Silicon wafer packaging method and silicon wafer packaging system
By placing protective layers on both sides of the silicon wafer in the thickness direction and binding them with cable ties, the problems of breakage and missing corners caused by misalignment during silicon wafer transportation were solved, thus improving the yield of silicon wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU ZHONGWEI PHOTOELECTRIC TECH CO LTD
- Filing Date
- 2023-06-14
- Publication Date
- 2026-07-10
AI Technical Summary
During silicon wafer transportation, the air cushion effect caused by stacking can lead to misalignment of the silicon wafers, generating stress, which can cause the silicon wafers to break and have missing corners, affecting the yield.
A first protective layer and a second protective layer are placed on both sides of the silicon wafer in the thickness direction, and then tied together with cable ties to form a stable stacked assembly. The assembly is then plastic-sealed and finally packed into a box.
This effectively avoids stress caused by misalignment of silicon wafers during transportation, improves the yield of silicon wafers, and provides additional protection, reducing breakage and corner defects.
Smart Images
Figure CN116674800B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of solar cell manufacturing technology, and more specifically to a silicon wafer packaging method and a silicon wafer packaging system. Background Technology
[0002] Because silicon wafers are fragile, they need to be packaged during transportation to prevent damage. In related technologies, multiple silicon wafers are often stacked together to form a stack, which is then encapsulated in plastic. During the stacking process, an air cushion effect exists between the newly placed wafers, causing misalignment between the upper and lower layers. When the stack is encapsulated, stress is generated between these misaligned wafers, leading to problems such as breakage and chipped corners, severely impacting the yield rate. Summary of the Invention
[0003] The present invention aims to at least partially solve one of the technical problems in the related art.
[0004] Therefore, embodiments of the present invention provide a silicon wafer packaging method comprising the following steps:
[0005] Step S1: Place a first protective layer and a second protective layer on both sides of a stack of silicon wafers in the thickness direction to form a stacked assembly;
[0006] Step S2: Bundle the stacked components with cable ties to form silicon wafer bundles;
[0007] Step S3: The silicon wafer bundle is encapsulated to form encapsulated silicon wafers;
[0008] Step S4: Pack the encapsulated silicon wafer into a packaging box.
[0009] In some embodiments, the silicon wafer packaging method further includes:
[0010] Before placing the first protective layer and the second protective layer on both sides of the stack of silicon wafers in the thickness direction, the stack of silicon wafers is first inspected.
[0011] When the test result of the stack of silicon wafers is unqualified, the stack of silicon wafers is removed; when the test result of the stack of silicon wafers is qualified, the first protective layer and the second protective layer are respectively placed on both sides of the stack of silicon wafers in the thickness direction.
[0012] In some embodiments, when inspecting the stack of silicon wafers, the corners of the stack of silicon wafers are inspected first, and then the sides of the stack of silicon wafers are inspected; and / or, the stack of silicon wafers is straightened before inspection.
[0013] In some embodiments, step S1 includes:
[0014] Step S11: Place the first protective layer on the turntable;
[0015] Step S12: The turntable rotates to the next station and places the silicon wafer on the first protective layer at that station;
[0016] Step S13: The turntable rotates to the next station, and the second protective layer is placed on the stack of silicon wafers at this station to obtain the stacked assembly.
[0017] In some embodiments, step S2 includes:
[0018] Step S21: Place the stacked assembly on two spaced-apart conveying assemblies, so that the middle part of the stacked assembly is suspended.
[0019] Step S12: Use cable ties to bundle the suspended portion of the stacked assembly to form the silicon wafer bundle;
[0020] Step S13: The two conveying components are activated to convey the silicon wafer bundle downstream.
[0021] In some embodiments, step S3 includes:
[0022] Step S31: Cover the outside of the silicon wafer bundle with heat-shrink film;
[0023] Step S32: Seal the edges of the heat-shrink film;
[0024] Step S33: Thermoplasticize the heat-shrink film.
[0025] In some embodiments, step S3 further includes:
[0026] Step S34: Affix a label to the surface of the heat-shrinkable film after heat shrinking to mark the encapsulated silicon wafer.
