tooth; 37. A limit rod; 38. A support rod; 39. A fixing nail; 40. A first rail groove; 41. A pull rod; 42. A first groove; 43. A metal wire; 44. A second groove; 45. An extrusion block; 46. A second tension spring; 47. A third groove; 48. A second rail groove; 49. A fixed column; 50. A torsion spring; 51. A third rail groove; 52. A first rotating shaft; 53. A second rotating shaft. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] like Figure 1-11 As shown, the present invention provides a technical solution: a heat dissipation patch for microelectronics, including a plastic plate 1, a metal plate 2 and a disassembly side plate 3, and the metal plate 2 and the disassembly side plate 3 are both made of copper metal.

[0039] Two fixing ears 4 are provided on the left and right sides of the plastic plate 1. A fixing column 5 is provided inside the fixing ear 4. The fixing ear 4 and the fixing column 5 are used to fix the heat dissipation device above the circuit board of the electronic component. A plurality of rubber sleeves 7 are fixedly provided on the bottom end of the plastic plate 1. The rubber sleeve 7 has a good insulating effect, and the rubber sleeve 7 can also increase the elastic force for the downward recovery of the copper tube 18. The bottom end of the rubber sleeve 7 is fixedly provided with a thermal conductive silicone grease 9. The thermal conductive silicone grease 9 is a solid containing silicon and has good thermal conductivity and insulation. A copper tube 18 is provided inside the rubber sleeve 7 and is located at the bottom end of the plastic plate 1. A plastic sleeve 19 is provided on the bottom end of the plastic plate 1 and on the surface of the copper tube 18. The plastic plate 1 and the rubber sleeve 7 are fixedly connected through the plastic sleeve 19. The copper tube The bottom end of 18 is provided with a connecting plate 17, and the copper tube 18 and the thermal grease 9 are fixedly connected through the connecting plate 17. A metal fixing tube 20 is fixedly provided between the plastic plate 1 and the metal plate 2 and above the copper tube 18. The metal fixing tube 20 and the plastic plate 1 are connected by glue. The surface of the metal fixing tube 20 is movably sleeved with a rotating sleeve 16. A matching ring 23 is provided at the bottom end of the metal plate 2 and above the rotating sleeve 16. The matching ring 23 is pressed into contact with the top of the rotating sleeve 16. When the distance between the metal plate 2 and the plastic plate 1 is reduced, the matching ring 23 on the metal plate 2 will be squeezed with the rotating sleeve 16, so that the rotating sleeve 16 can be better fixed. An arc groove 24 is provided inside the rotating sleeve 16. The metal fixing tube 2 0 is provided with three connecting plates 25 on the surface, and a movable arc plate 21 and a fixed arc plate 22 are provided at both ends of the connecting plate 25 respectively. The movable arc plate 21 is movably connected to the inner wall of the arc groove 24, and the fixed arc plate 22 is in pressure contact with the copper tube 18. Plastic buckles 12 and metal buckles 14 are fixedly installed on the inner surfaces of the left and right sides of the plastic plate 1 and the metal plate 2 respectively. A movable plate 15 is movably provided on both sides of the plastic plate 1. The upper and lower ends of the movable plate 15 are movably connected to the metal buckles 14 and the plastic buckles 12 respectively. The inner surface of the movable plate 15 is provided with an outer plate 8 and an inner plate 11. The outer wall of the inner plate 11 is rotatably connected to the rotating sleeve 16. Two screw nails 13 are provided inside the disassembly side panel 3, and the other end of the screw nail 13 is threadedly connected to the movable plate 15. A heat sink 10 is provided at the top of the plate 2. The working principle of the structure in this area is that the plastic plate 1 is first installed above the electronic component and fixed. At this time, the thermal grease 9 at the bottom end of the rubber sleeve 7 contacts with electronic components of different shapes, and will deform accordingly according to the size of the electronic components, and the copper tube 18 will also extend into the interior of the metal fixed tube 20. At this time, screwing in the threaded nail 13 will make the disassembled side plate 3 and the movable plate 15 move closer to each other. At this time, the upper and lower ends of the movable plate 15 are squeezed with the metal buckle 14 and the plastic buckle 12 respectively, thereby driving the metal plate 2 and the plastic plate 1 to move closer to each other and making the matching ring 23 and the rotating sleeve 16 squeeze each other to prevent the rotating sleeve 16 from rotating by itself after the plastic plate 1 and the metal plate 2 are assembled. It should be noted thatAs the movable plate 15 moves outward, it drives the outer plate 8 and inner plate 11 to move together. The inner plate 11 then drives the rotating sleeve 16 to rotate, allowing the inner wall of the arc groove 24 to contact the movable arc plate 21. The connecting plate 25 then forces the fixed arc plate 22 to press against the copper tube 18, thereby fixing the position of the copper tube 18. In this way, the heat generated by the electronic components is transferred to the metal plate 2 through the thermal grease 9, copper tube 18, fixed arc plate 22, connecting plate 25, movable arc plate 21, rotating sleeve 16, inner plate 11, and mating ring 23, and ultimately dissipated through the heat sink 10 on the metal plate 2.

