Electronic device and electronic device debugging method

Abstract

The application discloses an electronic device and an electronic device debugging method. The electronic device comprises a screen, a metal frame and conductive foam. The conductive foam is attached between the screen and the metal frame and located on the circumferential side of the metal frame. The conductive foam comprises a first attachment surface, a second attachment surface and a first side conductive surface connecting the first attachment surface and the second attachment surface. The first attachment surface is attached to and conductively connected with the screen. The second attachment surface is attached to and conductively connected with the metal frame. The first side conductive surface faces or is away from the middle part of the metal frame.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronics, and particularly relates to an electronic device and an electronic device debugging method. BACKGROUND

[0002] In a mobile terminal device, it is usually necessary to connect a screen with a metal frame as a main ground to reduce the interference of high-frequency electromagnetic waves generated by the screen in operation on an antenna. At present, the screen grounding is mainly achieved by connecting the screen and the metal frame through conductive foam. With the development of communication technology, the functions of mobile terminal devices are more and more various, and the application of various new antenna technologies such as high-frequency antennas makes the grounding requirements of the devices more and more strict.

[0003] In the related technology of screen grounding, the conductive foam is usually arranged parallel to the long side or the short side of the metal frame, or the arrangement direction of the conductive foam is adaptively adjusted according to the actual lapping space of the metal frame and the screen, under the consideration of the direct current lapping impedance. However, in actual application, problems of radiated spurious emission (RSE) or passive inter modulation (PIM) are prone to occur. SUMMARY

[0004] The present application aims to provide an electronic device and an electronic device debugging method, and at least solve the problem that the electronic device is prone to radiated spurious emission or passive inter modulation.

[0005] In order to solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, an electronic device is provided by the embodiments of the present application, which comprises:

[0007] a screen and a metal frame;

[0008] a conductive foam, which is attached between the screen and the metal frame and located at the circumferential side of the metal frame; the conductive foam comprises a first attachment surface, a second attachment surface and a first side conductive surface connecting the first attachment surface and the second attachment surface, the first attachment surface is attached to and conductively connected with the screen, the second attachment surface is attached to and conductively connected with the metal frame, and the first side conductive surface faces or is away from the middle part of the metal frame.

[0009] According to the electronic device provided by the present application, the included angle between the line connecting the conductive foam and the center of the metal frame and the first side conductive surface is 45°-90°.

[0010] According to the electronic device provided in the application, the metal frame is equally divided into three bonding areas in the length direction of the metal frame, each bonding area is provided with at least one bonding part, and at least one bonding part in each bonding area is bonded with the conductive foam.

[0011] According to the electronic device provided in the application, at least one bonding part is provided with a plurality of conductive foams, and the first side conductive surfaces of the plurality of conductive foams on the same bonding part are parallel to each other.

[0012] According to the electronic device provided in the application, the first side conductive surfaces of the plurality of conductive foams on the same bonding part are flush with each other.

[0013] According to the electronic device provided in the application, the number of conductive foams is at least three, and the plurality of conductive foams are equally spaced along the circumferential side of the metal frame.

[0014] According to the electronic device provided in the application, the conductive foam further comprises a second side conductive surface connecting the first bonding surface and the second bonding surface, and the first side conductive surface and the second side conductive surface are arranged opposite to each other.

[0015] In a second aspect, the embodiments of the application provide an electronic device debugging method, the electronic device comprising a screen, a metal frame and a conductive foam, the conductive foam being bonded between the screen and the metal frame and located on the circumferential side of the metal frame, the conductive foam comprising a first bonding surface, a second bonding surface and a first side conductive surface connecting the first bonding surface and the second bonding surface, the first bonding surface being bonded and conductively connected with the screen, the second bonding surface being bonded and conductively connected with the metal frame, and the electronic device debugging method comprising:

[0016] obtaining a fundamental mode current distribution of a resonant cavity formed by the screen, the metal frame and the conductive foam through simulation;

[0017] adjusting an included angle between a line connecting centers of the conductive foam and the metal frame and the first side conductive surface according to the fundamental mode current distribution, so as to improve uniformity of current distribution flowing to the first side conductive surface.

