Fin encapsulating machine

Abstract

The application discloses a fin rubber coating machine, wherein the fin rubber coating machine comprises a workbench, a feeding device, a material taking device and a rubber belt packaging device; the feeding device comprises a conveying assembly and a limiting assembly, the conveying assembly is arranged on the workbench, the limiting assembly is arranged on the conveying assembly, the conveying assembly is used for conveying transistors, and the limiting assembly is used for limiting the transistors from separating from the conveying assembly; the material taking device comprises a clamping and taking assembly and a driving assembly, the clamping and taking assembly comprises a first mounting seat and a material taking clamp jaw, the material taking clamp jaw is movably arranged on the first mounting seat, the first mounting seat is connected to the driving assembly, the driving assembly drives the first mounting seat to move on the workbench, and the material taking clamp jaw is moved to the conveying assembly to clamp the transistors; the rubber belt packaging device comprises a rubber belt storage assembly and a packaging platform which are arranged on the workbench, the rubber belt storage assembly is used for storing and outputting the rubber belt, and the packaging platform is used for inputting and outputting the rubber belt. The technical scheme can increase the stability of the transistor packaging equipment on transistor packaging.

Description

Technical Field

[0001] This invention relates to the field of transistor packaging technology, and in particular to a heat sink coating machine. Background Technology

[0002] With the rapid advancement of technology and the increasing prevalence of electronic products in various settings, the demand for transistors is constantly growing. Typically, transistors require individual packaging before being shipped from the warehouse, followed by bulk packing and shipping. This necessitates significant labor costs for packaging transistors before shipment, greatly impacting overall efficiency. Therefore, transistor packaging equipment has emerged that automates packaging before shipment, reducing labor costs and increasing efficiency. However, current transistor packaging equipment uses adhesive tape on both the top and bottom of the transistors for packaging. This can create gaps between the two layers of tape, resulting in lower packaging stability. Summary of the Invention

[0003] The main objective of this invention is to provide a heat sink coating machine, which aims to increase the stability of transistor packaging equipment for transistor packaging.

[0004] To achieve the above objectives, the present invention provides a heat sink coating machine, comprising:

[0005] Workbench;

[0006] A feeding device includes a transport component and a limiting component. The transport component is installed on the worktable, and the limiting component is installed at one end of the transport component. The transport component is used to transport transistors, and the limiting component is used to prevent the transistors from detaching from the transport component.

[0007] A material handling device includes a gripping assembly and a driving assembly. The gripping assembly includes a first mounting base and a gripping jaw. The gripping jaw is movably mounted on the first mounting base, which is connected to the driving assembly. The driving assembly can drive the first mounting base to move on the worktable, so that the gripping jaw moves onto a transport assembly to grip a transistor.

[0008] A tape packaging device includes a tape storage assembly and a packaging platform installed on the workbench. The tape storage assembly is used to store and output tape, and one end of the packaging platform is used to receive tape, while the other end is used to output tape.

[0009] In this process, the material-grabbing claws pick up the transistor and move it to the packaging platform. The packaging platform guides the tape to the transistor and attaches the tape to the outside of the transistor. Then, the material-grabbing claws rotate the transistor to complete the packaging process.

[0010] Optionally, the clamping assembly further includes a drive motor and a first rotating shaft. The drive motor is mounted on the first mounting base, and the first rotating shaft is rotatably inserted into the first mounting base. One end of the first rotating shaft is driven and connected to the drive motor, and the other end is fixed to the material-grabbing jaw. The drive motor drives the first rotating shaft to rotate so as to drive the material-grabbing jaw to rotate circumferentially along the first rotating shaft.

[0011] Optionally, the clamping assembly further includes a first gear and a second gear. The first gear is sleeved on the end of the first rotating shaft away from the material-grabbing claw, and the second gear is sleeved on the drive shaft of the drive motor. The first rotating shaft is located above the drive motor. The first gear meshes with the second gear, and the drive motor drives the second gear to rotate so as to drive the first gear to rotate.

