Display panel, method for manufacturing optical filter, and method for forming display panel

Abstract

The application relates to a display panel, a preparation method of a filter, and a forming method of a display panel. The display panel comprises a light-emitting layer and a filter. The filter comprises a first metal layer, a micro-nano structure layer and a second metal layer arranged in sequence in a direction away from the light-emitting layer. The micro-nano structure layer is used for focusing light rays of the light-emitting layer. The first metal layer is used for allowing the light rays of the light-emitting layer to pass through. The side of the first metal layer and the second metal layer facing each other is used for repeatedly reflecting part of the light rays of the light-emitting layer. The second metal layer is used for allowing part of the light rays of the light-emitting layer to pass out. The light rays sequentially emitted from the second metal layer interfere with each other. In this way, the light-emitting efficiency can be improved through the micro-nano structure layer. The first metal layer and the second metal layer can improve the light-emitting effect of the display panel. The preparation method of the filter can prepare the filter comprised in the above display panel, and facilitates the manufacture of the display panel with high light-emitting efficiency. The forming method of the display panel is used for forming the above display panel with high light-emitting efficiency.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for preparing a display panel, a filter, and a method for forming the display panel. Background Technology

[0002] With the development of display technology, Mini-LED COB displays have gradually emerged. Mini-LED COB displays refer to LED chips packaged on a PCB board, which allows for smaller spacing between the LED chips, enabling the display to achieve high resolution even at a larger size.

[0003] However, current Mini-LED displays have low light output efficiency, resulting in high overall energy consumption. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for preparing a display panel and a filter, and a method for forming a display panel, in order to address the problem of low light emission efficiency of the display screen.

[0005] A display panel, the display panel comprising:

[0006] Emissive layer;

[0007] A light filter comprising a first metal layer, a micro / nano structure layer, and a second metal layer arranged sequentially in a direction away from the light-emitting layer. The micro / nano structure layer is used to focus the light from the light-emitting layer. The first metal layer allows the light from the light-emitting layer to pass through. The first metal layer and the second metal layer are used to repeatedly reflect a portion of the light from the light-emitting layer on opposite sides. The second metal layer allows a portion of the light from the light-emitting layer to pass through. The light rays exiting the second metal layer in sequence interfere with each other.

[0008] In one embodiment, the first metal layer includes at least one of metallic chromium, metallic silver, chromium compounds, and silver compounds.

[0009] In one embodiment, the second metal layer comprises at least one of aluminum, nickel, aluminum compounds, and nickel compounds.

[0010] In one embodiment, the thickness of the first metal layer is 4nm-6nm; and / or

[0011] The thickness of the second metal layer is 15nm-50nm; and / or

[0012] The thickness of the micro / nano structure layer is 325nm-405nm.

[0013] In one embodiment, the light-emitting layer includes a plurality of light-emitting chips arranged in an array at intervals, and the micro / nano structure layer includes a plurality of light-concentrating parts distributed corresponding to the light-emitting chips, wherein at least one of the light-concentrating parts corresponds to one light-emitting chip.

[0014] In one embodiment, the light-emitting layer further includes a filling layer, which is filled between the plurality of light-emitting chips and disposed between the light-emitting chips and the filter. The filling layer is made of a light-transmitting and light-guiding material.

[0015] In one embodiment, the thickness of the filling layer between the light-emitting chip and the filter is less than 0.5 mm along the direction from the light-emitting chip to the filter.

[0016] In one embodiment, the light-emitting layer further includes a PCB substrate, the light-emitting chip is packaged on the PCB substrate, and the PCB substrate is located on the side of the light-emitting chip away from the filter.

[0017] A method for preparing a filter, the method comprising the following steps:

[0018] Provides a substrate and a template with micro / nano structure patterns;

[0019] A first metal layer is formed on the substrate, and the first metal layer allows light to pass through;

[0020] The medium to be formed is arranged in the first metal layer;

[0021] The micro-nano structure pattern on the template is transferred onto the medium to be formed by imprinting to form a micro-nano structure layer;

[0022] Remove the template;

[0023] A second metal layer is formed on the micro / nano structure layer. The second metal layer and the first metal layer face each other on the same side for repeated reflection of light. The second metal layer allows some light to pass through, and the light rays emitted from the second metal layer in sequence interfere with each other.