[0018] According to the electronic device debugging method provided in the application, the method further comprises:

[0019] obtaining a simulation resonant frequency of the resonant cavity through simulation;

[0020] determining that the simulation resonant frequency is within an operating frequency band of an antenna, and adding the conductive foam on the circumferential side of the metal frame.

[0021] According to the electronic device debugging method provided in the application, the method further comprises:

[0022] starting the screen, detecting an actual resonant frequency of the resonant cavity;

[0023] determining that the actual resonant frequency is within a working frequency band of the antenna, and adding the conductive foam to a periphery of the metal frame.

[0024] In the embodiments of the present application, by setting the first side conductive surface of the conductive foam between the screen and the metal frame of the electronic device to face or face away from the middle part of the metal frame, the base mode current flowing to the first side conductive surface on the metal frame forms a large angle with the first side conductive surface, so that the base mode current flowing to the first side conductive surface is more uniformly distributed, the effective overlap area of the conductive foam is increased, the maximum current density of the conductive foam is reduced, and the risk of radiation spurious or passive intermodulation is reduced.

[0025] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0026] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, in which:

[0027] Figure 1 is a schematic diagram of the positional relationship between the screen, the metal frame and the conductive foam in the electronic device according to the embodiments of the present application;

[0028] Figure 2 is a schematic diagram of the connection relationship between the screen, the metal frame and the conductive foam in the electronic device according to the embodiments of the present application;

[0029] Figure 3 is a schematic diagram of the connection relationship between the screen, the metal frame and the conductive foam in the electronic device according to the embodiments of the present application;

[0030] Figure 4 is an arrangement of the conductive foam in the related art;

[0031] Figure 5 is one of the arrangements of the conductive foam in the electronic device according to the embodiments of the present application;

[0032] Figure 6 is Figure 4 is a schematic diagram of the base mode current distribution around the conductive foam in the lower left corner of

[0033] Figure 7 is Figure 5 is a schematic diagram of the base mode current distribution around the conductive foam in

[0034] Figure 8 is the second arrangement of conductive foam in an electronic device according to an embodiment of the present application;

[0035] Figure 9 is the third arrangement of conductive foam in an electronic device according to an embodiment of the present application;

[0036] Figure 10 is a flowchart of a method for debugging an electronic device according to an embodiment of the present application;

[0037] Reference Signs:

[0038] 1, screen; 2, metal frame; 21, bonding area; 211, bonding part; 3, conductive foam; 31, first bonding surface; 32, second bonding surface; 33, first side conductive surface; 34, second side conductive surface. DETAILED DESCRIPTION

[0039] Embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar reference numbers throughout the several views. The embodiments described below are examples in which the same or similar components have the same or similar reference numbers throughout the several views. The embodiments described below are examples for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative work fall within the scope of the present application.

[0040] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0041] In the description of the present application, it should be understood that the terms "longitudinal", "length", "width", "thickness", "upper", "lower", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] The following will be described in detail Figures 1-10 The electronic device and the electronic device debugging method according to the embodiments of the present application are described.

[0044] The electronic device provided by the present application can be a mobile phone, a tablet computer, a game console or the like. As Figure 1 As shown in the figure, the electronic device provided by the embodiments of the present application includes a screen 1, a metal frame 2 and a conductive foam 3. The conductive foam 3 is attached between the screen 1 and the metal frame 2, and is located at the circumferential side of the metal frame 2.

[0045] As Figure 2 and Figure 3 As shown, the conductive foam 3 includes a first attachment surface 31, a second attachment surface 32 and a first side conductive surface 33 connecting the first attachment surface 31 and the second attachment surface 32. The first attachment surface 31 is attached to and conductively connected to the screen 1, the second attachment surface 32 is attached to and conductively connected to the metal frame 2, and the first side conductive surface 33 faces or departs from the middle part of the metal frame 2.