[0012] Optionally, the gripping assembly further includes a first cylinder mounted on the first mounting base. The push rod of the first cylinder is rotatably connected to the first gear. The first cylinder pushes the first gear to move the gripper along the axial direction of the first rotating shaft, so that the gripper can extend to the packaging platform.

[0013] Optionally, the driving assembly includes a second cylinder, a sliding block, and a guide rail. The sliding block is mounted on the first mounting base, and the guide rail is mounted on the worktable. The sliding block and the guide rail are slidably engaged. The second cylinder is fixed to the worktable, and its push rod is connected to the sliding block. The second cylinder is used to push the sliding block to move along the length of the guide rail. Optionally, the transport assembly includes a conveyor belt and a mounting frame. The mounting frame is fixed to the worktable, and the conveyor belt is mounted on the mounting frame. The conveyor belt is used to transport transistors. The limiting assembly includes a baffle, a movable block, a guide post, and an elastic element. The guide post is mounted on the mounting frame near the downstream end of the conveyor belt. The movable block is slidably fitted onto the guide post. The elastic element is fitted onto the guide post and located between the mounting frame and the movable block. The baffle is mounted on the movable block and extends towards the conveyor belt. The baffle is used to extend into the conveyor belt to prevent transistors from flowing out of the conveyor belt. The baffle is movable along the axial direction of the guide post.

[0014] Optionally, the tape storage assembly includes a second mounting base, a second rotating shaft, and a tape conveying shaft. The second rotating shaft is fixed to the second mounting base, and the tape is arranged around the second rotating shaft. The tape conveying shaft is rotatably inserted into the second mounting base and is used to convey the movable end of the tape to the packaging platform.

[0015] Optionally, the packaging platform further includes a guiding assembly. The packaging platform has a passage cavity. The guiding assembly includes multiple guide rollers, a third cylinder, and a pusher. The multiple guide rollers are evenly spaced within the passage cavity. The tape enters above the multiple guide rollers through the inlet of the passage cavity, with the adhesive end of the tape facing downwards. The guide rollers guide the tape to the outlet of the passage cavity. The third cylinder is mounted above the packaging platform, and the push rod of the third cylinder is connected to the pusher to drive the pusher to push the tape onto the transistor.

[0016] Optionally, the packaging platform further includes a lifting assembly, which includes a fourth cylinder and a push block. The upper surface of the push block is a first contact surface, and a boss is provided on the first contact surface. The upper surface of the boss is a second contact surface. The fourth cylinder is installed on the workbench and located below the packaging platform. The push block is installed on the side of the push rod of the fourth cylinder facing the outlet of the passage cavity. The tape extends from the outlet of the passage cavity and falls onto the push block. The tape simultaneously contacts the first contact surface and the second contact surface.

[0017] Optionally, the heat sink coating machine further includes a cutting device, which is installed on the packaging platform. After the transistor is packaged, the cutting device is used to cut the tape located at the outlet of the passage cavity.

[0018] In this invention, the workbench is equipped with a feeding device, a picking device, and a tape packaging device. The feeding device includes a transport component for conveying transistors, a limiting component for limiting the transistors to prevent them from falling off the transport component, and a picking gripper movably mounted on a first mounting base. The picking gripper can move onto the transport component to grip the transistors and then move the transistors to one end of the packaging platform for tape packaging. The packaging method involves attaching one end of the tape to the transistor, and the picking gripper rotating the transistor to wrap the tape around its exterior. Compared to packaging methods that apply tape to the top and bottom of the transistor, this invention's packaging method wraps all sides of the transistor with tape, reducing gaps during packaging and minimizing the possibility of the transistor's packaging falling off, thus increasing the stability of the transistor packaging.

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat sink coating machine of the present invention;

[0021] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0022] Figure 3 for Figure 1 A schematic diagram of the structure of the clamping component and the driving component;

[0023] Figure 4 for Figure 1 Schematic diagram of the structure of the medium tape storage assembly;

[0024] Figure 5 for Figure 1 A schematic diagram of the packaging platform and cutting device.

[0025] Explanation of icon numbers:

[0026]

[0027]

[0028] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0031] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0033] This invention proposes a heat sink coating machine.

