Electronic equipment and its housing

Abstract

The present application provides an electronic device and its housing; the housing includes a glass substrate and an optical coating layer coated on one side of the glass substrate; the optical coating layer includes a bottom layer, an intermediate layer, and a surface layer stacked in sequence on the surface of the glass substrate; wherein the bottom layer includes a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials, the intermediate layer includes a stacked layer of silicon nitride and silicon oxynitride materials alternating, and the surface layer includes a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials. The housing provided in the embodiment of the present application has an optical coating layer designed with a multi-layer stacked layer structure composed of silicon dioxide, silicon nitride, and silicon oxynitride materials, and the overall surface hardness can reach 15GPa to 20GPa, effectively improving the surface hardness of the glass and enhancing the glass's resistance to daily scratches. The minimum reflectivity of visible light from 380nm to 780nm can reach more than 30%.

Description

Technical Field

[0001] The present invention relates to the technical field of appearance display effects of electronic equipment housings, and in particular to an electronic equipment and a housing thereof. Background Art

[0002] Glass is a common material used on the surface of electronic products such as mobile phones. Glass is colorless and has a single-sided reflectivity of about 4%. In order to make the glass have anti-reflection (reduced reflectivity), brightening (increased reflectivity) and various color effects, a common method is to coat the inner surface of the glass with an optical thin film coating of a certain thickness (usually several hundred nanometers). The optical coating can give the glass the above effects through optical interference.

[0003] Chemically strengthened glass typically has a surface hardness of around 8 GPa, while optical coatings typically have a hardness of around 8-10 GPa. This coating's hardness is similar to that of the glass, making it ineffective at protecting the glass and offering weak scratch resistance. Therefore, it can only be applied to the inner surface of the glass (non-user contact surface). When an optical coating is applied to the inner surface, the light seen by the human eye is a combination of light reflected from the glass's upper surface and light reflected from the optical coating interface. Since mobile phone glass is typically around 0.5 mm thick or even thicker, the overlap between the two reflections is low, resulting in a double image of the two light sources, impacting the visual experience. Optical coatings are brittle materials with a high elastic modulus. When a mobile phone's glass is subjected to an inward impact (such as a drop or heavy object), the optical coating is subject to tension and easily cracks. Cracks propagate to the glass's surface, creating stress concentration points that facilitate crack propagation into the interior of the glass, reducing the glass's impact resistance. Testing has shown that applying an inner coating can reduce the glass's impact resistance by up to 70%. Therefore, the common practice is to first spray a layer of low elastic modulus resin organic material on the inner surface of the glass with a thickness of about 1.0um to 2.0um, and then coat the optical film. This can eliminate the impact of the inner surface coating on the impact resistance of the glass, but the cost of covering the organic material is high. Summary of the Invention

[0004] In a first aspect of an embodiment of the present application, a shell for an electronic device is provided, the shell comprising a glass substrate and an optical coating layer coated on a surface of one side of the glass substrate; the optical coating layer comprises a bottom layer, an intermediate layer, and a surface layer sequentially stacked on the surface of the glass substrate; wherein the bottom layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials, the intermediate layer comprises a stacked layer of alternating silicon nitride and silicon oxynitride materials, and the surface layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials.

[0005] In a second aspect, an embodiment of the present application provides a shell for an electronic device, the shell comprising a glass substrate and an optical coating layer coated on one surface of the glass substrate; the optical coating layer comprises a bottom layer, an intermediate layer and a surface layer stacked in sequence on the surface of the glass substrate; wherein the bottom layer comprises a stacking layer of silicon dioxide and silicon nitride materials, the intermediate layer comprises a stacking layer of multiple materials selected from silicon nitride and silicon oxynitride, and the surface layer comprises a stacking layer of silicon dioxide and any one material selected from silicon nitride and silicon oxynitride.

[0006] In addition, an embodiment of the present application provides an electronic device, which includes a display screen, a control circuit board, and a shell according to any one of the above embodiments. The shell and the display screen cooperate to form a storage space, and the control circuit board is arranged in the storage space and electrically connected to the display screen.