[0046] It should be noted that the middle part of the metal frame 2 can be understood as the middle area located at the relative center of the metal frame 2. It can be understood that the first side conductive surface 33 faces or departs from the middle part of the metal frame 2, so that the line connecting the center of the metal frame 2 and the conductive foam 3 forms a larger angle with the first side conductive surface 33.

[0047] Among them, the conductive foam 3 is made of a conductive material coated on a non-conductive foam body, and the first attachment surface 31, the second attachment surface 32 and the first side conductive surface 33 are formed by the conductive material. The conductive foam 3 is usually a rectangular sheet structure, the first attachment surface 31 and the second attachment surface 32 are respectively the front and back surfaces in the thickness direction, and the first side conductive surface 33 is the side surface in the thickness direction. The first side conductive surface 33 serves as the conductive path surface of the conductive foam 3 for conducting the screen 1 and the metal frame 2.

[0048] The metal frame 2 serves as the main ground of the electronic device, and when the conductive foam 3 is overlapped between the screen 1 and the metal frame 2, the current on the screen 1 can flow to the metal frame through the first side conductive surface 33, thereby realizing the grounding of the screen 1.

[0049] The conductive foam 3 is arranged between the screen 1 and the metal frame 2, and the screen 1, the metal frame 2 and the conductive foam 3 form a resonant cavity. The main scenario causing the radiation spurs and the passive intermodulation problem of the whole machine antenna excitation is the excitation of the screen resonant cavity mode. In the excitation of the screen resonant cavity mode, the base mode current of the resonant cavity is coupled to the conductive foam 3. The number of the conductive foams 3 is usually set to be multiple, and the base mode current is shown to flow from the center of the metal frame 2 to each conductive foam 3.

[0050] It can be understood that the center of the metal frame 2 and the direction of the line connecting the metal frame 2 and the conductive foam 3 are basically consistent with the direction of the base mode current flowing to the conductive foam 3. That is, when the first side conductive surface 33 faces or departs from the middle part of the metal frame 2, the first side conductive surface 33 has a large angle with the base mode current flowing to the conductive foam 3.

[0051] It should be noted that, as shown in Figure 6 and Figure 7 , the base mode current actually flows to the conductive foam 3 from each direction around the conductive foam 3, but the main flow direction of the base mode current is the direction of the line connecting the metal frame 2 and the conductive foam 3. For the convenience of description, the direction of the base mode current described in the embodiments of the present application refers to the main flow direction of the base mode current.

[0052] In the process of solving the radiation spurs and the passive intermodulation problem of the mobile terminal, the technical personnel found that in the conventional setting mode of the conductive foam 3 arranged parallel to the long side or the short side of the metal frame 2 or inclined according to the installation condition, the current distribution of the resonant cavity coupled to the conductive foam 3 is obviously non-uniform when the antenna is excited, mainly on the first side conductive surface 33.

[0053] Figure 4 A conventional arrangement of the conductive foam 3 is shown, and the first side conductive surface 33 of the conductive foam 3 does not face the middle part of the metal frame 2, and has a small angle with the corresponding flow direction of the base mode current. The first side conductive surface 33 of the two conductive foams 3 located in the middle and the lower left corner of the metal frame 2 even has a 0° angle with the corresponding flow direction of the base mode current.

[0054] The base mode current in Figure 4 is simulated, and the base mode current flows from the center of the rectangular metal frame 2 to the multiple conductive foams 3 on the periphery, as shown by the dashed arrows in the figure. Taking Figure 4 the conductive foam 3 in the middle of the metal frame as an example, as shown in Figure 6As shown in the figure, the arrow size represents the current size, and the arrow direction represents the current direction. The base film current flows from one side of the first side conductive surface 33 to the conductive foam 3, and the large current is concentrated in the corner of the conductive foam 3 overlapped, close to the area where the base film current flows, and the current on the opposite side is very weak. From the perspective of electromagnetism, the structure of the small current area has little effect on the actual overlapping effect, which is equivalent to the effective overlapping area of the conductive foam 3 being relatively small, the base current density on the conductive foam 3 being large, a large voltage being generated between the first and second bonding surfaces 31 and 32 of the conductive foam 3, the harmonic level being increased, and there being a high risk of radiation spurs and passive cross modulation.