[0034] In one embodiment of the present invention, such as Figures 1 to 5 As shown, the heat sink coating machine includes a worktable 10, a feeding device, a picking device, and a tape packaging device. The feeding device includes a transport component 11 and a limiting component 12. The transport component 11 is mounted on the worktable 10, and the limiting component 12 is mounted on one end of the transport component 11. The transport component 11 is used to transport transistors, and the limiting component is used to prevent transistors from detaching from the transport component 11. The picking device includes a clamping component 13 and a driving component 14. The clamping component 13 includes a first mounting base 132 and a picking gripper 131. The picking gripper 131 is movably mounted on the first mounting base 132, and the first mounting base 132 is connected to the driving component 14. The drive assembly 14 can drive the first mounting base 132 to move on the worktable 10, so that the picking gripper 131 moves to the transport assembly 11 to pick up the transistor; the tape packaging device includes a tape storage assembly 15 and a packaging platform 16 installed on the worktable 10. The tape storage assembly 15 is used to store and output tape, and one end of the packaging platform 16 is used to receive tape, and the other end is used to output tape; after the picking gripper 131 picks up the transistor, it moves to the packaging platform 16. The packaging platform 16 guides the tape to the transistor and attaches the tape to the outside of the transistor. Then, the picking gripper 131 rotates the transistor to complete the packaging action.

[0035] In this invention, the workbench 10 is equipped with a feeding device, a picking device, and a tape packaging device. The conveying component 11 in the feeding device is used to transport transistors, and the limiting component 12 is used to limit the transistors to prevent them from falling off the conveying component 11. The picking gripper 131 is movably mounted on the first mounting base 132. The picking gripper 131 can move onto the conveying component 11 to pick up the transistors, and then move the transistors to one end of the packaging platform 16 for tape packaging. The packaging method involves attaching one end of the tape to the transistor, and the picking gripper 131 gripping the transistor and rotating it so that the tape wraps around the outside of the transistor. Compared to packaging methods that apply tape to the top and bottom of the transistor, this invention's packaging method can wrap all sides of the transistor with tape, reducing gaps generated during packaging and minimizing the possibility of the transistor packaging falling off, thus increasing the stability of the transistor packaging.

[0036] In one embodiment, the gripping assembly 13 further includes a drive motor 133 and a first rotating shaft 134. The drive motor 133 is mounted on a first mounting base 132, and the first rotating shaft 134 is rotatably inserted into the first mounting base 132. One end of the first rotating shaft 134 is driven and connected to the drive motor 133, and the other end is fixed to the picking gripper 131. The drive motor 133 drives the first rotating shaft 134 to rotate so as to drive the picking gripper 131 to rotate circumferentially along the first rotating shaft 134.

[0037] Specifically, the drive motor 133 is mounted on the first mounting base 132, and the first rotating shaft 134 is rotatably inserted into the first mounting base 132 and driven by the drive motor 133. The drive motor 133 drives the picking gripper 131 to rotate circumferentially along the first rotating shaft 134. This configuration, by driving the picking gripper 131 to rotate via the drive motor 133, speeds up transistor packaging and increases packaging efficiency. In other embodiments, the specific structure of the gripping assembly 13 can be different, as long as it can drive the picking gripper 131 to rotate.

[0038] In one embodiment, the gripping assembly 13 further includes a first gear 135 and a second gear 136. The first gear 135 is sleeved on the end of the first rotating shaft 134 away from the gripping claw 131, and the second gear 136 is sleeved on the drive shaft of the drive motor 133. The first rotating shaft 134 is located above the drive motor 133. The first gear 135 and the second gear 136 mesh, and the drive motor 133 drives the second gear 136 to rotate so as to drive the first gear 135 to rotate.