[0007] The shell provided in the embodiment of the present application has an optical coating layer designed with a multi-layer stacked layer structure composed of silicon dioxide, silicon nitride, and silicon oxynitride materials. The overall surface hardness can reach 15GPa to 20GPa, which effectively improves the surface hardness of the glass and enhances the glass's resistance to daily scratches. The minimum reflectivity of visible light from 380nm to 780nm can reach more than 30%. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 It is a schematic diagram of the stacked structure of a conventional technical solution for a mobile phone shell;

[0010] Figure 2 yes Figure 1 Schematic diagram of the reflected light path of the housing in the embodiment;

[0011] Figure 3 This is a schematic diagram of the chemical formula of the AF anti-fingerprint layer combined with the substrate;

[0012] Figure 4 This is a schematic diagram of the stacked structure of an embodiment of a housing for an electronic device according to the present application;

[0013] Figure 5 This is a schematic diagram of a shell coating structure designed using three materials: silicon oxide / silicon oxynitride / silicon nitride, with a reflectivity R>30%;

[0014] Figure 6 yes Figure 5 Reflectivity of the middle shell versus wavelength.

[0015] Figure 7 is a schematic diagram of the stacked structure of another embodiment of the housing of the present application;

[0016] Figure 8 This is a schematic diagram of the stacked structure of another embodiment of the housing of the present application;

[0017] Figure 9 This is a schematic diagram of the stacked structure of another embodiment of the housing of the present application;

[0018] Figure 10 This is a schematic cross-sectional view of an embodiment of an electronic device of the present application;

[0019] Figure 11 It is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0020] The present invention will be described in further detail below with reference to the accompanying drawings and examples. It is particularly noted that the following examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. Similarly, the following examples are only some embodiments of the present invention and are not intended to be all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative effort are intended to fall within the scope of protection of the present invention.

[0021] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] As used herein, "electronic equipment" (or simply "terminal") includes, but is not limited to, devices configured to receive / transmit communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal," "wireless terminal," or "mobile terminal." Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that may combine a cellular radiotelephone with data processing, fax, and data communication capabilities; PDAs that may include a radiotelephone, a pager, Internet / Intranet access, a web browser, a notepad, a calendar, and / or a global positioning system (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A mobile phone is an electronic device equipped with a cellular communication module.

[0023] See also Figure 1 , Figure 1 This is a schematic diagram of the stacked structure of a conventional technical solution for a mobile phone shell. The existing technology uses Figure 1 The laminated structure is to first cover the back of the glass (non-user contact surface) with a color ink layer, and then deposit a silicon nitride transparent hardening layer, a diamond-like DLC (Diamond-like The thickness of the diamond-like carbon (DLC) layer is about 3nm to 5nm. In theory, the nanohardness of DLC is higher than that of silicon nitride, which can further improve the surface hardness of the glass. However, the proportion of diamond phase in the DLC film produced by conventional sputtering process is low, and the surface roughness of the silicon nitride hardened layer is greater than 1.0um. The DLC with a thickness of 3nm to 5nm attached to its surface is too thin, and the improvement of the scratch and wear resistance of the glass surface is not obvious. The AF anti-fingerprint layer is 20nm to 30nm thick and is attached to the DLC layer, in direct contact with the user environment, providing the glass with anti-fingerprint and anti-fouling capabilities.

