A linkage type fault injection instrument and a fault injection method

Abstract

The application discloses a linkage type fault injection instrument, wherein the linkage type fault injection instrument comprises an MCU module, a high-speed DAC circuit, a signal amplification module, a power-off injection circuit and a trigger circuit; the MCU module is electrically connected with the high-speed DAC circuit and the power-off injection circuit through wires, the high-speed DAC circuit channel wire is electrically connected with the signal amplification module, and the signal amplification module is electrically connected with a detected device; the MCU module is electrically connected with the trigger circuit through wires, and the trigger circuit is electrically connected with the detected device. The application further provides a fault injection method of the linkage type fault injection instrument. The application solves the technical problems that the existing fault injection instrument cannot emit adjustable and configurable fault injection signals for different devices and different physical positions of the devices, and the structure is complex and the function is single.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of Internet of Things and network bottom layer security, and in particular to a linkage type fault injection instrument and a fault injection method. BACKGROUND

[0002] With the rapid development of digital technology, it has radiated to all aspects of economic and social life, and has shown strong role in providing public services and promoting industrial development. However, at the same time, network security threats such as security vulnerabilities, data breaches, and ransomware have become increasingly prominent, and organized and purposeful network attacks have become more and more serious, in which each device and each line of code can become a breakthrough point of network supply. The fault injection instrument sends the corresponding data frame to the link according to the trigger condition, and the user can build a network simulation and test environment through the fault injection instrument, modify the content or form of the frame and send it back to the link under the trigger of a specific data frame, and verify the user's design concept. At present, the existing fault injection instrument cannot send adjustable, controllable and configurable fault injection signals to different devices and different physical positions of the device at the same time, and also supports fault injection such as high-low voltage differential mode / common mode / single polarity glitch, power failure, electromagnetic interference, etc. Therefore, there is an urgent need to propose a linkage type fault injection instrument and a fault injection method to solve the technical problems that the existing fault injection instrument cannot send adjustable and configurable fault injection signals to different devices and different physical positions of the device, and the structure is complex and the function is single. SUMMARY

[0003] The main purpose of the present application is to provide a linkage type fault injection instrument and a fault injection method, which aims to solve the technical problems that the existing fault injection instrument cannot send adjustable and configurable fault injection signals to different devices and different physical positions of the device, and the structure is complex and the function is single.

[0004] To achieve the above-mentioned purpose, the present application provides a linkage type fault injection instrument, wherein the linkage type fault injection instrument comprises: an MCU module, a high-speed DAC circuit, a signal amplification module, a power failure injection circuit and a trigger circuit.

[0005] The MCU module is electrically connected to the high-speed DAC circuit and the power failure injection circuit through wires, the high-speed DAC circuit channel wire is electrically connected to the signal amplification module, and the signal amplification module is electrically connected to the detected device. The MCU module is electrically connected to the trigger circuit through wires, and the trigger circuit is electrically connected to the detected device.

[0006] In one of the preferred embodiments, the signal amplification module comprises a signal amplification circuit; the signal amplification circuit comprises a coupling circuit, an amplification circuit, a signal conditioning switching circuit and a coupling output circuit connected in sequence.

[0007] In one preferred embodiment, the coupling circuit comprises resistors R1, R2, R3, R4 and a transformer T;

[0008] The 1 pin of the transformer T is connected with the resistor R1, the resistor R3 and the high-speed DAC circuit respectively; the 3 pin of the transformer T is connected with the resistor R2, the other end of the resistor R1 and the high-speed DAC circuit respectively; the 4 pin of the transformer T is connected with the resistor R4 and the ground respectively; the 6 pin of the transformer T is connected with the other end of the resistor R4 and the amplification circuit respectively; the 2 pin of the transformer T, the resistor R3 and the other end of the resistor R2 are grounded.

[0009] In one preferred embodiment, the signal conditioning switching circuit comprises a relay K; the input end of the relay K is connected with the amplification circuit, and the output end of the relay K is connected with the input end of the voltage boosting circuit and the bypass output circuit respectively; the output ends of the voltage boosting circuit and the bypass output circuit are connected with the input end of the coupling output circuit.

[0010] In one preferred embodiment, the power-down injection circuit comprises resistors R1, R2, diodes D1, D2, a MOS tube Q1, a resistor R3 and a third BNC interface;

[0011] The gate of the MOS tube Q1 is connected with the diode D1, the diode D2 and a resistor R6 respectively, the other end of the resistor R6 is connected with the resistor R5 and the MCU module respectively, the other end of the diode D1 is connected with a power supply, the other end of the diode D2 and the source of the MOS tube Q1 are grounded; the drain of the MOS tube Q1 is connected with a resistor R7, and the other end of the resistor R7 is connected with the detected device through the third BNC interface.

