Micro-nano production method, device and system

Abstract

The present invention provides a micro-nano production method, device and system, which relate to the field of micro-nano technology. The method comprises: controlling the first motion module and / or the second motion module to run a pre-production mode; determining the actual production operation parameters of the first motion module and the second motion module based on the operation results of the pre-production mode; controlling the reference part on the first motion module to be positioned to a preset reference point; determining the actual motion path of the second motion module based on the actual production operation parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point; wherein, after the reference part on the first motion module is positioned to the preset reference point, the first motion module only moves along the preset direction. The micro-nano production method provided by the present invention can realize the production of a large range of micro-nano components, and improve the production efficiency and production accuracy.

Description

Technical Field

[0001] The present invention relates to the field of micro-nano technology, and in particular to a micro-nano manufacturing method, device and system. Background Art

[0002] In the field of micro-nano technology, it covers many processes such as etching, assembly, morphology scanning, and detection of micro-nano components. For example, in etching, the tip of a nanoscale scanning probe interacts with the sample to etch the required pattern on the sample. In the field of micro-nano component assembly, the micro-nano scale sample components are integrated and assembled to form a complete micro-nano component. When performing morphology scanning on a micro-nano component, the scanning probe scans the finished micro-nano component to obtain morphology information to detect the etching effect.

[0003] In the prior art, the main structures of the micro-nano production system used in the field of micro-nano component processing include a scanning probe and a motion platform. The motion stroke of the scanning probe can directly affect the size of the actual etching range of the micro-nano component, the size of the micro-nano component assembly, and the size of the morphology scanning range. When the sample range is large, it is necessary to split the pattern on the sample into regions, and then move the motion platform and the scanning probe to move the split pattern area to the moving coverage range of the scanning probe to complete the small-scale production, and finally realize the large-scale sample production process in a splicing manner.

[0004] During the above process, the scanning probe and motion stage in the micro-nano manufacturing system need to move and position multiple times, which will result in splicing errors, thus affecting the processing accuracy of the micro-nano components. Faced with many process flows such as etching, assembly, and morphology scanning, it will also affect the manufacturing efficiency of the micro-nano components. Summary of the invention

[0005] In order to solve at least one technical problem in the background technology, the present invention provides a micro-nano production method, device and system, which can realize the production of a large range of micro-nano components and improve the production efficiency and production accuracy. The specific technical solution is as follows:

[0006] The first embodiment of the present invention provides a micro-nano production method, comprising:

[0007] Provide target sample preparation;

[0008] Controlling the first motion module and / or the second motion module to operate in a pre-production mode to pre-produce the target sample, and determining the operation result of the pre-production mode;

[0009] Based on the pre-production mode operation result, determining the actual production operation parameters of the first motion module and the second motion module;

[0010] Controlling the first motion module and / or the second motion module to move so that the reference portion on the first motion module is positioned to a preset reference point;

[0011] Based on the actual operating parameters, determining an actual motion path of the second motion module, and controlling the second motion module to move along the actual motion path relative to the preset reference point;

[0012] After the reference portion on the first motion module is positioned at the preset reference point, the first motion module only moves along a preset direction.

[0013] According to one embodiment of the present invention, the step of controlling the first motion module and / or the second motion module to operate in a pre-production mode to pre-produce the target sample and determining the operation result of the pre-production mode includes:

[0014] Controlling the first motion module to move along a first motion trajectory and collecting a first action effect signal between the first motion module and the target sample, and adjusting the relative position of the first motion module and the target sample based on the first action effect signal;

[0015] and / or,

[0016] The second motion module is controlled to move along a second motion trajectory and collect a second action effect signal between the first motion module and the target sample, and based on the second action effect signal, the relative position of the first motion module and the target sample is adjusted.

[0017] According to an embodiment of the present invention, the step of determining the actual motion path of the second motion module based on the actual operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes:

[0018] Collecting a first operating state signal of the first motion module and a second operating state signal of the second motion module;

[0019] Based on the first operating state signal and / or the second operating state signal, a position of the first motion module and / or a position of the second motion module is adjusted.

[0020] According to an embodiment of the present invention, the step of determining the actual motion path of the second motion module based on the actual operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes:

[0021] Determine a movement range of the second movement module based on a set of actual movement paths of the second movement module, and define at least one area within the movement range as a preset area of ​​interest;

[0022] The second motion module is controlled to move within the preset area of ​​interest.

[0023] According to an embodiment of the present invention, the step of determining the actual motion path of the second motion module based on the actual operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes:

[0024] Collecting a first operating state signal of the first motion module and a second operating state signal of the second motion module;

[0025] Based on the first operating state signal and / or the second operating state signal, controlling the second motion module to stop moving;

[0026] The position of at least one of the first motion module, the second motion module, and the target sample is adjusted.

[0027] According to an embodiment of the present invention, the actual motion path includes a straight path and / or a curved path.

[0028] According to one embodiment of the present invention, the actual production operation parameters include at least one of a production range, a production resolution and a production speed.

