A method for testing the uniformity of a DCB copper clad ceramic substrate film pressing

Abstract

The application discloses a method for testing the uniformity of film pressing of a DCB copper-clad ceramic substrate, and specifically comprises the following steps: first, a section of empty film is pressed; after bonding, the speed of the resin film is reduced to 0 and stays for 25-35 seconds, and the resin film is pressed and heated on a hot pressing wheel to form a pressing mark area; whether the film pressing is uniform is determined by measuring and observing the pressing mark of the pressing mark area, so that the copper surface of the copper-clad ceramic substrate semi-finished product and the film are well bonded and attached. Before formal production, the uniformity of the empty film is detected, and after the detection is qualified, the attachment production is carried out, so that the resin film and the copper surface are uniformly pressed, the film layer air bubbles, wrinkled film and film peeling-off caused defects such as attached product paste board and incomplete pattern are reduced, and the production yield is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of DCB substrate manufacturing, and relates to the application of a DCB substrate. BACKGROUND

[0002] Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by using DCB (Direct Copper Bond) technology to sinter copper foil directly on the surface of ceramic. In the production process of the existing copper-clad ceramic substrate, the sintered copper-clad ceramic semi-finished product is treated with a liquid medicine on the surface, and then a resin film is attached to the copper surface by using a film pressing machine. The film attachment uniformity is affected by the non-parallelism of the upper and lower pressing wheels of the film pressing machine, the surface wear and unevenness of the pressing wheels. At present, there is no film attachment uniformity detection method in actual production, so the manufacturers directly attach the film for production instead of detecting first and then producing, so that the uniformity of the resin film and the copper surface cannot be guaranteed, which leads to the occurrence of certain gaps between the resin film and the copper, or the undesirable adhesion of the resin film, and the occurrence of film layer bubbles, wrinkled film and film peeling after attachment, thereby causing the attached products to be defective, such as paste board and incomplete pattern, resulting in product rework or scrap. SUMMARY

[0003] The application provides a method for testing the film pressing uniformity of a DCB copper-clad ceramic substrate. Before formal production, the empty film attachment uniformity is detected, and the production is attached after the detection is qualified, so as to guarantee the uniformity of the resin film and the copper surface, reduce the defects of the attached products caused by film layer bubbles, wrinkled film and film peeling, and improve the production yield.

[0004] The technical scheme of the application is as follows:

[0005] First, a section of empty film is pressed, the resin film is stopped for 25-35 seconds at a speed of 0 after being combined, and is pressed and heated on the hot pressing wheel to form a pressing mark area;

[0006] The pressing mark area is measured and observed to determine whether the film pressing is uniform, so as to guarantee the good combination and adhesion of the copper surface of the copper-clad ceramic substrate semi-finished product and the film.

[0007] Further, the specific steps are as follows:

[0008] Step one, set the film pressing machine parameters;

[0009] Step two, operation steps;

[0010] 1) Before film attachment, adjust the resin film without wrinkles, and align the upper and lower films;

[0011] 2) resin film conveying: hot press wheel pressure and conveying the upper and lower film combined;

[0012] 3) speed reduction: after conveying the resin film out 10-20 cm, the conveying speed is reduced to 0 m / min, and stays for 25-35 s to form a 7±2 mm indentation area, and then the resin film with indentation area is conveyed out at a higher speed;

[0013] 4) indentation area observation: whether the indentation area is flat and clean, without bubbles;

[0014] 5) measurement: using measuring tools to measure the width and thickness uniformity of the indentation area;

[0015] (a) width uniformity, measuring the indentation area width with a vernier caliper, the width difference of the left, middle and right indentation areas should not be greater than 1 mm;

[0016] (b) thickness uniformity, measuring the indentation area thickness with a micrometer, the thickness difference of the left, middle and right resin film should not be greater than 0.1 mm;

[0017] Step three, if the measured width uniformity and thickness uniformity in step two do not meet the requirements, return to step one to reset the film press parameters until the measured width uniformity and thickness uniformity in step two meet the requirements;

[0018] Step four, formal film pasting production.

[0019] Further, the film press parameters in step one include conveying speed, hot press wheel temperature and roller pressure.

[0020] Further, the conveying speed is 3±0.5 m / min, the hot press wheel temperature is 115±5℃, and the roller pressure is 4±0.5 kg / cm 2 .

[0021] Further, in step two, the speed is reduced: after conveying the resin film out 15 cm, the conveying speed is reduced to 0 m / min, and stays for 30 s to form a 7±2 mm indentation area, and then the resin film with indentation area is conveyed out at a higher speed.

[0022] The beneficial effects of the present application are: by measuring the width difference of the indentation area and the thickness difference of the pasted film on the empty film to ensure the uniformity of the resin film and the copper surface of the copper-clad ceramic substrate semi-finished product.

[0023] Solve the problems of air bubbles, wrinkled film, film peeling, incomplete pattern, and paste board caused by uneven film pressing in subsequent production. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of film pressing.