[0012] In one preferred embodiment, the trigger circuit comprises resistors R8, R9, diodes D3, D4 and a fourth BNC interface; one end of the fourth BNC interface is connected with the resistor R8, the other end of the resistor R8 is connected with the resistor R9, the diode D3, the diode D4 and the MCU module respectively, and the other end of the fourth BNC interface is connected with the detected device; the other end of the diode D3 is connected with a power supply, and the other end of the diode D4, the resistor R9 and the fourth BNC interface are grounded.

[0013] In one preferred embodiment, the linkage type fault injection instrument further comprises a peripheral communication interface module;

[0014] The peripheral communication interface module is connected with the MCU module and the detected device respectively;

[0015] The peripheral communication interface module includes any one or more of an NFC external expansion interface circuit, an I2C interface circuit, an SPI interface circuit, a UART interface circuit, an RS232 interface circuit, an RS485 interface circuit, a CAN / CANFD interface circuit, a LIN interface circuit, and an RJ45 interface circuit.

[0016] In one preferred scheme, the linkage type fault injection instrument further includes a power supply module; an input end of the power supply module is connected with an external power supply, and an output end of the power supply module is connected with the MCU module; and the power supply module is used for providing power supply.

[0017] In one preferred scheme, the power supply module includes a DCDC power supply circuit, a first power conversion circuit, and a second power conversion circuit connected in sequence.

[0018] The DCDC power supply circuit is used for converting an external input power supply into a first direct current voltage.

[0019] The first power conversion circuit is used for converting the first direct current voltage into a second direct current voltage.

[0020] The second power conversion circuit is used for converting the second direct current voltage into a third direct current voltage.

[0021] A fault injection method including the linkage type fault injection instrument, including the following steps:

[0022] The system is powered on, a trigger instruction from a remote end is received through the peripheral communication interface module, a trigger signal is sent out by a trigger circuit, and timing triggering is performed by the MCU module.

[0023] The MCU module drives the high-speed DAC circuit to configure at least one AC coupling input signal to the signal amplification module.

[0024] The signal amplification module couples, amplifies, secondarily amplifies, impedance matches, and AC couples the AC coupling input signal, finally obtains a glitch pulse fault signal or a radio frequency fault signal, and then injects the glitch pulse fault signal or the radio frequency fault signal into a device to be detected to perform fault injection testing / penetration.

[0025] In the above technical scheme of the present application, the linkage type fault injection instrument comprises an MCU module, a high-speed DAC circuit, a signal amplification module, a power-off injection circuit and a trigger circuit; the MCU module is electrically connected with the high-speed DAC circuit and the power-off injection circuit through wires, the high-speed DAC circuit is electrically connected with the signal amplification module through wires, and the signal amplification module is electrically connected with a device under test; the MCU module is electrically connected with the trigger circuit through wires, and the trigger circuit is electrically connected with the device under test. The present application solves the technical problems that the existing fault injection instrument cannot send adjustable and configurable fault injection signals to different devices and different physical positions of the device, and has a complex structure and single function.

[0026] In the present application, the MCU module drives the DAC circuit to provide two independent AC coupled input signals with adjustable and configurable amplitudes, pulse widths, phases and frequencies for the signal amplification circuit, and the two independent signal amplification circuits of the signal amplification module can simultaneously perform fault injection of wired high-speed high-voltage pulse and wireless radio frequency signal in differential mode / common mode.

[0027] In the present application, by setting the power-off module, a power-off fault injection channel is independently provided while supporting the output of the pulse two channels, so as to meet the fault injection of the power-off scene, respond to the power-off fault test, and judge whether the device under test can work normally, thereby realizing the penetration test of the power-off injection.

[0028] In the present application, by setting the trigger circuit, the signals of the device under test are collected, so as to provide a basis for the precise triggering of subsequent fault injection, ensure that the fault injection can trigger at the accurate time, and ensure the precision and real-time performance of the fault injection.

[0029] In the present application, a plurality of peripheral communication interfaces are provided, which can link and trigger fault injection according to different communication protocols, and simultaneously, the plurality of peripheral communication interfaces can be used as a gateway for communication transfer. A plurality of peripheral communication interface circuits are set for one-way or multi-way input, and a matrix cross-combination switch provided in the MCU module is used for arbitrary or specified selection of one-way or multi-way output of the peripheral communication interface. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0031] Figure 1A structural schematic diagram of a linkage type fault injection instrument according to an embodiment of the present application;

[0032] Figure 2 A first circuit diagram of a power-down injection circuit according to an embodiment of the present application;

[0033] Figure 3 A second circuit diagram of a power-down injection circuit according to an embodiment of the present application;

[0034] Figure 4 A circuit diagram of a trigger circuit according to an embodiment of the present application;

[0035] Figure 5 A circuit diagram of a signal amplification circuit according to an embodiment of the present application;

[0036] Figure 6 A structural schematic diagram of a power supply module according to an embodiment of the present application.