[0055] To this end, the application proposes to adjust the installation angle of the conductive foam 3 to be towards or away from the middle of the metal frame 2, so that the first side conductive surface 33 forms a large angle with the flow direction of the corresponding base current.

[0056] Among them, the first side conductive surface 33 can be towards the center of the metal frame 2, or the first side conductive surface 33 can be towards the direction slightly deviating from the center of the metal frame 2.

[0057] Figure 5 The arrangement of the conductive foam 3 of an embodiment of the application is shown, and the first side conductive surface 33 of each conductive foam 3 is towards the middle of the metal frame 2 and forms a 90° angle with the flow direction of the corresponding base current.

[0058] The base current in the Figure 5 is simulated, and the base current flows from the center of the rectangular metal frame 2 to the plurality of conductive foams 3 on the periphery, as shown by the dashed arrows in the figure. As shown in Figure 7 , the arrow size represents the current size, and the arrow direction represents the current direction. The base current flowing to the first side conductive surface 33 of each conductive foam 3 is uniformly distributed along the width direction of the first side conductive surface 33, the effective overlapping area of the conductive foam 3 is large, and the maximum base current density on the conductive foam 3 is greatly reduced compared with the conductive foam 3 in the above Figure 6 , thereby reducing the risk of radiation spurs and passive cross modulation.

[0059] It should be noted that Figure 5 , the first side conductive surface 33 of the conductive foam 3 shown is arranged towards the middle of the metal frame 2, and the skilled person has simulated the conductive foam 3 at different arrangement angles to determine that the first side conductive surface 33 is arranged away from the middle of the metal frame 2, which basically does not affect the uniformity of the base current distribution on the first side conductive surface 33, and can also reduce the risk of radiation spurs and passive cross modulation.

[0060] According to the electronic device provided in the embodiments of the present application, the first side conductive surface 33 of the conductive foam 3 between the screen 1 and the metal frame 2 is arranged to face or be away from the middle part of the metal frame 2, so that the fundamental mode current flowing to the first side conductive surface 33 of the metal frame 2 forms a large angle with the first side conductive surface 33, the fundamental mode current flowing to the first side conductive surface 33 is distributed more uniformly, the effective overlapping area of the conductive foam 3 is increased, the maximum current density of the conductive foam 3 is reduced, and the risk of radiation spurs and passive intermodulation is reduced.

[0061] In some embodiments of the present application, the angle between the line connecting the center of the conductive foam 3 and the metal frame 2 and the first side conductive surface 33 is 45°-90°. In this case, the angle between the first side conductive surface 33 of the conductive foam 3 and the flow direction of the fundamental mode current flowing thereto is 45°-90°, so that the fundamental mode current flows to the first side conductive surface 33 more uniformly, and the risk of radiation spurs and passive intermodulation is controlled. The angle between the line connecting the center of the conductive foam 3 and the metal frame 2 and the first side conductive surface 33 can be 45°, 60°, 70° or 90°, and can be adjusted according to the installation conditions of the conductive foam 3 and the actual fundamental mode current to meet the performance requirements of the device.

[0062] In some embodiments of the present application, the circumferential side of the metal frame 2 is equally divided into three bonding areas 21 in the length direction of the metal frame 2, each bonding area 21 is provided with at least one bonding part 211, and at least one bonding part 211 in each bonding area 21 is bonded with the conductive foam 3. The length direction of the metal frame 2 is the extension direction of the long side of the metal frame 2. The bonding part 211 is distributed on the circumferential side of the metal frame 2, and is usually a planar area on the circumferential side of the metal frame 2 which can be bonded with the conductive foam 3.

