Printing screen

Abstract

A printing steel net comprises a base plate and a printing net. A first surface of the base plate is provided with a plurality of avoiding holes, and a second surface of the base plate is provided with a plurality of through holes. The avoiding holes are arranged at intervals, and the through holes are arranged at intervals. A first surface of the printing net is connected with the first surface of the base plate. The first surface of the printing net is provided with a plurality of printing holes and a plurality of communication holes. The printing holes and the communication holes are arranged through a second surface of the printing net respectively. The printing holes are communicated with the through holes respectively, and the communication holes are communicated with the avoiding holes one by one. The base plate is used for communication with the printing holes through the through holes, so that the printing holes can be coated with tin paste through the through holes. In addition, the base plate and the printing net are respectively provided with the avoiding holes and the communication holes which are communicated with each other. The protruding structure on the circuit board can be avoided, and the protruding electrical components on the circuit board can be avoided. Therefore, the printing net can be better attached to the surface of the circuit board, and the printing effect of the tin paste is further improved.

Description

Technical Field

[0001] This invention relates to the field of welding processing equipment technology, and in particular to a printed steel mesh. Background Technology

[0002] A stencil is a special mold used for printing solder paste. Specifically, the stencil helps to deposit solder paste, transferring the correct amount of solder paste to the correct location on the circuit board, facilitating subsequent soldering operations of electrical components. Stencils are widely used in the production and processing of circuit boards.

[0003] However, existing printing stencils are relatively thin, usually in sheet form, and are prone to deformation, such as warping and bending. This makes it difficult for the printing stencil to adhere well to the circuit board surface, thus affecting the solder paste printing effect. Summary of the Invention

[0004] Therefore, it is necessary to provide a printing stencil.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A printing stencil, comprising:

[0006] A base plate, wherein a first surface of the base plate has a plurality of clearance holes, and a second surface of the base plate has a plurality of through holes. The first surface and the second surface of the base plate are arranged opposite to each other. The clearance holes are spaced apart from each other, and the through holes are spaced apart from each other. Each through hole penetrates the first surface of the base plate.

[0007] A printing screen, the first side of which is connected to the first side of the base plate, the first side of which has a plurality of printing holes and a plurality of connecting holes, each of which is disposed through the second side of which is respectively disposed, each of which is connected to a connecting hole, and each of which is connected to a clearance hole in a corresponding manner, the first side and the second side of which are disposed opposite to each other.

[0008] In one embodiment, the thickness of the base plate is greater than the thickness of the printing screen.

[0009] In one embodiment, the base plate is an aluminum alloy base plate.

[0010] In one embodiment, the printing screen is a steel printing screen.

[0011] In one embodiment, the thickness of the base plate is 2mm to 3mm.

[0012] In one embodiment, the thickness of the printing screen is 0.08 mm to 0.1 mm.

[0013] In one embodiment, the base plate has a plurality of first welding holes, each of which penetrates a first surface and a second surface of the base plate. The printing screen has a plurality of second welding holes, each of which penetrates a first surface and a second surface of the printing screen. Each of the first welding holes is connected to a second welding hole.

[0014] In one embodiment, each of the first welding holes is disposed on the outside of each of the clearance holes, and each of the second welding holes is disposed on the outside of each of the connecting holes.

[0015] In one embodiment, the cross-sectional area of ​​each of the first weld holes is circular.

[0016] In one embodiment, the cross-sectional area of ​​each of the second welding holes is circular.

[0017] Compared with the prior art, the present invention has at least the following advantages:

[0018] This invention utilizes a base plate and a printing screen. The printing screen is mounted on the first surface of the base plate, which provides support and prevents deformation of the printing screen. This allows the printing screen to better adhere to the circuit board surface, ensuring effective solder paste printing. Specifically, the printing screen has printing holes that align with specific solder points on the circuit board, enabling accurate printing of solder paste. The base plate also has through-holes that connect to these holes, allowing solder paste to be applied. Furthermore, both the base plate and the printing screen have interconnected clearance holes and connecting holes to avoid protruding structures on the circuit board, such as protruding electrical components. This further ensures better adhesion of the printing screen to the circuit board surface, enhancing the solder paste printing effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a printed stencil as an example;

[0020] Figure 2 A schematic diagram of the printed stencil from another perspective of one embodiment;

[0021] Figure 3 for Figure 1 An enlarged structural diagram of part A in the illustrated embodiment. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be combined with each other. The technical solutions of the present invention will be further described below with reference to the accompanying drawings of the embodiments of the present invention. The present invention is not limited to the following specific embodiments.