[0037] Explanation of reference numerals:

[0038] 1, MCU module; 2, high-speed DAC circuit; 3, signal amplification module; 4, power-down injection circuit; 5, trigger circuit; 6, peripheral communication interface module; 7, isolated voltage acquisition circuit; 8, power supply module.

[0039] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0041] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0042] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features.

[0043] Moreover, the technical solutions among the various embodiments of the present application can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize the combination, and when the combination of the technical solutions appears contradictory or unachievable, it should be considered that the combination of the technical solutions does not exist and is not within the protection scope required by the present application.

[0044] Referring to Figures 1-6 According to an aspect of the present application, the present application provides a linkage type fault injection instrument, wherein the linkage type fault injection instrument comprises: an MCU module 1, a high-speed DAC circuit 2, a signal amplification module 3, a power failure injection circuit 4 and a trigger circuit 5.

[0045] The MCU module 1 is electrically connected with the high-speed DAC circuit 2 and the power failure injection circuit 4 through wires, the high-speed DAC circuit channel wire is electrically connected with the signal amplification module 3, and the signal amplification module 3 is electrically connected with a detected device; the MCU module 1 is electrically connected with the trigger circuit 5 through wires, and the trigger circuit 5 is electrically connected with the detected device.

[0046] Specifically, in the embodiment, the MCU module 1 comprises an SDRAM, an internal power supply circuit, a processor and a NORFLASH, the processor is connected with the SDRAM and the NORFLASH respectively, the internal power supply circuit provides power supply for the SDRAM, the internal power supply circuit and the NORFLASH respectively; the firmware program of the MCU module 1 is stored in the NORFLASH, and external SDRAM is supported, the requirement of power-on timing of the MCU module 1 can be met through the internal power supply circuit, after starting the power-on operation, the operation is carried out according to the instruction sent by the remote end or the data set by the user in advance; the MCU module 1 is used for driving the high-speed DAC circuit 2 to provide two independent AC coupled input signals with adjustable amplitude, pulse width, phase and frequency for the signal amplification module 3; the MCU module 1 is used for driving the power-down injection module to realize the low-voltage power-down injection output of the extremely low falling edge for the detected device, and the power-down injection pulse width can be accurately adjusted and configured through the instruction of the remote end, wherein the detected device comprises hardware electronic devices, chips or other devices of the detected device; the MCU module 1 is used for receiving the external input signal of the trigger circuit 5, so as to provide effective input signals for realizing different triggers such as precise high-speed external trigger, comparator trigger, edge trigger and manual trigger, and ensure that the glitch pulse fault signal, the wireless radio frequency fault signal and the power-down fault signal are accurately and purposefully injected into the hardware electronic devices, chips or other devices of the detected device; the MCU module 1 is used for driving and collecting the peripheral communication interface module 6, realizing the digital trigger fault injection and protocol analysis of the communication protocol of a plurality of interface circuits; the MCU module 1 is used for collecting the input voltage collected in real time by the isolation voltage collection circuit 7, and detecting the input voltage value online, especially in the battery power supply mode, the battery voltage is monitored in real time; the MCU module 1 is internally integrated with a customized firmware analysis AI model algorithm for different hardware electronic devices, CPU / MCU / DSP processor chip architecture categories, instruction running characteristics, communication protocols, business logic and other related parameters, the present application is not limited, and a conventional firmware analysis AI model algorithm can be used, the algorithm can be continuously upgraded and highly flexibly configured, and the purpose is to provide technical support for the fault trigger injection of the instructions and running accuracy of the hardware electronic devices and chips of the detected device, and also assist in the firmware forward debugging or reverse analysis of the detected device in the real power-on running environment;The MCU module 1 is also integrated with FM, AM and PM common wireless radio frequency signal modulation generation algorithms, and the application is not limited to specific ones, and the conventional wireless radio frequency signal modulation generation algorithm can be used, and various common radio frequency signal streams and radio frequency communication protocols are simulated and generated by the internal firmware algorithm, and the signal is transformed, coupled and matched by the high-speed DAC circuit and the signal amplification module 3, and then outputted, so that any wireless radio frequency modulation signal of a specified frequency band is non-physically contacted and injected into the detected equipment; the MCU module 1 is built-in with a high-speed high-voltage pulse signal overshoot suppression algorithm, and the application is not limited to specific ones, and the conventional pulse signal overshoot suppression algorithm can be used, and the transformer coupling is used, and the overshoot phenomenon cannot be avoided, and the application utilizes the lag characteristics generated by the overshoot, and the model is established according to the transformer specific parameter measurement value and the accurate time of the signal overshoot lag after the known specified pulse signal is generated, and the reverse pulse signal with opposite polarity and appropriate amplitude is quickly sent in the accurate time, so as to offset the overshoot signal electromagnetic potential energy in the transformer, and the overshoot phenomenon of the high-speed high-voltage pulse signal is weakened or eliminated.