[0039] Specifically, the first gear 135 is positioned above the second gear 136 and is fixedly connected to the first rotating shaft 134. The second gear 136 is sleeved on the drive shaft of the drive motor 133, and meshes with the first gear 135. The drive motor 133 drives the second gear 136 to rotate, which in turn drives the first gear 135 to rotate. The first gear 135 then drives the first rotating shaft 134 to rotate, causing the material-picking gripper 131 to rotate. This arrangement allows the drive motor 133 and the first rotating shaft 134 to be installed in an upper and lower arrangement, saving installation space. Furthermore, the gear transmission allows the drive motor 133 to precisely control the rotation angle of the material-picking gripper 131, ensuring that the transistors are not damaged during unloading after packaging. The gear transmission is also more stable, preventing slippage of the material-picking gripper 131. In some other embodiments, the clamping assembly 13 further includes a coupling, one end of which is sleeved on the drive shaft of the drive motor 133, and the other end of which is sleeved on the first rotating shaft 134.

[0040] In one embodiment, the gripping assembly 13 further includes a first cylinder 137, which is mounted on a first mounting base 132. The push rod of the first cylinder 137 is rotatably connected to a first gear 135. The first cylinder 137 pushes the first gear 135 to move the gripper along the axial direction of the first rotating shaft 134, so that the gripper can extend to the packaging platform 16.

[0041] Specifically, a bearing is fitted onto the push rod of the first cylinder 137, and the bearing is embedded in one end of the first gear 135. This means the first cylinder 137 can only be used to push out and pull back the first gear 135 without affecting its rotation. The other end of the first gear 135 is fixedly connected to the first rotating shaft 134. When the first cylinder 137 is retracted, the first gear 135 and the second gear 136 are not meshed. When the first cylinder 137 pushes out the first gear 135, causing it to mesh with the second gear 136, the material-grabbing gripper 131 extends to the packaging platform 16. This design prevents the material-grabbing gripper 131 from rotating before reaching the packaging platform 16, thus avoiding a situation where the gripper 131 cannot directly grasp the transistor due to rotation.

[0042] In one embodiment, the drive assembly 14 includes a second cylinder 141, a sliding block 142, and a guide rail 143. The sliding block 142 is mounted on a first mounting base 132, and the guide rail 143 is mounted on a worktable 10. The sliding block 142 and the guide rail 143 are slidably engaged. The second cylinder 141 is fixed to the worktable 10, and the drive end of the second cylinder 141 is connected to the sliding block 142. The second cylinder 141 is used to push the sliding block 142 to move along the length of the guide rail 143.

[0043] Specifically, the push rod of the second cylinder 141 is connected to the sliding block 142. There are two guide rails 143, both of which are slidably connected to the sliding block 142. The guide rails 143 extend towards the transport assembly 11. The sliding block 142 is connected to the first mounting base 132. The second cylinder 141 drives the sliding block 142 to slide, thereby moving the first mounting base 132 towards the transport assembly 11, so that the picking gripper 131 moves onto the transport assembly 11 to pick up the transistor. This arrangement reduces the sliding friction of the first mounting base 132, making its sliding smoother and shortening the time it takes for the picking gripper 131 to move to the packaging platform 16 after picking up the material. In other embodiments, the drive assembly 14 includes a first motor, a lead screw, and a nut seat. The lead screw is rotatably mounted on the worktable 10, and the nut seat is connected to the lead screw. The first motor is mounted on the worktable to drive the lead screw to rotate, and the nut seat can move along the axial direction of the lead screw. The nut seat is mounted on the first mounting base 132.

[0044] In one embodiment, the transport assembly 11 includes a conveyor belt 111 and a mounting frame 112. The mounting frame 112 is fixed to the worktable 10, and the conveyor belt 111 is mounted on the mounting frame 112. The conveyor belt 111 is used to transport transistors. The limiting assembly 12 includes a baffle 121, a movable block 122, a guide post 123, and an elastic member 124. The guide post 123 is mounted on the end of the mounting frame 112 near the downstream end of the conveyor belt 111. The movable block 122 is slidably sleeved on the guide post 123. The elastic member 124 is sleeved on the guide post 123 and is located between the mounting frame 112 and the movable block 122. The baffle 121 is mounted on the movable block 122 and extends toward the conveyor belt 111. The baffle 121 is used to extend into the conveyor belt 111 to prevent transistors from flowing out of the conveyor belt 111. The baffle 121 is movable along the axial direction of the guide post 123.