[0040] A third slot 47 is provided inside the fixing column 5, and a fixing nail 39 is movably provided inside the third slot 47. A first slot 42 is provided at the bottom end of the fixing nail 39, and a third rail slot 51 is provided on both sides of the left and right sides of the first slot 42. A first rail slot 40 is provided at the center of the first slot 42. The two third rail slots 51 are in an arc shape, and a limit rod 37 and a support rod 38 are rotatably provided on both sides of the inside of the first slot 42. One end of the limit rod 37 and one end of the support rod 38 are fixedly connected, and the other end of the limit rod 37 is provided with a first rotating shaft 52. One end of the first rotating shaft 52 is movably connected to the inner wall of the third rail slot 51, and the other end of the first rotating shaft 52 is rotatably provided with a pull rod 41, and the other end of the pull rod 41 is rotatably provided with a second rotating shaft 53, and the two pull rods 4 The other end of 1 is rotatably connected through the second rotating shaft 53, and the surface of the second rotating shaft 53 is provided with a metal wire 43. In this way, as the metal wire 43 is pulled up, the limit rod 37 can be supported by the pull rod 41 and the first rotating shaft 52. The inner top of the fixing nail 39 is provided with a fourth slide groove 35, and the inner part of the fourth slide groove 35 is movably provided with a third limit block 34. The top of the metal wire 43 passes through the interior of the fourth slide groove 35 and is fixedly connected to the bottom end of the third limit block 34. The top of the third slot 47 is movably provided with a rotating column 27, and movable columns 29 are provided on both sides of the rotating column 27. The inner walls on both sides of the top of the third slot 47 are provided with a second slide groove 30, and the other end of the movable column 29 is movably connected to the inner wall of the second slide groove 30. After 7 rotates, its movable column 29 will slide inside the second slide groove 30, so that the rotating column 27 can move up and down inside the third slot 47. The bottom end of the rotating column 27 is provided with a first tension spring 31, and the bottom end of the first tension spring 31 passes through the inside of the fourth slide groove 35 and is fixedly connected to the third limit block 34. The third slide groove 32 is opened on the left and right inner walls of the third slot 47. The top of the fixing nail 39 is fixedly provided with a second limit block 33 on both sides, and the second limit block 33 is movably connected to the inner wall of the third slide groove 32. The second limit block 33 and the third slide groove 32 cooperate to achieve that the fixing nail 39 can only move up and down. The bottom end of the fixed column 5 is rotatably provided with a rotating ring 6, and the inner surface of the rotating ring 6 is evenly provided with three arc sections. The teeth 36 and the left and right sides of the bottom end of the fixed column 5 are penetrated by a second groove 44. The horizontal height of the second groove 44 is adapted to the horizontal height of the rotating ring 6. An extrusion block 45 is movably provided inside the second groove 44. The top of the extrusion block 45 is movably connected to the arc tooth 36. The bottom end of the extrusion block 45 is pressed and contacted with the surface of the fixing nail 39. A fixed vertical rod 49 is rotatably provided at the center of the extrusion block 45. The surface of the fixed vertical rod 49 is sleeved with a torsion spring 50, and the two ends of the torsion spring 50 are fixedly connected to the fixed vertical rod 49 and the extrusion block 45 respectively. Through the action of the torsion spring 50, the bottom end of the extrusion block 45 can always be in a state of tending to alienate the surface of the fixing nail 39. The inner wall of the second groove 44 is provided with a second rail groove 48, and the second rail groove 48 is in an inclined state.A first slide groove 26 is provided inside the fixed column 5 and on one side of the second rail groove 48, and the first slide groove 26 is connected to the second groove 44 through the second rail groove 48. The other end of the fixed vertical rod 49 passes through the interior of the first slide groove 26 and is fixedly sleeved with a first limit block 28. A second tension spring 46 is provided on the top of the first limit block 28, and the top of the second tension spring 46 is fixedly connected to the inner wall of the first slide groove 26. The working principle of this area is that when the device needs to be installed above the circuit board of the corresponding electronic component, it only needs to be quickly turned. The rotating ring 6 is rotated. At this time, the arc teeth 36 inside the rotating ring 6 will alternately push down the extrusion blocks 45 on the left and right sides. When the arc teeth 36 on the left side of the rotating ring 6 push down the extrusion block 45 on the left side, the bottom end of the extrusion block 45 will contact the surface of the fixing nail 39 and push down, while the extrusion block 45 on the right side is in the blank area and will be driven by the torsion spring 50 to move its bottom end away from the fixing nail 39. At the same time, the second tension spring 46 will pull the first limit block 28 and the fixed rod 49, allowing the extrusion block 45 to quickly recover and wait for the next contact of the arc teeth 36. As the fixing pin 39 moves downward, the first tension spring 31 pulls the second rotating shaft 53 upward via the third limiting block 34 and the metal wire 43, thereby supporting the limiting rod 37 via the pull rod 41 and the first rotating shaft 52, allowing the limiting rod 37 to be stuck under the circuit board. To remove the heat sink, simply use a screwdriver to twist the rotating column 27 downward, reducing the tension of the first tension spring 31 and allowing the limiting rod 37 to be easily retracted into the first slot 42.