[0027] In some embodiments, the silicon wafer packaging method further includes:
[0028] Before packing the encapsulated silicon wafer into the packaging box, the heat-shrinkable film is laser-cut to create continuous holes in the film, so that the heat-shrinkable film can be unpacked.
[0029] In some embodiments, step S4 includes:
[0030] The encapsulated silicon wafer is packed into a packaging box with multiple placement slots, wherein the size of the placement slots is adapted to the size of the encapsulated silicon wafer.
[0031] Embodiments of the present invention also propose a silicon wafer packaging system.
[0032] The silicon wafer packaging system of this invention is used to implement the silicon wafer packaging method described in any of the above embodiments. The silicon wafer packaging system of this invention includes a silicon wafer sorting device, a sealing device, and a boxing device. The silicon wafer sorting device is used to place a first protective layer and a second protective layer on both sides of the thickness direction of the stack of silicon wafers, and to bundle the stacked components with cable ties. The sealing device is used to seal the silicon wafer bundles. The boxing device is used to pack the sealed silicon wafers into a packaging box.
[0033] The silicon wafer packaging method of this invention involves first placing a first protective layer and a second protective layer on both sides of a stack of silicon wafers along their thickness direction, and then bundling the stacked assembly with cable ties to form a stable whole with the silicon wafers, the first protective layer, and the second protective layer. Next, the silicon wafer bundle is plastic-sealed. Finally, the plastic-sealed silicon wafers are placed into a packaging box. Because the stacked silicon wafers are secured with cable ties before plastic sealing, any two silicon wafers in the same stack remain relatively fixed. Therefore, during plastic sealing, misalignment between the silicon wafers can be effectively avoided, thus preventing problems such as breakage and chipped corners caused by stress due to misalignment, and greatly improving the yield of silicon wafers. Attached Figure Description
[0034] Figure 1 This is a flowchart of a silicon wafer packaging method according to an embodiment of the present invention.
[0035] Figure 2 This is a simplified diagram of a silicon wafer packaging system according to an embodiment of the present invention.
[0036] Attached image labels:
[0037] 100. Silicon wafer packaging system;
[0038] 10. Silicon wafer handling equipment; 101. First frame;
[0039] 1. Turntable; 11. Turntable body; 12. Supporting part;
[0040] 2. Belt-tying equipment;
[0041] 3. First feeding assembly; 31. First feeding section;
[0042] 4. Second feeding assembly; 41. Second feeding section;
[0043] 5. Silicon wafer clamping device;
[0044] 6. Detection device;
[0045] 7. Translation guide rail;
[0046] 8. First conveying assembly;
[0047] 9. Second conveying assembly;
[0048] 20. Sealing equipment; 2001. Second frame;
[0049] 201. Sealing and cutting machine;
[0050] 202. Thermoplasticizing machine;
[0051] 203. Labeling machine;
[0052] 30. Packing equipment; 3001. Third rack;
[0053] 301. Laser cutting machine;
[0054] 302. Packing robot;
[0055] 303. Packaging boxes;
[0056] 304. Container conveyor assembly;
[0057] 305. Cache rack. Detailed Implementation
[0058] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0059] like Figure 1 and Figure 2 As shown, the silicon wafer packaging method of this invention includes the following steps:
[0060] Step S1: Place a first protective layer and a second protective layer on both sides of a stack of silicon wafers in the thickness direction to form a stacked assembly;
[0061] Step S2: Bundle the stacked components with cable ties to form silicon wafer bundles;
[0062] Step S3: Encapsulate the silicon wafer bundles to form encapsulated silicon wafers;
[0063] Step S4: Pack the preset number of encapsulated silicon wafers into the packaging box 303 according to the preset arrangement.
[0064] The silicon wafer packaging method of this invention involves first placing a first protective layer and a second protective layer on both sides of a stack of silicon wafers along their thickness direction, and then bundling the stacked assembly with cable ties to form a stable whole with the silicon wafers, the first protective layer, and the second protective layer. Next, the silicon wafer bundle is plastic-sealed. Finally, the plastic-sealed silicon wafers are placed into a packaging box. Because the stacked silicon wafers are secured with cable ties before plastic sealing, any two silicon wafers in the same stack remain relatively fixed. Therefore, during plastic sealing, misalignment between the silicon wafers can be effectively avoided, thus preventing problems such as breakage and chipped corners caused by stress due to misalignment, significantly improving the yield rate of the silicon wafers. Furthermore, the first and second protective layers provide good protection for the silicon wafers at both ends, further improving the yield rate.