[0045] Specifically, the baffle 121 is positioned facing the gripper. When the gripper 131 moves to the transport assembly 11, the limiting assembly 12 is located at the end of the conveyor belt 111 and mounted on the mounting bracket 112. Part of the gripper 131 contacts the baffle 121. When picking up material, the gripper 131 continues to move forward. At this time, the baffle 121 can move away from the gripper 131. After the gripper 131 finishes picking up material, it moves away from the conveyor belt 111, while the baffle 121 and the movable block 122 return to their initial positions. In the initial position, the end of the movable block 122 facing the transistor can prevent the transistor from moving further. This arrangement ensures that after the gripper 131 finishes picking up material, the transistor transported on the conveyor belt 111 will not detach from the conveyor belt 111. In some other embodiments, a fixing plate is provided at the end of the belt 111 to prevent the transistor from detaching from the belt 111. A clearance groove is provided on the belt 111, which is positioned facing the pick-up claw 131. The pick-up claw 131 extends into the clearance groove to pick up the transistor.

[0046] In one embodiment, the tape storage assembly 15 includes a second mounting base 151, a second rotating shaft 152, and a tape conveying shaft 153. The second rotating shaft 152 is fixed to the second mounting base 151, and the tape is arranged around the second rotating shaft 152. The tape conveying shaft 153 is rotatably inserted into the second mounting base 151 and is used to convey the movable end of the tape to the packaging platform 16.

[0047] Specifically, the tape storage assembly 15 also includes a carrier reel 155, which is rotatably mounted on the second rotating shaft 152. The tape is arranged around the carrier reel 155, and the movable end of the tape extends from the carrier reel 155 above the tape conveyor shaft 153. The tape storage assembly 15 also includes a second motor 156 mounted on the second mounting base 151. The second motor 156 is driven by the tape conveyor shaft 153, which rotates to power the tape and convey it outward to the packaging platform 16 for application. This arrangement ensures that the tape can be conveyed to the packaging platform 16 more quickly, and the continuous rotation of the tape conveyor shaft 153 provides a large frictional force, making it less likely for the tape to fall off the tape conveyor shaft 153. In some other embodiments, the second rotating shaft 152 is rotatably mounted on the second mounting base 151, the second motor 156 is driven and connected to the second rotating shaft 152, the carrier tape reel 155 is sleeved on the second rotating shaft 152 and fixedly connected to the second rotating shaft 152, the tape conveying shaft 153 is rotatably mounted on the second mounting shaft, and the second rotating shaft 152 drives the carrier tape reel 155 to rotate so that the movable end of the tape extends out and passes through the tape conveying shaft 153 and is conveyed to the packaging platform 16.

[0048] Furthermore, in this embodiment, a tensioning shaft 154 is also provided. The tensioning shaft 154 can move along the vertical direction of the second mounting base 151. The movable end of the tape rolls with the tensioning shaft 154 after passing through the tape conveyor shaft 153. The tape is output to the packaging platform 16 below the tensioning shaft 154. The tensioning shaft 154 adjusts its vertical position to adjust the tension of the tape.

[0049] In one embodiment, the packaging platform 16 further includes a guide assembly 161. The packaging platform 16 has a passage cavity. The guide assembly 161 includes a plurality of guide rollers 1611, a third cylinder 1612, and a pusher 1613. The plurality of guide rollers 1611 are evenly spaced in the passage cavity. The tape enters above the plurality of guide rollers 1611 through the inlet of the passage cavity, with the adhesive end of the tape facing downward. The guide rollers 1611 are used to guide the tape to the outlet of the passage cavity. The third cylinder 1612 is mounted above the packaging platform 16. The push rod of the third cylinder 1612 is connected to the pusher 1613 to drive the pusher 1613 to push the tape onto the transistor.

[0050] Specifically, multiple guide rollers 1611 are provided within the packaging platform 16, arranged side by side. In this embodiment, there are three guide rollers 1611. The adhesive tape moves through the gap between the three guide rollers and the inner top wall of the packaging platform 16. After the guide rollers 1611 guide the adhesive tape to the outlet of the passage cavity, the adhesive tape cannot be directly adhered to the transistor. Above the packaging platform 16, a third cylinder 1612 pushes a pusher 1613. The pusher 1613 contacts the upper surface of the adhesive tape to push the movable end of the adhesive tape onto the transistor located outside the packaging platform 16. This arrangement ensures the stability of the adhesive and prevents the adhesive tape from failing to adhere to the transistor.