[0024] A method for forming a display panel, the method comprising the following steps:

[0025] Provide PCB substrates;

[0026] Multiple light-emitting chips are packaged on the PCB substrate;

[0027] Optical adhesive is filled between the light-emitting chips, so that the optical adhesive covers the multiple light-emitting chips in a flat state to form a filling layer;

[0028] A filter is prepared using the preparation method described in the above embodiments, and the filter is disposed on the side of the filling layer opposite to the light-emitting chip.

[0029] In the aforementioned display panel, the micro-nano structure layer can focus the light from the light-emitting chip, increasing the light intensity and thus improving the light extraction efficiency of the display panel, which relatively reduces the energy consumption of the display panel. The combination of the first metal layer and the second metal layer can further enhance the light extraction effect of the display panel.

[0030] Specifically, the first metal layer allows light from the light-emitting layer to pass through. A portion of the light passing through the first metal layer is repeatedly reflected to one side of the first and second metal layers, while the remaining light passes through the second metal layer and exits. Therefore, by controlling the thickness of the micro / nano structure layers, the interference of light sequentially exiting the second metal layer can be enhanced. With this configuration, and by appropriately adjusting the thicknesses of the first, micro / nano structure, and second metal layers, combined with the principle of interference, the display panel can exhibit highly saturated colors. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application.

[0032] Figure 2 for Figure 1 The diagram shows an axial view of the filter in the display panel.

[0033] Figure 3 The effect of the thickness of the first metal layer on the reflection spectrum.

[0034] Figure 4 The effect of the thickness of the second metal layer on the reflection spectrum.

[0035] Figure 5 The effect of micro / nano structure layer thickness on the reflection spectrum.

[0036] Figure 6 for Figure 2 The diagram shows a light-gathering schematic of the micro-nano structure in the filter.

[0037] Figure 7 This is a flowchart illustrating the fabrication process of a filter provided in one embodiment of this application.

[0038] Reference numerals: 10, display panel; 100, light-emitting layer; 110, light-emitting chip; 120, PCB substrate; 130, filler layer; 200, filter; 210, first metal layer; 220, micro / nano structure layer; 221, light-concentrating part; 230, second metal layer; 240, substrate; 300, outer adhesive layer Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] The inventors of this application have discovered that current displays typically use LED chips as the light-emitting components to achieve small pixel pitch, i.e., the Mini-LED display. In a Mini-LED display, due to the small overall structure of the LED chip, the light provided by the LED chip allows for smaller spacing between individual pixels, thereby achieving higher resolution and facilitating splicing.

[0046] Currently, Mini-LED displays typically use optical adhesive with added diffusing agents to encapsulate LED chips to conduct light. However, manually mixing the optical adhesive makes it difficult to guarantee consistent proportions each time. Furthermore, the diffusing agent is usually made primarily of silica. If the silica is not ground evenly enough, the diffusing agent is prone to clumping when mixed with the optical adhesive, leading to low light extraction efficiency, modular light extraction, and large deviations in the light extraction angle of the display.

[0047] To address the aforementioned problems, this application proposes a method for fabricating a display panel and a light filter, as well as a method for forming the display panel. The display panel includes a light filter, which comprises a first metal layer, a micro / nano structure layer, and a second metal layer. The light filter, through the micro / nano structure layer, can focus the light emitted by the light-emitting chip, thereby increasing the transmittance of the light filter by improving the light intensity and thus enhancing the light extraction efficiency of the display panel. The interaction between the first and second metal layers further improves the light extraction effect of the display panel. The following detailed description, in conjunction with specific embodiments and accompanying drawings, provides a detailed explanation of the method for fabricating the display panel and the light filter provided in this application, as well as the method for forming the display panel.