[0065] Optionally, the first and second protective layers can be foam layers, coated paper, or corrugated paper, etc.
[0066] Optionally, the stacked components are bundled together with cable ties using the strapping device 2.
[0067] Optionally, step S1 includes:
[0068] Step S11: Place the first protective layer on turntable 1;
[0069] Step S12: Turntable 1 rotates to the next station and places the silicon wafer on the first protective layer at that station;
[0070] Step S13: Turntable 1 rotates to the next station and places the second protective layer on the silicon wafer at that station to obtain the stacked assembly.
[0071] For example, such as Figure 2 As shown, the silicon wafer packaging system 100 includes a turntable 1, which includes a turntable body 11 and four support portions 12, which are arranged circumferentially around the turntable body 11. During the rotation of the turntable body 11, each support portion 12 can switch between a first feeding position, a silicon wafer feeding position, a second feeding position, and a silicon wafer picking position, with the four support portions 12 respectively located at the first feeding position, the second feeding position, and the silicon wafer picking position. When a support portion 12 rotates to the first feeding position, a first protective layer is placed on it; then, the support portion 12 rotates to the silicon wafer feeding position, placing a stack of silicon wafers arranged in layers on the first protective layer; subsequently, the support portion 12 rotates to the second feeding position, placing a second protective layer on the stack of silicon wafers to form a stacked assembly; finally, the support portion 12 rotates to the silicon wafer picking position, transferring the stacked assembly from the turntable 1. By forming stacked components in the above manner, the silicon wafer transfer process can be reduced, thereby further reducing the risk of misalignment between silicon wafers and improving the yield of silicon wafers.
[0072] The turntable body 11 may also have only one support part 12, which can switch between a first feeding position, a silicon wafer feeding position, a second feeding position, and a silicon wafer picking position. Alternatively, the support part 12 may switch only between the first feeding position, the silicon wafer feeding position, and the second feeding position. In this case, at the second feeding position, after the second protective layer is placed on the stack of silicon wafers, the stacked assembly is transferred out of the turntable 1.
[0073] Optionally, each support portion 12 includes a support plate and multiple baffles. The support plate is used to support the first flexible layer, the second flexible layer, and the silicon wafer. The multiple baffles are spaced apart circumferentially along the support plate, and the space enclosed by the multiple baffles and the support plate matches the size of the silicon wafer. Thus, when the silicon wafer is placed on the support portion 12, the support portion 12 can be used to straighten the silicon wafer, so that a stack of silicon wafers is neatly arranged.
[0074] Optionally, such as Figure 2 As shown, a first feeding component 3 and a second feeding component 4 are respectively provided on opposite sides of the turntable 1. The first feeding component 3 is used to raise the first protective layer, and the second feeding component 4 is used to provide the second protective layer.
[0075] For example, the first feeding assembly 3 includes two first feeding sections 31, each used to place a first protective layer. Each first feeding section 31 can move between a first feeding position and a first clearance position, and when one first feeding section 31 is in the first feeding position, the other first feeding section 31 is in the first clearance position. The first protective layer can be grabbed from the first feeding section 31 in the first feeding position, and the first protective layer can be added to the first feeding section 31 in the first clearance position as a backup, achieving one for backup and one for use. The second feeding assembly 4 includes two second feeding sections 41, each used to place a second protective layer. Each second feeding section 41 can move between a second feeding position and a second clearance position, and when one second feeding section 41 is in the second feeding position, the other second feeding section 41 is in the second clearance position. The second protective layer can be grabbed from the second feeding section 41 at the second feeding position, and a second protective layer can be added to the second feeding section 41 at the second clearance position as a backup, so as to achieve one backup and one use.
[0076] This will help to further improve the packaging efficiency of silicon wafers.