[0023] It should be understood that the same or similar reference numerals in the accompanying drawings of the embodiments correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "front," "rear," "left," "right," "top," and "bottom" indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms describing positional relationships in the accompanying drawings are for illustrative purposes only and should not be construed as limiting this patent. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0024] Please see Figure 1 , Figure 2 and Figure 3 In one embodiment, a printing stencil 10 is provided, including a base plate 100 and a printing stencil 200. The base plate 100 has a plurality of clearance holes 110 on its first surface and a plurality of through holes 120 on its second surface. The first and second surfaces of the base plate 100 are opposite to each other. The clearance holes 110 are spaced apart from each other, and the through holes 120 are spaced apart from each other, each through hole 120 penetrating the first surface of the base plate 100. The first surface of the printing stencil 200 is connected to the first surface of the base plate 100. The first surface of the printing stencil 200 has a plurality of printing holes 210 and a plurality of connecting holes 220. The printing holes 210 and the connecting holes 220 penetrate the second surface of the printing stencil 200. Each printing hole 210 communicates with each through hole 120, and each connecting hole 220 communicates with each clearance hole 110 in a one-to-one correspondence. The first and second surfaces of the printing stencil 200 are opposite to each other.

[0025] It should be noted that the base plate 100 is a flat plate structure with a certain thickness and can be made of a material with high mechanical strength, which is beneficial to ensuring the mechanical strength of the base plate 100. In this embodiment, the base plate 100 is an aluminum alloy base plate. Aluminum alloys possess advantages such as good mechanical strength and ease of processing and forming, providing excellent support and installation. They are also easily shaped into any form. The printing screen 200 has a thin sheet structure and is fitted onto the first surface of the base plate 100. The base plate 100 provides support, preventing deformation of the printing screen 200 and avoiding warping or bending. This facilitates better adhesion of the printing screen 200 to the circuit board surface, ensuring accurate solder paste printing. Specifically, the printing screen 200 has printing holes 210, each penetrating both the first and second surfaces of the printing screen 200. The first and second surfaces of the printing screen 200 are opposite to each other. Each printing hole 210 is matched to a specific solder point on the circuit board, allowing for accurate solder paste printing. Simultaneously, the base plate 100 has through holes 120 for connecting to the printing holes 210. The number of vias 120 is less than the number of printed holes 210. The cross-sectional area of ​​vias 120 is larger than that of printed holes 210. One via 120 can connect with multiple printed holes 210. In other words, multiple printed holes 210 can be exposed simultaneously through one via 120, so that solder paste can be applied to each printed hole 210 through the via 120 to ensure normal solder paste application. In addition, the base plate 100 and the printing screen 200 are respectively provided with interconnected clearance holes 110 and connecting holes 220. The shapes and positions of clearance holes 110 and connecting holes 220 correspond one-to-one, and the clearance holes 110 are not set through the second surface of the base plate 100, so as to form a clearance groove structure, which can avoid protruding structures on the circuit board, such as protruding electrical components on the circuit board, thereby ensuring that the printing screen 200 fits better on the surface of the circuit board and further improving the solder paste printing effect.

[0026] In one embodiment, the thickness of the base plate 100 is greater than the thickness of the printing screen 200. It is understood that setting the thickness of the base plate 100 to be greater than the thickness of the printing screen 200 allows the base plate 100 to have a larger thickness, which helps ensure the mechanical strength of the base plate 100 and allows it to provide better support for the printing screen 200. In this embodiment, the thickness of the base plate 100 is 2mm to 3mm, and the thickness of the printing screen 200 is 0.08mm to 0.1mm. This ensures that the thickness of both the base plate 100 and the printing screen 200 is moderate, which is beneficial for ensuring the normal operation of the printing process.