[0048] Please see Figure 1 and Figure 2 In one embodiment, the display panel 10 includes a light-emitting layer 100 and a light filter 200. The light-emitting layer 100 is capable of emitting light. The light filter 200 includes a first metal layer 210, a micro / nano structure layer 220, and a second metal layer 230 arranged sequentially in a direction away from the light-emitting layer 100. The micro / nano structure layer 220 is used to focus the light emitted by the light-emitting layer 100. The first metal layer 210 allows the light emitted by the light-emitting layer 100 to pass through. The sides of the first metal layer 210 and the second metal layer 230 facing each other are used to repeatedly reflect a portion of the light emitted by the light-emitting layer 100. The second metal layer 230 allows a portion of the light emitted by the light-emitting layer 100 to pass through, and the light emitted sequentially from the second metal layer 230 interferes with each other.

[0049] In the aforementioned display panel 10, the micro-nano structure layer 220 can focus the light from the light-emitting chip 110, increasing the light intensity and thus improving the light emission efficiency of the display panel 10, which relatively reduces the energy consumption of the display panel 10. The first metal layer 210 and the second metal layer 230 work together to improve the light emission effect of the display panel 10.

[0050] Specifically, the first metal layer 210 allows light from the light-emitting layer 100 to pass through. A portion of the light passing through the first metal layer 210 is repeatedly reflected on the sides of the first metal layer 210 and the second metal layer 230 facing each other, while the remaining light passes through the second metal layer 230 and exits. Therefore, by controlling the thickness of the micro / nano structure layer 220, the interference of light sequentially exiting the second metal layer 230 can be enhanced. With this configuration, by appropriately setting the thicknesses of the first metal layer 210, the micro / nano structure layer 220, and the second metal layer 230, combined with the interference principle, the display panel 10 can possess highly saturated colors.

[0051] In one embodiment, to enable repeated reflection of light between the first metal layer 210 and the second metal layer 230, both layers can be made of materials with high reflectivity. For example, the first metal layer 210 may include metallic chromium or chromium compounds. Taking chromium as an example, since chromium has a significant impact on the reflection spectrum, studies of the reflection spectrum show that as the thickness of the first metal layer 210 increases, the peak wavelength of the reflection shifts towards longer wavelengths, and the bandwidth of the reflection spectrum first narrows and then widens. By appropriately setting the thickness of the first metal layer 210, the bandwidth of the reflection spectrum is minimized. At this point, the filter 200 exhibits the highest color saturation and a better display effect. Furthermore, chromium and chromium compounds also have high absorption properties. Therefore, through the combination of interference and absorption, the degree of freedom in color rendering of the display panel 10 can be increased.

[0052] In one embodiment, the second metal layer 230 may include aluminum or aluminum compounds. When the second metal layer 230 includes aluminum, it has a high reflectivity and functions as a high-reflection layer. Within a certain range, as the thickness of the second metal layer 230 gradually increases, the reflection peak value gradually increases, while the reflection bandwidth remains unchanged.

[0053] For the micro / nano structure layer 220, as the thickness of the micro / nano structure layer 220 increases, the light emitted by the light-emitting layer 100 will exhibit multiple interference levels. Within the same level, the reflection peak wavelength shifts towards longer wavelengths as the thickness of the micro / nano structure layer 220 increases. Thus, by reasonably adjusting the thicknesses of the first metal layer 210, the micro / nano structure layer 220, and the second metal layer 230, the emitted light color can be controlled. It is understood that, for the filter 200 comprising multiple thin films described in various embodiments, to achieve controllable light emitted from the display panel 10, the propagation of light in the filter 200 can be calculated using the transmission matrix, and the relationship between the reflection spectrum and the thicknesses of the first metal layer 210, the second metal layer 230, and the micro / nano structure layer 220 in the filter 200 can be derived using interference principles. This allows for controllable light color emitted from each light-emitting chip 110, facilitating the formation of the desired image. (The thickness direction is described in [reference needed]). Figure 1 And the number K in the diagram.

[0054] Of course, in one embodiment, the material of the first metal layer 210 is not limited to chromium or chromium compounds; the first metal layer 210 may include metallic silver or silver compounds. That is, the first metal layer 210 may include at least one of metallic chromium, metallic silver, chromium compounds, and silver compounds. Of course, the first metal layer 210 may also be made of other materials with similar properties.