[0077] Optionally, the silicon wafer packaging system 100 includes a first robotic arm, a second robotic arm, a third robotic arm, and a fourth robotic arm. The first robotic arm is used to place the first protective layer of the first loading section 31 onto the support section 12; the second robotic arm is used to place the second protective layer of the second loading section 41 onto the support section 12; the third robotic arm is used to place a stack of silicon wafers onto the support section 12; and the third robotic arm is used to remove the stacked components on the support section 12.
[0078] In some embodiments, the silicon wafer packaging method further includes:
[0079] Before placing the first protective layer and the second protective layer on both sides of a stack of silicon wafers in the thickness direction, the stack of silicon wafers is first inspected.
[0080] When the test result of the stack of silicon wafers is unqualified, the stack of silicon wafers is removed; when the test result of the stack of silicon wafers is qualified, a first protective layer and a second protective layer are respectively placed on both sides of the stack of silicon wafers in the thickness direction.
[0081] In other words, before packaging a stack of silicon wafers, the integrity of the wafers is checked. If the integrity of the stack of silicon wafers is problematic (unqualified), the stack of silicon wafers is removed and not packaged. Only when the integrity of the stack of silicon wafers meets the requirements (qualified) is the stack of silicon wafers packaged.
[0082] Therefore, on the one hand, it can avoid packaging substandard silicon wafers, thus avoiding waste of packaging materials; on the other hand, it can further improve the yield rate of silicon wafers.
[0083] Optionally, such as Figure 2 As shown, the stack of silicon wafers is inspected using inspection device 6. Inspection device 6 can be a camera.
[0084] Optionally, when inspecting the stack of silicon wafers, the corners of the stack of silicon wafers are inspected first, and then the sides of the stack of silicon wafers are inspected.
[0085] Understandably, the corners of silicon wafers are more prone to damage than their sides. By inspecting the corners first, and detecting any missing corners, the entire stack of wafers can be deemed unqualified, eliminating the need to inspect the sides. This improves wafer inspection efficiency and, consequently, wafer packaging efficiency.
[0086] Optionally, the stack of silicon wafers can be straightened before inspection. In other words, the stack of silicon wafers can be arranged neatly before inspection.
[0087] Therefore, when inspecting a stack of silicon wafers, the same corner and the same side of the same stack can be inspected simultaneously, which helps to further improve the inspection efficiency of silicon wafers, and thus further improve the packaging efficiency of silicon wafers.
[0088] For example, such as Figure 2As shown, a silicon wafer clamping device 5 is used to straighten a stack of silicon wafers. The silicon wafer clamping device 5 includes a base, a support member, and multiple limiting members. The support member is disposed on the base and has a support surface for supporting the silicon wafers. Multiple limiting members are spaced apart circumferentially along the support member. Each limiting member has a limiting surface facing the support member and is movably connected to the base between a clamping position and a released position. Specifically, in the clamping position, the limiting surfaces of the multiple limiting members abut against the side of the silicon wafer; in the released position, the limiting surfaces of the multiple limiting members move away from the silicon wafer.
[0089] A stack of silicon wafers is placed on the support surface of the support member. Then, the limiting members move to the clamping position, and the limiting surfaces of multiple limiting members abut against the sides of the silicon wafers, thereby aligning the silicon wafers on the silicon wafer clamping device 5 and ensuring that the silicon wafers placed on the silicon wafer clamping device 5 are neatly arranged. Afterward, the limiting members move to the releasing position, at which point the stack of silicon wafers on the silicon wafer clamping device 5 can be removed using a packing robot.
[0090] Optionally, the silicon wafer clamping device 5 can rotate about a center line and translate relative to the turntable 1. For example, as Figure 2 As shown, the silicon wafer clamping device 5 can move along the translation guide rail 7 to switch between an avoidance position and a detection position. The detection device 6 is set accordingly for the detection position.