[0063] It can be understood that the side of the metal frame 2 facing the screen 1 is equally divided into three bonding areas 21 in the longitudinal direction of the view, and at least one bonding part 211 is arranged in each bonding area 21, that is, at least three bonding parts are arranged on the metal frame 2. Figure 5 As shown in FIG. 2, two bonding parts 211 are arranged in the upper bonding area 21, one bonding part 211 is arranged in the middle bonding area 21, and two bonding parts 211 are arranged in the lower bonding area 21. Figure 5 It can be understood that the side of the metal frame 2 facing the screen 1 is equally divided into three bonding areas 21 in the longitudinal direction of the view, and at least one bonding part 211 is arranged in each bonding area 21, that is, at least three bonding parts are arranged on the metal frame 2.

[0064] It can be understood that the entire metal frame 2 is provided with at least three conductive foams 3, and at least one conductive foam 3 is arranged in each bonding area 21. In this way, the antenna excitation forms a relatively fixed screen resonant cavity mode, that is, the flow direction of the resonant current flows from the center of the metal frame 2 to the multiple conductive foams 3 on the circumferential side.

[0065] In the design of the metal frame 2 structure, a plurality of fitting parts 211 can be reserved in at least one fitting area 21, so that the conductive foam 3 can be added in the later debugging.

[0066] Further, the at least one fitting part 211 is provided with a plurality of conductive foams 3, and the first side conductive surfaces 33 of the plurality of conductive foams 3 on the same fitting part 211 are parallel to each other. Figure 8 As shown in FIG. 8, in some optional embodiments of the present application, the first side conductive surfaces 33 of the plurality of conductive foams 3 on the same fitting part 211 are flush with each other. It can be understood that the first side conductive surfaces 33 of the two conductive foams 3 are in the same plane. In this way, the width of the first side conductive surface 33 of the original conductive foam 3 in FIG. 7 is widened, which can further improve the uniformity of the current distribution on the adjacent two conductive foams 3, thereby further reducing the risk of radiation spurs and passive intermodulation. Figure 5 On the basis of FIG. 7, one conductive foam 3 is added on the adjacent side of each conductive foam 3, and the first side conductive surfaces 33 of the two adjacent conductive foams 3 are oriented in the same direction or opposite directions. In this way, the fundamental mode current can be more dispersed, and the current distribution on the two conductive foams 3 is more uniform, thereby further reducing the risk of radiation spurs and passive intermodulation.

[0067] The simulation test verifies that, by adding one conductive foam 3 with the same or opposite orientation on the side of the original conductive foam 3, although the total current on the double foam is larger, the maximum fundamental current density is reduced, and the measured harmonic coupling value shows that the third harmonic level of the double foam is lower than that of the single foam.

[0068] As shown in FIG. 8, in some optional embodiments of the present application, the first side conductive surfaces 33 of the plurality of conductive foams 3 on the same fitting part 211 are flush with each other. It can be understood that the first side conductive surfaces 33 of the two conductive foams 3 are in the same plane. In this way, the width of the first side conductive surface 33 of the original conductive foam 3 in FIG. 7 is widened, which can further improve the uniformity of the current distribution on the adjacent two conductive foams 3, thereby further reducing the risk of radiation spurs and passive intermodulation. Figure 5 Of course, the width of the first side conductive surface 33 can also be increased by directly widening the width of the conductive foam 3. In the device debugging, the problem of radiation spurs and passive intermodulation can be solved by adding the conductive foams 3 in parallel.

[0069] In some optional embodiments of the present application, the number of conductive foams 3 is 3-6. In the case that at least one fitting part 211 in each fitting area 21 is fitted with a conductive foam 3, the setting of 3-6 conductive foams 3 can ensure that the screen resonant cavity mode is basically fixed, that is, the flow direction of the fundamental mode current is from the middle of the metal frame 2 to each conductive foam 3. More conductive foams 3 do not change the screen resonant cavity mode. In this way, the amount of conductive foam 3 is saved under the premise of ensuring the performance of the device, thereby reducing the production cost.