[0024] The disadvantages of the above technical solution are:

[0025] (1) When several layers of nano-optical thin film material are deposited on the outer surface of glass, light is reflected at the interfaces of each layer of material when it is incident. The reflected light from each interface meets the conditions of coherent light. Therefore, the reflected light seen by the user is the light after the reflected light from each interface undergoes optical interference. Figure 2 , Figure 2 yes Figure 1 Schematic diagram of the reflected light path of the housing in the embodiment, Figure 2 For example, three layers of nano-optical thin film coating are deposited on the glass surface. After the light is incident, it is reflected on the four interfaces respectively. The four beams of reflected light undergo optical interference, and ultimately can achieve anti-reflection, brightening and various color optical effects. Assuming that the refractive indices of optical coating layer 1 and optical coating layer 2 are n1 and n2 respectively, then the reflectivity on the two material interfaces at vertical incidence is:

[0026] In the existing technical solutions, the nano-thin film materials in the optical coating layer are silicon nitride and silicon oxynitride, and the refractive indices of the two are approximately 2.03 and 1.68, respectively. The difference between the two is very small, which will eventually lead to the difficulty in improving the reflectivity of the interference light after the glass surface is coated. For example, in the existing solution, if you want to increase the minimum reflectivity of visible light 380nm~780nm to more than 30%, it is quite difficult. Therefore, the color saturation of the glass surface after coating will be greatly limited.

[0027] (2) In the existing solution, the AF anti-fingerprint layer is in contact with the DLC layer, and the bonding strength between the two is very poor, which will greatly affect the service life of the AF layer. The main component of the AF anti-fingerprint material is a fluoropolymer, which is often used on the surface of electronic products to provide them with anti-fingerprint and anti-fouling capabilities. The common practice in the industry is to deposit the AF material directly on the glass surface or on the surface of the silica material. For its bonding method, please refer to Figure 3 , Figure 3 This is a schematic diagram of the chemical formula for the bonding of the AF anti-fingerprint layer to the substrate. In existing solutions, the raw material for DLC material is carbon. After forming a diamond-like structure, its surface is difficult to bond with the AF material to form the following expression structure: Therefore, it is difficult for the AF material to adhere to the surface of the DLC layer. The wear resistance of the AF material in the structure shown in the existing solution is very poor and the service life is short.

[0028] (3) The DLC material in the existing solution is an opaque absorption material. It absorbs different wavelengths of visible light to different degrees. It absorbs more in the short-wave blue light band and less in the long-wave yellow light band. Therefore, after the glass is deposited with DLC material, the visible light that penetrates the glass is absorbed by DLC, and the amount of yellow light transmitted is greater than that of blue light, causing the glass to appear yellow. Especially when the back of the glass is covered with white or other high-gloss ink, the yellowing of the glass will be very obvious.

[0029] Based on the above problems, the present application provides a housing structure of an electronic device. Figure 4 , Figure 4 It is a schematic diagram of the stacked structure of an embodiment of a shell for an electronic device in the present application. It should be noted that the electronic devices in the present application may include mobile phones, tablet computers, laptop computers, wearable devices and other electronic devices with shells. The shell 10 includes but is not limited to the following structures: a glass substrate 100 and an optical coating layer 200. It should be noted that the terms "including" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products or devices.

[0030] Specifically, the optical coating layer 200 is coated on one side of the glass substrate 100. It should be noted that the glass substrate 100 in the embodiment of the present application can be conventional silica glass, or ceramic glass or a ceramic plate. The more common colors of ceramic plates are white and black, and other colors are more expensive without affecting performance. By providing the optical coating layer of this solution on the upper surface of the ceramic substrate, the ceramic can be flexibly provided with a variety of colors without sacrificing the surface's scratch resistance.

[0031] Among them, the glass substrate 100 can be glass with a smooth surface, or it can be glass with an etched surface. On the one hand, the surface of etched glass is rough, and the light reflected from the surface is mainly scattered, which can have an anti-glare effect. Common processing methods for etched glass include mechanical sandblasting etching, chemical reaction etching, high-energy particle bombardment etching, etc. The glass substrate 100 in this solution can use surface-etched glass instead of smooth glass, and the optical coating layer 200 on the outer surface can be provided on the etched surface of the glass. The optical coating layer 200 is provided on the outer surface of the etched glass substrate. In addition to the above advantages, the uneven surface of the etched glass has a contact point on the raised position of the glass surface when it is worn, and the position of the pit can be protected. Therefore, the wear and scratches on the surface are discontinuous, which can further improve the wear and scratch resistance of the glass surface.