[0029] A second aspect of the present invention provides a micro-nano manufacturing device, comprising:

[0030] A first control module, adapted to control the first motion module and / or the second motion module to operate in a pre-production mode, so as to pre-produce the target sample, and determine the operation result of the pre-production mode;

[0031] A parameter determination module, adapted to determine actual production operation parameters of the first motion module and the second motion module based on the operation result of the pre-production mode;

[0032] a second control module, adapted to control the movement of the first motion module and / or the second motion module so that the reference portion on the first motion module is positioned to a preset reference point;

[0033] The third control module is adapted to determine the actual motion path of the second motion module based on the actual operating parameters, and control the second motion module to move along the actual motion path relative to the preset reference point.

[0034] A third aspect of the present invention provides a micro-nano production system, comprising:

[0035] A first motion module and a second motion module, wherein the first motion module and the second motion module are arranged opposite to each other;

[0036] A processor, which implements the micro-nano manufacturing method as described above when executing a computer program;

[0037] A driving member, used for adjusting the motion state of the first motion module and / or the second motion module;

[0038] The processor determines the driving mode of the driving member based on the actually obtained operating parameters.

[0039] According to one embodiment of the present invention, the first motion module at least includes a scanning probe, and the second motion module includes a flexible nano-motion stage.

[0040] According to an embodiment of the present invention, the scanning probe etches the target sample by force etching, electrical etching, oxidation etching, thermochemical etching, near-atomic scale etching or thermal etching.

[0041] According to one embodiment of the present invention, the micro-nano production system further includes an X-direction auxiliary positioner and a Y-direction auxiliary positioner, and both the X-direction auxiliary positioner and the Y-direction auxiliary positioner are connected to the second motion module.

[0042] According to the micro-nano production method provided by the embodiment of the first aspect of the present invention, a wide range of micro-nano component production processes can be achieved by optimizing and controlling the movement of the motion module in the motion unit in the micro-nano production system. Specifically, a target sample is first provided, from which parameters such as the size of the preparation range and the resolution of each position of the target sample can be intuitively obtained. Before the actual preparation is performed, the micro-nano preparation system first executes a pre-preparation mode, that is, the first motion module can be controlled to move relative to the second motion module within the range where the target sample is located, and the interaction between the first motion module and the target sample during the movement is detected. The second motion module can also be controlled to carry the target sample to move relative to the first motion module, and the interaction between the first motion module and the target sample during the movement is detected. The first motion module and the second motion module can also be controlled to move in coordination, and the interaction between the first motion module and the target sample during the movement is detected. In this process, according to the pre-preparation mode operation result generated by the first motion module and the second motion module running in the pre-preparation mode and feedback, a single or multiple adjustments are made to the first motion module, the second motion module or the target sample to meet the requirements of the actual preparation state, thereby determining the actual preparation operation parameters of the first motion module and the second motion module. In this way, through pre-simulation preparation, problems can be discovered and adjusted in time, thereby improving the preparation success rate. After completing the above process, the first motion module is controlled to move relative to the second motion module so that the reference part on the first motion module is positioned to the preset reference point, or the second motion module is controlled to move relative to the first motion module so that the reference part on the first motion module is positioned to the preset reference point. The first motion module and the second motion module can also be controlled to move in coordination so that the reference part on the first motion module is positioned to the preset reference point. The preset reference point is a point pre-set in the system for locating the position of the first motion module in space. In the actual preparation process, a preset direction is given to the first motion module, and the preset direction can be a direction that is not parallel to the preparation surface of the target sample. Taking the target sample to be prepared horizontally and the preset direction perpendicular to the preparation surface of the target sample as an example, in the actual preparation process, the first motion module only moves along the Z direction. After completing the positioning of the first motion module, based on the actual preparation operation parameters, the second motion module is controlled to move relative to the preset reference point in an actual motion path to complete a series of preparation processes such as etching, assembly, and morphology scanning of micro-nano components. In combination with the above, when facing a large range of micro-nano components, the second motion module carries the target sample production movement, while the first motion module performs fine-tuning movement. This not only achieves overall coverage of the production range, but also avoids motion errors caused by multiple associations and positioning coordination between multiple motion modules, thereby realizing the production of a large range of micro-nano components and improving production efficiency and production accuracy.

[0043] According to the micro-nano preparation device provided by the embodiment of the second aspect of the present invention, the first control module controls the first motion module and / or the second motion module to operate in a pre-preparation mode to pre-prepare the target sample and determine the pre-preparation mode operation result; the parameter determination module determines the actual preparation operation parameters of the first motion module and the second motion module based on the pre-preparation mode operation result; the second control module controls the movement of the first motion module and / or the second motion module to position the reference part on the first motion module to a preset reference point; the third control module determines the actual movement path of the second motion module based on the actual preparation operation parameters, controls the second motion module to move along the actual movement path relative to the preset reference point, and can accurately control the operation states of the first motion module and the second motion module, execute the micro-nano preparation method in the above-mentioned first aspect embodiment, realize the preparation of a large range of micro-nano components, and improve the preparation efficiency and preparation accuracy.