[0027] In one embodiment, the printing screen 200 is a steel printing screen. It is understood that the printing screen 200 is made of steel, which has good mechanical strength and is easy to process and shape. This facilitates the fabrication of a porous printing screen 200 structure according to the solder points on the circuit board. Furthermore, steel is inexpensive, which helps reduce production costs and improve production efficiency.

[0028] Please see Figure 1 , Figure 2 and Figure 3 In one embodiment, the base plate 100 has a plurality of first welding holes 130, each of which penetrates both a first surface and a second surface of the base plate 100. The printing screen 200 has a plurality of second welding holes 230, each of which penetrates both a first surface and a second surface of the printing screen 200. Each first welding hole 130 is connected to a second welding hole 230. It can be understood that by providing first welding holes 130 and second welding holes 230 on the base plate 100 and the printing screen 200 respectively, with each first welding hole 130 and each second welding hole 230 corresponding vertically, and by injecting welding material into each first welding hole 130 and each second welding hole 230 and performing welding, the base plate 100 and the printing screen 200 are welded together, achieving a stable structure where the printing screen 200 is welded and installed on the base plate 100, ensuring the structural stability of the printed steel mesh.

[0029] In one embodiment, each of the first welding holes 130 is disposed on the outer side of each of the clearance holes 110, and each of the second welding holes 230 is disposed on the outer side of each of the connecting holes 220. It is understood that the distribution of the first welding holes 130 and the second welding holes 230 on the outer side of the clearance holes 110 and the connecting holes 220 respectively facilitates centralized opening operations on the base plate 100 and the printing screen 200, which is beneficial for the processing and forming of the printing screen and improves production efficiency.

[0030] In one embodiment, the radius of the first welding hole 130 is larger than the radius of the second welding hole 230. It is understood that, due to the large thickness of the base plate 100, setting the radius of the first welding hole 130 to be larger than the radius of the second welding hole 230 helps to increase the surface area of ​​the inner wall of the first welding hole 130. Simultaneously, the first welding hole 130 can form a T-shaped structure with the second welding hole 230, allowing a portion of the printed mesh 200 to be exposed. When filling the first welding hole 130 and the second welding hole 230 with solder, the contact area between the solder and the inner walls of the first welding hole 130 and the second welding hole 230 can be greatly increased, and the solder can contact the exposed portion of the printed mesh 200. This significantly improves the bonding force between the base plate 100 and the printed mesh 200, which is beneficial for improving the structural stability of the printed stencil and ensuring the normal operation of solder paste printing.

[0031] In one embodiment, the cross-sectional area of ​​each of the first welding holes 130 is circular. The cross-sectional area of ​​each of the second welding holes 230 is also circular. It is understood that by setting both the first welding holes 130 and the second welding holes 230 to a circular shape, a cylindrical structure of the first welding holes 130 and the second welding holes 230 can be formed. This allows for a larger surface area of ​​the inner walls of the first welding holes 130 and the second welding holes 230, which facilitates the injection of more welding material. Consequently, the base plate 100 and the printing mesh 200 can be welded together more firmly, improving the structural stability of the printing steel mesh.

[0032] In one embodiment, a buffer layer (not shown) is provided at the bottom of each of the clearance holes 110, and each buffer layer is a sponge buffer layer. It is understood that since each clearance hole 110 cooperates with the connecting hole 220 to avoid protruding structures on the circuit board, such as protruding electrical components, a buffer layer is provided at the bottom of the clearance hole 110. This buffer layer is a sponge buffer layer with a certain thickness and is made of soft material, allowing it to deform and automatically recover after deformation. Since the protruding electrical components have different shapes and heights, different electrical components can abut against the buffer layer, providing excellent protection and preventing hard contact between the electrical components and the bottom of the clearance hole 110. Furthermore, the sponge buffer layer can shrink to fit electrical components of different heights, providing good cushioning and preventing damage to the electrical components, thus ensuring a high product yield.