[0047] Specifically, in the embodiment, the high-speed DAC circuit 2 is provided with two channels which are adapted to the two signal amplification circuits of the signal amplification module 3, and the application is not limited to specific ones, and the corresponding channels can be set according to the number of signal amplification circuits of the signal amplification module 3; according to the real-time driving of the MCU module 1, the interlaced mode and the non-interlaced mode driving can be supported, and two independent glitch pulse current differential signals or wireless radio frequency current differential signals are generated to the input end of the signal amplification module 3, and the pulse width, phase, amplitude and frequency of the glitch pulse current differential signal and the wireless radio frequency current differential signal can be configured.

[0048] Specifically, in the embodiment, the signal amplification module 3 comprises at least two signal amplification circuits; the input ends of the two signal amplification circuits are connected with two channels of the high-speed DAC circuit 2 respectively, and the output ends of the two signal amplification circuits are connected with the first BNC interface and the second BNC interface respectively; the signal amplification circuit comprises a coupling circuit, an amplification circuit, a signal conditioning switching circuit and a coupling output circuit connected in sequence; the alternating current coupling input signal is the glitch pulse current differential signal and the wireless radio frequency current differential signal; the coupling circuit realizes the current-voltage conversion, alternating current coupling, signal isolation and impedance matching of the glitch pulse current differential signal or the wireless radio frequency current differential signal current, outputs the glitch pulse signal or the radio frequency signal, and ensures the safety and purity of the output signal, and then the amplification circuit realizes the accurate and high-speed amplification of the glitch pulse signal or the radio frequency signal, while ensuring that the glitch pulse signal or the pulse signal has high voltage and high current output capability; according to the instruction issued by the remote end or the user realizes the preset configuration data, whether the signal output by the amplification circuit is amplified again by the signal conditioning switching circuit, and whether the glitch pulse signal or the pulse signal with higher voltage value has the output capability of the glitch pulse signal or the radio frequency signal with higher voltage value is selected, and finally the glitch pulse fault signal or the radio frequency fault signal is injected into the detected device through the first BNC interface or the second BNC interface through the coupling output circuit.

[0049] Specifically, in the embodiment, the coupling circuit comprises resistors R1, R2, R3, R4 and a transformer T; the 1 pin of the transformer T is connected with the resistor R1, the resistor R3 and the high-speed DAC circuit 2 respectively; the 3 pin of the transformer T is connected with the resistor R2, the other end of the resistor R1 and the high-speed DAC circuit 2 respectively; the 4 pin of the transformer T is connected with the resistor R4 and the ground end respectively; the 6 pin of the transformer T is connected with the other end of the resistor R4 and the amplification circuit respectively; the 2 pin of the transformer T, the resistor R3 and the other end of the resistor R2 are grounded.

[0050] Specifically, in the embodiment, the amplification circuit comprises an amplifier, and the amplifier realizes the amplification of the glitch pulse signal or the radio frequency signal, so that the glitch pulse signal or the radio frequency signal has high voltage and high current output capability.

[0051] Specifically, in the embodiment, the signal conditioning switching circuit includes a relay K; an input end of the relay K is connected with the amplification circuit, output ends of the relay K are connected with input ends of a voltage boosting circuit and a bypass output circuit respectively; output ends of the voltage boosting circuit and the bypass output circuit are connected with an input end of the coupling output circuit; the voltage boosting circuit includes a first transformer, the voltage boosting circuit is for twice amplification of the glitch pulse signal or the pulse signal, an amplification ratio of the transformer can be set according to requirements, and the application does not make specific limitation; the bypass output circuit is for not twice voltage transformation of the glitch pulse signal or the pulse signal, that is, output to the detected device, the bypass output circuit includes a second transformer, an input-output ratio of the second transformer is 1:1; in order to adapt to requirements of different types of chip testing, the voltage boosting circuit and the bypass output circuit are arranged, for example, a low-voltage pulse cannot realize fault testing for a high-voltage chip, and is suitable for a high-voltage testing scene, so the glitch pulse signal or the pulse signal needs to be twice boosted to meet requirements of high-voltage chip fault testing.