[0055] In one embodiment, the material of the second metal layer 230 is not limited to aluminum or aluminum compounds; the second metal layer 230 may also include metallic nickel or nickel compounds. That is, the second metal layer 230 may include at least one of metallic aluminum, metallic nickel, aluminum compounds, and nickel compounds. Of course, the second metal layer 230 may also be made of other materials with similar properties.

[0056] For ease of understanding and description, the following explanation will still use the example of the first metal layer 210 including chromium and the second metal layer 230 including aluminum. It should be understood that the same applies to other materials.

[0057] Combined Figure 3In one embodiment, the thickness of the first metal layer 210 is 4nm-6nm. It is understood that chromium has a significant impact on the reflection spectrum. As the thickness of the first metal layer 210 increases, the peak reflection wavelength shifts towards longer wavelengths, and the reflection spectral bandwidth first narrows and then widens. When the thickness of the first metal layer 210 is 4nm-6nm, the reflection spectral bandwidth can reach its minimum point. At this point, the filter 200 exhibits the highest color saturation, resulting in better light emission from the display panel 10. Specifically, the thickness of the first metal layer 210 can be 5nm.

[0058] Please see Figure 4 In one embodiment, the thickness of the second metal layer 230 is 15nm-50nm. It should be noted that for aluminum, as the thickness gradually increases from 0-50nm, the reflection peak gradually increases, while the reflection bandwidth remains unchanged. When the thickness of the second metal layer 230 is less than 15nm, the second metal layer 230 is too thin, resulting in significant energy loss during light transmission. Therefore, the thickness of the second metal layer 230 can be selected to be 15nm-50nm.

[0059] Please see Figure 5 In one embodiment, the thickness of the micro / nano structure layer 220 is 325nm-405nm. The micro / nano structure layer 220 serves as an intermediate dielectric layer between the first metal layer 210 and the second metal layer 230. Based on the influence of the dielectric film thickness on the reflection spectrum, it is known that red and green reflections are obtained when the thickness of the intermediate dielectric layer is 325nm or 405nm.

[0060] Therefore, based on the transmission matrix method and using spectrophotometer measurements, when the incident light has an 8% incidence, the peak wavelengths of red and green light reflection are 644 mm and 538 mm, respectively, corresponding to a peak reflectance of approximately 89%. This configuration of filter 200, utilizing a single pixel with a micro / nano structure, enables more efficient color output and color rendering.

[0061] Please see Figure 1 and Figure 6 In one embodiment, the light-emitting layer 100 includes a plurality of light-emitting chips 110 arranged in an array at intervals, and the micro / nano structure layer 220 includes a plurality of light-concentrating portions 221 distributed corresponding to the light-emitting chips 110. At least one light-concentrating portion 221 corresponds to one light-emitting chip 110. In this way, the light emitted by the corresponding light-emitting chip 110 can be focused by the light-concentrating portion 221 and the light can be adjusted into parallel light.

[0062] The various light-concentrating sections 221 disposed on the micro / nano structure layer 220 work together to make the light emitted by the display panel 10 more uniform. Specifically, since the light-emitting chips 110 are arranged at intervals, the light emitted by each light-emitting chip 110 is linear, which can easily lead to uneven local light distribution and uneven overall light emission from the display panel 10. The micro / nano structure layer 220 focuses the light through the light-concentrating sections 221, changes the light emission angle, and redistributes the light, thereby improving the uniformity of light emission from the display panel 10. At the same time, the light passing through the micro / nano structure layer 220 can also reach the edges and corners during propagation and can still be refracted in the original direction.

[0063] Please see Figure 6 In one embodiment, the light-concentrating part 221 includes a concave curved surface to achieve the function of focusing light. The concave curved surface may include a spherical surface, an ellipsoidal surface, etc., and can be set accordingly according to the actual light-concentrating requirements, which will not be described in detail here.

[0064] In one embodiment, a light-emitting chip 110 may also correspond to multiple light-concentrating parts 221. That is, multiple light-concentrating parts 221 can cooperate with each other to focus light from different areas of the same light-emitting chip 110 to form parallel light.