[0032] The optical coating layer 200 includes a bottom layer 210, an intermediate layer 220, and a surface layer 230 sequentially stacked on the surface of the glass substrate 100; wherein the bottom layer 210 includes a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials. In addition, in some other embodiments, it can also be composed of only two nanomaterial layers of silicon dioxide and silicon nitride alternately stacked. Silicon dioxide is relatively soft (its hardness is comparable to that of glass), but its refractive index is low, and the difference between its refractive index and that of silicon nitride is large. Therefore, choosing silicon dioxide is more likely to cause optical interference to form a highly saturated reflective color. There is no limit to the total number of layers of the bottom layer 210, and the total thickness can be between 0.1um and 2um. The thickness of each material stacking layer ranges from 5 to 100nm.

[0033] Optionally, the intermediate layer 220 includes alternating stacked layers of silicon nitride and silicon oxynitride materials. In some other embodiments, the intermediate layer 220 may also be a stacked layer comprising multiple layers of either silicon nitride or silicon oxynitride. Due to its high hardness, the intermediate layer 220 can provide overall wear and scratch resistance for the optical coating layer. There is no limit to the total number of layers of the intermediate layer material, and the total thickness can be between 0.2 μm and 5 μm. The thickness of each material stacked layer ranges from 5 to 100 nm.

[0034] Optionally, the surface layer 230 includes a stacked layer of silicon dioxide, silicon nitride, or silicon oxynitride. In some other embodiments, the surface layer 230 may include a stacked layer of silicon dioxide and any one of silicon nitride and silicon oxynitride. The total number of layers of the surface layer 230 is not limited, and the total thickness may be between 0.1 μm and 2 μm, with the thickness of each stacked layer of material ranging from 5 to 100 nm.

[0035] The coating targets for the three materials (silicon dioxide, silicon nitride, and silicon oxynitride) in the optical coating layer 200 can all be silicon targets. Oxygen is used as the reaction gas during sputtering deposition of silicon oxide, nitrogen is used during sputtering deposition of silicon nitride, and a mixture of oxygen and nitrogen is used during sputtering deposition of silicon oxynitride. When depositing silicon oxynitride, the ratio of N2 to O2 in the reaction gas must be controlled. The lower the O2 ratio, the higher the refractive index of the silicon oxynitride. This solution limits the refractive index of silicon oxynitride to between 1.50 and 1.90. For example, when the ratio of O2:N2 = 1:2, the refractive index of silicon oxynitride is approximately 1.68. Further reducing the oxygen content will bring the refractive index of silicon oxynitride closer to 1.90.

[0036] The design of the optical coating layer can be calculated with the help of specialized optical thin film design software. Commonly used software includes Macleod, OptiLayer, TFCalc, etc. Based on the optical effect required by the designer, the design software can provide the required refractive index of the silicon oxynitride material. For the design of the optical coating layer 200, based on the required optical effect, the optical software can calculate the required material's refractive index, thickness, number of layers, arrangement and combination, etc. Figure 5 , Figure 5 This is a schematic diagram of a shell coating structure designed with a reflectivity R>30% using three materials: silicon oxide / silicon oxynitride / silicon nitride. Please refer to Figure 6 , Figure 6 yes Figure 5 Optionally, in this embodiment, the silicon dioxide layer in the bottom layer 210 is connected to the glass substrate 100 to improve the connection strength between the optical coating layer 200 and the glass substrate.

[0037] Next, we will Figure 5 The method for forming the shell stacking structure in the embodiment is introduced. The method mainly includes the following steps.