[0052] Specifically, in the embodiment, the coupling output circuit includes an impedance matching circuit, a third transformer and an alternating current coupling output circuit, the application does not make specific limitation, and a conventional circuit in the field can be specifically adopted; the glitch pulse signal or the pulse signal is isolated through the transformer after impedance matching, the glitch pulse fault signal or the radio frequency fault signal is output through the alternating current coupling output circuit, and is injected into a hardware electronic device, a board card, a chip or other components of the detected device through the first BNC interface or the second BNC interface, so that fault injection detection or penetration of different positions of the detected device is realized.

[0053] Specifically, in the embodiment, the power-off injection circuit 4 defaults to drain open-drain output to the outside, has a low internal node capacitance value, can be connected to the inside of a hardware electronic device, a chip or other components of an external detected device without interference, has an extremely low on-resistance, and can ensure that power-off injection is effectively realized when a large current and a large voltage work. The power-off injection circuit 4 is driven in real time through the MCU module 1, the simultaneously driven side and the power-off fault injection output side can be selectively controlled to realize isolation through a high-speed photoelectric isolation circuit, the power-off injection circuit 4 is configured to ensure safety, stability and real-time performance of the driven side, and a pulse width parameter of the power-off fault injection output can be specifically configured and connected to the detected device through the third BNC joint; the power-off injection circuit 4 independently has a power-off fault injection channel, in order to meet fault injection in a power-off scene, perform corresponding power-off fault testing, and determine whether the device can still work normally, so as to perform penetration testing of power-off fault injection.

[0054] Specifically, in the embodiment, the power-off injection circuit 4 comprises a resistor R1, a resistor R2, a diode D1, a diode D2, a MOS Q1, a resistor R3 and a third BNC interface; a gate of the MOS Q1 is connected with the diode D1, the diode D2 and a resistor R6 respectively, the other end of the resistor R6 is connected with a resistor R5 and the MCU module 1 respectively, the other end of the diode D1 is connected with a power supply, the other end of the diode D2 and a source of the MOS Q1 are connected with a ground; a drain of the MOS Q1 is connected with a resistor R7, the other end of the resistor R7 is connected with a detected device through the third BNC interface.

[0055] Specifically, in the embodiment, the power-off injection circuit 4 comprises a diode D5, a diode D6, a resistor R10, a photo-coupler U1, a resistor R11, a resistor R12, a diode D7, a diode D8, a MOS Q2, a resistor R13 and a third BNC interface; a pin 1 of the photo-coupler U1 is connected with the diode D5, the diode D6 and the MCU module 1 through the resistor R10 respectively, the other end of the diode D5 is connected with a power supply; a pin 3 of the photo-coupler U1 is connected with the resistor R12 and the diode D8 respectively; a pin 4 of the photo-coupler U1 is connected with the resistor R11, the diode D7 and a gate of the MOS Q2 respectively, a drain of the MOS Q2 is connected with the resistor R13, the other end of the resistor R13 is connected with a detected device through the third BNC interface; a source of the MOS Q2, a pin 2 of the photo-coupler U1, the diode D6, the resistor R12 and the other end of the diode D8 are connected with a ground.

[0056] Specifically, in the embodiment, the trigger circuit 5 comprises a resistor R8, a resistor R9, a diode D3, a diode D4 and a fourth BNC interface; one end of the fourth BNC interface is connected with the resistor R8, the other end of the resistor R8 is connected with the resistor R9, the diode D3, the diode D4 and the MCU module 1 respectively, the other end of the fourth BNC interface is connected with the detected device; the other end of the diode D3 is connected with a power supply, the other end of the diode D4, the resistor R9 and the other end of the fourth BNC interface are connected with a ground; the trigger circuit 5 is a key circuit for realizing fault injection synchronous external trigger, comparator trigger, edge trigger and manual trigger, different effective signals are externally connected to the MCU module 1 through the direct current coupling mode of resistance voltage division, the trigger functions of different modes are realized according to the instructions sent by the remote end or the data pre-configured by the user, and it is ensured that the fault injection signal is accurately injected into the chip or other components inside the detected device, wherein the trigger circuit 5 is connected with the detected device through the fourth BNC interface; the trigger circuit 5 realizes accurate injection of glitch pulse fault signals or radio frequency fault signals into the detected device by collecting the configuration of the detected device such as high-low level signals, TTL signals or clock signals and pre-setting high level or low level and rising edge or falling edge as clock trigger, and the application is not limited in particular and can be set as required.