[0070] For example, the number of conductive foams 3 is 3, and one conductive foam 3 can be arranged on each of the two short sides and one long side of the metal frame 2. For example, the number of conductive foams 3 is 4, and one conductive foam 3 is arranged on each of the two short sides and the two long sides of the metal frame 2.

[0071] For example, the number of conductive foam 3 is 5, and one conductive foam 3 is arranged at the middle of each of the four corners and one long side of the metal frame 2. For example, the number of conductive foam 3 is 6, and one conductive foam 3 is arranged at the middle of each of the four corners and two long sides of the metal frame 2.

[0072] Optionally, when there is only one conductive foam 3 on the short side, the conductive foam 3 is arranged at the middle of the short side. When there are multiple conductive foams 3 on the short side, the multiple conductive foams 3 are symmetrically arranged relative to the center of the short side. When there is only one conductive foam 3 on the long side, the conductive foam 3 is arranged at the middle of the long side. When there are multiple conductive foams 3 on the long side, the multiple conductive foams 3 are symmetrically arranged relative to the center of the long side. In practice, the installation position of the conductive foam 3 can be slightly adjusted according to the installation space condition, as long as the screen resonant cavity mode is fixed.

[0073] In actual application, two conductive foams 3 can also be arranged on each of the two short sides of the metal frame 2 according to actual conditions, that is, a total of four conductive foams 3, as long as the screen resonant cavity mode is fixed.

[0074] In some optional embodiments of the present application, the number of conductive foams 3 is at least three, and the multiple conductive foams 3 are distributed at equal intervals along the circumferential side of the metal frame 2. It can be understood that the at least three conductive foams 3 are uniformly distributed along the circumferential side of the metal frame 2, which is beneficial to make the fundamental mode current evenly shunt to each conductive foam 3, and is more beneficial to reduce the risk of radiation spurs and passive intermodulation.

[0075] In some embodiments of the present application, as shown in Figure 3 The conductive foam 3 also includes a second side conductive surface 34 connecting the first and second adhering surfaces 31 and 32, and the first side conductive surface 33 is arranged opposite to the second side conductive surface 34. That is, the first adhering surface 31, the first side conductive surface 33, the second adhering surface 32 and the second side conductive surface 34 are sequentially connected end to end. Figure 1 As shown in Figure 2 As shown in

[0076] The conductive foam 3 is a rectangular sheet structure, the first and second adhering surfaces 31 and 32 are respectively the front and back surfaces in the thickness direction, the first and second side conductive surfaces 33 and 34 are two opposite side surfaces, the first and second side conductive surfaces 33 and 34 are both conductive path surfaces for conducting the screen 1 and the metal frame 2, and the two are parallel to each other. When the conductive foam 3 is lapped between the screen 1 and the metal frame 2, the current on the screen 1 can flow to the metal frame 2 through the first and second side conductive surfaces 33 and 34.

[0077] As shown in Figure 9 The width of the conductive foam 3 with the second side conductive surface 34 isFigure 5 the measured harmonic coupling values show that the 3rd harmonic level is significantly lower in the case of the wider O-shaped conductive foam 3 as shown in Figure 9 than in the case of the narrower C-shaped conductive foam 3 as shown in Figure 5 .

[0078] The embodiments of the present application also provide an electronic device debugging method. The electronic device includes a screen 1, a metal frame 2, and a conductive foam 3. The conductive foam 3 is attached between the screen 1 and the metal frame 2 and located at the periphery of the metal frame 2. The conductive foam 3 includes a first attachment surface 31, a second attachment surface 32, and a first side conductive surface 33 connecting the first attachment surface 31 and the second attachment surface 32. The first attachment surface 31 is attached to and conductively connected to the screen 1, and the second attachment surface 32 is attached to and conductively connected to the metal frame 2.