[0025] In the figure: 1 is PE roller, 2 is dry film wheel, 3 is film separating wheel, 4 is hot pressing wheel, 5 is combined film, 6 is combined area, 7 is indentation area. DETAILED DESCRIPTION

[0026] The application is further described below in combination with the drawings.

[0027] A method for testing the uniformity of DCB copper-clad ceramic substrate film pressing, the design steps are:

[0028] 1. Film press parameter setting:

[0029] A. Conveying speed: 3±0.5 m / min

[0030] B. Hot pressing wheel temperature: 115±5℃

[0031] C. Roller pressure: 4±0.5 kg / cm 2

[0032] See Figure 1 .

[0033] 2. Operation steps:

[0034] 1) Adjust before film sticking:

[0035] The resin film has no wrinkles, and the upper and lower films are aligned.

[0036] 2) Resin film conveying:

[0037] The hot pressing wheel presses and conveys to combine the upper and lower films, and the conveying speed is 3 m / min.

[0038] 3) Speed reduction:

[0039] After the resin film is conveyed out by 15 cm, the conveying speed is reduced to 0 m / min, and stays for 30 s to form a 7±2 mm indentation area, and then the speed is increased to 3 m / min to convey the resin film with the indentation area out.

[0040] 4) Indentation area observation:

[0041] Whether the indentation area is flat and clean without bubbles.

[0042] 5) Measurement:

[0043] Use measuring tools to measure the width and thickness uniformity of the indentation area.

[0044] a) Width uniformity, use a vernier caliper to measure the indentation area width, the width difference of the left, middle and right indentation areas should not be greater than 1 mm.

[0045] b) Thickness uniformity, use a micrometer to measure the indentation area thickness, the thickness difference of the left, middle and right resin films should not be greater than 0.1 mm.

[0046] 3. Formal film pasting production:

[0047] After the width and thickness difference of the resin film indentation area is detected to be qualified, formal film pasting production can be entered.

[0048] Through the film pasting uniformity detection of the empty film, after the detection is qualified, the pasting production is carried out, the uniformity of the resin film and the copper surface pressing film can be ensured, the film layer air bubble, wrinkled film, film falling off and other defects caused by the pasting product paste board, incomplete pattern and other defects are reduced, and the product yield is improved.

[0049] The above only describes the preferred embodiments of the present application, and it should be noted that for ordinary skilled persons in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should be considered as the protection scope of the present application.

Claims

1. A method for testing the film pressing uniformity of a DCB copper clad ceramic substrate, characterized in that, The specific steps are as follows: First, a section of the film is pressed, the resin film is combined and the speed is reduced to 0 for 25-35s, and the pressure and heat are formed on the hot roller to form the indentation area; By measuring and observing the indentation of the indentation area, it is determined whether the film is uniform, thereby ensuring that the copper surface of the copper ceramic substrate semi-finished product is well combined and attached to the film; The specific steps are as follows: Step one, set the film pressing machine parameters; Step two, operation steps; 1) Adjust before sticking the film: the resin film has no wrinkles, and the upper and lower films are aligned; 2) Resin film conveying: the hot roller presses and conveys to combine the upper and lower films; 3) Reduce the speed: after the resin film is conveyed out for 10-20cm, the conveying speed is reduced to 0m / min, and the film is stopped for 25-35s to form a 7±2mm indentation area, and then the speed is increased to convey the resin film with the indentation area out; 4) Indentation area observation: whether the indentation area is flat and clean, and whether there are bubbles; 5) Measurement: use measuring tools to measure the width and thickness uniformity of the indentation area; (a) Width uniformity: use a vernier caliper to measure the width of the indentation area, and the difference in the width of the indentation area at left, center and right should not be greater than 1mm; (b) Thickness uniformity: use a micrometer to measure the thickness of the indentation area, and the difference in the thickness of the resin film at left, center and right should not be greater than 0.1mm; Step three, if the width uniformity and thickness uniformity measured in step two do not meet the requirements, return to step one to reset the film pressing machine parameters until the width uniformity and thickness uniformity measured in step two meet the requirements; Step four, formal film sticking production.

2. The method for testing the film pressing uniformity of a DCB copper-clad ceramic substrate according to claim 1, wherein, The film pressing machine parameters in step one include conveying speed, hot roller temperature and roller pressure.

3. The method for testing the film pressing uniformity of a DCB copper-clad ceramic substrate according to claim 2, wherein, The conveying speed is 3±0.5 m / min, the hot press wheel temperature is 115±5℃, and the roller pressure is 4±0.5 kg / cm 2 .

4. The method for testing the film pressing uniformity of a DCB copper-clad ceramic substrate according to claim 1, wherein, In step two, reduce the speed: after the resin film is conveyed out for 15cm, the conveying speed is reduced to 0m / min, and the film is stopped for 30s to form a 7±2mm indentation area, and then the speed is increased to convey the resin film with the indentation area out.

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