[0041] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0042] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation patch for microelectronics, comprising a plastic plate (1), a metal plate (2) and a detachable side plate (3), characterized in that: The plastic plate (1) is provided with two fixing ears (4) on both sides, and a fixing column (5) is provided inside the fixing ears (4). The bottom end of the plastic plate (1) is fixedly provided with a plurality of rubber sleeves (7), and the bottom end of the rubber sleeve (7) is fixedly provided with thermal grease (9). A copper tube (18) is provided inside the rubber sleeve (7) and located at the bottom end of the plastic plate (1). A connecting plate (17) is provided at the bottom end of the copper tube (18). The copper tube (18) and the thermal grease (9) are fixedly connected through the connecting plate (17). A metal fixing tube (20) is fixedly provided between the plastic plate (1) and the metal plate (2) and located above the copper tube (18). A rotating sleeve (16) is movably provided on the surface of the metal fixing tube (20), and an arc groove (24) is provided inside the rotating sleeve (16). Three connecting plates (25) are provided on the surface of the metal fixing tube (20). The two ends of (25) are respectively provided with a movable arc plate (21) and a fixed arc plate (22), the movable arc plate (21) is movably connected to the inner wall of the arc groove (24), and the fixed arc plate (22) is in pressure contact with the copper tube (18). The inner surfaces of the left and right sides of the plastic plate (1) and the metal plate (2) are respectively fixedly installed with a plastic buckle (12) and a metal buckle 14. The left and right sides of the plastic plate (1) are movably provided with a movable plate (15), the upper and lower ends of the movable plate (15) are respectively movably connected to the metal buckle (14) and the plastic buckle (12), the inner surface of the movable plate (15) is provided with an outer plate (8) and an inner plate (11), the outer wall of the inner plate (11) is rotatably connected to the rotating sleeve (16), two screw nails (13) are provided through the interior of the disassembly side plate (3), the other end of the screw nail (13) is threadedly connected to the movable plate (15), and the top of the metal plate (2) is provided with a heat sink (10).

2. A heat dissipation patch for microelectronics according to claim 1, characterized in that: A third slot (47) is provided inside the fixing column (5), a fixing nail (39) is movably provided inside the third slot (47), a first slot (42) is provided at the bottom end of the fixing nail (39), third rail slots (51) are provided on both the left and right sides of the first slot (42), and a first rail slot (40) is provided at the center of the first slot (42).