[0065] In one embodiment, the light-emitting chips 110 can be grouped into sets of three, and the display panel 10 includes multiple sets of light-emitting chips 110. Each set of light-emitting chips 110 includes a chip 110 capable of emitting red light, a chip 110 capable of emitting green light, and a chip 110 capable of emitting blue light. These three types of pixels (red, green, and blue) work together to form the image to be displayed on the display panel 10.

[0066] Please see Figure 1 In one embodiment, the light-emitting layer 100 further includes a filling layer 130, which fills the spaces between the plurality of light-emitting chips 110. The filling layer 130 is also disposed between the light-emitting chips 110 and the filter 200, and is made of a light-transmitting and light-guiding material. Thus, by filling the spaces between the light-emitting chips 110 with the filling layer 130, a light-uniforming effect can be achieved, and the problem of uneven light emission in the display panel 10 can be improved.

[0067] In one embodiment, the filler layer 130 may be made of optical adhesive. This allows for the connection between the filter 200 and the light-emitting chip 110, ensuring a stable relative position between them. Specifically, the filler layer 130 may be made of epoxy resin with added diffusing agent. Since epoxy resin is a transparent material, it can enhance light emission and uniformity. The filler layer 130 made of epoxy resin with added diffusing agent has a refractive index of 1.56.

[0068] In one embodiment, the first metal layer 210 comprises chromium and / or chromium compounds. Chromium has a refractive index of approximately 2.97, which is relatively high and can improve the light extraction efficiency of the display panel 10. Chromium compounds, such as chromium oxide, have a refractive index of approximately 2.705, which is also relatively high and can improve the light extraction efficiency of the display panel 10.

[0069] In one embodiment, the micro / nanostructure layer 220 may include an optical adhesive, and by forming a micro / nanostructure with the light-focusing portion 221 on the optical adhesive, the micro / nanostructure layer 220 can focus light. Specifically, the micro / nanostructure layer 220 may include a UV-curable adhesive, which can rapidly cure under UV light irradiation, facilitating the formation of the micro / nanostructure layer 220. The use of a UV-curable adhesive for the micro / nanostructure layer 220 also facilitates light conduction. The refractive index of the micro / nanostructure layer 220 formed by the UV-curable adhesive is approximately 1.55.

[0070] In one embodiment, along the direction from the light-emitting chip 110 to the filter 200, the thickness of the filling layer 130 between the light-emitting chip 110 and the filter 200 is less than 0.5 mm. This achieves a uniform light output effect through the filling layer 130 while reducing its impact on light propagation. It is understood that, while ensuring a smooth surface coverage of each light-emitting chip 110, the smaller the thickness of the filling layer 130 between the light-emitting chip 110 and the filter 200, the better. In actual production, the thickness of the filling layer 130 between the light-emitting chip 110 and the filter 200 can be controlled between 0.01 mm and 0.5 mm to manage costs.

[0071] In one embodiment, the light-emitting layer 100 further includes a PCB substrate 120, on which the light-emitting chip 110 is packaged. The PCB substrate 120 is located on the side of the light-emitting chip 110 away from the filter 200. The PCB substrate 120 serves as a driving device for the light-emitting chip 110, providing a driving voltage to the light-emitting chip 110.

[0072] In one embodiment, the display panel 10 further includes an outer adhesive layer 300, which is coated and cured on the side of the filter 200 away from the light-emitting chip 110. By coating the surface of the filter 200 with the outer adhesive layer 300, the structure of the filter 200 can be protected on the one hand, and the light emission effect can be improved on the other hand.

[0073] To facilitate understanding of the structure of the display panel 10, the overall structure of the display panel 10 is briefly described below. The display panel 10 sequentially includes a PCB substrate 120, a light-emitting chip 110, a filler layer 130, a first metal layer 210, a micro / nano structure layer 220, a second metal layer 230, and an outer adhesive layer 300. The PCB substrate 120 is used to drive the light-emitting chip 110 to emit light. The filler layer 130 fills the spaces between the light-emitting chips 110, and also fills the space between the filter 200 and the light-emitting chip 110 to improve the connection between the filter 200 and the substrate and the light-emitting chip 110. Along the direction away from the light-emitting chip 110, the first metal layer 210, the micro / nano structure layer 220, and the second metal layer 230 are sequentially distributed. By setting the micro / nano structure layer 220, the filter 200 can have high transmittance; by combining the first metal layer 210 with the second metal layer 230, the color saturation of the filter 200 is improved. In this way, the light emission efficiency is higher when the transmission filter is 200, which can relatively reduce the energy consumption of the panel.