[0038] (1) Use the processed mobile phone glass, clean and dry the surface thoroughly, put it into the coating equipment, and evacuate it to 0.001Pa~0.005Pa;

[0039] (2) Use plasma to clean the glass surface to increase surface activity, and the cleaning time is 1min to 10min;

[0040] (3) Sputtering deposition of silicon dioxide, the target material reaction gas is oxygen, the coating thickness is 5 to 50 nm;

[0041] (4) Sputtering deposition of silicon oxynitride. According to the calculation results of optical software, the refractive index of silicon oxynitride needs to be around 1.68, so the reaction gas of the target material here is O2:N2≈1:2, the coating thickness is 5~50nm, and the subsequent silicon oxynitride reaction gas is implemented according to this ratio;

[0042] (5) Sputtering deposition of silicon nitride, the target material reaction gas is nitrogen, the coating thickness is 30 ~ 100nm;

[0043] (6) Sputtering deposition of silicon dioxide, coating thickness 30 ~ 100nm;

[0044] (7) Sputtering deposition of silicon nitride, coating thickness 30 ~ 100nm;

[0045] (8) Sputtering deposition of silicon dioxide, coating thickness 30 ~ 100nm;

[0046] (9). Sputtering deposition of silicon nitride, coating thickness 30 ~ 100nm;

[0047] (10). Sputtering deposition of silicon oxynitride, coating thickness 50 ~ 150nm;

[0048] (11). Sputtering deposition of silicon nitride, coating thickness 30 ~ 100nm;

[0049] (12). Sputtering deposition of silicon oxynitride, coating thickness 50 ~ 150nm;

[0050] (13). Sputtering deposition of silicon nitride, coating thickness 50 ~ 150nm;

[0051] (14). Sputtering deposition of silicon oxynitride, coating thickness 30 ~ 100nm;

[0052] (15). Sputtering deposition of silicon nitride, coating thickness 30 ~ 100nm;

[0053] (16). Sputtering deposition of silicon oxynitride, coating thickness 30 ~ 100nm;

[0054] (17). Sputtering deposition of silicon dioxide, coating thickness 5 to 100 nm;

[0055] The shell provided in the embodiment of the present application has an optical coating layer designed with a multi-layer stacked layer structure composed of silicon dioxide, silicon nitride, and silicon oxynitride materials. The overall surface hardness can reach 15GPa to 20GPa, which effectively improves the surface hardness of the glass and enhances the glass's resistance to daily scratches. The minimum reflectivity of visible light from 380nm to 780nm can reach more than 30%.

[0056] See also Figure 7 , Figure 7 Schematic diagram of the stacked structure of another embodiment of the housing of the present application. The housing 10 in this embodiment includes but is not limited to a glass substrate 100, an optical coating layer 200 and an anti-fingerprint layer 300.

[0057] The optical coating layer 200 is coated on one side surface of the glass substrate 100. The glass substrate 100 can be glass with a smooth surface or glass with an etched surface. On the one hand, the surface of etched glass is rough, and the light reflected from the surface is mainly scattered, which can have an anti-glare effect. Common processing methods for etched glass include mechanical sandblasting etching, chemical reaction etching, high-energy particle bombardment etching, etc. The glass substrate 100 in this solution can use surface-etched glass instead of smooth glass, and the optical coating layer 200 on the outer surface can be provided on the etched surface of the glass.

[0058] The optical coating layer 200 may also include a bottom layer 210, an intermediate layer 220, and a surface layer 230 sequentially stacked on the surface of the glass substrate 100; wherein the bottom layer 210 includes a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials. In addition, in some other embodiments, it may also be composed of only two nanomaterial layers of silicon dioxide and silicon nitride alternately stacked. Silicon dioxide is relatively soft (its hardness is comparable to that of glass), but its refractive index is low, and the difference between its refractive index and that of silicon nitride is large. Therefore, it is easier to choose silicon dioxide to cause optical interference to form a highly saturated reflective color. There is no limit to the total number of layers of the bottom layer 210, and the total thickness can be between 0.1um and 2um. The thickness of each material stacking layer ranges from 5 to 100nm.