[0044] The micro-nano production system provided in the third aspect of the present invention can execute the micro-nano production method in the first aspect, and thus can achieve the same technical effect as in the first aspect. By using the micro-nano production system provided in the third aspect of the present invention, it is possible to achieve the production of a wide range of micro-nano components and improve production efficiency and production accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 It is a schematic diagram of the process of the micro-nano preparation method provided by an embodiment of the present invention;

[0047] Figure 2 is a schematic structural diagram of a micro-nano preparation device provided by an embodiment of the present invention;

[0048] Figure 3 It is a schematic diagram of the structure of the micro-nano production system provided by an embodiment of the present invention.

[0049] Reference numerals:

[0050] 10. frame; 20. first motion module; 30. second motion module; 310. X-axis auxiliary positioner; 320. Y-axis auxiliary positioner; 40. visual observation module;

[0051] 600, first control module; 700, parameter determination module; 800, second control module; 900, third control module. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0054] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0055] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] like Figure 1 As shown, the first embodiment of the present invention provides a micro-nano production method, the method comprising:

[0058] Step 100: Provide a target sample.

[0059] Step 200: Control the first motion module 20 and / or the second motion module 30 to operate in a pre-production mode to pre-produce a target sample and determine the operation result of the pre-production mode.

[0060] Step 300: Determine actual production operation parameters of the first motion module 20 and the second motion module 30 based on the pre-production mode operation result.

[0061] Step 400: Control the first motion module 20 and / or the second motion module 30 to move so that the reference part on the first motion module 20 is positioned to a preset reference point.

[0062] Step 500: Determine the actual motion path of the second motion module 30 based on the actual operating parameters, and control the second motion module 30 to move along the actual motion path relative to a preset reference point.

[0063] After the reference portion on the first motion module 20 is positioned at the preset reference point, the first motion module 20 only moves along the preset direction.

[0064] The preparation in the above method may include multiple process flows such as etching of micro-nano elements, assembly of micro-nano element parts, and morphology scanning of micro-nano elements. The first motion module 20 can complete the etching and morphology scanning of micro-nano elements by acting on the target sample. For example, during etching, the first motion module 20 moves on the target sample, and the track of the movement is left on the target sample to form an etching pattern; during morphology scanning, the first motion module 20 and the target sample generate relative motion to collect morphology feature signals, and the computer can further process the morphology feature signals to generate morphology feature images and other information. The target sample is placed on the second motion module 30, and the second motion module 30 can carry the target sample to move relative to the preset reference point so that the first motion module 20 can act on various positions on the target sample. The second motion module 30 can achieve a large range of motion.

[0065] In step 100, the target sample is the component to be micro-nano produced. For example, when an etching process is performed, the target sample is the component embryo to be processed, and when a topography scanning process is performed, the target sample is the finished product that has been etched. A target production parameter can be intuitively obtained through the target sample, which may include the range value of the target sample, the resolution of the pattern at each position on the target sample, and the production frequency and speed corresponding to the pattern.

[0066] In step 200, in the pre-production mode, the first motion module 20 does not produce a substantial effect on the target sample. For example, by running the pre-production mode, it can be determined whether the first motion module 20 can always interact with the surface of the target sample, thereby determining the flatness of the surface of the target sample. The first motion module 20 and the second motion module 30 can also be controlled to move at different speeds in the pre-production mode to determine an optimal movement speed to achieve the best production effect.

[0067] The parameters of the pre-production mode operation can be pre-set by the system, or determined based on the parameters of the target sample production. For example, based on parameters such as the range of the target sample production and the resolution of the produced pattern, the pre-production mode operation parameters such as the motion range and trajectory of the first motion module 20 and / or the second motion module 30 in the pre-production mode are determined.

[0068] In step 300, based on the pre-production mode operation result, the actual production operation parameters are determined, and the actual production operation parameters may include the movement speed of the second motion module 30, the contact force and amplitude of the first motion module 20 on the target sample, the voltage of the tip of the first motion module 20, and other parameters, such as the contact force and amplitude of the scanning probe on the target sample, the voltage of the tip of the scanning probe, and other parameters. The embodiment of the present invention does not specifically limit this.

[0069] In step 400, the first motion module 20 is positioned by means of reference point positioning. The preset reference point may be a point preset by the system, such as the origin in the spatial coordinates defined by the system. The preset reference point may also be set based on the actual range size of the target sample preparation, and may be any point within the target sample preparation range. The reference portion is located on the first motion module 20. For example, when the first motion module 20 is a vertically placed needle-like structure, the reference portion may be the tip of the needle tip. When the first motion module 20 has a horizontal cantilever structure, the reference portion may be set at the root position of the cantilever structure. The position of the reference portion may be set according to the actual structure of the first motion module 20.

[0070] In step 500, the second motion module 30 is controlled to carry the target sample and move relative to the preset reference point of the first motion module 20 according to the actual motion path, so that the first motion module 20 can act on the production area on the target sample in turn to complete full coverage of the production range.