[0074] In this application, as described in the above embodiments, the transmittance of the display panel 10 can be obtained to be between 98% and 99.7%.

[0075] One embodiment of this application also provides a method for preparing a filter 200, such as... Figure 7 As shown, the preparation method includes the following steps S41 to S46.

[0076] Step S41: Provide a substrate 240 and a template with micro-nano structure patterns.

[0077] The substrate 240 can be a PET (polyethylene terephthalate) film substrate 240. The template can be a 500μm dot array nickel template.

[0078] Step S42: A first metal layer 210 containing chromium is formed on the substrate 240, and the first metal layer 210 allows light to pass through.

[0079] The first metal layer 210 may include chromium, a chromium compound, silver, or a silver compound. The first metal layer 210 may be formed on the substrate 240 by electrolysis, spraying, vacuum deposition, or high-temperature diffusion.

[0080] Step S43: Arrange the medium to be formed in the first metal layer 210.

[0081] The medium to be formed is used to support the light-concentrating part 221 and ultimately form the micro / nano structure layer 220. The medium to be formed can be a UV-curable adhesive. Step S43 further includes the following steps S431 and S432.

[0082] Step S431: Apply the dielectric adhesive to be formed on the side of the first metal layer 210 away from the light-emitting chip 110.

[0083] Step S432: Bake the medium to be molded to cure it, so that the medium to be molded has a relatively fixed shape.

[0084] The baking time can be adjusted according to the composition of the medium to be molded. For example, when the medium to be molded includes UV-curable adhesive, the baking time can be 1 minute.

[0085] Step S44: The micro-nano structure pattern on the template is transferred to the medium to be formed by imprinting to form a micro-nano structure layer 220.

[0086] The imprinting process can be performed using a nanoimprinting machine to transfer the micro-nano structure on the template onto the medium to be formed, thereby creating a micro-nano structure layer 220. This allows the micro-nano structure layer 220 to focus light and improve the light emission effect of the display panel 10.

[0087] It is understood that the imprinting described in this embodiment is one method of forming the micro / nano structure layer 220. Etching or other methods can also be used to form the micro / nano structure layer 220 with the light-concentrating portion 221 on the substrate to be formed.

[0088] Step S45: Remove the template.

[0089] In step S46, a second aluminum-containing metal layer 230 is formed on the micro / nano structure layer 220. The sides of the second metal layer 230 and the first metal layer 210 facing each other are used for repeated light reflection. A portion of the light passes through the second metal layer 230, and the light rays exiting the second metal layer 230 sequentially interfere with each other. Therefore, by controlling the thickness of the micro / nano structure layer 220, the interference of the light rays exiting the second metal layer 230 sequentially can be strengthened. With this configuration, by reasonably setting the thicknesses of the first metal layer 210, the micro / nano structure layer 220, and the second metal layer 230, combined with the interference principle, the display panel 10 can possess the characteristic of highly saturated colors.

[0090] The second metal layer 230 may include aluminum, aluminum compounds, nickel, or nickel compounds. The second metal layer 230 can be deposited on the micro / nano structure layer 220 using ion beam sputtering deposition. Alternatively, other methods can be used to form a second metal layer 230 with high reflectivity on the micro / nano structure layer 220.

[0091] An embodiment of this application also provides a method for forming a display panel 10, the method comprising the following steps:

[0092] Step S1: Provide PCB substrate 120.

[0093] In step S2, multiple light-emitting chips 110 are packaged on a PCB substrate 120. Thus, the PCB substrate 120 can drive the light-emitting chips 110 to emit light.

[0094] In step S3, optical adhesive is filled between the light-emitting chips 110, so that the optical adhesive covers the multiple light-emitting chips 110 in a flat state, forming a filling layer 130. In this way, the light uniformity of the display panel 10 can be improved and the phenomenon of uneven light output can be reduced.