[0059] Optionally, the intermediate layer 220 can also be a stacked layer comprising alternating silicon nitride and silicon oxynitride materials. In some other embodiments, the intermediate layer 220 can also be a stacked layer comprising a plurality of silicon nitride and silicon oxynitride materials. Due to its high hardness, the intermediate layer 220 can provide overall wear resistance and scratch resistance for the optical coating layer. There is no limit to the total number of layers of intermediate layer material, and the total thickness can be between 0.2um and 5um. The thickness range of each material stacking layer is 5-100nm. It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0060] Optionally, the surface layer 230 may be a stacked layer comprising silicon dioxide, silicon nitride, or silicon oxynitride. In some other embodiments, the surface layer 230 may be a stacked layer comprising silicon dioxide and any one of silicon nitride and silicon oxynitride. There is no limit to the total number of layers of the surface layer 230, and the total thickness may be between 0.1um and 2um, with the thickness of each material stacked layer ranging from 5 to 100nm. The anti-fingerprint layer 300 is provided on the surface layer 230. The anti-fingerprint layer 300 may be specifically formed by evaporation, and the anti-fingerprint layer 300 is used to enhance the anti-fingerprint and anti-fouling capabilities of the glass surface.

[0061] Optionally, the silicon dioxide layer in the surface layer 230 is connected to the anti-fingerprint layer 300. This is because the material of the anti-fingerprint layer 300 needs to be firmly bonded to silicon dioxide. Please refer to the following chemical formula for the connection:

[0062] The housing in this embodiment can improve the anti-fingerprint and anti-fouling capabilities of the glass surface by providing an anti-fingerprint layer on the optical coating layer.

[0063] See also Figure 8 , Figure 8 It is a schematic diagram of the stacked structure of another embodiment of the shell of the present application. Different from the previous embodiment, the shell 10 in this embodiment also includes a color development layer 400, and the color development layer 400 is provided on the side of the glass substrate 100 away from the optical coating layer 200. The color development layer 400 can be sprayed with ink or a layer of film film. The most commonly used colors of ink are black and white, and other colors can also be used. Compared with ink, film film can also provide the color of ink for the back of the glass, and film film can also make the glass surface present various texture effects. The specific formation method of the color development layer 400 is to clean the non-coated surface of the glass substrate 100 (the side surface away from the optical coating layer 200), generally using plasma cleaning to enhance the surface activity; then cover the non-coated surface with ink or adhere a film film.

[0064] The shell in this embodiment can achieve different color and texture effects for the shell by forming a color development layer on the inner side of the shell.

[0065] The hardness of the glass surface of an ordinary mobile phone in conventional technology is generally about 8GPa. The shell in the embodiment of the present application has an overall hardness of the optical coating on its surface of up to 15GPa to 20GPa, which effectively improves the surface hardness of the glass and enhances the glass's resistance to daily scratches. In conventional technical solutions, the optical coating layer of the glass on products such as mobile phones is on the inner surface of the glass. When the mobile phone is impacted from the outside to the inside during daily use, the optical coating layer is easily cracked due to tensile stress. The cracks will cause the glass's impact resistance to decrease. It is necessary to pre-spray a layer of resin-based organic matter with a thickness of about 1.0um to 2.0um between the glass and the optical coating layer. The process cost is relatively high. However, the shell in the technical solution of the present application has an optical coating layer on the outer surface of the glass. When the mobile phone is impacted during daily use, the outer surface of the glass is subjected to compressive stress, and the coating is not easy to crack. Therefore, the impact resistance of the glass is not affected, and there is no need to pre-spray an organic layer on the glass surface, so the cost is relatively low. The shell in the technical solution of this application uses silicon nitride and silicon dioxide nano-thin film materials with a large refractive index difference in the bottom layer of the optical coating layer, which can make the optical coating layer more easily form highly saturated colors through optical interference, overcoming the disadvantage of too small a refractive index difference between silicon oxynitride and silicon nitride; the middle layer of the optical coating layer uses highly hard silicon nitride and silicon oxynitride, providing the entire optical coating layer with scratch resistance and wear resistance; the last layer of nano-thin film in the optical coating layer is silicon dioxide, which can form a strong chemical bond with the AF anti-fingerprint material on the outer surface, thereby increasing the service life of the anti-fingerprint material. The shell in the technical solution of this application does not contain nano-materials such as DLC that absorb visible light in its optical coating layer, and the color of the glass bottom ink or film film will not be visually yellowed due to the selective absorption of visible light by the coating layer.