[0091] During silicon wafer inspection, the stack of silicon wafers is first placed on the silicon wafer clamping device 5, and the silicon wafer clamping device 5 is used to align the stack of silicon wafers. Then, the silicon wafer clamping device 5 moves along the translation guide rail 7 to the inspection position. At this time, the inspection device 6 can be used to inspect a portion of the stack of silicon wafers. After that, the silicon wafer clamping device 5 moves along the translation guide rail 7 to the avoidance position. At this time, the inspection device 6 cannot detect the silicon wafers, and the silicon wafer clamping device 5 rotates at a preset angle. Next, the silicon wafer clamping device 5 moves along the translation guide rail 7 to the inspection position. At this time, the inspection device 6 can be used to inspect the other portion of the stack of silicon wafers.
[0092] For example, there are two detection devices 6, arranged on opposite sides of the silicon wafer clamping device 5. After a stack of silicon wafers is placed on the silicon wafer clamping device 5, the device first rotates 45° and moves to the detection position, using the two detection devices 6 to detect two corners of the wafer. Then, the device rotates 90° and moves to the detection position, using the two detection devices 6 to detect the other two corners of the wafer. After that, the device rotates 45° again and moves to the detection position, using the two detection devices 6 to detect two sides of the wafer. Finally, the device rotates 90° again and moves to the detection position, using the two detection devices 6 to detect the other two sides of the wafer, thus completing the detection of the stack of silicon wafers.
[0093] In some embodiments, step S2 includes:
[0094] Step S21: Place the stacked assembly on two spaced-apart conveyor assemblies, so that the middle of the stacked assembly is suspended.
[0095] Step S12: Use cable ties to bundle the suspended portions of the stacked components to form silicon wafer bundles;
[0096] Step S13: The two conveying components are activated to convey the silicon wafer bundle downstream.
[0097] For example, such as Figure 2 As shown, the first conveying assembly 8 and the second conveying assembly 9 are arranged at intervals. The stacked assembly is placed on the first conveying assembly 8 and the second conveying assembly 9, so that the middle part of the stacked assembly is suspended. The strapping device 2 is set between the first conveying assembly 8 and the second conveying assembly 9, and the strapping device 2 is used to strap the portion of the stacked assembly between the first conveying assembly 8 and the second conveying assembly 9. Then, the first conveying assembly 8 and the second conveying assembly 9 are activated, and the silicon wafer bundle is conveyed to the molding and encapsulation device 20 by the second conveying assembly 9, so that the silicon wafer bundle can be encapsulated by the molding and encapsulation device 20.
[0098] This reduces the movement of silicon wafers during the bundling of stacked components with cable ties. Furthermore, it effectively prevents misalignment between silicon wafers during the encapsulation process, thereby further improving the yield rate of silicon wafers.
[0099] Optionally, the first conveying component 8 and the second conveying component 9 are belt conveyors.
[0100] In some embodiments, step S3 includes:
[0101] Step S31: Cover the outside of the silicon wafer bundle with heat shrink film;
[0102] Step S32: Seal the edges of the heat-shrink film;
[0103] Step S33: Thermoplastic heat shrink film.
[0104] For example, such as Figure 2 As shown, the molding equipment 20 includes a sealing and cutting machine 201 and a thermoforming machine 202. The sealing and cutting machine is used to cover the outside of the silicon wafer bundle with heat shrink film and to seal and cut the edges of the heat shrink film. Then, the thermoforming machine 202 is used to thermoform the heat shrink film so that the heat shrink film is completely bonded to the silicon wafer bundle.
[0105] Using the above method to encapsulate the silicon wafer bundles can improve the adhesion between the heat shrink film and the silicon wafer bundles, effectively preventing damage to the silicon wafers due to misalignment during transportation.
[0106] In some embodiments, step S3 further includes:
[0107] Step S34: Attach the label to the surface of the heat-shrinkable film to mark the encapsulated silicon wafer.
[0108] For example, such as Figure 2 As shown, a labeling machine 203 is provided on the side of the shrink wrapping equipment 20. The labeling machine 203 is used to stick the label paper onto the surface of the heat-shrinkable film after heat shrinking.
[0109] By marking the encapsulated silicon wafers, it is easy to obtain other information such as the product grade of the encapsulated silicon wafers, thereby facilitating subsequent packaging operations.
[0110] Optionally, the label has a barcode, which can be scanned to obtain information about the silicon wafer.