[0095] Step S4: The filter 200 is prepared using the method described in the above embodiments, and the filter 200 is disposed on the side of the filling layer 130 facing away from the light-emitting chip 110. In this way, when light passes through the filter 200 and exits the display panel 10, the light emission is more uniform and the light emission efficiency is higher.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Emissive layer; A light filter comprising a first metal layer, a micro / nano structure layer, and a second metal layer arranged sequentially in a direction away from the light-emitting layer. The micro / nano structure layer is an intermediate dielectric layer between the first metal layer and the second metal layer. The micro / nano structure layer is used to focus the light from the light-emitting layer. The first metal layer allows the light from the light-emitting layer to pass through. The first metal layer and the second metal layer are used to repeatedly reflect a portion of the light from the light-emitting layer on opposite sides. The second metal layer allows a portion of the light from the light-emitting layer to pass through. The light rays exiting the second metal layer sequentially interfere with each other. The thickness of the micro / nano structure layer is 325nm-405nm. The light-emitting layer includes a plurality of light-emitting chips arranged in an array at intervals, and the micro-nano structure layer includes a plurality of light-concentrating parts distributed corresponding to the light-emitting chips, at least one of the light-concentrating parts corresponding to one light-emitting chip, and the light-concentrating part includes a concave curved surface.

2. The display panel according to claim 1, characterized in that, The first metal layer includes at least one of metallic chromium, metallic silver, chromium compounds, and silver compounds.

3. The display panel according to claim 2, characterized in that, The second metal layer includes at least one of aluminum, nickel, aluminum compounds, and nickel compounds.

4. The display panel according to claim 3, characterized in that, The thickness of the first metal layer is 4nm-6nm; and / or The thickness of the second metal layer is 15nm-50nm.

5. The display panel according to claim 1, characterized in that, One light-emitting chip corresponds to multiple light-concentrating units.

6. The display panel according to claim 5, characterized in that, The light-emitting layer further includes a filling layer, which is filled between the plurality of light-emitting chips and is also disposed between the light-emitting chips and the filter. The filling layer is made of a light-transmitting and light-guiding material.

7. The display panel according to claim 6, characterized in that, Along the direction from the light-emitting chip to the filter, the thickness of the filling layer between the light-emitting chip and the filter is less than 0.5 mm.

8. The display panel according to any one of claims 5-7, characterized in that, The light-emitting layer also includes a PCB substrate, and the light-emitting chip is packaged on the PCB substrate, with the PCB substrate located on the side of the light-emitting chip away from the filter.

9. A method for preparing a filter, characterized in that, The preparation method includes the following steps: Provides a substrate and a template with micro / nano structure patterns; A first metal layer is formed on the substrate, and the first metal layer allows light to pass through; The medium to be formed is arranged in the first metal layer; The micro-nano structure pattern on the template is transferred to the medium to be formed by imprinting to form a micro-nano structure layer. The micro-nano structure layer is used to focus the light of the light-emitting layer. The micro-nano structure layer includes multiple light-concentrating parts distributed to correspond to multiple light-emitting chips of the light-emitting layer. At least one of the light-concentrating parts corresponds to one light-emitting chip. The light-concentrating part includes a concave curved surface. The thickness of the micro-nano structure layer is 325nm-405nm. Remove the template; A second metal layer is formed on the micro / nano structure layer. The second metal layer and the first metal layer face each other on the same side for repeated reflection of light. The second metal layer allows some light to pass through, and the light rays that exit the second metal layer in sequence interfere with each other. The micro / nano structure layer is an intermediate dielectric layer between the first metal layer and the second metal layer.

10. A method for forming a display panel, characterized in that, The formation method includes the following steps: Provide PCB substrates; Multiple light-emitting chips are packaged on the PCB substrate; Optical adhesive is filled between the light-emitting chips, so that the optical adhesive covers the multiple light-emitting chips in a flat state to form a filling layer; A filter is prepared using the preparation method described in claim 9, and the filter is disposed on the side of the filling layer opposite to the light-emitting chip.

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