[0071] The positioning position of the first motion module 20 in step 400 does not necessarily fall completely within the area corresponding to the target sample preparation. Therefore, the actual motion path in step 500 may also include: controlling the movement of the second motion module 30 so that the first motion module 20 falls into the preparation area corresponding to the target sample preparation.

[0072] In the above-mentioned actual preparation process, the state of the first motion module 20 is that it only moves along a preset direction, and the preset direction is a set direction, which is not parallel to the preparation surface of the target sample. The preset direction can be perpendicular to the preparation surface of the target sample, or it can generate an angle greater than 0 degrees and less than 90 degrees with the target sample. For better explanation, the horizontal placement of the target sample is taken as an example. Correspondingly, the end of the first motion module 20 that acts on the target sample can be shaken in the Z direction based on the high and low undulations of the preparation pattern, and can also be lifted and lowered in the Z direction to adjust the Z-direction distance between the end and the target sample. In this way, the (x, y) coordinates of the first motion module 20 projected on the preparation surface of the target sample remain unchanged, that is, the first motion module 20 will not have a substantial impact on the size of the preparation range.

[0073] Due to the influence of factors such as the positioning accuracy of the components, the target sample cannot be guaranteed to be completely horizontal. At this time, the angle between the preset direction and the preparation surface of the target sample is greater than 0 degrees and less than 90 degrees, that is, the end of the first motion module 20 is inclined relative to the target sample. At this time, the first motion module 20 can also shake along the preset direction based on the ups and downs of the preparation pattern, and can also move along the preset direction to adjust the distance between the end and the target sample.

[0074] In an embodiment of the present invention, the first motion module 20 and / or the second motion module 30 are controlled to operate in a pre-production mode to pre-produce a target sample, and the step of determining the operation result of the pre-production mode includes:

[0075] Controlling the first motion module 20 to move along a first motion trajectory and collecting a first action effect signal between the first motion module 20 and the target sample, and adjusting the relative position of the first motion module 20 and the target sample based on the first action effect signal;

[0076] and / or,

[0077] The second motion module 30 is controlled to move along a second motion trajectory and collect a second action effect signal between the first motion module 20 and the target sample, and based on the second action effect signal, the relative position of the first motion module 20 and the target sample is adjusted.

[0078] In the above-mentioned pre-production mode operation process, the first motion module 20 walks the first motion trajectory when it moves alone. The first motion trajectory can be continuous or multiple motion trajectories intermittently, and the range of the collection of the first motion trajectory is roughly equivalent to the range of the target sample. Similarly, the second motion module 30 walks the second motion trajectory when it moves alone. The second motion trajectory can be continuous or multiple motion trajectories intermittently, and the range of the collection of the second motion trajectory is roughly equivalent to the range of the target sample. When the first motion module 20 and the second motion module 30 move simultaneously, the range of all the trajectory collections of the first motion trajectory and the second motion trajectory is roughly equivalent to the range of the target sample. Specifically, taking the first motion module 20 moving alone as an example, the first motion module 20 can walk a rectangular trajectory around the outer edge position of the target sample, and then continue to walk a cross-shaped trajectory based on the diagonal of the rectangular trajectory, and finally walk a cross-shaped trajectory based on the line connecting the center points of the side length of the rectangular trajectory. When the second motion module 30 moves alone or the two move together, the above-mentioned scheme of the first motion module 20 moving alone can be referred to. After the above process, problems such as the distance between the first motion module 20 and the target sample being too large or too small can be discovered in time. At this time, the position or angle of one or more of the first motion module 20, the second motion module 30, and the target sample can be adjusted to facilitate actual production.

[0079] Of course, the above-mentioned pre-production operation process may also not find any problems, that is, the relative relationship between the current first motion module 20, the second motion module 30 and the target sample is in an ideal state, so there is no need to adjust them.

[0080] In an embodiment of the present invention, based on the actual obtained operating parameters, the actual motion path of the second motion module 30 is determined, and the steps of controlling the second motion module 30 to move along the actual motion path relative to the preset reference point include:

[0081] Collecting a first operating state signal of the first motion module 20 and a second operating state signal of the second motion module 30;

[0082] Based on the first operating state signal and / or the second operating state signal, the position of the first motion module 20 and / or the position of the second motion module 30 is adjusted.

[0083] The first operation state signal may include the effect signal of the first motion module 20 on the target sample, such as a voltage signal, a signal of a photoelectric sensor, etc. The second operation state signal may include the actual motion track signal, speed signal, etc. of the second motion module 30. In the actual production process, the actual motion track signal, speed signal, etc. of the second motion module 30 may be collected in real time by the sensor, and the effect signal of the first motion module 20 on the target sample, such as the Z-direction voltage signal of the first motion module 20, the signal of the photoelectric sensor, etc., may be collected at the same time. The computer may determine the current working state according to one or more of the collected motion signals and effect signals, such as determining whether the first motion module 20 maintains continuous and effective contact with the target sample. When a breakpoint is detected in the production process, the position of the first motion module 20 relative to the target sample or the position of the second motion module 30 may be adjusted in time, and the positions of the first motion module 20 and the second motion module 30 may also be adjusted at the same time to fully ensure the production effect of the micro-nano element. The above adjustment may be achieved while the production process is kept in progress.