[0079] The electronic device debugging method can be applied to the electronic device of any of the above embodiments, i.e., the first side conductive surface 33 faces or is away from the middle part of the metal frame 2. In the actual production process of the above electronic device, due to the influence of various factors such as the shape of the metal frame 2 and the distribution position and number of the conductive foam 3, it cannot be guaranteed that the fundamental mode current flowing to the first side conductive surface 33 is uniformly distributed after one-time installation.

[0080] To this end, as shown in Figure 10 , the electronic device debugging method provided by the embodiments includes:

[0081] S100, obtaining the actual distribution of the fundamental mode current of the resonant cavity formed by the screen 1, the metal frame 2, and the conductive foam 3 through simulation.

[0082] S200, adjusting the included angle between the line connecting the center of the conductive foam 3 and the metal frame 2 and the first side conductive surface 33 according to the distribution of the fundamental mode current, so as to improve the uniformity of the current distribution flowing to the first side conductive surface 33.

[0083] The embodiments of the present application fine-tune the orientation of the conductive foam 3 according to the simulation results, which may need to be simulated again or multiple times and adjusted multiple times to meet the performance requirements of the device. Or until the current distribution flowing to the first side conductive surface 33 of each conductive foam 3 is uniform, thereby reducing the maximum current density on the conductive foam 3 as much as possible, ensuring the effective lap joint of the conductive foam 3, and reducing the risk of radiation spurs and passive intermodulation.

[0084] The electronic device debugging method provided in the application can also be applied to an electronic device that has been actually put into use. The conductive foam 3 in the electronic device can be arranged parallel to the long side or the short side of the metal frame 2. The actual distribution of the fundamental mode current of the resonant cavity formed by the screen 1, the metal frame 2 and the conductive foam 3 in the electronic device is obtained through simulation. The angle between the line connecting the centers of the conductive foam 3 and the metal frame 2 and the first side conductive surface 33 is adjusted according to the distribution of the fundamental mode current, so as to improve the distribution of the fundamental mode current flowing to the first side conductive surface 33, thereby reducing the maximum current density of the fundamental wave, increasing the effective overlap area of the conductive foam 3, and reducing or eliminating the problems of radiation spurs and passive intermodulation.

[0085] Further, the electronic device debugging method provided in the embodiment also includes:

[0086] S300, obtaining the simulation resonant frequency of the resonant cavity through simulation.

[0087] S400, determining that the simulation resonant frequency is located in the working frequency band of the antenna, and adding the conductive foam 3 to the circumferential side of the metal frame 2.

[0088] Specifically, after the orientation of the conductive foam 3 is adjusted, the simulation resonant frequency of the resonant cavity obtained through simulation is still within the working frequency band of the antenna, and the risk of radiation spurs or passive intermodulation still exists. At this time, the debugging is performed by adding the conductive foam 3.

[0089] The way of adding the conductive foam 3 can be adding the conductive foam 3 to other reserved bonding parts 211, or adding the conductive foam 3 with the same or opposite orientation to the adjacent side of the original conductive foam 3, so as to increase the resonant frequency. After the conductive foam 3 is added, the simulation in step S300 is performed again until the simulation resonant frequency is higher than the working frequency band of the antenna.

[0090] The conductive foam 3 is added, and steps S100-S200 can be repeatedly performed, and then steps S300-S400 are performed again until the simulation resonant frequency is higher than the working frequency band of the antenna.

[0091] In the actual use of the electronic device, there are many factors affecting the resonant frequency of the resonant cavity, and the simulation cannot consider all the influencing factors, so it cannot guarantee completely accurate prediction of the resonant frequency of the resonant cavity. In view of this, the electronic device debugging method provided in the embodiment also includes:

[0092] S500, starting the screen 1 and detecting the actual resonant frequency of the resonant cavity.

[0093] S600, determining that the actual resonant frequency is located in the working frequency band of the antenna, and adding the conductive foam 3 to the circumferential side of the metal frame 2.