[0066] The shell in the technical solution of this application uses silicon targets as the coating targets for the three materials in its optical coating layer. When sputtering and depositing silicon oxynitride, the reaction gas is a mixture of oxygen and nitrogen, and the ratio of N2 and O2 in the reaction gas needs to be controlled according to the required refractive index of silicon oxynitride. For example, when the O2:N2 flow rate = 1:2, the refractive index of silicon oxynitride is about 1.68. After further reducing the oxygen content, the refractive index of silicon oxynitride will approach 1.90. The lower the proportion of O2, the higher the refractive index of silicon oxynitride. This solution needs to limit the refractive index of silicon oxynitride to between 1.50 and 1.90.

[0067] See also Figure 9 , Figure 9 FIG2 is a schematic diagram of the laminated structure of another embodiment of the housing of the present application. Unlike the previous embodiment, the housing 10 in this embodiment further includes a second optical coating layer 500 and a primer layer 600. The primer layer 600 is an organic material, typically a resin material such as modified polyurethane. The material of the primer layer 600 has a molecular structure that can reliably connect with the second optical coating layer 150 and the glass substrate 100.

[0068] The second optical coating layer 500 is disposed between the color-developing layer 400 and the primer layer 600. From the inside out, the housing comprises the color-developing layer 400, the second optical coating layer 500, the primer layer 600, the glass substrate 100, the optical coating layer 200, and the anti-fingerprint layer 300. The second optical coating layer 500 may comprise any one of the nano-thin film materials selected from SiO2, TiO2, Nb2O5, Si3N4, Ta2O5, La2Ti2O7, ZrO2, and Al2O3, or a mixed stack of multiple materials. The housing in this embodiment, by providing a second optical coating layer, exhibits a greater variety of color variations. It should be noted that the terms "first," "second," and "third" in the embodiments of this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features designated as "first," "second," and "third" may explicitly or implicitly include at least one such feature. In the description of the present invention, “a plurality of” means at least two, such as two, three, etc., unless otherwise clearly defined.

[0069] Furthermore, the present invention also provides an electronic device. Figure 10 , Figure 10 FIG1 is a schematic cross-sectional view of an embodiment of an electronic device of the present application, wherein the electronic device in this embodiment may include a display screen 30, a housing 10, and a control circuit board 20. The structure of the housing 10 is as described in the above embodiment.

[0070] Optionally, the display screen 30 cooperates with the housing 10 to form a receiving space 1000, and the control circuit board 20 is disposed in the receiving space 1000. The control circuit board 20 is electrically connected to the display screen 30 and is used to control the operation of the display screen 30. The detailed technical features of other structural components of the electronic device are within the scope of understanding of those skilled in the art and will not be elaborated upon here.

[0071] See also Figure 11 , Figure 11 : This is a schematic block diagram of the structure of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.

[0072] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user proximity signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0073] The electronic device in this embodiment has an optical coating layer on its shell that is designed with a multi-layer stacked structure composed of silicon dioxide, silicon nitride, and silicon oxynitride materials. The overall surface hardness can reach 15GPa to 20GPa, which effectively improves the surface hardness of the glass and enhances the glass's resistance to daily scratches. The minimum reflectivity for visible light of 380nm to 780nm can reach more than 30%.