[0084] In an embodiment of the present invention, based on the actual obtained operating parameters, the actual motion path of the second motion module 30 is determined, and the steps of controlling the second motion module 30 to move along the actual motion path relative to the preset reference point include:

[0085] Based on a set of actual motion paths of the second motion module 30, determining a motion range of the second motion module 30, and defining at least one area within the motion range as a preset area of ​​interest;

[0086] The second motion module 30 is controlled to move within a preset area of ​​interest.

[0087] Specifically, when a micro-nano element with a relatively large range is prepared, the second motion module 30 can be controlled to carry the target sample to move within a range, and then a specific area is selected within this range for key preparation. Taking the morphology scanning process in the preparation process as an example to further illustrate the above process, firstly, the second motion module 30 is controlled to carry the micro-nano element that has been etched to move within a larger range relative to the first motion module 20, and the first motion module 20 can perform a low-resolution scan on the micro-nano element. According to the low-resolution scanning result, the area of ​​interest is selected, and the second motion module 30 is allowed to carry the micro-nano element again relative to the first motion module 20 to move the above-mentioned area of ​​interest, and the first motion module 20 can perform a high-resolution scan on the area of ​​the micro-nano element. When the second motion module 30 is controlled to move for the first time, the movement speed of the second motion module 30 can be appropriately increased, so that the efficiency can be improved. When the second motion module 30 is controlled to move for the second time, the movement speed of the second motion module 30 can be appropriately reduced, so that the first motion module 20 and the micro-nano element can fully interact with each other and ensure the preparation effect of the key area.

[0088] In an embodiment of the present invention, based on the actual obtained operating parameters, the actual motion path of the second motion module 30 is determined, and the steps of controlling the second motion module 30 to move along the actual motion path relative to the preset reference point include:

[0089] Collecting a first operating state signal of the first motion module 20 and a second operating state signal of the second motion module 30;

[0090] Based on the first operating state signal and / or the second operating state signal, controlling the second motion module 30 to stop moving;

[0091] The position of at least one of the first motion module 20, the second motion module 30 and the target sample is adjusted.

[0092] Although problems can be found in advance and corresponding adjustments can be made through the pre-production process, there will still be problems in the actual production process. Therefore, the first operating state signal of the first motion module 20 and the second operating state signal of the second motion module 30 are collected in real time. When the state is found to be wrong, the second motion module 30 that is performing the production movement is stopped, and then one or more of the first motion module 20, the second motion module 30, and the target sample are adjusted according to the problems found. The above adjustment requires temporarily suspending the production process to make corresponding adjustments.

[0093] In an embodiment of the present invention, the actual motion path includes a linear path and / or a curved path. The second motion module 30 can perform not only linear motion but also curved motion. For example, the second motion module 30 can rotate, and the motion trajectory of its rotation can be a spiral line. A rotating table mechanism can be added to the second motion module 30 to achieve the above-mentioned rotation function. The diversification of the actual motion path of the second motion module 30 can meet the requirements for the preparation of micro-nano components with complex pattern features.

[0094] In an embodiment of the present invention, the actual production operation parameters include at least one of the production range, the production resolution and the production speed. Based on the key features of the target sample, the relevant control module in the micro-nano production device can respond in time to generate the actual production operation parameters corresponding to the target sample and matching the system state. The actual production operation parameters may also include other parameters besides the above, which are not specifically limited in the embodiment of the present invention.

[0095] According to the micro-nano production method provided by the embodiment of the first aspect of the present invention, by optimizing and controlling the movement of the motion module in the motion unit of the micro-nano production system, a large-scale micro-nano element production process can be realized. Specifically, a target production sample is first provided, and the size of the production range, the resolution of each position of the target production sample and other parameters can be intuitively obtained from the target production sample. Before the actual production is carried out, the micro-nano production system first executes a pre-production mode, that is, the first motion module 20 can be controlled to move relative to the second motion module 30 within the range where the target production sample is located, and the interaction between the first motion module 20 and the target production sample during the movement process can be detected. The second motion module 30 can also be controlled to carry the target production sample to move relative to the first motion module 20, and the interaction between the first motion module 20 and the target production sample during the movement process can be detected. The first motion module 20 and the second motion module 30 are controlled to move in coordination, and the interaction between the first motion module 20 and the target sample during the movement is detected. In this process, according to the pre-production mode operation result generated by the first motion module 20 and the second motion module 30 running in the pre-production mode and feedback, a single or multiple adjustments are made to the first motion module 20, the second motion module 30 or the target sample to meet the requirements of the actual production state, thereby determining the actual production operation parameters of the first motion module 20 and the second motion module 30. In this way, problems can be discovered and adjusted in time through pre-simulation production, thereby improving the production success rate. After completing the above process, the first motion module 20 is controlled to move relative to the second motion module 30 so that the reference part on the first motion module 20 is positioned to the preset reference point, or the second motion module 30 is controlled to move relative to the first motion module 20 so that the reference part on the first motion module 20 is positioned to the preset reference point. The first motion module 20 and the second motion module 30 can also be controlled to move in coordination so that the reference part on the first motion module 20 is positioned to the preset reference point. The preset reference point is a point pre-set in the system for locating the position of the first motion module 20 in space. In the actual preparation process, a preset direction is given to the first motion module 20, and the preset direction can be a direction that is not parallel to the preparation surface of the target sample. Taking the target sample to be prepared horizontally and the preset direction perpendicular to the preparation surface of the target sample as an example, in the actual preparation process, the first motion module 20 only moves along the Z direction. After completing the positioning of the first motion module 20, based on the actual preparation operation parameters, the second motion module 30 is controlled to move relative to the preset reference point in an actual motion path to complete a series of preparation processes such as etching, assembly, and morphology scanning of micro-nano components.In combination with the above, when facing a large range of micro-nano components, the second motion module 30 carries the target sample production movement, while the first motion module 20 performs fine-tuning movement. This not only achieves overall coverage of the production range, but also avoids motion errors caused by multiple associations and positioning coordination between multiple motion modules, thereby realizing the production of a large range of micro-nano components and improving production efficiency and production accuracy.