[0051] Furthermore, an adjustment device 155 is provided below the tape storage assembly 15. The adjustment device 155 is used to adjust the position of the second mounting base 151, thereby ensuring that the tape conveyed by the carrier tape 155 is flush with the tape entering the passage cavity, so as to prevent the tape from wrinkling and becoming unusable.

[0052] In one embodiment, the packaging platform 16 further includes a lifting assembly 162, which includes a fourth cylinder 1621 and a push block 1622. The upper surface of the push block 1622 is a first contact surface, and a boss 1623 is provided on the first contact surface. The upper surface of the boss 1623 is a second contact surface. The fourth cylinder 1621 is installed on the workbench 10 and located below the packaging platform 16. The push block 1622 is installed on the side of the push rod of the fourth cylinder 1621 facing the outlet of the passage cavity. The tape extends out from the outlet of the passage cavity and falls onto the push block 1622. The tape simultaneously contacts the first contact surface and the second contact surface.

[0053] Specifically, the pusher block 1622 is located directly below the outlet of the passage cavity. After the movable end of the tape extends out of the outlet of the passage cavity, the fourth cylinder 1621 pushes the pusher block 1622 upward, so that the pusher block 1622 approaches the upper end of the packaging platform 16. The first contact surface and the second contact surface are flat. At this time, the first contact surface and the second contact surface of the pusher block 1622 form a gap with the inner top wall of the packaging platform 16. The protrusion 1623 on the first contact surface further pushes up the movable end of the tape. The tape is located within this gap, and the movable end of the tape faces obliquely upward away from the passage cavity. With this configuration, the pusher block 1622 can provide an upward force to the tape to resist the weight of the tape, preventing the tape from drooping after extending out of the passage cavity, which would make it difficult for the adhesive end of the tape to be directly attached to the transistor, affecting the smoothness of transistor packaging. In some other embodiments, a protrusion 1623 is provided on the first contact surface. This protrusion 1623 has a first inclined surface, and the tape can extend along the first inclined surface.

[0054] In one embodiment, the heat sink wrapping machine further includes a cutting device 17, which is mounted on the packaging platform 16. After the transistor is packaged, the cutting device 17 is used to cut the tape located at the outlet of the passage cavity.

[0055] Specifically, the cutting device 17 includes a cutting component 173, a first clamping plate 171, and a second clamping plate 172. After the transistor is packaged, the first clamping plate 171 and the second clamping plate 172 can hold the transistor. At this time, the jaws are released, and the cutting component 173 moves from top to bottom to cut the tape on the transistor. This configuration ensures that after the transistor is packaged with tape, the first clamping plate 171 and the second clamping plate 172 can clamp the tape, further increasing the adhesion stability of the tape. In other embodiments, the cutting device 17 can also have other structures, as long as it can effectively cut the tape and clamp the workpiece.

[0056] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat sink coating machine, characterized in that, include: Workbench; A feeding device includes a transport component and a limiting component. The transport component is mounted on the worktable, and the limiting component is mounted on one end of the transport component. The transport component is used to transport transistors, and the limiting component is used to prevent the transistors from detaching from the transport component. A material handling device includes a gripping assembly and a driving assembly. The gripping assembly includes a first mounting base and a material handling jaw. The material handling jaw is movably mounted on the first mounting base. The first mounting base is connected to the driving assembly. The driving assembly can drive the first mounting base to move on the worktable so that the material handling jaw moves onto the transport assembly to grip the transistor. as well as A tape packaging device includes a tape storage assembly and a packaging platform installed on the workbench. The tape storage assembly is used to store and output tape, and one end of the packaging platform is used to receive tape, while the other end is used to output tape. In this process, the material-grabbing claws pick up the transistor and move it to the packaging platform. The packaging platform guides the tape to the transistor and attaches the tape to the outside of the transistor. Then, the material-grabbing claws rotate the transistor to complete the packaging process. The gripping assembly further includes a drive motor and a first rotating shaft. The drive motor is mounted on the first mounting base, and the first rotating shaft is rotatably inserted into the first mounting base. One end of the first rotating shaft is driven and connected to the drive motor, and the other end is fixed to the material gripper. The drive motor drives the first rotating shaft to rotate so that the material gripper rotates circumferentially along the first rotating shaft.