[0057] Specifically, in the embodiment, the linkage type fault injection instrument further comprises a peripheral communication interface module 6; the peripheral communication interface module 6 is connected with the MCU module 1 and the detected device respectively; the peripheral communication interface module 6 comprises any one or more of an NFC external expansion interface circuit, an I2C interface circuit, an SPI interface circuit, a UART interface circuit, an RS232 interface circuit, an RS485 interface circuit, a CAN / CANFD interface circuit, a LIN interface circuit and an RJ45 interface circuit; the peripheral communication interface module 6 can be used as a gateway for communication transfer, one-way or multi-way input is realized through the setting of a plurality of peripheral communication interface circuits, and one-way or multi-way peripheral communication interface is selected for output through the matrix cross composite switch arranged in the MCU module 1.

[0058] Specifically, in the embodiment, the NFC external expansion interface circuit is a reserved expansion interface, and a special NFC acquisition board card can be externally expanded. The NFC acquisition board card is connected with the NFC external expansion interface circuit, receives a 5V power output provided by the NFC external expansion interface, receives a control signal of the NFC external expansion interface circuit, and sends an NFC baseband adjustment signal set to the NFC external expansion interface circuit. The NFC external expansion interface circuit is connected with the MCU module 1, realizes acquisition and protocol analysis of NFC wireless electromagnetic signals, and thus realizes a trigger fault injection function of an NFC near field communication protocol based on different frequency bands such as 13.56 MHz and 125 KHz. The trigger fault injection function can be externally led out through a pin row and an SMA joint.

[0059] Specifically, in the embodiment, the I2C interface circuit is an external leading-out interface of the MCU module 1, supports a master-slave communication mode, has a high communication rate and is adjustable, and has a configurable slave address. The I2C interface circuit can realize digital trigger fault injection and protocol analysis based on an I2C communication protocol, and the trigger mode can support flexible configuration of the I2C communication protocol. The I2C interface circuit is externally led out through a wiring terminal row.

[0060] Specifically, in the embodiment, the SPI interface circuit is an external leading-out interface of the MCU module 1, supports a master-slave communication mode, has a high communication rate and is adjustable, and can realize digital trigger fault injection and protocol analysis based on an SPI communication protocol. The trigger mode can support flexible configuration of the SPI communication protocol. The SPI interface circuit is externally led out through a wiring terminal row.

[0061] Specifically, in the embodiment, the UART interface circuit is an external leading-out interface of the MCU module 1, has a high communication rate and is adjustable, and can realize digital trigger fault injection and protocol analysis based on a UART communication protocol. The trigger mode can support flexible configuration of the UART communication protocol. The UART interface circuit is externally led out through a wiring terminal row and a DB9 socket.

[0062] Specifically, in the embodiment, the RS232 interface circuit is an independent circuit module. The RS232 interface circuit includes an RS232 interface chip and is driven by the MCU module 1. The RS232 interface circuit has a high communication rate and is adjustable, can realize digital output fault injection and protocol analysis based on an RS232 communication protocol, and the trigger mode can support flexible configuration of the RS232 communication protocol. The RS232 interface circuit is externally led out through a wiring terminal row and a DB9 socket.

[0063] Specifically, in the embodiment, the RS485 interface circuit is a separate circuit module, the RS485 interface circuit includes an RS485 interface chip, is driven by the MCU module 1, supports master-slave communication mode, has high communication rate and is adjustable, the slave address can be configured, digital trigger fault injection and protocol analysis based on the RS485 communication protocol can be realized, the trigger mode can support flexible configuration of the RS485 communication protocol, and is led out externally through a wiring terminal row.

[0064] Specifically, in the embodiment, the CAN / CANFD interface circuit is a separate circuit module, the CAN / CANFD interface circuit includes a CAN / CANFD interface chip, is driven by the MCU module 1, supports CAN and CANFD protocols, has high communication rate and is adjustable, communication messages can be configured, is mainly applied to vehicle networking, digital trigger fault injection and protocol analysis based on the CAN / CANFD bus communication protocol can be realized, the trigger mode can support flexible configuration of the CAN / CANFD bus communication protocol, and is led out externally through a wiring terminal row.

[0065] Specifically, in the embodiment, the LIN interface circuit is a separate circuit module, the LIN interface circuit includes a LIN interface chip and a LIN master-slave switching circuit, the LIN interface chip is connected with the MCU module 1, the LIN master-slave switching circuit and a detected device respectively, the LIN master-slave switching circuit is connected with the MCU module 1, the MCU module 1 issues a control signal, so that the LIN master-slave switching circuit switches the LIN master-slave working mode; the LIN interface circuit is driven by the MCU module 1, supports active communication mode, has adjustable communication rate and configurable address, is mainly applied to vehicle networking, digital trigger fault injection and protocol analysis based on the LIN bus communication protocol can be realized, the trigger mode can support flexible configuration of the LIN bus communication protocol, and is led out externally through a wiring terminal row.