[0096] like Figure 2 As shown, the second embodiment of the present invention provides a micro-nano preparation device, including a first control module 600, a parameter determination module 700, a second control module 800 and a third control module 900. The first control module 600 is suitable for controlling the first motion module 20 and / or the second motion module 30 to operate in a pre-preparation mode to pre-prepare the target sample and determine the pre-preparation mode operation result; the parameter determination module 700 is suitable for determining the actual preparation operation parameters of the first motion module 20 and the second motion module 30 based on the pre-preparation mode operation result; the second control module 800 is suitable for controlling the first motion module 20 and / or the second motion module 30 to move so that the reference part on the first motion module 20 is positioned to a preset reference point; the third control module 900 is suitable for determining the actual movement path of the second motion module 30 based on the actual preparation operation parameters, and controlling the second motion module 30 to move along the actual movement path relative to the preset reference point.

[0097] According to the micro-nano preparation device provided by the embodiment of the second aspect of the present invention, the first control module 600 controls the first motion module 20 and / or the second motion module 30 to operate in a pre-preparation mode to pre-prepare the target sample and determine the pre-preparation mode operation result; the parameter determination module 700 determines the actual preparation operation parameters of the first motion module 20 and the second motion module 30 based on the pre-preparation mode operation result; the second control module 800 controls the first motion module 20 and / or the second motion module 30 to move so that the reference part on the first motion module 20 is positioned to the preset reference point; the third control module 900 determines the actual movement path of the second motion module 30 based on the actual preparation operation parameters, and controls the second motion module 30 to move along the actual movement path relative to the preset reference point, so that the operation status of the first motion module 20 and the second motion module 30 can be accurately controlled, and the micro-nano preparation method in the above-mentioned first aspect embodiment is executed to achieve the preparation of a large range of micro-nano components and improve the preparation efficiency and preparation accuracy.

[0098] It should be noted here that the above-mentioned micro-nano production device provided in the embodiment of the present invention can implement all the method steps implemented in the above-mentioned micro-nano production method embodiment, and can achieve the same technical effects. The parts and beneficial effects that are the same as those in the method embodiment will not be described in detail here.

[0099] like Figure 3 As shown, the third aspect of the present invention provides a micro-nano production system, including a first motion module 20, a second motion module 30, a processor and a driving member, wherein the first motion module 20 and the second motion module 30 are arranged relatively to each other; when the processor executes the computer program, the micro-nano production method in any of the above embodiments is implemented; the driving member is used to adjust the motion state of the first motion module 20 and / or the second motion module 30; the processor determines the driving mode of the driving member based on actual production operation parameters.

[0100] The first motion module 20 may include a scanning probe, an etching probe or a laser galvanometer, etc. The Z-axis height of the first motion module 20 can be adjusted. The second motion module 30 may include a nano-motion table. The second motion module 30 can move in any direction in the XY plane, and a rotation drive device can be added to realize rotational motion. The Z-axis height of the second motion module 30 can also be adjusted.

[0101] In an embodiment of the present invention, the first motion module 20 includes at least a scanning probe, and the second motion module 30 includes a flexible nano-motion stage. The scanning probe is a commonly used device in micro-nano production processes. Taking the etching field as an example, multiple scanning probes can be set to etch the target sample at the same time, which can improve the efficiency of etching. Taking morphology scanning as an example, multiple scanning probes can be set to scan the target sample at the same time, which can improve the efficiency of morphology scanning. The flexible nano-motion stage usually includes a base, a terminal platform, a flexible guide, a flexible decoupling member, and a driver. The flexible nano-motion stage can achieve a large stroke of millimeters, nanometer-level precision, small stiffness nonlinearity, and small decoupling error.