2. The heat sink coating machine as described in claim 1, characterized in that, The clamping assembly further includes a first gear and a second gear. The first gear is sleeved on the end of the first rotating shaft away from the material-grabbing claw, and the second gear is sleeved on the drive shaft of the drive motor. The first rotating shaft is located above the drive motor. The first gear meshes with the second gear, and the drive motor drives the second gear to rotate so as to drive the first gear to rotate.

3. The heat sink coating machine as described in claim 2, characterized in that, The gripping assembly further includes a first cylinder mounted on the first mounting base. The push rod of the first cylinder is rotatably connected to the first gear. The first cylinder pushes the first gear to move, causing the gripper to move axially along the first rotating shaft, so that the gripper can extend to the packaging platform.

4. The heat sink coating machine as described in claim 1, characterized in that, The drive assembly includes a second cylinder, a sliding block, and a guide rail. The sliding block is mounted on the first mounting base, and the guide rail is mounted on the worktable. The sliding block and the guide rail are slidably engaged. The second cylinder is fixed to the worktable, and the push rod of the second cylinder is connected to the sliding block. The second cylinder is used to push the sliding block to move along the length of the guide rail.

5. The heat sink coating machine as described in claim 1, characterized in that, The transport assembly includes a conveyor belt and a mounting frame. The mounting frame is fixed to the worktable, and the conveyor belt is mounted on the mounting frame. The conveyor belt is used to transport transistors. The limiting assembly includes a baffle, a movable block, a guide post, and an elastic element. The guide post is mounted on the end of the mounting frame near the downstream end of the conveyor belt. The movable block is slidably fitted onto the guide post. The elastic element is fitted onto the guide post and located between the mounting frame and the movable block. The baffle is mounted on the movable block and extends toward the conveyor belt. The baffle is used to extend into the conveyor belt to prevent transistors from flowing out of the conveyor belt. The baffle is movable along the axial direction of the guide post.

6. The heat sink coating machine as described in claim 1, characterized in that, The tape storage assembly includes a second mounting base, a second rotating shaft, and a tape conveying shaft. The second rotating shaft is fixed to the second mounting base, and the tape is arranged around the second rotating shaft. The tape conveying shaft is rotatably inserted into the second mounting base and is used to convey the movable end of the tape to the packaging platform.

7. The heat sink coating machine according to any one of claims 1 to 6, characterized in that, The packaging platform also includes a guiding assembly. The packaging platform has a passage cavity. The guiding assembly includes multiple guide rollers, a third cylinder, and a pusher. The multiple guide rollers are evenly spaced within the passage cavity. The tape enters above the multiple guide rollers through the inlet of the passage cavity, with the adhesive end of the tape facing downwards. The guide rollers guide the tape to the outlet of the passage cavity. The third cylinder is mounted above the packaging platform, and the push rod of the third cylinder is connected to the pusher to drive the pusher to push the tape onto the transistor.

8. The heat sink coating machine as described in claim 7, characterized in that, The packaging platform also includes a lifting assembly, which includes a fourth cylinder and a push block. The upper surface of the push block is a first contact surface, and a boss is provided on the first contact surface. The upper surface of the boss is a second contact surface. The fourth cylinder is installed on the workbench and located below the packaging platform. The push block is installed on the side of the push rod of the fourth cylinder facing the outlet of the passage cavity. The tape extends from the outlet of the passage cavity and falls onto the push block. The tape simultaneously contacts the first contact surface and the second contact surface.

9. The heat sink coating machine as described in claim 8, characterized in that, The heat sink coating machine also includes a cutting device, which is installed on the packaging platform. After the transistor is packaged, the cutting device is used to cut the tape located at the outlet of the passage cavity.

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