[0033] In one embodiment, the first surface of the printed screen 200 is provided with a plurality of reinforcing ribs (not shown), each reinforcing rib being disposed within a through hole 120, and each reinforcing rib at least partially protruding from the outer side of the second surface of the base plate 100. It is understood that by providing reinforcing ribs, which are disposed within the through holes 120 (in this embodiment, each through hole 120 has one reinforcing rib, and the reinforcing rib is located at the center of the through hole 120), on the one hand, since the through holes 120 are connected to each printing hole 210, and the printed screen 200 is a thin sheet structure, and because it has multiple printing holes 210, it is prone to deformation and structural instability. By providing reinforcing ribs, the reinforcing ribs can play a strengthening and supporting role. When the second surface of the printed screen 200 is attached to a specific circuit board, the reinforcing ribs on the first surface of the printed screen 200 provide support. The ribs serve a reinforcing function and facilitate better adhesion of the printed stencil 200 to the circuit board surface, improving the structural stability of the printed stencil and ensuring the normal printing of solder paste. On the other hand, by setting the height of the reinforcing ribs above the depth of the through-hole 120, the reinforcing ribs protrude from the outside of the through-hole 120, that is, they protrude from the second surface of the base plate 100. Since the reinforcing ribs are located at the center of the through-hole 120, they can serve as markers, facilitating better identification and precise positioning, thereby enabling rapid solder paste printing and improving practicality.

[0034] Compared with the prior art, the present invention has at least the following advantages:

[0035] This invention utilizes a base plate and a printing screen. The printing screen is mounted on the first surface of the base plate, which provides support and prevents deformation of the printing screen. This allows the printing screen to better adhere to the circuit board surface, ensuring effective solder paste printing. Specifically, the printing screen has printing holes that align with specific solder points on the circuit board, enabling accurate printing of solder paste. The base plate also has through-holes that connect to these holes, allowing solder paste to be applied. Furthermore, both the base plate and the printing screen have interconnected clearance holes and connecting holes to avoid protruding structures on the circuit board, such as protruding electrical components. This further ensures better adhesion of the printing screen to the circuit board surface, enhancing the solder paste printing effect.

[0036] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A printing stencil, characterized in that, include: The base plate has multiple clearance holes on its first surface and multiple through holes on its second surface. The first and second surfaces of the base plate are arranged opposite to each other. The clearance holes are spaced apart from each other. A buffer layer is provided at the bottom of each clearance hole. Each buffer layer is a sponge buffer layer. The through holes are spaced apart from each other and each through hole penetrates the first surface of the base plate. and A printing screen, the first side of which is connected to the first side of the base plate, the first side of which has a plurality of printing holes and a plurality of connecting holes, each of which is disposed through the second side of which is connected to a guide hole, and each of which is connected to a clearance hole. The first side and the second side of which are disposed opposite to each other, the first side of which has a plurality of reinforcing ribs, each of which is disposed in a guide hole, and each of which is at least partially protruding from the outer side of the second side of the base plate.

2. The printing stencil according to claim 1, characterized in that, The thickness of the base plate is greater than the thickness of the printing screen.

3. The printed stencil according to claim 1, characterized in that, The base plate is an aluminum alloy base plate.

4. The printing stencil according to claim 1, characterized in that, The printing screen is a steel printing screen.

5. The printed stencil according to claim 1, characterized in that, The thickness of the base plate is 2mm-3mm.

6. The printing stencil according to claim 1, characterized in that, The thickness of the printing screen is 0.08mm-0.1mm.

7. The printed stencil according to any one of claims 1-6, characterized in that, The base plate has a plurality of first welding holes, each of which penetrates the first and second surfaces of the base plate. The printing screen has a plurality of second welding holes, each of which penetrates the first and second surfaces of the printing screen. Each first welding hole is connected to a second welding hole.

8. The printing stencil according to claim 7, characterized in that, Each of the first welding holes is disposed on the outside of each of the clearance holes, and each of the second welding holes is disposed on the outside of each of the connecting holes.

9. The printing stencil according to claim 7, characterized in that, The cross-sectional area of ​​each of the first welding holes is circular.

10. The printing stencil according to claim 7, characterized in that, The cross-sectional area of ​​each of the second welding holes is circular.

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