[0066] Specifically, in the embodiment, the RJ45 interface circuit is composed of two independent RJ45 interface modules, the RJ interface module includes an Ethernet interface chip, is driven by the MCU module 1 based on an RMII interface, digital trigger fault injection and protocol analysis based on the RJ45 Ethernet communication protocol can be realized, and the trigger mode can support flexible configuration of the RJ45 Ethernet communication protocol.

[0067] Specifically, in the embodiment, the linkage type fault injection instrument further comprises an isolated voltage acquisition circuit 7; the isolated voltage acquisition circuit 7 is connected with the MCU module 1 and the power supply module 8 respectively; the isolated voltage acquisition circuit 7 is used for acquiring the input voltage value of the power supply module 8; the isolated voltage acquisition circuit 7 is based on a high-linearity photo-coupler isolation type design, an external DC power supply 9V-15V, and then output to the MCU module 1 for AD sampling operation, isolated acquisition of input voltage, and realization of the purpose of online detection of output voltage, especially in the field battery power supply mode, which facilitates real-time detection of battery voltage.

[0068] Specifically, in the embodiment, the linkage type fault injection instrument further comprises a power supply module 8; an input end of the power supply module 8 is connected with an external power supply, and an output end of the power supply module 8 is connected with the MCU module 1; the power supply module 8 is used for providing power supply; the power supply module 8 comprises a DCDC power supply circuit, a first power conversion circuit and a second power conversion circuit connected in sequence; the DCDC power supply circuit is used for converting an external input power supply into a first DC voltage, wherein the external input power supply is a 9-15V DC input power supply, and the 9-15V DC input is converted into a 15V output through the DCDC power supply circuit; the first power conversion circuit is used for converting the first DC voltage into a second DC voltage, that is, converting the 15V voltage output of the DCDC power supply circuit into a 5V output voltage; the second power conversion circuit is used for converting the second DC voltage into a third DC voltage, that is, converting the 5V voltage output of the first power conversion circuit into a 3.3V output voltage; in the embodiment, the power supply module 8 comprises at least two second power conversion circuits; the power supply module 8 further comprises a power-on reset module connected with the second power conversion circuit, and the power-on reset module is used for performing power-on reset on the second power conversion circuit; the power supply module 8 can be powered by an outdoor battery DC power supply, and after conversion and filtering by the internal DCDC power supply circuit, a 15V DC voltage is output, and then 5V and 3.3V DC voltages are output through the first power conversion circuit and the second power conversion circuit respectively, the 15V DC voltage is mainly used for power supply of the signal amplification module 3 and the LIN interface circuit, and the 5V and 3.3V DC voltages are mainly used for power supply of other sub-module circuits, so as to ensure that part of the circuits meet the power-on timing requirements and can work normally.

[0069] According to another aspect of the present application, the present application provides a fault injection method of a linkage type fault injection instrument, comprising the following steps:

[0070] The system is powered on, receives the remote trigger instruction through the peripheral communication interface module 6, sends the trigger signal through the trigger circuit, and carries out timing triggering through the MCU module 1; the MCU module 1 drives the high-speed DAC circuit 2 to configure two-way AC coupling input signals to the signal amplification module 3; the signal amplification module 3 couples, amplifies, twice amplifies, impedance matches and AC couples the AC coupling input signals, and finally obtains the glitch pulse fault signal or the radio frequency fault signal, and then injects the glitch pulse fault signal or the radio frequency fault signal into the detected equipment for fault injection test / penetration.

[0071] The above is only the preferred embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structural transformation made under the inventive concept of the present application, using the content of the present application specification and drawings, or directly / indirectly applied in other related technical fields is included in the patent protection range of the present application.