[0111] Alternatively, the silicon wafer packaging method may also include:
[0112] Before packing the encapsulated silicon wafers into the packaging box, the heat-shrinkable film is laser-cut to create continuous holes in the film, making it easier to unpack.
[0113] For example, the silicon wafer packaging system 100 includes a laser cutter 301, which uses the laser cutter 301 to laser cut the heat-shrinkable film after heat shrinking, so that the heat-shrinkable film has continuous "I"-shaped holes, which makes it convenient for users to unpack the heat-shrinkable film when using the silicon wafer.
[0114] In some embodiments, step S4 includes loading the molded silicon wafer into a packaging box 303 having a plurality of placement slots, wherein the size of the placement slots is adapted to the size of the molded silicon wafer.
[0115] For example, packaging box 303 is an EPE pearl cotton packaging box, and packaging box 303 has multiple placement slots, the size of each placement slot being consistent with the size of the plastic-encapsulated silicon wafer.
[0116] Therefore, the walls of the placement tank can be used to press the molded silicon wafers together and protect them, effectively reducing the risk of damage to the silicon wafers during transportation.
[0117] Optionally, such as Figure 2 As shown, the silicon wafer packaging system 100 includes a boxing device 30, which includes a boxing robot 302, a box conveying assembly 304, and a buffer rack 305. The boxing robot 302 is used to place the plastic-encapsulated silicon wafers into the buffer rack 305 or the packaging box 303, and the box conveying assembly 304 is used to convey the packaging box 303.
[0118] Among them, the box conveyor assembly 304 can be a belt conveyor.
[0119] When the model of the encapsulated silicon wafer matches that of the packaging box 303, the packing robot 302 places the encapsulated silicon wafer into the packaging box 303. When the model of the encapsulated silicon wafer does not match that of the packaging box 303, the packing robot 302 places the encapsulated silicon wafer into the buffer rack 305.
[0120] The silicon wafer packaging system 100 of this invention is used to implement the silicon wafer packaging method described in any of the above embodiments. For example... Figure 2 As shown, the silicon wafer packaging system 100 of this embodiment includes a silicon wafer sorting device 10, a sealing device 20, and a boxing device 30. The silicon wafer sorting device 10 is used to place a first protective layer and a second protective layer on both sides of the stack of silicon wafers in the thickness direction, and to bundle the stacked components with cable ties. The sealing device 20 is used to seal the silicon wafer bundles. The boxing device 30 is used to pack the sealed silicon wafers into a packaging box 303.
[0121] Optionally, such as Figure 2 As shown, the silicon wafer handling equipment 10 includes a first frame 101, which is covered by a first protective cover. A turntable 1, a belt-bundling device 2, a first feeding assembly 3, a second feeding assembly 4, a silicon wafer clamping device 5, a detection device 6, a translation guide rail 7, a first conveying assembly 8, and a second conveying assembly 9 are all mounted on the first frame and housed within the first protective cover. A portion of the second conveying assembly 9 extends outside the first protective cover to convey the silicon wafer bundles into the molding compound 20.
[0122] Optionally, such as Figure 2 As shown, the molding and sealing equipment 20 includes a second frame 2001, which is covered by a second protective cover. The sealing and cutting machine 201, the thermoforming machine 202, and the labeling machine 203 are all mounted on the second frame 2001 and housed within the second protective cover. A transfer conveyor line is provided on the second frame 2001, with a portion extending outside the second protective cover to transport the molded silicon wafers into the packaging equipment 30.
[0123] Optionally, such as Figure 2As shown, the packing equipment 30 includes a third frame 3001, which is covered by a third protective cover. The laser cutter 301, the packing robot 302, and the box conveying assembly 304 are all mounted on the third frame 3001 and are all housed within the third protective cover. The buffer rack 305 is also housed within the third protective cover.