3. The heat dissipation patch for microelectronics according to claim 2, characterized in that: A limiting rod (37) and a supporting rod (38) are rotatably provided on both left and right sides of the interior of the first groove (42); one end of the limiting rod (37) is fixedly connected to one end of the supporting rod (38); the other end of the limiting rod (37) is provided with a first rotating shaft (52); one end of the first rotating shaft (52) is movably connected to the inner wall of the third rail groove (51).

4. The heat dissipation patch for microelectronics according to claim 3, characterized in that: The other end of the first rotating shaft (52) is rotatably provided with a pull rod (41), the other end of the pull rod (41) is rotatably provided with a second rotating shaft (53), and the other ends of the two pull rods (41) are rotatably connected through the second rotating shaft (53), and a metal wire (43) is provided on the surface of the second rotating shaft (53).

5. The heat dissipation patch for microelectronics according to claim 4, characterized in that: A fourth sliding groove (35) is provided at the inner top end of the fixing nail (39), a third limiting block (34) is movably provided inside the fourth sliding groove (35), and the top end of the metal wire (43) passes through the interior of the fourth sliding groove (35) and is fixedly connected to the bottom end of the third limiting block (34).

6. The heat dissipation patch for microelectronics according to claim 5, characterized in that: The top of the third slot (47) is movably provided with a rotating column (27), and movable columns (29) are provided on both sides of the rotating column (27). Second sliding grooves (30) are provided on the inner walls on both sides of the top of the third slot (47), and the other end of the movable column (29) is movably connected to the inner wall of the second sliding groove (30). The bottom end of the rotating column (27) is provided with a first tension spring (31), and the bottom end of the first tension spring (31) passes through the inside of the fourth sliding groove (35) and is fixedly connected to the third limit block (34). Third sliding grooves (32) are provided on the inner walls on both sides of the left and right sides of the third slot (47), and second limit blocks (33) are fixedly provided on the left and right sides of the top of the fixing nail (39), and the second limit block (33) is movably connected to the inner wall of the third sliding groove (32).

7. The heat dissipation patch for microelectronics according to claim 6, characterized in that: A rotating ring (6) is rotatably provided at the bottom end of the fixed column (5), and three arc teeth (36) are evenly provided on the inner surface of the rotating ring (6). A second groove (44) is provided through both left and right sides of the bottom end of the fixed column (5), and the horizontal height of the second groove (44) is adapted to the horizontal height of the rotating ring (6).

8. The heat dissipation patch for microelectronics according to claim 7, characterized in that: An extrusion block (45) is movably provided inside the second groove (44), the top end of the extrusion block (45) is movably connected to the arc tooth (36), the bottom end of the extrusion block (45) is in pressure contact with the surface of the fixing nail (39), and a fixed vertical rod (49) is rotatably provided at the center of the extrusion block (45), the surface of the fixed vertical rod (49) is sleeved with a torsion spring (50), and the two ends of the torsion spring (50) are fixedly connected to the fixed vertical rod (49) and the extrusion block (45) respectively.

9. The heat dissipation patch for microelectronics according to claim 8, characterized in that: A second rail groove (48) is provided on the inner wall of the second groove (44), a first slide groove (26) is provided inside the fixed column (5) and on one side of the second rail groove (48), and the first slide groove (26) is connected to the second groove (44) through the second rail groove (48), the other end of the fixed vertical rod (49) passes through the inside of the first slide groove (26) and is fixedly sleeved with a first limit block (28), a second tension spring (46) is provided at the top end of the first limit block (28), and the top end of the second tension spring (46) is fixedly connected to the inner wall of the first slide groove (26).

10. The heat dissipation patch for microelectronics according to claim 1, characterized in that: A plastic sleeve (19) is provided at the bottom end of the plastic plate (1) and located on the surface of the copper tube (18), and the plastic plate (1) and the rubber sleeve (7) are fixedly connected via the plastic sleeve (19). A matching ring (23) is provided at the bottom end of the metal plate (2) and located above the rotating sleeve (16), and the matching ring (23) is in press contact with the top end of the rotating sleeve (16).

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