[0074] The above descriptions are only some embodiments of the present invention and do not limit the scope of protection of the present invention. Any equivalent device or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A housing for an electronic device, characterized in that: The housing comprises: Glass substrate; An optical coating layer is coated on one side surface of the glass substrate, the optical coating layer comprising a base layer, an intermediate layer, and a surface layer sequentially stacked on the surface of the glass substrate; wherein the base layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials, or the base layer comprises a stacked layer of silicon dioxide and silicon nitride materials; the intermediate layer comprises a stacked layer of silicon nitride and silicon oxynitride materials alternating, or the intermediate layer comprises a stacked layer of multiple silicon nitride and silicon oxynitride materials; and the surface layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials; A color development layer is provided on a side of the glass substrate away from the optical coating layer; The second optical coating layer is arranged between the color development layer and the glass substrate.

2. The housing according to claim 1, wherein: The thickness of each material stacking layer in the optical coating layer is within the range of 5-100 nm.

3. The housing according to claim 1, wherein: The total thickness of the bottom layer is between 0.1um and 2um; the total thickness of the middle layer is between 0.2um and 5um; and the total thickness of the surface layer is between 0.1um and 2um.

4. The housing according to claim 1, wherein: The glass substrate is glass with an etched surface, and the optical coating layer is arranged on the etched surface of the glass substrate.

5. The housing according to claim 1, wherein: The silicon dioxide layer in the bottom layer is connected to the glass substrate.

6. The housing according to claim 1, wherein: The silicon dioxide layer in the surface layer is connected to the intermediate layer.

7. The housing according to claim 1, wherein: The housing further includes an anti-fingerprint layer, which is arranged on the surface layer.

8. The housing according to claim 7, wherein: The silicon dioxide layer in the surface layer is connected to the anti-fingerprint layer.

9. The housing according to claim 1, wherein: The second optical coating layer includes any one material layer of SiO2, TiO2, Nb2O5, Si3N4, Ta2O5, La2Ti2O7, ZrO2, Al2O3, or a mixed stacked layer of multiple materials.

10. The housing according to claim 1, wherein: The housing further comprises a primer layer provided on a surface of the glass substrate facing away from the optical coating layer, the primer layer being made of an organic material, and the second optical coating layer being provided between the color development layer and the primer layer.

11. A housing for an electronic device, characterized in that: The housing comprises: Glass substrate; An optical coating layer is coated on one side surface of the glass substrate, the optical coating layer comprising a base layer, an intermediate layer, and a surface layer sequentially stacked on the surface of the glass substrate; wherein the base layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials, or the base layer comprises a stacked layer of silicon dioxide and silicon nitride materials; the intermediate layer comprises a plurality of stacked layers of any one of silicon nitride and silicon oxynitride materials; the surface layer comprises a stacked layer of silicon dioxide, silicon nitride, and silicon oxynitride materials, or the surface layer comprises a stacked layer of any one of silicon nitride and silicon oxynitride and silicon dioxide materials; A color development layer is provided on a side of the glass substrate away from the optical coating layer; The second optical coating layer is arranged between the color development layer and the glass substrate.

12. The housing according to claim 11, wherein: The thickness of each material stacking layer in the optical coating layer is within the range of 5-100nm; the total thickness of the bottom layer is between 0.1um-2um; the total thickness of the middle layer is between 0.2um-5um; and the total thickness of the surface layer is between 0.1um-2um.

13. The housing according to claim 11, wherein: The glass substrate is glass with an etched surface, and the optical coating layer is arranged on the etched surface of the glass substrate.

14. The housing according to claim 11, wherein: The silicon dioxide layer in the surface layer is connected to the intermediate layer.

15. The housing according to claim 11, wherein The housing further includes an anti-fingerprint layer, which is disposed on the surface layer, and the silicon dioxide layer in the surface layer is connected to the anti-fingerprint layer.

16. The housing according to claim 11, wherein The second optical coating layer includes any one material layer of SiO2, TiO2, Nb2O5, Si3N4, Ta2O5, La2Ti2O7, ZrO2, Al2O3, or a mixed stacked layer of multiple materials.

17. An electronic device, characterized in that: The electronic device comprises the housing according to any one of claims 1 to 16.

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