[0124] The silicon wafer handling equipment 10 receives incoming materials and sequentially performs inspection, alignment, and handling (stacking of the first protective layer, second protective layer, and silicon wafers). Finally, the silicon wafers are secured with straps and conveyed to the docking molding and encapsulation equipment 20. The molding and encapsulation equipment 20 detects the inflow of silicon wafers and sequentially performs encapsulation, sealing, cutting, thermoforming, and labeling on the heat-shrink film of the encapsulated silicon wafers. The encapsulated silicon wafers are then conveyed to the next station. Upon detecting the encapsulated silicon wafers, the transfer conveyor line stops at a designated position. A laser cutter 301 cuts continuous small circular holes in a "H" shaped path on the surface of the encapsulated silicon wafers to facilitate subsequent unpacking. A barcode scanner scans the label to obtain the quality of the stacked silicon wafers. The transfer conveyor line then delivers the encapsulated silicon wafers to the packing robot 302. Upon receiving a signal, the packing robot 302 places the encapsulated silicon wafers into the corresponding packaging boxes 303 or buffer racks 305 according to the wafer quality.
[0125] The silicon wafer packaging system 100 mainly consists of three modules: a silicon wafer sorting device 10, a sealing device 20, and a boxing device 30. The silicon wafer sorting device 10 sequentially places the first protective layer, silicon wafer, and second protective layer to form a neat "sandwich" structure, then secures them with straps to prevent damage to the wafer's neatness during subsequent packaging. The entire process utilizes robotic arms, automatic conveyors, and rotation to grasp and transport the silicon wafers. The silicon wafer clamping device 5 straightens and organizes the wafers without manual intervention. The working environment is sealed, and the handling process is precise. The sealing device 20 conveys the silicon wafer bundles via a conveyor assembly. During transport, the wafer bundles undergo sequential processes including film application, sealing and cutting, thermoforming, and labeling. Both the first and second protective covers are brown, ensuring the equipment's appearance while allowing observation of the entire silicon wafer packaging process from the outside.
[0126] The following is for reference. Figure 2 Describes a silicon wafer packaging method according to an embodiment of the present invention;
[0127] First, a stack of silicon wafers is moved to the wafer clamping device 5 of the silicon wafer handling equipment 10, and the wafer clamping device 5 is used to straighten the silicon wafers. Then, by moving and rotating the wafer clamping device 5, and using the detection device 6, the silicon wafers are inspected. When a defect is detected in a silicon wafer, the wafer clamping device 5 moves to a clearance position and transfers the silicon wafer to a scrap box. When a silicon wafer is found to be qualified, a third robotic arm removes the silicon wafer from the inspection position and places it on the support part 12 at the wafer placement position. When the support part 12 is in the first placement position, the first robotic arm has already picked up the wafer from the first protective layer of the first loading part 31 in the first working position and placed it on the support part 12. Afterward, the support part 12 rotates to the second placement position, and the second robotic arm picks up the wafer from the second protective layer of the second loading part 41 in the second working position and places it on the upper side of the silicon wafer. Next, the support section 12 rotates to the wafer picking position, and the fourth robotic arm removes the stacked assembly from the support section 12 and places it on the first conveying assembly 8 and the second conveying assembly 9. Then, the stacked assembly is bundled with cable ties using the strapping device 2 to obtain wafer bundles. Next, the wafer bundles are transferred to the encapsulation device 20 using the second conveying assembly 9. Inside the encapsulation device 20, the encapsulation operation is completed using the sealing and cutting machine 201 and the thermoforming machine 202 to obtain encapsulated silicon wafers. Labels are then affixed to the encapsulated silicon wafers using a labeling machine. Finally, the encapsulated silicon wafers are transported to the packaging device 30 via a transfer conveyor line. First, a laser cutter 301 forms continuous holes in the heat-shrink film; then, the encapsulated silicon wafers are packed into packaging boxes 303 or placed on buffer racks 305.