[0094] Specifically, after the simulation simulation obtains a simulation resonance frequency higher than the working frequency band of the antenna, the resonance frequency of the resonant cavity is actually measured. If the actual resonance frequency actually detected is still within the working frequency band of the antenna, it means that the risk of radiation spurious or passive intermodulation still exists. At this time, debugging is performed again by increasing the conductive foam 3.

[0095] The way to increase the conductive foam 3 can be to increase the conductive foam 3 in other reserved bonding parts 211, or to increase the conductive foam 3 towards the same or opposite side of the original conductive foam 3 to raise the resonance frequency. After increasing the conductive foam 3, the actual detection of step S500 is performed again until the actual resonance frequency is higher than the working frequency band of the antenna.

[0096] Among them, after the conductive foam 3 is increased, steps S100-S200 can be repeatedly performed, and / or steps S300-S400 can be repeatedly performed until the simulation resonance frequency is higher than the working frequency band of the antenna, and then steps S500-S600 are performed until the actual resonance frequency is higher than the working frequency band of the antenna.

[0097] Other configurations of the electronic device according to the embodiments of the present application, such as the antenna and the simulation simulation operation of the resonant cavity, are known to those skilled in the art and will not be described in detail here.

[0098] In the description of the present specification, the description referring to the terms "some embodiments" or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0099] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The application relates to an electronic device comprising a screen and a metal frame, and a conductive foam between the screen and the metal frame and on the circumference of the metal frame. The conductive foam comprises a first adhering surface, a second adhering surface and a first side conductive surface connecting the first adhering surface and the second adhering surface, the first adhering surface adhering to and electrically connecting with the screen, the second adhering surface adhering to and electrically connecting with the metal frame, and the first side conductive surface facing or away from the middle part of the metal frame, and the angle between the line connecting the center of the metal frame and the first side conductive surface is 45-90 degrees. The metal frame is equally divided into three adhering areas in the length direction of the metal frame, and each adhering area is provided with at least one adhering part, and at least one adhering part in each adhering area is adhered with the conductive foam.

2. The electronic device of claim 1, wherein, At least one adhering part is provided with a plurality of conductive foams, and the first side conductive surfaces of the conductive foams on the same adhering part are parallel to each other.

3. The electronic device of claim 2, wherein, The first side conductive surfaces of the conductive foams on the same adhering part are flush with each other.

4. The electronic device of claim 3, wherein, The number of the conductive foams is at least three, and the plurality of conductive foams are equally spaced along the circumference of the metal frame.

5. The electronic device of claim 1, wherein, The conductive foam further comprises a second side conductive surface connecting the first adhering surface and the second adhering surface, and the first side conductive surface and the second side conductive surface are arranged oppositely.

6. The electronic device of claim 1, wherein, An electronic device comprises a screen, a metal frame and a conductive foam between the screen and the metal frame and on the circumference of the metal frame, the conductive foam comprises a first adhering surface, a second adhering surface and a first side conductive surface connecting the first adhering surface and the second adhering surface, the first adhering surface adhering to and electrically connecting with the screen, the second adhering surface adhering to and electrically connecting with the metal frame, and an electronic device debugging method comprises:

7. An electronic device debugging method characterized by comprising: Obtaining the basic mode current distribution of the resonant cavity formed by the screen, the metal frame and the conductive foam through simulation; According to the basic mode current distribution, adjusting the angle between the line connecting the center of the metal frame and the first side conductive surface to improve the uniformity of the current distribution flowing to the first side conductive surface. Further comprising:

8. The electronic device commissioning method of claim 7, wherein, Obtaining the simulation resonant frequency of the resonant cavity through simulation; If the simulation resonant frequency is within the working frequency band of the antenna, the conductive foam is added on the circumference of the metal frame. Further comprising:

9. The electronic device commissioning method of claim 8, wherein, Starting the screen to detect the actual resonant frequency of the resonant cavity; If the actual resonant frequency is within the working frequency band of the antenna, the conductive foam is added on the circumference of the metal frame. ​

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