[0102] In an embodiment of the present invention, the scanning probe etches the target sample by force etching, electrical etching, oxidation etching, thermochemical etching, near-atomic scale etching or thermal etching. Force etching means that the scanning probe contacts the target sample and exerts a force on the surface of the target sample. During the movement of the target sample relative to the scanning probe, a motion trajectory can be imprinted on the target sample. Electrical etching means that the scanning probe does not directly contact the target sample. The end of the scanning probe can generate an electric current and react electrochemically with the surface of the target sample, thereby completing the etching of the desired graphics or text on the surface of the target sample. Furthermore, thermal etching can be understood as the end of the scanning probe reacting thermochemically with the surface of the target sample, thereby completing the etching of the desired graphics or text on the surface of the target sample. During the preparation process, the amplitude, contact force, voltage and other preparation process parameters of the scanning probe can be adjusted in real time.

[0103] In an embodiment of the present invention, the micro-nano production system further includes an X-direction auxiliary positioner 310 and a Y-direction auxiliary positioner 320, and the X-direction auxiliary positioner 310 and the Y-direction auxiliary positioner 320 are both connected to the second motion module 30. The second motion module 30 is the main moving component in the process of realizing micro-nano production, so it is particularly important to ensure the positioning accuracy and motion accuracy of the second motion module 30. When the second motion module 30 moves to a certain position in the XY plane, the position of the second motion module 30 in the X direction is fine-tuned by the X-direction auxiliary positioner 310, so that the positioning reference of the second motion module 30 in the X direction is more accurate, and the position of the second motion module 30 in the Y direction is fine-tuned by the Y-direction auxiliary positioner 320, so that the positioning reference of the second motion module 30 in the Y direction is more accurate. The X-direction auxiliary positioner 310 and the Y-direction auxiliary positioner 320 may include a spiral fine-tuning component, and the second motion module 30 is adjusted by manual fine-tuning. There may be multiple ways to achieve the positioning adjustment of the second motion module 30, which is not limited by the embodiment of the present invention.

[0104] In addition, in some embodiments of the present invention, the micro-nano preparation system may further include a frame 10, a visual observation module 40, the first motion module 20 and the second motion module 30 may both be arranged on the frame 10, and the visual observation module 40 is arranged on the side of the first motion module 20 facing the target sample on the second motion module 30. Taking the etching field as an example, specifically, the first motion module 20 may be arranged in the middle position of the second motion module 30 and the visual observation module 40. In addition, a microscope lens may be arranged in the visual observation module 40, and the microscope lens may be arranged at a position close to the target sample. When the first motion module 20 etches on the target sample, the visual observation module 40 may collect the etching process of the first motion module 20 in real time, and at the same time, the etching state of the target sample may be observed through the visual observation module 40.

[0105] In some embodiments of the present invention, the micro-nano fabrication system may further include an adjustment component, which is disposed on the first motion module 20. The adjustment component is used to assist the reference point positioning process of the first motion module 20 to improve positioning accuracy.

[0106] According to the micro-nano production system provided in the third aspect of the present invention, all the method steps implemented in the above-mentioned micro-nano production method embodiment can be implemented, and the same technical effects can be achieved. The parts and beneficial effects that are the same as those in the method embodiment will not be described in detail here. The micro-nano production system provided in the third aspect of the present invention can realize the production of a large range of micro-nano components and improve the production efficiency and production accuracy.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A micro-nano preparation method, characterized in that: include: Provide target sample preparation; Controlling the first motion module and / or the second motion module to operate in a prefabrication mode to prefabricate the target sample, and determining the operation result of the prefabrication mode, wherein the first motion module completes the etching and / or morphology scanning of the micro-nano element by acting on the target sample, and the second motion module carries the target sample; the prefabrication at least includes judging the flatness of the surface of the target sample according to whether the first motion module can always interact with the surface of the target sample; According to the pre-production mode operation result generated by the first motion module and the second motion module running in the pre-production mode and feedback, single or multiple adjustments are made to the first motion module, the second motion module or the target sample to meet the requirements of the actual production state, and the actual production operation parameters of the first motion module and the second motion module are determined, and the actual production operation parameters include the movement speed of the second motion module, the contact force and amplitude of the first motion module acting on the target sample, and the voltage of the tip of the first motion module; Control the first motion module and / or the second motion module to move so that the reference portion on the first motion module is positioned to a preset reference point, where the preset reference point is a point in a spatial coordinate preset by the system or a point set based on an actual range size of a target sample; Based on the actual operating parameters, determining an actual motion path of the second motion module, and controlling the second motion module to move along the actual motion path relative to the preset reference point; After the reference portion on the first motion module is positioned at the preset reference point, the first motion module only moves along a preset direction.

2. The micro-nano preparation method according to claim 1, characterized in that: The step of controlling the first motion module and / or the second motion module to operate in a pre-production mode to pre-produce the target sample and determining the operation result of the pre-production mode includes: Controlling the first motion module to move along a first motion trajectory and collecting a first action effect signal between the first motion module and the target sample, and adjusting the relative position of the first motion module and the target sample based on the first action effect signal; and / or, The second motion module is controlled to move along a second motion trajectory and collect a second action effect signal between the first motion module and the target sample, and based on the second action effect signal, the relative position of the first motion module and the target sample is adjusted.