[0128] The silicon wafer packaging method of this invention can achieve a fully automated integrated process, saving costs and improving silicon wafer packaging efficiency. The silicon wafer bundles obtained by the silicon wafer sorting equipment 10 are tightly packed and not easily loosened, greatly avoiding damage to the silicon wafers during packaging and transportation. The mechanical structure is compact and occupies a reasonable amount of space. The sealing equipment 20 reduces the equipment's space occupation while ensuring the thermoforming effect. After thermoforming, it connects with the real-time online printing and labeling machine, reducing the overall space occupation and increasing the equipment's aesthetics. The first and second protective layers are placed on both sides of a stack of silicon wafers, providing isolation and protection. These "sandwich" layers are then secured with straps to prevent misalignment between silicon wafers. Finally, they are cut, sealed, and thermoformed, completing the silicon wafer packaging process. This reduces the types of auxiliary materials while ensuring the neatness of the silicon wafers and the packaging effect. Finally, the tightly packaged thermoformed silicon wafers are placed into the packaging box 303. The compact packing reduces damage to the silicon wafers, has low reliance on manual labor, and a high degree of automation.
[0129] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.
Claims
1. A method for packaging silicon wafers, characterized in that, Includes the following steps: Step S1: Place a first protective layer and a second protective layer on both sides of a stack of silicon wafers in the thickness direction to form a stacked assembly; Step S2: Bundle the stacked components with cable ties to form silicon wafer bundles; Step S3: The silicon wafer bundle is encapsulated to form encapsulated silicon wafers; Step S4: Pack the encapsulated silicon wafer into a packaging box; Step S2 includes: Step S21: Place the stacked assembly on two spaced-apart conveying assemblies, so that the middle part of the stacked assembly is suspended. Step S12: Use cable ties to bundle the suspended portion of the stacked assembly to form the silicon wafer bundle; Step S13: The two conveying components are activated to convey the silicon wafer bundle downstream.
2. The silicon wafer packaging method according to claim 1, characterized in that, The silicon wafer packaging method further includes: Before placing the first protective layer and the second protective layer on both sides of the stack of silicon wafers in the thickness direction, the stack of silicon wafers is first inspected. When the test result of the stack of silicon wafers is unqualified, the stack of silicon wafers is removed; when the test result of the stack of silicon wafers is qualified, the first protective layer and the second protective layer are respectively placed on both sides of the stack of silicon wafers in the thickness direction.
3. The silicon wafer packaging method according to claim 2, characterized in that, When inspecting the stack of silicon wafers, the corners of the stack are inspected first, followed by the sides; and / or Before inspecting the stack of silicon wafers, the stack of silicon wafers is first aligned.
4. The silicon wafer packaging method according to claim 1, characterized in that, Step S1 includes: Step S11: Place the first protective layer on the turntable; Step S12: The turntable rotates to the next station and places the silicon wafer on the first protective layer at that station; Step S13: The turntable rotates to the next station, and the second protective layer is placed on the stack of silicon wafers at this station to obtain the stacked assembly.
5. The silicon wafer packaging method according to claim 1, characterized in that, Step S3 includes: Step S31: Cover the outside of the silicon wafer bundle with heat-shrink film; Step S32: Seal the edges of the heat-shrink film; Step S33: Thermoplasticize the heat-shrink film.
6. The silicon wafer packaging method according to claim 5, characterized in that, Step S3 further includes: Step S34: Affix a label to the surface of the heat-shrinkable film after heat shrinking to mark the encapsulated silicon wafer.
7. The silicon wafer packaging method according to claim 5, characterized in that, The silicon wafer packaging method further includes: Before packing the encapsulated silicon wafer into the packaging box, the heat-shrinkable film is laser-cut to create continuous holes in the film, so that the heat-shrinkable film can be unpacked.
8. The silicon wafer packaging method according to claim 1, characterized in that, Step S4 includes: The encapsulated silicon wafer is packed into a packaging box with multiple placement slots, wherein the size of the placement slots is adapted to the size of the encapsulated silicon wafer.
9. A silicon wafer packaging system, characterized in that, A silicon wafer packaging method for implementing any one of claims 1-8 includes: A silicon wafer sorting device, wherein the stacked silicon wafer sorting device is used to place a first protective layer and a second protective layer on both sides of the thickness direction of a stack of silicon wafers, and to bind the stacked assembly with cable ties; Plastic encapsulation equipment, the plastic encapsulation equipment being used to encapsulate the silicon wafer bundles; and Packing equipment, the packaging equipment being used to pack the plastic-encapsulated silicon wafers into packaging boxes.