Claims

1. A chained fault injector, characterized in that, The linkage type fault injection instrument comprises an MCU module, a high-speed DAC circuit, a signal amplification module, a power-off injection circuit and a trigger circuit; The MCU module is electrically connected with the high-speed DAC circuit and the power-off injection circuit through wires, the high-speed DAC circuit channel wire is electrically connected with the signal amplification module, and the signal amplification module is electrically connected with the detected device; the MCU module is electrically connected with the trigger circuit through wires, and the trigger circuit is electrically connected with the detected device; The signal amplification module comprises at least two signal amplification circuits; the input ends of the two signal amplification circuits are connected with two channels of the high-speed DAC circuit respectively; the signal amplification circuit comprises a coupling circuit, an amplification circuit, a signal conditioning switching circuit and a coupling output circuit which are electrically connected in sequence; the coupling circuit realizes the conversion of current voltage, AC coupling, signal isolation and impedance matching of the differential signal or the wireless radio frequency current differential signal, and outputs the glitch pulse signal or the radio frequency signal; the amplification circuit realizes the accurate and high-speed amplification of the glitch pulse signal or the radio frequency signal, and ensures that the glitch pulse signal or the pulse signal has high voltage and high current output capability; according to the instruction from the remote end or the preset configuration data of the user, whether the signal output from the amplification circuit is amplified again or not is selected by the signal conditioning switching circuit, and finally the glitch pulse fault signal or the radio frequency fault signal is injected into the detected device through the first BNC interface or the second BNC interface through the coupling output circuit; The coupling circuit comprises resistors R1, R2, R3, R4 and a transformer T; the 1 pin of the transformer T is connected with the resistor R1, the resistor R3 and the high-speed DAC circuit respectively; the 3 pin of the transformer T is connected with the resistor R2, the other end of the resistor R1 and the high-speed DAC circuit respectively; the 4 pin of the transformer T is connected with the resistor R4 and the ground respectively; the 6 pin of the transformer T is connected with the other end of the resistor R4 and the amplification circuit respectively; the 2 pin of the transformer T, the resistor R3 and the other end of the resistor R2 are grounded; The signal conditioning switching circuit comprises a relay K; the input end of the relay K is connected with the amplification circuit, and the output end of the relay K is connected with the input ends of the voltage boosting circuit and the bypass output circuit respectively; the output ends of the voltage boosting circuit and the bypass output circuit are connected with the input end of the coupling output circuit.

2. The chained fault injector of claim 1, wherein, The power-off injection circuit comprises resistors R1, R2, diodes D1, D2, a MOS tube Q1, a resistor R3 and a third BNC interface; The gate of the MOS tube Q1 is connected with the diode D1, the diode D2 and a resistor R6 respectively, the other end of the resistor R6 is connected with a resistor R5 and the MCU module respectively, the other end of the diode D1 is connected with a power supply, the other end of the diode D2 and the source of the MOS tube Q1 are grounded; the drain of the MOS tube Q1 is connected with a resistor R7, and the other end of the resistor R7 is connected with the detected device through the third BNC interface.

3. The chained fault injector of claim 1, wherein, The trigger circuit comprises a resistor R8, a resistor R9, a diode D3, a diode D4 and a fourth BNC interface; one end of the fourth BNC interface is connected with the resistor R8, the other end of the resistor R8 is connected with the resistor R9, the diode D3, the diode D4 and the MCU module respectively, and the other end of the fourth BNC interface is connected with the detected device; the other end of the diode D3 is connected with a power supply, and the other end of the diode D4, the resistor R9 and the fourth BNC interface is connected with a ground.

4. The chained fault injector of claim 1, wherein, The linkage type fault injection instrument further comprises a peripheral communication interface module; The peripheral communication interface module is connected with the MCU module and the detected device respectively; The peripheral communication interface module comprises any one or more of an NFC external expansion interface circuit, an I2C interface circuit, an SPI interface circuit, a UART interface circuit, an RS232 interface circuit, an RS485 interface circuit, a CAN / CANFD interface circuit, a LIN interface circuit and an RJ45 interface circuit.

5. The chained fault injector of claim 1, wherein, The linkage type fault injection instrument further comprises a power module; an input end of the power module is connected with an external power supply, and an output end of the power module is connected with the MCU module; the power module is used for providing power supply.

6. The chained fault injector of claim 5, wherein, The power module comprises a DCDC power supply circuit, a first power conversion circuit and a second power conversion circuit connected in sequence; The DCDC power supply circuit is used for converting an external input power supply into a first direct current voltage; The first power conversion circuit is used for converting the first direct current voltage into a second direct current voltage; The second power conversion circuit is used for converting the second direct current voltage into a third direct current voltage.

7. A method for fault injection comprising the linkage fault injection apparatus according to any one of claims 1 to 6, wherein, The method comprises the following steps: The system is powered on, a trigger signal is sent out by the peripheral communication interface module receiving a remote trigger instruction / the trigger circuit / MCU module performing timing triggering; The MCU module drives the high-speed DAC circuit to configure at least one AC coupling input signal to the signal amplification module; The signal amplification module couples, amplifies, secondarily amplifies, impedance matches and AC couples the AC coupling input signal, and finally obtains a glitch pulse fault signal or a radio frequency fault signal, and then the glitch pulse fault signal or the radio frequency fault signal is injected into the detected device for fault injection test / penetration.

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