3. The micro-nano preparation method according to claim 1, characterized in that: The step of determining the actual motion path of the second motion module based on the actual obtained operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes: Collecting a first operating state signal of the first motion module and a second operating state signal of the second motion module, wherein the first operating state signal at least includes a signal of an effect of the first motion module on preparing a target sample, the first operating state signal at least includes a voltage signal and a photoelectric sensor signal, and the second operating state signal at least includes an actual motion trajectory signal and a speed signal; adjusting a position of the first motion module based on the first operating state signal and / or the second operating state signal; Alternatively, based on the first operating state signal and / or the second operating state signal, adjusting the position of the second motion module; Alternatively, based on the first operating status signal and / or the second operating status signal, the positions of the first motion module and the second motion module are adjusted.

4. The micro-nano preparation method according to claim 1, characterized in that: The step of determining the actual motion path of the second motion module based on the actual obtained operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes: Determine a movement range of the second movement module based on a set of actual movement paths of the second movement module, and define at least one area within the movement range as a preset interest area, wherein the set of actual movement paths refers to a set of multiple discontinuous movement trajectories; The second motion module is controlled to move within the preset area of ​​interest. The preset area of ​​interest is to first control the second motion module to carry the etched micro-nano element to move a larger range relative to the first motion module, and then control the first motion module to perform a low-resolution scan of the micro-nano element, and select a specific area range within the larger range according to the low-resolution scanning result.

5. The micro-nano preparation method according to claim 1, characterized in that: The step of determining the actual motion path of the second motion module based on the actual obtained operating parameters, and controlling the second motion module to move along the actual motion path relative to the preset reference point includes: Collecting a first operating state signal of the first motion module and a second operating state signal of the second motion module, wherein the first operating state signal at least includes a first effect signal of the first motion module on the target sample preparation, and the first effect signal at least includes a voltage signal and a photoelectric sensor signal, and the second operating state signal at least includes a second effect signal of the second motion module on the target sample preparation, and the second effect signal at least includes an actual motion trajectory signal and a speed signal; Based on the first operating state signal and / or the second operating state signal, controlling the second motion module to stop moving; The position of at least one of the first motion module, the second motion module, and the target sample is adjusted.

6. The micro-nano preparation method according to any one of claims 1 to 5, characterized in that: The actual motion path includes a straight path and / or a curved path.

7. The micro-nano preparation method according to any one of claims 1 to 5, characterized in that: The actual production operation parameters include at least one of a production range, a production resolution, and a production speed.

8. A micro-nano production device, characterized in that: include: The first control module is adapted to control the first motion module and / or the second motion module to operate in a prefabrication mode to prefabricate the target sample and determine the operation result of the prefabrication mode, wherein the first motion module completes the etching and / or morphology scanning of the micro-nano element by acting on the target sample, and the second motion module carries the target sample; the prefabrication at least includes judging the flatness of the surface of the target sample according to whether the first motion module can always interact with the surface of the target sample; a parameter determination module, adapted to perform single or multiple adjustments on the first motion module, the second motion module or the target sample to meet the requirements of the actual production state according to the pre-production mode operation result generated by the first motion module and the second motion module running in the pre-production mode and feedback, and determine the actual production operation parameters of the first motion module and the second motion module, wherein the actual production operation parameters include the movement speed of the second motion module, the contact force and amplitude of the first motion module acting on the target sample, and the voltage of the tip of the first motion module; A second control module is adapted to control the movement of the first motion module and / or the second motion module so that the reference portion on the first motion module is positioned to a preset reference point, where the preset reference point is a point in a spatial coordinate preset by the system or a point set based on an actual range size of a target sample; The third control module is adapted to determine the actual motion path of the second motion module based on the actual operating parameters, and control the second motion module to move along the actual motion path relative to the preset reference point.

9. A micro-nano production system, characterized in that: include: A first motion module and a second motion module, wherein the first motion module and the second motion module are arranged opposite to each other, the first motion module completes etching and / or morphology scanning of the micro-nano element by acting on the target sample, and the second motion module carries the target sample; A processor, which implements the micro-nano preparation method according to any one of claims 1 to 7 when executing the computer program; A driving member, used for adjusting the motion state of the first motion module and / or the second motion module; The processor determines the driving mode of the driving member based on the actual operating parameters; The pre-production at least includes judging the flatness of the surface of the target sample to be produced according to whether the first motion module can always interact with the surface of the target sample to be produced.

10. The micro-nano production system according to claim 9, characterized in that: The first motion module at least includes a scanning probe, and the second motion module includes a flexible nano-motion stage.

11. The micro-nano production system according to claim 10, characterized in that: The scanning probe etches the target sample by force etching, electric etching, oxidation etching, thermochemical etching, near-atomic scale etching or thermal etching.

12. The micro-nano production system according to claim 9, characterized in that: The micro-nano production system further includes an X-direction auxiliary positioner and a Y-direction auxiliary positioner, and both the X-direction auxiliary positioner and the Y-direction auxiliary positioner are connected to the second motion module.

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